EP2641268A4 - Polishing pad comprising transmissive region - Google Patents
Polishing pad comprising transmissive region Download PDFInfo
- Publication number
- EP2641268A4 EP2641268A4 EP11841143.8A EP11841143A EP2641268A4 EP 2641268 A4 EP2641268 A4 EP 2641268A4 EP 11841143 A EP11841143 A EP 11841143A EP 2641268 A4 EP2641268 A4 EP 2641268A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing pad
- transmissive region
- transmissive
- region
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41501510P | 2010-11-18 | 2010-11-18 | |
PCT/US2011/061312 WO2012068428A2 (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2641268A2 EP2641268A2 (en) | 2013-09-25 |
EP2641268A4 true EP2641268A4 (en) | 2017-01-25 |
Family
ID=46084662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11841143.8A Withdrawn EP2641268A4 (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130237136A1 (en) |
EP (1) | EP2641268A4 (en) |
JP (1) | JP5918254B2 (en) |
KR (1) | KR101602544B1 (en) |
CN (1) | CN103222034B (en) |
MY (1) | MY166716A (en) |
SG (1) | SG190249A1 (en) |
WO (1) | WO2012068428A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130205679A1 (en) * | 2012-02-14 | 2013-08-15 | Innopad, Inc. | Method of manufacturing a chemical mechanical planarization pad |
US20140370788A1 (en) * | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
CN106853610B (en) * | 2015-12-08 | 2019-11-01 | 中芯国际集成电路制造(北京)有限公司 | Polishing pad and its monitoring method and monitoring system |
KR101829542B1 (en) * | 2016-07-27 | 2018-02-23 | 신우유니온(주) | Manufacturing method of buffer for nails |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
US11260495B2 (en) * | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
JP7317440B2 (en) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | dressing tool |
JP7220130B2 (en) * | 2019-07-11 | 2023-02-09 | 株式会社クラレ | Polishing pad and polishing pad manufacturing method |
KR102593117B1 (en) * | 2021-07-02 | 2023-10-24 | 에스케이엔펄스 주식회사 | Polishing pad and preparing method of semiconductor device using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030129931A1 (en) * | 2001-10-26 | 2003-07-10 | Jsr Corporation | Window member for chemical mechanical polishing and polishing pad |
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5888120A (en) * | 1997-09-29 | 1999-03-30 | Lsi Logic Corporation | Method and apparatus for chemical mechanical polishing |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
US6280289B1 (en) * | 1998-11-02 | 2001-08-28 | Applied Materials, Inc. | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6716085B2 (en) * | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
US6247998B1 (en) * | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
US6071177A (en) * | 1999-03-30 | 2000-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for determining end point in a polishing process |
US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
WO2001023141A1 (en) * | 1999-09-29 | 2001-04-05 | Rodel Holdings, Inc. | Polishing pad |
JP2001110762A (en) * | 1999-10-04 | 2001-04-20 | Asahi Kasei Corp | Polishing pad |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
JP4131632B2 (en) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | Polishing apparatus and polishing pad |
KR100541545B1 (en) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | Polishing table of a chemical mechanical polishing apparatus |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US7261625B2 (en) * | 2005-02-07 | 2007-08-28 | Inoac Corporation | Polishing pad |
US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
JP5534672B2 (en) * | 2005-08-22 | 2014-07-02 | アプライド マテリアルズ インコーポレイテッド | Apparatus and method for spectrum-based monitoring of chemical mechanical polishing |
US7210980B2 (en) * | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
US20070197147A1 (en) * | 2006-02-15 | 2007-08-23 | Applied Materials, Inc. | Polishing system with spiral-grooved subpad |
JP5110677B2 (en) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | Polishing pad |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
JP2008226911A (en) * | 2007-03-08 | 2008-09-25 | Jsr Corp | Chemical and mechanical polishing pad, lamination pad for chemical mechanical polishing, and chemical and mechanical polishing method |
US8562389B2 (en) * | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
WO2011008499A2 (en) * | 2009-06-30 | 2011-01-20 | Applied Materials, Inc. | Leak proof pad for cmp endpoint detection |
US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
US8439994B2 (en) * | 2010-09-30 | 2013-05-14 | Nexplanar Corporation | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection |
-
2011
- 2011-11-18 SG SG2013036363A patent/SG190249A1/en unknown
- 2011-11-18 JP JP2013540037A patent/JP5918254B2/en not_active Expired - Fee Related
- 2011-11-18 WO PCT/US2011/061312 patent/WO2012068428A2/en active Application Filing
- 2011-11-18 US US13/988,144 patent/US20130237136A1/en not_active Abandoned
- 2011-11-18 CN CN201180055788.0A patent/CN103222034B/en not_active Expired - Fee Related
- 2011-11-18 EP EP11841143.8A patent/EP2641268A4/en not_active Withdrawn
- 2011-11-18 KR KR1020137015580A patent/KR101602544B1/en active IP Right Grant
- 2011-11-18 MY MYPI2013001771A patent/MY166716A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US20030129931A1 (en) * | 2001-10-26 | 2003-07-10 | Jsr Corporation | Window member for chemical mechanical polishing and polishing pad |
Also Published As
Publication number | Publication date |
---|---|
JP5918254B2 (en) | 2016-05-18 |
KR20130116892A (en) | 2013-10-24 |
WO2012068428A2 (en) | 2012-05-24 |
EP2641268A2 (en) | 2013-09-25 |
JP2013542863A (en) | 2013-11-28 |
US20130237136A1 (en) | 2013-09-12 |
CN103222034A (en) | 2013-07-24 |
WO2012068428A3 (en) | 2012-08-16 |
KR101602544B1 (en) | 2016-03-10 |
SG190249A1 (en) | 2013-06-28 |
CN103222034B (en) | 2016-03-09 |
MY166716A (en) | 2018-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130515 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20161222 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 37/20 20120101AFI20161216BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20170601 |