EP2606407A2

EP2606407A2 - Portable electronic device

Info

Publication number: EP2606407A2
Application number: EP11749066.4A
Authority: EP
Inventors: Fletcher R. Rothkopf; Phillip M. Hobson; Adam Mittleman; Anna-Katrina Shedletsky; Eric S. Jol; Stephen Brian Lynch
Original assignee: Apple Inc
Current assignee: Apple Inc
Priority date: 2010-08-19
Filing date: 2011-08-19
Publication date: 2013-06-26
Also published as: WO2012024578A8; KR101417695B1; CN103221896A; KR101494555B1; KR20130042050A; WO2012024578A2; CN103221896B; WO2012024578A3; KR20130055661A

Abstract

A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.

Description

PORTABLE ELECTRONIC DEVICE

BACKGROUND

Field of the Invention

[0001] The invention relates to consumer products, and more particularly, to a portable electronic device.

Description of the Related Art

[0002] A portable electronic device can take many forms such as, for example, a tablet computing device along the lines of an iPad™, a portable communication device such as an iPhone™, or a portable media player, such as an iPod™, each manufactured by Apple Inc. of Cupertino, CA. Such devices often have wireless communication mechanisms, in order to provide wireless communication between the portable device and base stations, cell phone towers, desktop computers, etc.

Common wireless communication mechanisms include IEEE 802.11 a, b, g, and n (commonly known as "WiFi"), Worldwide Interoperability for Microwave Access (WiMAX), and cellular communications mechanisms such as Global System for

Mobile Communications (GSM) and Code Division Multiple Access (CDMA). What is needed is improved techniques for integrating antennas into portable electronic devices to enable wireless communication.

SUMMARY

Compact Folded Configuration for Integrated Circuit Packaging

[0003] Broadly speaking, the embodiments disclosed herein describe memory chip packaging designs well suited for use in consumer electronic devices, such as laptops, cellphones, netbook computers, portable media players and tablet computers. In particular, packaging designs for memory chips used in a light-weight consumer electronic device with a thin and compact enclosure are described. The packaging designs using memory chips can be referred to as a "foldable memory device" in the associated description. The foldable memory device design can address assembly, electrical connectivity and RF shielding issues associated with using multiple chips in an electronic device. Methods and apparatus for implementing these chip packaging designs are described as follows.

[0004] In one embodiment of the chip packaging designs described herein, a plurality of chips can be coupled to a flexible circuit connector to form a memory device. The flexible circuit connector can include data and power traces used by the chips. Two chips on the flexible circuit connector that are adjacent to one another can be separated by a portion of the flexible circuit connector of some length. When the memory device is installed in an electronic device, the portion of the flexible circuit connector between each of the chips can be bent or twisted to allow an orientation of the chips relative to one another to be changed.

[0005] Via bending and twisting of the flexible circuit connector between the chips, the memory device can be configured in multiple orientations during the installation process. For instance, during one step of an installation process, a first chip connected to the flexible circuit connector can be in a side by side orientation with a second chip. This orientation can be used while the second chip is attached to a component, such as a printed circuit board (PCB). Then, during a second step, a portion of the flexible circuit connector between the first and second chips can be folded over to allow the orientation between the first chip and the second chip to be changed. For instance, after the folding, the first chip and the second chip can be aligned in a stacked configuration and bonded together. In general, when the memory device includes more than two chips, the orientation of each of the chips relative to one another can be adjusted by bending or folding the flexible circuit connector at different locations through multiple steps until the chips are assembled in a final packaging configuration.

[0006] In particular embodiments, the flexible circuit connector can include metal connector pads for grounding the flexible circuit connector to a metal frame or other metal components. To facilitate grounding, the flexible circuit connector can be folded in areas adjacent to the connector pads to allow the connector pads to be bonded to a particular surface, such as a surface of the metal frame. When properly grounded, the flexible circuit connector can be used to form part of a faraday cage.

[0007] In one embodiment, the faraday cage can be used to block radio frequency (RF) signals generated by the chips from reaching an antenna installed in the portable computing device. The antenna can be a component of a wireless interface used on the device. Using the flexible circuit connector to form part of the faraday cage rather than a separate metal shield can result in a thinner and lighter weight design since the flexible circuit connector is thinner and weighs less than a typical metal component used for RF shielding. For example, stainless steel is typically used to form a faraday cage used in RF shielding. A flexible circuit connector can be about 1/6 the thickness of a stainless steel component used in this manner.

[0008] In a particular embodiment, a method of installing the memory chips attached to the flexible circuit connector in a portable computing device is described. The method can include 1) attaching a first chip to a second chip via a flexible circuit connector; 2) attaching the first chip to a printed circuit board where the first chip can be positioned within a metal frame coupled to the printed circuit board such that the metal frame partially surrounds the first chip; 3) folding over the flexible circuit connector and aligning the second chip with the first chip; 4) attaching the second chip to the first chip via an adhesive where the first and second chips are aligned and bonded in a stacked configuration; 5) grounding a portion of the flexible circuit connector to one or more sides of the metal frame to prevent RF signals from leaking from the first chip and the second chip (as described above, leaking RF signals can affect an antenna used with the portable computing device); and 6) installing an assembly including the first chip, the second chip, the metal frame and the printed circuit board into the portable computing device.

Internal Frame Optimized for Stiffness and Heat Transfer

[0009] Broadly speaking, the embodiments disclosed herein describe structural components well suited for use in consumer electronic devices, such as laptops, cellphones, netbook computers, portable media players and tablet computers. In particular, structural components are described that address both strength and thermal issues associated with the design of a light-weight consumer electronic device with a thin and compact enclosure. Methods for forming these structural components are also described.

[0010] In one embodiment, the consumer electronic device can be a thin portable electronic device with a display. The internal arrangement of the components of the thin portable electronic device can be viewed as a number of stacked layers. The stacked layers can be associated with a particular height relative to the thickness of the device. Various device components, such as but not limited to display circuitry, a CPU, speakers, memory, wireless communication circuitry and a battery can be arranged and distributed on the stacked layers.

[0011] One of the stacked layers can be an internal frame. The internal frame can be coupled to the external housing of the thin portable electronic device. The internal frame can be configured to provide heat distribution capabilities, such as heat spreading, for components that generate heat located in layers adjacent to the internal frame. Further, the internal frame can be used to add to the overall structural stiffness of the device. In addition, the internal frame can be used as an attachment point for other device components used in the device, such as the display.

[0012] In one embodiment, the internal frame can be an internal metal frame formed from a number of layers of different metals. For instance, the internal metal frame can include a middle layer formed from a first metal situated between two outer layers formed from a second metal. The first metal and the second metal can each be selected for their strength and/or heat conduction properties. Further, the thickness of each of the layers can be varied to enhance either its strength or thermal

characteristics. In one embodiment, the different metal layers of the internal metal frame can be joined using a cladding process.

[0013] In a particular embodiment, the first metal used in the middle layer can be selected primarily for its heat conduction properties such that the middle layer can act as a heat spreader while the second metal used in the two outer layers can be primarily selected to improve the strength of the internal metal frame and hence, the overall stiffness of the device. In general, the first metal and the second metal can selected to improve one or more of heat conduction property, a strength property (e.g., stiffness), an environment property (e.g., corrosive resistance) and a cosmetic property (e.g., appearance of the device). As an example, the middle layer can be formed from copper, which is selected for its thermal properties, and the two outer layers can be formed from stainless steel, which is selected for its strength properties. In another embodiment, the second metal used in the two outer layers can be selected to allow each of the outer layers to act as heat spreaders while the first metal used in the middle layer can be selected for its strength properties.

[0014] When the first metal used in the middle layer of the internal metal frame is selected primarily selected for its thermal properties so that the middle layer can act as a heat spreader, one or more apertures can be provided in the outer layers of the internal metal frame. Each aperture can be located proximate to a heat generating component within the device. A thermal bridge can be provided that thermally links a surface associated with the heat generating component to the middle layer of the internal metal frame via the aperture in the outer layer proximate to the heat generating component. In particular embodiments, the thermal bridge can be formed from a soldering material or a thermally conductive adhesive tape.

Composite Microphone Boot to Optimize Sealing and Mechanical properties

[0015] Broadly speaking, the embodiments disclosed herein describe microphone assembly designs well suited for use in consumer electronic devices, such as laptops, cellphones, netbook computers, portable media players and tablet computers. The microphone assembly can be installed within a consumer electronic device and utilized for applications involving sound recording. In particular, the microphone assembly can be used for wireless communication applications, such as digital telephony.

[0016] The microphone assembly can include a microphone coupled to a circuit board and a microphone boot. When the microphone assembly is installed in an interior of a device, the microphone boot can provide a conduit for sound between the microphone and an aperture in a housing of the device. Typically, the microphone boot includes a hollow enclosure that can conduct sound to the microphone. Thus, sound waves from outside the device can enter the aperture in the housing, can pass through the microphone boot and then can be received by the microphone.

[0017] Once sound waves have entered through the aperture in the exterior housing, for sound quality purposes, it desirable to minimize any sounds passing through the interior of the housing from mixing with sounds that have entered the microphone boot, such as sounds generated from an internal speaker within the device. To prevent sound penetration into the microphone boot, it is desirable to establish a high seal integrity at both ends of the microphone boot that can be maintained (not broken) during operation of the device. Typically, one end of the microphone boot can be sealed to a surface on the interior of the housing and the other end of the microphone boot can be sealed to a microphone. Methods and apparatus related to microphone boot designs with good sealing qualities are described as follows.

[0018] The composite microphone boot can include a compressible center portion that is disposed between two end caps formed from a less compressible material than the center portion. For instance, the end caps can be formed from a hard plastic material and the center portion can be formed from a softer plastic material, such as a silicone plastic. As another example, the end caps can be formed from a softer plastic material and the center portion can be formed from a harder plastic material. In general, the ends cap and the center portion can each be formed from materials of different durometers. In one embodiment, the relative hardness of each of the materials can be selected to improve the sealing integrity and/or the shock absorbing properties of the composite microphone boot.

[0019] The composite microphone boot including a hollow interior portion can be formed in a double shot injection molding process. Different materials can each be used during one shot of the double shot injection molding process. For instance, in one shot, a harder plastic material can be used and in the other shot a softer plastic material can be used in the other shot. The materials used in each of the shots can be selected so that they bond together during the injection molding process.

[0020] In another embodiment, the end caps and center portion of the composite microphone boot can be separately formed and then stacked together. For instance, the end caps or the center portion can be separately molded or die-cut. The end caps and the center portions can be stacked together and held in place without physically bonding the components to one another. For instance, the components can be mechanically restrained in some manner, such as pressing the components together to hold them in place when they are installed within a device.

[0021] During installation, a pressure sensitive adhesive (PSA) can be attached to each end of the composite microphone boot. Then, via the PSA, one end of the composite microphone boot can be bonded to a surface associated with the microphone while the opposite end can be bonded to an inner surface of the housing. A compressive force can be applied to the composite microphone boot. For instance, a microphone assembly including a printed circuit, microphone and microphone boot can be secured to the housing in such a manner that a compressive force is exerted on the microphone boot. The compressive force can be mostly loaded onto the center portion of the composite microphone boot, which can be reduced in thickness as a result. The compressed center portion can exert an outward force against the end caps of the composite microphone boot, which can enable and help maintain a good seal between the PSA and the housing on one end of the microphone boot and the PSA and the microphone on the opposite end of the microphone boot. This implementation can result in a sound isolation of 40 DB or greater. [0022] In particular embodiments, the microphone boot can be formed as a hollow cylinder although other shapes can be utilized if desired. The microphone boot can include a center portion disposed between two end caps. In one embodiment, a size and shape of each end cap can be proximately identical. In other embodiments, the size and shape of each end cap can be different. For example, one end of the microphone boot can be sealed to an interior surface of the housing that is curved, the end cap of the microphone boot facing the interior portion of the housing can be shaped to conform to the shape of the surface of the interior surface to enable a better seal to be formed and maintained.

[0023] In one embodiment, a method of manufacturing a portable computing device is described the method. The method can include determining a size, a shape and a material composition of a composite microphone boot. Then, the composite microphone phone boot can be formed. The composite microphone boot can be formed using a double shot injection molding process. Next, opposite ends of the composite microphone boot can be bonded to a microphone and an interior surface of a housing of the portable computing device. For instance, a PSA can be used as a bonding agent. A microphone assembly including the composite microphone boot, the microphone and a printed circuit board can be secured to the housing such that the composite microphone boot is held in place and seals are maintained. Finally, the assembly of the portable computing device including the composite microphone boot can be completed.

Modular Material Antenna Assembly

[0024] Broadly speaking, the embodiments disclosed herein describe a modular material antenna assembly that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then

mechanically supported by the antenna block, and electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame. In one embodiment, the antenna block is made of Cyclo Olefin Polymer (COP), while the frame is made of a glass-filled plastic. The resultant difference in dielectric constant, in conjunction with the interlocking portions of the frame and antenna block, as well as the difference in dielectric loss tangent, improves antenna performance.

[0025] In another embodiment, a method for assembling a portable electronic device is provided. In this embodiment, an electrically conductive housing is provided. Then, an electrically non-conductive frame is glued to an interior of the electrically conductive housing, forming an integrated structure. The electrically non- conductive frame is formed of a frame material having a first dielectric constant. Then, an antenna block is secured to the frame by interlocking a portion of the antenna block having a first shape with a portion of the frame having a second shape corresponding to the first shape. The antenna block is formed of an antenna block material having a second dielectric constant substantially less than the first dielectric constant. An antenna flex is then supported by the antenna block.

[0026] In another embodiment, a computer readable medium is provided having computer code for affixing an electrically non-conductive frame to an interior of an electrically conductive housing, forming an integrated structure, wherein the electrically non-conductive frame is formed of a frame material having a first dielectric constant. This may include computer code for controlling robotic arms to glue the electrically non-conductive frame to an interior of the electrically conductive housing. The computer readable medium may also include computer code for securing an antenna block to the frame by interlocking a portion of the antenna block having a first shape with a portion of the frame having a second shape corresponding to the first shape. This may include computer code for controlling robotic arms to perform the interlocking. The computer readable medium may also include computer code for causing the antenna flex to be mechanically supported by the antenna block. This may include computer code for controlling an automatic screwdriver to screw in the antenna feed to the antenna block and to an electrically conducing bracket welded to the housing.

Formed PCB

[0027] Broadly speaking, the embodiments disclosed herein describe printed circuit board (PCB) well suited for use in consumer electronic devices, such as laptops, cellphones, netbook computers, portable media players and tablet computers. In particular, PCB designs are described that address packaging issues that can result when a light-weight consumer electronic device with a thin and compact enclosure is used. Methods for designing and forming the PCBs and illustrative embodiments of PCBs are described.

[0028] In one embodiment, the consumer electronic device can be a thin portable electronic device with a display. The internal arrangement of the components of the thin portable electronic device within its enclosure can be viewed as a number of stacked layers where the display including its display driver circuitry and the battery occupy some of the stacked layers. The remaining components, such as but not limited to a CPU, memory, audio components, a wireless interface, data connectors, power connectors and associated circuitry can be arranged to fit in unoccupied layers adjacent to the display, display circuitry and the battery or in portions of layers occupied but not totally utilized by these components. In particular, PCB designs are described that can allow various electrical components to be fitted and connected to one another in the odd spaces that can result in the device enclosure after the larger devices components are placed and secured within the enclosure.

[0029] In a particular embodiment, a relatively thin multi-layered PCB for use in a portable computing device can be provided. The multi-layered PCB can be formed in a planar configuration. During assembly of the portable computing device, the PCB can be bent in certain regions to allow it to be installed in a non-planar configuration. The bending capabilities can be used more efficiently fit the PCB within available spaces remaining in the enclosure after larger components, such as the battery are installed.

[0030] The multi-layered PCB can include a number of substrate layers and a number of trace layers wherein each trace layer is formed on top of a substrate layer. To form a trace layer, a solid layer of a conductive material, such as copper, can be deposited on top of a substrate layer and then portions of the solid layer can be removed to form conductive traces. For a PCB installed in a non-planar configuration, in regions where more bending forces are anticipated, the conductive traces can be made thicker. The conductive traces can be used to join components electrically coupled to the PCB. The components can be located on a top and/or bottom side of the PCB to fit in an available space or connect to other internal components as needed. [0031] The stiffness of the multi-layered PCB can be locally adjusted to allow the board to be more amenable to bending in particular regions and more resistant to bending in other areas. Typically, a trace layer only includes traces used to join the components coupled to the PCB board where the excess material not used to form traces is removed. In one or more of the trace layers excess material can be used to change the stiffness properties of the PCB. For instance, excess trace material can be preserved in some trace layer areas to increase the overall stiffness of the PCB proximate to these areas and removed in other areas to increase the flexibility of the PCB.

[0032] In particular embodiments, one of the trace layers can be dedicated solely to adjusting the stiffness properties of the PCB. The material of the trace layer can be selected primarily for its stiffness properties rather than for its conductive properties. In this layer, portions of the layer can be removed to decrease the stiffness of the PCB and increase the flexibility of the PCB proximate to where the material is removed. In one embodiment, a shape memory alloy, such as nitonol, can be used.

[0033] In one embodiment, a main logic board can be formed from the multi- layered PCB. The main logic board can include a first rectangular portion joined to a second rectangular portion via a narrow connecting portion. Components such as a processor, a memory and an audio codec can be coupled to the main logic board. The main logic board can be shaped to fit in spaces above and below a top and bottom portion of the battery and along a side of the battery that remain after the battery is installed in an enclosure of the portable computing device. The main logic board can be installed in a planar or a non-planar configuration.

Porting Audio Using A Connector in A Small Form Factor Electronic Device

[0034] A personal media device includes at least a housing, the housing having a plurality of openings at least one of which accommodates a housing port arranged to output a first portion of audible energy generated by an audio generator included in the housing and at least another one of which is an alternative port used to broadcast a second portion of the audible energy generated by the audio generator. When at least a portion of the housing port is blocked, then at least some of the first portion of the audible energy is re-directed to the alternative port preserving a perception that an audio output level of the outputted audio energy remains substantially unchanged. [0035] In one aspect of the described embodiment, the alternative port is incorporated into a connector opening in such a way that the alternative port remains substantially unseen by a user of the personal media device. In yet another aspect, the connector opening accommodates a data connector whereas in still another aspect, the connector opening accommodates an audio jack.

[0036] A method described in the embodiments can be carried out by performing at least the following operations. Providing a housing, the housing having a size and shape suitable for enclosing a plurality of operational components used to provide functionality for a personal media device, attaching a speaker assembly to an interior of the housing, configuring a first air path acoustically coupling the speaker assembly to the external environment by way of a first audio output port, configuring a second air path between the speaker assembly and a second audio output port independent of the first audio output port such that the first audio output port and the second audio output port are physically located such that when one of the audio output ports is blocked by an object, at least the other audio output port remains unblocked, and cooperatively passing audible sound generated by the speaker assembly to the external environment using the first and the second audio ports.

[0037] An integrated audible sound output system incorporated in a personal media device is described. In the described embodiments, the personal media device includes at least a processor, an audio circuit, and a data retention unit that includes at least an audible sound generator unit. The audible sound generator unit is arranged to produce audible sound in accordance with audio data retrieved from the data retention unit, decoded by the audio circuit, and processed by the processor. The integrated audible sound output system includes a first audio output port, the first audio output port acoustically coupled with the audible sound generator unit by way of a first air path. The system also includes a second audio port that is acoustically coupled with the audible sound generator unit by way of a second air path. The first and the second air paths cooperate to pass the audible sound generated by the audible sound generator unit to the external environment by way of the first audio port and the second audio port.

[0038] In another embodiment, non-transitory computer readable medium for storing a computer program executed by a processor and used in a computer aided assembly of a personal media device is described. The computer readable medium includes at least

computer code for providing a housing, the housing having a size and shape suitable for enclosing a plurality of operational components used to provide functionality for a personal media device, computer code for attaching a speaker assembly to an interior of the housing, computer code for configuring a first air path acoustically coupling the speaker assembly to the external environment by way of a first audio output port, and computer code for configuring a second air path between the speaker assembly and a second audio output port independent of the first audio output port such that first audio output port and the second audio output port are physically located such that when one of the audio output ports is blocked by an object, at least the other audio output port remains unblocked. During operation of the personal media device, the first air path and the second air path cooperatively pass audible sound generated by the speaker assembly to the external environment using the first and the second audio ports.

[0039] Broadly speaking, the embodiments disclosed herein describe a modular material antenna assembly that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then

[0040] In another embodiment, a method for assembling a portable electronic device is provided. In this embodiment, an electrically conductive housing is provided. Then, an electrically non-conductive frame is glued to an interior of the electrically conductive housing, forming an integrated structure. The electrically non- conductive frame is formed of a frame material having a first dielectric constant. Then, an antenna block is secured to the frame by interlocking a portion of the antenna block having a first shape with a portion of the frame having a second shape corresponding to the first shape. The antenna block is formed of an antenna block material having a second dielectric constant substantially less than the first dielectric constant. An antenna flex is then supported by the antenna block.

[0041] In another embodiment, a computer readable medium is provided having computer code for affixing an electrically non-conductive frame to an interior of an electrically conductive housing, forming an integrated structure, wherein the electrically non-conductive frame is formed of a frame material having a first dielectric constant. This may include computer code for controlling robotic arms to glue the electrically non-conductive frame to an interior of the electrically conductive housing. The computer readable medium may also include computer code for securing an antenna block to the frame by interlocking a portion of the antenna block having a first shape with a portion of the frame having a second shape corresponding to the first shape. This may include computer code for controlling robotic arms to perform the interlocking. The computer readable medium may also include computer code for causing the antenna flex to be mechanically supported by the antenna block. This may include computer code for controlling an automatic screwdriver to screw in the antenna feed to the antenna block and to an electrically conducing bracket welded to the housing.

[0042] Other aspects and advantages will become apparent from the following detailed description taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The described embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

Compact Folded Configuration for Integrated Circuit Packaging

[0044] Figure 11 A is a perspective drawing of a foldable memory device in a first pre-assembled configuration in accordance with the described embodiments. [0045] Figure 1 IB is a perspective drawing of a foldable memory device in a second pre-assembled configuration in accordance with the described embodiments.

[0046] Figure 11C is a perspective drawing of a flexible circuit connector for a foldable memory device in accordance with the described embodiments.

[0047] Figure 12 shows a top view of a foldable memory device coupled to a printed circuit board (PCB) in an assembled configuration in accordance with the described embodiments.

[0048] Figure 13 shows a cross section of a portable computing device including a foldable memory device in accordance with the described embodiments.

[0049] Figure 14 shows a top view of a foldable memory device coupled to a printed circuit board (PCB) in a pre-assembled configuration in accordance with the described embodiments.

[0050] Figures 15A-15C show perspective views of a foldable memory device coupled to a PCB and attached to a metal frame using different attachment methods in accordance with the described embodiments.

[0051] Figures 15D show perspective views of a foldable memory device coupled to a PCB where contacts associated with the foldable memory device are grounded using a conductive tape in accordance with the described embodiments.

[0052] Figure 16 shows a perspective view of a foldable memory device coupled to a PCB in a pre-assembled configuration accordance with the described

embodiments.

[0053] Figure 17 is a flow chart of a method of assembling a portable computing device including a foldable memory device in accordance with the described embodiments.

[0054] Figure 18A shows a top view of a portable electronic device in accordance with the described embodiments.

[0055] Figure 18B shows a bottom view of a portable electronic device in accordance with the described embodiments.

[0056] Figure 18C is a block diagram of a media player in accordance with the described embodiments.

Internal Frame Optimized for Stiffness and Heat Transfer

[0057] Figure 21 A shows a top view of a portable electronic device in accordance with the described embodiments. [0058] Figure 21B shows a bottom view of a portable electronic device in accordance with the described embodiments.

[0059] Figure 21C shows block diagram of a portable electronic device in accordance with the described embodiments.

[0060] Figure 21D shows a cross-sectional view of a portable electronic device in accordance with the described embodiments.

[0061] Figures 22A and 22B show top and bottom views of an internal frame in accordance with the described embodiments.

[0062] Figure 22C shows a top view of an internal frame in accordance with the described embodiments.

[0063] Figures 23A-23B shows a cross-sectional view of the internal frame in accordance with the described embodiments.

[0064] Figures 24A-24B shows a cross-sectional view of the internal frame thermally linked to a number of device components in accordance with the described embodiments.

[0065] Figure 25 is flow chart of a method of manufacturing a portable electronic device with an internal frame designed with specific thermo structural properties in accordance with the described embodiments.

[0066] Figure 26 is a block diagram of a portable computing device configured as a media player in accordance with the described embodiments.

Composite Microphone Boot to Optimize Sealing and Mechanical properties

[0067] Figures 31A-31C show perspective views of a microphone assembly including a microphone and a microphone boot in accordance with the described embodiments.

[0068] Figure 32A-32B shows perspective views of a microphone assembly in different orientations in a housing of a portable computing device in accordance with the described embodiments.

[0069] Figures 33A-33B show a side view of a microphone assembly in a pre- installed and installed position in a housing in accordance with the described embodiments.

[0070] Figure 33C shows a side view of a microphone assembly in a housing that is responding to an externally applied force. [0071] Figures 34A-34D show cross-sections and a top view of a composite microphone boot in accordance with the preferred embodiments.

[0072] Figure 35 is a flow chart of a method of manufacturing a portable computer device including a composite microphone boot in accordance with the preferred embodiments.

[0073] Figure 36A shows a top view of a portable electronic device in accordance with the described embodiments.

[0074] Figure 36B shows a bottom view of a portable electronic device in accordance with the described embodiments.

[0075] Figure 36C is a block diagram of a media player in accordance with the described embodiments.

Modular Material Antenna Assembly

[0076] Figure 41 shows a perspective top view illustrating a representative consumer product in accordance with the described embodiments.

[0077] Figure 42 shows a perspective top view of a modular material antenna assembly in accordance with one embodiment.

[0078] Figure 43 shows a first cross section of a modular material antenna assembly in accordance with one embodiment.

[0079] Figure 44 shows a second cross section of a modular material antenna assembly in accordance with one embodiment.

[0080] Figure 45 shows an expanded view of a top perspective view of a modular material antenna assembly in accordance with one embodiment.

[0081] Figure 46 depicts an alternative interlocking shape in accordance with an embodiment.

[0082] Figure 47 depicts an alternative locking shape in accordance with another embodiment.

[0083] Figure 48 depicts an alternative interlocking shape in accordance with an embodiment.

[0084] Figure 49 depicts an alternative locking shape in accordance with another embodiment.

[0085] Figure 50 is a flow diagram depicting a method for assembling a portable electronic device in accordance with one embodiment. [0086] Figure 51 is a block diagram of a portable consumer device according to one embodiment of the invention.

Formed PCB

[0087] Figures 61 A and 6 IB show a perspective view of a portable computing device and a block diagram of the portable computing device in accordance with the described embodiments.

[0088] Figures 62A, 62B and 62C show a perspective view and side views of a bendable main logic board in accordance with the described embodiments.

[0089] Figures 63A, 63B and 63C show a perspective view, a top view and a bottom view of a bendable PCB in accordance with the described embodiments.

[0090] Figures 64A-64C show top views of a bendable PCB in various bend configurations.

[0091] Figures 65A-65E show side views of a bendable PCB in various bend configurations.

[0092] Figure 66A shows a side cross section of a multi-layered PCB.

[0093] Figures 66B shows top views of two trace layers in the multiplayer PCB of Figure 66A.

[0094] Figure 67 is a flow chart of a method of manufacturing a portable computer device using a multi-layered PCB.

[0095] Figure 68 is a block diagram of portable computing device with media playing capabilities in accordance with the described embodiments.

Porting Audio Using A Connector in A Small Form Factor Electronic Device

[0096] Figures. 71 - 72 are perspective diagrams showing various views of fully assembled personal media device in accordance with an embodiment of the invention.

[0097] Figure 73 shows a cross-sectional view of a portable electronic device.

[0098] Figure 74 shows an enlarged view of a portion of housing shown in Fig. 2 viewed in a head on perspective.

[0099] Figure 75 is a side view of the portion of the housing shown in Fig. 5 highlighting a relationship between an output audio port and a sound reflecting surface.

[0100] Figure 76 shows a view of interior portion of personal media device in accordance with the described embodiments. [0101] Figure 77 shows a close up view of a portion shown in Fig. 6.

[0102] Figure 78 shows a cross sectional view along line A-A of Fig. 6.

[0103] Figure 79 shows another embodiment where an audio jack is used to port audible sound.

[0104] Figure 80 details a flow chart describing a process in accordance with the described embodiments.

[0105] Figure 81 is a block diagram of an arrangement of functional modules utilized by a portable media device.

[0106] Figure 82 is a block diagram of a media player suitable for use with the described embodiments.

DETAILED DESCRIPTION OF THE DESCRIBED EMBODIMENTS

[0107] In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art that the described embodiments can be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order to avoid unnecessarily obscuring the underlying concepts.

Compact Folded Configuration for Integrated Circuit Packaging

[0108] In the following figures, a packaging design for utilizing multiple memory chips is described that can overcome the disadvantages described in the preceding paragraphs. The packaging design can be referred to as a "foldable memory device." The packaging design allows a memory device including a number of memory chips connected by a flexible circuit connector to be simply installed in a portable computing device. The flexible circuit connector can be used to provide data and/power connections for the memory device and for RF shielding purposes. Using the flexible circuit connector for RF shielding in lieu of a separate metal shield helps to reduce the over thickness profile of the memory unit and can also simplify the assembly process because a need to install a separate metal RF shield can be eliminated.

[0109] These and other embodiments are discussed below with reference to

Figures 11-18C. Nevertheless, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting. In particular, with respect to Figures 11A-11C, a foldable memory device and its associated components in two different pre-assembled configurations is described. Then, a foldable memory device in its final assembled and installed configuration is discussed in regards to Figures 12 and 13. With respect to Figures 14 and 16, foldable memory device configurations are described that can occur during the assembly process prior to a final configuration of the foldable memory device being reached. The different foldable memory device configurations can be obtained by folding or bending the flexible circuit connector portion of the foldable memory device at different locations.

[0110] With respect to Figures 15A-15D, different methods of grounding the flexible circuit connector portion of the foldable memory device are described. The flexible circuit connector can be grounded to allow it to be used as part of a faraday cage surrounding the foldable memory device. A method of assembling a portable computing device including a foldable memory device is described with respect to Figure 17. Perspective views of a portable electronic device that can include a foldable memory device are described with respect to Figures 18A-18B. Finally, a block diagram of a portable media device that can include a foldable memory device is discussed with respect to Figure 18C.

[0111] Figure 11 A is a perspective drawing of a foldable memory device 1100 in a first pre-assembled configuration in accordance with the described embodiments. When installed, the foldable memory device 1100 can be used as part of a memory unit for a portable computing device. A foldable memory device, such as 100, can include two or more memory chips. The memory chips can be attached to flexible circuit connector, such as 1112. In one embodiment, the memory chips can be flash memory nand chips.

[0112] In Figure 11 A, two chips, 1102 and 1104, are shown attached to a top surface 1112a of the flexible circuit connector 1112. In Figure 11C, the top surface 1112a of the flexible circuit connector 1112 is shown without the two chips attached. The flexible circuit connector 1112 (also referred to as a "flex connector") can include traces that bring power to each of the chips, such as 1102 and 1104 and allow data communications between the chips and other devices, such as a main logic board.

[0113] In one embodiment, the flex connector 1112 can include components, such as 1110, that extend from the top surface 1112a. The components 110 are located on a flap portion 1112f of the flexible connector. In particular embodiments, the components 1110 can be part of a data interface that allows communication between the flex connector and a remote device, such as a main logic board and a power interface that brings power to the flex connector 1112.

[0114] The chips, such as 1102 and 1104, can include data and power interfaces that are coupled to data and power interfaces on the flex connector 1112. In one embodiment, the data and power interfaces (not shown) can be soldered to the data and power interfaces (not shown) on the flex connector 1112. For instance, the flex connector 1112 can include on its top surface 1112a data and power interfaces to which corresponding interfaces on a bottom surface of chips, such as 1102 and 1104, can be soldered. In addition to soldering, other bonding mechanisms can be used to attach the chips to the top surface 1112a of the flex connector 1112. For instance, a liquid adhesive or an adhesive tape can be used to further attach each of the chips 1102 and 104 to the flex connector 1112.

[0115] The flex 1112 can also include a number of shielding traces that allows the flex to act as a part of a faraday cage. The shielding traces can be coupled to connector pads, such as 1106. As is described in more detail with respect to Figures 13, 14 and 15A-15C, the connector pads can be coupled, such as taped or soldered, to other conductive components to form a faraday cage that surrounds the chips when they are installed in the portable computing device. The faraday cage can prevent RF signals generated from the chips from interfering with other components of the portable computing device. For instance, the portable computing can include an antenna and the faraday cage can prevent RF signals generated by the chips from reaching the antenna.

[0116] The chips, such as 1102 and 1104, can be attached to the flex connector 1112 such that they separated by some length of flex connector, such as 1112c. The portion of the flex connector between two chips can be referred to as a "separating portion." The separating portion 1112c can be bent and/or twisted in different directions during the installation of the foldable memory device to enable one or more different configuration of the foldable memory device. For instance, the separating portion 1112c can be bent and/or twisted in one manner when the first chip is attached to a printed circuit board during a first installation step and then can be bent and/or twisted in a different manner when the top surface 1102a is bonded to the top surface of 104a during a second installation step. [0117] The distance 1105a between the chips can be selected to allow the flex connector to be wrapped around various components and/or to conform to different surfaces. For instance, as is shown in Figures 13 and 14, the separating portion 1112c of the flex connector 1112 can be wrapped around a PCB board and a metal frame. In various embodiments, the distance 1105a can be adjusted to account for

discontinuities in the surface that it is wrapped around, such as a component sticking out from the surface. For instance, as is shown in Figures 14, the PCB board is at a different height relative to the metal frame. If desired, the separating portion 1112c can be bonded in some manner to the intervening surfaces such that it conforms to these surfaces. Whether or not, the separating portion is to conform to the intervening surfaces and a topology of the intervening surfaces can affect the distance 1105a between the chips selected for use in a particular foldable memory device design.

[0118] A width 1105b of the separating portion 1112c is shown as approximately the width of the chips, 1102 and 1104. In various embodiments, the width 1105b can be greater or less than the width of the chips. For instance, in one embodiment, the width 1105b of the separating portion 1112c between the chips can be narrowed to allow the separating portion to be more easily twisted or bent. In another embodiment, one or more apertures can be placed in the separating portion 1112c. When wrapped around an intervening surface, an aperture can allow a component extending from the intervening surface to extend through the aperture as opposed to having the separating component go over the extended component. Designed in this manner, the separating portion 1112c can conform better to the surfaces surrounding the extended

component.

[0119] In one embodiment, the separating portion 1112c on the flex connector 1112 between the chips 1102 and 1104 can be folded, such as along line 1108, to allow the top surface 1102a of chip 1102 to be aligned and bonded to a top surface 1104a of chip 1104. In Figure 11B, a perspective drawing of the flex connector 1112 including the chips, 1102 and 1104, after a folding is shown. In Figure 11B, the flex connector 1112 is folded over along line 1108 to reveal a bottom surface 1112b of the flex connector 1112. In a particular embodiment, the first and second chips can be the same size and the two chips can be aligned directly on top of one another in a stacked configuration such that corners of each chip are proximately aligned. If desired, the two chips can be bonded together in this configuration. In Figure 11B, the chips are shown in a configuration where they are not yet directly aligned and additional alignment is needed to directly align the chips.

[0120] In other embodiments, the flex connector can be folded and the chips can be aligned and bonded in an overlapping stacked configuration where the chips are not directly on top over one another. In this configuration, a portion of the top surface 1104a of chip 1104 can hang over the edge of the top surface 1102a of chip 1102. In other embodiments, the chips, 1102 and 1104, can be of different sizes. In this embodiment, after folding, the chips can be stacked and aligned such that the smaller chip is centered on the larger chip. An off-center stacked alignment configuration can also be employed. For instance, one or more outer edges of the smaller chip can be aligned with one or more outer edges of the larger chip.

[0121] Figure 12 shows a top view of a foldable memory device 1100 coupled to a printed circuit board (PCB) 1214 in an assembled configuration in accordance with the described embodiments. The foldable memory device 1100 can be a component of assembly 1200. The assembly 1200 can include the PCB 1214 and a number of other components, such as a main logic board that can be located below the shield lid 1206. The assembly 1200 can be attached to an enclosure of a portable computing device via a number of different attachment points, such as attachment points 1215.

[0122] When folder over, the flap portion 1112f of the foldable memory device 1100 can be attached and grounded to the shield lid 1206. Flap portions 1112d and 1112e of the foldable memory device 1100 can include connector pads. These portions can be folded over to allow the connector pads to be grounded to a metal frame (see Figures 13 and 14) that surrounds the foldable memory device 1100. As described above, when grounded, various portions of the flex connector and other metal components, such as the metal frame and the shield lid 1206 can be part of a faraday cage that surrounds the chips.

[0123] The separating portion 1112c of the flex connector 1112 is shown folded in two places. The first fold is proximate to the bottom of the PCB 1214. The second fold is proximate to the height of the shield lid 1206. The separating portion 1112c is not made to conform to the small ledge of the PCB 1214 that extends from the metal frame. Thus, there can be a gap between the flex circuit and the metal frame. In other embodiments, the separating 1112c can be attached to the ledge so that the separating portion 1112 better conforms to this intervening surface. [0124] Figure 13 shows a cross section of a portable computing device including a foldable memory device. An outer perimeter of the portable computing device can be formed from a cover glass 1216 and the housing 1208. A display 1218 and associated circuitry, such as a display driver, can be located below the cover glass 1216. The assembly 1200 including the PCB 1214 and the foldable memory device 1100 can be located below the display circuitry. In one embodiment, the assembly 1100 can be installed such that the top of shield lid 1206 and a bottom surface 1112b of flex connector 1112 are each facing an inner surface of the housing 1208.

[0125] In the installed configuration of the foldable memory device, the first chipl02 and the second chip 1104 are shown stacked on top of one another where the first 1102 and the second chip 1104 are proximately the same size and are aligned right on top of each other. As previously described, the first chip 1102 and the second chip 1104 can be shifted to the left or the right relative to one another resulting in an overhang if desired.

[0126] The flap portion 1112f of the flex 1112 can be attached to the shield lid 1206. The flap portion can include connector pads that are grounded to the shield lid 1206. The flap portion 1112e can be attached to an outer surface portion of the metal frame 1210 to ground the flex to an outer surface of the metal frame 1210. In other embodiments, the flap portion 1112e of the flex 1112 can be attached to an inner surface of the metal frame 1210 (see Figure 15A).

[0127] The outer surface of the flex 1112 below the stacked chips is shown at a slightly lower height than the shield lid 1206 relative to a height above the inner surface of the housing 1208. In other embodiments, the height of the stacked chips and the flex can be higher than the height of the shield. Further, the stacked chip configuration can include two or more chips and is not limited to the two chips shown in Figure 13.

[0128] Typically, a shield lid that is used as part of a faraday cage can be formed from an electrically conductive metal, such as stainless steel. A flex connector, such as 1112, can be about 1/6 as thick as the shield lid formed from stainless steel. Thus, using a flex connector instead of a metal shield can create additional space that can be used for other purposes in the packaging design. For instance, the additional space can be used to increase a size of the battery that is employed or thicken a structure that is used to increase a stiffness of the device. [0129] Figure 14 shows a top view of a foldable memory device coupled to a printed circuit board (PCB) 1214 in a pre-assembled configuration. In one

embodiment of an installation step, the first chip 1102 can be placed within the metal frame 1210 and coupled to the PCB 1214, such as via surface mount adhesion. A temporary fence 1224 can be provided to the first chip in place while it is secured to the PCB. While the first chip 1102 is being attached to the PCB 1214, the separating portion 1112c of the foldable memory device 1100 can be unfolded and placed to the side such that the foldable memory device is in a relatively flat configuration.

[0130] In an embodiment of a second installation step, after the first chip of the foldable memory device 1100 is secured to the PCB 1214, the separating portion 1112c of the foldable memory device 1100 can be folded over the intervening surfaces consisting of the side of the PCB 1214 and a side of the metal frame 1210 such that the chip 1104 and its associated portion of the flex connector is flipped over. After being flipped, the flex components 1220 on the flap portion 1112f can be aligned to fit into each of the apertures 1222 in the metal shield lid. In one

embodiment, the flex components 1220 can be part of the data and power interfaces to the flex connector 1112.

[0131] The foldable memory device can be configured such that, when the flex components 1220 are aligned with the apertures 1222, the two chips, 1102 and 1104, are proximately aligned in a stacked configuration. A bonding agent, such as a double-side tape adhesive or a liquid adhesive, can be applied to secure the two chips in a stacked configuration as previously described with respect to Figures 12 and 13. Then, flap portions, such as 1112e, which include connector pads, can be grounded to another portion of the faraday cage, such as a side of the metal frame 1210. A number of different approaches can be applied to secure the connector pads on the flap portions of the flex 1112 to the other portions of the faraday cage. These approaches are described with respect to Figures 15A-15C.

[0132] In one embodiment, the chips in the foldable memory device are stacked within a metal frame. In this configuration, connector pads on flap portions of the flex connector are attached to the metal frame to ground the flex connector and form a faraday cage around the chips on the foldable memory device. Figures 15A-15C show perspective views of a foldable memory device coupled to a PCB that is attached to a metal frame using different attachment methods in accordance with the described embodiments.

[0133] In Figure 15 A, the connector pads, which can be formed from a conductive metal, such as copper, can be tucked on the inside of the metal frame 1210. Then, the connector pads can be soldered to the metal frame 1210 along a top edge 1226. In another embodiment, solder paste can be applied to the connector pads and then the connector pads and the paste can be tucked on the inside of the metal frame. Next, the metal frame can be heated to melt the solder paste and bond the connector pads to the inside of the metal frame 1210. The solder paste can also be placed between the inside of the metal frame and connector pads after the flap portion of the foldable memory device including the connector pads has been tucked inside the metal frame.

[0134] In a particular embodiment, as is illustrated in Figure 15B, the flap portion 1228 of the foldable memory device can be folded over the outside of the metal frame where a conductive adhesive, such as a conductive adhesive tape, is applied to bond the connector pads to the outside of the metal frame. Pressure can be applied to the flap portion 1228 to ensure a bond is formed. In yet another embodiment, as is shown in Figure 15C, solder paste can be applied between the connector pads and the outside of the metal frame and the connector pads 1228 and heat can be applied to solder the connector pads to the metal frame.

[0135] A foldable memory device can include multiple flap portions including metal connector pads. In some embodiments, one flap can be tucked inside a metal component, such as a metal frame, and bonded to the inside of the metal while another flap can be folded over the outside of a metal component and bonded to an outside of the metal components, such as the top of a shield lid or an outside portion of a metal frame. The connector pads can be located on a top surface or a bottom surface of the flex connector depending on how the flexible connector is folded and according to which surface (e.g., an inside surface or and outside surface) that the connector pads are to be bonded. As described above, the flap portions can be bonded to a surface using a conductive adhesive, such as a conductive tape or solder.

[0136] Figures 15D show perspective views of a foldable memory device coupled to a PCB where contacts (e.g., connector pads 1240) associated with the foldable memory device are grounded using a conductive tape 1230 in accordance with the described embodiments. In one embodiment, a flap portion, such as 1112f, on the flex connector of a foldable memory device can include connector pads 1240 on one side and components on the other side (the components 1220 are shown in Figure 14). In the embodiment described in Figure 14, the foldable memory device is folded over so that the components 1220 on flap portion 1112f fit through apertures in the shield lid 1206. If the flap portion 1112f did not include components, then the flap portion could be placed over the top of the shield lid such that it rested on the top of the shield lid. In this embodiment, the connector pads can be placed on the opposite side flex connector such that they face the shield lid 1206.

[0137] When the flap portion is placed on top of the shield lid, as is shown in Figures 15 A, 15B or 15C, connector pads can be left exposed. As is shown in Figure 15D, the exposed connector pads 1240 can be covered with a conductive tape, such as 1230, to ground the exposed connector pads to the another component, such as a top of shield lid 1206. The connector pads 1240, when grounded in this manner, can allow a portion of the flex connector on the foldable memory device to be used as a portion of a faraday cage.

[0138] Figure 16 shows a perspective view of a foldable memory device coupled to a PCB in a pre-assembled configuration accordance with the described

embodiments. In this embodiment, the foldable memory device includes four chips, 1202, 1203, 1204 and 1205, attached to a flex connector. The chips can be a different size than the previously described chips. For instance, the chip can be thinner, such as about ½ the thickness, of the previously described chips, such that when 1202, 1203, 1204 and 1205, are stacked on top of one another, the stack is about the same height as the stack including only chips 1102 and 1204.

[0139] In one embodiment, a first chip in the foldable memory device, such as 1202, can be attached to a PCB, such as 1214. Then, in one embodiment, a separating portion 1212d of the flex connector can be folded over and chip 1203 can be bonded to chip 1202. Next, separating portion 1212e can be folded over and chip 1205 can be bonded to chip 1204. These steps can also be reversed, i.e., chip 1205 can be first bonded to chip 1204 and then chip 1203 can be bonded to chip 1202.

[0140] After chips 1202/1203 and 1204/1205 are bonded together, a separating 1212c portion of the flex connector between chips 1202 and 1204 can be folded over and the chip stack 1204/1205 can be bonded to the chip stack 1202/1203. The components 1220 on the flex connector on the bottom of chip 1204 can be aligned such that the components fit through the apertures 1222. Then, flap portions on the flex connector on the bottom surface of chip 1204 can be bonded and grounded to other metal components, such as the metal frame and shield lid to form a faraday cage around the stacked chips, as previously described.

[0141] In another embodiment, the folding of the foldable memory device can be carried out in a different order (The folding steps can vary depending on the foldable memory device configuration and these steps are provided for the purposes of illustration only.). For instance, the separating portion 1212e of the flex connector can be folder over and chip 1205 can be bonded to chip 1204. Then, the separating portion 1212c can be folded over and chip stack 1204/1205 can be bonded to chip 1202.

Then, the separating portion 1212d can be folded over and chip 1203 can be bonded to the chip stack 1202/1204/1205. In this embodiment, flap portions of the flex connector can be located on the bottom of chip 1203 rather than chip 1204 as is shown in Figure 16. The flap portions extending from the bottom of chip 1203 can be bonded to other metal components, such as shield lid 1206 and metal frame 1210, to form a faraday cage around the stacked chips.

[0142] The assembly steps described above using a foldable memory device can be implemented in the manufacture of a portable computing device. As an example, a method 1300 of assembling a portable computing device including a foldable memory device in accordance with the described embodiments is described with respect to Figure 17. In 1302, a plurality of memory chips, such as chips, can be connected to a flexible circuit connector. The flexible circuit connector can include power and data traces. Each of the chips can be connected to the power and data traces on the flex connector so that power can be supplied to the chips and data can be moved on or off of the chips via the data traces.

[0143] The chips can be used as part of a memory device on the portable computing device. In 1304, a first chip on the foldable memory device can be attached to an assembly that is to be installed in the portable computing device. For example, the assembly can include a printed circuit board and the first chip can be attached to the printed circuit board. The assembly can be used to secure the foldable memory device in place during operation of the portable computing device. The assembly that holds the foldable memory device can already be secured to the housing of the portable device or can be secured during a later assembly step. [0144] In one embodiment, in 1306, a separating portion between two chips can be folded over and the two chips can be aligned in a stacked configuration. In 1308, the two chips can be bonded together in the stacked configuration. In general, the folding steps can depend on the number of chips on the foldable memory device and how each chip is connected to one another via the separating portions of the flexible connector. A folding order can be affected by whether a portion of the flexible connector is to be used as part of the faraday cage because the folding order may require that each chip end up in a certain position after the folding takes places so that proper connections used to ground the flex connector can be made.

[0145] In 1310, connector pads on the flexible circuit connector can be bonded to other metal components to form a part of a faraday cage. For instance, as described above, the connector pads can be bonded to a metal frame that surrounds the chips. The faraday cage can be used to shield RF signals from leaking from the chips. For instance, the portable computing device can include an antenna and the chips can be surrounded by a faraday cage to keep RF signals generated from the chips from reaching the antenna. In 1312, when the foldable memory device surrounded by the faraday cage is not part of an assembly that already secured to the housing of the portable computing device, the assembly including the foldable memory device can be installed in the portable computing device.

[0146] In the methods described above, one or more of the steps can be implemented by a processor in a computer aided manufacturing process. For instance, a processor can be programmed that allows a robotic device to install and fold the foldable memory device. As another example, a processor can be programmed that allows a robotic device to couple the chips to the flex connector or connector pads on the flex connector to other components.

[0147] Figures 18A and 18B show a top and bottom view of a portable computing device 1400 in accordance with the described embodiments. The portable computing device can be suitable for being held in hand of a user. A cover glass 1406 and a display 1404 can be placed within an opening 1408 of housing 1402. The cover glass can include an opening for an input mechanism, such as input button 1414. In one embodiment, the input button 1414 can be used to return the portable computing device to a particular state, such as a home state. [0148] Other input/output mechanisms can be arranged around an periphery of the housing 1402. For instance, a power switch, such as 1410 can be located on a top edge of the housing and a volume switch, such as 1412, can be located along one edge of the housing. An audio jack 1416 for connecting headphones or another audio device and a data/power connector interface are located on the bottom edge of the housing. The housing 1400 also includes an aperture for a camera 1415 that allows video data to be received.

[0149] FIG. 18C is a block diagram of a media player 1500 in accordance with the described embodiments. The media player 1500 includes a processor 1502 that pertains to a microprocessor or controller for controlling the overall operation of the media player 1500. The media player 1500 stores media data pertaining to media items in a file system 1504 and a cache 1506. The file system 1504 is, typically, a storage disk or a plurality of disks. The file system typically provides high capacity storage capability for the media player 1500. However, since the access time to the file system 1504 is relatively slow, the media player 1500 also includes a cache 1506. The cache 1506 is, for example, Random-Access Memory (RAM) provided by semiconductor memory. The relative access time to the cache 1506 is substantially shorter than for the file system 1504. However, the cache 1506 does not have the large storage capacity of the file system 1504.

[0150] Further, the file system 1504, when active, consumes more power than does the cache 1506. The power consumption is particularly important when the media player 1500 is a portable media player that is powered by a battery (not shown).

[0151] The media player 1500 also includes a user input device 1508 that allows a user of the media player 1500 to interact with the media player 1500. For example, the user input device 1508 can take a variety of forms, such as a button, keypad, dial, etc. Still further, the media player 1500 includes a display 1510 (screen display) that can be controlled by the processor 1502 to display information to the user. A data bus 1511 can facilitate data transfer between at least the file system 1504, the cache 1506, the processor 1502, and the CODEC 1512.

[0152] In one embodiment, the media player 1500 serves to store a plurality of media items (e.g., songs) in the file system 1504. When a user desires to have the media player play a particular media item, a list of available media items is displayed on the display 1510. Then, using the user input device 1508, a user can select one of the available media items. The processor 1502, upon receiving a selection of a particular media item, supplies the media data (e.g., audio file) for the particular media item to a coder/decoder (CODEC) 1512. The CODEC 1512 then produces analog output signals for a speaker 1514. The speaker 1514 can be a speaker internal to the media player 1500 or external to the media player 1500. For example, headphones or earphones that connect to the media player 1500 would be considered an external speaker.

Internal Frame Optimized for Stiffness and Heat Transfer

[0153] A first factor that can be considered in the thermo structural design of a thin and compact portable electronic device can be the placement of the components associated with the user interface. After determining an outer placement of the components, factors, such as internal packaging, weight, strength and stiffness needed to protect the device during expected operational conditions, can be considered in regards to the design of the housing. Then, thermal issues, such as preventing internal hot spots from developing can be considered. These design factors, when considered together, can each affect one another. Thus, the design of the device can be an iterative process.

[0154] As an illustration of the thermostructural design process for a portable device, a device design is discussed in view of the factors described in the preceding paragraphs. Typically, a portable device can include a display. The display and an input mechanism can usually be placed on one face of the device. If desired, a thin- profile housing can be specified that surrounds and encloses all but the portion of the display visible to the user. The face opposite the display can be mostly structure associated with housing but can include apertures for other input devices, such as a camera.

[0155] Along the edges of the housing, various input/output mechanisms can be placed, such as volume switches, power buttons, data and power connectors, audio jacks and the like. The housing can include apertures to accommodate the

input/output mechanisms. The locations at which the input/output mechanisms are placed can be selected to enhance the usability of the interface under conditions for which the device is intended to operate. For instance, for a device intended to be operated with a single hand, the input mechanisms, such as an audio control switch, can be placed at a location that are easily finger operated while the device is held in the palm of the hand. Further, output mechanisms, such as an audio jack, can be placed at locations that do not interfere with holding the device, such as on a top edge of the device.

[0156] Once the components of the user interface are placed, device components that connect to and allow the portable electronic device to operate for its intended functions can be packaged within the enclosure. Examples of internal device components can include speakers, a microphone, a main logic board with a processor and memory, non- volatile storage, data and power interface boards, a display driver and a battery. Some flexibility can be afforded in regards to the locations of the internal device components as long as sufficient space for needed connectors between components is available. Also, approaches, such as custom-shaped PCBs or batteries, can be employed to allow available internal spaces to be efficiently utilized.

[0157] Once the user interface has been designed and the internal components are packaged in a suitably compact housing, thermal issues can be considered. Many internal components generate heat. To prevent the heat from building up in certain locations and possibly damaging the internal components, mechanisms may be needed to dissipate and conduct heat internally. The compact design of these devices can leave little room for convective cooling, i.e., allowing air to circulate in the device to dissipate heat. Thus, other approaches may be needed to address internal cooling issues.

[0158] One approach to solving the cooling problem can be to provide one or more structures configured to conduct heat away from and to different internal locations within the device. Besides being used for cooling, the structures can also be used to enhance to the structural properties of the device, such as adding to the overall stiffness of the device. In particular embodiments, internal frames designed to satisfy thermal and structural constraints associated with the design and operation of a portable electronic device are described. The internal frames can be configured to conduct and dissipate heat generated within the enclosure. Further, the internal frames can be configured to add to the over-all strength of the device.

[0159] The thermo structural design of these internal frames and their use in portable electronic devices are discussed below with reference to Figures 21A-26. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting. In particular, with respect to Figures 21A-21D, an overall configuration of a portable electronic device is described. The device can include an internal frame with heat conduction capabilities configured to satisfy thermal and structural constraints associated with the design and operation of the device, which is discussed. In Figures 22A-22C, various embodiments of the internal frame are shown and discussed. With respect to Figures 23A and 23B, internal structures and materials associated with the internal frames are described. A coupling of the internal frame to various device components and associated manufacturing methods are discussed in relation to Figures 24A, 24B and 25. Finally, portable computing device configured as a media player is described with respect to Figure 26.

[0160] Figure 21 A and 21B show a top and side view of a portable electronic device 210 in accordance with the described embodiments. The device 210 can include a housing 2100 that surrounds a display 2104. The housing 2100 can be designed with a relatively thin-profile. The housing 2100 provides an opening 2108 in which the display 2104 is placed. A cover glass 2106 is placed over the display 2104. The cover glass 2106 helps to seal the opening 2108. The device 210 can include a touch screen associated with the display (not shown).

[0161] A significant fraction of the area of the top face of the device 210 is occupied by the display 2104. This fraction can be smaller or larger if desired. Also, the fraction dedicated to the display can vary from device to device. In some embodiments, the device 210 may not even include a display.

[0162] As previously described above, the display 2104 can be a component in a user interface associated with the device 210. Other device components that contribute to the user interface or the over-all operation of the device 210 are distributed at various locations on the housing 2100 of the device 210. The placement of these components can affect the internal packaging and hence the location of heat generating components within the device.

[0163] As an example of an outer arrangement of the device components, an input button 2114 is located on the front face. In one embodiment, the input button 2114 can be used to receive an input indicating a desire to return the device to a particular state, such as a "home" state. A volume switch 2112 that can be used to adjust a volume associated with various audio applications implemented on the device can be located on one side of the housing 2100. A power switch 110 is located on the top side of device 210 and an audio jack and an opening for a data/power connector is located on a bottom side of the housing 2100 opposite the top side. The bottom side of the housing 2100 includes an aperture. A lens 2115 for a camera can be placed in the aperture.

[0164] Figure 1C shows a block diagram of the device 210. A display 2104, a battery 2132, a touchscreen 2122, a wireless communication interface 126, a display controller 2120, audio components 2124 (e.g., speakers), can each be coupled to a main logic board (MLB) 2105. The device 210 can include other components (not shown), such as a Sim card, a microphone and a non-volatile memory and is not limited to the components shown in Figure 21C. The MLB 2105 can include a processor and a memory. The processor and memory can execute various

programming instructions to allow the device perform various functions. The user interface, described above, can be considered to allow a user to select and adjust the various functions that are available on the device 210. In particular embodiments, these functions can be provided as user selectable application programs that are stored on the device.

[0165] Figure 21D shows a cross-sectional view of a portable electronic device 210 in accordance with the described embodiments. An enclosure can be formed from the top glass 2106 and the housing 2100. Other enclosure configuration are possible and the described embodiments are not limited to this example. As is illustrated in Figure ID, the housing 2100 can provide a cavity that is covered by the top glass 2106. The housing 2100 can include an outer surface and an inner surface where the inner contour profile 2117 of the inner surface can be different from the outer contour profile of the housing 2100.

[0166] Within an enclosure, such as an enclosure including the top glass 2106 and the housing 2100, various internal device components, such as device components associated with the user interface that allow the device 210 to operate for its intended functions, are packaged. For the purposes of discussion, the internal device components can be considered to be arranged in a number of stacked layers. The height of each of the stacked layers can be specified relative to the overall thickness 2136 of the device. For instance, a height of the middle of the top glass 2106 can be specified as a first fraction of the overall thickness 2136 while a height of the battery 2132 can be specified as a second fraction of the overall thickness 2136.

[0167] The display screen of the display 2104 can be located directly below the top glass 2106. In one embodiment, the display screen and its associated display driver circuitry can be packaged together as part of the display 2104. Below display 2104, device circuitry 2130, such as a main logic board or circuitry associated with other components, and a battery 2132, which provides power to the device 210, can be located.

[0168] As previously described and as shown in the Figure 21D, the internal components can be tightly packed leaving little room for pathways that allow cooling via air circulation to be effective for the internal components that generate heat.

Another approach to addressing internal heating issues that can be used in conjunction with or in lieu of convective air cooling is to place a thermally conductive material proximate to the heating source. The thermally conductive material can absorb and conduct heat away from an internal heat source, such as a heat generating internal device component, to lower a temperature near the heat source during operation of the device.

[0169] In one embodiment, the thermally conductive material can be incorporated into an internal structure associated with the device 210, such as internal frame 2140. The internal frame 2140, which is described in more detail with respect to the following figures, can be configured to conduct heat away from one or more device components and to add to the overall strength of the device. For instance, the internal frame 2140 can be configured to add to the overall stiffness of the device 210, such as an ability to resist bending moments experienced by the housing 2100.

[0170] In the Figure 21D, the internal frame 2140 is located in at a height below the display 2104 and above the device circuitry 2130. The internal frame 140 can be placed in this location to draw away heat generated by the display circuitry. Further, one or more heat sources associated with the device circuitry 2130 can be positioned proximate the internal frame 2140 to allow heat from these components to be conducted into the internal frame 2140 and away from the heat source.

[0171] Other packaging configurations are possible. Thus, in other embodiments, the internal frame 2140 can be located at different heights relative to the overall thickness 2136 of the device and can also be located proximate to different device components. Further, a device, such as 210, can include multiple frames, such as 2140 and described embodiments are not limited to a use of a single internal frame 2140.

[0172] In one embodiment, the internal frame 2140 can be used as an attachment point for other device components. For example, the internal frame 2140 can be attached to mounting surface, such as 2134a and 2134b, on the housing 2100 via fasteners or using a bonding agent. Then, other device components, such as the display 2104 can be coupled to the internal frame 2140 rather than directly to the housing 2100. One advantage of coupling the display 2104 to the housing via the internal frame 2140 is that the display can be somewhat isolated from bending moments associated with the housing 2100, i.e., bending moments generated on the housing can be dissipated into the internal frame 2140. Isolating the display 2104 from bending moments associated with the housing 2100 can prevent damage to the display 2104, such as cracking, from occurring.

[0173] Figures 22A and 22B show top 2142a and bottom 2142b views of an internal frame 2140 in accordance with the described embodiments. In one embodiment, the internal frame can be formed as a multi-layered sheet, such as a sheet including a number of metal layers (see Figures 23A and 23B for a cross-section of the internal frame 2140 including its different layers). In a particular embodiment, the internal frame 2140 can be formed having a middle layer of a first material sandwiched between two outer layers of a second material. The materials used in the middle layer and the outer layer can be selected for their thermal properties, such as thermal conductivity, and/or strength properties.

[0174] In one embodiment, the first material used in the middle layer can be selected primarily for its thermal properties while the second material used in the outer layers can be selected primarily for its strength properties. As an example, a middle layer of copper can be sandwiched between two layers of a stainless steel, such as Iconel.™ The thermal conductivity of the copper is about 25 times greater than the Iconel™ whereas the stainless steel is much more resistant to bending than the copper, which can be quite pliable. In one embodiment, the middle layer can make up about 50% of the thickness of the internal frame and the outer layers can each make up about 25% if the thickness of the internal frame. When the middle layer is copper and the outer layers are stainless steel, this configuration retains about 94% of the stiffness of an internal frame of the same thickness made from just stainless steel. [0175] Other combinations of material are possible and the embodiments describe herein are not limited to a combination of copper and stainless steel. For instance, other metal combinations, such as a aluminum and stainless steel, can also be employed. Further, non-metal and metal materials or different types of non-metal materials can be combined to form an internal frame, such as 2140.

[0176] In a particular embodiment, an internal frame, such as 2140, having a copper layer sandwiched between to two stainless steel layers, can be formed using a cladding process. In one implementation of a cladding process, a sheet of copper can be compressed at a high pressure between two sheets of stainless steel to join the sheets. As an example, the sheets can be squeezed with a high pressure between two rollers as part of the cladding process. The sheets formed via the cladding process can be cut to form the internal frame 2140 shown in the figures.

[0177] In metallurgy, cladding is the bonding together of dissimilar metals. It is distinct from welding or gluing as a method to fasten the metals together. Cladding can be often achieved by extruding two metals through a die as well as pressing or rolling sheets together under high pressure. The cladding process "metallurgically" bonds metals together, producing a continuous strip that can be annealed, rolled, and slit to meet very precise electrical, thermal, and/or mechanical end-use needs. Clad inlays or overlays on one or both base metal surfaces with precious or non-precious metal combinations can be provided.

[0178] In general, cladding can refer to a deposition process where one metal is coated with another metal or a substrate material, which can be non-metallic, is coated with another metal. In some cladding processes, the metal can be melted on to the substrate, such as via a laser cladding process. Thus, the embodiments described herein are not limited to a cladding process where metal sheets are joined together under high-pressures, such as via rollers.

[0179] For an internal frame, such as 2140, where the middle conductive layer is sandwiched between two outer layers with a significantly lower thermal conductivity, the outer layers can include one or more apertures that expose the middle conductive layer. The apertures can be provided to allow a better thermal link to be formed between the middle conductive layers and a heat generating component. In particular embodiments, a surface of the heat generating component can be thermally linked to the middle conductive layer via soldering material or via thermally conductive tape. Double-sided thermally conductive tapes are often used to join heat sinks to components, such as processors, in computer applications. In the embodiments described herein, the double-sided thermally conductive tape or a soldering material can be used to bond and hence thermally link a surface of a heat generating component to the internal frame 2140.

[0180] On the internal frame 2140, the position of the apertures can be selected to be close to heat generating components within the portable device. A number of apertures, 2150a-f, are shown on the top 2142a and bottom 2142b of the internal frame 2140. As is shown, the aperture locations can vary from the top 2142a to the bottom 2142b of the internal frame 2140. As is shown in Figures 22A and 22B, the aperture locations on the top 2142a are at different locations than on the bottom 2142b. Further, there are more apertures on the top 2142a than on the bottom 2142b of the internal frame 2140.

[0181] In general, the locations of apertures in outer layer of an internal frame 2140 can vary from device to device depending on the heat generating components used with each device and the internal packaging schema selected for each device. In one embodiment, the apertures can be located on only one side of the internal frame, such as only the top side or the bottom side. In another embodiments, the outer layers can be thermally conductive and the middle layer can be provided for strength, such as stainless steel sandwiched between two copper layers. In this example, apertures in the outer layer are not necessary for thermal linking purposes because a surface of a heat generating source can be directly bonded to the thermally conductive outer layers.

[0182] Figure 22C shows a top view of an internal frame 2160 in accordance with the described embodiments. In one embodiment, the internal frame 2160 can include one or more apertures, such as 2162, that go entirely through the internal frame 2160. The one or more apertures can be used to place a component, such as a connector through the internal frame 2160. In addition, apertures that go entirely through the frame 2160 can be provided to fasten the internal frame 2160 to another component, such as a device housing 2100 described with respect to Figures 21A, 21B and 21D.

[0183] As described above with respect to Figures 22A and 22B, the internal frame 2160 can include one or more apertures in its outer layers that expose a solid middle layer. In one embodiment, the apertures can be filled-in with a material the same as or different from the material used in the middle layer. Aperture 2150a is an example of a filled-in aperture. In another embodiment, the apertures may not be filled in and thus, a slight recess or cavity is possible where an aperture is provided to expose the middle conductive layer. Aperture 2164 is an example of an aperture in the outer layer of the internal frame 2160 that forms a cavity.

[0184] In one embodiment, a raised thermal connector, such as 2166, can be provided. The raised thermal connector 2166 can be formed from a thermally conductive material such as a copper. The raised thermal connector 2166 can be used to thermally link a heat source located at some height above the internal frame 2160 to a conductive layer of the internal frame, such as the middle layer. A raised thermal connector can be used when a heat generating component is located at a distance above the connector that is too large to use direct soldering to provide the thermal link. In one embodiment, the raised thermal connector 2166 can be thermally insulated via an outer insulation layer, such as 2168.

[0185] In a particular embodiment, the raised thermal connector 2166 can be coupled to the internal frame 2160 after it is formed. For example, the raised thermal connector 2166 can be soldered or taped onto the internal frame 2160. In one embodiment, when apertures are provided in the outer layers to expose a thermally conductive middle layer, a raised thermal connector 2166 can be provided at one of these locations to thermally link, via the connector, a surface of a heat generating device component to the middle layer of the device frame. An example of a raised thermal connector positioned in this matter is also described with respect to Figure 4B.

[0186] Figures 23A-23B shows a cross-sectional view of an internal frame, such as a cross-section that can be used in internal frame, such as 2150 or 2160 (Internal frame 2150 and 2160 are described with respect to Figures 22A-22C). In Figure 23A, a cross-section including three layers is shown. The three layers include outer layers 2170a and 2170b and a middle layer 2172 disposed between these two outer layers.

[0187] The thicknesses of each of the middle and outer layers can vary. In one embodiment, the thicknesses of each of the outer layers can be approximately the same. In another embodiment, the thicknesses of each of the outer layers can be different. The thickness of the middle layer can be the same or different than the thicknesses of each of the two outer layers. In a particular embodiment, the thicknesses of each of the two outer layers can be proximately the same where a combined thickness of the two outer layers is proximately equal to the thickness of the middle layer.

[0188] The thicknesses of each layer can be varied to adjust the strength, weight, and/or thermal properties of the internal frame. For instance, a stainless steel layer can be made thicker to increase an overall strength of the internal frame. In another example, a copper layer can be made thicker to increase the thermal mass of the internal frame.

[0189] A first aperture 2171a can be provided in the top outer layer 2170a and a second aperture 2171b can be provided in the bottom outer layer 2170b. The aperture 2171a in the top outer layer 2170a is shown as not filled in so that a small cavity is formed proximate to the aperture. The aperture 2171b in outer layer 2170b is shown as filled with the same material as the middle layer. A few methods for filling in an aperture, such as 2171b, are described in the following paragraph.

[0190] In one embodiment, the aperture 2171b can be totally or partially filled in during the cladding process. For instance, the outer and middle layers can be sufficiently squeezed together such that a portion of the middle layer protrudes through the aperture. In another embodiment, the apertures can be filled in after the cladding process. The apertures can be filled with a material that is the same or different than the material of the middle layer. For example, the cavity formed from the aperture can be filled with a soldering material that is provided to thermally link the middle layer 2172 to a surface of a heat generating component. As another example, the internal frame can be dipped into another material to fill in one or more of the apertures.

[0191] Figure 23B shows another embodiment of a cross section that can be utilized with an internal frame. In this embodiment, a middle layer 2172 is sandwiched between two outer layers 2170a and 2170b. However, a portion of the middle layer 2172 is somewhat thermally isolated from another portion of the middle layer. The thermal isolation is illustrated by the material 2173 that extends from the top layer 2170a to the 2170b.

[0192] In some embodiments, it may be desirable to reduce the heat transfer rate between one portion of the internal frame and another portion of the internal frame. This can be accomplished by placing a material with a lower conductivity between two portions of the thermally conductive middle layer. For instance, the middle layer 2172 can be formed from two or more separate strips of material that are sandwiched between sheets including the outer layers. During the cladding process, in the gap between the strips, the outer layers can be squeezed together to join the top and bottom layers and provide a reduced heat transfer rate between the portions of the middle layer 2172. A similar process, as described in the previous paragraph, can be employed to thermally link two layers. For instance, in Figure 23B, if the top layers are a thermally conductive material, such as copper, and the middle layer is a less conductive material such as stainless steel formed from separate strips, then, during the cladding process, the top and bottom copper layers can be squeezed together through the gaps in the stainless steel strips to thermally link the top and bottom copper layers.

[0193] Figures 24A-24B shows a cross-sectional view of an internal frame thermally linked to a number of device components in accordance with the described embodiments. A typical direction of heat transfer into the middle layer is indicated by the arrows. In Figure 24A, different device components are shown linked to a cross section of the internal frame shown in Figure 23A. In this example, the middle layer 2172 of the internal frame can be formed from a thermally conductive material, such as copper, while the outer layers can be formed from a material that is stronger than the copper, such as stainless steel. Apertures can be provided in the outer layers to expose the middle layer to allow for a better thermal link to be formed between the middle layer and surfaces of heat generating components proximate to each aperture.

[0194] In Figure 4A, controller circuitry 2186 can be located above top layer 2170a. For instance, the controller circuitry 2186 can be display circuitry as was described with respect to Figure 21D. A PCB 2180 can be located below the internal frame. The PCB 2180 can include a number of components, such as 2182a and 2182b. In one embodiment, the PCB can be a main logic board that includes a processor and a memory.

[0195] The aperture 2171a in outer layer 2170a can be located below a high heating area 2188 associated with the controller circuitry 2186. The aperture 2171a is not filled in. A thermal bridge 2184b, such as a soldering material, can be used to provide a thermal link between a surface of the device circuitry 2186 and the middle layer 2172. The use of thermal bridge, such as 2184b, can be desirable because an air gap between the high heating area and the thermal bridge can act as an insulator that prevents heat from being conducted into the middle layer. Leaving a cavity in which the thermal bridge can be placed can allow the controller circuitry to be placed closer to the internal frame since additional space between the internal frame and the surface of the controller circuitry is not needed for the thermal bridge. During operation, heat generated in the high heating area 2188 can be conducted into the middle layer 2172 and away from the high heating area 2188. Thus, the temperature proximate to the high heating area can be reduced via the internal frame.

[0196] The aperture 2171b in the outer layer 2170b is filled in. A thermal bridge 2184a is provided between a surface of the PCB component 2182a and the middle layer 2172. The thermal bridge 184a can increase a space between the PCB component 2182a and the internal frame since the aperture 2171b is filled in and does not provide a cavity in which the thermal bridge can sit. In one embodiment, the thermal 2184a bridge can be a thermally conductive adhesive, such as a double-sided adhesive tape.

[0197] When thermal bridge 2184a is used near an aperture, such as 2171b, the thermal bridge 2184a can be larger or smaller than the area of the aperture. In the example in Figure 24A, the thermal bridge is shown as being bigger than the aperture 2171b. The area of the thermal bridge, such as 2184a, can be selected to ensure that a proper bond is maintained during operation of the device.

[0198] As is shown in Figure 24A, only certain components of a PCB, such as the components that generate the most heat, may be thermally linked to the internal frame whereas less hot components may not be thermally linked to the internal frame. To illustrate this point, PCB component 2182a is shown thermally linked to the internal frame while PCB component 2182b is not shown thermally linked to the internal frame. Depending on a design of a particular board and the number of its associated components, one or more components associated with the board can be thermally linked to the internal frame.

[0199] In Figure 24B, a cross sectional view of device components thermally linked to an internal frame is shown. In the cross section illustrated in Figure 24B, a top layer 2170a of the internal frame includes two apertures that expose a thermally conductive middle layer 2172. The bottom layer 2170b does not include any apertures in this cross section. On the top layer 2170a, one of the apertures proximate to thermal bridge 2194 is filled- in while another of the apertures proximate to thermal bridge 2196 is not filled in. A PCB 2190 including a PCB component 2192 is located above the internal frame. Another device component 2195 that is not associated with the PCB 2190 is shown located above the PCB 2190.

[0200] The PCB board is orientated so that a heat generating surface of the PCB component faces the internal frame. When a thermally conductive internal frame is employed, the orientation/location of other internal components, such as a PCB, can be adjusted so that surfaces associated with heat generating components can be thermally linked to the internal frame. Further, the desire to facilitate thermal linkage between a device component on a PCB and the internal frame can also be a factor in the design of the PCB, i.e., the device component can be arranged on the PCB such that a thermal linkage is easily facilitated.

[0201] In Figure 24B, a surface of the PCB component 2192, which is a heat generating component, is shown thermally linked to the middle layer 2172 of the internal frame via thermal bridge 2194. In addition, a surface of the component 2195, which is also a heat generating component, is shown linked to middle layer 2172 of the internal frame via thermal connector 2198. The thermal connector 2198 is coupled to the middle layer 2172 and a surface of the device component 2195 via thermal bridges 2196. As previously described with respect to Figure 22C, the thermal connector 2198 can include an outer thermally insulating layer surrounding a thermally conductive core. In this example, the thermal connector 2198 is shown extending above the level of the PCB 2190 to reach the heating generating component 2195.

[0202] Figure 25 is a flow chart of a method 2200 of manufacturing a portable electronic device with an internal frame designed with specific thermo structural properties in accordance with the described embodiments. In 2202, an internal frame including a number of material layers can be configured. The configuration process can involve selecting a number of layers, a thickness of each layer and the strength and thermal properties desired for each layer. The strength and thermal properties desired for each layer can affect a material selected for each layer.

[0203] In the embodiment, where a layer selected for its thermal properties is sandwiched between two outer layers selected to add strength to the internal frame, one or more apertures can be configured in the outer layers. These apertures can be provided to allow a better thermal link to be formed between the middle layer of the internal frame and a heat generating surface of an internal device component. In 2202, a placement of these apertures can be determined.

[0204] In 2204, the internal frame with the selected aperture locations, thermal and strength properties can be generated. In one embodiment, the internal frame can be formed using a cladding process. In 2206, during the assembly process for the electronic device, surfaces associated with heat generating components within the electronic device can be thermally linked to the internal frame. In 2208, the internal frame can be mechanically linked to the housing of the electronic device. In 2210, one or more device components can be mechanically linked to the internal frame.

[0205] Figure 26 is a block diagram of a media player 2300 in accordance with the described embodiments. The media player 300 includes a processor 2302 that pertains to a microprocessor or controller for controlling the overall operation of the media player 2300. The media player 2300 stores media data pertaining to media items in a file system 2304 and a cache 2306. The file system 2304 is, typically, a storage disk or a plurality of disks. The file system typically provides high capacity storage capability for the media player 2300. However, since the access time to the file system 2304 is relatively slow, the media player 2300 also includes a cache 2306. The cache 2306 is, for example, Random-Access Memory (RAM) provided by semiconductor memory. The relative access time to the cache 2306 is substantially shorter than for the file system 2304. However, the cache 2306 does not have the large storage capacity of the file system 2304.

[0206] Further, the file system 2304, when active, consumes more power than does the cache 2306. The power consumption is particularly important when the media player 2300 is a portable media player that is powered by a battery (not shown).

[0207] The media player 2300 also includes a user input device 2308 that allows a user of the media player 2300 to interact with the media player 2300. For example, the user input device 2308 can take a variety of forms, such as a button, keypad, dial, etc. Still further, the media player 2300 includes a display 2310 (screen display) that can be controlled by the processor 2302 to display information to the user. A data bus 2311 can facilitate data transfer between at least the file system 2304, the cache 2306, the processor 2302, and the CODEC 2312.

[0208] In one embodiment, the media player 2300 serves to store a plurality of media items (e.g., songs) in the file system 2304. When a user desires to have the media player play a particular media item, a list of available media items is displayed on the display 2310. Then, using the user input device 2308, a user can select one of the available media items. The processor 2302, upon receiving a selection of a particular media item, supplies the media data (e.g., audio file) for the particular media item to a coder/decoder (CODEC) 2312. The CODEC 2312 then produces analog output signals for a speaker 2314. The speaker 2314 can be a speaker internal to the media player 2300 or external to the media player 2300. For example, headphones or earphones that connect to the media player 2300 would be considered an external speaker.

[0209] In some embodiments, a device component, such as a display, can be both mechanically and thermally linked to the internal frame. In other embodiments, a device component can be mechanically linked but not thermally linked to the internal frame. In yet other embodiments, a device component can be thermally linked to the internal frame and mechanically secured to the housing via other structural components.

[0210] In particular embodiments, the portable computing device can be assembled using a computer aided manufacturing and assembly process. The computer aided manufacturing and assembly process can involve the use of multiple devices, such as multiple devices configured in an assembly line configuration. For instance, a computer aided machine can be configured to form the apertures at different location by removing material after the cladding process or by forming apertures in the sheets prior to the cladding process. As another example, a robotic device can be configured to thermal link a heat generating component to the internal frame, such as via a soldering process.

Composite Microphone Boot to Optimize Sealing and Mechanical properties

[0211] In consumer electronic devices, such as a portable computing devices, sound recording capabilities are fairly ubiquitous. Thus, the devices typically can include a microphone of some type. Often, the microphone can be utilized in voice applications, such as digital telephony, voice over IP (VOIP) and voice memos. Also, the microphone can be used in video recording applications where video images and sounds are recorded simultaneously.

[0212] The microphone can be located within an interior of the electronic device. For instance, in a portable computing device with a housing, an interior microphone can be provided that is configured to receive sounds via an aperture in the housing. There can be a distance between the interior microphone and the aperture. Thus, a microphone boot can be used to provide a sound conduit between the aperture and the interior microphone.

[0213] In a portable computing device, it can be desirable to prevent sounds generated within or passing through the interior from mixing with sounds from an external source that have entered into the microphone boot via the aperture in the housing. For instance, if the device includes an internal speaker, then it can be desirable to prevent internally generated sounds from the speaker from overwhelming externally generated sounds received by the microphone via the microphone boot. In addition, when the externally generated sounds that have entered into the microphone boot are acoustically isolated from other sound sources, then methods, such as echo cancellation can be more easily used. In telephony, echo cancellation describe the process of removing echo from a voice communication in order to improve voice quality on a telephone call. Application of echo cancellation can require knowledge of the acoustic environment, such as the acoustic environment in the microphone boot, which is more easy to determine when the microphone boot is acoustically isolated.

[0214] The interior of the microphone boot can be acoustically isolated by forming the microphone boot from a relatively sound-proof material and by providing a good airtight seal at both ends of the microphone boot. Seal integrity can be affected by the material or materials used to form the microphone boot and an approach used to secure the microphone boot. For example, the microphone boot can be secured in a manner such that pressure is maintained on the seals, which helps to preserve seal integrity of the seals at each end of the microphone boot.

[0215] The seal integrity can be affected by a relative hardness of a material used to form the microphone boot. An advantage of a harder material is that it can provide a good platform for establishing a seal at each end of the microphone boot. A disadvantage of a harder material is that it can more easily transmit externally generated forces, such as force generated when a device is dropped, into the interior of the device. If a force transmitted by the microphone boot is too great, internal components of the portable computing device can be damaged. In view of the above, designs for microphone boots are described as follows that take advantage of the improved sealing qualities that a harder material can provide while accounting for the shock transmitting properties associated with using harder materials.

[0216] In more detail, with reference to Figures 31A-36C, composite microphone boots are described that can utilize a combination of harder materials selected for their sealing qualities and softer materials selected for their shock absorbing qualities. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting. In particular, embodiments of a composite microphone boots using a combination of harder and softer materials is described with respect to Figures 31A-31C. With respect to Figures 32A-32B, a few examples of installation positions of a composite microphone boot incorporated as part of a microphone assembly are discussed. In Figure 33A-33B, a microphone assembly in a pre-installed and installed positions are shown. During installation, the microphone boot can be secured in such a manner that it is compressed, which can improve sealing integrity. Transmission of an external force through a microphone boot during operation is described with respect to Figure 33C. With respect to Figures 34A-34C. different embodiments of a composite microphone boot, including dimensions and materials, are discussed. A method of manufacturing a portable computer device including a composite microphone boot is described with respect to Figure 35. Finally, with respect to Figures 36A-36C, perspective diagrams and a block diagram of a portable computing device that can include a composite microphone boot are discussed.

[0217] Figures 31A-31C show perspective views of a microphone assembly 3100 including a microphone 3106, circuit board 3104 and a microphone boot, such as 3102a, 3102b and 3102c. The microphone 3106 is shown coupled to the circuit board 3104. In particular embodiments, the circuit board can be formed from a rigid or a flexible substrate. The microphone boot, such as 3102a, 3102b and 3102c, can include surfaces that surround a cavity 3112. The cavity 3112 can act as a sound conduit. For instance, as described above and in more detail with respect to Figures 32A and 32B, in a portable computing device, the cavity 3112 can be acoustically coupled to an aperture in a housing to act as a sound conduit to an interior microphone for sounds generated from a source external to the portable computing device.

[0218] The microphone boot can include an inner surface profile and an outer surface profile. The inner surface profile provides the bounds for the interior cavity 3110a. As shown in Figure 31 A, the microphone boot 3102a is cylindrically shaped. In this example, the outer surface profile 108 a and the inner surface profile 3110a can be proximately described as two concentric cylinders. The top surface 3111 and bottom surface of the microphone boot 3102a are proximately flat.

[0219] The inner surface profile and the outer surface profile of the microphone boot do not have to be formed from concentric shapes. In general, the inner and outer surface profiles can be different from one another and each can be arbitrarily shaped where the shape can vary from the top surface to the bottom surface. For instance, the cavity 3112 can be wider at the top and narrower at the bottom. Further, the cavity 3112 can be one shape at the top and another shape at the bottom. In addition, in a particular embodiment, the cavity 3112 can follow a curved path through the interior of the microphone boot.

[0220] As one example, in Figure 3 IB, a microphone boot 3102b with a different outer and inner surface profiles is shown. The microphone boot 3102 includes a cylindrically shaped inner surface profile 3110b and a rectangular shaped outer surface profile 3108b. In another example, the shape profile could be reversed so that the inner surface profile 3110b is rectangular shaped and the outer surface profile 3108b is cylindrically shaped. Like the example shown in Figure 31 A, the top surface 3111 and the bottom surface of the microphone boot are both flat.

[0221] In various embodiments, one or both of the top and bottom surfaces of the microphone boot can be curved. As an example, in Figure 31C, a microphone boot 3102c is shown that includes a curved top surface 3111a and a flat bottom surface. The microphone boot 3102c includes a rectangular shaped inner surface profile 3110c and a rectangular shaped outer surface profile 3108c.

[0222] In some embodiments, a top surface of the microphone boot, such as 3111a, can be bonded to a curved interior surface of a device's housing. To improve seal integrity, it can be beneficial to shape the top surface, such as 3111a, so that its curvature somewhat conforms to the curvature of the interior surface of the housing. For example, curving the top surface to conform to the interior surface of the housing can result in a more equal pressure over the top surface, which can improve sealing integrity. In other embodiments, a microphone boot with a flat top surface can be bonded to a curved interior surface or a microphone boot with a curved top surface can be bonded to a flat interior surface. In this embodiment, the flat or curved top surface of the microphone boot can be made to conform to the interior surface using compressive forces, i.e., by compressing the microphone boot.

[0223] In the Figures 31A-31C, a top surface of the microphone 3106 is shown as flat and a microphone boot with a flat bottom surface is shown bonded to the flat top surface of the microphone. In other embodiments, the top surface of the microphone 3106 can be sloped or curved and if desired a bottom surface of the microphone boot, such as 3102a, 3102b and 3102c, can be sloped to somewhat conform to the top surface of the microphone. As described above, shaping the microphone boot in this manner may improve a sealing integrity between the bottom surface of the

microphone boot and a top surface of the microphone.

[0224] In other embodiments, the bottom surface of the microphone boot and the top surface of the microphone can be shaped differently. For instance, a top surface of a microphone can be curved and the bottom surface of the microphone boot can be flat. The bottom portion of the microphone boot can be formed from a compressible material such that when the flat bottom surface of the microphone boot is pressed to the curved surface of the microphone, the flat bottom surface of the microphone boot conforms to the curved top surface of the microphone.

[0225] As described above, the microphone assembly can be installed in an interior of a device, such as a portable computer device. The microphone assembly and its associated microphone boot can be positioned such that it is aligned with an aperture in the housing and provides a sound conduit between the aperture and the microphone. The aperture can be located at various locations on an exterior surface of the device. The placement of the aperture can affect a placement position and orientation of the microphone boot. Two examples of a microphone assembly in different orientations within a portable computing device are described as follows with respect to Figures 32A and 32B.

[0226] In Figures 32 A and 32B, a microphone assembly including a microphone 3106, a circuit board 3104 and a microphone boot 3102 is shown positioned within an interior portion of a housing 3120 for portable computing device. The housing 3120 is proximately rectangular. The outer surface of the housing 3120 includes an outer surface profile 3120a and an inner surface profile 3120b. The outer surface profile 3120a and inner surface 3120b can be shaped differently from one another. For instance, the outer surface 3120a can be flat in one region but the corresponding interior portion can be curved. The shape of the interior surface proximate to the microphone boot can affect a sealing integrity of the seal between the microphone boot and the interior surface. As described above, in some embodiments, a top surface of the microphone boot can be shaped to conform to the shape of the interior surface of the housing to improve the sealing integrity. Sealing integrity can be important because a good, air-tight seal can help to acoustically isolate the sound conduit within the interior of the microphone boot.

[0227] In Figure 32A, the microphone boot 3102 is shown orientated upward and the cavity in the microphone boot is aligned from the top to the bottom of the housing along the 'Η' axis. In this embodiment, a top cover, such as a cover glass can be placed over the opening the housing 3120. An embodiment of a portable computing device including a housing with a cover glass is shown in Figure 36A. The top cover can include an aperture. During installation, the microphone assembly can be positioned in the housing such that the top surface of the microphone boot is aligned with where the aperture in the top cover will be in its installed position. Then, when the top cover is installed, a bottom surface of the top cover can be bonded to the top surface of the microphone boot to generate a sound conduit between the aperture in the top cover and the microphone via the microphone boot.

[0228] In another embodiment, a housing, such as 3120, can include an aperture 3122 for a microphone, such as 3106. In Figure 32B, the housing 3120 is shown with an aperture 3122 in its side near a corner. The microphone 3106 and the circuit board 3104 are shown positioned such that a top surface of the microphone and the circuit board are proximately parallel to the side with the aperture and an opening in the microphone boot 3102 is aligned with the aperture. A sound conduit associated with the microphone boot is proximately aligned with the 'W axis.

[0229] Other orientations of the microphone assembly and microphone boot are possible and are not limited to the orientations shown in Figures 32A and 32B. For instance, on one embodiment, a top surface of the microphone boot 3102 can be bonded to the inner surface of the housing proximate to the aperture 3122 to form a sound conduit. Then, the orientation of the circuit board and the microphone can be adjusted such that the microphone boot and its internal conduit are slightly bent in some manner. The microphone boot can be constructed from a flexible material to enable bending. It may not be desirable to bend the microphone boot beyond some determined limit to avoid possibly pinching off the sound conduit in the interior of the microphone boot.

[0230] In another embodiment, a curved microphone boot can be provided. For example, a microphone boot can be constructed like pipe elbow. The pipe elbow can be provided in a bent shape where the elbow is bent through some angle. A bent microphone boot can allow the orientation of the microphone and the printed circuit board to be changed relative to the housing, which may be desirable for packaging reasons. More details of bonding a microphone boot 3102 to the housing 3120 are described with respect to Figures 33 A and 33B as follows.

[0231] Figures 33A-33B show a side view of a microphone assembly in a pre- installed and installed position, respectively, in a housing in accordance with the described embodiments. In Figure 33A, a cross section of the microphone boot 3102 is shown. One end of the microphone boot 3102 is aligned with an aperture 3121a in the housing 3120 and a second end of the microphone boot is aligned with the microphone 3106. Thus, a sound conduit can be formed via the microphone boot between the aperture 3121a and the microphone 3106.

[0232] A first seal 3122 can be formed between a bottom surface of the microphone boot 3102 and a top surface of the microphone 3106. A second seal 3124 can be formed between a top surface of the microphone boot 3102 and an interior surface of the housing 3120 such that the microphone boot surrounds the aperture in the housing 3120. In one embodiment, the first and second seals can be formed using an adhesive, such as a pressure sensitive adhesive (PSA). The PSA can be provided as a double-sided tape. In another embodiment, the first 3122 or the second seal 3124 can be formed using a liquid adhesive.

[0233] In one embodiment, the microphone 3106 and circuit board 3104 can be provided with the microphone boot 3102 already attached to the microphone 3106. In another embodiment, during device assembly, the microphone 3106 and the circuit board 3104 can be provided as a separate part from the microphone boot 3102. When the microphone boot and microphone are provided as separate parts, the microphone boot 3102 can be first attached to the microphone 3106 and then attached the inner surface of the housing 3120 or vice versa. The attachment process can involve placing PSA or some other sealing adhesive on each end of the microphone boot.

[0234] After the microphone boot 3102 is aligned with the aperture 3121a of the housing and an initial bond is formed between the microphone boot and the interior of the housing, compressive forces, such as 3130a and 3130b, can be placed on the microphone boot. The compressive forces can be generated when the microphone boot 3102, microphone 3106 and circuit board 3104 are secured in place. For example, one or more fasteners, such as screws, can be used to secure the circuit board 3104 to the housing 3120 or some other nearby structure. As the screws are seated, the compressive forces can be generated on the microphone boot 3102. The compressive forces can be used to squeeze out any air pockets surrounding the seals, which may improve the sealing integrity of the seal.

[0235] As is shown in the Figure 33A, the housing 3120 is curved proximate to the microphone boot 3102. Thus, the compressive forces can be unequally distributed through the microphone boot. For instance, the compressive forces on side 3114a of the microphone boot can be less than the compressive forces on side 3114b of the microphone boot. As described above, in some embodiments, the microphone boot 3102 can be shaped to more evenly distribute the compressive forces. For instance, the top surface of the microphone boot can be sloped to follow the curvature of the inner surface of the housing 3120. In other embodiments, the top surface of the microphone boot 3102 may not follow the curvature of the inner surface of the housing (e.g., the top surface can be flat while the inner surface is curved as shown in Figure 33A) and the compressive forces can be used to force a top surface of the microphone boot to deform such that it conforms with the inner surface of the housing.

[0236] A height 3135 between the circuit board 3104 and one position of the housing is shown in Figure 33A. After installation, as is shown in Figure 33B, the height 3135 can change. For instance, the height 3135 can lessen, which can be associated with a reduction in height of the microphone boot 3120. The amount height reduction of the microphone boot can depend on its original dimensions, materials used to form the microphone boot and an amount of compressive force that is placed on the microphone boot. [0237] The reduction in height of the microphone foot can result in an expansive force 3140 being transferred to the microphone boot. The expansive force 3140 can push against the seals 3122 and 3124, which can improve the seal integrity of the seals. For instance, as described above, the compressive forces can help to remove air pockets. Improving the seal integrity can result in better acoustic isolation

characteristics for the sound conduit in the interior of the microphone boot 3102. For instance, as the seals become more air tight, sound penetration into the microphone boot via sound paths within the interior of the housing 3120 can be reduced. In one embodiment, the acoustic isolation within the sound conduit of the microphone boot can be about 40 DB or greater.

[0238] Figure 33C shows a side view of a microphone assembly installed in the housing 3120 that is responding to an externally applied force 3142. During operation, a device, such as a portable computing device, can experience an externally applied force, such as 3142. For instance, the device can be dropped, which generates the force.

[0239] The externally applied force can be transmitted through the device via various pathways. A force, such as 3142a, can be transmitted through the microphone boot 3102 and then a force, such as 3142b, can be transmitted into the microphone 3106 and into the circuit board 3104. The force can be transmitted in a dynamic manner. For instance, the microphone boot can compress and then can expand in response to the force causing the height 3135c to change. The expansion and contraction of the microphone boot can push and pull at the attachments between the various components, such as between the microphone 3102 and circuit board 3104 and on each side of the seals, 3122 and 3124.

[0240] If the microphone boot is not designed properly, the expansion and contraction of the microphone boot 3102 as well as bending of the other parts, such as the circuit board 3104, can cause the seal integrity of the seals, such as 3122 or 3124, to degrade. Under testing, for some microphone boot designs, it was found that the seals, such as 3122 or 3124, can be pulled apart, the microphone 3106 can be pulled off the circuit board 3104 or the circuit board can be damaged. In one embodiment, the microphone assembly can be designed to withstand an acceleration of up to 10,000 g's, which can bound a magnitude of the externally applied force. [0241] During testing, it was found that microphone assemblies using a microphone boot formed a single material that is softer and more compressible can be more resistant to shock damage, such as a shock resulting from a sudden acceleration, than a microphone boot formed from a harder material. However, it was also found that a microphone boot formed from a single harder material can provide for better seal integrity and hence better acoustic isolation than a microphone boot formed from a softer material. However, microphone assemblies using a microphone boot formed from a harder material can be more susceptible to shock damage.

[0242] To take advantage of the shock resistance properties of a softer material and the improved sealing qualities of a hard material, composite microphone boot designs can be provided. The composite microphone boot can use a combination of hard and soft materials. The harder materials can be used to improve seal integrity while the softer materials can be used to improve shock resistance. Embodiments of composite microphone boot designs that can be utilized in a microphone assembly are described with respect to Figures 34A-34D as follows.

[0243] Figures 34A-34D show cross-sections of composite microphone boots, such as 3200, 3225 and 3235, in accordance with the preferred embodiments. A top and bottom seal is shown formed on each of the microphone boots. In Figure 34A, a top view of a microphone boot 3200 including a seal 3202a is shown. The top view shows the microphone boot 3200 includes a circular opening 3210 to the interior passageway 3215 that forms a sound conduit through the microphone boot. A washer like seal 3202a can be formed on top of the microphone boot 3200. As described above, the outer and inner surface profiles of the microphone boot, such as 3200, can vary through the interior passage way. Thus, the top view of the microphone boot can vary depending on the surface contours selected for the outer and inner profiles. The seal 3202a can be designed to almost cover the top surface of the microphone boot 3200. Thus, the shape of seal 3202a can vary accordingly.

[0244] Returning to Figure 34A, the microphone boot can include a first end cap portion 3204a. The first end cap 3204a can be formed from a first material and can have a first thickness 3212. A sealing portion 3202a can be bonded to a top of the first end cap 3204a. A second end cap 204b can be located on a bottom of the microphone boot. The second end cap can formed from a second material and can have a second thickness 3216. A center portion 3206 of the microphone boot of a thickness 3214 can be disposed between the first end cap 3204a and the second end cap 3204b. The center portion can be formed from a third material. The first thickness 3212, the second thickness 3216, and the third thickness 3214 can be different from one another.

[0245] A sealing portion 3202b can be bonded to the second end cap 3204b. As previously described, the sealing portion 3202a can be bonded to a surface, such as the interior surface of a housing. The sealing portion 3202b can be bonded to a surface, such as a top surface of a microphone. The sealing portions 3202a and 3202b can be formed from a common material or a different material. For instance, the sealing portions can be formed from a common PSA or two different PSAs.

[0246] In particular embodiments, the first and second materials used for the first end cap 3204a and the second cap 3204b can be selected for their ability to improve sealing integrity while the third material of the center portion 3204 can be selected for its shock absorbing qualities. As described above, using a hard material can improve sealing integrity associated with the microphone boot seals, such as 3202a and 3202b, while using a softer material can improve the shock resistance of the microphone assembly. Thus, the materials selected for the first end cap and the second cap can be formed from harder materials to improve sealing integrity and the center portion can be formed from a softer, more compressible material than the first end cap and the second cap, to improve the shock resistance. In one embodiment, the first and second end caps can be formed from hard plastics and the center portion can be formed from a softer plastic than the end caps, such as a silicon based plastic.

[0247] In a particular embodiment, the first end cap 3204a and the second end cap 3204b can be formed from a first material harder material and the center portion can be formed from a second softer material. A microphone boot designed in this manner can be integrally formed during a double shot injection molding process where during one shot the first material is used and during the other shot the second material is used. The first and second material can be selected such that the materials bond together during the double shot injection molding process. In other embodiments, the first end cap 3204a, the second end cap 3204b and the center portion 3206 can be separately formed, such as die cut, and then bonded together in some manner to form the microphone boot. [0248] In one embodiment, the first end cap 3204a and the second cap 3204b can be proximately identically shaped with a common thickness. However, the thickness 3214 of the center portion can be different. In other embodiments, the first end cap and the second cap can be shaped differently. For instance, in Figure 34B, a microphone boot 3225 is shown where the first end cap 3228a is shaped differently than the second end cap 3228. The microphone boot includes a center portion 3230 and the materials used for the center portion 3230, the first end cap 3228a and the second end cap 3228b can be selected to improve sealing integrity and/or shock resistance in the manner described above.

[0249] A top surface of the first end cap 3228a can be curved or sloped in some manner. As described above, it can be desirable to shape the first end cap 3228a to conform proximately to a surface to which it is to be bonded. For instance, the first end cap 3228a can be shaped to conform to a curved interior surface of a housing as is shown in Figures 33A to 33C. The seals, 3226a and 3226b, can be bonded to each of the first end cap 3228a and the second end cap 3229b. The seals can be shaped to follow surfaces to which they are bonded. Thus, seal 3226a can be curved to follow the shape of the first end cap 3228a while seal 3226b is relative planer to follow the planar shape of the bottom end cap 3228b.

[0250] In Figures 34 A and 34B, the center portions 3206 and 3230 of the microphone boots are shown with a relatively constant thickness. In other

embodiments, the thickness of the center portion of a microphone boot can vary. For example, in Figure 34C, a microphone boot 3235 is shown where the thickness of the center portion 3240 varies. The microphone boot 3235 can include a first end cap 3238a with a sloped upper surface and a second end cap 3238b with a planar bottom surface. The seals 3236a and 3236b can be attached to each end cap. The thickness of the second end cap 3238b is shown as relatively constant for this example.

[0251] In Figure 34C, the thickness of the center portion 3240 varies from thicker to thinner. In addition, the thickness of the first end cap 3238 is thickened in areas where the center portion 3240 is thinner and thinned in areas where the center portion is thicker. In other embodiments, the interface between the center portion 3240 and the first end cap 3238a can be relatively horizontal and the second end cap can be made thinner or thicker, such that the interface between the center portion 3240 and the second end cap 3238b is sloped, to allow the center portion thickness profile to vary. In yet another embodiment, the interfaces between the first end cap 3238a and the center portion 3240 and the second end cap 3238b can both be sloped in some manner.

[0252] The thickness of the center portion 3240 of the microphone boot can be varied to change a distribution of compressive forces within the microphone boot when it is installed. For instance, the thickness of the center portion 3240 can be varied to produce a more even distribution of compressive forces and possible a better seal for an end cap, such as 3238a. In other embodiments, the center portion 3240 can be made thicker or thinner in particular areas to adjust the shock absorption properties in these areas. In yet other embodiments, the center portion can be made thicker or thinner in particular areas to generate a preferred shock transmission path such as to direct a shock away from a more vulnerable area and towards an area with more structural reinforcement.

[0253] In the composite microphone boots described with respect to Figures 34A- 34D, multiple materials are used to form the composite boot. In one embodiment, as is shown in Figure 34D, a single material can be used for the microphone boot. The microphone boot 3245 includes a center portion 3250 of a single material. Seals 3246a and 3246b are shown attached to the microphone boot. It may be possible to use a single material, such as a single harder material, selected for its ability to improve seal integrity, if shock absorption effects are compensated for in some other manner rather than using a second shock absorbing material.

[0254] In one example, the geometry of the microphone boot, such as 3245, can be adjusted to change it shock absorbing characteristics. For instance, a bulge, such as 3250a, can be provided in the microphone boot 3245 to help dissipate shocks that are transmitted through the microphone boot. In another example, the microphone assembly can be adjusted in some manner to improve its shock absorbing capabilities. For instance, shock dampening features can be designed into the way the microphone assembly is attached or a more flexible circuit board can be used in the microphone assembly to improve its dampening characteristics.

[0255] Figure 35 is a flow chart 3300 of a method of manufacturing a portable computer device including a composite microphone boot in accordance with the preferred embodiments. In 3302, microphone boot dimensions and materials can be selected. For instance, in a composite microphone boot including a center portion disposed between two end caps, the dimensions to be used for each of the end caps and the center portion can be determined. The dimensions can be selected to improve sealing integrity and shock absorption properties of the microphone boot. Further, the materials to be used for each component can be selected. As previously described, the materials can also be selected to improve sealing integrity and the shock absorption properties of the microphone boot.

[0256] Next, a microphone boot according to the specified dimensions and materials can be formed. In one embodiment, the microphone boot can be a composite microphone boot formed from multiple materials and components that are integrally formed using an injection molding process. In 3304, a first portion of the microphone boot can be formed in one shot of a double shot injection molding process. In 3306, a second portion of the microphone boot can be formed in another shot of the injection molding process. A different material can be used in each of the shots. In other embodiments, the different portions of the microphone boot can be formed separately and then assembly together after each of the components is formed.

[0257] In 3308, the microphone boot can be attached to a microphone. The microphone can be part of a microphone assembly including a microphone coupled to a circuit board and the microphone boot. In 3310, the microphone assembly can be attached to the housing of an electronic device, such as a portable computing device to form a seal between the microphone and the housing. In one embodiment, the seal can be formed using a pressure sensitive adhesive. In 3312, when the assembly is secured, the microphone boot can be compressed in some manner. The compression can change the dimensions of the microphone boot and cause the microphone boot to exert a force on its associated seals. The exerted force can be used to improve seal integrity of the seals.

[0258] Figures 36A and 36B show a top and bottom view of a portable computing device 3400 in accordance with the described embodiments. The portable computing device can be suitable for being held in hand of a user. A cover glass 3406 and a display 3404 can be placed within an opening 3408 of housing 3402. The cover glass can include an opening for an input mechanism, such as input button 3414. In one embodiment, the input button 3414 can be used to return the portable computing device to a particular state, such as a home state. [0259] Other input/output mechanisms can be arranged around an periphery of the housing 3402. For instance, a power switch, such as 3410 can be located on a top edge of the housing and a volume switch, such as 3412, can be located along one edge of the housing. An audio jack 3416 for connecting headphones or another audio device and a data/power connector interface are located on the bottom edge of the housing. The housing 3400 also includes an aperture for a camera 3415 that allows video data to be received.

[0260] FIG. 36C is a block diagram of a media player 3500 in accordance with the described embodiments. The media player 3500 includes a processor 3502 that pertains to a microprocessor or controller for controlling the overall operation of the media player 3500. The media player 3500 stores media data pertaining to media items in a file system 3504 and a cache 3506. The file system 3504 is, typically, a storage disk or a plurality of disks. The file system typically provides high capacity storage capability for the media player 3500. However, since the access time to the file system 3504 is relatively slow, the media player 3500 also includes a cache 3506. The cache 3506 is, for example, Random- Access Memory (RAM) provided by semiconductor memory. The relative access time to the cache 3506 is substantially shorter than for the file system 3504. However, the cache 3506 does not have the large storage capacity of the file system 3504.

[0261] Further, the file system 3504, when active, consumes more power than does the cache 3506. The power consumption is particularly important when the media player 3500 is a portable media player that is powered by a battery (not shown).

[0262] The media player 3500 also includes a user input device 3508 that allows a user of the media player 3500 to interact with the media player 3500. For example, the user input device 3508 can take a variety of forms, such as a button, keypad, dial, etc. Still further, the media player 3500 includes a display 3510 (screen display) that can be controlled by the processor 3502 to display information to the user. A data bus 3511 can facilitate data transfer between at least the file system 3504, the cache 3506, the processor 3502, and the CODEC 3512.

[0263] In one embodiment, the media player 3500 serves to store a plurality of media items (e.g., songs) in the file system 3504. When a user desires to have the media player play a particular media item, a list of available media items is displayed on the display 3510. Then, using the user input device 3508, a user can select one of the available media items. The processor 3502, upon receiving a selection of a particular media item, supplies the media data (e.g., audio file) for the particular media item to a coder/decoder (CODEC) 3512. The CODEC 3512 then produces analog output signals for a speaker 3514. The speaker 3514 can be a speaker internal to the media player 3500 or external to the media player 3100. For example, headphones or earphones that connect to the media player 3500 would be considered an external speaker.

[0264] In method described above, one or more of the steps can be performed using a computer aided manufacturing process. The computer aided manufacturing process can involve programming one or more different devices to form or assemble the microphone boot and the portable computing device. For instance, a robotic device can be programmed to install a microphone boot and/or a microphone assembly including the microphone in a particular orientation within a housing of the portable computing device.

Modular Material Antenna Assembly

[0265] Broadly speaking, the embodiments disclosed herein describe a modular material antenna assembly that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then

mechanically supported by the antenna block and electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame. In one embodiment, the antenna block is made of Cyclo Olefin Polymer (COP) while the frame is made of a glass-filled plastic. The resultant difference in dielectric constant, in conjunction with the interlocking portions of the frame and antenna block, as well as the difference in dielectric loss tangent, improves antenna performance.

[0266] FIG. 41 shows a perspective top view illustrating a representative consumer product 4100 in accordance with the described embodiments. Consumer product 4100 can take many forms, not the least of which includes a portable media player such as an iPod™ or iPod Touch™, a smartphone such as an iPhone™, and a tablet computer such as an iPad™, each manufactured by Apple Inc. of Cupertino, CA. Consumer product 4100 can utilize an internal antenna to send and/or receive wireless communications. These wireless communications may be performed for many different purposes. For example, as will be described later, the wireless communications may be performed for mobile phone communications, WiFi communications, Bluetooth™ communications, wireless broadband communications, etc. Making these communications more efficient and effective provides for an improved user experience when using consumer product 4100.

[0267] FIG. 42 shows a perspective top view of a modular material antenna assembly in accordance with one embodiment. Here, housing 4200 is provided, which is made of an electrically conductive material. An example of an electrically conductive material suitable for use with this embodiment is stainless steel, although one of ordinary skill in the art will recognize that there are many other potential materials that would be suitable with this embodiment and the claims should not be construed as being limited to stainless steel unless expressly stated. Frame 4202 is affixed to housing 4200, and generally may act to support a front face (not pictured) of the device. The front face may be made of transparent material, such as glass, and may act to cover the device, yet permit a user to view through the cover to a display (not pictured) underneath. This display may also act as an input device. For example, the display may be one of many different types of touchscreens.

[0268] In order to support the cover, frame 4202 may include rim 4204 having flange portion 4206. In one embodiment, the cover is glued to rim 4204 about flange 4206, thus sealing the entire device. Thus, rim 4204 acts not only as a support for the cover but also as a junction area where the cover may be affixed to the frame. Frame 4202 may be made of an electrically non-conductive frame material, such as a glass filled plastic. One example glass-filled plastic suitable for use in frame 4202 is KALIX™, manufactured by Solvay Advanced Polymers of Alpharetta, GA.

KALIX™ includes 50% glass-fiber reinforced high-performance nylon. One of ordinary skill in the art will recognize that there are many other potential frame materials that would be suitable for use with this embodiment, and the claims should not be construed as being limited to KALIX™ or any other glass-filled plastic unless expressly stated.

[0269] The dielectric constant of frame 4202 is substantially greater than the dielectric constant of antenna block 4208. Glass-filled plastic, for example, has a dielectric constant of about 5, while COP, which, as described earlier, can be used as an antenna block material, may have a dielectric constant of approximately 2.25. Additionally, the dielectric loss tangent of frame 4202 is substantially greater than the dielectric loss tangent of antenna block 4208. Glass-filled plastic, for example, has a dielectric loss tangent of between 2.5 and 4, whereas antenna block 4208 composed of COP may have a dielectric loss tangent of approximately 0.0005. Dielectric loss tangent is a parameter of a dielectric material that quantifies its inherent dissipation of electromagnetic energy. The term refers to the angle in a complex plane between the resistive (lossy) component of an electromagnetic field and its reactive (lossless) component. The smaller the dielectric loss tangent, the less "lossy" the antenna reception.

[0270] In addition to being formed of an antenna block material that, as just described, has a dielectric constant substantially less than the frame material, antenna block 4208 additionally has a portion with a shape that interlocks with a

corresponding portion of frame 4202 and secures the antenna block to the frame. This is depicted in FIGS. 43 and 44. The device may additionally contain a printed circuit board (not pictured) Integrated circuits and other electrical components may be mounted to circuit board and may be used to operate the device as well as control the display. The printed circuit board can include a processor or processors configured to perform various functions of the device.

[0271] FIG. 43 shows a first cross section of a modular material antenna assembly in accordance with one embodiment. This cross section represents the view from the side of the device in FIG. 42. As can be seen in FIG. 43, antenna block 4208 contains a portion 4210 with a shape that interlocks with a corresponding portion 4212 of frame 4202. Here, the interlocking portions include a tabbed portion 4212 of frame 4202, with a notched portion 4210 of antenna block 4208. However, one of ordinary skill in the art will recognize that there may be many different ways in which to interlock these components in a manner that secures antenna block 4208 to frame 4202, and the claims should not be limited to any particular shape(s) unless expressly stated.

[0272] FIG. 44 shows a second cross section of a modular material antenna assembly in accordance with one embodiment. This cross section represents the view from the top end of the device in FIG. 43. Here, antenna block 4208 has another portion 4214 with a shape that interlocks with a corresponding portion 4216 of frame 4202. This portion 4214 is tabbed portion on the antenna block 4208 side, while portion 4216 is a notched portion 4216 on the frame 4202 side. By alternating the tabbed and notched portions between antenna block 4208 and frame 4202, antenna block 4208 can be secured more tightly to frame 4202. It should be noted that it is not necessary for there to be any particular number of these corresponding portions to interlock antenna block 4208 and frame 4202. It is enough to have one set of interlocking portions in order for the antenna block 4208 to be secured to the frame 4202. Nevertheless, additional interlocking portions can be provided to provide additional strength to the coupling of the two components. Additionally depicted in this figure is bracket 4218, which connects to housing 4200 and permits electrical conductivity between an item screwed into the bracket 4218 via screw hole 4222 and housing 4200. Bracket 4218 may be welded to the housing 4200. Bracket 4218 may be composed of an electrically conductive material.

[0273] FIG. 45 shows an expanded view of a top perspective view of a modular material antenna assembly in accordance with one embodiment. Here, an antenna flex 4222 has been mechanically secured to the top of antenna block 4208. Antenna flex 4222 may be secured to antenna block 4208 through the use of a screw 4224 into bracket 4218, depicted in FIG. 44. It should be noted that it is not necessary for bracket 4218 to be a separate component from housing 4200, and in fact in one embodiment, bracket 4218 is integrally formed with housing 4200. Antenna flex 4222 may also be electrically connected to a circuit board (not pictured) of the consumer product, and electrical components on the circuit board can additionally be electrically connected housing 4200 to ground each of the components.

[0274] Additionally, antenna block 4208 may be ground to housing 4200. In one example, an electrically conductive spring (known as a grounding spring) may be used to perform this task. The spring may itself have shapes that interlock with corresponding portions of antenna block 4208 and housing 4200, in order to secure the grounding spring. Such a spring is designed to deform elastically, which can reduce the effect of bumps or other trauma to the consumer device. The elastic deformability of the spring can allow the spring to be retained between antenna block 4208 and housing 4200 even during drop events or other such impacts.

[0275] While antenna block 4208 is depicted in FIGS. 42-45 as having a particular shape, it is not necessary for the antenna block generally to be formed in any particular shape. Indeed, the shape of the antenna block may vary based on a number of different factors, including the design and form of neighboring structures, ease of construction, ease of installation, and how tightly the antenna block is to be secured to the frame. The manner in which the frame and antenna block interlock with each other can also affect antenna performance, and it is believed that having the interlocking portions be made of materials having different dielectric constants further improves antenna performance above. In other words, the interlocking aspect of the different dielectric constant materials increases antenna performance above and beyond what would occur if the different dielectric constant materials were connected without interlocking portions.

[0276] Additionally, the shape of the antenna block may alter the characteristics of wireless reception of the device. Certain shapes and/or sizes may generally increase or decrease wireless reception. Additionally, certain shapes and sizes may increase wireless reception when the device is used in certain manners and decrease wireless reception when the device is used in other manners. For example, the position of a user's hand while holding the device may alter the wireless reception characteristics of the device. This affect may be reduced or eliminated by providing more room between the antenna block and the portion of the housing at which the user typically grasps the device, or by the placement of an electrically non-conductive and physically buffering material such as a rubber bumper. As such, the antenna block may be designed to balance all of the above factors in the most efficient manner possible.

[0277] The antenna block, frame, and housing may be manufactured from any suitable material, using any suitable process. This may include, for example, metals, composite materials, plastic, etc. These components may be manufactured using any suitable approach, such as, for example, forming, forging, extruding, machining, molding, stamping, and any other suitable manufacturing process, or combinations thereof.

[0278] The antenna block may be configured to operate over any suitable band or bands to cover any existing or new services of interest. If desired, multiple antenna blocks may be provided to cover more bands, or one or more antennas may be provided with wide-bandwidth resonating elements to cover multiple communications bands of interest. Unless expressly disclaimed, nothing in this application should be construed as limiting the claimed embodiments to a single antenna block.

[0279] FIG. 46 depicts an alternative interlocking shape in accordance with an embodiment. This figure depicts a close-up of the interlocking shape area of the antenna block and frame, and the other features of the antenna block and frame (and perhaps other interlocking shapes elsewhere on those elements) are not depicted. Here, antenna block 4600 contains a rounded notched portion 4602, which interlocks with a rounded tabbed portion 4604 of frame 4606. By manufacturing the

interlocking portions with rounded shapes as opposed to substantially rectangular shapes, assembly becomes easier because the shapes slide together more quickly than many rectangular shapes. This must be counterbalanced, however, by the fact that a rounded shape may not provide as much resistance to separation as substantially rectangular shapes.

[0280] FIG. 47 depicts an alternative locking shape in accordance with another embodiment. This figure depicts a close-up of the interlocking shape area of the antenna block and frame, and the other features of the antenna block and frame (and perhaps other interlocking shapes elsewhere on those elements) are not depicted. This embodiment is similar to that shown in FIG. 46, except that antenna block 4700 contains a rounded tabbed portion 4702, which interlocks with a rounded notched portion 4704 of frame 4706. As with the embodiment in FIG. 46, the rounded design may speed up assembly, but may also be less reliable as far as locking antenna block 4700 to frame 4706.

[0281] FIG. 48 depicts an alternative interlocking shape in accordance with an embodiment. This figure depicts a close-up of the interlocking shape area of the antenna block and frame, and the other features of the antenna block and frame (and perhaps other interlocking shapes elsewhere on those elements) are not depicted. Here, antenna block 4800 contains a notched portion 4802 having a rectangular portion 4804 and a rounded portion 4806. Notched portion 4802 interlocks with tabbed portion 4808 of frame 4810. Tabbed portion 4808 contains rectangular portion 4812 and rounded portion 4814. This design provides exceptional locking ability, providing significant resistance to separation of antenna block 4800 and frame 4810. This must be counterbalanced, however, by the fact that assembly of such interlocking portions may be difficult or even impossible if there are multiple such notched portions 4802 and tabbed portions 4808 in the device. This embodiment may be ideal, however, in cases where there is only a single interlocking portion for each of the antenna block and frame.

[0282] FIG. 49 depicts an alternative locking shape in accordance with another embodiment. This figure depicts a close-up of the interlocking shape area of the antenna block and frame, and the other features of the antenna block and frame (and perhaps other interlocking shapes elsewhere on those elements) are not depicted. This embodiment is similar to that shown in FIG. 48, except that antenna block 4900 contains a tabbed portion 4902 having a rectangular portion 4904 and a rounded portion 4906. Tabbed portion 4902 interlocks with notched portion 4908 of frame 4910. Notched portion 4908 contains rectangular portion 4912 and rounded portion 4914. As with the embodiment in FIG. 48, this embodiment may be ideal in cases where there is only a single interlocking portion for each of the antenna block and frame.

[0283] FIG. 50 is a flow diagram depicting a method for assembling a portable electronic device in accordance with one embodiment. At 5000, an electrically conductive housing is provided. This housing may be made of, for example, stainless steel. At 5002, a bracket is welded to the housing. This bracket may be also made of an electrically conductive material. At 5004, an electrically non-conductive frame is glued, or otherwise secured, to an interior of the electrically conductive housing, forming an integrated structure. The electrically non-conductive frame is formed of a frame material having a first dielectric constant. At 5006, an antenna block is secured to the frame by interlocking a portion of the antenna having a first shape with a portion of the frame having a second shape corresponding to the first shape. The antenna block is formed of an antenna block material having a second dielectric constant substantially less than the first dielectric constant. At 5008, an antenna flex is mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board.

[0284] FIG. 51 is a block diagram of a portable consumer device according to one embodiment of the invention. The portable consumer device 5100 can utilize the modular material antenna assembly in accordance with any of the embodiments described above. Portable consumer device 5100 includes a processor 5102 that pertains to a microprocessor or controller for controlling the overall operation of portable consumer device 5100. Portable consumer device 5100 stores media data pertaining to media items in a file system 5104 and a cache 5106. File system 5104 is, typically, a storage disk or a plurality of disks. File system 5104 typically provides high capacity storage capability for portable consumer device 5100. File system 5104 can store not only media data but also non-media data (e.g., when operated in a disk mode). However, since the access time to file system 5104 is relatively slow, portable consumer device 5100 can also include a cache 5106. Cache 5106 is, for example, Random- Access Memory (RAM) provided by semiconductor memory. The relative access time to cache 1106 is substantially shorter than for file system 5104. However, cache 5106 does not have the large storage capacity of file system 5104. Further, file system 5104, when active, consumes more power than does cache 5106. The power consumption is often a concern when portable consumer device 5100 is a portable consumer device that is powered by a battery (not shown).

[0285] In one embodiment, portable consumer device 5100 serves to store a plurality of media items (e.g., songs) in file system 5104. When a user desires to have the portable consumer device play a particular media item, a list of available media items is displayed on display 5108. Then, using a touchpad built into display 5108, a user can select one of the available media items. Processor 5102, upon receiving a selection of a particular media item, supplies the media data (e.g., an audio file) for the particular media item to a coder/decoder (CODEC) 5110. CODEC 5110 then produces analog output signals for a speaker 5112. Speaker 5112 can be a speaker internal to the portable consumer device 5100 or external to the portable consumer device 5100. For example, headphones or earphones that connect to portable consumer device 5100 would be considered an external speaker. Speaker 5112 can not only be used to output audio sounds pertaining to the media item being played, but also to output sound effects and cellular phone call audio. The sound effects can be stored as audio data on the portable consumer device 5100, such as in file system 5104, cache 5106, ROM 5114 or RAM 1116. A sound effect can be output in response to a user input or a system request. When a particular sound effect is to be output to speaker 5112, the associated sound effect audio data can be retrieved by processor 5102 and supplied to CODEC 5110 which then supplies audio signals to speaker 5112. In the case where audio data for a media item is also being output, processor 5100 can process the audio data for the media item as well as the sound effect. In such case, the audio data for the sound effect can be mixed with the audio data for the media item. The mixed audio data can then be supplied to CODEC 5110 which supplies audio signals (pertaining to both the media item and the sound effect) to speaker 5112.

[0286] Portable consumer device 5100 also includes a network/bus interface 5118 that couples to a data link 5120. Data link 5118 allows the portable consumer device 5100 to couple to a host computer. Data link 5118 can be provided over a wired connection or a wireless connection. In the case of a wireless connection, network/bus interface 5118 can include a wireless transceiver.

Formed PCB

[0287] A first factor that can be considered in the packaging of a portable computing device with a display and a desired thin profile is the placement of the larger components, such as a display, a display circuitry and a battery within the housing. In addition, a placement of the support and/or attachments structures needed to secure the larger device components to the housing can be considered. The larger device components and their associated support structure can be positioned with the consideration that sufficient room needs to be provided to allow various input/output mechanisms, such as volume switches, power buttons, data and power connectors, audio jacks to be arranged around the outer edges of the housing. In the remaining spaces not occupied by the larger components, other internal components, such as but not limited to a processor and memory, speakers, a microphone, a camera and their associated circuitry boards as well as various connectors that allow all the device components to be controlled and operated for their intended functions, can be placed.

[0288] The remaining spaces not occupied by the larger components can be irregularly shaped and distributed at various positions and height levels throughout the enclosure. Custom shaped components can be designed to fit within these spaces. Then, the components can be linked to one another in some manner. For instance, to allow the portable device to provide its intended functionality, many of the components can communicate with a controller board, such as a main logic board, to receive operating instructions. As another example, many of the components require power, which can be supplied from an internal battery via various power connections. Typically, the space between components can be used to route data and/or power connections. Thus, room for needed power and data connections can be considered in the packaging design of the device.

[0289] One solution for connecting various electrical components internally distributed within the housing is to use flexible connectors (Flexible connectors are often call "flex" connectors). One disadvantage of flex connectors is an increase in manufacturing steps. Each time one internal component is connected to another internal component by a flex connector two manufacturing steps are added. One of the steps can be eliminated in the assembly process by connecting the flex to one of the components during its manufacture. Nevertheless, during assembly, typically at least one end of the flex connector needs to be connected to an associated internal component.

[0290] Another disadvantage of flex connectors is that the connection points where the flex is connected to a component can be susceptible to failure during the operation of the device. For instance, flex connection points can be susceptible to failures resulting from shocks, such as when a device is dropped, than other types of connections. In addition, during assembly, a flex connection point can be improperly formed which can lead to premature or unanticipated failure of the device. Thus, the use of flex connectors can introduce additional instances where a manufacturing error can occur that reduces the overall reliability of the device.

[0291] As is described in detail herein, to eliminate flex connectors and yet accommodate the packaging environment associated thin and compact portable electronic device, bendable and contiguously formed PCBs can be used. As an example, a single contiguous PCB can include two large portions, such as two rectangular shaped portions, connected by a portion of the PCB that is much thinner the two rectangular portions. The two large portions of the PCB can be formed as two separate PCBs and then joined by a flex connector. Instead, a contiguous PCB board can be formed where connector portion of the PCB can be used in lieu of the flex connector. The relative thinness of the connector portion can allow it to be easily bent.

[0292] The larger portions of the PCB can be custom shaped (e.g., non- rectangular) and sized to fit into spaces that are available internally within the housing. A length and shape of the connector portion of the PCB can be determined based upon the internal pathways that exist between the spaces where the larger portions of the PCB are placed. In one embodiment, the connector portion of the PCB can be bent at various locations to fit into the internal pathways that can be available between larger portions of the PCB. In other embodiments, the larger portions of the PCB can also be bent to allow them to be fit in an available internal space.

[0293] The profile of a portable computing device, the components that need to be connected and the positioning of the various components can affect the available spaces within the housing that the bendable PCBs described herein can be shaped to fit and the circuitry that can reside on the bendable PCBs. Thus, a perspective view of a portable computing device with an illustrative profile and a block diagram of the components of the portable computing device are described with respect to Figures 61 A and 6 IB. In one embodiment, a bendable PCB can be formed as a main logic board. Thus, with respect to Figures 62A, 62B and 62C, a bendable main logic board including an illustrative placement of the board within a housing of a portable computing device is described. Other configurations and placement of a bendable

PCB are discussed with respect to Figures 63A, 63B and 63C. With respect to Figures 64A-65E, a number of configurations for a bendable PCB are illustrated. The stiffness properties of a bendable PCB can be adjusted by manipulating the formation of one or more the trace layers in the PCB. The formation and manipulation of these layers is described with respect to Figures 66A-66B. A method of manufacturing a portable computing device utilizing a bendable PCB is discussed with respect to Figure 67. Finally, a block diagram of portable computing device with media playing capabilities is described with respect to Figure 88.

[0294] Figure 61 A shows a perspective view of a portable computing device 610 with a relatively thin profile in accordance with the described embodiments. The portable computing device 610 can include a housing 6100 with an opening 6108. A display 6104 surrounded by a frame can be positioned within the opening 6108.

Display circuitry for the display 6104 can be located within the housing 6100, such as directly below the display 6104. As described above, the positioning of the display circuitry can affect the internal spaces that are available within the housing 6100.

[0295] A touch screen can be associated with the display 6104. Circuitry associated with the touch screen, such as touch screen controller, can be located within the housing 6100. The display 6104 can be sealed via a cover glass 6106. An input button 6114 can be positioned in an opening the glass cover 6106. Detection circuitry associated with the input button 6114 can be located within the housing 6100. In one embodiment, the input button can be used to return the device 610 to a particular state, such as a home state.

[0296] A number of input/output mechanisms can be located around the edges of the housing. For instance, a data/power connector 6118 and audio jack 6116 can be located on a bottom edge of the housing 6100 and a power switch 6110 can be located on a top edge of the housing 6100. The housing 6100 can also include openings for speakers and/or microphones. Circuitry supporting these components can be packaged internally within the housing 6100. The circuitry can be embodied on various circuit boards, such as bendable PCBs described herein, disposed within the housing.

[0297] A block diagram of the device 610 is shown in Figure 6 IB. The components described above are typically controlled by a processor on a main logic board (MLB) 6105. Thus, various internal connections can be provided that allows data to move between the MLB 6105 and the various components. The routing of the internal data connections can depend on how the various components are packaged including where the MLB 6105 is positioned within the housing 6100 and available internal pathways that result after the positioning of the various internal device components.

[0298] In regards to data connections, the MLB 6105 can be connected to a display controller 6120 which is coupled to the display 6104. Further, the MLB 6105 can be coupled to audio components, such as a speaker, the audio jack 6116, a microphone or associated audio support circuitry including an audio codec. Further, the MLB 6105 can be coupled to the various input devices, such as the touch screen 6122, the volume switch circuitry, the input button circuitry and the power switch circuitry. In addition, the MLB 6105 can be connected to various data interfaces that allow it to receive and send external data, such as the wireless interface 6126, which can include an antenna, and the data/power connector 6118. [0299] Besides data connections, many internal device components can receive power from an internal power source, such as battery 6130. For instance, the battery 6130 can be coupled to the MLB 6105, the display 6104, the display controller 6120, the touchscreen 6122 and the data/power connector 6118. Like the data connections, the routing of the power connections can depend on the positioning of the various internal device components, such as the battery 6130 and the available internal pathways within the housing 6100.

[0300] With respect to the following figures, embodiments of bendable PCBs are described. In one embodiment, the bendable PCBs can include portions of various sizes that are shaped to fit within internally available spaces distributed throughout the housing. The larger sized portions of the PCB can be joined by thin connector portions that are shaped to fit within the internal pathways that are available between the larger portions. The larger portions and the connector portions can be formed as a contiguous PCB. In a particular embodiment, a main logic board can be formed from a bendable PCB as is illustrated in the following figures.

[0301] Figures 62A, 62B and 62C show a perspective view and side views of a bendable MLB 6105 in accordance with the described embodiments. In Figure 62A, a cross section of housing 6100 is shown. The cross section of the housing 6100 includes a length 6150 and a width 6151. The length 6150 and width 6151 can vary for different cross sections depending on the internal surface profile of the housing 6100.

[0302] A battery 6130 can be positioned within a center portion of the housing. In one embodiment, the battery 6130 can be positioned and sized such that an internal space is available proximate to a top end of the battery, an internal space is available proximate to a bottom end of the battery and internal space is available along a side of the battery. A MLB 6105 is shaped such that a first portion 6105a can fit in the internal space proximate to the top end of the battery and a second portion 6105b can fit in the internal space proximate to the bottom end of the battery. A connector portion 6105c can join the first portion 6105a and the second portion 6105b. The connector portion 6105c is thinner and longer than the first and second portions, 6105a and 6105b. The connector portion 6105c is shown routed along an internal pathway on a side of the battery 6130. [0303] The shapes and positions of the first portion 6105a, the second portion 6105b and the connector portion 6105c are provided for the purposes of illustration only and are not meant to be limiting. In various embodiments, the first portion 6105a and the second portion 6105b of MLB 6105 can be larger or smaller in size than is shown in the figures. Further, the first portion 6105a can have a different shape and size than the second portion 6105b. Also, the shape of each portion, such as 6105a and 6105b, can be non-rectangular and include curved surfaces if desired. In addition, a PCB, such as MLB 6105, can include two or more larger portions. For instance, a bendable PCB, such as MLB 6105, can include three large portions that are joined by two connector portions.

[0304] In various embodiments, the connector portion 6105c can be attached to the larger portions, 6105a and 6105b, at different locations. For example, the connector portion 6105c can be attached to the portions 6105a and 6105b near their center to form more an "I" shape. In this example, the connector 6105c can be routed over a top or a bottom of the battery 6132 if there is an internal pathway available or the casing of the battery 6132 can include a groove on its top surface or bottom surface that can be used as a pathway for connector 6105c.

[0305] The connector 6105c does not have to be formed as a straight line. For example, the connector 6105c can be formed to follow a curve path or follow a number of straight line segments at different angles to one another (e.g., a stepped or a zigzag path). In another example, the connector 6105c can include one or more branches. The branches can be connected to other circuitry, such as additional PCBs. As is described in more detail with respect to Figures 62C and 64B-65E, after the connector 6105c is formed, it can be bent or twisted into various configurations to follow a particular internal pathway. For instance, as is described in more detail with respect to Figure 62C, it can be bent to traverse different heights within the device.

[0306] Figure 62B shows a cross section perpendicular to the cross section in Figure 62A with at a constant width value. The MLB 6105 can be positioned at a height 6152 below the top of the battery 6130. The first and second portions of the MLB, 6105a and 6105b, can be sized to fit in the available space between the top side of the battery 6130 and the bottom side of the battery 6130. The connector portion 6105c can traverse a side connecting the bottom side and top side of the battery and is indicated by the dashed lines. [0307] In one embodiment, as is shown in Figure 62B, the MLB 6105 can be installed in a planar configuration with a relatively constant height across the PCB i.e., 6105a, 6105b and 6105c are installed at similar height. In other embodiments, the MLB can be installed in a non-planar configuration. For example, in Figure 62C, the first portion 6105a is installed at a height above the top of battery 6130 and flush with display 6104 and the second portion 6105b is installed at a height below the top of the battery 6130. The connector portion 6105c traverses the height difference between the first portion 6105a and the second portion 6105b.

[0308] In Figures 62A-62C, embodiments of a bendable PCB configured as a MLB 6105 are shown. For the purpose of illustration, the larger top surface area of the MLB 6105 is shown as installed proximately parallel to the bottom surface of the device housing. In other embodiments, a bendable PCB can be installed such that the larger top surface area is proximately perpendicular to a bottom of the device housing (see Figure 63 A). In yet other embodiments, a first portion of a bendable PCB can be installed such that is parallel to the bottom surface of the housing and a second portion can be installed such that it is perpendicular to the bottom of housing. For example, in Figure 62A, the portion 6105a can be installed proximately parallel to the bottom of the housing and connector 6105c can be bent through a right angle to allow connector 6105b to be installed proximately perpendicular to a bottom surface of the housing. The perpendicular orientations are described for the purposes of illustration only. An angle at which each portion of a bendable PCB, such as MLB 6105, is installed can vary and is not limited to installation in a perpendicular orientation relative to one another or relative to the various dimensions of the housing.

[0309] Figure 63 A shows a perspective view of a bendable PCB 6160 installed in a configuration where the larger surface areas of the PCB are proximately

perpendicular to the bottom of housing 6100. In an unbent position, the PCB 6160 is proximately a rectangular strip, which is shown for the purposes of illustration as other shapes can be utilized. A top and bottom view of the PCB 6160 in an unbent position is shown in Figures 63B and 63C. In Figure 63A, the PCB 6160 is bent around a corner to fit in a space between the device component 6165 and the housing 6100. The device component 6165 can be 1) structural in nature, such as part a frame for securing other internal components, 2) can be part of device component, such as a battery, that is installed in the housing or 3) combinations thereof. [0310] During assembly, the PCB 6160 can be provided as a flat strip and then can be bent and/or twisted to fit into a desired space, such as around the corner between the device component 6165 and the housing 6100. In one embodiment, the materials of the PCB 6160 can be configured such that it does not hold its bent shape. Thus, the PCB 6160 may have to be secured for it to remain in its bent position as shown in Figure 63A.

[0311] As an example, to secure the PCB in a bent shape, the PCB 6160 can be attached to the sides or bottom of housing 6100 and/or the sides of device component 6165. As another example, if the space where PCB 6160 is placed is sufficiently narrow, such as the space between the device component 6165 and the housing 6100, then the PCB 6160 can be bent and then slide into a desired space during the assembly. The bending moment stored in the PCB 6160 (i.e., the PCB 6160 will straighten if unconstrained), can force the PCB 6160 against the sides of the space and can help to secure into the space in which it has been placed.

[0312] In another embodiment, during assembly, the PCB 6160 can be provided as a flat strip. However, the PCB 6160 can be configured such that it holds or partially holds a shape after bending. The PCB 6160 can be configured such that can be more easily bent in particular regions, such as a region that is designed to be bent, and stiffer in other regions, such as a region that is designed to be flat. Details of forming a PCB, such as 6160, with variable stiffness properties is described in more detail with respect to Figures 66A and 66B.

[0313] In yet another embodiment, the PCB 6160 can be formed into its bent shape prior to assembly. For instance, the PCB 6160 can be molded in a bent shape. In another example, the PCB 6160 can be formed in a flat shape but then manipulated into a bent shape prior to assembly of the portable computing device. Then, a PCB 6160 in a bent shape can be provided for the assembly process.

[0314] In various embodiments, the PCB 6106 can include components that are attached to only a top side of the PCB 6160, to only a bottom side of the PCB 6160 or to both the top and bottom of the PCB 6160. The attached components can extend above the surfaces of the PCB 6160. The component locations can be selected according to the available spaces within the housing when the PCB 6160 is its installed position. Further, the component locations can be selected based upon where the intended bending locations are located on the PCB. In some embodiments, it can be desirable to attach certain components away from regions that are intended to be significantly bent because the bending can damage the component or its attachment to the PCB 6160.

[0315] Figures 63B and 63C show a top and bottom view of PCB 6160. In Figure 63B, on the top of the PCB 6160 components 6162a and 6162b are placed near the ends of the PCB 6160. In one embodiment, the components can be placed away from the bending axis 6165 where a bending direction is indicated by arrow 6164 because a large amount of bending may damage a components attachment to the PCB 6160.

[0316] The height clearances associated with each component attached to PCB 6160, such as components 6162a through 6162b, can vary from component to component. For instance, the component 6162b can extend farther from the top of the board than component 6162a. The height of each component affects the amount of clearance or space that is needed when the PCB 6160 is installed. This height of each component can affect where each component is positioned on PCB 6160. For example, when PCB 6160 is in an installed position, component 6162b is in a location where the PCB 6160 extends away from the device component 6165. The component 6162b position on PCB 6160 can have been selected so that it is located in this area away from device component 6165 when it is installed because there can be more space available in this region than in the space between the device component 6165 and the housing 6100.

[0317] As described above, PCB 6160 can include components on its top and bottom surfaces. The layout and number of components on each of the top and bottom surfaces can be different than one another. For instance, in Figure 63B, on the top surface of PCB 6160, two components are attached widely apart from one another. In Figure 63C, three components, with sizes different from one another, are shown attached to a bottom surface of PCB 6160 relatively close to one another as compared to the components shown in Figure 63B.

[0318] Figures 64A-65E show top and side views of a bendable PCB 6170 in various bend configurations. As described above, a bendable PCB, such as 6170, can be formed in a bent configuration. For example, each of the configurations shown with respect to Figures 64A-65E can be formed in the bent configuration shown each of the figures. In alternative embodiments, the PCB 6170 can be formed in an unbent configuration and then bent to another configuration before or during assembly. For example, the PCB 6170 can be formed in either of the configurations shown in Figures 64B and 64C and then bent to the configuration shown in Figure 64A. As another example, the PCB 6170 can be formed in the configuration shown in Figure 64A and then bent around axis 6165 according to the direction 6164 to achieve the configurations shown in Figures 64B and 64C, respectively.

[0319] A PCB, such as 6170, can be configured to return to its original shape after bending or can be configured to maintain or partially maintain a particular bent configuration after bending takes place. At a particular location, a PCB, such as 6170, can be bent through multiple axes. Also, a PCB can be bent and twisted at a particular location. In Figures 65D and 65E portions 6170a and 6170c are installed in a configuration at an angle to one another and at different heights, this installation configuration introduces a bend and a twist to portion 6170b of PCB 6170.

[0320] In other embodiments, a PCB, such as 6170, can be bent in multiple locations. For instance, in Figure 64A, each of portions 6170a, 6170b and 6170c can be bent around a particular axis, in a particular direction and for a particular amount (e.g., each portion can be bent through a particular angle amount in a particular direction about an axis). As another example, in Figure 64 A, portion 6170a, 6170b and/or 6170c can each be bent at multiple locations. For instance, portion 6170b can be bent at two different locations. Thus, an assembly including an installation of a particular PCB 6170 can include multiple different bending steps.

[0321] The bendable PCB 6170 can be shaped and/or bent to fit in a space around a particular object. For instance, in Figure 65A, a side view of an internal device component 6176a is shown surrounded by PCB 6170. The PCB 6170 can be bent to proximately conform to a side perimeter of the component 6176a. The side perimeter of component 6176a can include straight line portions, stepped line portions or curved line portions. As shown in Figures 64B and 64C, the PCB 6170 can be bent to fit around a curved surface, such as when device component 6176a includes a curved side perimeter.

[0322] In Figure 65B, a side view of a device component 6176b is shown. The PCB 6170 can be bent to fit around a top and bottom surface of component 6176b. The component 6176b can be irregularly shaped. For instance, component 6176b includes two indentations. Board components 6178a and 6178b are placed at locations on a top surface of PCB 6170 such that when the PCB 6170 is bent around component 6176b, the board components extend into the space provided by the indentations in the side profile of component 6176b.

[0323] In Figure 65C, a side view of a device component 6176c and a side view of device component 6180 are shown. In one embodiment, the device component 6180 can be a structural component, such as an internal frame. PCB 6170 can be bent around device component 6176c and device component 6180. Component 6178a can be located on a top surface of PCB 6170 and components 6178b can be located on a bottom surface of PCB 6170. The components 6178a and 6178b can be located to fit into spaces surrounding device components 6176c and 6180 that are created by their orientations.

[0324] The PCB 6170 is shown bent such that a bottom surface of PCB 6170 is proximately parallel to a side of device component 6176c. In one embodiment, the bottom surface of PCB 6170 can include a connector. The connector can be positioned on PCB 6170 such that when the PCB 6170 is bent in its installed configuration, the connector aligns with a connector on the side of device 6176c allowing the two connectors to be joined. The two connectors can be joined in various ways. For instance, the two connectors can be configured to be snapped or to be soldered together.

[0325] As previously described, bendable PCBs are provided. It can be desirable to configure the PCBs such that after bending, a bent shape is maintained. In general, it can be desirable to vary the stiffness properties associated with a bendable PCB. With respect to Figures 66A-66B, methods and PCB configurations are described that can be used to form PCBs with different stiffness properties. Figure 66A shows a side cross section of a multi-layered PCB 6200. The number of layers is provided for the purposes of illustration as more or less layers than shown can be utilized.

[0326] The PCB 6200 can include a number of trace layers, such as 6202a, 6202b, 6202c and a number of substrate layers, such as 6206a, 6206b and 6206c. The trace layers can be used to form data and/or power connections to and between various PCB components, such as 6204a and 6204b. The PCB components, 6204a and 6204b are shown located on a top surface of PCB 6200 but in other embodiments, components can also be located on a bottom surface of PCB 6200.

[0327] The trace layers are typically formed from a conductive material such as copper. The trace layer can be formed as a solid layer, such as foil layer, and then a portion of the layer can be etched or milled away to form the traces that connect the various components.

[0328] The substrate layers can be formed from different materials depending on the insulating requirements of the particular circuits on the PCB board. A few examples of substrate materials that can be used are (Teflon), FR-4, FR-1, CEM-1 or CEM-3. The different layers can be laminated together with an epoxy resin prepeg. A few examples of prepeg materials that can be utilized include but are not limited to FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester).

[0329] The substrate and trace layers can be adjusted to affect their stiffness and flexibility. For instance, a trace layer or substrate layer can be made thicker or thinner to increase or decreased to make the multi-layered PCB stiffer or more flexible. Further, a substrate or trace layer material can be selected for its relative stiffness compared to other materials.

[0330] In one embodiment, a metal layer selected for its stiffness properties rather conductive properties can be substituted for a trace layer. The metal layer can be strong enough such that when the multi-layered PCB, such as 6200, is bent, the PCB maintains the bent shape. One or more such layers can be used in a multi-layered PCB. In some embodiments, these "stiffening" layers may not include traces.

[0331] In a particular embodiment, a stiffening layer can be composed a shape memory alloy such as Nitinol. The shape memory alloy can be formed in a desired bent shape and then flattened and installed on a PCB, such as 6200. The shape selected for the shape memory alloy layer can be a desired bent shape for the PCB, such as 6200. Board components can be attached to the PCB 6200 in its flattened position. Then, the shape memory allow can be manipulated to return it to the shape held in its memory. For instance, the shape memory can be heated. When the shape memory alloy returns to the position in its memory, the whole PCB can be bent into this configuration.

[0332] Figures 66B show top views of two trace layers, such as 6202a, 6202b or 6202c, in the multiplayer PCB of Figure 66A. A first trace layer includes 4 traces 6212a, 6212b, 6212c and 6216. The traces can be over a substrate 6218. The PCB 6200 is configured to be bent around axis 6165 according to direction 6165. In this region, traces 6212a, 6212b and 6212c can be thickened to resist damage that can result from bending. Trace 6216 is already thick, so its size is not increased in the bend area proximate to axis 6165.

[0333] Typically, excess material not used to form a trace is removed from the trace layer. In one embodiment, excess material can be left to stiffen the PCB in certain areas. For instance, excess material, such as 6208 and 6210, can be left to stiffen the PCB in these areas. In one embodiment, excess material is removed near the bend axis 6165. The excess material can be removed to allow the PCB to be less stiff in this area and bend more easily.

[0334] Another trace layer is shown in Figure 66B that includes no traces and just material 6220. This material can be selected solely for its strength characteristics, such as its stiffness properties. A portion of the material is removed near the bend axis to allow the PCB to bend more easily in this area. In other embodiment, additional material can be added in this region rather than removed. The additional material can be added to allow the trace layer and hence the PCB hold a shape after it is bent around axis 6165.

[0335] Figure 67 is a flow chart of a method 6300 of manufacturing a portable computer device using a multi-layered PCB. In 6302, a board shape can be determined. The board can have different sized portions depending on the spaces in which each portion is intended to fit as well as whether each of the portions are to be bent and if so by how much. As previously described, the board can be formed flat or can be formed in a configuration that already includes bent portions.

[0336] In 6304, component locations on a top and/or bottom surfaces of the board can be selected. The component locations can be selected based upon the available spaces around the board in its installed configuration. In 6306, trace locations and trace locations for the board can be determined. The trace locations can be made thicker in locations where more board bending is expected.

[0337] In 6308, board stiffness properties can be selected. Then, trace material in trace layers can left in certain areas or removed in certain areas to adjust the stiffness or flexibility characteristics of the board. Further, one or more layers can be dedicated towards adjusting the stiffness characteristics of the board. For example, a metal layer, selected for its strength, can be used to allow the board to hold a shape after it is bent.

[0338] In 6310, the bendable PCB can be formed according to the specifications determined above. It can be formed in a flat shape or can be formed in a bent state. Various components can be attached to the PCB. In 6312, a portable computing device can be assembled using a formed PCB. The assembly process can involve installing the formed PCB in a bent configuration. The formed PCB can be bent one or more times during the assembly process.

[0339] In particular embodiments, the portable computing can be assembled using a computer aided manufacturing and assembly process. The computer aided manufacturing and assembly process can involve the use of multiple devices, such as multiple devices configured in an assembly line configuration. For instance, in 6310, in a first computer aided assembly process multiple devices can be programmed to form the bendable PC according to the specifications determined in 6302-6308. The first computer aided assembly process can involve programming different devices to form and/or cut board substrates in a particular shape and lay down particular trace patterns that can vary from substrate layer to substrate layer on the PCB. Another computer aided and manufacturing process could involve devices, such as robotic assemblers, that can be programmed to assemble the portable computing device. The robotic assemblers can be programmed to move the PCB through one or more bend configurations during the assembly of the portable computing device.

[0340] Figure 68 is a block diagram of a media player 6400 in accordance with the described embodiments. The media player 6400 includes a processor 6402 that pertains to a microprocessor or controller for controlling the overall operation of the media player 6400. The media player 6400 stores media data pertaining to media items in a file system 6404 and a cache 6406. The file system 6404 is, typically, a storage disk or a plurality of disks. The file system typically provides high capacity storage capability for the media player 6400. However, since the access time to the file system 6404 is relatively slow, the media player 6400 also includes a cache 6406. The cache 6406 is, for example, Random-Access Memory (RAM) provided by semiconductor memory. The relative access time to the cache 6406 is substantially shorter than for the file system 6404. However, the cache 6406 does not have the large storage capacity of the file system 6404. [0341] Further, the file system 6404, when active, consumes more power than does the cache 6406. The power consumption is particularly important when the media player 6400 is a portable media player that is powered by a battery (not shown).

[0342] The media player 6400 also includes a user input device 6408 that allows a user of the media player 6400 to interact with the media player 6400. For example, the user input device 6408 can take a variety of forms, such as a button, keypad, dial, etc. Still further, the media player 6400 includes a display 6410 (screen display) that can be controlled by the processor 6402 to display information to the user. A data bus 6411 can facilitate data transfer between at least the file system 6404, the cache 6406, the processor 6402, and the CODEC 6412.

[0343] In one embodiment, the media player 6400 serves to store a plurality of media items (e.g., songs) in the file system 6404. When a user desires to have the media player play a particular media item, a list of available media items is displayed on the display 6410. Then, using the user input device 6408, a user can select one of the available media items. The processor 6402, upon receiving a selection of a particular media item, supplies the media data (e.g., audio file) for the particular media item to a coder/decoder (CODEC) 6412. The CODEC 6412 then produces analog output signals for a speaker 6414. The speaker 6414 can be a speaker internal to the media player 6400 or external to the media player 6400. For example, headphones or earphones that connect to the media player 6400 would be considered an external speaker.

Porting Audio Using A Connector in A Small Form Factor Electronic Device

[0344] Aspects of the described embodiments relate to a small form factor electronic product. For the remainder of this discussion, the small form factor electronic device will be described in terms of a personal media device. The personal media device can include housing suitable for enclosing and supporting various operational components. The housing can support various input/output mechanisms such as volume switches, power buttons, data and power connectors, audio jacks and the like. The housing can include openings to accommodate the input/output mechanisms. The locations at which the input/output mechanisms are placed can be selected to enhance the usability of the interface under conditions for which the device is intended to operate. For instance, for a device intended to be operated with a single hand, the input mechanisms, such as an audio control switch, can be placed at a location that are easily finger operated while the device is held in the palm of the hand. Other output mechanisms, such as an audio jack, can be placed at locations that do not interfere with holding the device, such as on a top edge of the device.

[0345] Device components that connect to and allow the personal media device to operate for its intended functions can be packaged within the enclosure. Some flexibility can be afforded in regards to the locations of the internal device

components as long as sufficient space for needed connectors between components is available. Also, approaches, such as custom-shaped printed circuit boards (PCBs) or batteries, can be employed to allow available internal spaces to be efficiently utilized. The personal media device can include audio circuitry adapted to produce audible sound. The audible sound can be created by an acoustic device that receives and uses the audio signals to modulate a volume of air within an enclosure. In one

embodiment, the audible sound can be generated by an audible sound generator enclosed within the housing. The audible sound can take the form of music provided by decoding music files retained in the personal media device. The audible sound can be actively ported through more than one opening in the housing of the personal media device. The audible sound generator can take the form of acoustic speakers having at least a diaphragm, the acoustic speakers being enclosed within an acoustic enclosure, also referred to as a speaker box. In one implementation, the openings can include a first opening in the housing used to direct at least a portion of the audible sound generated by the acoustic speakers. A second opening can be used to direct at least a remaining portion of the audible sound generated by the acoustic speakers. The second opening can be associated with a connector assembly and be referred to as a connector port.

[0346] The connector assembly used to accommodate the connector port can be widely varied. For example, the connector assembly can take the form of a data/power connector (such as a standard 30 pin type connector). The connector assembly can also be associated with an output device such as an audio jack having an audio jack barrel with a size and shape in accordance with an audio post. The audio post can be inserted into the audio jack barrel. In this way electrical contacts on the audio post engage corresponding contact pads on an interior surface of the audio jack barrel allowing electrical signals to pass between an external circuit (such as headphones) and the personal media device. Typically, when the audio post is inserted into the audio jack barrel, the acoustic speakers are disabled such that the insertion of the audio jack into the audio jack barrel does not interfere with the outputting of audible sound.

[0347] In order to enhance the listening experience, interior dimensions of the connector port/speaker assembly can be acoustically optimized for transport of sound energy. In one implementation, the housing port and the connector port can have different sizes. One of the advantages to using more than one port is that the overall audio experience can be enhanced due in part to the increase in perceived sound volume. In addition to increasing overall perceived volume, the configuration of housing port and connection port makes fully covering both the housing port and the connector port very unlikely. Therefore, a user can hold the personal media device without worrying about completely disrupting the air path from the speakers to the external environment. Furthermore, the presence of a second port reduces the overall resistance to air flow in the air-path from the speaker to the outside world resulting in a better acoustic experience.

[0348] These and other embodiments are discussed below with reference to Figs. 71 - 82. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting.

[0349] Figs. 71 - 72 are perspective diagrams showing various views of fully assembled personal media device 7100 in accordance with an embodiment of the invention. Personal media device 7100 can be sized for one-handed operation and placement into small areas such as a pocket, i.e., personal media device 7100 can be a handheld pocket sized electronic device. By way of example, personal media device 100 can correspond to a computer, media device, telecommunication device and/or the like. Personal media device 7100 is capable of processing data and more particularly media such as audio. Personal media device 7100 can generally correspond to a music player, game player, video player, personal digital assistant (PDA), and/or the like. With regards to being handheld, personal media device 7100 can be operated solely by the user's hand(s), i.e., no reference surface such as a desktop is needed. In some cases, the handheld device is sized for placement into a pocket of the user. By being pocket sized, the user does not have to directly carry the device and therefore the device can be taken almost anywhere the user travels (e.g., the user is not limited by carrying a large, bulky and heavy device).

[0350] Personal media device 7100 can be widely varied. In some embodiments, personal media device 7100 can perform a single function (e.g., a device dedicated to playing and storing media) and, in other cases, the personal media device can perform multiple functions (e.g., a device that plays/stores media, receives/ transmits telephone calls/text messages/internet, and/or performs web browsing). Personal media device 7100 is capable of communicating wirelessly (with or without the aid of a wireless enabling accessory system) and/or via wired pathways (e.g., using traditional electrical wires). In some embodiments, personal media device 7100 can be extremely portable (e.g., small form factor, thin, low profile, lightweight).

Personal media device 7100 can even be sized for one-handed operation and placement into small areas such as a pocket, i.e., personal media device 7100 can be a handheld pocket sized electronic device. Personal media device 7100 can correspond to any of those electronic devices an iPod™ , or an iPhone™ available by Apple Inc. of Cupertino, California.

[0351] Personal media device 7100 can include housing 7102 configured to at least partially enclose any suitable number of components associated with personal media device 7100. For example, housing 7102 can enclose and support internally various electrical components (including integrated circuit chips and other circuitry) to provide computing operations for the device. The integrated circuit chips and other circuitry can include a microprocessor, memory, a battery, a circuit board, I/O, various input/output (I/O) support circuitry and the like. Although not shown in this figure, housing 7102 can define a cavity within which the components can be positioned and housing 7102 also can physically support any suitable number of mechanisms, within housing 7102 or within openings through the surface of housing 102.

[0352] In addition to the above, housing 7102 can also define at least in part the outward appearance of personal media device 7100. That is, the shape and form of housing 7102 can help define the overall shape and form of personal media device 100 or the contour of housing 7102 can embody the outward physical appearance of personal media device 7100. Any suitable shape can be used. In some embodiments, the size and shape of housing 7102 can be dimensioned to fit comfortably within a user's hand. In some embodiments, the shape includes a slightly curved back surface and highly curved side surfaces. Housing 7102 is integrally formed in such as way as to constitute is a single complete unit. By being integrally formed, housing 7102 has a seamless appearance unlike conventional housings that include two parts that are fastened together thereby forming a reveal, a seam there between. That is, unlike conventional housings, housing 7102 does not include any breaks thereby making it stronger and more aesthetically pleasing. Housing 7102 can be formed of any number of materials including for example plastics, metals, ceramics and the like. In one embodiment, housing 7102 can be formed of stainless steel in order to provide an aesthetic and appealing look and feel as well as provide structural integrity and support for all sub-assemblies installed therein. When metal, housing 7102 can be formed using conventional collapsible core metal forming techniques well known to those skilled in the art.

[0353] Personal media device 7100 also includes cover 7106 that includes a planar outer surface. The outer surface can for example be flush with an edge of the housing wall that surrounds the edge of the cover. Cover 7106 cooperates with housing 7102 to enclose personal media device 7100. Although cover 7106 can be situated in a variety of ways relative to the housing, in the illustrated embodiment, cover 7106 is disposed within and proximate the mouth of the cavity of housing 7102. That is, cover 7106 fits into an opening 7108. In an alternate embodiment, cover

7106 can be opaque and can include touch sensing mechanism that forms a touch pad. Cover 7106 can be configured to define/carry the user interface of personal media device 7100. Cover 106 can provide a viewing region for display assembly 7104 used to display a graphical user interface (GUI) as well as other information to the user (e.g., text, objects, and graphics). Display assembly 7104 can be part of a display unit (not shown) that is assembled and contained within housing 7102. Such user input events can be used for any number of purposes, such as resetting personal media device 7100, selecting between display screens presented on display assembly 7104, and so on. In one embodiment, cover 7106 is a protective top layer of transparent or semitransparent material (clear) such that display assembly 7104 is visible therethrough. That is, cover 7106 serves as a window for display assembly 7104 (i.e., the transparent cover overlays the display screen). In one particular embodiment, cover 7106 is formed from glass (e.g., cover glass), and more particularly highly polished glass. It should be appreciated, however, that other transparent materials such as clear plastic can be used.

[0354] The viewing region can be touch sensitive for receiving one or more touch inputs that help control various aspects of what is being displayed on the display screen. In some cases, the one or more inputs can be simultaneously received (e.g., multi-touch). In these embodiments, a touch sensing layer (not shown) can be located below the cover glass 7106. The touch sensing layer can for example be disposed between the cover glass 7106 and the display assembly 7104. In some cases, the touch sensing layer is applied to display assembly 7104 while in other cases the touch sensing layer is applied to the cover glass 7106. The touch sensing layer can for example be attached to the inner surface of the cover glass 7106 (printed, deposited, laminated or otherwise bonded thereto). The touch sensing layer generally includes a plurality of sensors that are configured to activate as the finger touches the upper surface of the cover glass 7106. In the simplest case, an electrical signal is produced each time the finger passes a sensor. The number of signals in a given time frame can indicate location, direction, speed and acceleration of the finger on the touch sensitive portion, i.e., the more signals, the more the user moved his or her finger. In most cases, the signals are monitored by an electronic interface that converts the number, combination and frequency of the signals into location, direction, speed and acceleration information. This information can then be used by the personal media device 7100 to perform the desired control function relative to display assembly 7104.

[0355] Personal media device 7100 can also include one or more switches including power switches, volume control switches, user input devices and the like. Power switch 7110 can be configured to turn personal media device 7100 on and off, whereas volume switch 7112 is configured to modify the volume level produced by the personal media device 7100. Personal media device 7100 can also include one or more connectors for transferring data and/or power to and from personal media device 7100. For example, opening 7115 can accommodate audio jack 7116 whereas opening 7117 can accommodate data/power connector 7118. Audio j ack 7116 allows audio information to be outputted from personal media device 7100 by way of a wired connector whereas connector 7118 allows data to be transmitted and received to and from a host device such as a general purpose computer (e.g., desktop computer, portable computer). Connector 7118 can be used to upload or down load audio, video and other image data as well as operating systems, applications and the like to and from personal media device 7100. For example, connector 7118 can be used to download songs and play lists, audio books, photos, and the like into the storage mechanism (memory) of personal media device 7100. Connector 7118 also allows power to be delivered to personal media device 7100.

[0356] Portion 7200 of personal media device 7100 can include a number of communication features. For example, portion 7200 can include at least first audio port 7120 that can be used to output a first portion of audible sound generated by an audible sound generator assembly enclosed within housing 7102. The audible sound generator assembly can take many forms. In the described embodiment, however, the audible sound generator assembly includes at least a diaphragm arranged to synchronously vibrate with audio signals provided by a processing unit included in personal media device 7100. The audio signals can be provided by the processing unit decoding audio data files retained within personal media device 7100. Enclosed within connector assembly 7118, second audio port 7122 can be used to output a remaining portion of the audible sound generated by the audible sound generator assembly. In this way, first audio port 7120 and second audio port 7122 can cooperatively output the audible sound generated by the audible sound generator assembly. By cooperative it is meant that when, for example, first audio port 7120 is blocked or otherwise obstructed (by a finger, clothing, etc.), the placement of second audio port 7122 substantially precludes the likelihood that second audio port 7122 will also be blocked. Therefore, since first audio port 7120 and second audio port 7122 share an air path from the audible sound generator to the external environment, when one portion of the air path (that portion associated with first audio port 7120, for example) is blocked or otherwise obstructed, at least some of the first portion of audible sound generated by the audible sound generator assembly can be passively redirected to second audio port 7122 thereby substantially preserving an overall perceived sound output level.

[0357] As an example, since connector assembly 7118 can receive an external connector (such as a 30 pin connector), a substantial portion of second audio port 7122 can be blocked or obscured when the connector is engaged with connector assembly 7118. In this situation, it is unlikely that a user of personal media device 7100 will grasp housing 7102 in such as way as to obscure or block first audio port 7120. Therefore, even though the engaged connector can substantially block or obscure second audio port 7122, the presence of first audio port 7120 helps to maintain the overall perceived audio output level by outputting at least some of the audible sound passively re-directed from second audio port 7122 to first audio port 7120.

[0358] Fig. 73 shows a cross-sectional view of a portable electronic device 7100 shown in Figs. 71 - 72. Housing 7102 can enclose various internal device

components such as those associated with the user interface that allow personal media device 7100 to operate for its intended functions. For the purposes of discussion, the internal device components can be considered to be arranged in a number of stacked layers. For example, a display screen of the display assembly 7104 can be located directly below the top glass 7106. In one embodiment, the display screen and its associated display driver circuitry can be packaged together as part of the display assembly 7104. Below display assembly 7104, device circuitry 7130, such as a main logic board or circuitry associated with other components, and a battery 7132, which provides power to personal media device 7100, can be located.

[0359] Internal frame 7140 can add to the overall stiffness of personal media device 7100 by, for example, enhancing an ability to resist bending moments experienced by housing 7102. Internal frame 7140 can be formed of many strong and resilient materials. For example when internal frame 7140 is formed of metal such as stainless steel, internal frame 7140 can be referred to as M(etal)-frame 7140. M- frame 7140 can provide both structural support for personal media device 7100 but also act to aid in the transfer of heat generated by the various internal components to the external environment. M-frame 7140 can be located below the display assembly 7104 and above the device circuitry 7130. In this way, M-frame 7140 can provide support for various internal components as well as aid in transferring heat from internal components such as display assembly 7104.

[0360] M-frame 7140 can be used as an attachment point for other device components. For example, M-frame 7140 can be attached to mounting surface, such as 7134a and 7134b, on housing 7102 via fasteners or using a bonding agent. Then, other device components, such as display assembly 7104 can be coupled to M-frame 7140 rather than directly to housing 7102. One advantage of coupling display assembly 104 to the housing via M-frame 7140 is that display 7140 can be somewhat isolated from bending moments associated with housing 7102, i.e., bending moments generated on the housing can be dissipated into M-frame 7140. Isolating the display assembly 7104 from bending moments associated with housing 7102 can prevent damage to display assembly 7104, such as cracking, from occurring.

[0361] It should be noted that in some embodiments, personal media device 7100 can include additional internal frames. For example, frame 7150 can be affixed directly to housing 7102 and generally may act to support top glass 7106. In this regard, frame 7150 can be referred to as G(lass)-frame 7150. In order to support cover glass 7106, G-frame 7150 can include rim 7152 having flange portion 7154 where cover glass 7106 is glued to rim 7152 about flange 7154, thus sealing the entire device. G-frame 7150 can be made of an electrically non-conductive frame material, such as a glass filled plastic. One example glass-filled plastic suitable for use in G- frame 7150 is KALIX™, manufactured by Solvay Advanced Polymers of Alpharetta, GA. KALIX™ includes 50% glass-fiber reinforced high-performance nylon. One of ordinary skill in the art will recognize that there are many other potential frame materials that would be suitable for use with this embodiment, and the claims should not be construed as being limited to KALIX™ or any other glass-filled plastic unless expressly stated.

[0362] Fig. 74 shows an enlarged view of portion 7200 of housing 7102 shown in Fig. 72 viewed head on. For the remainder of this discussion and without loss of generality, first audio port 7120 will be referred to as housing port 7202 and second audio port 7120 as connector port 7204. Housing port 7202 can have a size and shape in keeping with the overall shape and appearance of housing 7102. For example, side walls 7206 of housing 7102 can have a spline, or curved shape that facilitates a user holding personal media device 7100 in a hand. Accordingly, housing port 7202 can be shaped to more readily blend in with the shape of sidewalls 7206. Housing port 7202 can be located distance "d" from rear surface 7208 of housing 7102. Housing port 7202 can be configured in such a way that sound 7210 emanating from housing port 7202 can be directed at angle Θ towards rear surface 7208 of housing 7102 as shown in Fig. 75. In this way, when personal media device 7100 is placed upon supporting surface S, audible sound 7210 emanating from housing port 7202 can be directed at angle Θ with respect to surface S resulting in at least some of audible sound 7210 being directed towards supporting surface S. In this way, supporting surface S can act as a sound board such that at least a portion of audible sound 7210 can reflect off of supporting surface S resulting in a more robust sounding audio presentation.

[0363] Fig. 76 shows a view of interior portion 7500 of personal media device 7100 in accordance with the described embodiments. As shown in Fig. 76, M-frame 7140 can be used to provide support for various internal components such as audio sound generator assembly 7504 and connector assembly 7506. In the described embodiment, audio sound generator assembly 7504 can be secured to housing 7102 by way of G-frame 7150 and M-frame 7140. Connector assembly 7506 can be surface mounted to printed circuit board (PCB) 7508. Audio sound generator assembly 7504 can include speaker box 7510 having first part 7512 and second part 7514. First part 7512 can include audio sound generator unit 7516 arranged to provide audible sound 7518. First part 7512 can be configured to provide first air path 7520. First air path 7520 can acoustically couple audio sound generator unit 7516 and housing port 7202 by way of housing port assembly 7522. In this way, first portion 7524 of audible sound 7518 can pass from audio sound generator unit 7516 to the external environment by way of housing port assembly 7522 and housing port 7202 using first air path 7520.

[0364] Second part 7514 can be integrally formed with first part 7512. Second part 7514 (also referred to as a "side car" portion) can be configured to provide second air path 7526. Second air path 7526 can acoustically couple audio sound generator unit 7516 and connector port 7204 by way of connector assembly 7506. In this way, second portion 7528 of audible sound 7518 can use second air path 7526 to pass from audio sound generator unit 7516 to the external environment by way of connector port 7204. In order to assure a secure attachment of audio sound generator assembly 7504, fastener 7530 can be used. Fastener 7530 can be widely varied. Fastener 7530 can take the form of screw 7530 that secures audio sound generator assembly 7504, M-frame 7140, and connector assembly 7506 to housing 7102.

[0365] The presence of at least two parallel air paths in the form of first air path 7520 and second air path 7526 has a number of advantages. One such advantage is that the presence of at least two air paths can reduce an overall resistance to air flow thereby reducing the amount of audible sound energy lost during normal operation. In this way, the audible efficiency (i.e., the perceived sound level at a given volume input level) can be substantially increased. Furthermore, by providing at least two parallel air paths along which audible sound 7518 generated by audible sound generator unit 7516 can travel, any increase in resistance to air flow that develops in one air path can be at least partially compensated by passive re-direction to the other air path representing the air path of lesser resistance. In this way, even if one audio output port is partially or even fully blocked, the perceived output sound level will not substantially decrease. In this way, the preservation of audio presentation provided by personal media device 7100 can substantially improve user perception of the audio performance of personal media device 7100.

[0366] For example, when audio sound generator unit 7516 is providing audible sound 7518, first portion 7524 can pass to housing port 7202 by way of first air path 7520. Second portion 7528 of audible sound 7518 can concurrently pass to connector port 7204 by way of second air path 7526. As perceived by a user, the perceived sound levels (i.e., acoustic energy level) at housing port 7202 and connector port 7204 are about the same. In other words, the overall audio perception would lead the listener to conclude that audible sound 7210 is in fact emanating from a single location and not at least two. However, if, for example, the user placed a finger or other object in a position to block or obscure housing port 7202, then the resistance to air flow in air path 7520 would increase significantly resulting in a substantial reduction in the amount of acoustic energy output at housing port 7202. In this situation, the increase in resistance to air flow experienced at first air path 7520 can passively cause at least some of first portion 7524 to be re-directed from first air path 7520 to second air path 7526. In this way, even though the amount of acoustic energy output at housing port 7202 is substantially reduced, the amount of acoustic energy output at connector port 7204 can substantially increase due to the passive re-direction of acoustic energy from first air path 7520 to second air path 7526. In this way, the perceived overall audio output level (i.e., volume level) can remain substantially unchanged.

[0367] Therefore, it is clear that the overall integrity of first air path 7520 and second air path 7526 is important to maintaining at least some of the advantages described above especially with regards to audio efficiency, perception of audio balance between the various output ports, and the ability to preserve the overall acoustic experience. For example, any systemic increase in resistance to air flow in an air path can reduce the overall audio efficiency of audio sound generator assembly 7504. For example, second air path 7526 is directly connected to the external environment by way of connector port 7204. In order to prevent the intrusion of dust and other debris from the external environment from degrading the quality of air path 7526 (by, for example, increasing the systemic resistance to air flow due to the accumulation of debris), filter 7532 can be placed between port connector 7204 and second part 7514. Filter 7532 (shown and discussed in more detail below) can be used to prevent water and debris such as dust from contaminating second air path 7526. Moreover, in the described embodiments, filter 7532 can be both strong yet accessible providing for a user with the ability to periodically clean filter 7532 without causing damage. Moreover, foam seal 7533 and foam seal 7535 can be concurrently applied to housing port 7202 and connector port 7204. Foam seal 7533 used to air seal housing port 7202 can take the form of a relatively thick layer of foam and a cosmetic mesh whereas foam seal 7535 can take the form of a ring of foam using a lap joint on connector port 7204.

[0368] In a particularly useful embodiment, filter 7532 can take the form of cosmetic/hydrophobic mesh stack 7532 that can be placed in air path 7526. When placed in air path 7526, cosmetic/hydrophobic mesh stack 7532 can prevent moisture and dust from intruding into personal media device 7100. The mesh stack 7532 can include a number layers including at least a mesh layer. The mesh layer can provide a cosmetic screen that can prevent direct view of the interior of personal media device 7100 from the exterior environment. Generally, the mesh portion of mesh stack 7532 can be formed of a rugged and water resistant material. In some cases, the mesh material can be strong enough to provide at least some structural support for connector port 7204. The strength of the cosmetic mesh can be sufficiently great to resist damage caused by, for example, the insertion of an object into the connector port.

[0369] In addition to providing protection from dust and water intrusion as well as protecting the interior of personal media device 7100, the mesh remains accessible for cleaning and debris removal. The accessibility of the mesh is particularly useful since the likelihood that dust or other debris can collect at mesh stack 7532 is fairly significant. Dust or other debris collecting at the mesh can be particularly irksome since contaminants, such as dust, can collect at the mesh and impede the output of audible sound thus degrading the overall performance of personal media device 7100 as well as the overall user experience. The mesh can be cleaned of debris such as dust and lint by simply inserting a cleaning tool such as a damp cotton swab thereby preventing the seal from becoming clogged and reducing sound output.

[0370] Features such as air seal 7534 can be used to help maintain the integrity of second air path 7526. Air seal 7534 can be used to seal the junction between a rear portion of connector assembly 7506 and second part 7514. Seal 7534 can be formed of any suitably compliant material having appropriate sealant characteristics. For example, seal 7534 can take the form of foam seal 7534. Due to the compressible nature of foam, foam seal 7534 can be compressed in place between adapter 7536 of second part 7514 and adapter 7538 of connector assembly 7506 (shown in Fig. 77). In the described embodiment, adapter 7536 can be shaped in accordance with adapter 538 such that adapter 7536 can be tight fitted together. In this way, adapter 7536 can fit tightly within an accommodating space provided by adapter 7538.

[0371] During assembly, audio sound generator unit 7504 can be placed within housing 7102 using a tilting action. The tilting action can cause adapter 7536 to tilt into and be accommodated by adapter 7538 at which point, pressure can be applied to second part 7514 that can connect and secure audio sound generator unit 7504 to both connector assembly 7506 and PCB 7508. By tilting in and applying pressure, adapter 7536 can compress foam seal 7534 between adapter 7536 and adapter 7538 causing foam seal 7534 to undergo a substantial compression. In the described embodiment, adapter 7538 can be shaped in such as way to accentuate the compression that foam seal 7534 undergoes thereby greatly enhancing the ability of foam seal 7534 to block or at least substantially inhibit the intrusion of moisture or other contaminants into air path 7526. A locating pin associated with second part 7514 can be used in the tilt in insertion process. The locating pin can have a shape and location configured to be inserted through an accommodating hole in PCB 7508. Since PCB 7508 and connector assembly 7506 are soldered together during the reflow process, the locating pin can also hold second part 7514 in position such that second part 7514 cannot become easily separated from the connector assembly 7506.

[0372] Furthermore, retention feature 7540 can be used to further assure the integrity of the air seal of second air path 7526. Retention feature 7540 can be fitted to M-frame 7140 and once in place prevents adapter 7536 and adapter 7538 from separating. Accordingly, M-frame 7140 be placed on top of connector assembly 7506 and the speaker box 7510. M-frame 7140 can include a finger that can fit into retention feature 7540 that in one embodiment can be located on a shell portion of the connector assembly 7506. M-frame 7140 can also include a spring finger that can load a side of second part 7514 facing the connector assembly 7506. The force created by the spring finger can cause foam seal 7534 to hyper-compress at the junction of adapter 7534 and adapter 7536. Therefore, once in place, M-frame 7140 can prevent connector assembly 7506 and second part 7514 from separating. It should be noted that audible sound generating unit 504 can be hard mounted to the M- frame 7140 and G- frame 7150. This rigid mounting can help to prevent buzzing and amplifies audible sound through housing back 7208 that can be accentuated when personal media device 7100 is on a hard, flat surface such as desk or table.

[0373] Fig. 77 shows a close up view of portion 7600 shown in Fig. 76. Portion 7600 provides a more detailed view of the junction of connector assembly 7506 and second part 7514. In particular, portion 7600 shows additional details of the mesh stack of filter 7532. Filter 7532 can be formed of cosmetic mesh 7602 used in part to prevent intrusion of water and other contaminants such as dust from entering degrading second air path 7526. During assembly of personal media device 7100, connector assembly 7506 is mounted and attached to PCB 7508 using a surface mount technique referred to as solder reflow, or more simply, reflow. During the reflow process, molten solder is used to electrically connect various components onto electrical pads and traces that are part of PCB 7508. Due to the harsh conditions (including high temperature), filter 7532 cannot survive the reflow process used to surface mount connector assembly 7506 to printed circuit board 7508, and therefore, filter 7532 cannot be an integral part of connector assembly 7506. Therefore, filter 7532 can be installed after connector assembly 7506 has been surface mounted to

PCB 7508 using what can be referred to as a "portcullis" (i.e., a sliding gate) assembly technique. As with a sliding gate, filter 7532 can be dropped into place during assembly using slots, or grooves. Once in place, filter 7532 can be sealed in place using an adhesive such as glue. In this way, the filter 7532 can be sealed against environmental contaminants from entering the interior of the personal media device.

[0374] Fig. 78 shows a cross sectional view 7700 along line A-A of Fig. 76.

Cross sectional view 7700 shows a relationship between the sealing capability of foam seal 7534 and adapter 7536 and adapter 7538. In particular, retention spring 7701 can be used to apply retention force F_retention directly onto second part 7514. Retention force F_retention can, in turn, cause adapter 7536 to impinge directly onto "spear" shaped portion 7702 of adapter 7538. In this way, chamfered surfaces 7704 and 7706 of spear portion 7702 can direct components of retention force F_retention (shown as foam force F_foam) to "hyper-compress" portion 7708 of foam seal 7534 against M-frame 7150 thereby substantially increasing the sealing capability of foam seal 7534. Audible sound generating unit 7504 can include alignment pin 7710 having a size and shape in accordance with PCB opening 7712. During the assembly of personal media device 7100, connector assembly 7506 can be secured to PCB 7508 using connector alignment pin 7714 into PCB opening 7716. Seal 7718 can be used to enhance the seal and therefore reduce the likelihood of sound leaks.

[0375] Fig. 79 shows another embodiment where in place of, or in addition to, connector port 7204, audio jack port 7900 can be used to output audio sound generated by audible sound generator unit 7516 using audio jack air path 7902.

Audio jack air path 7902 can acoustically connect audible sound generator unit 7516 to audio jack unit 7904. In particular, second part 7514 can be connected to audio jack unit 7904 at, for example, audio jack barrel 7906. In this way, when not occupied by an audio jack post, portion 7908 of audible sound 7518 can emanate from audio jack port 7900. It should be noted, that when the audio jack post is inserted into audio jack barrel 7906, audible sound generator unit 7516 is typically disabled and therefore presents no conflict with any potential audible sound emanating from audio jack port 7900.

[0376] Fig. 80 shows a flowchart detailing process 8000 in accordance with the described embodiments. Process 8000 can begin at 8002 by providing a housing for enclosing a plurality of operational components used to provide functionality for a personal media device. The housing can be formed of metal such as stainless steel or aluminum and have a seamless uni-body construction. The housing can include a number of openings each having a size and shape to accommodate an input/output device, switch, connector and so forth. Next at 8004, a speaker assembly can be attached to an interior of the housing. The speaker assembly can take many forms. In the described embodiments, the speaker assembly includes an acoustic speaker formed of, for example, a diaphragm that vibrates in accordance with electrical signals provided by an audio circuit that decodes audio files retained in the personal media device. Next at 8006, a first air path is configured. The first air path acoustically couples the speaker assembly to the external environment by way of a first audio output port. In the described embodiment, the first audio output port can take the form of an opening in the housing. Next at 8008, a second air path is configured between the speaker assembly and a second audio output port independent of the first audio output port. By independent it is meant that the first audio output port and the second audio output port can be physically located such that one or the other of the ports can be blocked by an object such as a user's finger but not both. In this way, at least one of the audio ports can remain substantially unblocked at all times.

[0377] At 8010, audible sound is generated by the speaker assembly. At 8012, the audible sound is cooperatively passed from the speaker assembly to the external environment using the first and the second audio ports. By cooperatively passing it is meant that the first air path and the second air path are linked such that an increase in resistance to the transfer of acoustic energy in one air path results in a passive redirection of at least some of the acoustic energy from the air path of higher resistance to the air path of the lower resistance. For example, if the first audio output port is blocked or at least obscured resulting in an increase in resistance to the flow of acoustic energy in the first air path, then at least some of the otherwise blocked acoustic energy is re-directed to the second air path. In this way, the perceived audio output level by the personal media device remains substantially unchanged.

[0378] Fig. 81 is a block diagram of an arrangement 8100 of functional modules utilized by a portable media device. The portable media device can, for example, be portable media device 7102 illustrated in Figs. 71 and 72. The arrangement 8100 includes a media player 8102 that is able to output media for a user of the portable media device but also store and retrieve data with respect to data storage 8104. The arrangement 8100 also includes a graphical user interface (GUI) manager 8106. The GUI manager 8106 operates to control information being provided to and displayed on a display device. The arrangement 8100 also includes a communication module 8108 that facilitates communication between the portable media device and an accessory device. Still further, the arrangement 8100 includes an accessory manager 8110 that operates to authenticate and acquire data from an accessory device that may be coupled to the portable media device. For example, the accessory device can be a wireless interface accessory, such as the wireless interface accessory 7106 illustrated in FIG. 71 as being coupled to portable media device 7102.

[0379] Fig. 82 is a block diagram of a media player 8150 suitable for use with the described embodiments. The media player 8150 illustrates circuitry of a

representative portable media device. The media player 8150 includes a processor 8152 that pertains to a microprocessor or controller for controlling the overall operation of the media player 8150. The media player 8150 stores media data pertaining to media items in a file system 8154 and a cache 8156. The file system 8154 is, typically, a storage disk or a plurality of disks. The file system 8154 typically provides high capacity storage capability for the media player 8150.

However, since the access time to the file system 8154 is relatively slow, the media player 8150 can also include a cache 8156. The cache 8156 is, for example, Random- Access Memory (RAM) provided by semiconductor memory. The relative access time to the cache 8156 is substantially shorter than for the file system 8154.

However, the cache 8156 does not have the large storage capacity of the file system 8154. Further, the file system 8154, when active, consumes more power than does the cache 8156. The power consumption is often a concern when the media player 8150 is a portable media device that is powered by a battery 8174. The media player 8150 can also include a RAM 8170 and a Read-Only Memory (ROM) 8172. The ROM 8172 can store programs, utilities or processes to be executed in a non- volatile manner. The RAM 8170 provides volatile data storage, such as for the cache 8156.

[0380] The media player 8150 also includes a user input device 8158 that allows a user of the media player 8150 to interact with the media player 8150. For example, the user input device 8158 can take a variety of forms, such as a button, keypad, dial, touch screen, audio input interface, video/image capture input interface, input in the form of sensor data, etc. Still further, the media player 8150 includes a display 8160 (screen display) that can be controlled by the processor 8152 to display information to the user. A data bus 8166 can facilitate data transfer between at least the file system 8154, the cache 8156, the processor 8152, and the CODEC 8163.

[0381] In one embodiment, the media player 8150 serves to store a plurality of media items (e g., songs, podcasts, etc.) in the file system 8154. When a user desires to have the media player play a particular media item, a list of available media items is displayed on the display 8160. Then, using the user input device 8158, a user can select one of the available media items. The processor 8152, upon receiving a selection of a particular media item, supplies the media data (e.g., audio file) for the particular media item to a coder/decoder (CODEC) 8163. The CODEC 8163 then produces analog output signals for a speaker 8164. The speaker 8164 can be a speaker internal to the media player 8150 or external to the media player 8150. For example, headphones or earphones that connect to the media player 8150 would be considered an external speaker.

[0382] The media player 8150 also includes a network/bus interface 8161that couples to a data link 8162. The data link 8162 allows the media player 8150 to couple to a host computer or to accessory devices. The data link 8162 can be provided over a wired connection or a wireless connection. In the case of a wireless connection, the network/bus interface 8161 can include a wireless transceiver. The media items (media assets) can pertain to one or more different types of media content. In one embodiment, the media items are audio tracks (e.g., songs, audio books, and podcasts). In another embodiment, the media items are images (e.g., photos). However, in other embodiments, the media items can be any combination of audio, graphical or video content.

[0383] In one embodiment, the internal antenna is utilized for Wi-Fi

communications, such as those in accordance with the IEEE 802.11 a, b, g, and n standards. Wi-Fi is commonly used to wirelessly network computing devices, and as such it is common for computer-related information to be transferred over the Wi-Fi connection. Nevertheless, other types of communications have been increasingly conducted over Wi-Fi connections, including, for example, video phone calls, the downloading of electronic books to tablet computers, etc. The modular material antenna assembly described herein can be utilized for such Wi-Fi communications. In another embodiment, the internal antenna is utilized for short-range wireless networking communications, such as those in accordance with the Bluetooth™ standard.

[0384] In another embodiment, the internal antenna is utilized for wireless broadband (WiBB) communications, such as IEEE 802.16, also known as WiMAX, Local Multipoint Distribution Service (LMDS), and Multichannel Multipoint Distribution Service (MMDS). In another embodiment, the internal antenna is utilized for cellular communications. This may include communications conducted using one of many different cellular communications protocols, such as Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Evolution-Data Optimized (EV-DO), Enhanced Data Rates for GSM Evolution (EDGE), 3GSM, Digital Enhanced Cordless Telecommunications (DECT), Digital AMPS (IS-136/TDMA), and Integrated Digital Enhanced Network (iDEN).

[0385] In some embodiments, the internal antenna is a broadband antenna that can be configured to receive multiple different frequency bands. Additional bands are expected to be deployed in the future as new wireless services are made available. Antenna designs of various embodiments may be configured to operate over any suitable band or bands to cover any existing or new services of interest. If desired, multiple antennas may be provided to cover more bands or one or more antennas may be provided with wide-bandwidth resonating elements to cover multiple

communications bands of interest. An advantage of using a broadband antenna design that covers multiple communications bands of interest is that this makes it possible to reduce device complexity and cost and to minimize the amount of a handheld device that is allocated towards antenna structures.

[0386] A broadband design may be used for one or more antennas in wireless devices when it is desired to cover a relatively larger range of frequencies without providing numerous individual antennas or using a tunable antenna arrangement. If desired, a broadband antenna design may be made tunable to expand its bandwidth coverage or may be used in combination with additional antennas. In general, however, broadband designs tend to reduce or eliminate the need for multiple antennas and tunable configurations.

[0387] In addition, embodiments of the present invention further relate to computer storage products with a computer-readable medium that have computer code thereon for performing various computer-implemented operations. The media and computer code may be those specially designed and constructed for the purposes of the present invention, or they may be of the kind well known and available to those having skill in the computer software arts. Examples of computer-readable media include, but are not limited to: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROMs and DVDs and holographic devices; magneto-optical media such as floptical disks; and hardware devices that are specially configured to store and execute program code, such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs) and ROM and RAM devices. Examples of computer code include machine code, such as produced by a compiler, and files containing higher level code that are executed by a computer using an interpreter.

[0388] In one embodiment, a computer-readable medium is provided that includes computer program instructions for performing the various steps of assembling a portable electronic device. Specifically, the computer program instruction may act to control various automatic installation components, such as, for example, robotic arms, automatic

screwdrivers, etc. that can assemble the device without the need for human intervention (or, at least, minimizing human intervention). In this way, the computer instructions may be programmed to control a machine to weld a bracket to an electrically conductive housing, glue an electrically non-conductive frame to the interior of the electrically conductive housing, secure the antenna block to the frame by interlocking the portion of the antenna having a first shape with a portion of the frame having a second shape corresponding to the first shape, mechanically secure the antenna flex to the antenna block by, for example, screwing a screw through the antenna flex and the bracket, etc.

[0389] The many features and advantages of the present invention are apparent from the written description and, thus, it is intended by the appended claims to cover all such features and advantages of the invention. Further, since numerous modifications and changes will readily occur to those skilled in the art, the invention should not be limited to the exact construction and operation as illustrated and described. Hence, all suitable modifications and equivalents may be resorted to as falling within the scope of the invention.

Claims

What is claimed is: Compact Folded Configuration for Integrated Circuit Packaging

1. A method of manufacturing a portable computing device comprising:

attaching a first chip to a second chip via a flexible circuit connector;

attaching the first chip to a printed circuit board wherein the first chip is positioned within a metal frame coupled to the printed circuit board such that the metal frame partially surrounds the first chip;

folding over the flexible circuit connector and aligning the second chip with the first chip;

attaching the second chip to the first chip via an adhesive wherein the first and second chips are bonded in a stacked configuration;

grounding a portion of the flexible circuit connector to one or more sides of the metal frame to prevent RF signals from leaking from the first chip and the second chip; and

installing an assembly including the first chip, the second chip, the metal frame and the printed circuit board into the portable computing device.

2. The method of claim 1, further comprising: aligning a component attached to the flexible circuit connector with an aperture in a metal shield proximate to the first chip and the second chip.

3. The method of claim 1 or 2, wherein the portion of the flexible circuit connector includes a plurality of connector pads.

4. The method of claim 3, further comprising: soldering the connector pads to the one or more sides of the metal frame.

5. The method of claim 3, further comprising: bonding the connector pads to the one or more sides of the metal frame using a conductive tape.

6. The method of claim 1 or 2, further comprising: attaching a first portion of the flexible circuit connector to a first side of the metal frame and attaching a second portion of the flexible circuit connector to a second side of the metal frame.

7. A memory device comprising:

a first chip coupled to a first portion of flexible circuit connector;

a second chip including a top surface and a bottom surface, coupled to a second portion of the to the flexible circuit connector wherein the second portion of the flexible circuit connector proximately covers the bottom surface; a third portion of the flexible circuit connector between the first portion and the second portion;

a fourth portion of the flexible circuit connector extending from the second portion including connector pads coupled to circuit traces within the flexible circuit connector; and

wherein to install the memory device in a computing device the third portion of the flexible circuit connector is folded over to allow the top surface of the second chip to be bonded to the first chip and to allow the connector pads on the fourth portion of the flexible connector to be grounded to a metal component in the computing device.

8. The memory device of claim 7, wherein the connected pads are grounded to the metal component to allow the circuit traces to act as part of a faraday cage for preventing RF signals generated by first chip and the second chip from leaving the faraday cage.

9. The memory device of claim 7 or 8, wherein the memory device coupled to a printed circuit board including the metal component prior to installation in the computing device.

10. The memory device of claim 9, wherein the connector pads are soldered to the metal component.

11. The memory device of claim 9, wherein the connector pads are bonded to the metal component via a conductive adhesive tape.

12. The memory device of claim 7 or 8, further comprising a fifth portion of the flexible circuit connector, extending from the second portion, including second connector pads, wherein to install the memory device in the computing device the fifth portion is folded over to allow the second connector pads to be coupled the metal component.

13. A portable computing device comprising:

a housing;

an antenna coupled to the housing;

a plurality of chips coupled to each other via flexible circuit connector and arranged in a stacked configuration wherein a bottom surface of a first chip is attached to the flexible circuit connector; and a faraday cage surrounding the plurality of chips for preventing radio frequency (RF) signals generated by the chips from reaching the antenna, said faraday cage formed from a metal frame and a portion of the flexible circuit connector proximate to the bottom surface of the first chip wherein the flexible circuit connector is grounded to the metal frame.

14. The portable computing device of claim 13, further comprising: at least one portion of the flexible connector extending from the flexible connector proximate to the bottom surface of the first chip wherein the first portion is grounded to the metal frame.

15. The portable computing device of claim 13 or 14, wherein the first portion is soldered to an outside portion of the metal frame.

16. The portable computing device of claim 13 or 14, further comprising a second chip and a first portion of the flexible connector between the first chip and the second chip wherein during assembly, the first portion of the flexible connector is folded over to allow a top surface of the first chip to be attached to a top surface of the second chip.

17. The portable computing device of claim 16, further comprising a printed circuit board wherein the second chip is coupled to the printed circuit board.

18. The portable computing device of claim 17, wherein the metal frame is formed from a silver-nickel alloy.

Internal Frame Optimized for Stiffness and Heat Transfer

19. A thermostructural component for a portable computing device comprising: an internal metal frame formed from at least two different metals wherein the two different metals are arranged in layers, the internal metal frame comprising:

two outer metal layers formed from a first metal and configured to add structural stiffness to the internal metal frame; and

a middle metal layer, disposed between the two outer metal layers, formed from a second metal with a thermal conductivity greater than the first metal, said middle metal layer configured to conduct heat generated by a heat generating component in the portable computing device such that it is spread out within the middle metal layer of the internal metal frame wherein the two outer metal layers and the middle metal layer are joined via a cladding process; and wherein the two outer metal layers include one or more apertures for allowing a thermal bridge to thermally link the middle layer to a surface of the heat generating component.

20. The thermostructural component of claim 19, wherein the first metal is stainless steel and the second metal is copper.

21. The portable electronic device of claim 19 or 20, wherein the one or more apertures are filled in with a thermally conductive material.

22. The portable electronic device of claim 21, wherein the thermally conductive material is the second metal.

23. The portable electronic device of any of claims 19-22, wherein the two outer metal layers are formed from stainless steel and the middle layer is formed from copper wherein each of the stainless layers are about 25% of a thickness of the internal frame and the copper layer is about 50% of the thickness of the internal frame.

24. A portable electronic device comprising:

a housing with a proximate thickness;

a plurality of device components arranged internally within the housing at different heights relative to the proximate thickness of the housing;

an internal frame primarily disposed primarily at one height relative to the proximate thickness, coupled to the housing, formed from at least two different materials wherein the two different materials are arranged in layers, said internal frame comprising:

two outer layers formed from a first material and configured to add structural stiffness of the device; and

a middle layer, disposed between the two outer layers, formed from a second material with a thermal conductivity greater than the first material, said middle layer configured to conduct heat generated by the plurality of device components such that it is spread out within the middle layer of the internal frame;

wherein the two outer layers include a plurality of apertures that each expose a portion of the middle layer; and

a plurality of thermal bridges each configured to thermally link a heat generating surface associated with one of the plurality of device components to the middle layer via one of the plurality of apertures proximate to the heating generating surface.

25. The portable electronic device of claim 24, wherein the two outer layers are formed from a first metal and the middle layer is formed from a second metal.

26. The portable electronic device of claim 25, wherein the two outer layers and the middle layer are joined via a cladding process.

27. The portable electronic device of claim 26, wherein a portion of the middle layer is extruded into each of the apertures during the cladding process.

28. The portable electronic device of claim 24, wherein the plurality of apertures is located in only one of the two outer layers.

Composite Microphone Boot to Optimize Sealing and Mechanical properties

29. A composite microphone boot comprising:

a first end cap shaped to conform to a curved interior surface of a portable computing device;

a second end cap shaped to conform to an exterior surface of a microphone; a center portion disposed between the first end cap and the second cap, the center portion, the first end cap and the second cap surrounding a hollow interior portion configured to direct sound entering via an aperture in a housing of a portable computing device to the microphone wherein the center portion is formed from a softer material than the first end cap and the second cap to act as a shock absorber during operation of the portable computing device.

30. The composite microphone boot of claim 29, wherein the softer material is a silicon based plastic.

31. The composite microphone boot of claim 29, wherein the composite microphone boot is formed during a double shot injection molding process.

32. The composite microphone boot of claim 29, wherein the first end cap, the second end cap and the center portion are separately formed.

33. The composite microphone boot of claim 32, wherein the first end cap, the second end cap and the center portion are installed and held in place within the portable computing device via a mechanical restraint without physically bonding the first end cap, the second end cap and the center portion to one another.

34. The composite microphone boot of claim 29, wherein the microphone boot is cylindrically shaped.

35. A microphone assembly comprising:

a circuit board;

a microphone coupled to the circuit board;

a composite microphone boot bonded to the microphone comprising a center portion disposed between a first end cap and a second end cap, the center portion, the first end cap and the second cap surrounding a hollow interior portion configured to direct sound entering via an aperture in a housing of a portable computing device to the microphone wherein the center portion, the first end cap and the second end cap are formed from materials of different durometers and wherein the durometers are selected to configure the composite microphone boot to act as a shock absorber during operation of the portable computing device.

36. The microphone assembly of claim 35, wherein the second end cap is bonded to an exterior surface of the microphone via a pressure sensitive adhesive (PSA).

37. The microphone assembly of claim 35 or 36, wherein an upper surface of the end cap is curved to conform to an interior surface of the housing of the portable computing device.

38. The microphone assembly of claim 35 or 36, where the first end cap and the second cap are formed from softer materials than the center portion.

39. The microphone assembly of claim 35 or 36, wherein the first end cap and the second end cap are formed from harder materials than the center portion.

40. The microphone assembly of claim 35 or 36, wherein a thickness of the center portion surrounding the hollowing interior portion varies.

Modular Material Antenna Assembly

41. A portable electronic device comprising:

an electrically conductive housing;

an electrically non-conductive frame formed of a frame material having a first dielectric constant and attached to an interior of the electrically conductive housing, the housing and the frame forming an integrated structure;

an antenna block formed of an antenna block material having a second dielectric constant that is substantially less than the first dielectric, wherein a portion of the antenna block has a shape that interlocks with a corresponding portion of the frame and secures the antenna block to the frame; and

an antenna flex mechanically secured to the antenna block.

42. The portable electronic device of claim 41, wherein the frame material is glass-filled plastic.

43. The portable electronic device of claim 41 or 42, wherein the antenna block material is Cyclo Olefin Polymer.

44. The portable electronic device of claim 4 lor 43, wherein the electrically conductive housing comprises stainless steel.

45. The portable electronic device of claim 41, wherein the electrically non- conductive frame contains a rim designed to support a cover glass of the portable electronic device.

46. The portable electronic device of claim 45, wherein the rim contains a flange.

47. The portable electronic device of claim 41, wherein the portion of the antenna block that has a shape that interlocks with a corresponding portion of the frame is a notched portion and the corresponding portion of the frame is a tabbed portion.

48. The portable electronic device of claim 41, wherein the antenna block further comprises a second portion that has a shape that interlocks with a second

corresponding portion of the frame.

49. The portable electronic device of claim 41, wherein the antenna flex is mechanically secured to a conductive bracket welded to the electrically conductive housing, and electrically connected to a circuit board of the portable electronic device.

50. A method for assembling a portable electronic device, comprising:

providing an electrically conductive housing;

gluing an electrically non-conductive frame to an interior of the electrically conductive housing, forming an integrated structure, wherein the electrically non- conductive frame is formed of a frame material having a first dielectric constant; securing an antenna block to the frame by interlocking a portion of the antenna block having a first shape with a portion of the frame having a second shape corresponding to the first shape, wherein the antenna block is formed of an antenna block material having a second dielectric constant substantially less than the first dielectric constant; and

mechanically securing an antenna flex to the antenna block.

51. The method of claim 50, further comprising welding a conductive bracket to the housing and wherein the electrically connecting includes connecting the antenna flex to the antenna block and to the conductive bracket.

52. The method of claim 51, wherein connecting the antenna flex to the antenna block includes screwing a screw through a hole in the antenna flex and through a hole in the antenna block.

53. The method of claim 51, wherein connecting the antenna flex to the conductive bracket includes screwing a screw through a hole in the antenna flex and through a hole in the bracket.

54. The method of claim 50, further comprising connecting the antenna flex to a system board so that the antenna block can be used to send and receive wireless communications.

55. The method of claim 54, wherein the wireless communications are performed via a WiFi protocol.

56. The method of claim 54, wherein the wireless communications are performed via a Bluetooth™ protocol.

57. The method of claim 54, wherein the wireless communications are performed via a short range broadband standard.

58. The method of claim 54, wherein the wireless communications are performed via a cellular telephone protocol.

59. The method of claim 50, wherein the first dielectric constant is approximately 5 and wherein the second dielectric constant is approximately 2.25.

60. The method of claim 50, wherein the frame material has a dielectric loss tangent of between 2.5 and 4 and wherein the frame material has a dielectric loss tangent of approximately 0.0005.

Formed PCB

61. A main logic board comprising

a processor and a memory, formed on a contiguous multi-layered printed circuit board (PCB), configured to receive power from a battery,

the PCB comprising:

a first rectangular portion configured for alignment with a top end of the battery;

a second rectangular portion configured for alignment with a bottom end of the battery;

a thin and narrow third portion connecting the first portion and the second portion configured to conform proximately to one side of the battery such that the first portion, the second portion and the thin and narrow third portion partially surround the battery.

62. The main logic board of claim 61, wherein main logic board is installed in an enclosure of a portable computing device such that the first rectangular portion is secured at a height within the enclosure that is different from the height at which the second rectangular portion is installed.

63. The main logic board of claim 61, wherein the thin and narrow third portion includes a number of traces that provide a data or power connections between one or more components attached to the first rectangular portion and one or more

components attached to the second rectangular portion.

64. The main logic board of claim 61, wherein the thin and narrow third portion is bent or twisted in its installed position in a device.

65. The main logic board of claim 61, wherein the PCB includes a trace layer and wherein material not used to form a trace is left in the trace layer of the PCB to affect a stiffness of the PCB during bending.

66. The main logic board of claim 61, wherein the PCB includes a metal layer formed from a material selected to increase the stiffness of the PCB, said metal layer not including traces.

67. A portable electronic device comprising:

an enclosure;

a device component packaged within the enclosure, said device component including a top, a bottom and a side wherein the side includes two faces at an angle to one another; and

a contiguous multi-layered printed circuit board (PCB) formed in a flat configuration including 1) a substrate layer, 2) a trace layer, 3) a metal layer and 4) one or more components attached to the PCB wherein two portions of PCB are bent at the angle relative to one another during assembly of the portable electronic device to allow the PCB to fit in a space proximate to the two faces such that the PCB proximately conforms to the side of the device component and wherein the metal layer is configured to stiffen the PCB such that the two portions remain in a bent configuration after the bending is applied.

68. The portable electronic device of claim 67, wherein the one or more components are attached only on a top surface of the PCB.

69. The portable electronic device of claim 67, wherein one or more components are located on a bottom surface of the PCB and one or more components are located on a top surface of the PCB.

70. The portable electronic device of claim 67, wherein the side includes a curved portion and wherein a portion of the PCB is bent to follow a curvature of the curved portion.

71. The portable electronic device of claim 67, wherein the PCB is a main logic board including a processor.

72. A portable electronic device comprising:

an enclosure;

a battery installed within the enclosure

a number of device components installed within the enclosure; and a main logic board, including a processor and a memory, formed on a contiguous multi-layered printed circuit board (PCB), configured to receive power from the battery and control the portable electronic device, the PCB comprising:

a first custom shaped portion configured to fit in a first space between the battery and the number of device components including the processor; a second custom shaped portion configured to fit in a second space between the battery and the number of device components including circuitry for operating the portable electronic device;

a thin and narrow third portion installed in a pathway between the number of device components and the battery that connects the first space and the second space wherein the thin and narrow shaped portion only includes traces for providing data or power connections between the first custom shaped portion and the second custom shaped portion.

73. The portable electronic device of claim 72, wherein the first custom shaped portion or the second custom shaped portion are rectangular shaped.

74. The portable electronic device of claim 72, wherein the first custom shaped portion or the second custom shaped portion includes one or more curved portions.

75. The portable electronic device of claim 72, wherein the first custom shaped portion and the second custom shaped portion are installed at an angle relative to one another.

76. The portable electronic device of claim 72, wherein the first custom shaped portion and the second custom shaped portion are installed at different heights relative to one another.

77. The portable electronic device of claim 72, wherein the pathway between the first space and the second space includes one or more steps or curves and the third portion is bent to follow the one or more steps or the curves.

Porting Audio Using A Connector in A Small Form Factor Electronic Device

78. A personal media device, comprising:

a housing, the housing having a plurality of openings, at least one of which is a first port arranged to facilitate broadcast of a first portion of audible energy generated by an audio generator enclosed within the housing and at least one of which is a second port used to broadcast a second portion of the audible energy generated by the audio generator, wherein when at least a portion of the first port is blocked, then at least some of the first portion of the audible energy is re-directed to the second port.

79. The personal media device as recited in claim 78, wherein the second port is incorporated into a connector opening in such a way that the second port remains substantially unseen by a user of the personal media device.

80. The personal media device as recited in claim 79, wherein the second port is accommodated by a connector opening.

81. The personal media device as recited in claim 80, wherein the connector opening accommodates a data connector.

82. The personal media device as recited in claim 81, wherein the data connector has 30 pins.

83. The personal media device as recited in claim 80 wherein the connector opening accommodates an audio jack.

84. The personal media device as recited in claim 78, wherein the first and the second audio ports are located such that when one of the audio ports is blocked by an object, then the second audio port remains available for outputting at least some of the audible sound otherwise blocked by the object.

85. A method, comprising:

providing a housing, the housing having a size and shape suitable for enclosing a plurality of operational components used to provide functionality for a personal media device; attaching a speaker assembly to an interior of the housing;

configuring a first air path acoustically coupling the speaker assembly to the external environment by way of a first audio output port;

configuring a second air path between the speaker assembly and a second audio output port independent of the first audio output port such that first audio output port and the second audio output port are physically located such that when one of the audio output ports is blocked by an object, at least the other audio output port remains unblocked; and

cooperatively passing audible sound generated by the speaker assembly to the external environment using the first and the second audio ports.

86. The method as recited in claim 85, further comprising:

increasing a resistance to the passage of audible sound at the first audio path; passively re-directing at least some of the audible sound from the first audio path to the second audio path such that an overall perception of audio output level remains substantially unchanged.

87. The method as recited in claim 86,wherein the increasing the resistance to the passage of audible sound at the first audio path comprises:

blocking the first audio output port with the object.

88. The method as recited in claim 85, wherein the first audio output port is a housing port, the housing port accommodated by a housing port opening in the housing.

89. The method as recited in claim 85, wherein the second audio output port is a connector port, the connector port included in a connector opening.

90. The method as recited in claim 89, wherein the connector opening has a size and shape to accommodate a data connector.

91. The method as recited in claim 89, wherein the connector opening has a size and shape to accommodate an audio jack.

92. The method as recited in claim 91, further comprising:

Inserting a audio post into the audio jack;

disabling the speaker assembly.

93. An integrated audible sound output system incorporated in a personal media device, the personal media device having at least a processor, an audio circuit, and a data retention unit, comprising: an audible sound generator unit, the audible sound generator unit arranged to produce audible sound in accordance with audio data retrieved from the data retention unit, decoded by the audio circuit, and processed by the processor;

a first audio output port, the first audio output port acoustically coupled with the audible sound generator unit by way of a first air path; and

a second audio output port, the second audio output port acoustically coupled with the audible sound generator unit by way of a second air path, wherein the first and the second air paths cooperate to pass the audible sound generated by the audible sound generator unit to the external environment by way of the first audio port and the second audio port.

94. The integrated audible sound generator system as recited in claim 93, wherein the first audio port is a housing port, and the second audio port is accommodated in a data connector opening.

95. The integrated audible sound generator system as recited in claim 93, wherein the first audio port is a housing port, and the second audio port is accommodated in an audio jack unit, the audio jack unit including an audio jack barrel connected to the second air path.

96. The integrated audible sound generator unit as recited in claim 93, wherein when the first audio output port is blocked, a first portion of the audible sound generated by the audible sound generator unit is prevented from passing from the audible sound generator unit to the external environment by way of the first audio port.

97. The integrated audible sound generator unit as recited in claim 96, wherein at least some of the blocked first portion of audible sound generated by the audible sound generator unit is passively re-directed to the second air path that remains substantially unblocked such that an overall perception of audio output level of the personal media device remains substantially unchanged.

98. Non-transitory computer readable medium for storing a computer program executed by a processor and used in a computer aided assembly of a personal media device, comprising:

computer code for providing a housing, the housing having a size and shape suitable for enclosing a plurality of operational components used to provide functionality for a personal media device; computer code for attaching a speaker assembly to an interior of the housing; computer code for configuring a first air path acoustically coupling the speaker assembly to the external environment by way of a first audio output port; computer code for configuring a second air path between the speaker assembly and a second audio output port independent of the first audio output port such that first audio output port and the second audio output port are physically located such that when one of the audio output ports is blocked by an object, at least the other audio output port remains unblocked, wherein during operation of the personal media device, the first air path and the second air path cooperatively pass audible sound generated by the speaker assembly to the external environment using the first and the second audio ports.

99. The computer readable medium as recited in claim 98, wherein when a resistance to the passage of audible sound at the first audio path increases, at least some of the audible sound from the first audio path is passively re-directed to the second audio path such that an overall perception of audio output level remains substantially unchanged.

100. The computer readable medium as recited in claim 99, wherein the increasing the resistance to the passage of audible sound at the first audio path comprises:

blocking the first audio output port with the object.

101. The computer readable medium as recited in claim 98, wherein the first audio output port is a housing port, the housing port accommodated by a housing port opening in the housing.