EP2621646A1 - Stanz- und/oder perforiervorrichtung mit einem substratträgerkopf mit kontinuierlich gesteuerter ausrichtung - Google Patents

Stanz- und/oder perforiervorrichtung mit einem substratträgerkopf mit kontinuierlich gesteuerter ausrichtung

Info

Publication number
EP2621646A1
EP2621646A1 EP11763684.5A EP11763684A EP2621646A1 EP 2621646 A1 EP2621646 A1 EP 2621646A1 EP 11763684 A EP11763684 A EP 11763684A EP 2621646 A1 EP2621646 A1 EP 2621646A1
Authority
EP
European Patent Office
Prior art keywords
substrate
head
base
stamping
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11763684.5A
Other languages
English (en)
French (fr)
Inventor
Stéphane BREDEAU
Jacky Bancillon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of EP2621646A1 publication Critical patent/EP2621646A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02Stamping using rigid devices or tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B47/00Constructional features of components specially designed for boring or drilling machines; Accessories therefor
    • B23B47/26Liftable or lowerable drill heads or headstocks; Balancing arrangements therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0094Press load monitoring means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06Platens or press rams
    • B30B15/068Drive connections, e.g. pivotal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00Cutting by use of rotating axially moving tool
    • Y10T408/03Processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00Cutting by use of rotating axially moving tool
    • Y10T408/16Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor

Definitions

  • the present invention relates to the field of stamping and piercing substrates, using two matrices intended to be relatively displaced relative to one another in translation, for example using a hydraulic or mechanical traction / compression machine, such as a press.
  • the invention relates to the stamping and drilling of thin and flat substrates made of polymeric, ceramic, metallic or other materials.
  • the parts obtained have multiple applications in industry, particularly as components of MEMs (microsystems electromechanical), especially dedicated to biology, medicine, or even chemistry.
  • MEMs microsystems electromechanical
  • a stamping action may be considered as a pattern printing technique on a surface of a substrate. It is based on the mechanical structuring of a viscous material by pressing the substrate between two dies, also called punches or molds. This technique is particularly well suited for the structuring of polymers, but is also effective for the structuring of ceramic and metallic substrates.
  • the substrate is heated to a temperature greater than or equal to its glass transition temperature T g , in order to be in a so-called rubbery state.
  • the plates of the press are then brought together so that the substrate is urged between the two dies, so that the material is forced to fill the microcavities provided in one and / or the other of these dies, under the action of the press.
  • the dies and the sample are cooled while maintaining a constant pressure, in order to limit the shrinkage of the material.
  • the stamping can be done cold, that is to say at room temperature.
  • the object of the invention is therefore to remedy at least partially the disadvantages mentioned above, relating to the embodiments of the prior art.
  • the invention firstly relates to a device for stamping and / or drilling a substrate, comprising two stamping / drilling dies carried respectively by two support assemblies intended to be moved relatively. relative to one another in translation so that said matrices solicit said substrate when it is arranged between these matrices.
  • At least one of said support assemblies comprises a base, an orientable head integral with the matrix associated with this assembly, and connection means between the base and the head for adjusting the orientation of this head. compared to the base.
  • the device also comprises a plurality of pressure sensors designed to continuously deliver, during a solicitation of the substrate by said two matrices, information providing information on the pressure exerted on one of said matrices at different points of contact. it.
  • the device also comprises means for controlling said connecting means, provided for continuously controlling the orientation of the head relative to the base, in response to the information supplied by said plurality of pressure sensors.
  • the invention is therefore remarkable in that it makes it possible to know, easily and in a manner reliable with the plurality of sensors, the pressure distribution applied to one of the two matrices, which provides information directly on the pressure distribution applied to the substrate in contact with the same matrix.
  • the orientation of the head is then advantageously continuously controlled in response to the pressure information delivered by the sensors, so that this distribution is closer to the desired one, which is preferably a homogeneous distribution of pressure on the matrix and the substrate. generally obtained by a precise and constant parallelism between the two matrices applying the pressure.
  • each of the two support assemblies is equipped with an orientable head.
  • each of the two sets could be equipped with such a controlled swivel head.
  • each of the two matrices could be associated with a plurality of sensors of its own, whether or not it can be controlled in orientation.
  • the invention applies preferentially to substrates whose thickness is between 50 ⁇ and 10 mm.
  • the geometry of the patterns to be printed can be varied, for example bands or spheres. These patterns are then generally distributed regularly along rows and columns.
  • said connecting means comprise a ball joint member and at least two support systems adjustable in height.
  • This configuration is of simple design, since it allows by actuation of one or both support systems to put the head in motion around the patella, and thus change its inclination.
  • said steerable head is equipped with a counterweight arranged so that the portion of said support assembly carried by said base has, in view in the direction of relative translation of the two support assemblies, a center of gravity located in a triangle. whose vertices are constituted respectively by the center of the connection forming a ball joint, and the points of contact of the two support systems on said base. This securely stabilizes this portion of the support assembly on the base.
  • said triangle is isosceles rectangle at the apex formed by the center of the ball joint. This form, which conditions the positioning of the two support systems, ensures a fine adjustment of the orientation of the steerable head.
  • each support system adjustable in height is a micrometer screw, widely used in the trade and known to be reliable and accurate.
  • At least one of said support assemblies comprises a primary body receiving its associated matrix, for example by screwing.
  • said pressure sensors are interposed between said matrix and said primary body.
  • the primary body is provided with housings equipped with heating cartridges, and cooling fluid circulation channels. This configuration allows very high heating and cooling rates.
  • said housings are orthogonal to said channels, and / or that said channels are arranged between said housings and said matrix of the support assembly.
  • said support assembly further comprises a stainless steel secondary body separated from the brass primary body by a thermally insulating piece.
  • a layer of carbon in the form of amorphous diamond called DLC layer. This makes it possible to increase the life of the dies, and to facilitate the removal of the part obtained after stamping the substrate, because of the low coefficient of friction of said layer.
  • the invention also relates to an installation for stamping and / or drilling a substrate, comprising a device as described above, mounted on a traction / compression machine such as a press, allowing said two support assemblies to be moved relative to one another in translation.
  • a subject of the invention is a process for stamping and / or drilling a substrate using a device as described above, the method implementing continuously the control of the orientation of the head relative to the base in response to the information provided by said plurality of pressure sensors.
  • FIG. 1 is a diagrammatic front view of an installation comprising a press and a device for stamping and / or drilling a substrate according to a preferred embodiment of the present invention
  • FIG. 2 represents a schematic view from above of the orientable head of the device of FIG. 1;
  • FIG. 3 represents a front view of a portion of a matrix support assembly equipping the device shown in the preceding figures;
  • FIG. 4 represents a view from above of that shown in FIG. 3;
  • FIG. 5 represents one of the matrices of the device shown in the preceding figures
  • Figures 6a to 6c show different successive steps of a stamping process implemented using the device shown in the preceding figures
  • FIG. 7 represents an example of a piece obtained following the implementation of the method schematized in FIGS. 6a to 6c;
  • FIG. 8 represents an example of a part obtained following the implementation of a similar method, leading to the piercing of the substrate;
  • FIG. 9 represents an exploded perspective view of part of the tooling used to obtain the part shown in the previous figure.
  • FIG. 1 a plant 100 comprising a press hydraulic or mechanical 102, and a device 1 for stamping a substrate according to a preferred embodiment of the present invention.
  • the press 102 generally comprises a frame 104 and a carriage 106 mounted in translation on the chassis, in a pressurizing direction 108.
  • the press 102 accommodates the device 1 , which comprises two support assemblies 4a, 4b intended to be displaced relative to each other in a direction of translation corresponding to the direction 108.
  • the support assembly 4a said lower assembly, is removably mounted on the base of the frame 104, while the support assembly 4b, said upper assembly, is removably mounted on the carriage 106, above and in the aligning the assembly 4a according to the direction 108.
  • the support assembly 4a carries a lower die 6a, and at its lower end, the support assembly 4b carries an upper die 6b opposite the die 6a, on which the substrate 8 is disposed. stamping.
  • the lower die 6a is provided with a relief intended to print patterns on the lower surface of the substrate, its upper surface then being intended here to remain flat and devoid of patterns.
  • it could be the upper matrix 6b which is structured in reliefs, or both. The developments which follow in relation to the structured matrix in reliefs 6a can thus be applied to the matrix 6b.
  • the lower support assembly 4a first comprises a base 10, removably connected to the frame 104 by a connecting shaft 12.
  • the base 10 carries an orientable head 14, connecting means being interposed between these two elements.
  • These connecting means which adjust the orientation of the head 14 relative to the base 10 as will be described in more detail below, comprises a link 16 forming a ball joint, and two micrometer screws 18, 18 adjustable in height in the direction 108.
  • Each of these screws 18 has for example a fixed body mounted on the head 14, and a deployable tip in the direction 108, carried by the fixed body and punctual support at its opposite end against the upper surface of the base 10.
  • the two screws 18 are arranged at 90 ° relative to one another, along the center 20 of the ball joint 16.
  • it is formed a right isosceles triangle 22 whose vertices are respectively constituted by the center 20 of the ball joint connection, and by the two contact points 24 of the two screws 18 on the upper surface of the base 10.
  • the screws 18 can be placed at the free ends of arms 28 carried by a circular-shaped head core 30, on which the ball joint 16 is arranged.
  • the steerable head 14 is equipped with a counterweight 32 arranged so that the portion of the support assembly 4a carried by the base 10 has, in view in the translation direction 108, a center of gravity located in the triangle 22.
  • This part of the assembly 4a corresponds to all the elements thereof situated above the base 10, that is to say to all the elements between the orientable head 14 and the lower die 6a.
  • the counterweight can be suspended at the free end of an arm 34 carried by the head core 30, and located between the two other arms 28.
  • the steerable head 14 carries a plurality of elements of the lower support assembly 4a, the matrix 6a. These elements, bearing the overall reference numeral 36 in FIG. 1, will now be described in detail with reference to FIG.
  • the lower die 6a intended to carry the substrate 8.
  • This die is removably fixedly mounted, for example by screwing / bolting, on a primary body 40 of brass.
  • the primary body 40 has a recess 42 on its upper part, in which is housed the base of the complementary shape matrix.
  • the body 40 generally disk-shaped, is connected to a thermally insulating piece 44, for example made of stumatite.
  • This piece 44 is interposed between the primary body 40 and a secondary body 46 made of stainless steel, which carries a connecting member 48 to the swiveling head 14.
  • a stainless steel cap 50 covers a part of these elements, in particular the insulating part 44 and the primary support body 40, as can be seen in FIG.
  • the head 14 and the aforementioned elements 48, 46, 44, 40 and 6a are integral with each other.
  • the support assembly 4a comprises a plurality of pressure sensors 60, here four sensors distributed at 90 ° with respect to a center of the matrix 6a housed in the recess 42.
  • the sensors 60 are housed in notches 62 formed on the primary body 40, these notches being open radially outwardly and opening radially inwards in the recess. 42.
  • the pressure sensors 60 are each interposed, in the direction 108, between a plate of the primary body 40 defining the bottom of a notch 62, and the lower surface of the die 6a, preferably at a periphery of it.
  • the primary body 40 is equipped with means heating and cooling means.
  • heating cartridges 66 housed removable in housing 68 formed within the primary body 40.
  • the number is adaptable according to the needs encountered. They are for example two in number, arranged parallel to each other and orthogonally to the direction 108, in the bottom of the body 40.
  • the power delivered by these cartridges inserted in the body 40 can be controlled by computer, via a temperature controller and thermocouples (not shown).
  • the cartridges adopt a diameter of about 6.3 mm, and each have a power of about 80 W.
  • cooling fluid circulation channels 70 can be made in the form of cooling fluid circulation channels 70, also made within the primary body 40, preferably at the most ready of the matrix 6a, between the latter and the cartridges 66.
  • their number and their form are adaptable according to the needs met. They are for example two in number, arranged parallel to each other and orthogonally to direction 108 and cartridges 66.
  • a connection connects their end in order to be able to practice a circulation of cooling fluid entering through one of the two channels, and out through the other of these channels.
  • This configuration allows in particular very high heating and cooling rates.
  • these speeds can be respectively of the order of + 7 ° C / min over the range between 120 and 140 ° C, and of the order of -75 ° C / min over the same interval.
  • control means 74 for example of the computer type. These control means are therefore designed to continuously receive, from the sensors 60, information providing information on the pressure exerted on the lower matrix 6a at different points thereof, corresponding to the points of contact between the lower surface of this matrix and the different sensors.
  • control means 74 are provided to continuously control the orientation of the head 14 relative to the base 10, by appropriately controlling the two micrometer screws 18.
  • the upper support assembly 4b has a group of elements 36 'identical or similar to the group of elements 36 of Figure 3, the pressure sensors and the heating and cooling means remaining here optional.
  • This group 36 ' in inverted position by relative to the group 36 in order to orient the die 6b downwards, is removably mounted on the carriage 106, by means of connection means 80.
  • one and / or the other of the two matrices may be coated with a layer 84 of carbon in the form of amorphous diamond, represented in part in FIG. 5, showing the lower matrix 6a provided with reliefs 86
  • This type of layer also called film, improves the life of the matrix and facilitates the demolding of the part after the stamping phase, thanks to the low coefficient of friction that it provides.
  • the deposition of this layer is preferably carried out by a process of the "PECVD” type, also known as the "Plasma Assisted Steam Phase Chemical Deposition”. This technique makes it possible to obtain a so-called DLC ("Diamond Like Carbon") monolayer, typically between 10 and 2000 nm thick.
  • the thickness of the deposited layer 84 is preferably of the order of 1.8 ⁇ .
  • a thin layer of silicon carbide SiC can be deposited beforehand, for example to a thickness of about 400 nm. It is noted that this layer 84 is also applicable to dies made of materials other than brass, such as for example stainless steel.
  • the substrate 8 is placed on the lower die 6a, which is then heated with the aid of the cartridges at a stamping temperature corresponding to a temperature greater than or equal to the glass transition temperature T g of the substrate 8
  • the pressure information collected by the control means 74 can already detect a failure to balance the various pressures applied to the die 6a. . If this is the case, then the micrometer screws 18 are controlled by these means 74 in order to correct the orientation of the head 14, this correction resulting in a substantially identical correction of the orientation of the lower die 6a and the substrate 8 resting on it.
  • the stamping phase is operated by pressurizing the substrate 8 between the two matrices 6a, 6b, by moving the upper die 6b downwards in the direction 108.
  • the crushing allows the substrate 8 to deform plastically to fill the microcavities of the lower die 6a, as shown schematically in Figure 6b.
  • the orientation of the head 14 around the ball 16 is controlled by the means 74.
  • This orientation of the head continuously controlled in response to the pressure information delivered by the sensors, is such that the distribution of pressure on the matrix 6a is as close as possible to that desired, which is preferably a homogeneous distribution of pressure on the four controlled points of this matrix.
  • the control in orientation of the matrix 6a by controlling the orientation of the head 14, actually leads to maintain a precise and constant parallelism between the two matrices 6a, 6b, throughout the stamping phase .
  • a continuous control of the orientation of the matrix 6a a continuous control of the pressure distribution on the substrate 8 pressed between the two matrices is obtained, which makes it possible to appreciably improve the quality, the uniformity and the repeatability. patterns printed on the bottom surface of the substrate.
  • the heating means are deactivated, then the cooling means are in turn activated by circulating the fluid in the channels 70, while maintaining the substrate under pressure between the two matrices.
  • T g glass transition temperature
  • the part is separated from the dies after the lapse of a predetermined cooling time.
  • the upper die 6b is raised along the direction 108 as shown schematically in FIG. 6c, and then the resulting piece 88, an example of which is shown in Figure 7, can be easily removed from the lower die 6a.
  • the piece 88 'shown in FIG. 8 is an example of a pierced piece obtained following the implementation of a method analogous to that just described, but with dies allowing the drilling of the substrate.
  • the lower die 6a is equipped with reliefs 86 which are here intended to fully traverse the substrate 8.
  • the latter is housed between two parts 90a, 90b of a grid 90, whose holes correspond to the reliefs 86 to allow the passage thereof.
  • the reliefs 86 are housed in the holes of the lower part 90a of the grid 90, while the upper planar matrix 6b presses on an upper rim 96 raised from the upper part 90b of Grid.
  • the method may relate to the cold stamping, or embossing, of an alumina substrate.
  • the shape of this substrate can be square, 30 mm side, for a thickness of the order of 400 ⁇ .
  • the force applied by the upper die can be of the order of 3 kN, for a duration of about 60 s.
  • the printed patterns have a depth of the order of 150 ⁇ .
  • the stamping of a polyglycolide substrate may be the stamping of a polyglycolide substrate (PGA).
  • the shape of this substrate may be square, 40 mm side, for a thickness of the order of 1.4 mm.
  • the stamping temperature is of the order of 60 ° C, and the force applied by the upper die can be of the order of 1.1 kN, for a period of about 10 s.
  • the cooling temperature can be set at 16 ° C, during a cooling time of the order of 50 s.
  • the printed patterns have a depth of the order of 100 ⁇ .
  • this substrate may be a cold drilling of a zirconia substrate.
  • the shape of this substrate may be rectangular, 35 and 22 mm sides, for a thickness of the order of 400 ⁇ .
  • the force applied by the upper die may be of the order of 0.6 or 0.7 kN, for a duration of about 5 s.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
EP11763684.5A 2010-10-01 2011-09-29 Stanz- und/oder perforiervorrichtung mit einem substratträgerkopf mit kontinuierlich gesteuerter ausrichtung Withdrawn EP2621646A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1057960A FR2965495B1 (fr) 2010-10-01 2010-10-01 Dispositif d'estampage et/ou de percage comprenant une tete support de substrat dont l'orientation est commandee en continu
PCT/EP2011/067016 WO2012041976A1 (fr) 2010-10-01 2011-09-29 Dispositif d'estampage et/ou de perçage comprenant une tête support de substrat dont l'orientation est commandée en continu

Publications (1)

Publication Number Publication Date
EP2621646A1 true EP2621646A1 (de) 2013-08-07

Family

ID=44147907

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11763684.5A Withdrawn EP2621646A1 (de) 2010-10-01 2011-09-29 Stanz- und/oder perforiervorrichtung mit einem substratträgerkopf mit kontinuierlich gesteuerter ausrichtung

Country Status (4)

Country Link
US (1) US9061462B2 (de)
EP (1) EP2621646A1 (de)
FR (1) FR2965495B1 (de)
WO (1) WO2012041976A1 (de)

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
FR2959599B1 (fr) 2010-04-28 2013-12-20 Commissariat Energie Atomique Dispositif et procede de texturation mecanique d'une plaquette de silicium destinee a constituer une cellule photovoltaique, plaquette de silicium obtenue
CN104586127B (zh) * 2015-01-27 2017-05-17 安徽省佳艺休闲用品有限公司 一种应用于休闲椅背加工的压布机及其使用方法
CN114311816B (zh) * 2022-02-15 2024-05-14 江苏海王健康生物科技有限公司 一种药食同源营养粉处理用压片机及其压片工艺
US20230280218A1 (en) * 2022-03-01 2023-09-07 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device

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JP3055708B2 (ja) * 1991-03-29 2000-06-26 新東工業株式会社 液晶パネル製造用プレス装置
DE4138285C2 (de) * 1991-11-21 1994-04-07 M & S Brugg Ag Brugg Hydraulische Abkantpresse
EP0741001B1 (de) * 1995-05-04 2002-02-06 Gietz AG Präge-Druck- und Stanzmaschine
GB9601289D0 (en) * 1996-01-23 1996-03-27 Nimbus Manufacturing Uk Limite Manufacture of optical data storage disc
DE19648844C1 (de) * 1996-11-26 1997-09-18 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Abformung mikrosystemtechnischer Strukturen
SE515962C2 (sv) * 2000-03-15 2001-11-05 Obducat Ab Anordning för överföring av mönster till objekt
US6758664B1 (en) * 2001-01-12 2004-07-06 Seagate Technology Llc Self-leveling stamper module
JP4089383B2 (ja) * 2001-10-30 2008-05-28 ソニー株式会社 情報記録媒体の製造方法と製造装置
JP2005190632A (ja) * 2003-12-26 2005-07-14 Technos:Kk ダイヤモンド様炭素膜を施した光ディスク成形金型とそれを使用する成形方法
JP4500183B2 (ja) * 2005-02-25 2010-07-14 東芝機械株式会社 転写装置
JP4923924B2 (ja) * 2005-11-22 2012-04-25 コニカミノルタホールディングス株式会社 インプリント装置及びインプリント方法
TWI388418B (zh) * 2008-10-09 2013-03-11 Hitachi Ind Equipment Sys Precision imprinting device and its embossing load control method
FR2959599B1 (fr) 2010-04-28 2013-12-20 Commissariat Energie Atomique Dispositif et procede de texturation mecanique d'une plaquette de silicium destinee a constituer une cellule photovoltaique, plaquette de silicium obtenue

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Also Published As

Publication number Publication date
US9061462B2 (en) 2015-06-23
FR2965495A1 (fr) 2012-04-06
FR2965495B1 (fr) 2013-08-02
WO2012041976A1 (fr) 2012-04-05
US20130307173A1 (en) 2013-11-21

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