EP2494655B1 - Antenna arrangement for signal transmission - Google Patents
Antenna arrangement for signal transmission Download PDFInfo
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- EP2494655B1 EP2494655B1 EP10779263.2A EP10779263A EP2494655B1 EP 2494655 B1 EP2494655 B1 EP 2494655B1 EP 10779263 A EP10779263 A EP 10779263A EP 2494655 B1 EP2494655 B1 EP 2494655B1
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- antenna
- antennas
- antenna arrangement
- subarrangement
- chip
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to an antenna arrangement for transmitting signals, consisting of a plurality of antennas, which are arranged in a plane spaced from a chip surface.
- antennas For the emission and reception of electromagnetic waves, for example in the field of wireless communication, antennas are needed.
- This technical arrangement converts as a transmitter-side arranged antenna conducted electromagnetic waves in so-called free space waves, which propagate as electromagnetic waves from the antenna into the room.
- the antenna converts the electromagnetic waves arriving as free-space wave back into conducted electromagnetic waves, the antenna is thus a converter between conduction and free-space waves and vice versa.
- Essential for this is the adaptation of the characteristic impedance of the line to the characteristic impedance of the free space.
- the first antenna is used as the transmitting antenna and the second antenna as the receiving antenna or that the first and the second antenna are connected in series as a two-part overall antenna.
- the invention is therefore based on the object of specifying an antenna arrangement for transmitting signals, which has an improved directional characteristic and a higher antenna gain, is easy to manufacture, robust and inexpensive.
- the object is achieved with an antenna arrangement for transmitting signals of the type mentioned above in that the orientation of the antennas between two adjacent planes is different, wherein the antenna arrangement consists of a first antenna sub-assembly and a second antenna sub-assembly, wherein the first antenna sub-assembly via the second antenna subassembly is arranged, wherein the first antenna subassembly of patch antennas and the second antenna subassembly consists of multi-layer Vivaldi antennas or the first antenna subassembly of patch antennas and the second antenna subassembly of a series of lateral patch antennas or the first antenna subassembly of loop antennas and the second antenna subassembly of multilayer Vivaldi antennas or consists of the first antenna sub-array of cavity-backed structures and the second antenna sub-array of multi-layer Vivaldi antennas.
- a plurality of antennas are arranged per level, wherein
- the invention enables both a combination of identical and different antennas in an antenna system to improve the performance of the overall system.
- the improvements include increasing the coverage of the illuminable space, whereby the individual antenna systems generally do not adversely affect, as well as the reduction of energy consumption.
- the orientation of the antennas in a plane is the same.
- the orientation of the antennas in a plane is different.
- the individual antennas arranged in one plane of the antenna arrangement can be arranged in the same direction in the main direction of their emitted radiant intensity. In this way, a directional effect of the antenna arrangement in a preferred beam direction of the antennas can be achieved.
- the individual antennas of a plane can be aligned unequal with respect to their main direction.
- the directional characteristic of the antenna arrangement can be changed, for example, such that a preferred range or sector of the directivity or a nearly uniform directivity (spherical characteristic) results on all sides.
- the orientation of the antennas between two adjacent planes is different.
- the alignment of the individual antennas of one plane is the same or different from the alignment of the individual antennas of another plane.
- the directivity of the entire antenna array in the direction of alignment of the individual antennas improves, while by means of a different alignment of the planes a preferred area or a more uniform all-round directivity can be achieved.
- the antennas of two adjacent planes coincide or offset from one another.
- the planes can be arranged in multiple layers one above the other. In this case, it is possible to arrange the individual planes flush or staggered with respect to one another, wherein in turn the directional characteristic of the system can be influenced.
- the planes have a circular or n-shaped base area with n ⁇ 3.
- the planes are arranged forming a cuboid or a truncated pyramid structure one above the other.
- the coupling of the antenna arrangement to the chip takes place by means of contacts, inductively or capacitively.
- a signal transmission between the chip and the antenna can be effected for example by an electrically conductive connection in the form of contacts or wires.
- Another form of connection is one capacitive or inductive coupling between antenna and chip.
- the antenna arrangement is arranged indirectly on the chip or in a housing part which covers the chip like a cover.
- the invention provides in a particular embodiment, a housing for a chip, which simultaneously includes an antenna arrangement according to the invention.
- an antenna arrangement according to the invention.
- Several possibilities of designing this antenna arrangement are conceivable, for example combinations of two or more similar or different types of antennas (for example microstrip patch antennas, Vivaldi antennas) in one or more planes.
- An arrangement of a plurality of antennas in at least two different levels to an antenna system is also possible.
- a goal is the enlargement of the so-called illuminated area or the directional characteristic of the antenna.
- each individual antenna of the antenna arrangement can be connected to its own drive unit.
- a single antenna becomes active at a fixed time, controlled by its associated drive unit.
- Another possibility is to interconnect a plurality of antennas of one or more planes of the antenna arrangement and to connect them to a drive circuit.
- a plurality of interconnected antennas which are also referred to as clusters, are driven by a common drive circuit.
- This interconnection of several antennas can be static. In this case, for example, once established connections, which are to be switched, produced between the drive circuit and the antennas. As a result, the antenna arrangement or part of the antenna arrangement (cluster) becomes active at a specified time.
- FIG. 1 shows an antenna arrangement 1 according to the invention, which is arranged for example in a cover of a chip-like covering housing part 4 of a chip package.
- the chip housing 4 is only partially and only schematically shown.
- FIG. 1 shows the antenna assembly 1 in an isometric view.
- the antenna arrangement 1 consists of two antenna sub-assemblies 2 and 3.
- the first antenna sub-assembly 2 comprises the uppermost level.
- the top-level antennas are implemented as microstrip patch antennas and arranged in the same orientation.
- the antenna sub-assembly 2 comprises two planes, in each of which a plurality of Vivaldi antennas are arranged aligned in different directions per plane.
- the alignment of the Vivaldi antennas between the two adjacent planes is congruent.
- the second antenna subassembly 3 consisting of only one plane or three planes, the alignment of the Vivaldi antennas from plane to plane is different.
- FIG. 2 shows a view of the antenna assembly from the top of the chip housing 4, wherein a top level covering housing or protective layer is not shown.
- the antenna arrangement is shown in a view from below.
- the consisting of several Vivaldi antennas antenna sub-assembly 3 extends to the edge of the chip housing 4.
- the alignment of the Vivaldi antennas was carried out in a plane of a coordinate system, not shown at an angle of 0, 90, 180 and 270 degrees.
- FIG. 4 shows a representation of a 6x6 antenna array, for example, as a first antenna sub-assembly 2, in which so-called “cavity-backed dipole antennas" were used.
- the orientation of all antennas of this antenna sub-assembly 2 is the same.
- FIG. 5 shows an enlarged detail of the first, consisting of a plane, antenna sub-assembly 2 of the FIG. 4 , Under the first antenna sub-assembly 2, a three-level second antenna sub-assembly 3 is arranged. In this Vivaldi antennas are aligned and arranged congruently one above the other.
- FIG. 6 shows a three-dimensional graphical representation of the radiation characteristic (or directional characteristic) of the antenna arrangement 1 according to the invention from the FIG. 4 ,
- the representation is only a schematic representation of different clubs in a spatial coordinate system. On a representation of the field strength was waived. Shown is the case of an in-phase and with the same amplitude fed from 36 subantenna antenna array. 1
- FIG. 7 is a further three-dimensional schematic representation of a directional characteristic shown. This also refers to those in the FIG. 4 illustrated antenna arrangement 1.
- the phases of the 36 individual antennas of the antenna assembly 1 were set such that the illustrated beam swing is achieved.
- the maximum achievable beam swing is shown with such an arrangement.
- Another beam swing is by means of a in the FIG. 5 illustrated antenna arrangement 1 possible.
- this two antenna antennas consisting of various antennas arrangements 2 and 3 are shown. Due to the different antenna types and a different orientation of the antennas in a plane or between the planes, a targeted influencing of the beam shaping and the alignment is achieved.
- the invention provides an antenna arrangement 1 which is arranged directly in the housing of a chip 4, preferably in a housing part which covers the cover like a cover.
- Such chips may, for example, be semiconductor chips for applications in the millimeter wave range. It is irrelevant for the antennas of the antenna assembly 1, which signal information is emitted or received with her.
- the antenna assembly 1 When the antenna assembly 1 is a part of the chip package, no connections between the terminals of the semiconductor chip (pins) and a separate off-chip antenna become necessary, resulting in simplification of chip design and cost reduction. Furthermore, no electrical losses occur through the compounds listed above. Thus, will achieved a reduction in power dissipation. In addition, the number of connecting lines required on the board carrying the chip is reduced, resulting in a reduction in the space required and the cost.
- the antenna arrangement 1 according to the invention can also be applied directly to the chip, for example separated from it only by an insulating layer, and thus does not form part of the chip housing.
- antenna arrangement 1 Another possibility of placing the antenna arrangement 1 is the arrangement directly on the semiconductor chip as a subassembly of the chip itself or the placement in a chip housing wall laterally covering the semiconductor chip.
- Such antenna arrangements 1 can, for example, for the transmission of large amounts of data between PC, printer, mouse, keyboard, screen, TV, hi-fi devices, projectors, medical analysis devices u.a. be used. For example, when using the 60 GHz frequency spectrum, data transmission up to a distance of about 10 meters is possible.
- the feed network for controlling the individual antennas is located in the housing itself. This can also be designed in several layers. Possible line structures are CPS, CPW, (coupled) microstrip, slotline or stripline. The coupling from the lead to the radiating apertures can be done differently, e.g. galvanically, capacitively or inductively coupled.
- the applications of such an antenna arrangement can take place, for example, in the field of communication (high data rates, short contact times), sensor technology (high resolution), medicine (eg imaging systems), radar, pattern recognition and industrial manufacturing.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
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Description
Die Erfindung betrifft eine Antennenanordnung zur Übertragung von Signalen, bestehend aus mehreren Antennen, welche in einer Ebene zu einer Chipoberfläche beabstandet angeordnet sind.The invention relates to an antenna arrangement for transmitting signals, consisting of a plurality of antennas, which are arranged in a plane spaced from a chip surface.
Zur Abstrahlung und zum Empfang elektromagnetischer Wellen, beispielsweise im Bereich der drahtlosen Kommunikation, werden Antennen benötigt. Diese technische Anordnung wandelt als eine senderseitig angeordnete Antenne leitungsgebundene elektromagnetische Wellen in sogenannte Freiraumwellen um, welche sich als elektromagnetische Wellen von der Antenne in den Raum ausbreiten.For the emission and reception of electromagnetic waves, for example in the field of wireless communication, antennas are needed. This technical arrangement converts as a transmitter-side arranged antenna conducted electromagnetic waves in so-called free space waves, which propagate as electromagnetic waves from the antenna into the room.
Empfängerseitig wandelt die Antenne die als Freiraumwelle ankommenden elektromagnetischen Wellen zurück in leitungsgebundene elektromagnetische Wellen, die Antenne ist somit ein Wandler zwischen Leitungs- und Freiraumwellen sowie umgekehrt. Wesentlich dafür ist die Anpassung des Wellenwiderstandes der Leitung an den Wellenwiderstand des freien Raumes.On the receiver side, the antenna converts the electromagnetic waves arriving as free-space wave back into conducted electromagnetic waves, the antenna is thus a converter between conduction and free-space waves and vice versa. Essential for this is the adaptation of the characteristic impedance of the line to the characteristic impedance of the free space.
In modernen Geräten im Bereich der Kommunikationstechnik besteht die Notwendigkeit, Antennen mit kleinen oder kleinsten Abmessungen mit den für die Signalverarbeitung vorgesehenen Halbleiterchips oder Bestandteilen des Halbleiterchips zu verbinden, um deren Funktionalitäten zu gewährleisten.In modern devices in the field of communication technology, there is the need to connect antennas with small or smallest dimensions with the intended for signal processing semiconductor chips or components of the semiconductor chip in order to ensure their functionality.
Aus der
Diese Lösung weist den Nachteil auf, dass sie ein Bestandteil des Chips selbst ist. Dadurch ist eine Nutzung mit unterschiedlichen Chips nur bedingt möglich, da der Entwurf der Antennenstruktur bereits beim Entwurf des Chips durchgeführt werden muss.This solution has the disadvantage of being a Part of the chip itself. As a result, use with different chips is only possible to a limited extent since the design of the antenna structure must already be carried out during the design of the chip.
Aus der
Aus der
Offenbart ist hierbei, dass die erste Antenne als Sende- und die zweite Antenne als Empfangsantenne genutzt wird oder dass die erste und die zweite Antenne in Serie geschaltet als eine aus zwei Teilen bestehende Gesamtantenne betrieben wird. Der Erfindung liegt somit die Aufgabe zugrunde, eine Antennenanordnung zur Übertragung von Signalen anzugeben, welche eine verbesserte Richtcharakteristik sowie einen höheren Antennengewinn aufweist, einfach zu fertigen, robust und kostengünstig ist.It is disclosed here that the first antenna is used as the transmitting antenna and the second antenna as the receiving antenna or that the first and the second antenna are connected in series as a two-part overall antenna. The invention is therefore based on the object of specifying an antenna arrangement for transmitting signals, which has an improved directional characteristic and a higher antenna gain, is easy to manufacture, robust and inexpensive.
Gemäß der Erfindung wird die Aufgabe mit einer Antennenanordnung zur Übertragung von Signalen der eingangs genannten Art dadurch gelöst, dass die Ausrichtung der Antennen zwischen zwei benachbarten Ebenen unterschiedlich ist, wobei die Antennenanordnung aus einer ersten Antennenteilanordnung und einer zweiten Antennenteilanordnung besteht, wobei die erste Antennenteilanordnung über der zweiten Antennenteilanordnung angeordnet ist, wobei die erste Antennenteilanordnung aus Patchantennen und die zweite Antennenteilanordnung aus mehrlagigen Vivaldi-Antennen besteht oder die erste Antennenteilanordnung aus Patchantennen und die zweite Antennenteilanordnung aus einer Reihe von seitlichen Patchantennen besteht oderdie erste Antennenteilanordnung aus Schleifenantennen und die zweite Antennenteilanordnung aus mehrlagigen Vivaldi-Antennen besteht oder die erste Antennenteilanordnung aus Cavity-Backed Strukturen und die zweite Antennenteilanordnung aus mehrlagigen Vivaldi-Antennen besteht. Gemäß der Erfindung werden mehrere Antennen pro Ebene angeordnet, wobei die Antennenanordnung mindesten zwei Ebenen umfasst. Durch eine derartige Anordnung der Antennen zu einer Antennenanordnung wird die Richtcharakteristik verbessert.According to the invention, the object is achieved with an antenna arrangement for transmitting signals of the type mentioned above in that the orientation of the antennas between two adjacent planes is different, wherein the antenna arrangement consists of a first antenna sub-assembly and a second antenna sub-assembly, wherein the first antenna sub-assembly via the second antenna subassembly is arranged, wherein the first antenna subassembly of patch antennas and the second antenna subassembly consists of multi-layer Vivaldi antennas or the first antenna subassembly of patch antennas and the second antenna subassembly of a series of lateral patch antennas or the first antenna subassembly of loop antennas and the second antenna subassembly of multilayer Vivaldi antennas or consists of the first antenna sub-array of cavity-backed structures and the second antenna sub-array of multi-layer Vivaldi antennas. According to the invention, a plurality of antennas are arranged per level, wherein the antenna arrangement comprises at least two levels. Such an arrangement of the antennas to form an antenna arrangement improves the directional characteristic.
Die Erfindung ermöglicht sowohl eine Kombination gleicher als auch unterschiedlicher Antennen in einem Antennensystem, um die Leistungsfähigkeit des Gesamtsystems zu verbessern. Die Verbesserungen umfassen dabei die Erhöhung der Abdeckung des ausleuchtbaren Raumes, wobei sich die Einzelantennensysteme im Allgemeinen nicht negativ beeinflussen, sowie die Verringerung des Energieverbrauchs.The invention enables both a combination of identical and different antennas in an antenna system to improve the performance of the overall system. The improvements include increasing the coverage of the illuminable space, whereby the individual antenna systems generally do not adversely affect, as well as the reduction of energy consumption.
Wesentliche Vorteile sind dabei die Erhöhung der Abdeckung, d.h. der Raum, welcher das Gesamtantennensystem in der Lage ist auszuleuchten (Abstrahlcharakteristik) und die kompakte und robuste Bauform.Significant advantages are the increase in coverage, ie the space which the overall antenna system is able to illuminate (radiation characteristic) and the compact and robust design.
In einer Ausgestaltung der Erfindung ist vorgesehen, dass die Ausrichtung der Antennen in einer Ebene gleich ist.In one embodiment of the invention it is provided that the orientation of the antennas in a plane is the same.
In einer Ausführung der Erfindung ist vorgesehen, dass die Ausrichtung der Antennen in einer Ebene unterschiedlich ist.In an embodiment of the invention it is provided that the orientation of the antennas in a plane is different.
Die in einer Ebene der Antennenanordnung angeordneten Einzelantennen können in der Hauptrichtung ihrer abgegebenen Strahlstärke gleich ausgerichtet angeordnet werden. Derart kann eine Richtwirkung der Antennenanordnung in eine bevorzugte Strahlrichtung der Antennen erreicht werden.The individual antennas arranged in one plane of the antenna arrangement can be arranged in the same direction in the main direction of their emitted radiant intensity. In this way, a directional effect of the antenna arrangement in a preferred beam direction of the antennas can be achieved.
In einer anderen Ausführung können die Einzelantennen einer Ebene bezogen auf ihre Hauptrichtung ungleich ausgerichtet werden. Mittels verschiedener Hautrichtungen kann die Richtcharakteristik der Antennenanordnung beispielsweise derart verändert werden, dass sich ein bevorzugter Bereich oder Sektor der Richtwirkung oder eine nahezu gleichmäßige Richtwirkung (Kugelcharakteristik) nach allen Seiten ergibt.In another embodiment, the individual antennas of a plane can be aligned unequal with respect to their main direction. By means of different skin directions, the directional characteristic of the antenna arrangement can be changed, for example, such that a preferred range or sector of the directivity or a nearly uniform directivity (spherical characteristic) results on all sides.
In einer weiteren Ausgestaltung der Erfindung ist vorgesehen, dass die Ausrichtung der Antennen zwischen zwei benachbarten Ebenen unterschiedlich ist.In a further embodiment of the invention, it is provided that the orientation of the antennas between two adjacent planes is different.
Erfindungsgemäß ist es möglich, die Ausrichtung der Einzelantennen einer Ebene gleich oder verschiedenartig zur Ausrichtung der Einzelantennen einer anderen Ebene zu gestalten. Bei einer gleichen Ausrichtung zwischen zwei Ebenen verbessert sich wiederum die Richtwirkung der gesamten Antennenanordnung in der Richtung der Ausrichtung der Einzelantennen während mittels einer verschiedenartigen Ausrichtung der Ebenen ein bevorzugter Bereich oder eine gleichmäßigere allseitige Richtwirkung erreichen lässt.According to the invention, it is possible to make the alignment of the individual antennas of one plane the same or different from the alignment of the individual antennas of another plane. In the same orientation between two planes, in turn, the directivity of the entire antenna array in the direction of alignment of the individual antennas improves, while by means of a different alignment of the planes a preferred area or a more uniform all-round directivity can be achieved.
In einer besonderen Ausführung der Erfindung ist vorgesehen, dass die Antennen zweier benachbarter Ebenen deckungsgleich oder versetzt zueinander angeordnet sind.In a particular embodiment of the invention, it is provided that the antennas of two adjacent planes coincide or offset from one another.
Wenn mehrere Ebenen der Antennenanordnung eine planare Struktur aufweisen, so können die Ebenen mehrlagig übereinander angeordnet werden. Dabei ist es möglich, die einzelnen Ebenen bündig oder versetzt zueinander anzuordnen, wobei wiederum die Richtcharakteristik des Systems beeinflusst werden kann.If a plurality of planes of the antenna arrangement have a planar structure, the planes can be arranged in multiple layers one above the other. In this case, it is possible to arrange the individual planes flush or staggered with respect to one another, wherein in turn the directional characteristic of the system can be influenced.
In einer Ausführung der Erfindung ist vorgesehen, dass die Ebenen eine kreisförmige oder n-eckige Grundfläche mit n ≥ 3 aufweisen.In one embodiment of the invention, it is provided that the planes have a circular or n-shaped base area with n ≥ 3.
Es ist möglich, die Grundfläche einer oder mehrerer Ebenen zu variieren, so kann diese beispielsweise als Dreieck, Viereck oder Achteck ausgeführt werden.It is possible to vary the footprint of one or more planes, such as triangles, squares or octagons.
In einer weiteren Ausführung der Erfindung ist vorgesehen, dass die Ebenen eine Quader- oder eine Pyramidenstumpfstruktur bildend übereinander angeordnet sind.In a further embodiment of the invention, it is provided that the planes are arranged forming a cuboid or a truncated pyramid structure one above the other.
Bei einer rechteckigen Grundfläche einer Ebene der Antennenanordnung entsteht, bei einer Anordnung der Ebenen aufeinander oder übereinander, entweder eine Quaderstruktur oder für den Fall, dass die Abmessungen der übereinander angeordneten Ebenen immer kleiner werden, eine Pyramidenstumpfstruktur.With a rectangular base of a plane of the antenna arrangement, when the planes are arranged on one another or one above the other, either a cuboid structure or, in the case of the dimensions of the planes arranged one above another, smaller and smaller, a truncated pyramid structure is created.
In einer speziellen Ausführung der Erfindung ist vorgesehen, dass die Ankopplung der Antennenanordnung an den Chip mittels Kontakten, induktiv oder kapazitiv erfolgt.In a special embodiment of the invention, it is provided that the coupling of the antenna arrangement to the chip takes place by means of contacts, inductively or capacitively.
Zur Übertragung von Signalen zwischen den Einzelantennen oder der Antennenanordnung und dem Chip müssen beide miteinander verbunden sein. Eine Signalübertragung zwischen Chip und Antenne kann beispielsweise durch eine elektrisch leitende Verbindung in Form von Kontakten oder Drähten erfolgen. Eine andere Form der Verbindung ist eine kapazitive oder eine induktive Kopplung zwischen Antenne und Chip.To transmit signals between the individual antennas or the antenna array and the chip both must be connected together. A signal transmission between the chip and the antenna can be effected for example by an electrically conductive connection in the form of contacts or wires. Another form of connection is one capacitive or inductive coupling between antenna and chip.
In einer speziellen Ausführungsform der Erfindung ist vorgesehen, dass die Antennenanordnung mittelbar auf dem Chip oder in einem den Chip deckelartig abdeckenden Gehäuseteil angeordnet ist.In a specific embodiment of the invention, it is provided that the antenna arrangement is arranged indirectly on the chip or in a housing part which covers the chip like a cover.
Die Erfindung stellt in einer besonderen Ausführung ein Gehäuse für einen Chip zur Verfügung, welches gleichzeitig eine erfindungsgemäße Antennenanordnung beinhaltet. Dabei sind mehrere Möglichkeiten der Ausgestaltung dieser Antennenanordnung denkbar, beispielsweise Kombinationen zweier oder mehrerer gleichartiger oder verschiedenartiger Antennen (beispielsweise Mikrostreifen-Patchantennen, Vivaldi-Antennen) in einer oder mehreren Ebenen. Auch eine Anordnung jeweils mehrerer Antennen in mindestens zwei verschiedenen Ebenen zu einem Antennensystem ist möglich. Bei der Kombination verschiedener Antennen zu einer derartigen Antennenanordnung ist ein Ziel die Vergrößerung des sogenannten ausgeleuchteten Bereichs oder der Richtcharakteristik der Antenne.The invention provides in a particular embodiment, a housing for a chip, which simultaneously includes an antenna arrangement according to the invention. Several possibilities of designing this antenna arrangement are conceivable, for example combinations of two or more similar or different types of antennas (for example microstrip patch antennas, Vivaldi antennas) in one or more planes. An arrangement of a plurality of antennas in at least two different levels to an antenna system is also possible. In the combination of different antennas to such an antenna arrangement, a goal is the enlargement of the so-called illuminated area or the directional characteristic of the antenna.
Gemäß der Erfindung kann jede einzelne Antenne der Antennenanordnung mit einer eigenen Ansteuereinheit verbunden sein. Hier wird eine einzelne Antenne zu einer festgelegten Zeit, gesteuert durch ihre zugeordnete Ansteuereinheit, aktiv.According to the invention, each individual antenna of the antenna arrangement can be connected to its own drive unit. Here a single antenna becomes active at a fixed time, controlled by its associated drive unit.
Eine andere Möglichkeit besteht darin, mehrere Antennen einer oder mehrerer Ebenen der Antennenanordnung zusammenzuschalten und mit einer Ansteuerschaltung zu verbinden. Somit werden mehrere derart zusammengeschaltete Antennen, welche auch als Cluster bezeichnet werden, von einer gemeinsamen Ansteuerschaltung angesteuert.Another possibility is to interconnect a plurality of antennas of one or more planes of the antenna arrangement and to connect them to a drive circuit. Thus, a plurality of interconnected antennas, which are also referred to as clusters, are driven by a common drive circuit.
Durch die Zusammenschaltung mehrerer einzelner Antennen der Antennenanordnung kann die Anzahl der benötigten Verstärker reduziert und somit der Energiebedarf des Systems verringert werden.Through the interconnection of several individual antennas of Antenna arrangement can reduce the number of required amplifiers and thus reduce the energy requirements of the system.
Diese Zusammenschaltung mehrerer Antennen kann statisch erfolgen. Hierbei werden beispielsweise einmalig festgelegte Verbindungen, welche geschaltet werden sollen, zwischen der Ansteuerschaltung und den Antennen hergestellt. Dadurch wird die Antennenanordnung oder ein Teil der Antennenanordnung (Cluster) zu einer festgelegten Zeit aktiv.This interconnection of several antennas can be static. In this case, for example, once established connections, which are to be switched, produced between the drive circuit and the antennas. As a result, the antenna arrangement or part of the antenna arrangement (cluster) becomes active at a specified time.
Es ist aber auch eine vollständig dynamische Arbeitsweise möglich, derart dass die elektrischen Amplituden und Phasen aller Antennen und/oder Cluster zeitgleich und unabhängig voneinander mittels einer entsprechenden Ansteuereinheit gesteuert werden.But it is also a completely dynamic operation possible, so that the electrical amplitudes and phases of all antennas and / or clusters are controlled simultaneously and independently of each other by means of a corresponding drive unit.
Die Erfindung soll nachfolgend anhand eines Ausführungsbeispiels näher erläutert werden. In den zugehörigen Zeichnungen zeigt
- Fig. 1
- eine Ansicht einer erfindungsgemäßen Antennenanordnung mit zwei übereinander angeordneten Antennenteilanordnungen,
- Fig. 2
- eine Ansicht der ersten Antennenteilanordnung von oben,
- Fig. 3
- eine Ansicht der zweiten Antennenteilanordnung,
- Fig. 4
- eine Darstellung einer Antennenanordnung, bestehend aus 6x6 Antennenelementen, Teilantennen oder Einzelantennenelemente, wobei hier cavity backed dipole antennas verwendet werden,
- Fig. 5
- eine Ausschnittsvergrößerung eines 6x6 Arrays aus der
Figur 4 mit darunter angeordneten Vivaldi-Antennen, dreilagig ausgeführt, - Fig. 6
- eine Richtcharakteristik des Arrays aus
Figur 4 , alle Elemente sind dabei gleichphasig und mit gleicher Amplitude gespeist und - Fig. 7
- eine Richtcharakteristik des Arrays aus
Figur 4 , hierbei wurden die Phasen der Einzelelemente so eingestellt, dass die Strahlschwenkung erreicht wird.
- Fig. 1
- a view of an antenna arrangement according to the invention with two superposed antenna sub-assemblies,
- Fig. 2
- a view of the first antenna sub-assembly from above,
- Fig. 3
- a view of the second antenna sub-assembly,
- Fig. 4
- a representation of an antenna arrangement, consisting of 6x6 antenna elements, sub-antennas or individual antenna elements, in which case cavity-backed dipole antennas are used,
- Fig. 5
- an enlarged detail of a 6x6 array from the
FIG. 4 with underneath arranged Vivaldi antennas, three-layered, - Fig. 6
- a directional characteristic of the array
FIG. 4 , all elements are in-phase and fed with the same amplitude and - Fig. 7
- a directional characteristic of the array
FIG. 4 , In this case, the phases of the individual elements were adjusted so that the beam tilting is achieved.
Unter der ersten Antennenteilanordnung 2 ist die zweite Antennenteilanordnung 3 dargestellt. Die Antennenteilanordnung 2 umfasst zwei Ebenen, in denen jeweils mehrere Vivaldi-Antennen pro Ebene in unterschiedlichen Richtungen ausgerichtet angeordnet sind.Under the
Die Ausrichtung der Vivaldi-Antennen zwischen den beiden benachbarten Ebenen ist deckungsgleich. Es ist jedoch auch denkbar, die zweite Antennenteilanordnung 3 nur aus einer Ebene oder aus drei Ebenen bestehend auszuführen, wobei die Ausrichtung der Vivaldi-Antennen von Ebene zu Ebene verschieden ist. Weiterhin ist es möglich, in einer Ebene sowohl Vivaldi-Antennen als auch Mikrostreifen-Patchantennen anzuordnen.The alignment of the Vivaldi antennas between the two adjacent planes is congruent. However, it is also conceivable to carry out the
In der
Die
Die
Die
In der
Die Erfindung stellt eine Antennenanordnung 1 bereit, welche direkt im Gehäuse eines Chips 4, vorzugsweise in einem dem Chip deckelartig abdeckenden Gehäuseteil angeordnet ist.The invention provides an antenna arrangement 1 which is arranged directly in the housing of a chip 4, preferably in a housing part which covers the cover like a cover.
Derartige Chips können beispielsweise Halbleiterchips für Anwendungen im Millimeterwellbereich sein. Dabei ist es für die Antennen der Antennenanordnung 1 unerheblich, welche Signalinformationen mit ihr abgestrahlt oder empfangen werden.Such chips may, for example, be semiconductor chips for applications in the millimeter wave range. It is irrelevant for the antennas of the antenna assembly 1, which signal information is emitted or received with her.
Ist die Antennenanordnung 1 ein Teil des Chipgehäuses, werden keine Verbindungen zwischen den Anschlüssen des Halbleiterchips (Pins) und einer separaten, außerhalb des Chips angeordneten Antenne notwendig, was zu einer Vereinfachung des Chipdesigns und zu einer Reduzierung der Kosten führt. Weiterhin treten keine elektrischen Verluste durch die oben aufgeführten Verbindungen auf. Somit wird eine Reduzierung der Verlustleistung erreicht. Darüber hinaus verringert sich die Zahl notwendinger Verbindungsleitungen auf der den Chip tragenden Platine, was zu einer Reduzierung des notwendigen Platzbedarfs und der Kosten führt.When the antenna assembly 1 is a part of the chip package, no connections between the terminals of the semiconductor chip (pins) and a separate off-chip antenna become necessary, resulting in simplification of chip design and cost reduction. Furthermore, no electrical losses occur through the compounds listed above. Thus, will achieved a reduction in power dissipation. In addition, the number of connecting lines required on the board carrying the chip is reduced, resulting in a reduction in the space required and the cost.
Die erfindungsgemäße Antennenanordnung 1 kann aber auch direkt auf den Chip, beispielsweise nur durch eine Isolationsschicht von diesem getrennt, aufgebracht werden und bildet somit keinen Bestandteil des Chipgehäuses.However, the antenna arrangement 1 according to the invention can also be applied directly to the chip, for example separated from it only by an insulating layer, and thus does not form part of the chip housing.
Eine weitere Möglichkeit der Platzierung der Antennenanordnung 1 ist die Anordnung direkt auf dem Halbleiterchip als eine Teilbaugruppe des Chips selbst oder die Platzierung in einer den Halbleiterchip seitlich abdeckenden Chipgehäusewand.Another possibility of placing the antenna arrangement 1 is the arrangement directly on the semiconductor chip as a subassembly of the chip itself or the placement in a chip housing wall laterally covering the semiconductor chip.
Derartige Antennenanordnungen 1 können beispielsweise zur Übertragung von großen Datenmengen zwischen PC, Drucker, Maus, Tastatur, Bildschirm, TV-Gerät, Hi-Fi-Geräten, Beamer, mediznischen Analysegeräten u.a. eingesetzt werden. Dabei ist beispielsweise bei der Verwendung des 60 GHz Frequenzspektrums eine Datenübertragung bis zu einer Entfernung von etwa 10 Metern möglich.Such antenna arrangements 1 can, for example, for the transmission of large amounts of data between PC, printer, mouse, keyboard, screen, TV, hi-fi devices, projectors, medical analysis devices u.a. be used. For example, when using the 60 GHz frequency spectrum, data transmission up to a distance of about 10 meters is possible.
Weiter besondere Merkmale und Ausführungsformen sind nachfolgend aufgeführt:
Möglich sind Kombinationen zweier (oder mehrerer) unterschiedlicher Antennenanordnungen, z.B. planare, geschichtete Systeme. Dadurch wird eine Vergrößerung des ausgeleuchteten Raumes (Erhöhung der Abdeckung) sowie eine kompakte Bauform der Antennenanordnung erreicht.Further special features and embodiments are listed below:
Combinations of two (or more) different antenna arrangements are possible, eg planar, layered systems. As a result, an enlargement of the illuminated space (increase of the cover) as well as a compact design of the antenna arrangement is achieved.
Integration der Antennenanordnung im Chipgehäuse oder eine Implementierung der Erfindung auf dem Chip selbst sind möglich.Integration of the antenna arrangement in the chip housing or an implementation of the invention on the chip itself are possible.
Verwendung einer oder mehrerer mehrlagiger Antennenanordnungen sind möglich, wobei die Anzahl der Lagen ≥ 1 ist.Use of one or more multilayer antenna arrangements is possible, the number of layers being ≥ 1.
Das Speisenetzwerk zur Ansteuerung der Einzelantennen befindet sich im Gehäuse selbst. Dieses kann dabei ebenfalls mehrlagig ausgeführt sein. Mögliche Leitungsstrukturen sind CPS, CPW, (gekoppelte) Mikrostreifen, Schlitzleitung oder Streifenleitung. Die Überkopplung von der Zuleitung auf die strahlenden Aperturen kann unterschiedlich erfolgen, z.B. galvanisch, kapazitiv oder induktiv gekoppelt.The feed network for controlling the individual antennas is located in the housing itself. This can also be designed in several layers. Possible line structures are CPS, CPW, (coupled) microstrip, slotline or stripline. The coupling from the lead to the radiating apertures can be done differently, e.g. galvanically, capacitively or inductively coupled.
Vorgesehen sind galvanische, kapazitive oder induktive Verbindungen zwischen Gehäuse und dem Chip.Provided galvanic, capacitive or inductive connections between the housing and the chip.
Bei der Ansteuerung der Einzelantennen der Antennenanordnung 1 sind nachfolgende Ausführungen vorgesehen:
- ∘ Fest verdrahtet, d.h. es ist keine Strahlschwenkung möglich.
- ∘ Komplett unabhängig, d.h. die elektrischen Phasen und Amplituden jedes Antennenelements aller Antennensysteme sind frei und unabhängig voneinander einstellbar.
- ∘ Eine Kombination der zuvor genannten Möglichkeiten, d.h. es werden kleinere Gruppen (Cluster), bestehend aus fest verdrahteten Antennenelementen eines oder mehrerer Antennensysteme gebildet, wobei die elektrischen Phasen und Amplituden der einzelnen Gruppen unabhängig voneinander einstellbar sind.
- ∘ Einzelne Antennenelemente oder Cluster sind zu-/abschaltbar bzw. Aktivierung beliebig kombinierbar um eine diskretisierte Strahlschwenkung zu erreichen.
- ∘ Leistung der einzelnen Leistungsverstärker lässt sich wahlweise auf die Antennenelemente bzw. Cluster aufteilen und kombinieren. Gleiches gilt auch für die Empfangsverstärker.
- ∘ Bei der Strahlformung und Strahlschwenkung kann es sich um eine reine Steuerung oder auch um eine Regelung handeln, die adaptiv ausgeführt werden kann.
- ∘ Hardwired, ie no beam swing is possible.
- ∘ Completely independent, ie the electrical phases and amplitudes of each antenna element of all antenna systems are freely and independently adjustable.
- ∘ A combination of the abovementioned possibilities, ie smaller groups (clusters) consisting of hard-wired antenna elements of one or more antenna systems are formed, wherein the electrical phases and amplitudes of the individual groups can be set independently of one another.
- ∘ Individual antenna elements or clusters can be switched on / off or activation can be combined as required to achieve a discretized beam swing.
- ∘ Power of each power amplifier can be optionally split on the antenna elements or clusters and combine. The same applies to the receiver amplifiers.
- ∘ Beam shaping and beam tilting can be pure control or regulation that can be adaptive.
Es können die nachfolgend aufgeführten Antennentypen zum Einsatz kommen:
- ∘ Bei einer Antennenanordnung nach
Figur 1 :- ▪ Patchantennen
- ▪ Dielektrische Resonatorantennen
- ▪ Schleifenantennen, Rhombische Antennen
- ▪ "Gedruckte" Dipole, Yagi-Antennen
- ▪ Cavity-Backed Strukturen
- ▪ als Hornantennen angedeutete Vias in der obersten Substratschicht mit Speiselementen (Vgl.
US 7444734 B2
- ∘ Bei einer Antennenanordnung nach
Figur 3 :- ▪ aufgeweitete Schlitzantennen (mögliche Formen der Aufweitung: stufenweise, linear, exponentiell (Vivaldi-Antenne), etc.)
- ▪ Dipole
- ▪ Yagi-Antennen
- ▪ seitlich montierte Patchantennen
- ▪ neben dem Gehäuse montierte/an das Gehäuse geklebte (oder anders befestigt) dielektrische Resonatorantennen
- ∘ Sinnvolle Kombinationen von mehrlagigen Teilantennensystemen können erfindungsgemäß bestehen aus:
- ▪ Patchantennen (oben) mit Vivaldis (mehrlagig)
- ▪ Patchantennen (oben) mit einer Reihe Patchantennen seitlich
- ▪ Schleifenantennen (oben) mit Vivaldis (mehrlagig)
- ∘ In an antenna arrangement according to
FIG. 1 :- ▪ patch antennas
- ▪ Dielectric resonator antennas
- ▪ Loop antennas, rhombic antennas
- ▪ "Printed" dipoles, Yagi antennas
- ▪ Cavity-backed structures
- ▪ Vias in the uppermost substrate layer with feeding elements, indicated as horn antennas (cf.
US 7444734 B2
- ∘ In an antenna arrangement according to
FIG. 3 :- ▪ widened slot antennas (possible forms of widening: stepwise, linear, exponential (Vivaldi antenna), etc.)
- ▪ Dipoles
- ▪ Yagi antennas
- ▪ side mounted patch antennas
- ▪ dielectric mounted next to the enclosure / glued (or otherwise attached) to the enclosure resonator antennas
- ∘ Meaningful combinations of multi-layer subantenna systems can consist according to the invention of:
- ▪ Patch antennas (top) with Vivaldis (multi-layered)
- ▪ Patch antennas (top) with a row of patch antennas on the side
- ▪ Loop antennas (top) with Vivaldis (multilayer)
Die Anwendungen einer derartigen Antennenanordnung kann beispielsweise im Bereich der Kommunikation (hohe Datenraten, kurze Kontaktzeiten), der Sensor-Technik (hohe Auflösung), der Medizin (z.B. abbildende Systeme), des Radars, der Mustererkennung sowie in der industriellen Fertigung erfolgen.The applications of such an antenna arrangement can take place, for example, in the field of communication (high data rates, short contact times), sensor technology (high resolution), medicine (eg imaging systems), radar, pattern recognition and industrial manufacturing.
- 11
- Antennenanordnungantenna array
- 22
- erste Antennenteilanordnungfirst antenna subassembly
- 33
- zweite Antennenteilanordnungsecond antenna subassembly
- 44
- Chipgehäuses (Teil des Deckels)Chip housing (part of the lid)
Claims (9)
- Antenna arrangement (1) for transmitting signals, consisting of a plurality of antennas arranged in a plane at a distance from a chip surface, wherein the antenna arrangement has a plurality of planes, wherein a plurality of individual antennas are arranged in each plane, characterized in that the orientation of the antennas between two adjacent planes is different
wherein the antenna arrangement consists of a first antenna subarrangement (2) and a second antenna subarrangement (3),
wherein the first antenna subarrangement is arranged above the second antenna subarrangement ,
wherein the first antenna subarrangement consists of patch antennas and the second antenna subarrangement consists of multilayered Vivaldi antennas or
the first antenna subarrangement consists of patch antennas and the second antenna subarrangement consists of a series of lateral patch antennas or the first antenna subarrangement consists of loop antennas and the second antenna subarrangement consists of multilayered Vivaldi antennas or
the first antenna subarrangement consists of cavity-backed structures and the second antenna subarrangement consists of multilayered Vivaldi antennas. - Antenna arrangement according to Claim 1, characterized in that the orientation of the antennas in a plane is the same.
- Antenna arrangement according to Claim 1, characterized in that the orientation of the antennas in a plane is different.
- Antenna arrangement according to any of Claims 1 to 3, characterized in that the antennas of two adjacent planes are arranged congruently or in an offset manner with respect to one another.
- Antenna arrangement according to any of Claims 1 to 4, characterized in that the planes have a circular or n-gonal basic area where n ≥ 3.
- Antenna arrangement according to any of Claims 1 to 5, characterized in that the planes are arranged one above another to form a parallelepipedal or a truncated pyramid structure.
- Antenna arrangement according to any of Claims 1 to 6, characterized in that the coupling of the antenna arrangement to the chip is effected by means of contacts, inductively or capacitively.
- Antenna arrangement according to any of Claims 1 to 7, characterized in that the antenna arrangement is arranged indirectly on the chip or in a housing part covering the chip like a cover.
- Antenna arrangement according to any of Claims 1 to 8, characterized in that each antenna is connected to a separate drive unit, or in that a plurality of antennas are connected to a common drive unit.
Applications Claiming Priority (2)
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DE102009051143 | 2009-10-29 | ||
PCT/EP2010/066485 WO2011051456A1 (en) | 2009-10-29 | 2010-10-29 | Antenna arrangement for transmitting signals |
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EP2494655B1 true EP2494655B1 (en) | 2018-07-18 |
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EP10779263.2A Active EP2494655B1 (en) | 2009-10-29 | 2010-10-29 | Antenna arrangement for signal transmission |
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US (1) | US9059503B2 (en) |
EP (1) | EP2494655B1 (en) |
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US9401745B1 (en) * | 2009-12-11 | 2016-07-26 | Micron Technology, Inc. | Wireless communication link using near field coupling |
JP6067742B2 (en) * | 2011-12-13 | 2017-01-25 | メリディアン・メディカル・システムズ,エルエルシー | Low profile temperature transducer |
EP2840650B1 (en) * | 2013-08-24 | 2018-12-26 | HENSOLDT Sensors GmbH | Three-dimensional antenna array |
JP6706722B2 (en) * | 2016-10-09 | 2020-06-10 | 華為技術有限公司Huawei Technologies Co.,Ltd. | Horn antenna |
USD863268S1 (en) | 2018-05-04 | 2019-10-15 | Scott R. Archer | Yagi-uda antenna with triangle loop |
USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
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JP3141692B2 (en) * | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | Millimeter wave detector |
US6373447B1 (en) * | 1998-12-28 | 2002-04-16 | Kawasaki Steel Corporation | On-chip antenna, and systems utilizing same |
US7163155B2 (en) | 2003-11-05 | 2007-01-16 | Interdigital Technology Corporation | ASIC-embedded switchable antenna arrays |
US7444734B2 (en) | 2003-12-09 | 2008-11-04 | International Business Machines Corporation | Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate |
TWI278084B (en) | 2004-10-19 | 2007-04-01 | Advanced Semiconductor Eng | Chip scale package with micro antenna and method for manufacturing the same |
US7834808B2 (en) | 2005-06-29 | 2010-11-16 | Georgia Tech Research Corporation | Multilayer electronic component systems and methods of manufacture |
US7615863B2 (en) | 2006-06-19 | 2009-11-10 | Northrop Grumman Space & Missions Systems Corp. | Multi-dimensional wafer-level integrated antenna sensor micro packaging |
US7768457B2 (en) | 2007-06-22 | 2010-08-03 | Vubiq, Inc. | Integrated antenna and chip package and method of manufacturing thereof |
US7880677B2 (en) | 2007-12-12 | 2011-02-01 | Broadcom Corporation | Method and system for a phased array antenna embedded in an integrated circuit package |
US7696930B2 (en) * | 2008-04-14 | 2010-04-13 | International Business Machines Corporation | Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities |
US20130050016A1 (en) * | 2011-08-26 | 2013-02-28 | Electronics And Telecommunications Research Institute | Radar package for millimeter waves |
US9196951B2 (en) * | 2012-11-26 | 2015-11-24 | International Business Machines Corporation | Millimeter-wave radio frequency integrated circuit packages with integrated antennas |
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