EP2522153A1 - Component having a micromechanical microphone structure and method for the production thereof - Google Patents

Component having a micromechanical microphone structure and method for the production thereof

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Publication number
EP2522153A1
EP2522153A1 EP10781632A EP10781632A EP2522153A1 EP 2522153 A1 EP2522153 A1 EP 2522153A1 EP 10781632 A EP10781632 A EP 10781632A EP 10781632 A EP10781632 A EP 10781632A EP 2522153 A1 EP2522153 A1 EP 2522153A1
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EP
European Patent Office
Prior art keywords
membrane
layer
openings
sound
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10781632A
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German (de)
French (fr)
Other versions
EP2522153B1 (en
Inventor
Jochen Zoellin
Axel Grosse
Bernhard Gehl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
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Publication date
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Publication of EP2522153A1 publication Critical patent/EP2522153A1/en
Application granted granted Critical
Publication of EP2522153B1 publication Critical patent/EP2522153B1/en
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials

Definitions

  • the invention relates to a component with a micromechanical microphone structure, which is realized in a layer structure.
  • the microphone structure comprises at least one deflectable by the sound pressure membrane, which is realized in a membrane layer, and a fixed acoustically permeable counter element for the membrane, which is realized in a thick functional layer over the membrane layer and provided with passage openings for sound coupling.
  • the invention relates to a method for producing such a microphone component.
  • MEMS micro-electro-mechanical system
  • MEMS microphones are becoming increasingly important in a wide range of applications. This is primarily due to the miniaturized design of such devices and the ability to integrate additional functionality at very low cost. Another advantage of MEMS microphones is their high temperature stability.
  • the signal detection is usually capacitive, wherein the membrane of the microphone structure acts as a movable electrode of a microphone capacitor and the fixed counter element represents the carrier of the corresponding counter electrode.
  • the membrane When the membrane is deflected by the sound pressure, the distance between the membrane and the counter electrode changes, which is then detected as a capacitance change of the microphone capacitor.
  • the sound openings in the counter element are used as etching accesses for the sacrificial etching process in which the membrane is released.
  • the layout of the microphone structure and in particular the membrane is determined not only by the desired microphone characteristics, but also depends significantly on the possibilities and properties of the sacrificial layer etching process, such as the etching time, the isotropy of the etching process and the boundaries and the spread of the undercut ,
  • the layout also limits the acoustic properties of a ME MS microphone manufactured in this way.
  • the present invention proposes measures for improving the acoustic properties of a microphone component manufactured in sacrificial layer technology.
  • such an improvement is achieved according to the invention in that the passage openings for sound introduction are arranged above the middle region of the membrane and that over the edge region of the membrane acoustically hardly continuous and therefore largely acoustically passive perforation openings are structured in the counter element.
  • the invention is based on the recognition that the sound application should be limited as possible to the central region of the microphone membrane in order to maximize the length of the acoustic short circuit and thus minimize its effects on the sound pickup of the microphone membrane.
  • the invention proposes, in the counter element only over the central region of the membrane through holes for sound introduction, i. Sound openings to provide. Furthermore, it has been recognized according to the invention that with a constant perforation thickness with the diameter of the perforations, their permeability to sound waves decreases. Since the etching attack during the sacrificial layer etching can also take place via very small perforation openings, according to the invention such acoustically strongly over-damped and thus inactive perforation openings are structured over the edge region of the membrane in the counter element, ie between the outermost sound openings and the membrane edge.
  • the path of the acoustic short circuit can be significantly extended independently of the undercut width of the sacrificial layer etching process.
  • These very small perforation openings arranged above the edge region of the microphone diaphragm also reduce the attenuation of the microphone diaphragm with respect to a completely closed counter element, since they reduce the squeeze-film attenuation in the gap.
  • the perforation openings can be just as punctiform as slit-shaped, as well as straight, curved or angled executed.
  • the perforation openings located in the counter element above the edge area of the microphone membrane serve as etching accesses in sacrificial layer etching in the context of the production of the above-described microphone component according to the invention. Accordingly, a method for producing such a device is claimed, in which a membrane is formed by structuring a membrane layer of the layer structure, at least one sacrificial layer is applied to the membrane layer and a thick functional layer is produced on the sacrificial layer, from which a fixed Restructured counter element for the membrane.
  • the thick functional layer when the thick functional layer is structured above the middle region of the membrane, through-openings are produced with a size suitable for sound introduction, while over the edge region of the membrane acoustically largely passive perforation openings are formed as through-openings. gen generated.
  • the sacrificial layer material is then dissolved out between the membrane and the counter element, with the etching attack taking place both via the passage openings for sound coupling and via the acoustically passive perforation openings in the counter element.
  • the perforation openings are arranged in a grid matched to the sub-etching width of the etching medium, i. so that the sacrificial layer material between the counter element and the edge region of the membrane is completely removed during an etching attack via the perforation openings.
  • the perforation openings can be narrowed or closed in a targeted manner after the sacrificial layer material has been removed by depositing a sealing layer on the structured thick functional layer. This procedure opens up the possibility of forming the perforation openings widened by the layer thickness of the sealing layer only for the etching attack within the scope of the production method in order to promote the dissolution out of the sacrificial layer material.
  • Fig. 1 shows a schematic plan view of the provided with through holes counter element of a microphone component according to the invention and 2a to c show schematic sectional views of the layer structure of a microphone component according to the invention during the sealing of perforation openings.
  • the present invention relates to devices having a micromechanical microphone structure realized in a layered construction.
  • the microphone structure comprises at least one membrane, which is formed in a membrane layer of the layer structure, and a fixed acoustically permeable counter element for the membrane, which is realized in a thick functional layer over the membrane layer.
  • the membrane is acted upon by sound openings in the counter element with the sound pressure.
  • FIG. 1 illustrates that sound openings 13 are formed in the mating element 12 only over the middle region of the membrane, whereas the mating element 12 is provided with perforation openings 14 over the edge region of the membrane.
  • These perforation openings 14 are significantly smaller than the sound openings 13 and so small that they are acoustically strongly over-damped and thus acoustically almost impermeable.
  • Both the sound openings 13 and the perforation openings 14 serve as ⁇ tzzu réelle in the context of the manufacturing process for a sacrificial layer, in which the sacrificial layer material between the membrane layer and the counter-element 12 is dissolved out to expose the membrane.
  • the degree of overlap of the circles 15 makes it clear that the grid arrangement of the sound openings 13 is denser than would have been necessary for a complete undercut of the counter element 12, so that the arrangement of the sound openings 13 primarily takes account of acoustic considerations.
  • the grid of the perforation openings 14 was selected so that the circles 16 completely cover the edge area of the membrane, but the degree of overlap of the circles 16 is relatively small and evenly distributed.
  • the grid of the perforation openings 14 has been optimized here with regard to a complete undercut of the counter element 12.
  • the perforation openings 14 over the edge region of the membrane reduce the attenuation of the microphone membrane, which likewise has a favorable effect on the acoustic properties of the microphone component.
  • a series or also a field of acoustically passive etch entries with a small diameter is produced between the diaphragm edge and the sound openings in the counterelement.
  • the number, the size and also the arrangement of these perforation openings depend both on the calculated optimum with regard to the acoustic, mechanical and electrical properties, such as attenuation, sensitivity, signal-to-noise ratio and structuring possibilities in the production process.
  • perforation openings must therefore meet two criteria. First, they must be sufficiently large to act as an etch access for the sacrificial layer etching process. On the other hand, they must be so small that they are acoustically impermeable as possible.
  • the perforation openings can be narrowed or even completely closed after the sacrificial layer etching process with the aid of a sealing layer.
  • the process sequence required for this purpose is illustrated by FIGS. 2a to 2c.
  • FIG. 2 a shows the upper part of the layer construction of a microphone component 20 with the membrane 21 and the counter-element 22 in the region of the membrane edge, after the sacrificial layer material has been removed between the membrane 21 and the counter-element 22 in a sacrificial-layer etching process.
  • the etching attack took place via the passage openings 23 and 24 in the counter element.
  • the passage openings 23 arranged above the middle region of the membrane 21 are designed as sound openings, while the passage openings 24 in the edge region of the membrane 21 are realized in the form of perforation openings with a very small cross section.
  • a sealing layer 25 such as a PECVD oxide, was then deposited on the device surface.
  • the material of this sealing layer 25 was thereby deposited via the passage openings 23 and 24 also on the membrane 21 and on the opening walls. While the sound openings 23 were only narrowed by the sealing layer 25, the smaller perforation openings 24 were completely closed here, which is shown in Fig. 2b.
  • Fig. 2c illustrates that the material of the sealing layer

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

The invention relates to measures for improving the acoustic properties of a microphone component produced in sacrificial layer technology. According to the invention, the micromechanical microphone structure of such a component (10) is implemented in a layer structure and comprises at least one membrane which can be deflected by sound pressure and which is implemented in a membrane layer and a fixed, acoustically permeable counter-element (12) for the membrane which is implemented in a thick function layer over the membrane layer and has passage openings (13) for sound induction. According to the invention, the passage openings (13) are arranged over the center region of the membrane for sound induction, whereas acoustic, extensively passive perforation openings (14) are designed in the counter-element (12) over the edge region of the membrane.

Description

Beschreibung Titel  Description title
Bauelement mit einer mikromechanischen Mikrofon struktur und  Component with a micromechanical microphone structure and
Verfahren zu dessen Herstellung Process for its preparation
Stand der Technik State of the art
Die Erfindung betrifft ein Bauelement mit einer mikromechanischen Mikrofonstruktur, die in einem Schichtaufbau realisiert ist. Die Mikrofon struktur umfasst zumindest eine durch den Schalldruck auslenkbare Membran, die in einer Membranschicht realisiert ist, und ein feststehendes akustisch durchlässiges Gegenelement für die Membran, das in einer dicken Funktionsschicht über der Membranschicht realisiert ist und mit Durchgangsöffnungen zur Schalleinkopplung versehen ist. The invention relates to a component with a micromechanical microphone structure, which is realized in a layer structure. The microphone structure comprises at least one deflectable by the sound pressure membrane, which is realized in a membrane layer, and a fixed acoustically permeable counter element for the membrane, which is realized in a thick functional layer over the membrane layer and provided with passage openings for sound coupling.
Des Weiteren betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Mikrofonbauelements. Furthermore, the invention relates to a method for producing such a microphone component.
MEMS(Micro-Electro-Mechanical-System)-Mikrofone gewinnen in den unterschiedlichsten Anwendungsbereichen zunehmend an Bedeutung. Dies ist in erster Linie auf die miniaturisierte Bauform derartiger Bauelemente und die Möglichkeit zur Integration weiterer Funktionalitäten bei sehr geringen Herstellungskosten zurückzuführen. Ein weiterer Vorteil von MEMS-Mikrofonen ist deren hohe Temperaturstabilität. MEMS (micro-electro-mechanical system) microphones are becoming increasingly important in a wide range of applications. This is primarily due to the miniaturized design of such devices and the ability to integrate additional functionality at very low cost. Another advantage of MEMS microphones is their high temperature stability.
Die Signalerfassung erfolgt in der Regel kapazitiv, wobei die Membran der Mikrofonstruktur als bewegliche Elektrode eines Mikrofonkondensators fungiert und das feststehende Gegenelement den Träger der entsprechenden Gegenelektrode darstellt. Wenn die Membran durch den Schalldruck ausgelenkt wird, ändert sich der Abstand zwischen der Membran und der Gegenelektrode, was dann als Kapazitätsänderung des Mikrofonkondensators erfasst wird. Mit Verfahren der Oberflächen- und Volumenmikromechanik und unter Verwendung von Opferschichtätzprozessen lassen sich Mikrofonbauelemente mit sehr kleiner Chipfläche realisieren. Gemäß einem aus der Praxis bekannten Verfahren werden dabei die Schallöffnungen im Gegenelement als Ätzzugänge für den Op- ferschichtätzprozess genutzt, bei dem die Membran freigestellt wird. Bei dieserThe signal detection is usually capacitive, wherein the membrane of the microphone structure acts as a movable electrode of a microphone capacitor and the fixed counter element represents the carrier of the corresponding counter electrode. When the membrane is deflected by the sound pressure, the distance between the membrane and the counter electrode changes, which is then detected as a capacitance change of the microphone capacitor. With methods of surface and volume micromechanics and using sacrificial layer etching processes, it is possible to realize microphone components with a very small chip area. According to a method known from practice, the sound openings in the counter element are used as etching accesses for the sacrificial etching process in which the membrane is released. At this
Vorgehensweise wird das Layout der Mikrofonstruktur und insbesondere der Membran nicht nur durch die angestrebten Mikrofoneigenschaften bestimmt, sondern hängt auch wesentlich von den Möglichkeiten und Eigenschaften des Opferschichtätzprozesses ab, wie beispielsweise von der Ätzdauer, der Isotropie des Ätzprozesses und von den Grenzen und der Streuung der Unterätzweite. Mit dem Layout sind auch die akustischen Eigenschaften eines so gefertigten ME MS- Mikrofons limitiert. Approach, the layout of the microphone structure and in particular the membrane is determined not only by the desired microphone characteristics, but also depends significantly on the possibilities and properties of the sacrificial layer etching process, such as the etching time, the isotropy of the etching process and the boundaries and the spread of the undercut , The layout also limits the acoustic properties of a ME MS microphone manufactured in this way.
So ist bei den bekannten Mikrofonbauelementen der laterale Abstand zwischen den als Ätzzugang dienenden Schallöffnungen und dem Membranrand durch dieThus, in the known microphone components of the lateral distance between the serving as Ätzzugang sound openings and the membrane edge through the
Unterätzweite des Opferschichtätzprozesses begrenzt. Dieser Abstand bestimmt die Größe des akustischen Kurzschlusses, d.h. die Verminderung der Schallaufnahme der Mikrofonmembran durch direkten Druckausgleich zwischen der Membranvorderseite und der Membranrückseite. Je größer der laterale Abstand zwischen den Schallöffnungen und dem Membranrand ist, um so geringer sind die Auswirkungen des akustischen Kurzschlusses auf die Signalqualität und um so besser ist das Signal-Rausch-Verhältnis (SNR) des Mikrofonbauelements. Undercutting the sacrificial layer etching process limited. This distance determines the size of the acoustic short, i. the reduction of the sound pick-up of the microphone membrane by direct pressure equalization between the membrane front side and the membrane rear side. The greater the lateral distance between the sound apertures and the diaphragm edge, the lower the impact of the acoustic short circuit on signal quality, and the better the signal-to-noise ratio (SNR) of the microphone component.
Offenbarung der Erfindung Disclosure of the invention
Mit der vorliegenden Erfindung werden Maßnahmen zur Verbesserung der akustischen Eigenschaften eines in Opferschichttechnologie gefertigten Mikrofonbauelements vorgeschlagen. The present invention proposes measures for improving the acoustic properties of a microphone component manufactured in sacrificial layer technology.
Bei einem Bauelement der eingangs genannten Art wird eine solche Verbesserung erfindungsgemäß dadurch erreicht, dass die Durchgangsöffnungen zur Schalleinleitung über dem Mittelbereich der Membran angeordnet sind und dass über dem Randbereich der Membran akustisch kaum durchgängige und damit weitestgehend akustisch passive Perforationsöffnungen im Gegenelement strukturiert sind. Die Erfindung geht aus von der Erkenntnis, dass die Schallbeaufschlagung möglichst auf den Mittelbereich der Mikrofonmembran begrenzt werden sollte, um die Länge des akustischen Kurzschlusses zu maximieren und so seine Auswirkun- gen auf die Schallaufnahme der Mikrofonmembran möglichst gering zu halten.In a component of the type mentioned, such an improvement is achieved according to the invention in that the passage openings for sound introduction are arranged above the middle region of the membrane and that over the edge region of the membrane acoustically hardly continuous and therefore largely acoustically passive perforation openings are structured in the counter element. The invention is based on the recognition that the sound application should be limited as possible to the central region of the microphone membrane in order to maximize the length of the acoustic short circuit and thus minimize its effects on the sound pickup of the microphone membrane.
Deshalb wird erfindungsgemäß vorgeschlagen, im Gegenelement lediglich über dem Mittelbereich der Membran Durchgangsöffnungen zur Schalleinleitung, d.h. Schallöffnungen, vorzusehen. Des Weiteren ist erfindungsgemäß erkannt worden, dass bei gleichbleibender Perforationsdicke mit dem Durchmesser der Per- forationsöffnungen deren Durchlässigkeit für Schallwellen abnimmt. Da der Ätzangriff beim Opferschichtätzen aber auch über sehr kleine Perforationsöffnungen erfolgen kann, werden erfindungsgemäß solche akustisch stark überdämpften und damit inaktiven Perforationsöffnungen über dem Randbereich der Membran im Gegenelement strukturiert, also zwischen den äußersten Schallöffnungen und dem Membranrand. Dadurch kann der Pfad des akustischen Kurzschlusses unabhängig von der Unterätzweite des Opferschichtätzprozesses deutlich verlängert werden. Diese über dem Randbereich der Mikrofonmembran angeordneten sehr kleinen Perforationsöffnungen vermindern außerdem die Dämpfung der Mikrofonmembran gegenüber einem völlig geschlossenen Gegenelement, da sie die Squeezefilmdämpfung im Spalt verringern. Die Perforationsöffnungen können dazu ebenso gut punktförmig wie auch schlitzartig geformt, sowie gerade, gekrümmt oder gewinkelt ausgeführt sein. Therefore, the invention proposes, in the counter element only over the central region of the membrane through holes for sound introduction, i. Sound openings to provide. Furthermore, it has been recognized according to the invention that with a constant perforation thickness with the diameter of the perforations, their permeability to sound waves decreases. Since the etching attack during the sacrificial layer etching can also take place via very small perforation openings, according to the invention such acoustically strongly over-damped and thus inactive perforation openings are structured over the edge region of the membrane in the counter element, ie between the outermost sound openings and the membrane edge. As a result, the path of the acoustic short circuit can be significantly extended independently of the undercut width of the sacrificial layer etching process. These very small perforation openings arranged above the edge region of the microphone diaphragm also reduce the attenuation of the microphone diaphragm with respect to a completely closed counter element, since they reduce the squeeze-film attenuation in the gap. The perforation openings can be just as punctiform as slit-shaped, as well as straight, curved or angled executed.
Wie bereits erwähnt, dienen die über dem Randbereich der Mikrofonmembran im Gegenelement befindlichen Perforationsöffnungen als Ätzzugänge beim Opferschichtätzen im Rahmen der Herstellung des voranstehend beschriebenen erfindungsgemäßen Mikrofonbauelements. Dementsprechend wird hier auch ein Verfahren zur Herstellung eines solchen Bauelements beansprucht, bei dem durch Strukturierung einer Membranschicht des Schichtaufbaus eine Membran ausge- bildet wird, mindestens eine Opferschicht auf die Membranschicht aufgebracht wird und eine dicke Funktionsschicht auf der Opferschicht erzeugt wird, aus der ein feststehendes Gegenelement für die Membran herausstrukturiert wird. Erfindungsgemäß werden bei der Strukturierung der dicken Funktionsschicht über dem Mittelbereich der Membran Durchgangsöffnungen mit einer zur Schalleinlei- tung geeigneten Größe erzeugt, während über dem Randbereich der Membran akustisch weitestgehend passive Perforationsöffnungen als Durchgangsöffnun- gen erzeugt werden. In einem darauffolgenden Opferschichtätzprozess wird dann das Opferschichtmaterial zwischen der Membran und dem Gegenelement herausgelöst, wobei der Ätzangriff sowohl über die Durchgangsöffnungen zur Schalleinkopplung als auch über die akustisch passiven Perforationsöffnungen im Gegenelement erfolgt. As already mentioned, the perforation openings located in the counter element above the edge area of the microphone membrane serve as etching accesses in sacrificial layer etching in the context of the production of the above-described microphone component according to the invention. Accordingly, a method for producing such a device is claimed, in which a membrane is formed by structuring a membrane layer of the layer structure, at least one sacrificial layer is applied to the membrane layer and a thick functional layer is produced on the sacrificial layer, from which a fixed Restructured counter element for the membrane. According to the invention, when the thick functional layer is structured above the middle region of the membrane, through-openings are produced with a size suitable for sound introduction, while over the edge region of the membrane acoustically largely passive perforation openings are formed as through-openings. gen generated. In a subsequent sacrificial layer etching process, the sacrificial layer material is then dissolved out between the membrane and the counter element, with the etching attack taking place both via the passage openings for sound coupling and via the acoustically passive perforation openings in the counter element.
Zur Optimierung des akustischen Kurzschlusses bei gleichzeitiger Gewährleistung der Fertigungssicherheit werden die Perforationsöffnungen in einem auf die Unterätzweite des Ätzmediums abgestimmten Raster angeordnet, d.h. so dass das Opferschichtmaterial zwischen dem Gegenelement und dem Randbereich der Membran bei einem Ätzangriff über die Perforationsöffnungen vollständig entfernt wird. In order to optimize the acoustic short circuit while at the same time guaranteeing the manufacturing reliability, the perforation openings are arranged in a grid matched to the sub-etching width of the etching medium, i. so that the sacrificial layer material between the counter element and the edge region of the membrane is completely removed during an etching attack via the perforation openings.
Um sicherzustellen, dass die Perforationsöffnungen über dem Randbereich der Membran tatsächlich akustisch stark überdämpft oder sogar gänzlich inaktiv sind, können die Perforationsöffnungen nach dem Herauslösen des Opferschichtmaterials durch Abscheiden einer Versiegelungsschicht auf der strukturierten dicken Funktionsschicht gezielt verengt oder verschlossen werden. Diese Vorgehensweise eröffnet die Möglichkeit, die Perforationsöffnungen lediglich für den Ätzangriff im Rahmen des Herstellungsverfahrens um die Schichtdicke der Versiegelungsschicht erweitert auszubilden, um das Herauslösen des Opferschichtmaterials zu begünstigen. In order to ensure that the perforation openings over the edge region of the membrane are in fact acoustically strongly attenuated or even completely inactive, the perforation openings can be narrowed or closed in a targeted manner after the sacrificial layer material has been removed by depositing a sealing layer on the structured thick functional layer. This procedure opens up the possibility of forming the perforation openings widened by the layer thickness of the sealing layer only for the etching attack within the scope of the production method in order to promote the dissolution out of the sacrificial layer material.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Wie bereits voranstehend erörtert, gibt es verschiedene Möglichkeiten, die Lehre der vorliegenden Erfindung in vorteilhafter Weise auszugestalten und weiterzubilden. Dazu wird einerseits auf die nachgeordneten Patentansprüche verwiesen und andererseits auf die nachfolgende Beschreibung eines Ausführungsbeispiels der Erfindung anhand der Figuren. As already discussed above, there are various possibilities for embodying and developing the teaching of the present invention in an advantageous manner. Reference is made on the one hand to the subordinate claims and on the other hand to the following description of an embodiment of the invention with reference to FIGS.
Fig. 1 zeigt eine schematische Aufsicht auf das mit Durchgangsöffnungen versehene Gegenelement eines erfindungsgemäßen Mikrofonbauelements und Fig. 2a bis c zeigen schematische Schnittdarstellungen des Schichtaufbaus eines erfindungsgemäßen Mikrofonbauelements während der Versiegelung von Perforationsöffnungen. Fig. 1 shows a schematic plan view of the provided with through holes counter element of a microphone component according to the invention and 2a to c show schematic sectional views of the layer structure of a microphone component according to the invention during the sealing of perforation openings.
Ausführungsformen der Erfindung Embodiments of the invention
Wie voranstehend erörtert, bezieht sich die vorliegende Erfindung auf Bauelemente mit einer mikromechanischen Mikrofonstruktur, die in einem Schichtaufbau realisiert ist. Die Mikrofon struktur umfasst mindestens eine Membran, die in einer Membranschicht des Schichtaufbaus ausgebildet ist, und ein feststehendes akustisch durchlässiges Gegenelement für die Membran, das in einer dicken Funktionsschicht über der Membranschicht realisiert ist. Die Membran wird über Schallöffnungen im Gegenelement mit dem Schalldruck beaufschlagt. As discussed above, the present invention relates to devices having a micromechanical microphone structure realized in a layered construction. The microphone structure comprises at least one membrane, which is formed in a membrane layer of the layer structure, and a fixed acoustically permeable counter element for the membrane, which is realized in a thick functional layer over the membrane layer. The membrane is acted upon by sound openings in the counter element with the sound pressure.
In Fig. 1 ist die Draufsicht auf ein derartiges Mikrofonbauelement 10 bzw. auf dessen Gegenelement 12 dargestellt, und zwar auf einen Bereich über dem seitlichen Membranrand bis in den Mittelbereich der Membran. Die Membran überdeckt im abgebildeten Ausschnitt das Gegenelement 12. Fig. 1 veranschaulicht, dass lediglich über dem Mittelbereich der Membran Schallöffnungen 13 im Gegenelement 12 ausgebildet sind, während das Gegenelement 12 über dem Randbereich der Membran ausschließlich mit Perforationsöffnungen 14 versehen ist. Diese Perforationsöffnungen 14 sind deutlich kleiner als die Schallöffnungen 13 und so klein, dass sie akustisch stark überdämpft und dadurch akustisch nahezu undurchlässig sind. Sowohl die Schallöffnungen 13 als auch die Perforationsöffnungen 14 dienen im Rahmen des Herstellungsverfahrens als Ätzzugänge für einen Opferschichtätzprozess, bei dem das Opferschichtmaterial zwischen der Membranschicht und dem Gegenelement 12 herausgelöst wird, um die Membran freizulegen. In Fig. 1 ist die Unterätzweite dieses Ätzprozesses für jede Schallöffnung 13 und für jede Perforationsöffnung 14 in Form eines Kreises 15 bzw. 16 eingezeichnet. Der Überlappungsgrad der Kreise 15 verdeutlicht, dass die Rasteranordnung der Schallöffnungen 13 dichter ist, als dies für eine vollständige Unterätzung des Gegenelements 12 erforderlich gewesen wäre, dass die Anordnung der Schallöffnungen 13 also in erster Linie akustischen Erwägungen Rechnung trägt. Im Unterschied dazu wurde das Raster der Perforationsöffnungen 14 so gewählt, dass die Kreise 16 den Randbereich der Membran zwar vollständig überdecken, der Überlappungsgrad der Kreise 16 aber relativ klein und gleichmäßig verteilt ist. Das Raster der Perforationsöffnungen 14 wurde hier im Hinblick auf eine vollständige Unterätzung des Gegenelements 12 optimiert. In Fig. 1, the plan view of such a microphone component 10 and on the counter-element 12 is shown, to an area above the lateral edge of the membrane into the central region of the membrane. FIG. 1 illustrates that sound openings 13 are formed in the mating element 12 only over the middle region of the membrane, whereas the mating element 12 is provided with perforation openings 14 over the edge region of the membrane. These perforation openings 14 are significantly smaller than the sound openings 13 and so small that they are acoustically strongly over-damped and thus acoustically almost impermeable. Both the sound openings 13 and the perforation openings 14 serve as Ätzzugänge in the context of the manufacturing process for a sacrificial layer, in which the sacrificial layer material between the membrane layer and the counter-element 12 is dissolved out to expose the membrane. In Fig. 1, the undercut width of this etching process for each sound opening 13 and for each perforation opening 14 in the form of a circle 15 and 16, respectively. The degree of overlap of the circles 15 makes it clear that the grid arrangement of the sound openings 13 is denser than would have been necessary for a complete undercut of the counter element 12, so that the arrangement of the sound openings 13 primarily takes account of acoustic considerations. In contrast, the grid of the perforation openings 14 was selected so that the circles 16 completely cover the edge area of the membrane, but the degree of overlap of the circles 16 is relatively small and evenly distributed. The grid of the perforation openings 14 has been optimized here with regard to a complete undercut of the counter element 12.
Zum Vergleich besonders hervorgehoben sind in Fig. 1 die Unterätzweite der äußersten Schallöffnungen 13, die durch den Pfeil 17 dargestellt ist, und der Abstand zwischen den äußersten Schallöffnungen 13 und dem Membranrand 1 1 , der durch den Pfeil 18 wiedergegeben wird. Der Vergleich dieser beiden Größen verdeutlicht, dass mit Hilfe der Perforationsöffnungen 14 ein deutlich größerer Abstand zwischen den äußersten Schallöffnungen 13 und dem Membranrand 1 1 realisiert wurde, als dies bei ausschließlicher Verwendung der SchallöffnungenFor comparison, the undercut width of the outermost sound openings 13, which is represented by the arrow 17, and the distance between the outermost sound openings 13 and the membrane edge 1 1, which is represented by the arrow 18, are particularly emphasized in FIG. 1. The comparison of these two variables makes it clear that with the aid of the perforation openings 14, a significantly greater distance between the outermost sound openings 13 and the membrane edge 1 1 was realized than when the sound openings were used exclusively
13 als Ätzzugang beim Opferschichtätzprozess möglich gewesen wäre. 13 would have been possible as Ätzzugang the Opferschichtätzprozess.
Da der Einfluss des akustischen Kurzschlusses auf das Mikrofonsignal um so größer ist, je kleiner der Abstand zwischen den äußersten Schallöffnungen und dem Membranrand ist, tragen die Perforationsöffnungen 14, mit denen dieserSince the influence of the acoustic short circuit on the microphone signal is the greater, the smaller the distance between the outermost sound openings and the membrane edge, carry the perforation openings 14, with which this
Abstand im Opferschichtätzprozess vergrößert wurde, zur Verbesserung der a- kustischen Eigenschaften des Mikrofonbauelements 10 bei. Außerdem vermindern die Perforationsöffnungen 14 über dem Randbereich der Membran die Dämpfung der Mikrofonmembran, was sich ebenfalls günstig auf die akustischen Eigenschaften des Mikrofonbauelements auswirkt. Distance in the sacrificial layer etching process has been increased, to improve the acoustic properties of the acoustic component 10 at. In addition, the perforation openings 14 over the edge region of the membrane reduce the attenuation of the microphone membrane, which likewise has a favorable effect on the acoustic properties of the microphone component.
Zur Implementierung der hier in Rede stehenden Erfindung wird also je nach den angestrebten akustischen Eigenschaften des Mikrofonbauelements eine Reihe oder auch ein Feld von akustisch passiven Ätzzugängen mit kleinem Durchmes- ser zwischen der Membrankante und den Schallöffnungen im Gegenelement erzeugt. Die Anzahl, die Größe und auch die Anordnung dieser Perforationsöffnungen hängen dabei sowohl vom errechneten Optimum bezüglich der akustischen, mechanischen und elektrischen Eigenschaften, wie Dämpfung, Empfindlichkeit, Signal-Rausch-Abstand, als auch von den Strukturierungsmöglichkeiten im Her- stellungsprozess ab. Dabei muss ein Kompromiss gefunden werden zwischen großen Perforationsöffnungen einerseits, was mit einer geringen Dämpfung der Mikrofonmembran verbunden ist, und einer Perforationsstruktur mit einem hohen akustischen Widerstand andererseits, wodurch die elektrische Empfindlichkeit der Mikrofon struktur erhöht und das Rauschen des akustischen Kurzschlusses verringert wird. Erfindungsgemäß müssen die Perforationsöffnungen also zwei Kriterien erfüllen. Zum einen müssen sie hinreichend groß sein, um als Ätzzugang für den Opferschichtätzprozess fungieren zu können. Zum anderen müssen sie so klein sein, dass sie akustisch möglichst undurchlässig sind. Um diesen vermeintlich widerstreitenden Anforderungen zu genügen, können die Perforationsöffnungen nach dem Opferschichtätzprozess mit Hilfe einer Versiegelungsschicht verengt oder sogar gänzlich verschlossen werden. Die hierfür erforderliche Prozessfolge wird durch die Figuren 2a bis 2c veranschaulicht. In order to implement the invention in question, depending on the desired acoustic properties of the microphone component, a series or also a field of acoustically passive etch entries with a small diameter is produced between the diaphragm edge and the sound openings in the counterelement. The number, the size and also the arrangement of these perforation openings depend both on the calculated optimum with regard to the acoustic, mechanical and electrical properties, such as attenuation, sensitivity, signal-to-noise ratio and structuring possibilities in the production process. A compromise must be found between large perforations on the one hand, which is associated with a low attenuation of the microphone membrane, and a perforation structure with a high acoustic resistance on the other hand, whereby the electrical sensitivity of the microphone structure increases and the noise of the acoustic short circuit is reduced. According to the perforation openings must therefore meet two criteria. First, they must be sufficiently large to act as an etch access for the sacrificial layer etching process. On the other hand, they must be so small that they are acoustically impermeable as possible. In order to meet these supposedly conflicting requirements, the perforation openings can be narrowed or even completely closed after the sacrificial layer etching process with the aid of a sealing layer. The process sequence required for this purpose is illustrated by FIGS. 2a to 2c.
In Fig. 2a ist der obere Teil des Schichtaufbaus eines Mikrofonbauelements 20 mit der Membran 21 und dem Gegenelement 22 im Bereich des Membranrandes dargestellt, nachdem das Opferschichtmaterial zwischen der Membran 21 und dem Gegenelement 22 in einem Opferschichtätzprozess entfernt worden ist. Der Ätzangriff erfolgte dabei über die Durchgangsöffnungen 23 und 24 im Gegenelement. Die über dem Mittelbereich der Membran 21 angeordneten Durchgangsöffnungen 23 sind als Schallöffnungen angelegt, während die Durchgangsöffnungen 24 im Randbereich der Membran 21 in Form von Perforationsöffnungen mit sehr kleinem Querschnitt realisiert sind. FIG. 2 a shows the upper part of the layer construction of a microphone component 20 with the membrane 21 and the counter-element 22 in the region of the membrane edge, after the sacrificial layer material has been removed between the membrane 21 and the counter-element 22 in a sacrificial-layer etching process. The etching attack took place via the passage openings 23 and 24 in the counter element. The passage openings 23 arranged above the middle region of the membrane 21 are designed as sound openings, while the passage openings 24 in the edge region of the membrane 21 are realized in the form of perforation openings with a very small cross section.
Nach dem Opferschichtätzprozess wurde dann eine Versiegelungsschicht 25, beispielsweise ein PECVD-Oxid, auf der Bauteiloberfläche abgeschieden. Das Material dieser Versiegelungsschicht 25 wurde dabei über die Durchgangsöffnungen 23 und 24 auch auf der Membran 21 und an den Öffnungswandungen angelagert. Während die Schallöffnungen 23 durch die Versiegelungsschicht 25 lediglich verengt wurden, wurden die kleineren Perforationsöffnungen 24 hier gänzlich verschlossen, was in Fig. 2b dargestellt ist. After the sacrificial layer etching process, a sealing layer 25, such as a PECVD oxide, was then deposited on the device surface. The material of this sealing layer 25 was thereby deposited via the passage openings 23 and 24 also on the membrane 21 and on the opening walls. While the sound openings 23 were only narrowed by the sealing layer 25, the smaller perforation openings 24 were completely closed here, which is shown in Fig. 2b.
In einem weiteren kurzen Gasphasenätzschritt wurde die Versiegelungsschicht 25 schließlich wieder großflächig vom Gegenelement 22 und von der Membran 21 entfernt. Fig. 2c veranschaulicht, dass das Material der VersiegelungsschichtIn a further short gas phase etching step, the sealing layer 25 was finally removed again over a large area from the counter element 22 and from the membrane 21. Fig. 2c illustrates that the material of the sealing layer
25 dabei auch von der Wandung der Schallöffnungen 23 entfernt wurde, während die gänzlich versiegelten Perforationsöffnungen 24 mit kleinem Durchmesser verschlossen oder zumindest sehr stark verengt bleiben. Dies ist auf die sehr reduzierte Angriffsfläche für den Ätzprozess auf der Vorder- und Rückseite des Gegenelements 22 zurückzuführen. 25 was also removed from the wall of the sound openings 23, while the completely sealed perforation openings 24 are closed with a small diameter or at least very narrowed. This is due to the very reduced attack surface for the etching process on the front and back of the counter-element 22.

Claims

Ansprüche claims
1 . Bauelement (10) mit einer mikromechanischen Mikrofonstruktur, die in einem Schichtaufbau realisiert ist, mindestens umfassend 1 . Component (10) with a micromechanical microphone structure, which is realized in a layer structure, at least comprising
o eine durch den Schalldruck auslenkbare Membran, die in einer Membranschicht realisiert ist, und  o a deflectable by the sound pressure membrane, which is realized in a membrane layer, and
o ein feststehendes akustisch durchlässiges Gegenelement (12) für die Membran, das in einer dicken Funktionsschicht über der Membranschicht realisiert ist und mit Durchgangsöffnungen (13) zur Schalleinkopplung versehen ist;  o a fixed acoustically permeable counter element (12) for the membrane, which is realized in a thick functional layer over the membrane layer and provided with passage openings (13) for sound coupling;
dadurch gekennzeichnet, dass die Durchgangsöffnungen (13) zur Schalleinkopplung über dem Mittelbereich der Membran angeordnet sind und dass über dem Randbereich der Membran akustisch weitestgehend passive Perforationsöffnungen (14) im Gegenelement (12) strukturiert sind.  characterized in that the passage openings (13) are arranged for sound coupling over the central region of the membrane and that over the edge region of the membrane acoustically largely passive perforation openings (14) in the counter-element (12) are structured.
2. Bauelement (20) nach Anspruch 1 , dadurch gekennzeichnet, dass die Perforationsöffnungen (24) durch das Material mindestens einer auf die dicke Funktionsschicht aufgebrachten Versiegelungsschicht (25) verengt sind. 2. The component (20) according to claim 1, characterized in that the perforation openings (24) are narrowed by the material of at least one applied to the thick functional layer sealing layer (25).
3. Bauelement (20) nach Anspruch 1 , dadurch gekennzeichnet, dass die Perforationsöffnungen (24) durch das Material mindestens einer auf die dicke Funktionsschicht aufgebrachten Versiegelungsschicht (25) verschlossen sind. 3. The component (20) according to claim 1, characterized in that the perforation openings (24) are closed by the material of at least one applied to the thick functional layer sealing layer (25).
4. Verfahren zur Herstellung eines Bauelements (10) mit einer mikromechanischen Mikrofonstruktur, die in einem Schichtaufbau realisiert wird, insbesondere zur Herstellung eines Bauelements nach einem der Ansprüche 1 bis 3, bei dem 4. A method for producing a component (10) with a micromechanical microphone structure, which is realized in a layer structure, in particular for producing a component according to one of claims 1 to 3, wherein
- durch Strukturierung einer Membranschicht eine Membran ausgebil- det wird, - mindestens eine Opferschicht auf die Membranschicht aufgebracht wird, a membrane is formed by structuring a membrane layer, at least one sacrificial layer is applied to the membrane layer,
- eine dicke Funktionsschicht auf der Opferschicht erzeugt und strukturiert wird, wobei ein feststehendes Gegenelement (12) für die Membran ausgebildet und mit Durchgangsöffnungen (13) versehen wird, und  a thick functional layer is produced and patterned on the sacrificial layer, wherein a fixed counter element (12) for the membrane is formed and provided with passage openings (13), and
- das Opferschichtmaterial zwischen der Membran und dem Gegenelement (12) in einem Opferschichtätzprozess herausgelöst wird, wobei der Ätzangriff über die Durchgangsöffnungen (13) im Gegenelement erfolgt,  the sacrificial layer material is dissolved out between the membrane and the counter element (12) in a sacrificial layer etching process, wherein the etching attack occurs via the through openings (13) in the counter element,
dadurch gekennzeichnet, dass bei der Strukturierung der dicken Funktionsschicht über dem Mittelbereich der Membran Durchgangsöffnungen (13) mit einer zur Schalleinleitung geeigneten Größe erzeugt werden und dass über dem Randbereich der Membran akustisch weitestgehend passive Perforationsöffnungen (14) als Durchgangsöffnungen erzeugt werden. characterized in that in the structuring of the thick functional layer over the central region of the membrane passage openings (13) are generated with a size suitable for sound introduction size and that over the edge region of the membrane acoustically largely passive perforation openings (14) are produced as passage openings.
Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass die Perforationsöffnungen (14) in einem Raster angeordnet werden, das auf die Unterätzweite des Ätzmediums abgestimmt ist. A method according to claim 4, characterized in that the perforation openings (14) are arranged in a grid which is tuned to the undercutting of the etching medium.
Verfahren nach einem der Ansprüche 3 oder 4, dadurch gekennzeichnet, dass die Perforationsöffnungen (24) nach dem Herauslösen des Opferschichtmaterials durch Abscheiden einer Versiegelungsschicht (25) auf der strukturierten dicken Funktionsschicht gezielt verengt oder verschlossen werden. Method according to one of claims 3 or 4, characterized in that the perforation openings (24) are selectively narrowed or closed after the dissolution of the sacrificial layer material by depositing a sealing layer (25) on the structured thick functional layer.
EP10781632.4A 2010-01-05 2010-11-05 Component having micromechanical microphonestructure and method for producing Active EP2522153B1 (en)

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