EP2641268A4 - Polishing pad comprising transmissive region - Google Patents
Polishing pad comprising transmissive region Download PDFInfo
- Publication number
- EP2641268A4 EP2641268A4 EP11841143.8A EP11841143A EP2641268A4 EP 2641268 A4 EP2641268 A4 EP 2641268A4 EP 11841143 A EP11841143 A EP 11841143A EP 2641268 A4 EP2641268 A4 EP 2641268A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing pad
- transmissive region
- transmissive
- region
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41501510P | 2010-11-18 | 2010-11-18 | |
PCT/US2011/061312 WO2012068428A2 (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2641268A2 EP2641268A2 (en) | 2013-09-25 |
EP2641268A4 true EP2641268A4 (en) | 2017-01-25 |
Family
ID=46084662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11841143.8A Withdrawn EP2641268A4 (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130237136A1 (en) |
EP (1) | EP2641268A4 (en) |
JP (1) | JP5918254B2 (en) |
KR (1) | KR101602544B1 (en) |
CN (1) | CN103222034B (en) |
MY (1) | MY166716A (en) |
SG (1) | SG190249A1 (en) |
WO (1) | WO2012068428A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013123105A2 (en) * | 2012-02-14 | 2013-08-22 | Innopad, Inc. | Method of manufacturing a chemical mechanical planarization pad |
US20140370788A1 (en) * | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
CN106853610B (en) | 2015-12-08 | 2019-11-01 | 中芯国际集成电路制造(北京)有限公司 | Polishing pad and its monitoring method and monitoring system |
KR101829542B1 (en) * | 2016-07-27 | 2018-02-23 | 신우유니온(주) | Manufacturing method of buffer for nails |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11260495B2 (en) | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
JP7317440B2 (en) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | dressing tool |
JP7220130B2 (en) * | 2019-07-11 | 2023-02-09 | 株式会社クラレ | Polishing pad and polishing pad manufacturing method |
KR102593117B1 (en) * | 2021-07-02 | 2023-10-24 | 에스케이엔펄스 주식회사 | Polishing pad and preparing method of semiconductor device using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030129931A1 (en) * | 2001-10-26 | 2003-07-10 | Jsr Corporation | Window member for chemical mechanical polishing and polishing pad |
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5888120A (en) * | 1997-09-29 | 1999-03-30 | Lsi Logic Corporation | Method and apparatus for chemical mechanical polishing |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
US6280289B1 (en) * | 1998-11-02 | 2001-08-28 | Applied Materials, Inc. | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
US6247998B1 (en) * | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6716085B2 (en) * | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
US6071177A (en) * | 1999-03-30 | 2000-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for determining end point in a polishing process |
US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
WO2001023141A1 (en) * | 1999-09-29 | 2001-04-05 | Rodel Holdings, Inc. | Polishing pad |
JP2001110762A (en) * | 1999-10-04 | 2001-04-20 | Asahi Kasei Corp | Polishing pad |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
JP4131632B2 (en) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | Polishing apparatus and polishing pad |
KR100541545B1 (en) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | Polishing table of a chemical mechanical polishing apparatus |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US7261625B2 (en) * | 2005-02-07 | 2007-08-28 | Inoac Corporation | Polishing pad |
US7306507B2 (en) * | 2005-08-22 | 2007-12-11 | Applied Materials, Inc. | Polishing pad assembly with glass or crystalline window |
JP5534672B2 (en) * | 2005-08-22 | 2014-07-02 | アプライド マテリアルズ インコーポレイテッド | Apparatus and method for spectrum-based monitoring of chemical mechanical polishing |
US7210980B2 (en) * | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
US20070197145A1 (en) * | 2006-02-15 | 2007-08-23 | Applied Materials, Inc. | Polishing article with window stripe |
JP5110677B2 (en) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | Polishing pad |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
JP2008226911A (en) * | 2007-03-08 | 2008-09-25 | Jsr Corp | Chemical and mechanical polishing pad, lamination pad for chemical mechanical polishing, and chemical and mechanical polishing method |
JP5363470B2 (en) * | 2007-06-08 | 2013-12-11 | アプライド マテリアルズ インコーポレイテッド | Thin polishing pad with window and molding process |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
WO2011008499A2 (en) * | 2009-06-30 | 2011-01-20 | Applied Materials, Inc. | Leak proof pad for cmp endpoint detection |
US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
US8439994B2 (en) * | 2010-09-30 | 2013-05-14 | Nexplanar Corporation | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection |
-
2011
- 2011-11-18 EP EP11841143.8A patent/EP2641268A4/en not_active Withdrawn
- 2011-11-18 JP JP2013540037A patent/JP5918254B2/en not_active Expired - Fee Related
- 2011-11-18 MY MYPI2013001771A patent/MY166716A/en unknown
- 2011-11-18 KR KR1020137015580A patent/KR101602544B1/en active IP Right Grant
- 2011-11-18 CN CN201180055788.0A patent/CN103222034B/en not_active Expired - Fee Related
- 2011-11-18 SG SG2013036363A patent/SG190249A1/en unknown
- 2011-11-18 US US13/988,144 patent/US20130237136A1/en not_active Abandoned
- 2011-11-18 WO PCT/US2011/061312 patent/WO2012068428A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US20030129931A1 (en) * | 2001-10-26 | 2003-07-10 | Jsr Corporation | Window member for chemical mechanical polishing and polishing pad |
Also Published As
Publication number | Publication date |
---|---|
JP2013542863A (en) | 2013-11-28 |
KR20130116892A (en) | 2013-10-24 |
SG190249A1 (en) | 2013-06-28 |
KR101602544B1 (en) | 2016-03-10 |
WO2012068428A3 (en) | 2012-08-16 |
MY166716A (en) | 2018-07-18 |
JP5918254B2 (en) | 2016-05-18 |
WO2012068428A2 (en) | 2012-05-24 |
CN103222034A (en) | 2013-07-24 |
CN103222034B (en) | 2016-03-09 |
EP2641268A2 (en) | 2013-09-25 |
US20130237136A1 (en) | 2013-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130515 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20161222 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 37/20 20120101AFI20161216BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20170601 |