EP2694875A2 - Device for fastening and contacting a lighting means and/or a lighting module, and lamp - Google Patents

Device for fastening and contacting a lighting means and/or a lighting module, and lamp

Info

Publication number
EP2694875A2
EP2694875A2 EP12721692.7A EP12721692A EP2694875A2 EP 2694875 A2 EP2694875 A2 EP 2694875A2 EP 12721692 A EP12721692 A EP 12721692A EP 2694875 A2 EP2694875 A2 EP 2694875A2
Authority
EP
European Patent Office
Prior art keywords
spring means
led module
socket housing
module
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12721692.7A
Other languages
German (de)
French (fr)
Other versions
EP2694875B1 (en
Inventor
Peter Moser
Thomas Riedler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tridonic GmbH and Co KG
Original Assignee
Tridonic Connection Technology GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ATGM204/2011U external-priority patent/AT12818U1/en
Application filed by Tridonic Connection Technology GmbH and Co KG filed Critical Tridonic Connection Technology GmbH and Co KG
Publication of EP2694875A2 publication Critical patent/EP2694875A2/en
Application granted granted Critical
Publication of EP2694875B1 publication Critical patent/EP2694875B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/012—Housings with variable shape or dimensions, e.g. by means of elastically deformable materials or by movement of parts forming telescopic extensions of the housing body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a device for fastening and contacting a lamp and / or a lighting module, in particular an LED module according to the preambles of the independent claims 1 and 12, and a lamp, in particular as a downlight, with such
  • Such devices are used to attach at least one light source and / or a light module, in particular LED module, and to contact with a power supply. They are also connected to a light.
  • the device has a socket housing with at least one outer ring and an inner ring, which is provided with a plurality of separate compression springs distributed in the vicinity,
  • Screws and washers is mounted in the outer ring. Due to the resilient mounting of the inner ring, the back of the LED module is pressed on a heat sink. The inner ring should be off
  • the object of the invention is to provide a device for fastening
  • the device for fastening and contacting a luminous means and / or a lighting module, in particular an LED module has at least one socket housing, wherein the lighting means and / or lighting module, in particular LED module, in the socket housing
  • the required contact pressure depends i.a. from the structure of the lamp and / or light module, in particular LED module, and also from its electrical contacts. The less contact pressure is required, the easier it will be to design the spring means.
  • fastening means or locking means for the lighting means and / or lighting module, in particular LED module are present in the device. It is preferred to offer a tool-free installation.
  • Locking means be mechanical fastening means or mechanical locking means, which are designed for holding means of the illuminant and / or light module, in particular LED module.
  • the attachment of the light source and / or light module, in particular LED module in the device can be done by known per se principles. If the device or the socket housing are formed as a ring, the principle of a bayonet closure can be applied.
  • Light module in particular LED module
  • the heat sink are distributed over several points.
  • nubs may be arranged as holding means on the lighting means and / or lighting module, in particular LED module. in the
  • Socket housing of the device can corresponding recesses be present so that the light source and / or light module, in particular LED module, can be inserted into the socket housing.
  • the socket housing of the device guide elements preferably provided as a locking link, be present, which serve for the guidance of the holding means of the illuminant and / or light module, in particular LED module.
  • Locking of the lamp and / or light module, in particular LED module, in the socket housing can be realized by a locking stop. It could also be done by means of a notch in the
  • Socket housing can be realized.
  • the LED module fastened in the device can be pressed against a heat sink, which can be arranged on or behind the device.
  • Illuminated module in particular LED module, consists of a heat-dissipating material.
  • the heat sink is preferably made of aluminum. If the contact pressure over the entire contact surface between the heat sink and the back of the lamp and / or light module, in particular LED module, is distributed almost uniformly, an improved
  • Heat dissipation from the lamp and / or light module, in particular LED module can be achieved.
  • the socket housing may be formed partially resilient, this effect can be achieved by the leg position of spring means, which are integrated in the socket housing.
  • Advantage here is that the spring means are integrally formed with the socket housing. By minimizing the number of individual components required, there is a significant reduction in assembly costs.
  • the socket housing is preferably made of plastic.
  • the spring means may be according to the invention of the same material as the socket housing.
  • the spring means need not necessarily be too strong, so that they can be integrally formed with the socket housing.
  • the spring means may be formed in particular in a direction perpendicular to the contact surface of the heat sink with the light source and / or light module, in particular LED module, resilient. It corresponds to the direction of the necessary pressing force or pressing force.
  • the spring means may preferably between the socket housing and the lighting means and / or lighting module,
  • LED module or act between the socket housing and the heat sink. It is important that sufficient contact between the lamp and / or light module, in particular LED module, and
  • Heat sink takes place in order to dissipate the heat of the LEDs from the light source and / or light module, in particular LED module.
  • the spring means may be formed as spring elements.
  • the device has locking means for the mechanical fastening of the luminous means and / or luminous module, in particular LED module. These locking means are arranged in the socket housing.
  • the spring means may be present in the locking means.
  • Locking means are resilient and integrally formed with the socket housing.
  • the locking means may comprise at least one locking link, which is resilient.
  • the holding means of the luminous means and / or light module, in particular LED module can be held by the locking elements.
  • a contact pressure on the holding means i. practiced on the light source and / or light module, in particular LED module, so that the light source and / or light module, in particular LED module, is pressed on the heat sink.
  • the spring means may for example be integrally formed with the lighting means and / or lighting module, in particular LED module, wherein the holding means for Attachment may be resiliently formed with the socket housing and the locking means of the socket housing can be rigid.
  • the device has fastening means for mechanically fastening the device to the heat sink.
  • the spring means can be arranged on these fastening means.
  • a respective spring means between the fastening means of the device to the heat sink and the socket housing can be provided.
  • these respective spring means can be formed as a tab.
  • Socket housing a fixed connection between these two elements is provided.
  • the invention is also that additional spring means may be present to the one-piece spring means in or on the socket housing. Especially when higher forces are necessary to press the LED module on the heat sink, it is advantageous if other spring means are present. When the one-piece spring means off
  • Plastic as the socket housing are formed, it may happen that they can deploy less force over time and / or that the design of the one-piece spring means is insufficient for the required spring force. This can also be achieved at higher temperatures, which may occur due to the LED heating or the ambient temperature come, wherein the plastic of the socket housing and the one-piece spring means would diminish.
  • the additional spring means should act to assist the spring means, i. that the additional spring means should be stronger than the one-piece spring means. A higher contact pressure can be achieved. Depending on the properties of the one-piece spring means and the additional spring means can be up to about ten times
  • the required contact pressure can be achieved.
  • the additional spring means can also be integral with the
  • Socket housing or formed as an additional element can be made of the same material as the one-piece spring means. But you can also preferably made of a material with a higher spring force, in particular spring steel. As a result, higher temperatures are better tolerated and the contact pressure of the LED module on the heat sink remains more evenly distributed.
  • the additional spring means be arranged directly to the one-piece spring means. They can for example be provided almost or substantially parallel to the one-piece spring means.
  • the additional spring means may preferably be attached or locked at least on one side with the socket housing. The other side of the additional spring means may be arranged for example mounted in the socket housing.
  • the one-piece spring means consist of a different material than that of the socket housing.
  • the socket housing can be made of plastic and the one-piece
  • Spring means made of spring steel, wherein in the manufacture of the device, these spring means are integrally connected to the socket housing, for example by encapsulation.
  • Such spring means can at least at one end connected to the socket housing of the device or in or on the socket housing the
  • the one-piece spring means can be omitted.
  • the spring means can be selected as additional elements so that the necessary contact pressure of the lamp and / or light module, in particular LED module, is achieved on the heat sink.
  • Material and geometry of the spring means can be selected accordingly, with spring steel can be preferred as a material. Further advantages from the other described embodiments may be given for such
  • Embodiments are also taken into account. It is not
  • a further aspect of the invention is that the electrical contact between the device and the lighting means and / or light module, in particular LED module, via further means than for the mechanical attachment between the device and the lamp and / or light module, in particular LED Module, is provided.
  • a device for attaching and contacting a light source and / or a light module, in particular an LED module wherein the device has at least one socket housing, wherein the lighting means and / or light module, in particular LED module, in the socket housing of the device is arranged and pressed on a heat sink connected to the device, and wherein the device has a ground. It is essential that the grounding of the socket housing is contacted directly on the heat sink.
  • the grounding can be springy. It can also be provided as a wire hanger.
  • Another essential feature of the invention is that the device for attaching and contacting a lamp and / or a
  • Light module in particular an LED module, directly or indirectly connected to a lamp.
  • a light for example, a downlight can be provided.
  • the invention also relates to a lamp or light module, in particular LED module, as well as a lamp with the device according to the invention.
  • Fig. 1a exploded view of a first device according to the invention with an LED module and a heat sink.
  • Fig. 1b Detail view of the spring means of Fig. 1a.
  • Fig. 2 exploded view of the first device according to the invention with an LED module.
  • Fig. 4a perspective view of a second invention
  • Fig. 4b Detail view of the spring means of Fig. 4a.
  • Fig. 5 top view of the second device according to the invention with a heat sink.
  • Fig. 6b Detail view of the spring means of Fig. 6a.
  • Fig. 7 side view of the second device according to the invention with an LED module and a heat sink, wherein the LED module is not yet mounted in the device.
  • Fig. 8 side view of the second device according to the invention with an LED module and a heat sink, wherein the LED module is mounted in the device.
  • Fig. 9a perspective view of the second invention
  • Fig. 9b Detail view of the ground of Fig. 9a.
  • Fig. 10a perspective view of the second invention
  • FIG. 10b Detail view of the spring means of Fig. 10a.
  • Fig. 11a perspective view of the second invention
  • Fig. 11b Detail view of the spring means of Fig. 11a.
  • Fig. 12a side view of the second device according to the invention with additional spring means, wherein the LED module in the
  • Fig. 12b Detail view of the spring means of Fig. 12a.
  • a device 1 according to the invention is shown, and an LED module 2 and a heat sink 4. Only LED modules 2 are described here, but it is not excluded that other light sources or lighting modules can be used.
  • the device 1 with the LED module 2 and the heat sink 4 are usually part of a lamp. It could be a downlight here. Nevertheless, other types of luminaires should not be excluded from this invention.
  • Heat sinks are preferably made of aluminum and are necessary when using LEDs or LED modules in order to be able to dissipate the heat generated by the LEDs.
  • a first variant of the device 1 according to the invention is shown.
  • the device 1 has a socket housing 3.
  • This socket housing 3 can be mounted on the heat sink 4, the
  • connection can be made, for example, by fastening means 15 and 16, here as screw holes for not shown here
  • the fastening means 5 are preferably distributed regularly on the socket housing 3 and the fastening means 16 are distributed on the cooling body 4, correspondingly suitable for the fastening means 15 of the socket housing 3.
  • the device 1 is thereby fixed or rigidly connected to the heat sink 4. Subsequently, the assembly of the LED module 2 in the device 1 can take place. It has the advantage that only the light source and / or the light module, in particular LED module 2, should be replaced, if necessary.
  • the device 1 can remain in its assembled state. It simplifies assembly and disassembly for the specialist personnel, especially if the light source and / or the light module is intended as a downlight.
  • the mechanical connection of the LED module 2 with the device 1 or with the socket housing 3 may preferably take place via a bayonet principle.
  • the LED module 2 is locked in the device 1 and in the socket housing 3 in this way.
  • the LED module 2 has nubs 10. These nubs are preferably distributed around the LED module 2.
  • the knobs 10 When mounting the LED module 2 in the device 1, the knobs 10 are inserted into the recesses 7 of the socket housing 3 and then the LED module 2 is rotated in the direction of rotation according to a bayonet principle. The knobs 10 are guided and locked via the locking means 6. As a result, the LED module 2 is mechanically fixed in the device 1.
  • the knobs 10 slide along the locking link 8 of the locking means 6 to the stop 9 of the locking means 6.
  • Each locking means 6 is integrally connected at its two ends 1 1 and 12 with the socket housing 3.
  • the locking means 6, especially the locking cams 8, are resilient and will push the knobs 10 of the LED module 2 in the direction of the pressing force, so that the LED module 2 can be kept pressed to the heat sink 4.
  • the locking means 6 simultaneously form the spring means 5, which are to enable the pressing of the LED module 2 on the heat sink 4.
  • the socket housing 3 is preferably made of plastic. As a result, the locking means 6 are made of the same material.
  • FIGS. 4a to 8b show a second variant of the invention
  • the mechanical locking of the LED module 2 with the device 1 can be done in a manner known per se.
  • the knobs 10 of the LED module 2 can be inserted into the respective recesses 7 of the socket housing 3.
  • the LED module 2 can be rotated according to a bayonet principle, wherein the studs 10 of the LED module 2 each slide along a rigid locking link 29 and can be guided and each can be locked by a locking stop 30.
  • the device 1 can turn over for this embodiment
  • Heatsink 4 are connected by means of fastening screws, not shown here.
  • the spring means 5 by tabs 17 between the fasteners 15 of the device 1 and the
  • Socket housing 3 formed.
  • the tabs 17 are resilient.
  • the tabs 17 are integral with the socket housing 3 and
  • One end 18 of a tab 17 may in the upper part of a
  • Fastener 15 may be connected and the other end 19 of this tab 17 may be connected to the socket housing 3. To the resilient movement of the socket housing 3 of the
  • Fixing elements 15 of the device 1 to keep free can
  • Fasteners 15 may be present. Before the LED module 2 is screwed into the socket housing 3, ie as long as the LED module 2 is inserted only in the socket housing 3, the socket housing 3 is located on the contact surface 13 of the heat sink 4 at. When the LED module 2 is screwed into the socket housing 3 in the direction of rotation D, the socket housing 3 lifts off from the contact surface 13 of the heat sink 4 from a distance X and by the suspension of the tab 17 is preferably made of heat-dissipating material
  • Device 1 can be done in a conventional manner.
  • the LED module 2 on pins 20 which are positioned all around the LED module 2 and are arranged in a direction perpendicular to the rear side 14 of the LED module 2.
  • the contact pins 20 are inserted into the slots 21 of the socket housing 3 and by the rotational movement for the mechanical locking they are with the electrically conductive
  • the contact pins 20 are clamped in the respective contact clips 23. These contact clips 23 are each electrically connected to a wiring contact 24, wherein a further electrical wiring is possible. There are five pins 20 here. The number of pins may be dependent on the desired terminals.
  • the required contact pressure or pressure depends mainly on
  • a good light management or little heat from the LED module 2 allows a simplified design of the spring means 5. They can be integrally formed with the socket housing 3 and need not be designed as an additional component to the socket housing 3. The assembly of the device is thereby simplified and a more favorable production of the device results.
  • FIGS. 9a and 9b show a possible embodiment of a grounding 25 for this unit (LED module 2 with device 1 and heat sink 4).
  • a ground 25 may be required for LED modules, depending on the regulations.
  • Socket housing 3 is arranged, preferably from his
  • the grounding 25 may preferably be a wire bow. It is preferably resilient. The ground 25 can be contacted directly on the heat sink 4. Due to their resilient properties, a good grounding contact of the LED module 2 with the heat sink 4 is provided.
  • the grounding 25 as a wire hanger can of these
  • the additional spring means 31 may be formed of spring steel.
  • a first end 32 of the spring means 31 is attached indirectly and / or directly to the fastening means 15 of the device 1.
  • the spring means 31 is bent and is positioned in a slot 34 in the region of the fastening means 15 and at the first end 18 of the one-piece spring means 5, 17.
  • Heatsink 4 by means of screws 36 in the fasteners 15, lock or fasten the screws 36, the end 32 of the spring means 31, the screw head beyond the end 32 of the spring means 31 and on the bending of the spring element 31st This will be the
  • the socket housing 3 has storage means, here as nubs 35th
  • the second end 33 of the spring means 31 can be arranged or stored in the region of the bearing means, here as nubs 35. It is not mandatory that this end 33 of the spring means 31 is fixed.
  • the free end 33 of the spring means 31 may be present, for example, between nub 35 and second end 19 of the spring means 5, 17.
  • the spring means 5, 17 and 31 may be arranged substantially parallel to each other when the LED module 2 is not yet mounted in the socket housing 3.
  • the spring force direction of the spring means 5, 17 and 31 is substantially identical.
  • the socket housing 3 is detached from the heat sink 4 by a distance X, and the spring means 5 and the spring means 31 may deform differently, as shown in Figs. 12a and 12b ,
  • the spring means 5, 17 have a greater deformation than the spring means 31, since they can allow less contact force of the LED module 2 on the heat sink 4.
  • the spring means 5, 17 and 31 are mounted in the
  • the spring means 31 support the
  • the second end 33 of the spring means 31 is located on the end 19 of
  • the thickness of the spring means 31 as spring steel influences u.a. the pressing force of the LED module 2 on the heat sink 4. It would be conceivable to use different spring means 31 with e.g. to have different thicknesses and to use the appropriate spring means 31 to the requirements for the light in the device.
  • the embodiments shown in the figures are only examples of the invention. Other, not shown embodiments, should not be excluded.

Abstract

The invention relates to a device for fastening and contacting a lighting means and/or a lighting module, in particular an LED module (2), wherein the device (1) has at least one socket housing (3), wherein the lighting means and/or lighting module, in particular LED module (2), is arranged in the socket housing (3) of the device (1) and is pressed onto a heat sink (4) connected to the device (1), wherein said pressing is performed at least by means of spring means (5) of the device (1), wherein the spring means (5) are an integral part of the socket housing (3). The invention further relates to a device having a ground (25), which is contacted by the socket housing (3) directly on the heat sink (4), and to a lamp having such a device.

Description

Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Leuchtmoduls, sowie Leuchte  Device for attaching and contacting a light source and / or a light module, as well as light
Die Erfindung betrifft eine Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Leuchtmoduls, insbesondere eines LED- Moduls nach den Oberbegriffen der unabhängigen Ansprüche 1 und 12, sowie eine Leuchte, insbesondere als Downlight, mit einer solchen The invention relates to a device for fastening and contacting a lamp and / or a lighting module, in particular an LED module according to the preambles of the independent claims 1 and 12, and a lamp, in particular as a downlight, with such
Vorrichtung. Contraption.
Derartige Vorrichtungen dienen dazu, zumindest ein Leuchtmittel und/oder ein Leuchtmodul, insbesondere LED-Modul, zu befestigen und mit einer Spannungsversorgung zu kontaktieren. Sie werden auch mit einer Leuchte verbunden. Such devices are used to attach at least one light source and / or a light module, in particular LED module, and to contact with a power supply. They are also connected to a light.
Es sind Vorrichtungen für LED-Module, als LED Light Engine genannt, aus dem Stand der Technik bekannt, die ein Andrücken der LED-Modulrückseite auf eine Kühlkörperfläche ermöglichen. Dies soll mit einer definierten Kraft erfolgen, um eine notwendige Wärmeableitung gewährleisten zu können. Dadurch wird die Lebensdauer der LEDs beeinflusst. Die Vorrichtung weist ein Fassungsgehäuse mit zumindest einem Außenring und einem Innenring auf, der mit mehreren im Umkreis verteilten separaten Druckfedern, There are devices for LED modules, known as LED light engine, known from the prior art, which allow pressing the LED module back to a heat sink surface. This should be done with a defined force in order to ensure a necessary heat dissipation. This affects the life of the LEDs. The device has a socket housing with at least one outer ring and an inner ring, which is provided with a plurality of separate compression springs distributed in the vicinity,
Schrauben und Beilagscheiben in dem Außenring gelagert ist. Durch die federnde Lagerung des Innenringes wird die Rückseite des LED-Moduls auf einem Kühlkörper gedrückt. Der Innenring soll aus Screws and washers is mounted in the outer ring. Due to the resilient mounting of the inner ring, the back of the LED module is pressed on a heat sink. The inner ring should be off
hochtemperaturbeständigem Kunststoff aufgrund der Wärmeerzeugung des LED-Moduls hergestellt werden. Dies ist aus Kostengründen nachteilig. high temperature resistant plastic due to the heat generated by the LED module. This is disadvantageous for cost reasons.
In der DE 20 2009 012 000 U1 ist eine Vorrichtung beschrieben, welche einen gleichmäßig verteilten Anpressdruck über die gegenseitigen In DE 20 2009 012 000 U1 a device is described which a uniformly distributed contact pressure on the mutual
Anlageflächen vom LED-Modul und Kühlkörper gewährleisten soll. Dies erfolgt über die Gestaltung der elektrischen Kontaktierung, die zwischen den Fassungskontakten und den Kontakten des LED-Moduls durch To ensure contact surfaces of the LED module and heat sink. This takes place via the design of the electrical contact between the socket contacts and the contacts of the LED module
Kontaktausbildung in hinsichtlich der Andruckkraft gegenkraftfreier Weise erfolgt. Nachteil ist, dass die elektrische Kontaktierung trotzdem belastet wird. Contact training takes place in terms of the pressing force gegenkraftfreier way. Disadvantage is that the electrical contact is still charged.
Aufgabe der Erfindung ist es, eine Vorrichtung zum Befestigen und The object of the invention is to provide a device for fastening and
Kontaktieren eines Leuchtmittels und/oder Leuchtmoduls, insbesondere eines LED-Moduls, so zu gestalten und weiterzubilden, dass sie die genannten Nachteile beseitigt, wobei die Gestaltung der Vorrichtung vereinfacht und kostensparend werden soll. Dazu soll der erforderliche Anpressdruck des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED- Moduls, auf dem Kühlkörper weiterhin gewährleistet werden. Die Lösung dieser Aufgabe erfolgt erfindungsgemäß durch die in den unabhängigen Ansprüchen angegebenen Merkmale. Contacting a lamp and / or light module, in particular an LED module to design and further develop that it eliminates the disadvantages mentioned, the design of the device should be simplified and cost-saving. For this purpose, the required contact pressure of the lamp and / or light module, in particular LED module, continue to be ensured on the heat sink. The solution of this object is achieved according to the invention by the features specified in the independent claims.
Die Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Leuchtmoduls, insbesondere eines LED-Moduls, weist zumindest ein Fassungsgehäuse auf, wobei das Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, in das Fassungsgehäuse The device for fastening and contacting a luminous means and / or a lighting module, in particular an LED module, has at least one socket housing, wherein the lighting means and / or lighting module, in particular LED module, in the socket housing
angeordnet wird und auf einem mit der Vorrichtung verbundenen Kühlkörper angedrückt wird, wobei dieses Andrücken zumindest über Federmittel der Vorrichtung erfolgt. is arranged and pressed on a heat sink connected to the device, said pressing takes place at least via spring means of the device.
Ein wesentliches Merkmal der Vorrichtung ist, dass die Federmittel einstückig mit dem Fassungsgehäuse ausgebildet sind. An essential feature of the device is that the spring means are formed integrally with the socket housing.
Dadurch sind weniger Bauteile für die Vorrichtung notwendig. As a result, fewer components are required for the device.
Das Andrücken der gegenseitigen Anlageflächen vom LED-Modul und Kühlkörper soll mittels der mechanischen Befestigung der Vorrichtung mit dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, und/oder mit dem Kühlkörper erfolgen. The pressing of the mutual contact surfaces of the LED module and heat sink to by means of the mechanical attachment of the device with the lamp and / or light module, in particular LED module, and / or done with the heat sink.
Der erforderliche Anpressdruck hängt u.a. von dem Aufbau des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, und auch von seinen elektrischen Kontaktierungen ab. Je weniger Anpressdruck erforderlich wird, desto einfacher wird es, die Federmittel zu gestalten. The required contact pressure depends i.a. from the structure of the lamp and / or light module, in particular LED module, and also from its electrical contacts. The less contact pressure is required, the easier it will be to design the spring means.
Gemäß der Erfindung sind Befestigungsmittel bzw. Verriegelungsmittel für das Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, in der Vorrichtung vorhanden. Es wird bevorzugt, eine werkzeuglose Montage anzubieten. Vorzugsweise können die Befestigungsmittel bzw. According to the invention, fastening means or locking means for the lighting means and / or lighting module, in particular LED module, are present in the device. It is preferred to offer a tool-free installation. Preferably, the fastening means or
Verriegelungsmittel mechanische Befestigungsmittel bzw. mechanische Verriegelungsmittel sein, die für Haltemittel des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, gestaltet sind. Locking means be mechanical fastening means or mechanical locking means, which are designed for holding means of the illuminant and / or light module, in particular LED module.
Die Befestigung des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Modul, in der Vorrichtung kann über an sich bekannten Prinzipen erfolgen. Wenn die Vorrichtung bzw. das Fassungsgehäuse als Ring ausgebildet sind, kann das Prinzip eines Bajonett- Verschlusses angewendet werden. The attachment of the light source and / or light module, in particular LED module in the device can be done by known per se principles. If the device or the socket housing are formed as a ring, the principle of a bayonet closure can be applied.
Es wird bevorzugt, die mechanische Befestigung zwischen dem It is preferred to use the mechanical fastening between the
Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Modul, und der Vorrichtung über mehrere Punkte zu verteilen. In ähnlicher Weise kann die mechanische Befestigung zwischen dem Leuchtmittels und/oder Bulb and / or light module, in particular LED module, and the device over several points to distribute. Similarly, the mechanical attachment between the bulb and / or
Leuchtmoduls, insbesondere LED-Modul, und dem Kühlkörper über mehrere Punkte verteilt werden. Beispielsweise können Noppen als Haltemittel am Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, angeordnet sein. Im Light module, in particular LED module, and the heat sink are distributed over several points. For example, nubs may be arranged as holding means on the lighting means and / or lighting module, in particular LED module. in the
Fassungsgehäuse der Vorrichtung können entsprechende Aussparungen vorhanden sein, damit das Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, in das Fassungsgehäuse eingesteckt werden kann. Socket housing of the device can corresponding recesses be present so that the light source and / or light module, in particular LED module, can be inserted into the socket housing.
Im Fassungsgehäuse der Vorrichtung können Führungselemente, vorzugsweise als Verriegelungskulisse vorgesehen, vorhanden sein, die für die Führung der Haltemittel des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Modul, dienen. Eine mögliche Arretierung bzw. In the socket housing of the device guide elements, preferably provided as a locking link, be present, which serve for the guidance of the holding means of the illuminant and / or light module, in particular LED module. A possible locking or
Verriegelung des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED- Modul, im Fassungsgehäuse kann durch einen Verriegelungsanschlag realisiert werden. Es könnte auch mittels einer Rastkerbe im Locking of the lamp and / or light module, in particular LED module, in the socket housing can be realized by a locking stop. It could also be done by means of a notch in the
Fassungsgehäuse realisiert werden. Socket housing can be realized.
Dadurch kann das in der Vorrichtung befestigte LED-Modul gegen einen Kühlkörper angedrückt werden, der auf bzw. hinter der Vorrichtung angeordnet sein kann. As a result, the LED module fastened in the device can be pressed against a heat sink, which can be arranged on or behind the device.
Wesentlich ist auch, dass die Rückseite des Leuchtmittels und/oder It is also essential that the back of the bulb and / or
Leuchtmoduls, insbesondere LED-Moduls, aus einem wärmeableitenden Material besteht. Der Kühlkörper ist vorzugsweise aus Aluminium. Wenn die Anpresskraft über die gesamte Kontaktfläche zwischen Kühlkörper und Rückseite des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED- Moduls, nahezu gleichmäßig verteilt wird, kann eine verbesserte Illuminated module, in particular LED module, consists of a heat-dissipating material. The heat sink is preferably made of aluminum. If the contact pressure over the entire contact surface between the heat sink and the back of the lamp and / or light module, in particular LED module, is distributed almost uniformly, an improved
Wärmeableitung aus dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, erzielt werden. Je größer diese Kontaktfläche ist, desto besser kann die Wärmeableitung erfolgen. Heat dissipation from the lamp and / or light module, in particular LED module can be achieved. The larger this contact area, the better the heat dissipation can take place.
Es ist wesentlich, einen definierten Anpressdruck zwischen der Rückseite des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, und Kühlkörper zu gewährleisten. Abhängig vom Lichtmanagement des It is essential to ensure a defined pressure between the back of the lamp and / or light module, in particular LED module, and heat sink. Depending on the light management of the
Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, und/oder abhängig von den Produktspezifikationen können Kräfte zum Andrücken von ca. 8N bis ca. 75N notwendig bzw. ausreichend sein. Das Fassungsgehäuse kann zum Teil federnd ausgebildet sein, wobei diese Wirkung durch die Beinhaltung von Federmitteln erzielt werden kann, die im Fassungsgehäuse integriert sind. Vorteil hier ist, dass die Federmittel einstückig mit dem Fassungsgehäuse ausgebildet sind. Durch die Minimierung der Anzahl der notwendigen Einzelkomponenten ist eine wesentliche Reduktion der Montagekosten gegeben. Das Fassungsgehäuse ist bevorzugt aus Kunststoff. Die Federmittel können erfindungsgemäß aus demselben Material wie das Fassungsgehäuse sein. Illuminant and / or light module, in particular LED module, and / or depending on the product specifications forces for pressing of about 8N to about 75N may be necessary or sufficient. The socket housing may be formed partially resilient, this effect can be achieved by the leg position of spring means, which are integrated in the socket housing. Advantage here is that the spring means are integrally formed with the socket housing. By minimizing the number of individual components required, there is a significant reduction in assembly costs. The socket housing is preferably made of plastic. The spring means may be according to the invention of the same material as the socket housing.
Wenn eine geringe Andrückkraft des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, auf dem Kühlkörper ausreichend ist, müssen die Federmittel nicht unbedingt zu stark sein, so dass sie einstückig mit dem Fassungsgehäuse ausgebildet werden können. If a low pressure force of the light source and / or light module, in particular LED module, on the heat sink is sufficient, the spring means need not necessarily be too strong, so that they can be integrally formed with the socket housing.
Die Federmittel können insbesondere in einer senkrechten Richtung zur Kontaktfläche des Kühlkörpers mit dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, federnd ausgebildet sein. Es entspricht die Richtung der notwendigen Andrückkraft bzw. Anpresskraft. The spring means may be formed in particular in a direction perpendicular to the contact surface of the heat sink with the light source and / or light module, in particular LED module, resilient. It corresponds to the direction of the necessary pressing force or pressing force.
Es gibt mehrere Möglichkeiten für die Anordnung der Federmittel im There are several possibilities for the arrangement of the spring means in the
Fassungsgehäuse. Die Federmittel können vorzugsweise zwischen dem Fassungsgehäuse und dem Leuchtmittel und/oder Leuchtmodul, Socket housing. The spring means may preferably between the socket housing and the lighting means and / or lighting module,
insbesondere LED-Modul, oder zwischen dem Fassungsgehäuse und dem Kühlkörper wirken. Wichtig ist, dass ein ausreichender Kontakt zwischen Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, und in particular LED module, or act between the socket housing and the heat sink. It is important that sufficient contact between the lamp and / or light module, in particular LED module, and
Kühlkörper erfolgt, um die Wärme der LEDs vom Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, abzuleiten. Heat sink takes place in order to dissipate the heat of the LEDs from the light source and / or light module, in particular LED module.
Die Federmittel können als Federelemente ausgebildet werden. Die Vorrichtung weist Verriegelungsmittel zur mechanischen Befestigung des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, auf. Diese Verriegelungsmittel sind im Fassungsgehäuse angeordnet. Die Federmittel können in den Verrieglungsmitteln vorhanden sein. The spring means may be formed as spring elements. The device has locking means for the mechanical fastening of the luminous means and / or luminous module, in particular LED module. These locking means are arranged in the socket housing. The spring means may be present in the locking means.
Diese erste Möglichkeit zeigt, dass die Anbringung einer Andruckkraft des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, auf den Kühlkörper über die Verriegelungsmittel erfolgen kann. Sie kann sogar ausschließlich über die Verriegelungsmittel erfolgen. This first possibility shows that the application of a pressing force of the luminous means and / or the lighting module, in particular the LED module, onto the heat sink can take place via the locking means. It can even be done exclusively via the locking means.
In dieser ersten Ausführungsform der Erfindung können die In this first embodiment of the invention, the
Verriegelungsmittel federnd und einstückig mit dem Fassungsgehäuse ausgebildet sind. Die Verriegelungsmittel können zumindest eine Verriegelungskulisse aufweisen, die federnd ausgebildet ist. In diesem Fall bildet die Locking means are resilient and integrally formed with the socket housing. The locking means may comprise at least one locking link, which is resilient. In this case, the forms
Verriegelungskulisse die Federmittel. Wie oben bereits beschrieben, können die Haltemittel des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED- Moduls, von den Verriegelungselementen gehalten werden. Durch die Federung dieser erfindungsgemäßen Verriegelungselemente wird eine Anpresskraft auf den Haltemitteln, d.h. auf dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, geübt, so dass das Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, auf dem Kühlkörper gedrückt wird. Locking the spring means. As already described above, the holding means of the luminous means and / or light module, in particular LED module, can be held by the locking elements. By the suspension of these locking elements according to the invention, a contact pressure on the holding means, i. practiced on the light source and / or light module, in particular LED module, so that the light source and / or light module, in particular LED module, is pressed on the heat sink.
Für diese Ausführungsform ist es zu berücksichtigen, dass eine fixe For this embodiment, it should be noted that a fixed
Befestigung zwischen dem Fassungsgehäuse und dem Kühlkörper vorgesehen sein soll. Eine Umkehrung soll nicht ausgeschlossen sein. Die Federmittel können beispielsweise einstückig mit dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, ausgebildet sein, wobei die Haltemittel zur Befestigung mit dem Fassungsgehäuse federnd ausgebildet sein können und die Verriegelungsmittel des Fassungsgehäuses starr sein können. Attachment between the socket housing and the heat sink should be provided. A reversal should not be ruled out. The spring means may for example be integrally formed with the lighting means and / or lighting module, in particular LED module, wherein the holding means for Attachment may be resiliently formed with the socket housing and the locking means of the socket housing can be rigid.
Es ist auch aus dem Stand der Technik bekannt, dass die Vorrichtung Befestigungsmittel zur mechanischen Befestigung der Vorrichtung auf dem Kühlkörper aufweist. Als zweite Ausführungsform der Erfindung können die Federmittel an diesen Befestigungsmitteln angeordnet werden. It is also known from the prior art that the device has fastening means for mechanically fastening the device to the heat sink. As a second embodiment of the invention, the spring means can be arranged on these fastening means.
Vorzugsweise kann jeweils ein Federmittel zwischen dem Befestigungsmittel der Vorrichtung zum Kühlkörper und dem Fassungsgehäuse vorgesehen werden. Beispielsweise können diese jeweiligen Federmittel als Lasche ausgebildet werden. Preferably, a respective spring means between the fastening means of the device to the heat sink and the socket housing can be provided. For example, these respective spring means can be formed as a tab.
In dieser Ausführungsform kann die mechanische Befestigung zwischen Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, wie aus dem bisherigen Stand der Technik erfolgen, wobei im montierten Zustand des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, im In this embodiment, the mechanical attachment between the light source and / or light module, in particular LED module, as done in the prior art, wherein in the assembled state of the light and / or light module, in particular LED module, in
Fassungsgehäuse eine fixe Verbindung zwischen diesen zwei Elementen vorgesehen ist. Socket housing a fixed connection between these two elements is provided.
Gegenstand der Erfindung ist auch, dass zusätzliche Federmittel zu den einstückigen Federmitteln im oder am Fassungsgehäuse vorhanden sein können. Besonderes wenn höhere Kräfte notwendig sind, um das LED-Modul auf dem Kühlkörper andrücken zu können, ist es vorteilhaft, wenn weitere Federmittel vorhanden sind. Wenn die einstückigen Federmittel aus The invention is also that additional spring means may be present to the one-piece spring means in or on the socket housing. Especially when higher forces are necessary to press the LED module on the heat sink, it is advantageous if other spring means are present. When the one-piece spring means off
Kunststoff wie das Fassungsgehäuse ausgebildet sind, kann es vorkommen, dass sie mit der Zeit weniger Kraft ausbringen können und/oder dass die Gestaltung der einstückigen Federmittel unzureichend für die erforderliche Federkraft ist. Dies kann auch bei höheren Temperaturen, die aufgrund der LED-Erwärmung oder der ambienten Temperatur auftreten können, zustande kommen, wobei der Kunststoff des Fassungsgehäuses und der einstückigen Federmittel nachlassen würde. Plastic as the socket housing are formed, it may happen that they can deploy less force over time and / or that the design of the one-piece spring means is insufficient for the required spring force. This can also be achieved at higher temperatures, which may occur due to the LED heating or the ambient temperature come, wherein the plastic of the socket housing and the one-piece spring means would diminish.
Die zusätzlichen Federmittel sollen unterstützend zu den Federmitteln wirken, d.h. dass die zusätzlichen Federmittel stärker als die einstückigen Federmittel sein sollen. Eine höhere Anpresskraft kann dadurch erreicht werden. In Abhängigkeit von den Eigenschaften der einstückigen Federmittel und der zusätzlichen Federmittel kann eine bis zu ca. zehnfache The additional spring means should act to assist the spring means, i. that the additional spring means should be stronger than the one-piece spring means. A higher contact pressure can be achieved. Depending on the properties of the one-piece spring means and the additional spring means can be up to about ten times
Anpresskraft erzielt werden. Contact pressure can be achieved.
Aufgrund der Gestaltung der Federmittel, d.h. aufgrund ihrer Geometrie und ihrer Materialeigenschaften, kann die erforderliche Anpresskraft erreicht werden. Es kann beispielsweise verschiedene Federmittel geben, die jeweils eine andere Dicke haben, um verschiedene Anpresskräfte zu ermöglichen, abhängig welche Anpresskraft für die jeweiligen Produkte notwendig wird. Due to the design of the spring means, i. due to their geometry and their material properties, the required contact pressure can be achieved. For example, there may be different spring means, each having a different thickness to allow different contact forces, depending on which pressing force for the respective products is necessary.
Die zusätzlichen Federmittel können auch einstückig mit dem The additional spring means can also be integral with the
Fassungsgehäuse oder als Zusatzelement ausgebildet werden. Sie können aus demselben Material sein, als die einstückigen Federmittel. Sie können bevorzugt aber auch aus einem Material mit einer höheren Federkraft, insbesondere Federstahl. Dadurch höhere Temperaturen werden besser ausgehalten und die Anpresskraft des LED-Moduls auf dem Kühlkörper bleibt gleichmäßiger verteilt. Es wird bevorzugt, dass die zusätzlichen Federmittel unmittelbar zu den einstückigen Federmitteln angeordnet werden. Sie können beispielsweise nahezu bzw. im Wesentlichen parallel zu den einstückigen Federmittel vorgesehen werden. Die zusätzlichen Federmittel können bevorzugt zumindest auf einer Seite mit dem Fassungsgehäuse befestigt oder arretiert werden. Die andere Seite der zusätzlichen Federmittel kann beispielsweise im Fassungsgehäuse gelagert angeordnet sein. Es wäre auch vorstellbar, dass die einstückigen Federmittel aus einem anderen Material als das des Fassungsgehäuses bestehen. Beispielsweise kann das Fassungsgehäuse aus Kunststoff sein und die einstückigen Socket housing or formed as an additional element. They can be made of the same material as the one-piece spring means. But you can also preferably made of a material with a higher spring force, in particular spring steel. As a result, higher temperatures are better tolerated and the contact pressure of the LED module on the heat sink remains more evenly distributed. It is preferred that the additional spring means be arranged directly to the one-piece spring means. They can for example be provided almost or substantially parallel to the one-piece spring means. The additional spring means may preferably be attached or locked at least on one side with the socket housing. The other side of the additional spring means may be arranged for example mounted in the socket housing. It would also be conceivable that the one-piece spring means consist of a different material than that of the socket housing. For example, the socket housing can be made of plastic and the one-piece
Federmittel aus Federstahl, wobei bei der Herstellung der Vorrichtung diese Federmittel einstückig mit dem Fassungsgehäuse verbunden werden, beispielsweise durch Umspritzen. Spring means made of spring steel, wherein in the manufacture of the device, these spring means are integrally connected to the socket housing, for example by encapsulation.
Es kann in weiteren Ausführungsformen auch vorgesehen werden, dass Federmittel zwischen dem Fassungsgehäuse der Vorrichtung und demIt can also be provided in further embodiments that spring means between the socket housing of the device and the
Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, wirken, oder dass Federmittel zwischen dem Fassungsgehäuse der Vorrichtung und dem Kühlkörper wirken, wobei die Federmittel als zusätzliche Elemente zu dem Fassungsgehäuse der Vorrichtung vorhanden sind. Solche Federmittel können zumindest an einem ihren Enden mit dem Fassungsgehäuse der Vorrichtung verbunden bzw. in oder an dem Fassungsgehäuse der Illuminant and / or light module, in particular LED module act, or that spring means between the socket housing of the device and the heat sink act, the spring means are provided as additional elements to the socket housing of the device. Such spring means can at least at one end connected to the socket housing of the device or in or on the socket housing the
Vorrichtung gelagert werden. Es ist vorstellbar, dass bei diesen Device are stored. It is conceivable that in these
Ausführungsformen die einstückigen Federmittel entfallen können. Vor allem können die Federmittel als zusätzliche Elemente so ausgewählt werden, dass die notwendige Anpresskraft des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls, auf dem Kühlkörper erreicht wird. Material und Geometrie der Federmittel kann dementsprechend ausgewählt werden, wobei Federstahl als Material bevorzugt werden kann. Weitere Vorteile aus der anderen beschriebenen Ausführungsformen können für solche Embodiments the one-piece spring means can be omitted. Above all, the spring means can be selected as additional elements so that the necessary contact pressure of the lamp and / or light module, in particular LED module, is achieved on the heat sink. Material and geometry of the spring means can be selected accordingly, with spring steel can be preferred as a material. Further advantages from the other described embodiments may be given for such
Ausführungsformen auch berücksichtigt werden. Es ist auch nicht Embodiments are also taken into account. It is not
ausgeschlossen, Merkmale der anderen beschriebenen Ausführungsformen mit solchen Ausführungsformen zu kombinieren. excluded to combine features of the other described embodiments with such embodiments.
Weitere Ausführungsformen der Federmittel und der zusätzlichen Federmittel werden hier nicht beschrieben, sie sind aber aus der Erfindung nicht auszuschließen. Ein weiterer Aspekt der Erfindung ist, dass die elektrische Kontaktierung zwischen der Vorrichtung und dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, über weitere Mittel als die für die mechanische Befestigung zwischen der Vorrichtung und dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul, vorgesehen ist. Further embodiments of the spring means and the additional spring means are not described here, but they can not be excluded from the invention. A further aspect of the invention is that the electrical contact between the device and the lighting means and / or light module, in particular LED module, via further means than for the mechanical attachment between the device and the lamp and / or light module, in particular LED Module, is provided.
Zusätzlich ist eine Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Leuchtmoduls, insbesondere eines LED- Moduls, vorgesehen, wobei die Vorrichtung zumindest ein Fassungsgehäuse aufweist, wobei das Leuchtmittel und/oder Leuchtmodul, insbesondere LED- Modul, in das Fassungsgehäuse der Vorrichtung angeordnet wird und auf einem mit der Vorrichtung verbundenen Kühlkörper angedrückt wird, und wobei die Vorrichtung eine Erdung aufweist. Wesentlich ist, dass die Erdung von dem Fassungsgehäuse direkt auf dem Kühlkörper kontaktiert wird. Die Erdung kann federnd sein. Sie kann auch als Drahtbügel vorgesehen werden. In addition, a device for attaching and contacting a light source and / or a light module, in particular an LED module, is provided, wherein the device has at least one socket housing, wherein the lighting means and / or light module, in particular LED module, in the socket housing of the device is arranged and pressed on a heat sink connected to the device, and wherein the device has a ground. It is essential that the grounding of the socket housing is contacted directly on the heat sink. The grounding can be springy. It can also be provided as a wire hanger.
Ein weiteres wesentliches Merkmal der Erfindung ist, dass die Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Another essential feature of the invention is that the device for attaching and contacting a lamp and / or a
Leuchtmoduls, insbesondere eines LED-Moduls, mittelbar oder unmittelbar mit einer Leuchte verbunden wird. Als Leuchte kann beispielsweise eine Downlight-Leuchte vorgesehen sein. Die Erfindung betrifft außerdem ein Leuchtmittel oder Leuchtmodul, insbesondere LED-Modul, sowie eine Leuchte mit der erfindungsgemäßen Vorrichtung.  Light module, in particular an LED module, directly or indirectly connected to a lamp. As a light, for example, a downlight can be provided. The invention also relates to a lamp or light module, in particular LED module, as well as a lamp with the device according to the invention.
Im Folgenden wird die Erfindung anhand Ausführungsformen näher beschrieben, die jedoch nur beispielhaft, nicht aber einschränkend In the following, the invention will be described in more detail by means of embodiments which, however, by way of example only, not limitation
aufzufassen sein sollen. Es zeigen: should be understood. Show it:
Fig. 1a: Explosionsansicht einer ersten erfindungsgemäßen Vorrichtung mit einem LED-Modul und einem Kühlkörper. Fig. 1a: exploded view of a first device according to the invention with an LED module and a heat sink.
Fig. 1b: Detailansicht der Federmittel aus Fig. 1a. Fig. 1b: Detail view of the spring means of Fig. 1a.
Fig. 2: Explosionsansicht der ersten erfindungsgemäßen Vorrichtung mit einem LED-Modul.  Fig. 2: exploded view of the first device according to the invention with an LED module.
Fig. 3: weitere Explosionsansicht der ersten erfindungsgemäßen 3 shows another exploded view of the first invention
Vorrichtung mit einem LED-Modul.  Device with an LED module.
Fig. 4a: perspektivische Ansicht einer zweiten erfindungsgemäßen Fig. 4a: perspective view of a second invention
Vorrichtung mit einem Kühlkörper.  Device with a heat sink.
Fig. 4b: Detailansicht der Federmittel aus Fig. 4a. Fig. 4b: Detail view of the spring means of Fig. 4a.
Fig. 5: Ansicht von oben der zweiten erfindungsgemäßen Vorrichtung mit einem Kühlkörper.  Fig. 5: top view of the second device according to the invention with a heat sink.
Fig. 6a: Seitenansicht der zweiten erfindungsgemäßen Vorrichtung. 6a: side view of the second device according to the invention.
Fig. 6b: Detailansicht der Federmittel aus Fig. 6a. Fig. 6b: Detail view of the spring means of Fig. 6a.
Fig. 7: Seitenansicht der zweiten erfindungsgemäßen Vorrichtung mit einem LED-Modul und einem Kühlkörper, wobei das LED-Modul noch nicht in der Vorrichtung befestigt ist. Fig. 7: side view of the second device according to the invention with an LED module and a heat sink, wherein the LED module is not yet mounted in the device.
Fig. 8: Seitenansicht der zweiten erfindungsgemäßen Vorrichtung mit einem LED-Modul und einem Kühlkörper, wobei das LED-Modul in der Vorrichtung befestigt ist. Fig. 8: side view of the second device according to the invention with an LED module and a heat sink, wherein the LED module is mounted in the device.
Fig. 9a: perspektivische Ansicht der zweiten erfindungsgemäßen Fig. 9a: perspective view of the second invention
Vorrichtung mit einem Kühlkörper und einem noch nicht montierten LED-Modul.  Device with a heat sink and a not yet mounted LED module.
Fig. 9b: Detailansicht der Erdung aus Fig. 9a.  Fig. 9b: Detail view of the ground of Fig. 9a.
Fig. 10a: perspektivische Ansicht der zweiten erfindungsgemäßen  Fig. 10a: perspective view of the second invention
Vorrichtung mit noch nicht montierten zusätzlichen Federmitteln. Fig. 10b: Detailansicht der Federmittel aus Fig. 10a.  Device with not yet mounted additional spring means. Fig. 10b: Detail view of the spring means of Fig. 10a.
Fig. 11a: perspektivische Ansicht der zweiten erfindungsgemäßen Fig. 11a: perspective view of the second invention
Vorrichtung mit montierten zusätzlichen Federmitteln, wobei das nicht dargestellte LED-Modul noch nicht in der Vorrichtung montiert ist. Fig. 11 b: Detailansicht der Federmittel aus Fig. 11a. Device with mounted additional spring means, wherein the not-shown LED module is not yet mounted in the device. Fig. 11b: Detail view of the spring means of Fig. 11a.
Fig. 12a: Seitenansicht der zweiten erfindungsgemäßen Vorrichtung mit zusätzlichen Federmitteln, wobei das LED-Modul in der Fig. 12a: side view of the second device according to the invention with additional spring means, wherein the LED module in the
Vorrichtung montiert ist. Device is mounted.
Fig. 12b: Detailansicht der Federmittel aus Fig. 12a. Fig. 12b: Detail view of the spring means of Fig. 12a.
In Fig. 1a ist eine erfindungsgemäße Vorrichtung 1 dargestellt, sowie ein LED-Modul 2 und ein Kühlkörper 4. Es werden hier nur LED-Module 2 beschrieben, es ist aber nicht auszuschließen, dass andere Leuchtmittel oder Leuchtmodule eingesetzt werden können. In Fig. 1a, a device 1 according to the invention is shown, and an LED module 2 and a heat sink 4. Only LED modules 2 are described here, but it is not excluded that other light sources or lighting modules can be used.
Die Vorrichtung 1 mit dem LED-Modul 2 und dem Kühlkörper 4 sind üblicherweise Teil einer Leuchte. Es könnte sich hier um eine Downlight- Leuchte handeln. Weitere Leuchten-Type sollen trotzdem nicht aus dieser Erfindung ausgeschlossen werden. The device 1 with the LED module 2 and the heat sink 4 are usually part of a lamp. It could be a downlight here. Nevertheless, other types of luminaires should not be excluded from this invention.
Kühlkörper sind vorzugsweise aus Aluminium und sind beim Einsatz von LEDs bzw. LED-Modulen notwendig, um die von den LEDs erzeugte Wärme ableiten zu können. Heat sinks are preferably made of aluminum and are necessary when using LEDs or LED modules in order to be able to dissipate the heat generated by the LEDs.
In Fig. 1a bis 3 wird eine erste Variante der erfindungsgemäßen Vorrichtung 1 gezeigt. Die Vorrichtung 1 weist ein Fassungsgehäuse 3 auf. Dieses Fassungsgehäuse 3 kann auf dem Kühlkörper 4 befestigt werden, die In Fig. 1a to 3, a first variant of the device 1 according to the invention is shown. The device 1 has a socket housing 3. This socket housing 3 can be mounted on the heat sink 4, the
Verbindung kann beispielsweise durch Befestigungsmittel 15 und 16, erfolgen, hier als Schraubenlöcher für hier nicht dargestellte Connection can be made, for example, by fastening means 15 and 16, here as screw holes for not shown here
Befestigungsschrauben. Die Befestigungsmittel 5 sind vorzugsweise regelmäßig auf dem Fassungsgehäuse 3 verteilt und die Befestigungsmittel 16 sind auf dem Kuhlkörper 4 verteilt, dementsprechend passend zu den Befestigungsmitteln 15 des Fassungsgehäuses 3. Die Vorrichtung 1 wird dadurch fix bzw. starr mit dem Kühlkörper 4 verbunden werden. Anschließend kann die Montage des LED-Moduls 2 in die Vorrichtung 1 erfolgen. Es bringt den Vorteil, dass nur das Leuchtmittel und/oder das Leuchtmodul, insbesondere LED-Modul 2, ausgetauscht werden soll, wenn dies notwendig ist. Die Vorrichtung 1 kann in ihrem montierten Zustand bleiben. Es vereinfacht die Montage und Demontage für das Fachpersonal, vor allem wenn das Leuchtmittel und oder das Leuchtmodul als Downlight vorgesehen ist. Mounting screws. The fastening means 5 are preferably distributed regularly on the socket housing 3 and the fastening means 16 are distributed on the cooling body 4, correspondingly suitable for the fastening means 15 of the socket housing 3. The device 1 is thereby fixed or rigidly connected to the heat sink 4. Subsequently, the assembly of the LED module 2 in the device 1 can take place. It has the advantage that only the light source and / or the light module, in particular LED module 2, should be replaced, if necessary. The device 1 can remain in its assembled state. It simplifies assembly and disassembly for the specialist personnel, especially if the light source and / or the light module is intended as a downlight.
Die mechanische Verbindung des LED-Moduls 2 mit der Vorrichtung 1 bzw. mit dem Fassungsgehäuse 3 kann bevorzugt über ein Bajonett-Prinzip erfolgen. Hier wird das LED-Modul 2 in der Vorrichtung 1 bzw. in dem Fassungsgehäuse 3 in dieser Weise auch verriegelt. The mechanical connection of the LED module 2 with the device 1 or with the socket housing 3 may preferably take place via a bayonet principle. Here, the LED module 2 is locked in the device 1 and in the socket housing 3 in this way.
Das LED-Modul 2 weist Noppen 10 auf. Diese Noppen sind vorzugsweise rundum des LED-Moduls 2 verteilt angeordnet. The LED module 2 has nubs 10. These nubs are preferably distributed around the LED module 2.
Bei der Montage des LED-Moduls 2 in die Vorrichtung 1 , werden die Noppen 10 in die Aussparungen 7 des Fassungsgehäuses 3 eingesteckt und anschließend wird das LED-Modul 2 in Drehrichtung nach einem Bajonett- Prinzip gedreht. Die Noppen 10 werden über die Verriegelungsmittel 6 geführt und arretiert. Dadurch wird das LED-Modul 2 in der Vorrichtung 1 mechanisch fixiert. Die Noppen 10 gleiten entlang der Verriegelungskulisse 8 des Verriegelungsmittels 6 bis zum Anschlag 9 des Verriegelungsmittels 6. Jedes Verriegelungsmittel 6 ist mit ihren beiden Enden 1 1 und 12 mit dem Fassungsgehäuse 3 einstückig verbunden. Die Verriegelungsmittel 6, vor allem die Verriegelungskulissen 8, sind federnd ausgebildet und wird die Noppen 10 des LED-Moduls 2 in Richtung der Andrückkraft drücken, damit das LED-Modul 2 zum Kühlkörper 4 gedrückt gehalten werden kann. Die Verriegelungsmittel 6 bilden hier gleichzeitig die Federmittel 5, die das Andrücken des LED-Moduls 2 auf dem Kühlkörper 4 ermöglichen sollen. Das Fassungsgehäuse 3 ist vorzugsweise aus Kunststoff. Dadurch sind die Verriegelungsmittel 6 aus dem selben Material. When mounting the LED module 2 in the device 1, the knobs 10 are inserted into the recesses 7 of the socket housing 3 and then the LED module 2 is rotated in the direction of rotation according to a bayonet principle. The knobs 10 are guided and locked via the locking means 6. As a result, the LED module 2 is mechanically fixed in the device 1. The knobs 10 slide along the locking link 8 of the locking means 6 to the stop 9 of the locking means 6. Each locking means 6 is integrally connected at its two ends 1 1 and 12 with the socket housing 3. The locking means 6, especially the locking cams 8, are resilient and will push the knobs 10 of the LED module 2 in the direction of the pressing force, so that the LED module 2 can be kept pressed to the heat sink 4. The locking means 6 simultaneously form the spring means 5, which are to enable the pressing of the LED module 2 on the heat sink 4. The socket housing 3 is preferably made of plastic. As a result, the locking means 6 are made of the same material.
In den Fig. 4a bis 8b ist eine zweite Variante der erfindungsgemäßen FIGS. 4a to 8b show a second variant of the invention
Vorrichtung dargestellt. Device shown.
Die mechanische Verriegelung des LED-Moduls 2 mit der Vorrichtung 1 kann in einer an sich bekannten Weise erfolgen. Die Noppen 10 des LED-Moduls 2 können in den jeweiligen Aussparungen 7 des Fassungsgehäuses 3 eingesteckt werden. Das LED-Modul 2 kann nach einem Bajonett-Prinzip gedreht werden, wobei die Noppen 10 des LED-Moduls 2 jeweils entlang einer starren Verriegelungskulisse 29 gleiten bzw. geführt werden können und jeweils von einem Verriegelungsanschlag 30 arretiert werden können. Die Vorrichtung 1 kann wiederum für diese Ausführungsform über The mechanical locking of the LED module 2 with the device 1 can be done in a manner known per se. The knobs 10 of the LED module 2 can be inserted into the respective recesses 7 of the socket housing 3. The LED module 2 can be rotated according to a bayonet principle, wherein the studs 10 of the LED module 2 each slide along a rigid locking link 29 and can be guided and each can be locked by a locking stop 30. The device 1 can turn over for this embodiment
Befestigungselemente 15 mit den Befestigungselementen 16 des Fasteners 15 with the fasteners 16 of the
Kühlkörpers 4 mittels hier nicht dargestellten Befestigungsschrauben verbunden werden. In dieser Ausführungsform werden die Federmittel 5 durch Laschen 17 zwischen den Befestigungselementen 15 der Vorrichtung 1 und dem Heatsink 4 are connected by means of fastening screws, not shown here. In this embodiment, the spring means 5 by tabs 17 between the fasteners 15 of the device 1 and the
Fassungsgehäuse 3 gebildet. Die Laschen 17 sind federnd ausgebildet. Socket housing 3 formed. The tabs 17 are resilient.
Die Laschen 17 sind einstückig mit dem Fassungsgehäuse 3 und The tabs 17 are integral with the socket housing 3 and
vorzugsweise auch einstückig mit den jeweiligen Befestigungselementen 15 ausgebildet. Ein Ende 18 einer Lasche 17 kann im oberen Teil eines preferably also formed integrally with the respective fastening elements 15. One end 18 of a tab 17 may in the upper part of a
Befestigungselements 15 verbunden sein und das andere Ende 19 dieser Lasche 17 kann mit dem Fassungsgehäuse 3 verbunden werden. Um die federnde Bewegung des Fassungsgehäuses 3 von den Fastener 15 may be connected and the other end 19 of this tab 17 may be connected to the socket housing 3. To the resilient movement of the socket housing 3 of the
Befestigungselementen 15 der Vorrichtung 1 frei zu halten, können Fixing elements 15 of the device 1 to keep free can
Aussparungen 28 aus dem Fassungsgehäuse 3 rundum den Recesses 28 from the socket housing 3 around the
Befestigungselementen 15 vorhanden sein. Bevor das LED-Modul 2 in das Fassungsgehäuse 3 eingedreht wird, d.h. solange das LED-Modul 2 nur in das Fassungsgehäuse 3 eingesteckt wird, liegt das Fassungsgehäuse 3 auf der Kontaktfläche 13 des Kühlkörpers 4 an. Wenn das LED-Modul 2 in das Fassungsgehäuse 3 in Drehrichtung D eingedreht wird, hebt sich das Fassungsgehäuse 3 von der Kontaktfläche 13 des Kühlkörpers 4 von einem Abstand X ab und durch die Federung der Lasche 17 wird die vorzugsweise aus wärmeableitendem Material Fasteners 15 may be present. Before the LED module 2 is screwed into the socket housing 3, ie as long as the LED module 2 is inserted only in the socket housing 3, the socket housing 3 is located on the contact surface 13 of the heat sink 4 at. When the LED module 2 is screwed into the socket housing 3 in the direction of rotation D, the socket housing 3 lifts off from the contact surface 13 of the heat sink 4 from a distance X and by the suspension of the tab 17 is preferably made of heat-dissipating material
bestehende Rückseite 14 des LED-Moduls 2 auf die Kontaktfläche 13 des Kühlkörpers 4 gedrückt. existing rear side 14 of the LED module 2 is pressed onto the contact surface 13 of the heat sink 4.
Die elektrische Kontaktierung zwischen dem LED-Modul 2 und der The electrical contact between the LED module 2 and the
Vorrichtung 1 kann in an sich bekannter Weise erfolgen. Hier weist beispielsweise das LED-Modul 2 Kontaktstifte 20 auf, die rundum des LED- Moduls 2 positioniert sind und in einer senkrechten Richtung zur Rückseite 14 des LED-Moduls 2 angeordnet sind. Bei der Montage des LED-Moduls 2 in die Vorrichtung 1 , werden die Kontaktstifte 20 in die Langlöcher 21 des Fassungsgehäuses 3 eingesteckt und durch die Drehbewegung für die mechanische Verriegelung werden sie mit den elektrisch leitenden Device 1 can be done in a conventional manner. Here, for example, the LED module 2 on pins 20 which are positioned all around the LED module 2 and are arranged in a direction perpendicular to the rear side 14 of the LED module 2. When mounting the LED module 2 in the device 1, the contact pins 20 are inserted into the slots 21 of the socket housing 3 and by the rotational movement for the mechanical locking they are with the electrically conductive
Kontaktierungselementen 22 kontaktiert. Die Kontaktstifte 20 werden in den jeweiligen Kontaktklammern 23 eingeklemmt. Diese Kontaktklammern 23 sind jeweils mit einer Verdrahtungskontaktierung 24 elektrisch verbunden, wobei eine weitere elektrische Verdrahtung möglich ist. Es sind hier fünf Kontaktstifte 20 vorhanden. Die Anzahl der Kontaktstifte kann abhängig von den gewünschten Anschlüsse sein. Contacting elements 22 contacted. The contact pins 20 are clamped in the respective contact clips 23. These contact clips 23 are each electrically connected to a wiring contact 24, wherein a further electrical wiring is possible. There are five pins 20 here. The number of pins may be dependent on the desired terminals.
Die erforderliche Anpresskraft bzw. Andrückkraft hängt vor allem vom The required contact pressure or pressure depends mainly on
Lichtmanagement des LED-Moduls 2 ab, d.h. es hängt davon ab, wie viel Wärme aus dem LED-Modul heraus kommt. Als Richtwert betrachtet, kann eine Andrückkraft ungefähr von 10N bis 20N ausreichend sein, um die Wärme aus dem LED-Modul 2 ausreichend wegführen zu können. Ein gutes Lichtmanagement bzw. wenig Wärme aus dem LED-Modul 2 ermöglicht eine vereinfachte Bauweise der Federmittel 5. Sie können einstückig mit dem Fassungsgehäuse 3 ausgebildet werden und müssen nicht als zusätzlichen Bauteil zum Fassungsgehäuse 3 ausgeführt werden. Die Montage der Vorrichtung wird dadurch vereinfacht und eine günstigere Herstellung der Vorrichtung ergibt sich. Light management of the LED module 2 from, ie it depends on how much heat from the LED module comes out. As an indication, a pressing force of approximately 10N to 20N may be sufficient to sufficiently dissipate the heat from the LED module 2. A good light management or little heat from the LED module 2 allows a simplified design of the spring means 5. They can be integrally formed with the socket housing 3 and need not be designed as an additional component to the socket housing 3. The assembly of the device is thereby simplified and a more favorable production of the device results.
In Fig. 9a und 9b ist eine mögliche Ausführungsform einer Erdung 25 für diese Einheit (LED-Modul 2 mit Vorrichtung 1 und Kühlkörper 4) dargestellt. Eine Erdung 25 kann für LED-Module erforderlich sein, abhängig von den Vorschriften. Aus dem LED-Modul 2 gibt es einen Kontaktstift 20 für die Erdung des LED-Moduls 2, der mit dem Kontaktierungselement 22 elektrisch kontaktiert wird. Aus dem Kontaktierungselement 22, das in der FIGS. 9a and 9b show a possible embodiment of a grounding 25 for this unit (LED module 2 with device 1 and heat sink 4). A ground 25 may be required for LED modules, depending on the regulations. From the LED module 2, there is a contact pin 20 for the grounding of the LED module 2, which is electrically contacted with the contacting element 22. From the contacting element 22, which in the
Fassungsgehäuse 3 angeordnet ist, bevorzugt aus seiner Socket housing 3 is arranged, preferably from his
Verdrahtungskontaktierung 24, kann die Erdung 25 weiterverdrahtet werden. Wiring 24, the grounding 25 can be further wired.
Die Erdung 25 kann vorzugsweise ein Drahtbügel sein. Sie ist vorzugsweise federnd ausgebildet. Die Erdung 25 kann dadurch direkt auf dem Kühlkörper 4 kontaktiert werden. Durch ihre federnden Eigenschaften ist ein guter Erdungskontakt des LED-Moduls 2 mit dem Kühlkörper 4 vorgesehen. The grounding 25 may preferably be a wire bow. It is preferably resilient. The ground 25 can be contacted directly on the heat sink 4. Due to their resilient properties, a good grounding contact of the LED module 2 with the heat sink 4 is provided.
Es können Halteelemente 26 und/oder 27 vorhanden sein, die an dem Fassungsgehäuse und/oder an dem Befestigungselement 15 der Vorrichtung 1 angeordnet sind. Die Erdung 25 als Drahtbügel kann von diesen There may be holding elements 26 and / or 27, which are arranged on the socket housing and / or on the fastening element 15 of the device 1. The grounding 25 as a wire hanger can of these
Haltelementen 26 und 27 geführt werden. Holding elements 26 and 27 are guided.
In den Fig. 10a bis 12b ist eine beispielhafte Variante der vorher In Figs. 10a to 12b, an exemplary variant of the above
beschriebenen zweiten Ausführungsform mit zusätzlichen Federmitteln dargestellt. Die zusätzlichen Federmittel 31 können aus Federstahl ausgebildet werden. described second embodiment with additional spring means. The additional spring means 31 may be formed of spring steel.
Ein erstes Ende 32 der Federmittel 31 wird mittelbar und/oder unmittelbar mit dem Befestigungsmittel 15 der Vorrichtung 1 befestigt. Hier ist das Ende 32 der Federmittel 31 gebogen und wird in einem Schlitz 34 im Bereich des Befestigungsmittels 15 bzw. am ersten Ende 18 der einstückigen Federmittel 5, 17 positioniert. Bei der Montage des Fassungsgehäuses 3 auf dem A first end 32 of the spring means 31 is attached indirectly and / or directly to the fastening means 15 of the device 1. Here is the end 32 the spring means 31 is bent and is positioned in a slot 34 in the region of the fastening means 15 and at the first end 18 of the one-piece spring means 5, 17. When mounting the socket housing 3 on the
Kühlkörper 4 mittels den Schrauben 36 in den Befestigungsmitteln 15, arretieren bzw. befestigen die Schrauben 36 das Ende 32 der Federmittel 31 , wobei der Schraubenkopf über das Ende 32 der Federmittel 31 hinausgeht bzw. auf der Biegung des Federelements 31 . Dadurch werden die Heatsink 4 by means of screws 36 in the fasteners 15, lock or fasten the screws 36, the end 32 of the spring means 31, the screw head beyond the end 32 of the spring means 31 and on the bending of the spring element 31st This will be the
Federmittel 31 zumindest einseitig mit der Vorrichtung fixiert, hier mit den Befestigungselementen 15. Spring means 31 fixed at least on one side with the device, here with the fasteners 15th
Das Fassungsgehäuse 3 weist Lagermittel auf, hier als Noppen 35 The socket housing 3 has storage means, here as nubs 35th
dargestellt, die im Bereich des zweiten Endes 19 der Federmittel 5, 17 angeordnet sind. Das zweite Ende 33 der Federmittel 31 kann im Bereich der Lagermittel, hier als Noppen 35, angeordnet bzw. gelagert werden. Es ist nicht zwingend, dass dieses Ende 33 der Federmittel 31 fixiert wird. Das freie Ende 33 der Federmittel 31 kann beispielsweise zwischen Noppe 35 und zweitem Ende 19 der Federmittel 5, 17 vorhanden sein. Die Federmittel 5, 17 und 31 können im Wesentlichen parallel zueinander angeordnet sein, wenn das LED-Modul 2 noch nicht in im Fassungsgehäuse 3 montiert ist. Die Federkraftrichtung der Federmittel 5 ,17 und 31 ist im Wesentlichen identisch. represented, which are arranged in the region of the second end 19 of the spring means 5, 17. The second end 33 of the spring means 31 can be arranged or stored in the region of the bearing means, here as nubs 35. It is not mandatory that this end 33 of the spring means 31 is fixed. The free end 33 of the spring means 31 may be present, for example, between nub 35 and second end 19 of the spring means 5, 17. The spring means 5, 17 and 31 may be arranged substantially parallel to each other when the LED module 2 is not yet mounted in the socket housing 3. The spring force direction of the spring means 5, 17 and 31 is substantially identical.
Andere Möglichkeiten, um die Federmittel 31 zu lagern bzw. zu fixieren, sollen nicht ausgeschlossen werden. Other ways to store or fix the spring means 31 should not be excluded.
Wenn das LED-Modul 2 in der Vorrichtung 1 montiert wird, wird in dieser Ausführungsform das Fassungsgehäuse 3 vom Kühlkörper 4 von einem Abstand X aufgehoben, und die Federmittel 5 und die Federmittel 31 können sich unterschiedlich verformen, wie in Fig. 12a und 12b dargestellt. Die Federmittel 5, 17 weisen eine stärkere Verformung auf als die Federmittel 31 , da sie weniger Anpresskraft des LED-Moduls 2 auf dem Kühlkörper 4 ermöglichen können. Die Federmittel 5, 17 und 31 sind im montierten When the LED module 2 is mounted in the apparatus 1, in this embodiment, the socket housing 3 is detached from the heat sink 4 by a distance X, and the spring means 5 and the spring means 31 may deform differently, as shown in Figs. 12a and 12b , The spring means 5, 17 have a greater deformation than the spring means 31, since they can allow less contact force of the LED module 2 on the heat sink 4. The spring means 5, 17 and 31 are mounted in the
Zustand des LED-Moduls 2 nicht mehr parallel zueinander aufgrund der verschiedenen Verformungen. Die Federmittel 31 unterstützen die State of the LED module 2 no longer parallel to each other due to different deformations. The spring means 31 support the
Federmittel 5, 17 und verbessern bzw. erhöhen den Druck des LED-Moduls 2 auf dem Kühlkörper 4. Das zweite Ende 33 der Federmittel 31 liegt auf dem Ende 19 der Spring means 5, 17 and improve or increase the pressure of the LED module 2 on the heat sink 4. The second end 33 of the spring means 31 is located on the end 19 of
Federmittel 5, 17 im Bereich des Fassungsgehäuses auf. Die Federmittel 31 sind niedergespannt.  Spring means 5, 17 in the region of the socket housing. The spring means 31 are clamped down.
Die Dicke der Federmittel 31 als Federstahl beeinflusst u.a. die Anpresskraft vom LED-Modul 2 auf dem Kühlkörper 4. Es wäre vorstellbar, verschiedenen Federmittel 31 mit z.B. verschiedenen Dicken zu haben und die passenden Federmittel 31 zu den Anforderungen für die Leuchte in der Vorrichtung einzusetzen. Die in den Figuren dargestellten Ausführungsformen sind nur Beispiele für die Erfindung. Weitere, hier nicht dargestellte Ausführungsformen, sollen nicht ausgeschlossen sein. The thickness of the spring means 31 as spring steel influences u.a. the pressing force of the LED module 2 on the heat sink 4. It would be conceivable to use different spring means 31 with e.g. to have different thicknesses and to use the appropriate spring means 31 to the requirements for the light in the device. The embodiments shown in the figures are only examples of the invention. Other, not shown embodiments, should not be excluded.
Zeichnunqsbezeichnunqen: Zeichnunqsbezeichnunqen:
1. Vorrichtung  1. Device
2. LED-Modul  2. LED module
3. Fassungsgehäuse  3. socket housing
4. Kühlkörper  4. heat sink
5. Federmittel  5. Spring means
6. Verriegelungsmittel  6. Locking means
7. Aussparung  7. recess
8. Verriegelungskulisse  8. Locking link
9. Verriegelungsanschlag  9. Latch stop
10. Noppe  10. knob
11. erstes Ende vom 6  11th first end of the 6th
12. zweites Ende vom 6  12th second end of the 6th
13. Kontaktfläche vom 4 14. Rückseite vom 2 13. contact surface of the 4th 14. back of the 2nd
15. Befestigungsmittel von 1 15. Fasteners of 1
16. Befestigungsmittel vom 416. Fasteners of the 4th
17. Lasche 17th tab
18. erstes Ende von 17 18th first end of 17
19. zweites Ende vom 1719th second end of the 17th
20. Kontaktstift 20. Contact pin
21. Langloch  21st slot
22. Kontaktierungselement 22. contacting element
23. Kontaktklammer 23. Contact clip
24. Verdrahtungskontaktierung 24. Wiring contact
25. Erdung 25. Grounding
26. Halteelement  26. Retaining element
27. Halteelement  27. Retaining element
28. Aussparung  28th recess
29. Verriegelungskulisse 29. Locking link
30. Verriegelungsanschlag30. Latch stop
31. Federmittel 31. Spring means
32. erstes Ende von 31 32nd first end of 31
33. zweites Ende von 3133rd second end of 31
34. Schlitz 34. slot
35. Noppe  35th knob
36. Schraube  36. screw
D: Drehrichtung D: direction of rotation
Fa: Andrückkraft  Fa: pressing force
X: Abstand zwischen 3 und 4  X: distance between 3 and 4

Claims

Ansprüche  claims
1. Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Leuchtmoduls, insbesondere eines LED-Moduls (2), wobei die Vorrichtung (1 ) zumindest ein Fassungsgehäuse (3) aufweist, wobei das Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul (2), in das Fassungsgehäuse (3) der Vorrichtung (1) angeordnet wird und auf einem mit der Vorrichtung (1 ) verbundenen Kühlkörper (4) angedrückt wird, wobei dieses Andrücken zumindest über Federmittel (5) der Vorrichtung (1 ) erfolgt, dadurch 1. Device for attaching and contacting a lamp and / or a light module, in particular an LED module (2), wherein the device (1) has at least one socket housing (3), wherein the lamp and / or light module, in particular LED module (2), in the socket housing (3) of the device (1) is arranged and on a device (1) connected to the heat sink (4) is pressed, said pressing at least via spring means (5) of the device (1), thereby
gekennzeichnet, dass die Federmittel (5) einstückig mit dem  characterized in that the spring means (5) integral with the
Fassungsgehäuse (3) ausgebildet sind.  Socket housing (3) are formed.
Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Federmittel (5) in einer senkrechten Richtung zur Kontaktfläche (13) des Kühlkörpers (4) mit dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul (2), federnd ausgebildet sind. Apparatus according to claim 1, characterized in that the spring means (5) in a vertical direction to the contact surface (13) of the heat sink (4) with the lighting means and / or lighting module, in particular LED module (2), are resilient.
3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Federmittel (5) zwischen dem Fassungsgehäuse (3) und dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul (2), oder zwischen dem Fassungsgehäuse (3) und dem Kühlkörper (4) wirken. 3. Apparatus according to claim 1 or 2, characterized in that the spring means (5) between the socket housing (3) and the lighting means and / or light module, in particular LED module (2), or between the socket housing (3) and the heat sink (4) act.
4. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch 4. Device according to one of claims 1 to 3, characterized
gekennzeichnet, dass die Vorrichtung (1 ) Verriegelungsmittel (6) zur mechanischen Befestigung des Leuchtmittels und/oder Leuchtmoduls, insbesondere LED-Moduls (2), im Fassungsgehäuse (3) aufweist, wobei die Federmittel (5) in den Verrieglungsmitteln (6) vorhanden sind. in that the device (1) has locking means (6) for the mechanical fastening of the luminous means and / or light module, in particular LED module (2), in the socket housing (3), the spring means (5) being present in the locking means (6) are.
5. Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, dass die Verriegelungsmittel (6) zumindest eine Verriegelungskulisse (8) aufweisen, die federnd ausgebildet ist. 5. Apparatus according to claim 4, characterized in that the locking means (6) have at least one locking link (8) which is resilient.
6. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch 6. Device according to one of claims 1 to 3, characterized
gekennzeichnet, dass die Vorrichtung (1 ) Befestigungsmittel (15) zur mechanischen Befestigung der Vorrichtung (1 ) auf dem Kühlkörper (4) aufweist, wobei die Federmittel (5) an den Befestigungsmitteln (15) angeordnet sind.  in that the device (1) has fastening means (15) for the mechanical fastening of the device (1) on the cooling body (4), the spring means (5) being arranged on the fastening means (15).
7. Vorrichtung nach Anspruch 6, dadurch gekennzeichnet, dass die 7. Apparatus according to claim 6, characterized in that the
Federmittel (5) als Lasche (17) zwischen dem Befestigungsmittel (15) und dem Fassungsgehäuse (3) ausgebildet sind.  Spring means (5) as a tab (17) between the fastening means (15) and the socket housing (3) are formed.
8. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zusätzliche Federmittel (31 ) zu den 8. Device according to one of the preceding claims, characterized in that additional spring means (31) to the
Federmitteln (5) im oder am Fassungsgehäuse (3) vorhanden sind.  Spring means (5) in or on the socket housing (3) are present.
Vorrichtung nach Anspruch 8, dadurch gekennzeichnet, dass die zusätzlichen Federmittel (31 ) unterstützend zu den Federmitteln (5) wirken. Apparatus according to claim 8, characterized in that the additional spring means (31) act in support of the spring means (5).
10. Vorrichtung nach Anspruch 8 oder 9, dadurch gekennzeichnet, dass die zusätzlichen Federmittel (31 ) unmittelbar zu den Federmitteln (5) angeordnet sind. 10. Apparatus according to claim 8 or 9, characterized in that the additional spring means (31) are arranged directly to the spring means (5).
1 1. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die elektrische Kontaktierung zwischen der Vorrichtung (1 ) und dem Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul (2), über weitere Mittel (20, 22) als die für die mechanische Befestigung zwischen der Vorrichtung (1 ) und dem vorgesehen ist. 1 1. Device according to one of the preceding claims, characterized in that the electrical contact between the device (1) and the lighting means and / or light module, in particular LED module (2), via further means (20, 22) than for the mechanical attachment between the device (1) and the is provided.
12. Vorrichtung zum Befestigen und Kontaktieren eines Leuchtmittels und/oder eines Leuchtmoduls, insbesondere eines LED-Moduls (2), wobei die Vorrichtung (1 ) zumindest ein Fassungsgehäuse (3) aufweist, wobei das Leuchtmittel und/oder Leuchtmodul, insbesondere LED-Modul (2), in das Fassungsgehäuse (3) der Vorrichtung (1) angeordnet wird und auf einem mit der Vorrichtung (1) verbundenen Kühlkörper (4) angedrückt wird, und wobei die Vorrichtung (1 ) eine12. Device for attaching and contacting a light source and / or a light module, in particular an LED module (2), wherein the device (1) has at least one socket housing (3), wherein the lighting means and / or light module, in particular LED module (2), in the socket housing (3) of the device (1) is arranged and on a device (1) connected to the heat sink (4) is pressed, and wherein the device (1) a
Erdung (25) aufweist, dadurch gekennzeichnet, dass die Erdung (25) von dem Fassungsgehäuse (3) direkt auf dem Kühlkörper (4) kontaktiert wird. 13. Leuchte mit einer Vorrichtung (1) nach einem der vorhergehenden Ansprüche. Grounding (25), characterized in that the grounding (25) of the socket housing (3) is contacted directly on the heat sink (4). 13. Light with a device (1) according to one of the preceding claims.
EP12721692.7A 2011-04-08 2012-04-03 Device for fastening and contacting a lighting means and/or a lighting module, and lamp Active EP2694875B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM204/2011U AT12818U1 (en) 2011-04-08 2011-04-08 DEVICE FOR MOUNTING AND CONTACTING A LIGHTING MEANS AND / OR A LIGHTING MODULE, AND LIGHT
ATGM434/2011U AT12910U1 (en) 2011-04-08 2011-08-01 DEVICE FOR MOUNTING AND CONTACTING A LIGHTING MEANS AND / OR A LIGHTING MODULE, AND LIGHT
PCT/AT2012/000087 WO2012135877A2 (en) 2011-04-08 2012-04-03 Device for fastening and contacting a lighting means and/or a lighting module, and lamp

Publications (2)

Publication Number Publication Date
EP2694875A2 true EP2694875A2 (en) 2014-02-12
EP2694875B1 EP2694875B1 (en) 2016-03-30

Family

ID=46969595

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12721692.7A Active EP2694875B1 (en) 2011-04-08 2012-04-03 Device for fastening and contacting a lighting means and/or a lighting module, and lamp

Country Status (6)

Country Link
US (1) US9146021B2 (en)
EP (1) EP2694875B1 (en)
CN (1) CN103597281B (en)
AT (1) AT12910U1 (en)
DE (1) DE112012001614A5 (en)
WO (1) WO2012135877A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9835300B2 (en) 2014-05-22 2017-12-05 Feit Electric Company, Inc. Multi-configurable light emitting diode (LED) flat panel lighting fixture
US9927103B2 (en) 2014-05-22 2018-03-27 Feit Electric Company, Inc. Flush mount lighting fixture
US10119685B2 (en) 2014-12-03 2018-11-06 CP IP Holdings Limited Lighting arrangement
US10174887B2 (en) 2014-12-03 2019-01-08 CP IP Holdings Limited Lighting arrangement with battery backup
EP3029369B1 (en) * 2014-12-03 2017-06-07 CP IP Holdings Limited Lighting arrangement
US10039161B2 (en) 2014-12-03 2018-07-31 CP IP Holdings Limited Lighting arrangement with battery backup
EP3041319B1 (en) 2015-01-03 2018-12-19 CP IP Holdings Limited Lighting arrangement
EP3141810B1 (en) * 2015-08-27 2019-01-09 CP IP Holdings Limited Lighting arrangement
JP6775165B2 (en) * 2016-04-08 2020-10-28 パナソニックＩｐマネジメント株式会社 lighting equipment
US10047937B2 (en) 2016-06-29 2018-08-14 Feit Electric Company, Inc. Lighting fixture mounting systems
US10634320B2 (en) 2016-06-29 2020-04-28 Feit Electric Company, Inc. Lighting fixture mounting systems
CN114815456A (en) * 2022-06-28 2022-07-29 深圳市爱图仕影像器材有限公司 Lighting device, light effect accessory and lighting equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7510400B2 (en) * 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
DE102007050893B4 (en) * 2007-10-24 2011-06-01 Continental Automotive Gmbh Method for positioning and mounting a LED assembly and positioning body therefor
US7866850B2 (en) * 2008-02-26 2011-01-11 Journée Lighting, Inc. Light fixture assembly and LED assembly
US8152336B2 (en) 2008-11-21 2012-04-10 Journée Lighting, Inc. Removable LED light module for use in a light fixture assembly
WO2010146513A1 (en) * 2009-06-17 2010-12-23 Koninklijke Philips Electronics N.V. Illumination device comprising an internal power source and an interface for connecting the illumination device to an external power supply
EP2284440A1 (en) * 2009-08-14 2011-02-16 Koninklijke Philips Electronics N.V. A connector for connecting a component to a heat sink
DE102009036122B4 (en) 2009-08-05 2011-07-21 BJB GmbH & Co. KG, 59755 Lamp base and lamp socket
WO2011019945A1 (en) 2009-08-12 2011-02-17 Journee Lighting, Inc. Led light module for use in a lighting assembly
JP2013528902A (en) 2010-04-26 2013-07-11 シカト・インコーポレイテッド Mounting tool for LED-based lighting module to fixed member

Also Published As

Publication number Publication date
DE112012001614A5 (en) 2014-01-09
US9146021B2 (en) 2015-09-29
AT12910U1 (en) 2013-01-15
WO2012135877A3 (en) 2012-12-13
CN103597281A (en) 2014-02-19
WO2012135877A2 (en) 2012-10-11
US20140092608A1 (en) 2014-04-03
EP2694875B1 (en) 2016-03-30
CN103597281B (en) 2016-12-28

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