EP2522153B1 - Component having micromechanical microphonestructure and method for producing - Google Patents
Component having micromechanical microphonestructure and method for producing Download PDFInfo
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- EP2522153B1 EP2522153B1 EP10781632.4A EP10781632A EP2522153B1 EP 2522153 B1 EP2522153 B1 EP 2522153B1 EP 10781632 A EP10781632 A EP 10781632A EP 2522153 B1 EP2522153 B1 EP 2522153B1
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010410 layer Substances 0.000 claims description 59
- 238000005530 etching Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 239000002346 layers by function Substances 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000012528 membrane Substances 0.000 description 59
- 239000003990 capacitor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
Definitions
- a microphone device in which a counter-element is arranged on a substrate with an intermediate conductive membrane.
- the counter element has a support structure, which restricts both the movement of the membrane and ensures the distance between the counter element and the membrane.
- Above the movable membrane are located in the counter element a series of openings. Separated therefrom by the support structure, there are further openings in the outer area of the counter element outside the movable membrane; which have a smaller diameter than the openings
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Description
Die Erfindung betrifft ein Bauelement mit einer mikromechanischen Mikrofonstruktur, die in einem Schichtaufbau realisiert ist gemäß Anspruch 1. Die Mikrofonstruktur umfasst zumindest eine durch den Schalldruck auslenkbare Membran, die in einer Membranschicht realisiert ist, und ein feststehendes akustisch durchlässiges Gegenelement für die Membran, das in einer dicken Funktionsschicht über der Membranschicht realisiert ist und mit Durchgangsöffnungen zur Schalleinkopplung versehen ist.The invention relates to a component having a micromechanical microphone structure which is realized in a layer structure according to claim 1. The microphone structure comprises at least one deflectable by the sound pressure membrane, which is realized in a membrane layer, and a fixed acoustically permeable counter element for the membrane, which in a thick functional layer is realized over the membrane layer and is provided with passage openings for sound coupling.
Des Weiteren betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Mikrofonbauelements gemäß Anspruch 5.Furthermore, the invention relates to a method for producing such a microphone component according to claim 5.
MEMS(Micro-Electro-Mechanical-System)-Mikrofone gewinnen in den unterschiedlichsten Anwendungsbereichen zunehmend an Bedeutung. Dies ist in erster Linie auf die miniaturisierte Bauform derartiger Bauelemente und die Möglichkeit zur Integration weiterer Funktionalitäten bei sehr geringen Herstellungskosten zurückzuführen. Ein weiterer Vorteil von MEMS-Mikrofonen ist deren hohe Temperaturstabilität.MEMS (micro-electro-mechanical system) microphones are becoming increasingly important in a wide range of applications. This is primarily due to the miniaturized design of such devices and the ability to integrate additional functionality at very low cost. Another advantage of MEMS microphones is their high temperature stability.
Die Signalerfassung erfolgt in der Regel kapazitiv, wobei die Membran der Mikrofonstruktur als bewegliche Elektrode eines Mikrofonkondensators fungiert und das feststehende Gegenelement den Träger der entsprechenden Gegenelektrode darstellt. Wenn die Membran durch den Schalldruck ausgelenkt wird, ändert sich der Abstand zwischen der Membran und der Gegenelektrode, was dann als Kapazitätsänderung des Mikrofonkondensators erfasst wird.The signal detection is usually capacitive, wherein the membrane of the microphone structure acts as a movable electrode of a microphone capacitor and the fixed counter element represents the carrier of the corresponding counter electrode. When the membrane is deflected by the sound pressure, the distance between the membrane and the counter electrode changes, which is then detected as a capacitance change of the microphone capacitor.
Mit Verfahren der Oberflächen- und Volumenmikromechanik und unter Verwendung von Opferschichtätzprozessen lassen sich Mikrofonbauelemente mit sehr kleiner Chipfläche realisieren. Gemäß einem aus der Praxis bekannten Verfahren werden dabei die Schallöffnungen im Gegenelement als Ätzzugänge für den Opferschichtätzprozess genutzt, bei dem die Membran freigestellt wird. Bei dieser Vorgehensweise wird das Layout der Mikrofonstruktur und insbesondere der Membran nicht nur durch die angestrebten Mikrofoneigenschaften bestimmt, sondern hängt auch wesentlich von den Möglichkeiten und Eigenschaften des Opferschichtätzprozesses ab, wie beispielsweise von der Ätzdauer, der Isotropie des Ätzprozesses und von den Grenzen und der Streuung der Unterätzweite. Mit dem Layout sind auch die akustischen Eigenschaften eines so gefertigten MEMS-Mikrofons limitiert.With methods of surface and volume micromechanics and using sacrificial layer etching processes, it is possible to realize microphone components with a very small chip area. According to a method known from practice, the sound openings in the counter element are used as etching accesses for the sacrificial layer etching process, in which the membrane is released. In this approach, the layout of the microphone structure and in particular the membrane is determined not only by the desired microphone properties, but also depends significantly on the possibilities and properties of the sacrificial layer etching process, such as the etching time, the isotropy of the etching process and the limits and the scattering the undercut width. The layout also limits the acoustic properties of a MEMS microphone manufactured in this way.
So ist bei den bekannten Mikrofonbauelementen der laterale Abstand zwischen den als Ätzzugang dienenden Schallöffnungen und dem Membranrand durch die Unterätzweite des Opferschichtätzprozesses begrenzt. Dieser Abstand bestimmt die Größe des akustischen Kurzschlusses, d.h. die Verminderung der Schallaufnahme der Mikrofonmembran durch direkten Druckausgleich zwischen der Membranvorderseite und der Membranrückseite. Je größer der laterale Abstand zwischen den Schallöffnungen und dem Membranrand ist, um so geringer sind die Auswirkungen des akustischen Kurzschlusses auf die Signalqualität und um so besser ist das Signal-Rausch-Verhältnis (SNR) des Mikrofonbauelements.Thus, in the case of the known microphone components, the lateral distance between the sound openings serving as etching access and the membrane edge is limited by the undercut width of the sacrificial layer etching process. This distance determines the size of the acoustic short, i. the reduction of the sound pick-up of the microphone membrane by direct pressure equalization between the membrane front side and the membrane rear side. The greater the lateral distance between the sound apertures and the diaphragm edge, the lower the impact of the acoustic short circuit on signal quality, and the better the signal-to-noise ratio (SNR) of the microphone component.
Aus der Schrift
Aus der Schrift
Mit der vorliegenden Erfindung werden Maßnahmen zur Verbesserung der akustischen Eigenschaften eines in Opferschichttechnologie gefertigten Mikrofonbauelements vorgeschlagen.The present invention proposes measures for improving the acoustic properties of a microphone component manufactured in sacrificial layer technology.
Bei einem Bauelement der eingangs genannten Art wird eine solche Verbesserung erfindungsgemäß dadurch erreicht, dass die Durchgangsöffnungen zur Schalleinleitung über dem Mittelbereich der Membran angeordnet sind und dass über dem Randbereich der Membran akustisch kaum durchgängige und damit weitestgehend akustisch passive Perforationsöffnungen im Gegenelement strukturiert sind.In a component of the type mentioned, such an improvement is achieved according to the invention in that the passage openings for sound introduction are arranged above the middle region of the membrane and that over the edge region of the membrane acoustically hardly continuous and therefore largely acoustically passive perforation openings are structured in the counterelement.
Die Erfindung geht aus von der Erkenntnis, dass die Schallbeaufschlagung möglichst auf den Mittelbereich der Mikrofonmembran begrenzt werden sollte, um die Länge des akustischen Kurzschlusses zu maximieren und so seine Auswirkungen auf die Schallaufnahme der Mikrofonmembran möglichst gering zu halten. Deshalb wird erfindungsgemäß vorgeschlagen, im Gegenelement lediglich über dem Mittelbereich der Membran Durchgangsöffnungen zur Schalleinleitung, d.h. Schallöffnungen, vorzusehen. Des Weiteren ist erfindungsgemäß erkannt worden, dass bei gleichbleibender Perforationsdicke mit dem Durchmesser der Perforationsöffnungen deren Durchlässigkeit für Schallwellen abnimmt. Da der Ätzangriff beim Opferschichtätzen aber auch über sehr kleine Perforationsöffnungen erfolgen kann, werden erfindungsgemäß solche akustisch stark überdämpften und damit inaktiven Perforationsöffnungen über dem Randbereich der Membran im Gegenelement strukturiert, also zwischen den äußersten Schallöffnungen und dem Membranrand. Dadurch kann der Pfad des akustischen Kurzschlusses unabhängig von der Unterätzweite des Opferschichtätzprozesses deutlich verlängert werden. Diese über dem Randbereich der Mikrofonmembran angeordneten sehr kleinen Perforationsöffnungen vermindern außerdem die Dämpfung der Mikrofonmembran gegenüber einem völlig geschlossenen Gegenelement, da sie die Squeezefilmdämpfung im Spalt verringern. Die Perforationsöffnungen können dazu ebenso gut punktförmig wie auch schlitzartig geformt, sowie gerade, gekrümmt oder gewinkelt ausgeführt sein.The invention is based on the recognition that the sound input should be limited as possible to the central region of the microphone diaphragm in order to maximize the length of the acoustic short circuit and thus to minimize its effects on the sound pickup of the microphone diaphragm. Therefore, the invention proposes, in the counter element only over the central region of the membrane through holes for sound introduction, i. Sound openings to provide. Furthermore, it has been recognized according to the invention that with constant perforation thickness with the diameter of the perforation openings, their permeability to sound waves decreases. Since the etching attack during the sacrificial layer etching can also take place via very small perforation openings, according to the invention such acoustically strongly over-damped and thus inactive perforation openings are structured over the edge region of the membrane in the counter element, ie between the outermost sound openings and the membrane edge. As a result, the path of the acoustic short circuit can be significantly extended independently of the undercut width of the sacrificial layer etching process. These very small perforation openings arranged above the edge region of the microphone diaphragm also reduce the attenuation of the microphone diaphragm with respect to a completely closed counter element, since they reduce the squeeze-film attenuation in the gap. The perforation openings can be just as punctiform as slit-shaped, as well as straight, curved or angled executed.
Wie bereits erwähnt, dienen die über dem Randbereich der Mikrofonmembran im Gegenelement befindlichen Perforationsöffnungen als Ätzzugänge beim Opferschichtätzen im Rahmen der Herstellung des voranstehend beschriebenen erfindungsgemäßen Mikrofonbauelements. Dementsprechend wird hier auch ein Verfahren zur Herstellung eines solchen Bauelements beansprucht, bei dem durch Strukturierung einer Membranschicht des Schichtaufbaus eine Membran ausgebildet wird, mindestens eine Opferschicht auf die Membranschicht aufgebracht wird und eine dicke Funktionsschicht auf der Opferschicht erzeugt wird, aus der ein feststehendes Gegenelement für die Membran herausstrukturiert wird. Erfindungsgemäß werden bei der Strukturierung der dicken Funktionsschicht über dem Mittelbereich der Membran Durchgangsöffnungen mit einer zur Schalleinleitung geeigneten Größe erzeugt, während über dem Randbereich der Membran akustisch weitestgehend passive Perforationsöffnungen als Durchgangsöffnungen erzeugt werden. In einem darauffolgenden Opferschichtätzprozess wird dann das Opferschichtmaterial zwischen der Membran und dem Gegenelement herausgelöst, wobei der Ätzangriff sowohl über die Durchgangsöffnungen zur Schalleinkopplung als auch über die akustisch passiven Perforationsöffnungen im Gegenelement erfolgt.As already mentioned, the perforation openings located in the counter element above the edge area of the microphone membrane serve as etching accesses in sacrificial layer etching in the context of the production of the above-described microphone component according to the invention. Accordingly, a method for producing such a device is claimed, in which a membrane is formed by structuring a membrane layer of the layer structure, at least one sacrificial layer is applied to the membrane layer and a thick functional layer is produced on the sacrificial layer, from which a fixed counter element for the membrane is structured out. According to the invention, in the structuring of the thick functional layer over the middle region of the membrane, through openings are produced with a size suitable for sound introduction, while over the edge region of the membrane acoustically largely passive perforation openings are provided as through openings be generated. In a subsequent sacrificial layer etching process, the sacrificial layer material is then dissolved out between the membrane and the counter element, with the etching attack taking place both via the passage openings for sound coupling and via the acoustically passive perforation openings in the counter element.
Zur Optimierung des akustischen Kurzschlusses bei gleichzeitiger Gewährleistung der Fertigungssicherheit werden die Perforationsöffnungen in einem auf die Unterätzweite des Ätzmediums abgestimmten Raster angeordnet, d.h. so dass das Opferschichtmaterial zwischen dem Gegenelement und dem Randbereich der Membran bei einem Ätzangriff über die Perforationsöffnungen vollständig entfernt wird.In order to optimize the acoustic short circuit while at the same time guaranteeing the manufacturing reliability, the perforation openings are arranged in a grid matched to the sub-etching width of the etching medium, i. so that the sacrificial layer material between the counter element and the edge region of the membrane is completely removed during an etching attack via the perforation openings.
Um sicherzustellen, dass die Perforationsöffnungen über dem Randbereich der Membran tatsächlich akustisch stark überdämpft oder sogar gänzlich inaktiv sind, können die Perforationsöffnungen nach dem Herauslösen des Opferschichtmaterials durch Abscheiden einer Versiegelungsschicht auf der strukturierten dicken Funktionsschicht gezielt verengt oder verschlossen werden. Diese Vorgehensweise eröffnet die Möglichkeit, die Perforationsöffnungen lediglich für den Ätzangriff im Rahmen des Herstellungsverfahrens um die Schichtdicke der Versiegelungsschicht erweitert auszubilden, um das Herauslösen des Opferschichtmaterials zu begünstigen.In order to ensure that the perforation openings over the edge region of the membrane are in fact acoustically strongly attenuated or even completely inactive, the perforation openings can be narrowed or closed in a targeted manner after the sacrificial layer material has been removed by depositing a sealing layer on the structured thick functional layer. This procedure opens up the possibility of forming the perforation openings widened by the layer thickness of the sealing layer only for the etching attack within the scope of the production method in order to promote the dissolution out of the sacrificial layer material.
Wie bereits voranstehend erörtert, gibt es verschiedene Möglichkeiten, die Lehre der vorliegenden Erfindung in vorteilhafter Weise auszugestalten und weiterzubilden. Dazu wird einerseits auf die nachgeordneten Patentansprüche verwiesen und andererseits auf die nachfolgende Beschreibung eines Ausführungsbeispiels der Erfindung anhand der Figuren.
- Fig. 1
- zeigt eine schematische Aufsicht auf das mit Durchgangsöffnungen versehene Gegenelement eines erfindungsgemäßen Mikrofonbauelements und
- Fig. 2a bis c
- zeigen schematische Schnittdarstellungen des Schichtaufbaus eines erfindungsgemäßen Mikrofonbauelements während der Versiegelung von Perforationsöffnungen.
- Fig. 1
- shows a schematic plan view of the provided with through holes counter element of a microphone component according to the invention and
- Fig. 2a to c
- show schematic sectional views of the layer structure of a microphone component according to the invention during the sealing of perforation openings.
Wie voranstehend erörtert, bezieht sich die vorliegende Erfindung auf Bauelemente mit einer mikromechanischen Mikrofonstruktur, die in einem Schichtaufbau realisiert ist. Die Mikrofonstruktur umfasst mindestens eine Membran, die in einer Membranschicht des Schichtaufbaus ausgebildet ist, und ein feststehendes akustisch durchlässiges Gegenelement für die Membran, das in einer dicken Funktionsschicht über der Membranschicht realisiert ist. Die Membran wird über Schallöffnungen im Gegenelement mit dem Schalldruck beaufschlagt.As discussed above, the present invention relates to devices having a micromechanical microphone structure realized in a layered construction. The microphone structure comprises at least one membrane, which is formed in a membrane layer of the layer structure, and a fixed acoustically permeable counter element for the membrane, which is realized in a thick functional layer over the membrane layer. The membrane is acted upon by sound openings in the counter element with the sound pressure.
In
Zum Vergleich besonders hervorgehoben sind in
Da der Einfluss des akustischen Kurzschlusses auf das Mikrofonsignal um so größer ist, je kleiner der Abstand zwischen den äußersten Schallöffnungen und dem Membranrand ist, tragen die Perforationsöffnungen 14, mit denen dieser Abstand im Opferschichtätzprozess vergrößert wurde, zur Verbesserung der akustischen Eigenschaften des Mikrofonbauelements 10 bei. Außerdem vermindern die Perforationsöffnungen 14 über dem Randbereich der Membran die Dämpfung der Mikrofonmembran, was sich ebenfalls günstig auf die akustischen Eigenschaften des Mikrofonbauelements auswirkt.Since the influence of the acoustic short circuit on the microphone signal is greater, the smaller the distance between the outermost sound openings and the membrane edge, the
Zur Implementierung der hier in Rede stehenden Erfindung wird also je nach den angestrebten akustischen Eigenschaften des Mikrofonbauelements eine Reihe oder auch ein Feld von akustisch passiven Ätzzugängen mit kleinem Durchmesser zwischen der Membrankante und den Schallöffnungen im Gegenelement erzeugt. Die Anzahl, die Größe und auch die Anordnung dieser Perforationsöffnungen hängen dabei sowohl vom errechneten Optimum bezüglich der akustischen, mechanischen und elektrischen Eigenschaften, wie Dämpfung, Empfindlichkeit, Signal-Rausch-Abstand, als auch von den Strukturierungsmöglichkeiten im Herstellungsprozess ab. Dabei muss ein Kompromiss gefunden werden zwischen großen Perforationsöffnungen einerseits, was mit einer geringen Dämpfung der Mikrofonmembran verbunden ist, und einer Perforationsstruktur mit einem hohen akustischen Widerstand andererseits, wodurch die elektrische Empfindlichkeit der Mikrofonstruktur erhöht und das Rauschen des akustischen Kurzschlusses verringert wird.In order to implement the present invention in question, depending on the desired acoustic properties of the microphone component, a series or also a field of acoustically passive etching accesses with a small diameter is produced between the diaphragm edge and the sound openings in the counterelement. The number, the size and also the arrangement of these perforation openings depend both on the calculated optimum with regard to the acoustic, mechanical and electrical properties, such as attenuation, sensitivity, signal-to-noise ratio and structuring possibilities in the production process. A compromise must be found between large perforations on the one hand, which is associated with a low attenuation of the microphone diaphragm, and a perforation structure with a high acoustic resistance on the other hand, which increases the electrical sensitivity of the microphone structure and the noise of the acoustic short circuit is reduced.
Erfindungsgemäß müssen die Perforationsöffnungen also zwei Kriterien erfüllen. Zum einen müssen sie hinreichend groß sein, um als Ätzzugang für den Opferschichtätzprozess fungieren zu können. Zum anderen müssen sie so klein sein, dass sie akustisch möglichst undurchlässig sind. Um diesen vermeintlich widerstreitenden Anforderungen zu genügen, können die Perforationsöffnungen nach dem Opferschichtätzprozess mit Hilfe einer Versiegelungsschicht verengt oder sogar gänzlich verschlossen werden. Die hierfür erforderliche Prozessfolge wird durch die
In
Nach dem Opferschichtätzprozess wurde dann eine Versiegelungsschicht 25, beispielsweise ein PECVD-Oxid, auf der Bauteiloberfläche abgeschieden. Das Material dieser Versiegelungsschicht 25 wurde dabei über die Durchgangsöffnungen 23 und 24 auch auf der Membran 21 und an den Öffnungswandungen angelagert. Während die Schallöffnungen 23 durch die Versiegelungsschicht 25 lediglich verengt wurden, wurden die kleineren Perforationsöffnungen 24 hier gänzlich verschlossen, was in
In einem weiteren kurzen Gasphasenätzschritt wurde die Versiegelungsschicht 25 schließlich wieder großflächig vom Gegenelement 22 und von der Membran 21 entfernt.
Claims (8)
- Component (10) having a micromechanical microphone structure, which is provided in the form of a layered structure, comprising at least
o a diaphragm which can be deflected by sound pressure and is provided in a diaphragm layer, and
o a fixed, acoustically permeable counter-element (12) for the diaphragm, which is provided in a thick functional layer over the diaphragm layer and is provided with passage openings (13) for sound induction;
characterized in that• the counter-element is completely undercut, and• the passage openings (13) for the sound induction are arranged over the middle region of the diaphragm that can be deflected by the sound pressure and• acoustically largely passive, and consequently acoustically almost impermeable perforation openings (14), which are made much smaller than the passage openings (13), are incorporated in the structure of the counter-element (12) over the peripheral region of the diaphragm that can be deflected by the sound pressure. - Component (20) according to Claim 1, characterized in that the passage openings (13) and the perforation openings (14) are arranged above the undercut.
- Component (20) according to Claim 1 or 2, characterized in that the perforation openings (14) are narrowed by the material of at least one sealing layer (25) applied to the thick functional layer.
- Component (20) according to Claim 1 or 2, characterized in that the perforation openings (14) are closed by the material of at least one sealing layer (35) applied to the thick functional layer.
- Method for producing a component (10) having a micromechanical microphone structure, which is provided in the form of a layered structure, in particular for producing a component according to one of Claims 1 to 3, in which- a diaphragm is formed by structuring of a diaphragm layer,- at least one sacrificial layer is applied to the diaphragm layer,- a thick functional layer is created on the sacrificial layer and structured, a fixed counter-element (12) for the diaphragm being formed and provided with passage openings (13), and- the sacrificial layer material between the diaphragm and the counter-element (12) is removed by being dissolved in a sacrificial layer etching process, the etching attack taking place via the passage openings (13) in the counter-element,characterized in that• the counter-element is completely undercut, and• during the structuring of the thick functional layer, passage openings (13) of a size that is suitable for introducing sound are created over the middle region of the diaphragm that can be deflected by the sound pressure and• acoustically largely passive perforation openings (14) are created as passage openings over the peripheral region of the diaphragm that can be deflected by the sound pressure.
- Method according to Claim 5, characterized in that the counter-element is completely undercut, the undercutting taking place by means of a sacrificial layer etching process, the passage openings (13) and the perforation openings (14) serving as access for the etching.
- Method according to Claim 5 or 6, characterized in that the perforation openings (14) are arranged in a grid that is made to match the undercutting width of the etching medium.
- Method according to one of Claims 5, 6 and 7, characterized in that, after the removal of the sacrificial layer material, the perforation openings (14) are specifically narrowed or closed by depositing a sealing layer (25) on the structured thick functional layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE201010000666 DE102010000666A1 (en) | 2010-01-05 | 2010-01-05 | Component with a micromechanical microphone structure and method for its production |
PCT/EP2010/066854 WO2011082861A1 (en) | 2010-01-05 | 2010-11-05 | Component having a micromechanical microphone structure and method for the production thereof |
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EP2522153A1 EP2522153A1 (en) | 2012-11-14 |
EP2522153B1 true EP2522153B1 (en) | 2014-02-12 |
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US (1) | US9042581B2 (en) |
EP (1) | EP2522153B1 (en) |
CN (1) | CN102714772B (en) |
DE (1) | DE102010000666A1 (en) |
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CN104185099A (en) | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
US12091313B2 (en) | 2019-08-26 | 2024-09-17 | The Research Foundation For The State University Of New York | Electrodynamically levitated actuator |
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EP2495212A3 (en) * | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
TWI272671B (en) * | 2005-10-03 | 2007-02-01 | Touch Micro System Tech | Method of forming a cavity by two-step etching and method of reducing dimension of an MEMS device |
TWI270526B (en) * | 2005-11-08 | 2007-01-11 | Touch Micro System Tech | Method of fabricating suspended structure |
TWI285509B (en) * | 2006-02-10 | 2007-08-11 | Univ Nat Chunghsing | Sawing-free process for manufacturing wafer of capacitor-type silicon microphone |
GB0605576D0 (en) * | 2006-03-20 | 2006-04-26 | Oligon Ltd | MEMS device |
CN200983677Y (en) * | 2006-08-22 | 2007-11-28 | 美律实业股份有限公司 | Silicon crystal capacitance microphone |
JP2008080444A (en) | 2006-09-27 | 2008-04-10 | Toshiba Corp | Mems element manufacturing method and mems element |
US7795063B2 (en) * | 2007-12-31 | 2010-09-14 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device and process for fabricating the same |
JP2009226500A (en) * | 2008-03-19 | 2009-10-08 | Toshiba Corp | Micromechanical apparatus and manufacturing method of micromechanical apparatus |
-
2010
- 2010-01-05 DE DE201010000666 patent/DE102010000666A1/en not_active Withdrawn
- 2010-11-05 CN CN201080060665.1A patent/CN102714772B/en active Active
- 2010-11-05 EP EP10781632.4A patent/EP2522153B1/en active Active
- 2010-11-05 US US13/520,444 patent/US9042581B2/en active Active
- 2010-11-05 WO PCT/EP2010/066854 patent/WO2011082861A1/en active Application Filing
-
2011
- 2011-01-03 TW TW100100006A patent/TWI473506B/en active
Also Published As
Publication number | Publication date |
---|---|
CN102714772B (en) | 2015-11-25 |
TWI473506B (en) | 2015-02-11 |
WO2011082861A1 (en) | 2011-07-14 |
US9042581B2 (en) | 2015-05-26 |
US20130010989A1 (en) | 2013-01-10 |
DE102010000666A1 (en) | 2011-07-07 |
EP2522153A1 (en) | 2012-11-14 |
TW201127089A (en) | 2011-08-01 |
CN102714772A (en) | 2012-10-03 |
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