EP2671251A2 - Method and device for electrically contact-connecting connection areas of two substrates - Google Patents

Method and device for electrically contact-connecting connection areas of two substrates

Info

Publication number
EP2671251A2
EP2671251A2 EP12714202.4A EP12714202A EP2671251A2 EP 2671251 A2 EP2671251 A2 EP 2671251A2 EP 12714202 A EP12714202 A EP 12714202A EP 2671251 A2 EP2671251 A2 EP 2671251A2
Authority
EP
European Patent Office
Prior art keywords
substrate
housing
pads
phase
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12714202.4A
Other languages
German (de)
French (fr)
Inventor
Ghassem Azdasht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pac Tech Packaging Technologies GmbH
Original Assignee
Pac Tech Packaging Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pac Tech Packaging Technologies GmbH filed Critical Pac Tech Packaging Technologies GmbH
Publication of EP2671251A2 publication Critical patent/EP2671251A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
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Definitions

  • the present invention relates to a method for electrically contacting pads of two substrates, wherein the first substrate with its second substrate facing pads is directly and electrically connected mechanically to the pads of the second substrate and the pads of the first substrate are provided with a Lotstoffön Ltd.
  • the first substrate may be a chip and the second substrate a carrier substrate, wherein the chip is contacted face-down with its chip pads against the substrate pads.
  • the invention relates to an apparatus for carrying out a second phase of the method according to the invention.
  • CONFIRMATION COPY facing pads and previously applied to the pads of the chip solder is mounted directly on the carrier substrate or a printed circuit board.
  • the solder agent application is reflowed during reflow soldering in a soldering oven and connects to the connection surfaces of the carrier substrate.
  • phase I the chip is positioned with its pads against the pads of the substrate and the chip pads and / or the substrate pads are provided with a LotstoffKU.
  • phase I the chip is applied with laser energy to the rear, in such a way that the solder is melted or fused at least to the extent to allow a fixation of the chip on the substrate, wherein at the same time a leveling or a uniform flattening of the chips on the chip pads . Plotted on the substrate pads Lotstoffträge takes place, so that a contact is made between all chip pads and substrate pads.
  • an arrangement of the component arrangement formed by the chip and the substrate takes place in a housing which is designed such that, during a reflow of the solder material application, the component arrangement is acted upon by a flux medium, in particular in gaseous form, which preferably consists of a nitrogen - / formic acid mixture consists.
  • a flux medium in particular in gaseous form, which preferably consists of a nitrogen - / formic acid mixture consists.
  • FIG. 1 shows a device for carrying out the method during phase II, after the above-described fixation of the chip on the substrate has previously been carried out in the phase I not shown here.
  • the component assembly is transferred to the position shown in FIG. 1, in which it is located below the housing 3 and then the housing 3 is lowered over the component assembly, as shown in Fig. 1.
  • the component arrangement formed from the chip 6 and the substrate 7 is located in an interior of a housing 3 sealed to the outside by a seal 2 relative to a support table 1.
  • the housing 3 has a wall which is otherwise substantially gas-tight in relation to the surroundings Inflow opening 8 and an outlet Flow opening 9, which allow a flow or flushing or flooding of the housing interior with a gaseous medium.
  • the substantially parallel to a rear side of the chip 6 arranged housing wall is formed by a glass plate or a transparent plate, which allows a backward loading of the chip with laser energy 5, wherein the laser radiation is focused according to the dimensions of the back of the chip 6 to a to avoid direct heat input or energy input into the substrate 7.
  • a reflow of the solder deposit 10 arranged between the chip connection surfaces and the substrate connection surfaces occurs during a flow through the housing interior with a flux gas, which in the present case is formed from a mixture of nitrogen and formic acid.
  • a nitrogen flow outside the housing 3 can be passed over a surface of a formic acid bath, so that the entrained fumes of formic acid mix with the nitrogen prior to the inflow into the housing 3.
  • a flow or purging of the interior of the housing 3 with a preferably pure protective gas flow, in which case preferably a nitrogen flow is used, for flux deposits, ie here in particular Precipitates of formic acid to avoid on the device assembly 6/7.
  • a nitrogen flow is used, for flux deposits, ie here in particular Precipitates of formic acid to avoid on the device assembly 6/7.
  • any gaseous flux which produces comparable effects can be used instead of the formic acid exemplified here.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a method for electrically contacting terminal faces of two substrates (6, 7), in particular of a chip (6) and of a carrier substrate (7). Furthermore, the invention relates to a device for performing a second phase of the method according to the invention. The method according to the invention takes place in two successive phases, wherein, in a first phase, the chip (6) is positioned with its terminal faces against terminal faces of the substrate (7) and laser energy (5) is applied to the chip (6) at the rear and, in a subsequent second phase, in a housing (3), a flux medium is applied and at the same time a reflow is performed by means of laser energy (5) being applied to the chip (6) at the rear, and a process of rinsing the housing interior is subsequently performed. The device according to the invention for performing a second phase of the method comprises a carrier table (1) and a housing (3), which together with a top side of the carrier table (1) forms a housing interior, in which the component arrangement is positioned, and also a laser light source (5), which is oriented in such a way that the laser radiation impinges on the first substrate (6) on the rear side.

Description

Verfahren und Vorrichtung zur elektrischen Kontaktierung von Anschlussflächen zweier Substrate  Method and device for electrical contacting of connection surfaces of two substrates
Die vorliegende Erfindung betrifft ein Verfahren zur elektrischen Kontaktierung von Anschlussflächen zweier Substrate, wobei das erste Substrat mit seinen dem zweiten Substrat zugewandten Anschlussflächen direkt mit den Anschlussflächen des zweiten Substrats elektrisch und mechanisch verbunden wird und die Anschlussflächen des ersten Substrats mit einem Lotmittelauftrag versehen sind. Insbesondere können zur Ausbildung eines Chipmoduls das erste Substrat ein Chip und das zweite Substrat ein Trägersubstrat sein, wobei der Chip Face-Down mit seinen Chipanschlussflächen gegen die Substratanschlussflächen kontaktiert wird. The present invention relates to a method for electrically contacting pads of two substrates, wherein the first substrate with its second substrate facing pads is directly and electrically connected mechanically to the pads of the second substrate and the pads of the first substrate are provided with a Lotmittelauftrag. In particular, to form a chip module, the first substrate may be a chip and the second substrate a carrier substrate, wherein the chip is contacted face-down with its chip pads against the substrate pads.
Weiterhin betrifft die Erfindung eine Vorrichtung zur Ausführung einer zweiten Phase des erfindungsgemäßen Verfahrens. Furthermore, the invention relates to an apparatus for carrying out a second phase of the method according to the invention.
Aus dem allgemeinen Stand der Technik sind Verfahren zur Direktmon- tage von Halbleiter-Chips auf Trägersubstraten bekannt. So existieren Verfahren, bei denen der ungehäuste Chip mit seinen dem Trägersubstrat Methods for the direct mounting of semiconductor chips on carrier substrates are known from the general state of the art. Thus, there are methods in which the unhoused chip with its the carrier substrate
BESTÄTIGUNGSKOPIE zugewandten Anschlussflächen und vorher auf die Anschlussflächen des Chips aufgetragenen Lotmitteln (Lotperlen) direkt auf dem Trägersubstrat oder einer Leiterplatte befestigt wird. Dabei wird der Lotmittelauftrag beim Reflow-Löten in einem LÖtofen wiederaufgeschmolzen und verbindet sich mit den Anschlussflächen des Trägersubstrats. Derartige Verfahren gestalten sich sowohl hinsichtlich ihres Ablaufs als auch in Bezug auf die dafür erforderlichen Vorrichtungen als sehr komplex. CONFIRMATION COPY facing pads and previously applied to the pads of the chip solder (solder balls) is mounted directly on the carrier substrate or a printed circuit board. In this case, the solder agent application is reflowed during reflow soldering in a soldering oven and connects to the connection surfaces of the carrier substrate. Such methods are very complex both in terms of their operation and in terms of the devices required for them.
Der vorliegenden Erfindung liegt daher die Aufgabe zu Grunde, einen Verfahrensablauf und eine Vorrichtung zu dessen Durchführung vorzu- schlagen, die den Prozess der elektrischen Kontaktierung von Anschlussflächen zweier Substrate, insbesondere von Halbleiterbauelementen mit Trägersubstraten, technisch vereinfacht und somit wirtschaftlicher gestaltet. It is therefore an object of the present invention to propose a method sequence and a device for carrying it out, which simplifies the process of electrically contacting terminal surfaces of two substrates, in particular semiconductor devices with carrier substrates, and thus makes them more economical.
Das erfindungsgemäße Verfahren erfolgt in zwei aufeinanderfolgenden Phasen, wobei in Phase I der Chip mit seinen Anschlussflächen gegen die Anschlussflächen des Substrats positioniert wird und die Chipanschlussflächen und/oder die Substratanschlussflächen mit einem Lotmittelauftrag versehen sind. In Phase I erfolgt eine rückwärtige Beaufschlagung des Chips mit Laserenergie, derart, dass das Lotmittel zumindest soweit aufgeschmolzen bzw. angeschmolzen wird, um eine Fixierung des Chips auf dem Substrat zu ermöglichen, wobei gleichzeitig eine Nivellierung bzw. eine gleichmäßige Abflachung der auf den Chipanschlussflächen bzw. den Substratanschlussflächen angeordneten Lotmittelaufträge erfolgt, so dass zwischen sämtlichen Chipanschlussflächen und Substrat- anschlussflächen ein Kontakt hergestellt ist. The inventive method is carried out in two successive phases, wherein in phase I, the chip is positioned with its pads against the pads of the substrate and the chip pads and / or the substrate pads are provided with a Lotmittelauftrag. In phase I, the chip is applied with laser energy to the rear, in such a way that the solder is melted or fused at least to the extent to allow a fixation of the chip on the substrate, wherein at the same time a leveling or a uniform flattening of the chips on the chip pads . Plotted on the substrate pads Lotmittelaufträge takes place, so that a contact is made between all chip pads and substrate pads.
Nachfolgend der Phase I erfolgt eine Anordnung der aus dem Chip und dem Substrat gebildeten Bauelementanordnung in einem Gehäuse, das so ausgebildet ist, dass während eines Reflows des Lotmaterialauftrags eine Beaufschlagung der Bauelementanordnung mit einem, insbesondere gasförmig ausgebildeten, Flussmittelmedium erfolgt, das vorzugsweise aus einem Stickstoff- / Ameisensäure-Gemisch besteht. Besonders vorteilhaft ist es dabei, wenn das Gehäuse so ausgebildet ist, dass eine Durchströmung des Gehäuseinnenraums mit dem Medium erfolgt, wobei gleichzeitig zur Beaufschlagung ein Reflow durch eine rückwärtige Beaufschlagung des Chips mit Laserenergie ähnlich wie in der zuvor geschilderten Phase I erfolgt. Subsequent to phase I, an arrangement of the component arrangement formed by the chip and the substrate takes place in a housing which is designed such that, during a reflow of the solder material application, the component arrangement is acted upon by a flux medium, in particular in gaseous form, which preferably consists of a nitrogen - / formic acid mixture consists. Especially It is advantageous if the housing is formed so that a flow through the housing interior is carried out with the medium, at the same time for applying a reflow by a backward loading of the chip with laser energy similar to that in the previously described phase I.
Nachfolgend der Beaufschlagung mit dem Flussmittelmedium, das insbesondere ein Aufbrechen einer möglicherweise in Phase I ausgebildeten Oxidschicht auf dem Lotmittelauftrag ermöglicht, erfolgt ein Spülvorgang des Gehäuseinnenraums, bei dem vorzugsweise ausschließ- lieh ein Schutzgas verwendet wird. Subsequent to the application of the flux medium, which in particular makes it possible to break up an oxide layer possibly formed in phase I on the solder agent application, a flushing process of the interior of the housing takes place, in which exclusively a protective gas is preferably used.
Weitere vorteilhafte Ausgestaltungsmerkmale ergeben sich aus der nachfolgenden Beschreibung und der Zeichnung, die eine bevorzugte Ausführungsform der Erfindung an Hand eines Beispiels erläutert. Further advantageous design features will become apparent from the following description and the drawing, which illustrates a preferred embodiment of the invention with reference to an example.
Es zeigt: Fig. 1 : eine schematische Darstellung der erfindungsgemäßen 1 shows a schematic representation of the invention
Vorrichtung.  Contraption.
In Fig. 1 ist eine Vorrichtung zur Ausführung des Verfahrens während Phase II dargestellt, nachdem zuvor in der hier nicht näher dargestellten Phase I die vorstehend beschriebene Fixierung des Chips auf dem Sub- strat erfolgt ist. Nach Durchführung der Phase I wird die Bauelementanordnung in die in der Fig. 1 dargestellte Position überführt, in der sie sich unterhalb des Gehäuses 3 befindet und anschließend wird das Gehäuse 3 über die Bauelementanordnung abgesenkt, wie in Fig. 1 dargestellt. In Phase II befindet sich die aus dem Chip 6 und dem Substrat 7 gebildete Bauelementanordnung in einem Innenraum eines nach außen hin durch eine Dichtung 2 gegenüber einem Trägertisch 1 abgedichteten Gehäuses 3. Das Gehäuse 3 weist in einer ansonsten zur Umgebung hin im Wesentlichen gasdichten Umwandung eine Zuströmöffnung 8 sowie eine Aus- Strömöffnung 9 auf, die eine Durchströmung bzw. Spülung oder Flutung des Gehäuseinnenraums mit einem gasförmigen Medium ermöglichen. Die im Wesentlichen parallel zu einer Rückseite des Chips 6 angeordnete Gehäusewandung ist durch eine Glasplatte bzw. eine transparente Platte gebildet, die eine rückwärtige Beaufschlagung des Chips mit Laserenergie 5 ermöglicht, wobei die Laserstrahlung entsprechend den Abmessungen der Rückseite des Chips 6 fokussiert ist, um einen unmittelbaren Wärmeeintrag bzw. Energieeintrag in das Substrat 7 zu vermeiden. In Folge der rückwärtigen Beaufschlagung des Chips 6 mit Laserstrahlung 5 erfolgt ein Reflow des zwischen den Chipanschlussflächen und den Substratanschlussflächen angeordneten Lotmittelauftrags 10 während einer Durchströmung des Gehäuseinnenraums mit einem Flussmittelgas, das im vorliegenden Fall aus einem Gemisch aus Stickstoff und Ameisensäure gebildet ist. Zur Ausbildung dieses Gasgemisches kann bei- spielsweise eine Stickstoffströmung außerhalb des Gehäuses 3 über eine Oberfläche eines Ameisensäurebades geleitet werden, so dass die mitgerissenen Dämpfe der Ameisensäure sich mit dem Stickstoff vor der Einströmung in das Gehäuse 3 vermischen. Nach erfolgtem Reflow, also insbesondere nach Beaufschlagung der Rückseite des Chips mit Laser- energie, erfolgt eine Durchströmung bzw. -Spülung des Innenraums des Gehäuses 3 mit einer vorzugsweise reinen Schutzgasströmung, wobei hier vorzugsweise eine Stickstoffströmung zum Einsatz kommt, um Flussmittelablagerungen, also hier insbesondere Ablagerungen von Ameisensäure, auf der Bauelementanordnung 6/7 zu vermeiden. Anstelle der hier beispielhaft erwähnten Ameisensäure kann grundsätzlich auch j edes gasförmige Flussmittel verwendet werden, das vergleichbare Wirkungen erzeugt. FIG. 1 shows a device for carrying out the method during phase II, after the above-described fixation of the chip on the substrate has previously been carried out in the phase I not shown here. After performing the phase I, the component assembly is transferred to the position shown in FIG. 1, in which it is located below the housing 3 and then the housing 3 is lowered over the component assembly, as shown in Fig. 1. In phase II, the component arrangement formed from the chip 6 and the substrate 7 is located in an interior of a housing 3 sealed to the outside by a seal 2 relative to a support table 1. The housing 3 has a wall which is otherwise substantially gas-tight in relation to the surroundings Inflow opening 8 and an outlet Flow opening 9, which allow a flow or flushing or flooding of the housing interior with a gaseous medium. The substantially parallel to a rear side of the chip 6 arranged housing wall is formed by a glass plate or a transparent plate, which allows a backward loading of the chip with laser energy 5, wherein the laser radiation is focused according to the dimensions of the back of the chip 6 to a to avoid direct heat input or energy input into the substrate 7. As a result of the backward loading of the chip 6 with laser radiation 5, a reflow of the solder deposit 10 arranged between the chip connection surfaces and the substrate connection surfaces occurs during a flow through the housing interior with a flux gas, which in the present case is formed from a mixture of nitrogen and formic acid. To form this gas mixture, for example, a nitrogen flow outside the housing 3 can be passed over a surface of a formic acid bath, so that the entrained fumes of formic acid mix with the nitrogen prior to the inflow into the housing 3. After the reflow, ie in particular after loading the rear side of the chip with laser energy, there is a flow or purging of the interior of the housing 3 with a preferably pure protective gas flow, in which case preferably a nitrogen flow is used, for flux deposits, ie here in particular Precipitates of formic acid to avoid on the device assembly 6/7. In principle, any gaseous flux which produces comparable effects can be used instead of the formic acid exemplified here.
Abweichend von der in der Fig. 1 beispielhaft erfolgten Darstellung der Bauelementanordnung als eine Kombination aus einem Chip 6 mit einem Substrat 7 ist es auch möglich, das erfindungsgemäße Verfahren aufNotwithstanding the example in FIG. 1 representation of the component arrangement as a combination of a chip 6 with a substrate 7, it is also possible to the inventive method
Wafer-Ebene durchzuführen, also zwei Wafer miteinander zu verbinden. Darüber hinaus ist es auch möglich, abweichend von der gewählten Darstellung nicht nur einen Chip mit einem Substrat zu verbinden bzw. in einem Reflow-Verfahren zwischen den Substratanschlussflächen und den Chipanschlussflächen angeordnete Lotmaterial aufträge bzw. -depots aufzuschmelzen, sondern auch Stapelanordnungen von Chips mit einer Mehrzahl von übereinander angeordneten Chips mit einem Substrat zu verbinden. Perform wafer level, so to connect two wafers together. In addition, it is also possible, notwithstanding the chosen representation, not only to connect a chip to a substrate or to reflow solder deposits or depots arranged in a reflow process between the substrate pads and the chip pads, but also stack arrangements of chips with one To connect a plurality of stacked chips to a substrate.

Claims

Patentansprüche claims
Verfahren zur elektrischen ontaktierung von Anschlussflächen zweier Substrate (6, 7), wobei das erste Substrat (6) mit seinen dem zweiten Substrat (7) zugewandten Anschlussflächen direkt mit den Anschlussflächen des zweiten Substrats (7) elektrisch und mechanisch verbunden wird und die Anschlussflächen des ersten Substrats (6) mit einem Lotmittelauftrag ( 10) versehen sind, und wobei der Verfahrensablauf in zwei aufeinanderfolgenden Phasen erfolgt, mit einer ersten Phase, in der Method for the electrical ontaktierung of pads of two substrates (6, 7), wherein the first substrate (6) with its the second substrate (7) facing pads electrically and mechanically connected directly to the pads of the second substrate (7) and the pads of the first substrate (6) are provided with a Lotmittelauftrag (10), and wherein the process sequence takes place in two successive phases, with a first phase, in the
- das erste Substrat (6) mit seinen Anschlussflächen gegen die Anschlussflächen des zweiten Substrats (7) positioniert wird und - The first substrate (6) is positioned with its pads against the pads of the second substrate (7) and
- eine rückwärtige Beaufschlagung des ersten Substrats (6) mit Laserenergie (5) derart erfolgt, dass das Lotmittel ( 10) zumindest soweit aufgeschmolzen wird, dass eine mechanische Fixierung des ersten Substrats (6) auf dem zweiten Substrat (7) ermöglicht wird und eine elektrische Kontaktierung der einander zugewandten Anschlussflächen erfolgt - A backward loading of the first substrate (6) with laser energy (5) takes place such that the solder (10) is at least melted so far that a mechanical fixation of the first substrate (6) on the second substrate (7) is made possible and a electrical contacting of the mutually facing connection surfaces takes place
und mit einer zweiten Phase, in der and with a second phase, in the
- in einem Gehäuseinnenraum eine Beaufschlagung der aus den Substraten (6, 7) gebildeten Bauelementeanordnung mit einem Flussmittelmedium erfolgt,  in an interior of the housing, the component arrangement formed by the substrates (6, 7) is exposed to a flux medium,
- gleichzeitig durch eine rückwärtige Beaufschlagung des ersten Substrats (6) mit Laserenergie (5) ein Wiederaufschmelzen des Lotmaterials ( 10) erfolgt und  - At the same time by a backward loading of the first substrate (6) with laser energy (5), a re-melting of the solder material (10) takes place and
- nachfolgend ein Spülvorgang des Gehäuseinnenraums durchgeführt wird.  - Subsequently, a purging of the housing interior is performed.
Verfahren nach Anspruch 1 , Method according to claim 1,
d adurch gek ennz ei chn et ,  characterized ,
dass das Flussmittelmedium einen gasförmigen Zustand aufweist. Verfahren nach Anspruch 2, the flux medium has a gaseous state. Method according to claim 2,
dadurch gekennzeichnet,  characterized,
dass das gasförmige Flussmittelmedium aus einem Stickstoff- Ameisensäure-Gemisch besteht.  the gaseous flux medium consists of a mixture of nitrogen and formic acid.
Verfahren nach Anspruch 3, Method according to claim 3,
dadurch gekennzeichnet,  characterized,
dass zur Ausbildung des gasförmigen Flussmittelmediums außerhalb des Gehäuseinnenraums eine Stickstoffströmung über eine Oberfläche eines Ameisensäurebades geleitet wird, so dass sich die mitgerissenen Dämpfe der Ameisensäure vor der Beaufschlagung der Bauelementeanordnung mit dem Stickstoff vermischen.  in that, to form the gaseous flux medium outside the interior of the housing, a nitrogen flow is conducted over a surface of a formic acid bath, so that the entrained fumes of the formic acid mix with the nitrogen before the component arrangement is acted upon.
Verfahren nach einem der Ansprüche 1 bis 4, Method according to one of claims 1 to 4,
dadurch gekennzeichnet,  characterized,
dass der Spülvorgang mit einer reinen Schutzgasströmung durchgeführt wird.  that the rinsing process is carried out with a pure protective gas flow.
Verfahren nach Anspruch 5, Method according to claim 5,
dadurch gekennzeichnet,  characterized,
dass die reine Schutzgasströmung eine Stickstoffströmung ist.  that the pure protective gas flow is a nitrogen flow.
Vorrichtung zur Ausführung einer zweiten Phase des Verfahrens nach Anspruch 1, mit einem Trägertisch (1) zur Auflage der aus den Substraten (6, 7) gebildeten Bauelementeanordnung, mit einem Gehäuse (3), das die Bauelementeanordnung umschließt und zusammen mit einer Oberseite des Trägertisches (1) einen Gehäuseinnenraum ausbildet, in dem die Bauelementeanordnung positioniert ist, und mit einer Laserlichtquelle (5), die derart ausgerichtet ist, dass die Laserstrahlung rückseitig auf das erste Substrat (6) trifft. Apparatus for carrying out a second phase of the method according to claim 1, comprising a support table (1) for supporting the component arrangement formed from the substrates (6, 7), with a housing (3) enclosing the component arrangement and together with an upper side of the support table (1) forming a housing interior in which the device assembly is positioned, and a laser light source (5) aligned such that the laser radiation hits the first substrate (6) at the back.
8. Vorrichtung nach Anspruch 7, 8. Apparatus according to claim 7,
dadurch gekennzeichnet, dass das Gehäuse (3) mit einer umlaufenden Dichtung (2) gegenüber der Oberseite des Trägertisches (1) versehen ist. characterized, the housing (3) is provided with a circumferential seal (2) opposite the top side of the support table (1).
. Vorrichtung nach Anspruch 7 oder 8, , Device according to claim 7 or 8,
dadurch gekennzeichnet,  characterized,
dass das Gehäuse (3) eine Zuströmöffnung (8) und eine Ausströmöffnung (9) aufweist, die eine Durchströmung des Gehäuseinnenraums mit einem Flussmittelmedium oder einem Spülmedium ermöglichen.  the housing (3) has an inflow opening (8) and an outflow opening (9), which allow a flow through the interior of the housing with a flux medium or a flushing medium.
0. Vorrichtung nach einem der Ansprüche 7 bis 9, 0. Device according to one of claims 7 to 9,
dadurch gekennzeichnet,  characterized,
dass eine im Wesentlichen parallel zu einer Rückseite des ersten Substrats (6) angeordnete Gehäusewandung (4) des Gehäuses (3) als transparente Platte (4) ausgebildet ist, um eine rückwärtige Beaufschlagung des ersten Substrats (6) mit Laserenergie (5) zu ermöglichen.  in that a housing wall (4) of the housing (3) arranged substantially parallel to a rear side of the first substrate (6) is designed as a transparent plate (4) in order to allow rearward application of laser energy (5) to the first substrate (6) ,
EP12714202.4A 2011-02-02 2012-01-30 Method and device for electrically contact-connecting connection areas of two substrates Withdrawn EP2671251A2 (en)

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CN103477424A (en) 2013-12-25
CN103477424B (en) 2016-12-14
WO2012103868A2 (en) 2012-08-09
WO2012103868A8 (en) 2012-11-15
US20140027418A1 (en) 2014-01-30
WO2012103868A3 (en) 2012-09-27
US9649711B2 (en) 2017-05-16
JP2014506012A (en) 2014-03-06

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