Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
  • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
  • B81C1/00261—Processes for packaging MEMS devices
  • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/001—Joining in special atmospheres
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2207/00—Microstructural systems or auxiliary parts thereof
  • B81B2207/09—Packages
  • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
  • B81B2207/094—Feed-through, via
  • B81B2207/095—Feed-through, via through the lid
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C2203/00—Forming microstructural systems
  • B81C2203/01—Packaging MEMS
  • B81C2203/0109—Bonding an individual cap on the substrate

Definitions

• Circuit comprising a component covered with a cover, a method for producing such a circuit and a device for carrying out said process
• the present invention relates to an electronic circuit consisting of a substrate on at least one side of which is mounted at least one component to which is attached first connection means, at least one cover resting on said substrate to cover said component.
• the invention also relates to a method for encapsulating or enclosing a component intended for such a circuit and a device for implementing this method.
• the invention applies in particular to the microsystem requiring components such as sensors requiring protection vis-à-vis the outside or at least some isolation vis-à-vis the environment.
• WO 2010/012966 discloses a method which encapsulates components for such circuits. Although the method described gives complete satisfaction, it does not meet all the configurations that one wishes to achieve.
• the aim of the invention is to provide measures to provide flexibility for establishing configurations in the circuit implementation including components requiring encapsulation.
• the invention therefore provides an improvement to the process already described in the aforementioned patent document.
• the invention allows connections of the component disposed under the hood with the outside world through the hood. This often brings a great simplification in the establishment of circuit connections.
• FIG. 1 explains the manufacture of a microcircuit according to the invention
• FIG. 2 explains the manufacture of a microcircuit according to a variant of the invention
• Figure 3 is a diagram of a device for implementing said method
• Figures 4 and 5 explain the manufacture of a microcircuit according to another embodiment of the invention.
• Figure 6 shows a circuit having on both sides of the substrate, a cover.
• the reference 1 indicates a microcircuit comprising an electronic component 3 such as a temperature probe or an electret microphone disposed on a reception substrate 10, which needs to be protected from external aggressions or to be isolated so that to be placed in a controlled environment.
• an electronic component 3 such as a temperature probe or an electret microphone disposed on a reception substrate 10, which needs to be protected from external aggressions or to be isolated so that to be placed in a controlled environment.
• the reference 20 shows a so-called substrate substrate "mold" which contains the cover 22.
• the cover has a portion hollow 23 to cover the microcircuit 1 and a corolla 24 disposed on the periphery of this portion 23.
• a layer 25 called controlled adhesion layer is interposed between the cover 22 and the substrate 20, as shown in A and B.
• a weld seam 40 is placed on the corolla 24 surrounding the portion 23 for attachment to the substrate 10.
• passage connections formed, in particular by means of metallization rivets 50 and 51, or VIA which pass through the cover 22. These rivets will make contact with the connections 15 after the weld, see Figure 1 in C and D.
• Figure 1 shows at A the substrates 10 and 20 separated.
• connection pad 60 (bump) or a connecting wire 61.
• the element 3 comprises first connection means 15 which need to be connected to second connection means 70 forming part of the remainder of the circuit 1.
• first connection means 15 which need to be connected to second connection means 70 forming part of the remainder of the circuit 1.
• second connection means 70 forming part of the remainder of the circuit 1.
• Bridges of links 80 and 81 disposed on the top of the corolla 24 of the cover 22 connect respectively the rivets 50 and 50 'and the rivets 51 and 5. Electrical connections between the connections 15 and 70 are ensured.
• the two substrates and the weld beads 40 are heated and pressed as one, as shown in B in Figure 2, to provide mechanical contact between the two substrates.
• the "mold" substrate is removed, which is permitted by the layer 24 which is detached from the cover 22.
• the finished circuit 1 is shown provided with the cover 22 with the connections passing through it.
• FIG. 3 shows a device for implementing the method. Again, reference is made to the aforementioned patent document WO 2010/012966.
• FIG. 3 shows the two substrates 10 and 20 attached to motorized plates 100 and 101 allowing displacements along three orthogonal axes.
• the substrates 10 and 20 are held by holding means 110 and 111. All this is placed in a chamber 150 in which it is possible to evacuate by means of a vacuum pump 155. Thus, the vacuum will prevail at the inside the hood 22.
• hoods filled with a given gas such as nitrogen, etc.
• the vacuum pump is then replaced by means, such as bottles, for supplying the enclosure 150 with the required gas. It is therefore possible to obtain a well-defined atmosphere, gas, vacuum inside the hood 22.
• hoods described above comprising a corolla, are considered to be hoods of the first type. But they can have different shapes from the one shown above.
• Figures 4 and 5 show the implementation of the invention relating to other kinds of cover.
• FIG. 4 explains the first steps of making a circuit comprising components covered by a cover 22 formed of a plate 22A resting on a wall forming a cylinder 22B around the component 3.
• This cover is considered to be of the second type .
• A in this figure the cover is fixed on the mold substrate 20 in the same manner already described.
• B the substrates are put face to face to be pressed against each other.
• C the welding is performed using, at least partially, the wall 22B as a weld seam.
• FIG. 5 shows in D the separation of the two substrates 10 and 20, the cover separates from the substrate 20 thanks to the properties of the layer 25 already described.
• E the circuit thus produced is shown.
• connection passages 50 and 50 'constituted by VIAs are connected externally by a connecting bridge 80 and the passage links 51 and 5 by another bridge 81.
• This embodiment provides the advantage that the occupied area is decreased since there is no more corolla. It should also be noted that the invention applies to the case where the components to which a cap has been added can be located on both sides of the substrate as shown in FIG.
• the substrate 10 has on one side components 3 and 3 'to which are respectively joined hoods 22 and 22'. On the other side of the substrate 10 a component 3 "is also fixed, it is covered with a hood 22"
• the cover can be insulating or conductive. It is also possible to provide a layer of insulation on the edge to be fixed of a conductive cover so as to isolate it from the rest of the circuit.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Casings For Electric Apparatus (AREA)
• Micromachines (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=44246380

Family Applications (1)

Country Status (5)

Family Cites Families (13)

• 2010
  • 2010-12-08 FR FR1060259A patent/FR2968647A1/fr not_active Withdrawn
• 2011
  • 2011-12-08 JP JP2013542594A patent/JP2014503371A/ja active Pending
  • 2011-12-08 EP EP11811048.5A patent/EP2649006A1/de not_active Withdrawn
  • 2011-12-08 US US13/992,510 patent/US20140130966A1/en not_active Abandoned
  • 2011-12-08 WO PCT/FR2011/052900 patent/WO2012076818A1/fr active Application Filing

Non-Patent Citations (1)

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