EP2656185A4 - Panneau tactile et procédé de fabrication d'élément d'électrode - Google Patents

Panneau tactile et procédé de fabrication d'élément d'électrode

Info

Publication number
EP2656185A4
EP2656185A4 EP11850202.0A EP11850202A EP2656185A4 EP 2656185 A4 EP2656185 A4 EP 2656185A4 EP 11850202 A EP11850202 A EP 11850202A EP 2656185 A4 EP2656185 A4 EP 2656185A4
Authority
EP
European Patent Office
Prior art keywords
touch panel
electrode member
manufacturing electrode
manufacturing
touch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP11850202.0A
Other languages
German (de)
English (en)
Other versions
EP2656185A2 (fr
Inventor
Young Sun You
Young Jin Lee
Kyoung Hoon Chai
Sun Young Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP2656185A2 publication Critical patent/EP2656185A2/fr
Publication of EP2656185A4 publication Critical patent/EP2656185A4/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Position Input By Displaying (AREA)
EP11850202.0A 2010-12-23 2011-12-20 Panneau tactile et procédé de fabrication d'élément d'électrode Ceased EP2656185A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100134016A KR20120072186A (ko) 2010-12-23 2010-12-23 터치 패널 및 전극 부재 제조 방법
PCT/KR2011/009860 WO2012087003A2 (fr) 2010-12-23 2011-12-20 Panneau tactile et procédé de fabrication d'élément d'électrode

Publications (2)

Publication Number Publication Date
EP2656185A2 EP2656185A2 (fr) 2013-10-30
EP2656185A4 true EP2656185A4 (fr) 2016-04-27

Family

ID=46314613

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11850202.0A Ceased EP2656185A4 (fr) 2010-12-23 2011-12-20 Panneau tactile et procédé de fabrication d'élément d'électrode

Country Status (5)

Country Link
US (2) US9955576B2 (fr)
EP (1) EP2656185A4 (fr)
KR (1) KR20120072186A (fr)
TW (1) TW201232134A (fr)
WO (1) WO2012087003A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101852014B1 (ko) * 2012-07-11 2018-04-26 동우 화인켐 주식회사 투명 도전성 필름의 제조방법 및 이를 이용하여 제조된 터치 패널
KR20140070005A (ko) * 2012-11-30 2014-06-10 코닝정밀소재 주식회사 투명 도전성 기재 및 이를 포함하는 터치 패널
JP6030453B2 (ja) * 2013-01-10 2016-11-24 株式会社ジャパンディスプレイ タッチ検出装置、これを備えるタッチ検出機能付き表示装置及び電子機器
KR102183097B1 (ko) * 2014-03-10 2020-11-25 엘지전자 주식회사 전도성 필름 및 이를 포함하는 터치 패널
CN105320333B (zh) * 2014-07-29 2018-10-23 南京瀚宇彩欣科技有限责任公司 有机电激发光抗扰触控面板
CN106502441B (zh) * 2015-09-07 2020-02-07 宸盛光电有限公司 触控面板及其制作方法
CN113164263A (zh) * 2019-05-13 2021-07-23 赛德迪康医疗科技有限公司 改进的皮肤替代物的粘附性、可拉伸性和皮肤替代物的顺应性
CN110441930B (zh) * 2019-06-11 2021-09-10 惠科股份有限公司 一种显示面板和显示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100066683A1 (en) * 2008-09-17 2010-03-18 Shih-Chang Chang Method for Transferring Thin Film to Substrate

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CA2391745C (fr) * 2002-06-25 2012-08-14 Albert Mark David Ecran tactile a verre stratifie ultra-mince
KR100869109B1 (ko) * 2007-10-04 2008-11-17 삼성에스디아이 주식회사 얼라인 마크부를 가지는 플라즈마 디스플레이 패널과, 이의제조방법
TWM344544U (en) 2007-12-25 2008-11-11 Cando Corp Sensory structure of touch panel
KR100994608B1 (ko) * 2008-04-18 2010-11-15 (주)멜파스 전극 일체형 윈도우를 포함하는 접촉 감지 패널, 및 그 제조 방법
US8629841B2 (en) * 2008-04-30 2014-01-14 Apple Inc. Multi-touch sensor patterns and stack-ups
KR100894710B1 (ko) * 2008-06-27 2009-04-24 (주) 월드비젼 윈도우 일체형 터치스크린 및 이의 제조방법
US20100108409A1 (en) 2008-11-06 2010-05-06 Jun Tanaka Capacitive coupling type touch panel
KR101126473B1 (ko) * 2008-12-26 2012-03-29 니폰샤신인사츠가부시키가이샤 전자기기 표시창의 터치입력기능을 갖춘 보호패널과 그 제조방법
KR101066111B1 (ko) * 2009-01-09 2011-09-20 전자부품연구원 정전용량방식 터치패널 및 그 제조방법
KR101025023B1 (ko) * 2009-02-23 2011-03-25 (주)이엔에이치 정전용량 방식의 터치스크린 패널
KR100921709B1 (ko) * 2009-02-23 2009-10-15 (주)이엔에이치 정전용량 방식의 터치스크린 패널
KR100942763B1 (ko) * 2009-03-30 2010-02-18 (주) 월드비젼 윈도우 패널 일체형 정전용량방식 터치 센서 및 제조 방법
JP5407599B2 (ja) * 2009-07-01 2014-02-05 パナソニック株式会社 タッチパネル
TWI511019B (zh) * 2009-11-17 2015-12-01 Wistron Corp 全平面之電阻式觸控面板
TW201120712A (en) * 2009-12-09 2011-06-16 J Touch Corp Capacitive touch device structure.
TW201142682A (en) * 2010-02-12 2011-12-01 Wintek Corp Surface capacitive touch panel and its fabrication method
KR101067164B1 (ko) * 2010-05-03 2011-09-22 삼성전기주식회사 터치스크린 일체형 표시장치
KR101699530B1 (ko) * 2010-07-27 2017-01-25 삼성디스플레이 주식회사 터치스크린패널 및 이를 구비한 영상표시장치
KR101224419B1 (ko) * 2010-10-26 2013-01-22 (주)삼원에스티 터치패널센서
KR101739797B1 (ko) * 2010-10-27 2017-05-26 삼성디스플레이 주식회사 터치 스크린 패널
KR20120065687A (ko) * 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 터치 스크린 패널
CN103250121B (zh) * 2010-12-21 2014-09-17 日本写真印刷株式会社 覆盖玻璃一体型传感器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100066683A1 (en) * 2008-09-17 2010-03-18 Shih-Chang Chang Method for Transferring Thin Film to Substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
R A HEINZ ET AL: "DOUBLE -SIDED PHOTOLITHOGRAPHY", PROC. SPIE 0135, DEVELOPMENTS IN SEMICONDUCTOR MICROLITHOGRAPHY III, 147 (SEPTEMBER 6, 1978), 6 September 1978 (1978-09-06), pages 147 - 152, XP055259346, Retrieved from the Internet <URL:http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=1227142> [retrieved on 20160317], DOI: http://dx.doi.org/10.1117/12.956124 *

Also Published As

Publication number Publication date
KR20120072186A (ko) 2012-07-03
US9955576B2 (en) 2018-04-24
WO2012087003A2 (fr) 2012-06-28
TW201232134A (en) 2012-08-01
US20130299220A1 (en) 2013-11-14
US20180228025A1 (en) 2018-08-09
EP2656185A2 (fr) 2013-10-30
WO2012087003A3 (fr) 2012-10-04
US10440821B2 (en) 2019-10-08

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