EP2622289A1 - Pompe à chaleur - Google Patents

Pompe à chaleur

Info

Publication number
EP2622289A1
EP2622289A1 EP11764460.9A EP11764460A EP2622289A1 EP 2622289 A1 EP2622289 A1 EP 2622289A1 EP 11764460 A EP11764460 A EP 11764460A EP 2622289 A1 EP2622289 A1 EP 2622289A1
Authority
EP
European Patent Office
Prior art keywords
heat
pressure
carrier
heat carrier
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11764460.9A
Other languages
German (de)
English (en)
Inventor
Stefan Bertsch
Erik Vincent Granwehr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP2622289A1 publication Critical patent/EP2622289A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/39—Dispositions with two or more expansion means arranged in series, i.e. multi-stage expansion, on a refrigerant line leading to the same evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F25B1/10—Compression machines, plants or systems with non-reversible cycle with multi-stage compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/07—Details of compressors or related parts
    • F25B2400/075—Details of compressors or related parts with parallel compressors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/13—Economisers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/23—Separators

Definitions

  • the invention relates to a heat pump according to the preamble of claim 1 and a method for its operation according to the preamble of claim 6.
  • a heat transfer medium such as e.g. Propane is first compressed in a cyclic process, then releases heat to the outside via a first heat exchanger, then it is expanded and finally absorbs heat from outside in a second heat exchanger before it is again compressed.
  • a heat transfer medium such as e.g. Propane
  • phase transition instead, which is why in the first heat exchanger also speaks of a condenser and the second heat exchanger of an evaporator.
  • the compaction or the supply of the work takes place e.g. by means of a
  • Compressor while the relaxation can be accomplished via an expansion valve or an expander.
  • heat pumps are also known in which the release of heat to the outside takes place at two temperature levels (JP 60-226668, JP 60-126546).
  • the heat transfer medium is in such facilities after passing through a
  • Heat pump affects, or comes from the process itself and is by means of heat exchangers from streams at very high or low temperature branched off, as is also known from the prior art described above. An efficiency increase is not aimed at - on the contrary, the less expensive construction method is bought by a consumption of usable energy.
  • An object of the present invention is to provide a heat pump and a method of operating such which allow improved performance and / or efficiency over known heat pumps and known methods and / or reduce exergy losses. Further advantages and objects of the present invention will become apparent from the
  • heat pump (preferably closed) circuit in which a heat transfer medium is guided, which heat pump has at least the following components:
  • compressor (or in general: one or more compressors) for
  • a first heat exchanger (preferably a condenser) located downstream of the compressor
  • a second heat exchanger (preferably an evaporator), which is arranged downstream of the second expansion stage and upstream of the compressor.
  • the heat pump has a device (hereinafter also referred to as "economizer"), which the heat transfer medium or a part thereof (preferably the "second part”, see below) heat from outside the
  • the device is for this purpose associated with a source of waste heat or is it in the heat that is supplied from outside the circuit to waste heat.
  • the device is downstream of the first heat exchanger and upstream of the second
  • Heat exchanger arranged.
  • the preferred sequence of the device components in the direction of flow of the heat carrier is therefore: 1) compressor, 2) first heat exchanger,
  • the economizer is arranged between the first and the second heat exchanger or the condenser and the evaporator and is designed such that it can supply heat to the heat carrier from outside the circuit. To this end, it advantageously has one or more heat exchangers associated with one or more sources of heat. By using waste heat from a process outside the cycle, the efficiency of the heat pump can be significantly increased.
  • Temperature range vary.
  • the advantage lies in the fact that the waste heat can be supplied to the heat carrier at the temperature level or at that pressure level at which it is obtained.
  • a method for operating a heat pump in which a heat transfer medium is conducted in a (preferably closed) circuit, has at least the following steps (preferably in the predetermined sequence):
  • the heat carrier is compressed until a first pressure is reached, wherein individual parts of the heat carrier, e.g. can be compressed in a multi-stage compressor or separately from each other in several separate compressors;
  • the heat transfer medium is then removed from outside the circuit heat; this can e.g. take place in a capacitor, i. there can be a phase transition;
  • the first part of the heat carrier is then supplied at the third pressure heat from outside the circuit; this can e.g. take place in an evaporator, i. there can be a phase transition;
  • a second part of the heat carrier is expanded from the first pressure to a second (lower) pressure, the second pressure being higher than the third pressure; the second part can be relaxed either separately from the first part or together with the first part to the second pressure;
  • the second part of the heat carrier at the second pressure heat is supplied from outside the circuit, wherein the heat is waste heat from a process outside the circuit and either only the second part heat is supplied or - if the first and the second Part not yet been separated - the second and the first part together
  • Method preferably constant or substantially constant, while the heat transfer medium heat is supplied or withdrawn, in particular at step f).
  • the heat supply can be optimized by regulation or control technology.
  • the heat transfer medium or a part thereof ("second part") in the economizer from outside the circuit heat to a medium
  • Temperature level and / or a medium pressure level supplied i. at a temperature level and / or pressure level which is between that in the first heat exchanger and that in the second heat exchanger.
  • This heat can be incurred, for example, in the form of waste heat and out
  • the material cycle of the heat carrier is to be understood with advantage as “circulating.”
  • This preferably comprises at least the material flow (also referred to as “main flow”) passing through the first heat exchanger and the second heat exchanger.
  • it advantageously comprises at least one
  • the term "cycle” particularly preferably encompasses all material flows of the heat carrier which are circulated and are led together as a stream at least over part of the way mentioned material flows are circulated. If in this document of the supply of heat from outside the cycle is mentioned, it should preferably be understood that heat is supplied from outside the material cycle of the heat carrier. In other words, it is preferable to understand that not only an exchange of heat between partial flows of the heat carrier takes place, but at least one further source of heat is present. This heat source may be, for example, the engine that drives the compressor. However, in this document, among the sources of heat, particular preference is given to those sources which are not part of the heat pump. The supply of heat advantageously takes place downstream of the first
  • Heat exchanger and upstream of the second heat exchanger and / or upstream of a compressor instead.
  • the heat transfer medium is advantageously hydrocarbons such as propane (R-290), or propylene, or inorganic substances such as ammonia, carbon dioxide, or water.
  • hydrocarbons such as propane (R-290), or propylene
  • inorganic substances such as ammonia, carbon dioxide, or water.
  • R-134a Tetrafluoroethane
  • Heat pump is preferably one which operates (in terms of the heat transfer medium) in the subcritical range and / or not to such a heat pump, which operates in the transcritical range.
  • the first and / or second expansion stage is preferably an expansion valve or a condensate separator, in particular a thermodynamic condensate separator or a Sch wimmer valve.
  • the use of expanders may be advantageous in which the pressure loss is used to generate energy.
  • at least one expansion stage, in particular the second expansion stage is variable and / or controllable (eg a variable expansion valve)
  • the second expansion stage can also be a
  • both expansion stages are variable.
  • variable is in this context preferably the possibility of control or stepwise control
  • the economizer preferably communicates with a source of heat, the source preferably being a source of waste heat and / or the source of heat in a temperature range between minus 20 ° C and plus 50 ° C, preferably between 0 ° C and plus 40 ° C and in particular between 10 ° C and 25 ° C, wherein the temperature or the
  • Temperature level is preferably substantially constant (difference between maximum and minimum preferably less than 15, 10 or 5 degrees Celsius). It may also be provided two, three, four or more of such sources, it being preferred if at least two sources are present, the heat in different temperature ranges provide, wherein the average temperature of the different temperature ranges preferably by at least 2, 5 or 10 degrees Celsius is different.
  • Heat carrier at the second pressure is supplied to waste heat from a
  • Process outside the cycle (for example, from a solar system or a building ventilation) acts and / or if:
  • step f) The supply of heat in step f) (ie the second part at the second pressure) by contact of the heat carrier takes place with a surface which (especially before contact with the heat carrier) has a temperature between -20 ° C and plus 50 ° C, preferably between 0 ° C and plus 40 ° C and in particular between plus 10 ° C and plus 25 ° C and - as mentioned above - is preferably substantially constant.
  • step d) the supply of heat to the first part of the heat carrier according to step d) (i.e., the third pressure) takes place by contact of the first part of the heat carrier with a first surface
  • step f) The supply of heat to the second part of the heat carrier according to step f) (i.e., the second pressure) by contact of the second part of the heat carrier takes place with a second surface, wherein
  • the second surface has a higher temperature than the first surface, whereby preferably a pressure difference is produced.
  • the pressure of the heat carrier at the first surface is preferably at least 0.1 bar or at least 0.4 bar and more preferably at least 0.8 bar lower than at the second surface.
  • Surface have a temperature which is higher by at least 5 ° C, preferably at least 10 ° C and more preferably at least 15 ° C than the temperature of the first surface.
  • the surfaces mentioned are preferably surfaces of heat exchangers, the first surface preferably being part of the first
  • the economizer one or more
  • the economizer is a container for receiving the heat carrier, which has one (or more) heat exchanger, wherein the heat exchanger connected to a source (or in the case of several heat exchangers preferably with multiple sources) of heat outside the circuit is and is in contact with the heat transfer medium inside the container.
  • the economizer can also act as a so-called collector (“receiver”) here.
  • module Device parts of the individual stages collectively referred to as "module”.
  • the heat pump has a module which is arranged downstream of the first heat exchanger and has at least the following components:
  • Branch point is arranged
  • the module is arranged upstream of the compressor. Furthermore, it is advantageous if the module (at least with respect to the partial flow, which passes through the second heat exchanger, or with respect to the first part of
  • Heat carrier upstream of the second expansion stage is arranged.
  • the preferred order of the device components in the direction of flow of the heat carrier is thus: 1) compressor, 2) first heat exchanger, 3) modules (including expansion stages and economizers), 4) second heat exchanger.
  • the separation of the heat carrier, i. the entire material flow, in a first part and a second part can thus take place at various points.
  • the branch point is part of
  • Economizers or (with respect to the second branch line) arranged downstream of the device This can e.g. then be the case when the economizer is designed as a container and the heat carrier is supplied to this total, but is discharged separately into a first and a second part.
  • branch point (with respect to the second branch line) is arranged upstream of the economizer. This can e.g. be the case when the second part of the heat carrier first passes through the economizer along with the first part and is then separated before it is again passed back into the economizer, there to exchange heat with the entire substance Ström the heat transfer medium.
  • the branch point may therefore be provided eg in the economizer or upstream or downstream thereof.
  • At least the second branch line, which transports the second part of the heat carrier, is preferably arranged downstream of the first expansion stage.
  • both the first and the second branch line are arranged downstream of the first expansion stage and / or if the supply line
  • Expansion stage is arranged in the supply line. In this way, both the first and the second part of the heat carrier (preferably together) relaxed and can absorb heat in the economizer from outside the circuit.
  • Heat carrier is relaxed from the first pressure to the second pressure
  • Heat carrier is supplied together with the second pressure heat from outside the circuit, and
  • the heat carrier is then separated into the first and the second part and the first part of the heat carrier is expanded from the second pressure to the third pressure.
  • two, three or more modules are provided in the described heat pump, which are connected in series in the circuit, wherein the first branch line of a module feeds the subsequent heat transfer medium.
  • the first branch line of a preceding module preferably represents the supply line for the subsequent module.
  • the "first part of the heat carrier" from the previous module in this case corresponds to the "first part” and the "Second part” of the heat carrier (ie, the total flow of the heat carrier) with respect to the subsequent module, so the modules are preferably
  • Each module has an expansion stage ("first expansion stage”), resulting in pressure stages or temperature stages that can be used to supply heat from various external sources, especially in the case of larger systems, where a large number of modules is advantageous.
  • first expansion stage resulting in pressure stages or temperature stages that can be used to supply heat from various external sources, especially in the case of larger systems, where a large number of modules is advantageous.
  • a named method may be advantageous if
  • parts W2.1, W2.2 ... W2.N of the heat carrier are expanded from the first pressure (Pi) to the pressures P21, P2.2 ... PZN, where Pi> P2.1> P2. 2> ...> PZN> P3 is; f) the parts W2.1, W2.2 ... W2.N of the heat carrier at the pressures P2.i, P2.2 ... P2.N heat is supplied from outside the circuit, and
  • Each part W 2 .N is assigned a pressure PZN, on which the said part is relaxed (W2.1 is assigned to P2.1, W2.2 is assigned to P2.2, etc.).
  • N is an integer, preferably between 2 and 20, in particular 2, 3, 4, 5, 6 or 7.
  • the parts of the heat carrier can be expanded individually or jointly, as described above for the first and the second part The parts can then - as described below - take place an adaptation of the pressures.
  • the parts W2.1, W2.2... W2.N are to be understood as design variants of the "second part” of the heat carrier described above, and the pressures P2.1, P2.2... P2.N are embodiments of the invention to understand the above-mentioned "second pressure". Accordingly, the features described in connection with the second part or the second pressure are also applicable to the design variants.
  • the second part of the heat carrier is thus preferred with circumvention of the second
  • Heat exchanger supplied to the first part of the heat carrier again This can be done in different ways.
  • an equalization of the pressures takes place, wherein the pressure of the first part can be increased and / or that of the second part can be reduced before the two parts are brought together. After unification, a further pressure increase can take place. It is particularly preferred to increase the pressure of the two parts separately from one another to different degrees in order to bring the pressures closer to one another. If more than one module is provided, the pressure equalization for the parts W2.1, W2.2 ⁇ .. WIN can be carried out analogously. Terms in this document should preferably be understood as one of ordinary skill in the art would understand. In particular in the event of ambiguity, the preferred definitions given in this document (alternative or supplementary) may be used. The terms "upstream” and "downstream" are preferably to one
  • waste heat is preferably to be understood as meaning the heat which is generated by a device or a process but is not used and / or can not be used by the same device or in the same process. It could also be said that the waste heat reduces the efficiency of said device or of the said process and thus
  • the said device or said process preferably serves not or not primarily for the generation of heat, but rather the heat is produced as a by-product or as a waste product, e.g. in the production of other products such as electricity, mechanical work, chemical or other products, etc.
  • the heat pump can also be used for cooling because the external source of heat is cooled when heat is supplied to the economizer.
  • the heat pump can thus e.g. be used for cooling water.
  • process steps involves the use of one or more of those mentioned in this document
  • the heat pump may comprise means which can perform one or more of the process steps mentioned in the document.
  • a heat pump with a circuit in which a heat transfer medium is performed comprising
  • a compressor for compressing the heat carrier, a first heat exchanger, which is arranged downstream of the compressor,
  • Heat exchanger are arranged
  • Expansion stage and upstream of the compressor is arranged, wherein the heat pump comprises a device which can supply the heat transfer medium or a part thereof heat from outside the circuit, wherein the device is arranged downstream of the first heat exchanger and upstream of the second heat exchanger.
  • a heat pump according to 1, wherein the device is a container for receiving the heat carrier, which has a heat exchanger, wherein the heat exchanger is connected to a source of heat outside the circuit and in contact with the heat transfer medium inside the container stands.
  • a heat pump according to 1 or 2 wherein the device communicates with a source of heat, wherein
  • the source is a source of waste heat and / or
  • the source of heat in a temperature range between minus 20 ° C and plus 50 ° C, preferably between 0 ° C and plus 40 ° C and in particular between 10 ° C and 25 ° C provides and / or
  • thermopump has a module which is arranged upstream of the second expansion stage and has at least the following components:
  • Branch point is arranged
  • a heat pump according to any one of items 4 to 6, characterized in that two, three or more modules are provided, which are connected in series in the circuit, wherein the first branch line of a module to a subsequent module supplies the heat carrier.
  • Branch line upstream of the first heat exchanger and downstream of the second heat exchanger opens into the circuit.
  • a second part of the heat carrier is expanded from the first pressure to a second pressure, wherein the second pressure is higher than the third pressure, characterized
  • step f) That the supply of heat to the second part of the heat carrier according to step f) takes place by contact of the second part of the heat carrier with a second surface
  • step f) That the supply of heat in step f) takes place by contact of the heat carrier with a surface having a temperature between minus 20 ° C and plus 50 ° C, preferably between 0 ° C and 40 ° C and
  • Fig. 1 shows a refrigerator as known from the prior art
  • Fig. 2 is a pressure-enthalpy diagram for a refrigerator according to
  • Fig. 3 shows an embodiment of the inventive heat pump
  • FIG. 5a shows an embodiment analogous to Figure 3, in which a part of
  • Heat transfer is compressed before the union with the rest of the heat carrier
  • FIG. 5c shows an embodiment analogous to FIG. 3 in which the two parts of FIG.
  • FIG. 8 shows a heat pump analogous to FIG. 3 in a multi-stage design
  • FIGS. 9a-c show different variants of the feed analogous to FIGS. 5a-c, but based on the closed embodiment according to FIG.
  • Heat pump is used as a building heating
  • Fig.l shows a heat pump as known from the prior art, while Figure 2 illustrates the process using a pressure-enthalpy diagram, wherein the circled numbers in Fig.l correspond to those in Figure 2.
  • the machine shown in Fig.l is a cooling system as it is
  • a heat transfer medium or a coolant is compressed in a cyclic process, cooled, relaxed and reheated.
  • the compression takes place by means of compressors 13, wherein the heat transfer medium simultaneously experiences a slight increase in the specific enthalpy due to the mechanical work performed by the compressor 13.
  • the heat transfer medium is passed through a condenser or generally a heat exchanger 19, where it releases heat to the outside and thus experiences a reduction of its specific enthalpy.
  • the heat carrier is then passed through an economizer in the form of a heat exchanger 29, where its temperature is further lowered. For this purpose, a diverted part of the.
  • the main stream is decompressed in a second expansion stage 17 to a lower pressure and thus further cooled, before it can absorb heat in a second heat exchanger 21 from the outside and so cool the environment.
  • the branched part is reunited after passing through the heat exchanger 29 with the rest of the heat carrier, the pressure has been previously increased by means of a compressor 13 accordingly. Subsequently, the heat carrier is again compressed, i. the cycle begins again.
  • FIG. 3 shows an embodiment of the heat pump according to the invention and FIG. 4 illustrates the processes on the basis of a pressure-enthalpy diagram.
  • the difference of this heat exchanger compared to that shown in Fig.l consists in the design of the economizer 23.
  • the heat transfer medium is also supplied to the economizer 23 after the heat release in the first heat exchanger 19. This is done via a supply line 33, wherein the heat transfer medium, however, is previously relaxed in total in a first expansion stage 15 to a lower pressure and cools.
  • the economizer 23 does not consist of a simple heat exchanger, but it has means that allow the supply of heat from outside the circuit. In the present case, this is a heat exchanger 25, which is the heat transfer medium e.g. Waste heat from other processes (solar systems / photovoltaic systems, building ventilation etc.) feeds. So it does not just find an exchange of heat within the
  • FIG. 3 shows an open version of the heat pump 11, in which the economizer 23, the shape a container, in which the heat carrier is supplied in its entirety.
  • the container shape allows the heat transfer medium to adjust its liquid volume to the temperature conditions.
  • the economizer 23 thus provides space for the liquid part of the heat carrier to expand and contract (phase transition and volume change) and thus to assume a maximum and a minimum volume of liquid in the container.
  • the heat exchanger 25 must be below a defined by the minimum volume of liquid
  • a line 37 serves to branch off a gaseous part (second part) of the heat carrier from the economizer 23, this part due to its in the
  • Essential gaseous state has a higher specific enthalpy, as the economizer 23 through the line 35 extracted part (first part) of the heat carrier, which is substantially liquid.
  • the latter flows through the line 35 to a second expansion stage 17, where it is further decompressed and thus cools before it is passed into the second heat exchanger 21 to receive there again heat from the outside.
  • the two parts (first / second part) of the heat carrier are analogous to the example in Fig.l again
  • the second part of the heat carrier which leaves the economizer via the line 37, can be fed back to the circuit or the main flow of the heat carrier at different points downstream.
  • the pressures are equalized, whereby the pressure of the first part increases (FIG. 5a) and / or that of the second part can be reduced (FIG two parts are merged. After unification, a further pressure increase can take place.
  • Fig.5b shows a variant in which the second part of the heat carrier is withdrawn via the line 37 from the economizer 23 and then relaxed.
  • the line 37 opens downstream of the second
  • Fig.5c describes an embodiment in which the first part and the second part of the heat carrier separately from each other through a compressor 13, wherein the second part must be less compressed, since its pressure is higher because it does not pass the second expansion stage 17 Has.
  • the merging of the two parts of the heat carrier takes place downstream of the two compressors 13 and before entry into the first heat exchanger 19.
  • 6a to 6c show an embodiment of the heat pump 11, in which the heat carrier is supplied to the economizer 23 in total via the supply line 33, after it has been expanded in the first expansion stage 15. in the
  • Economizer 23 takes the heat transfer heat through the heat exchanger 25 from outside the circuit.
  • the branching point 34 ie the location at which the heat transfer medium is divided into two streams (first / second part), does not lie here in the economizer 23, but downstream thereof.
  • the second part of a further expansion stage 16 is supplied, cools and is then supplied via the branch line 37 to the economizer 23, where he heat via a heat exchanger 29 with the line 33 supplied total flow of the heat carrier exchanges. That is, the second part passes through the economizer 23 twice per cycle.
  • the first part as the total flow of the total flow of the
  • FIGS. 6 a to 6 c show different variants of how the first and the second part of the heat carrier downstream of the second heat exchanger 21 can be combined.
  • the essential advantage of the embodiments according to FIGS. 6 a to 6 c compared to those from FIGS. 5 a to 5 c lies in the oil guide. Because the second part of the heat carrier leaves the economizer 23 here in the liquid state. Thus, a lubricant entrained in the heat transfer medium (for example oil) remains in the heat transfer medium and stands for the lubrication of the lubricant
  • FIG. 7 shows a closed version of the heat pump 11
  • Economizer 23 is not formed here in the form of a container, but as two (preferably separate) heat exchangers 25 and 29.
  • the one heat exchanger 29 performs the function of an economizer as it is known from the prior art.
  • the other heat exchanger 25 supplies heat to the second part of the heat carrier from outside the circuit.
  • Branching point 34 is here, in contrast to Fig.6a to 6c upstream of the economizer 23 (ie, with respect to both branch lines 35 and 37).
  • the second part of the heat carrier of the first expansion stage 15 is supplied, cools and is then supplied via the second branch line 37 to the economizer 23, where it exchanges heat via a heat exchanger 29 with the first branch line 35 supplied to the first part of the heat carrier.
  • the supply of heat to the second part of the heat carrier takes place by means of a heat exchanger 25.
  • FIG. 8 illustrates a heat pump having a plurality of repeating units, referred to as modules 24.
  • a module 24 is indicated by a dashed line. All modules 24 are in relation to the
  • Main current upstream of the second expansion stage 17 is arranged (although it is also conceivable that each module has a second expansion stage 17) and each module 24 each has an economizer 23, and a first expansion stage 15 on. Furthermore, a branch point 34 is present per module 24 (here within the container-shaped economizer 23), at which the heat carrier is separated into a first part and a second part, and a first
  • Branch line 35 for the first part of the heat carrier which is arranged downstream of the branch point 34 and a second branch line 37 for the second part of the heat carrier, which downstream of the first expansion stage 15 and downstream of the branch point 34 is arranged.
  • a line (depending on the design 33 or 37, here 33) connected to the economizer 23, which feeds the economizer 23 at least the second part of the heat carrier.
  • Said line (33 or 37) is arranged downstream of the first expansion stage 15, because at least the relaxed and thus cooled second part of the heat carrier is in the
  • Economizer 23 directed to receive there heat from sources outside the circuit, here via the heat exchanger 25. If the total flow of the heat carrier in the first expansion stage 15 is relaxed before it is passed into the economizer 23, the said conduit corresponds to the supply line 33rd (see Figures 3, 5a to 5c, 8, 10 and 11). However, if a separation of the heat carrier takes place before the expansion in the first expansion stage 15, with only the second part of the heat carrier passing through the first expansion stage 15, then said line corresponds to the branch line 37 (FIGS. 7 and 9a to 9c).
  • Heat exchanger 19 is arranged flows in the multi-stage model shown by its supply line 33 (depending on the configuration of the economizer 23)
  • the supply line 33 of the respective subsequent module corresponds to the branch line 35 of the preceding
  • Module 24 or goes into this.
  • heat is supplied via one or more heat exchangers 25, preferably at different temperatures
  • Heat pump 11 can dissipate the accumulated heat from other processes, i.
  • waste heat from different sources for example, waste heat from different sources, on the appropriate
  • Temperature level or pressure level are supplied.
  • FIGS. 9a to 9c show, analogously to FIGS. 5a to 5c, different variants of how the first and the second part of the heat transfer medium can be combined, the basis being a heat pump according to FIG.
  • the heat pump 11 shows an application example in which the heat pump 11 is used in a building.
  • the heat pump 11 largely corresponds to that shown in Figure 3, although only one compressor 13 is used in the present example. It serves to heat the building via a space heater 19 using waste heat from other processes. On the one hand, this is the waste heat from a solar collector 55 and on the other hand, that from a controlled apartment ventilation 57.
  • apartment ventilation 57 are each in contact with a heat exchanger 25 and 27, which are arranged in the economizer 23 and there heat the heat transfer medium.
  • the heat transfer medium thus passes through the compressor 13, then gives off heat in the controlled domestic ventilation 57 and subsequently in a space heater 19 before it enters the economizer 23.
  • a second part leaves the economizer 23 via the line 37 and is combined in the region of the compressor 13 with the first part.
  • the heat in addition to the operation of a
  • Water storage 59 can be used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

L'invention concerne une pompe à chaleur (11) dans laquelle de la chaleur est acheminée de l'extérieur à au moins deux niveaux de température. À cet effet, elle présente, outre un compresseur (13) servant à comprimer un caloporteur, un premier échangeur de chaleur (19), un étage d'expansion (15 ou 17) servant à détendre le caloporteur et un deuxième échangeur de chaleur (21), un économiseur spécial (23) qui peut acheminer au caloporteur ou à une partie de ce dernier de la chaleur perdue de l'extérieur du circuit.
EP11764460.9A 2010-09-29 2011-09-28 Pompe à chaleur Withdrawn EP2622289A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01586/10A CH703290A1 (de) 2010-09-29 2010-09-29 Wärmepumpe.
PCT/CH2011/000228 WO2012040864A1 (fr) 2010-09-29 2011-09-28 Pompe à chaleur

Publications (1)

Publication Number Publication Date
EP2622289A1 true EP2622289A1 (fr) 2013-08-07

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EP11764460.9A Withdrawn EP2622289A1 (fr) 2010-09-29 2011-09-28 Pompe à chaleur

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EP (1) EP2622289A1 (fr)
CH (1) CH703290A1 (fr)
WO (1) WO2012040864A1 (fr)

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ITPD20130004A1 (it) * 2013-01-15 2014-07-16 Epta Spa Impianto frigorifero con eiettore
US9353980B2 (en) * 2013-05-02 2016-05-31 Emerson Climate Technologies, Inc. Climate-control system having multiple compressors
FR3008031B1 (fr) * 2013-07-08 2016-12-30 Valeo Systemes Thermiques Systeme de conditionnement thermique pour vehicule automobile, installation de chauffage, ventilation et/ou climatisation correspondante et procede de pilotage correspondant
CN103954061B (zh) * 2014-04-11 2016-04-06 西安交通大学 一种喷射器过冷增效的单级蒸气压缩式循环系统
DE102015112439A1 (de) 2015-07-29 2017-02-02 Bitzer Kühlmaschinenbau Gmbh Kälteanlage
ITUA20163465A1 (it) * 2016-05-16 2017-11-16 Epta Spa Impianto frigorifero a più livelli di evaporazione e metodo di gestione di un tale impianto
US11585608B2 (en) 2018-02-05 2023-02-21 Emerson Climate Technologies, Inc. Climate-control system having thermal storage tank
US11149971B2 (en) 2018-02-23 2021-10-19 Emerson Climate Technologies, Inc. Climate-control system with thermal storage device
WO2019222394A1 (fr) 2018-05-15 2019-11-21 Emerson Climate Technologies, Inc. Système de climatisation avec boucle de mise à la terre
US11346583B2 (en) 2018-06-27 2022-05-31 Emerson Climate Technologies, Inc. Climate-control system having vapor-injection compressors
CN108759157B (zh) * 2018-07-20 2023-10-24 天津商业大学 一次节流双级压缩热泵系统

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Also Published As

Publication number Publication date
CH703290A1 (de) 2011-12-15
WO2012040864A1 (fr) 2012-04-05

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