EP2541139A2 - Module d' éclairage à DEL - Google Patents

Module d' éclairage à DEL Download PDF

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Publication number
EP2541139A2
EP2541139A2 EP12174633A EP12174633A EP2541139A2 EP 2541139 A2 EP2541139 A2 EP 2541139A2 EP 12174633 A EP12174633 A EP 12174633A EP 12174633 A EP12174633 A EP 12174633A EP 2541139 A2 EP2541139 A2 EP 2541139A2
Authority
EP
European Patent Office
Prior art keywords
light
led lighting
lighting module
board
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12174633A
Other languages
German (de)
English (en)
Other versions
EP2541139A3 (fr
EP2541139B1 (fr
Inventor
Frank Keller
Klaus Keller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP2541139A2 publication Critical patent/EP2541139A2/fr
Publication of EP2541139A3 publication Critical patent/EP2541139A3/fr
Application granted granted Critical
Publication of EP2541139B1 publication Critical patent/EP2541139B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Embodiments of the present invention relate to lighting modules, in particular using light emitting diodes (LED).
  • LED light emitting diodes
  • they relate to LED lighting modules with simplified production and improved dissipation of the heat loss.
  • LEDs have in recent years become a promising alternative to traditional lighting in both the residential and commercial sectors, as well as in the public sector.
  • metal halide lamps for example, sodium vapor lamps and mercury vapor lamps
  • LED technology has been increasingly used, which has developed into an advantageous alternative in terms of service life, luminous efficacy and cost aspects.
  • conventional metal vapor technology the LED technology is characterized by continuous development, which in many aspects further significant progress can be expected. Therefore, significant market shifts have already begun.
  • the constant increase in luminance has at the same time relativized an aspect that once characterized LEDs as a "cold" alternative to conventional incandescent or discharge lamps.
  • standard white high-power LEDs use power losses of more than 10 watts with external dimensions (base area) of less than about 1 cm 2 . Since both efficiency or power output, as well as the life are negatively affected by the increasing temperature of the semiconductor substrate, it is therefore an increasing Challenge to derive the occurring power loss quickly and reliably.
  • Typically, to achieve sufficient illuminance several individual LEDs are combined to form a lighting module, that is in practice mounted in a matrix-like manner on a common base such as a printed circuit board.
  • High-power LEDs usually have approximately the shape of a flat disc or a very flat cuboid.
  • PCB printed circuit board material
  • the LEDs are applied and contacted on the PCB material, wherein the aluminum plate takes over the task of heat dissipation and the heat sink.
  • PCB printed circuit board material
  • these and similar solutions have several disadvantages.
  • such composite printed circuit boards are more expensive than conventional printed circuit boards because of the smaller numbers and their complex structure, on the other hand, the printed circuit board material, or possibly further insulation layers, an undesirable thermal barrier between the LED and the aluminum plate.
  • an LED lighting module comprises a circuit board having first and second sides and at least one through opening, at least one light emitting diode mounted on the opening, on the first side of the board, having a light emitting face and a non-emitting face Light emitting diode is mounted with its light-emitting front to the first side of the board so that emitted light passes at least part of the opening and exits on the second side of the board, and that the back of the LED is exposed, so that the module with the not Light-emitting back of the LED can be attached to a heat sink.
  • Embodiments relate to a printed circuit board or board, which is provided with a plurality of through openings.
  • the apertures typically each have approximately the same shape as the effective radiating area of a single LED, but are larger, e.g. each about 5% to about 30% in length and width.
  • the openings 70 may have the same shape as the effective radiating area of the LED but be 1 mm or 2 mm in diameter larger than this.
  • the shape of the openings 70 may also correspond to the shape of the surface of the emitting side of the LEDs, but be about 1 to 3 mm smaller than this.
  • the LEDs are mounted on the printed circuit board so that their light emitting side faces the printed circuit board or is attached to a first side of the printed circuit board or printed circuit board, so that the light emitted during operation radiates through the openings of the printed circuit board and on a second side of the printed circuit board PCB / board exit.
  • the usually planar (non-light-emitting) back side of the LEDs is correspondingly raised in relation to the surface of the printed circuit board, with the individual rear sides of the LEDs typically lying on a common plane.
  • the contacting of the individual LEDs to the printed circuit board can be provided in various methods known to the person skilled in the art.
  • a metal plate is attached, typically made of aluminum or another good heat-conducting material such as copper.
  • a thin (typically less than 0.5 mm) applied means for improving the heat transfer can be provided between the LED backs and the metal plate, typically thermal grease.
  • the LEDs emit light through the holes of the circuit board. Due to the comparatively small thickness of the printed circuit board in comparison to the size of the openings or by appropriate coordination between emission characteristic of the LED and the opening size, a reduction of the emission angle can be prevented or minimized become.
  • the heat loss of the LEDs is in each case passed over their entire (typically planar) back into the metal plate or the heat sink, whereby a highly efficient cooling is achieved.
  • the metal plate should have a sufficient thickness, typically at least about 2 mm, to ensure sufficient dissipation of the heat loss from the contact area with the LED. On the other hand, if the metal plate were not sufficiently thick or made of material which is not sufficiently thermally conductive, the removal of heat energy from the contact zone with the LED could not be sufficient.
  • the thickness of the plate may be in embodiments of 2 mm to 10 mm, in particular from 3 mm to 7 mm.
  • Fig. 1 shows an LED lighting module 10 according to embodiments in a plan view.
  • the printed circuit board also referred to as board below
  • eight light-emitting diodes (LEDs) 40 are arranged in two rows of 4 LEDs each.
  • the LEDs are slightly larger (their outline lines hidden in the board are in Fig. 1 Dashed lines) as the openings 70 in board 30.
  • the terminals of the LEDs 40 are guided to one side of the board, where they are completed with a multi-pin socket 50 which is mounted on the board.
  • the interconnects 60 extend in the view of Fig. 1 on the side facing away from the viewer surface of the board 30, on which the LEDs are mounted. Other geometrical arrangements are also possible, as described below.
  • the conductor tracks 60 can also run on the other side of the board 30, ie in the Fig. 1 on the side of the board facing the viewer. If the board 30 has several layers, that is a multilayer board, the printed conductors can also run in an intermediate layer of the board. Also mixed forms between the above are possible. Depending on the design, feedthroughs may be provided from the printed conductors through the printed circuit board or part of the printed circuit board to the LEDs.
  • the board 30 is, typically at its corners, with post / spacers 80 with the Aluminum plate 20 connected, which serves as a heat sink. The light emission of the LEDs is directed in this representation of the drawing plane to the viewer.
  • Fig. 2 shows a schematic side view of the LED lighting module of Fig. 1 , Thermal paste (not shown) provides improved heat transfer between the housings of the LEDs 40 and the aluminum plate 20.
  • the holes 70 in the circuit board are shown in phantom.
  • the emission direction of the LEDs 40 is shown schematically by arrows in the example of the left of the four illustrated light emitting diodes.
  • the emitted light passes through the apertures 70 in the circuit board 30, that is, the light passes through the circuit board 30 through the apertures 70.
  • the LEDs are fitted in additional recesses in the circuit board 30 rather than in FIG Fig. 2 shown mounted on the surface, the emitted light traverses only a portion of the thickness of the board, for example, 30%, 50% or 70% of the thickness of the board (not shown).
  • the apertures 70 are typically from about 5% to about 30% larger (by diameter) than the effective radiating area of the light emitting diode 40, or a projection of the radiating surface of the light emitting diode onto the plane of the circuit board.
  • the dimensions of the openings are to be chosen so that on the one hand, the opening is large enough not to block the radiated light, on the other hand, the opening is smaller than the base of the LED on its emission side, since the LED rests on its edges on the board ,
  • an LED lighting module 10 may include from 1 to 64 light emitting diodes 40 and as many holes / openings 70, typically arranged as an mxn matrix, such as (non-limiting) 1 x 1, 1 x 2, 2 x 2, 2 x 3, 2 x 4, 4 x 4, etc.
  • the LEDs 40 used have a different shape from that described here of a flat cuboid, this may require changes to the structure described, which represents a standard task for a person skilled in the art.
  • a non-planar back side of the LEDs could require corresponding recesses in the heat sink 20 in order to ensure a corresponding surface contact between LED and heat sink, and thus good heat dissipation.
  • Fig. 3 shows a lighting fixture 130, in which three LED lighting modules 10 (shown only schematically here) according to embodiments in a lamp housing 110 are installed.
  • the three modules 10 are connected via cable 140 to a ballast 120, which is designed to transform the 115 or 230 volt AC mains voltage to the operating voltage of the modules 10, typically from 6 to 120 volts DC, eg 6, 12, 24, 48 , 60 or 96 volts.
  • the ballast 120 is designed as a switching power supply.
  • the aluminum plates 20 can be connected / bonded in a planar manner to an inner wall of the housing 110 using thermal paste.
  • the power supply may additionally be equipped with control functions to enable single switching on / control of individual LEDs or of groups. Any number of lighting modules 10 may be incorporated into a common housing 110 limited only by its dimensions and the performance of the one or more ballasts 120.
  • the LED modules 10 may be configured to be connected through the connector 50 also in FIG Position are kept and thus easily replaceable. An additional clamping device or the like may also be provided to ensure thermal contact with the housing 110.
  • Fig. 4 is a side cross-sectional view of a similar embodiment as that of Fig. 3 shown.
  • Fig. 5 shows a further embodiment, analogous to that of 3 and 4 ,
  • two LED lighting modules each with four LEDs 40 are mounted in a housing 110.
  • the two modules are each powered by a ballast 120, 121 with DC voltage.
  • the two ballasts are connected to a common neutral conductor 132.
  • the connections for the mains alternating voltage 133, 134 can, as shown, be designed separately for both ballasts 120, 121. If these are connected to different phases of the supply current network, a simple circuit of the illuminance can be realized in this way.
  • the illuminance can be reduced without the need for a separate switching device or electronics in the lamp housing.
  • several ballasts per lighting module 10 may be provided.
  • Fig. 6 shows an embodiment of an LED lighting module 10 similar to that of Fig. 1 ,
  • eight LEDs are combined in two groups of four LEDs connected in series. The connections are led separately to the sockets 50, 51, so that both groups can optionally be switched or controlled separately, analogously to the example in FIG Fig. 5
  • ballasts which may optionally be connected to different phases.
  • a side view of this embodiment substantially corresponds to the illustration in FIG Fig. 2 ,
  • the LEDs 40 and typically the tracks 60 are located in this example on the side facing away from the viewer side of the board 30, but are shown for illustrative purposes. For other possible levels of the conductor tracks the same applies as in Fig. 1 described.
  • a combination of two such modules, each with 8 high-power LEDs, each about 6 to 9 W, in a lamp housing is suitable from the achieved luminance, for example as a lighting fixture for street lighting purposes.
  • Fig. 7 schematically shows embodiments in which a plurality of LEDs 40 are arranged in a circular or star-shaped arrangement on the first side of the board 30.
  • the light-emitting diodes 40 are high-power light-emitting diodes. These are typically cuboid with a low height-to-width ratio, but may be e.g. also have a round or elliptical form factor.
  • height refers to the dimension in the main or symmetry direction of the light emission. Preferably, the height is less than 20% of the respective larger of width and length.
  • Typical size ranges are 0.5 to 8 mm height (measured without any optical attachment element), more particularly 1 mm to 3 mm, and each (independently of each other) 5 to 120 mm in length and width, more particularly 8 mm to 30 mm.
  • An exemplary, non-limiting LED may have dimensions of 12 x 15 x 1.6 mm (L x W x H) and a power consumption of 7 W. Typical power consumption is 1 W to 100 W, more specifically 3 W to 50 W.
  • Lighting fixtures according to embodiments using LED modules 10 as described may further include a blower 200. This blows or sucks air in the Gap or air space 205 between board 30 and heat sink 20 to increase the cooling, which in Fig. 8 is shown.
  • Lighting fixtures may further comprise a thermosyphone 210 or a heat pipe 220, which is in thermal communication with the backside of the LEDs.
  • the heat sink 20 may be arranged as in previous examples, and in addition to the thermosyphone 210 or the heat pipe 220 are in communication, so that the waste heat is transported to a heat sink / condenser 230. This is in Fig. 9 shown schematically. Both elements 210, 220 may be thermally connected directly to the LED backs without heat sink 20.
  • the LED modules according to embodiments are suitable as replaceable lighting fixtures as a replacement for conventional illuminants such as halogen bulbs or rods.
  • the connection can be made to the power supply via plug, so that the module can be quickly and easily replaced by laymen in case of a defect or to change the illuminance.
  • the power connector may be configured to hold the module in position at the same time, such as by combination with the posts / spacers 80.
  • the heat sink 20 may be part of the module 10, or part of the lamp 130.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP12174633.3A 2011-06-30 2012-07-02 Module d' éclairage à DEL Not-in-force EP2541139B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202011050596U DE202011050596U1 (de) 2011-06-30 2011-06-30 LED-Beleuchtungsmodul

Publications (3)

Publication Number Publication Date
EP2541139A2 true EP2541139A2 (fr) 2013-01-02
EP2541139A3 EP2541139A3 (fr) 2013-08-07
EP2541139B1 EP2541139B1 (fr) 2017-03-08

Family

ID=46514103

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12174633.3A Not-in-force EP2541139B1 (fr) 2011-06-30 2012-07-02 Module d' éclairage à DEL

Country Status (2)

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EP (1) EP2541139B1 (fr)
DE (1) DE202011050596U1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204757A1 (de) * 2014-03-14 2015-09-17 Continental Automotive Gmbh Lichtmodul für einen Kraftfahrzeugscheinwerfer
WO2015192958A1 (fr) 2014-06-16 2015-12-23 Novoferm Tormatic Gmbh Caisson pour bloc moteur d'un système de commande de porte de garage
WO2015192957A1 (fr) 2014-06-16 2015-12-23 Novoferm Tormatic Gmbh Système d'entraînement pour une porte
DE102015004080A1 (de) 2015-03-31 2016-10-06 Novoferm Tormatic Gmbh llluminationseinheit
DE102015002099A1 (de) * 2015-02-23 2016-08-25 Jenoptik Polymer Systems Gmbh Leuchtdiodenvorrichtung und Verfahren zum Herstellen einer Leuchtdiodenvorrichtung
DE202015105853U1 (de) * 2015-11-04 2017-02-08 Zumtobel Lighting Gmbh Leuchtvorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657767B2 (en) * 2001-05-21 2003-12-02 Gentex Corporation Rearview mirror assembly construction
EP1696404A1 (fr) * 2005-02-25 2006-08-30 Electrovac, Fabrikation elektrotechnischer Spezialartikel Gesellschaft m.b.H. Assemblage de diodes électroluminescentes
TWM278828U (en) * 2005-05-11 2005-10-21 Shiu Yung Yuan LED planar light source module
TWI356486B (en) * 2007-09-07 2012-01-11 Young Lighting Technology Led light source module and manufacturing method t
JP2009117661A (ja) * 2007-11-07 2009-05-28 Tokai Rika Co Ltd プリント配線板
DE202008002873U1 (de) * 2008-02-29 2008-05-15 Martin, Andreas, Dipl.-Ing. Lichtmodul für Raum- und Flächenausleuchtung

Non-Patent Citations (1)

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Title
"Thermal Management of Golden Dragon LED", APPLICATION NOTE, October 2008 (2008-10-01)

Also Published As

Publication number Publication date
EP2541139A3 (fr) 2013-08-07
DE202011050596U1 (de) 2012-08-01
EP2541139B1 (fr) 2017-03-08

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