EP2494655B1 - Antenna arrangement for signal transmission - Google Patents

Antenna arrangement for signal transmission Download PDF

Info

Publication number
EP2494655B1
EP2494655B1 EP10779263.2A EP10779263A EP2494655B1 EP 2494655 B1 EP2494655 B1 EP 2494655B1 EP 10779263 A EP10779263 A EP 10779263A EP 2494655 B1 EP2494655 B1 EP 2494655B1
Authority
EP
European Patent Office
Prior art keywords
antenna
antennas
antenna arrangement
subarrangement
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10779263.2A
Other languages
German (de)
French (fr)
Other versions
EP2494655A1 (en
Inventor
Dirk Plettemeier
Michael Jenning
Ting-Jung Liang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technische Universitaet Dresden
Original Assignee
Technische Universitaet Dresden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universitaet Dresden filed Critical Technische Universitaet Dresden
Publication of EP2494655A1 publication Critical patent/EP2494655A1/en
Application granted granted Critical
Publication of EP2494655B1 publication Critical patent/EP2494655B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an antenna arrangement for transmitting signals, consisting of a plurality of antennas, which are arranged in a plane spaced from a chip surface.
  • antennas For the emission and reception of electromagnetic waves, for example in the field of wireless communication, antennas are needed.
  • This technical arrangement converts as a transmitter-side arranged antenna conducted electromagnetic waves in so-called free space waves, which propagate as electromagnetic waves from the antenna into the room.
  • the antenna converts the electromagnetic waves arriving as free-space wave back into conducted electromagnetic waves, the antenna is thus a converter between conduction and free-space waves and vice versa.
  • Essential for this is the adaptation of the characteristic impedance of the line to the characteristic impedance of the free space.
  • the first antenna is used as the transmitting antenna and the second antenna as the receiving antenna or that the first and the second antenna are connected in series as a two-part overall antenna.
  • the invention is therefore based on the object of specifying an antenna arrangement for transmitting signals, which has an improved directional characteristic and a higher antenna gain, is easy to manufacture, robust and inexpensive.
  • the object is achieved with an antenna arrangement for transmitting signals of the type mentioned above in that the orientation of the antennas between two adjacent planes is different, wherein the antenna arrangement consists of a first antenna sub-assembly and a second antenna sub-assembly, wherein the first antenna sub-assembly via the second antenna subassembly is arranged, wherein the first antenna subassembly of patch antennas and the second antenna subassembly consists of multi-layer Vivaldi antennas or the first antenna subassembly of patch antennas and the second antenna subassembly of a series of lateral patch antennas or the first antenna subassembly of loop antennas and the second antenna subassembly of multilayer Vivaldi antennas or consists of the first antenna sub-array of cavity-backed structures and the second antenna sub-array of multi-layer Vivaldi antennas.
  • a plurality of antennas are arranged per level, wherein
  • the invention enables both a combination of identical and different antennas in an antenna system to improve the performance of the overall system.
  • the improvements include increasing the coverage of the illuminable space, whereby the individual antenna systems generally do not adversely affect, as well as the reduction of energy consumption.
  • the orientation of the antennas in a plane is the same.
  • the orientation of the antennas in a plane is different.
  • the individual antennas arranged in one plane of the antenna arrangement can be arranged in the same direction in the main direction of their emitted radiant intensity. In this way, a directional effect of the antenna arrangement in a preferred beam direction of the antennas can be achieved.
  • the individual antennas of a plane can be aligned unequal with respect to their main direction.
  • the directional characteristic of the antenna arrangement can be changed, for example, such that a preferred range or sector of the directivity or a nearly uniform directivity (spherical characteristic) results on all sides.
  • the orientation of the antennas between two adjacent planes is different.
  • the alignment of the individual antennas of one plane is the same or different from the alignment of the individual antennas of another plane.
  • the directivity of the entire antenna array in the direction of alignment of the individual antennas improves, while by means of a different alignment of the planes a preferred area or a more uniform all-round directivity can be achieved.
  • the antennas of two adjacent planes coincide or offset from one another.
  • the planes can be arranged in multiple layers one above the other. In this case, it is possible to arrange the individual planes flush or staggered with respect to one another, wherein in turn the directional characteristic of the system can be influenced.
  • the planes have a circular or n-shaped base area with n ⁇ 3.
  • the planes are arranged forming a cuboid or a truncated pyramid structure one above the other.
  • the coupling of the antenna arrangement to the chip takes place by means of contacts, inductively or capacitively.
  • a signal transmission between the chip and the antenna can be effected for example by an electrically conductive connection in the form of contacts or wires.
  • Another form of connection is one capacitive or inductive coupling between antenna and chip.
  • the antenna arrangement is arranged indirectly on the chip or in a housing part which covers the chip like a cover.
  • the invention provides in a particular embodiment, a housing for a chip, which simultaneously includes an antenna arrangement according to the invention.
  • an antenna arrangement according to the invention.
  • Several possibilities of designing this antenna arrangement are conceivable, for example combinations of two or more similar or different types of antennas (for example microstrip patch antennas, Vivaldi antennas) in one or more planes.
  • An arrangement of a plurality of antennas in at least two different levels to an antenna system is also possible.
  • a goal is the enlargement of the so-called illuminated area or the directional characteristic of the antenna.
  • each individual antenna of the antenna arrangement can be connected to its own drive unit.
  • a single antenna becomes active at a fixed time, controlled by its associated drive unit.
  • Another possibility is to interconnect a plurality of antennas of one or more planes of the antenna arrangement and to connect them to a drive circuit.
  • a plurality of interconnected antennas which are also referred to as clusters, are driven by a common drive circuit.
  • This interconnection of several antennas can be static. In this case, for example, once established connections, which are to be switched, produced between the drive circuit and the antennas. As a result, the antenna arrangement or part of the antenna arrangement (cluster) becomes active at a specified time.
  • FIG. 1 shows an antenna arrangement 1 according to the invention, which is arranged for example in a cover of a chip-like covering housing part 4 of a chip package.
  • the chip housing 4 is only partially and only schematically shown.
  • FIG. 1 shows the antenna assembly 1 in an isometric view.
  • the antenna arrangement 1 consists of two antenna sub-assemblies 2 and 3.
  • the first antenna sub-assembly 2 comprises the uppermost level.
  • the top-level antennas are implemented as microstrip patch antennas and arranged in the same orientation.
  • the antenna sub-assembly 2 comprises two planes, in each of which a plurality of Vivaldi antennas are arranged aligned in different directions per plane.
  • the alignment of the Vivaldi antennas between the two adjacent planes is congruent.
  • the second antenna subassembly 3 consisting of only one plane or three planes, the alignment of the Vivaldi antennas from plane to plane is different.
  • FIG. 2 shows a view of the antenna assembly from the top of the chip housing 4, wherein a top level covering housing or protective layer is not shown.
  • the antenna arrangement is shown in a view from below.
  • the consisting of several Vivaldi antennas antenna sub-assembly 3 extends to the edge of the chip housing 4.
  • the alignment of the Vivaldi antennas was carried out in a plane of a coordinate system, not shown at an angle of 0, 90, 180 and 270 degrees.
  • FIG. 4 shows a representation of a 6x6 antenna array, for example, as a first antenna sub-assembly 2, in which so-called “cavity-backed dipole antennas" were used.
  • the orientation of all antennas of this antenna sub-assembly 2 is the same.
  • FIG. 5 shows an enlarged detail of the first, consisting of a plane, antenna sub-assembly 2 of the FIG. 4 , Under the first antenna sub-assembly 2, a three-level second antenna sub-assembly 3 is arranged. In this Vivaldi antennas are aligned and arranged congruently one above the other.
  • FIG. 6 shows a three-dimensional graphical representation of the radiation characteristic (or directional characteristic) of the antenna arrangement 1 according to the invention from the FIG. 4 ,
  • the representation is only a schematic representation of different clubs in a spatial coordinate system. On a representation of the field strength was waived. Shown is the case of an in-phase and with the same amplitude fed from 36 subantenna antenna array. 1
  • FIG. 7 is a further three-dimensional schematic representation of a directional characteristic shown. This also refers to those in the FIG. 4 illustrated antenna arrangement 1.
  • the phases of the 36 individual antennas of the antenna assembly 1 were set such that the illustrated beam swing is achieved.
  • the maximum achievable beam swing is shown with such an arrangement.
  • Another beam swing is by means of a in the FIG. 5 illustrated antenna arrangement 1 possible.
  • this two antenna antennas consisting of various antennas arrangements 2 and 3 are shown. Due to the different antenna types and a different orientation of the antennas in a plane or between the planes, a targeted influencing of the beam shaping and the alignment is achieved.
  • the invention provides an antenna arrangement 1 which is arranged directly in the housing of a chip 4, preferably in a housing part which covers the cover like a cover.
  • Such chips may, for example, be semiconductor chips for applications in the millimeter wave range. It is irrelevant for the antennas of the antenna assembly 1, which signal information is emitted or received with her.
  • the antenna assembly 1 When the antenna assembly 1 is a part of the chip package, no connections between the terminals of the semiconductor chip (pins) and a separate off-chip antenna become necessary, resulting in simplification of chip design and cost reduction. Furthermore, no electrical losses occur through the compounds listed above. Thus, will achieved a reduction in power dissipation. In addition, the number of connecting lines required on the board carrying the chip is reduced, resulting in a reduction in the space required and the cost.
  • the antenna arrangement 1 according to the invention can also be applied directly to the chip, for example separated from it only by an insulating layer, and thus does not form part of the chip housing.
  • antenna arrangement 1 Another possibility of placing the antenna arrangement 1 is the arrangement directly on the semiconductor chip as a subassembly of the chip itself or the placement in a chip housing wall laterally covering the semiconductor chip.
  • Such antenna arrangements 1 can, for example, for the transmission of large amounts of data between PC, printer, mouse, keyboard, screen, TV, hi-fi devices, projectors, medical analysis devices u.a. be used. For example, when using the 60 GHz frequency spectrum, data transmission up to a distance of about 10 meters is possible.
  • the feed network for controlling the individual antennas is located in the housing itself. This can also be designed in several layers. Possible line structures are CPS, CPW, (coupled) microstrip, slotline or stripline. The coupling from the lead to the radiating apertures can be done differently, e.g. galvanically, capacitively or inductively coupled.
  • the applications of such an antenna arrangement can take place, for example, in the field of communication (high data rates, short contact times), sensor technology (high resolution), medicine (eg imaging systems), radar, pattern recognition and industrial manufacturing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)

Description

Die Erfindung betrifft eine Antennenanordnung zur Übertragung von Signalen, bestehend aus mehreren Antennen, welche in einer Ebene zu einer Chipoberfläche beabstandet angeordnet sind.The invention relates to an antenna arrangement for transmitting signals, consisting of a plurality of antennas, which are arranged in a plane spaced from a chip surface.

Zur Abstrahlung und zum Empfang elektromagnetischer Wellen, beispielsweise im Bereich der drahtlosen Kommunikation, werden Antennen benötigt. Diese technische Anordnung wandelt als eine senderseitig angeordnete Antenne leitungsgebundene elektromagnetische Wellen in sogenannte Freiraumwellen um, welche sich als elektromagnetische Wellen von der Antenne in den Raum ausbreiten.For the emission and reception of electromagnetic waves, for example in the field of wireless communication, antennas are needed. This technical arrangement converts as a transmitter-side arranged antenna conducted electromagnetic waves in so-called free space waves, which propagate as electromagnetic waves from the antenna into the room.

Empfängerseitig wandelt die Antenne die als Freiraumwelle ankommenden elektromagnetischen Wellen zurück in leitungsgebundene elektromagnetische Wellen, die Antenne ist somit ein Wandler zwischen Leitungs- und Freiraumwellen sowie umgekehrt. Wesentlich dafür ist die Anpassung des Wellenwiderstandes der Leitung an den Wellenwiderstand des freien Raumes.On the receiver side, the antenna converts the electromagnetic waves arriving as free-space wave back into conducted electromagnetic waves, the antenna is thus a converter between conduction and free-space waves and vice versa. Essential for this is the adaptation of the characteristic impedance of the line to the characteristic impedance of the free space.

In modernen Geräten im Bereich der Kommunikationstechnik besteht die Notwendigkeit, Antennen mit kleinen oder kleinsten Abmessungen mit den für die Signalverarbeitung vorgesehenen Halbleiterchips oder Bestandteilen des Halbleiterchips zu verbinden, um deren Funktionalitäten zu gewährleisten.In modern devices in the field of communication technology, there is the need to connect antennas with small or smallest dimensions with the intended for signal processing semiconductor chips or components of the semiconductor chip in order to ensure their functionality.

Aus der US 7,221,052 B2 ist eine mit einem Halbleiterchip verbundene Antenne bekannt, wobei die Antenne auf der Oberseite des Halbleiterchips ausgebildet ist.From the US 7,221,052 B2 an antenna connected to a semiconductor chip is known, wherein the antenna is formed on the upper side of the semiconductor chip.

Diese Lösung weist den Nachteil auf, dass sie ein Bestandteil des Chips selbst ist. Dadurch ist eine Nutzung mit unterschiedlichen Chips nur bedingt möglich, da der Entwurf der Antennenstruktur bereits beim Entwurf des Chips durchgeführt werden muss.This solution has the disadvantage of being a Part of the chip itself. As a result, use with different chips is only possible to a limited extent since the design of the antenna structure must already be carried out during the design of the chip.

Aus der US 2009/0207090 ist eine auf der Oberseite eines Halbleiterchips angeordnete, aus vier gleich aufgebauten Antennen bestehende Antennenanordnung bekannt. Diese Anordnung verbessert die Einsatzmöglichkeiten, da sie unabhängig vom Chip ist und somit für eine Vielzahl verschiedener Chips genutzt werden kann. Die Nachteile dieser Anordnung liegen darin, dass die Chips in der gleichen Lage wie die Antennenelemente liegen. Dies führt zu einer Vergrößerung der Fläche, die das gesamte Bauteil, bestehend aus Antenne, Chip und Gehäuse auf einer Platine benötigt. Ein weiterer Nachteil dieser Anordnung ist, dass sowohl die Chips die Strahlungscharakteristik der Antennen beeinflussen als auch die abgestrahlte Leistung Einfluss auf die Chips hat.From the US 2009/0207090 is an arranged on top of a semiconductor chip, consisting of four identically constructed antennas antenna arrangement known. This arrangement improves the possibilities of use, as it is independent of the chip and thus can be used for a variety of different chips. The disadvantages of this arrangement are that the chips are in the same position as the antenna elements. This leads to an increase in the area required by the entire component, consisting of antenna, chip and housing on a circuit board. A further disadvantage of this arrangement is that both the chips influence the radiation characteristic of the antennas and the radiated power has an influence on the chips.

Aus der US 6.373.447 B1 ist eine Antennenanordnung zur Übertragung von Signalen bekannt, welche mittels einer Strukturanordnung über einem Chip befestigt ist. Weiterhin ist aus dieser Druckschrift bekannt, zwei Antennen nebeneinander in der gleichen, von der Chipoberfläche beabstandeten Ebene anzuordnen.From the US 6,373,447 B1 An antenna arrangement for transmitting signals is known, which is fastened by means of a structural arrangement over a chip. Furthermore, it is known from this document to arrange two antennas side by side in the same, spaced from the chip surface level.

Offenbart ist hierbei, dass die erste Antenne als Sende- und die zweite Antenne als Empfangsantenne genutzt wird oder dass die erste und die zweite Antenne in Serie geschaltet als eine aus zwei Teilen bestehende Gesamtantenne betrieben wird. Der Erfindung liegt somit die Aufgabe zugrunde, eine Antennenanordnung zur Übertragung von Signalen anzugeben, welche eine verbesserte Richtcharakteristik sowie einen höheren Antennengewinn aufweist, einfach zu fertigen, robust und kostengünstig ist.It is disclosed here that the first antenna is used as the transmitting antenna and the second antenna as the receiving antenna or that the first and the second antenna are connected in series as a two-part overall antenna. The invention is therefore based on the object of specifying an antenna arrangement for transmitting signals, which has an improved directional characteristic and a higher antenna gain, is easy to manufacture, robust and inexpensive.

Gemäß der Erfindung wird die Aufgabe mit einer Antennenanordnung zur Übertragung von Signalen der eingangs genannten Art dadurch gelöst, dass die Ausrichtung der Antennen zwischen zwei benachbarten Ebenen unterschiedlich ist, wobei die Antennenanordnung aus einer ersten Antennenteilanordnung und einer zweiten Antennenteilanordnung besteht, wobei die erste Antennenteilanordnung über der zweiten Antennenteilanordnung angeordnet ist, wobei die erste Antennenteilanordnung aus Patchantennen und die zweite Antennenteilanordnung aus mehrlagigen Vivaldi-Antennen besteht oder die erste Antennenteilanordnung aus Patchantennen und die zweite Antennenteilanordnung aus einer Reihe von seitlichen Patchantennen besteht oderdie erste Antennenteilanordnung aus Schleifenantennen und die zweite Antennenteilanordnung aus mehrlagigen Vivaldi-Antennen besteht oder die erste Antennenteilanordnung aus Cavity-Backed Strukturen und die zweite Antennenteilanordnung aus mehrlagigen Vivaldi-Antennen besteht. Gemäß der Erfindung werden mehrere Antennen pro Ebene angeordnet, wobei die Antennenanordnung mindesten zwei Ebenen umfasst. Durch eine derartige Anordnung der Antennen zu einer Antennenanordnung wird die Richtcharakteristik verbessert.According to the invention, the object is achieved with an antenna arrangement for transmitting signals of the type mentioned above in that the orientation of the antennas between two adjacent planes is different, wherein the antenna arrangement consists of a first antenna sub-assembly and a second antenna sub-assembly, wherein the first antenna sub-assembly via the second antenna subassembly is arranged, wherein the first antenna subassembly of patch antennas and the second antenna subassembly consists of multi-layer Vivaldi antennas or the first antenna subassembly of patch antennas and the second antenna subassembly of a series of lateral patch antennas or the first antenna subassembly of loop antennas and the second antenna subassembly of multilayer Vivaldi antennas or consists of the first antenna sub-array of cavity-backed structures and the second antenna sub-array of multi-layer Vivaldi antennas. According to the invention, a plurality of antennas are arranged per level, wherein the antenna arrangement comprises at least two levels. Such an arrangement of the antennas to form an antenna arrangement improves the directional characteristic.

Die Erfindung ermöglicht sowohl eine Kombination gleicher als auch unterschiedlicher Antennen in einem Antennensystem, um die Leistungsfähigkeit des Gesamtsystems zu verbessern. Die Verbesserungen umfassen dabei die Erhöhung der Abdeckung des ausleuchtbaren Raumes, wobei sich die Einzelantennensysteme im Allgemeinen nicht negativ beeinflussen, sowie die Verringerung des Energieverbrauchs.The invention enables both a combination of identical and different antennas in an antenna system to improve the performance of the overall system. The improvements include increasing the coverage of the illuminable space, whereby the individual antenna systems generally do not adversely affect, as well as the reduction of energy consumption.

Wesentliche Vorteile sind dabei die Erhöhung der Abdeckung, d.h. der Raum, welcher das Gesamtantennensystem in der Lage ist auszuleuchten (Abstrahlcharakteristik) und die kompakte und robuste Bauform.Significant advantages are the increase in coverage, ie the space which the overall antenna system is able to illuminate (radiation characteristic) and the compact and robust design.

In einer Ausgestaltung der Erfindung ist vorgesehen, dass die Ausrichtung der Antennen in einer Ebene gleich ist.In one embodiment of the invention it is provided that the orientation of the antennas in a plane is the same.

In einer Ausführung der Erfindung ist vorgesehen, dass die Ausrichtung der Antennen in einer Ebene unterschiedlich ist.In an embodiment of the invention it is provided that the orientation of the antennas in a plane is different.

Die in einer Ebene der Antennenanordnung angeordneten Einzelantennen können in der Hauptrichtung ihrer abgegebenen Strahlstärke gleich ausgerichtet angeordnet werden. Derart kann eine Richtwirkung der Antennenanordnung in eine bevorzugte Strahlrichtung der Antennen erreicht werden.The individual antennas arranged in one plane of the antenna arrangement can be arranged in the same direction in the main direction of their emitted radiant intensity. In this way, a directional effect of the antenna arrangement in a preferred beam direction of the antennas can be achieved.

In einer anderen Ausführung können die Einzelantennen einer Ebene bezogen auf ihre Hauptrichtung ungleich ausgerichtet werden. Mittels verschiedener Hautrichtungen kann die Richtcharakteristik der Antennenanordnung beispielsweise derart verändert werden, dass sich ein bevorzugter Bereich oder Sektor der Richtwirkung oder eine nahezu gleichmäßige Richtwirkung (Kugelcharakteristik) nach allen Seiten ergibt.In another embodiment, the individual antennas of a plane can be aligned unequal with respect to their main direction. By means of different skin directions, the directional characteristic of the antenna arrangement can be changed, for example, such that a preferred range or sector of the directivity or a nearly uniform directivity (spherical characteristic) results on all sides.

In einer weiteren Ausgestaltung der Erfindung ist vorgesehen, dass die Ausrichtung der Antennen zwischen zwei benachbarten Ebenen unterschiedlich ist.In a further embodiment of the invention, it is provided that the orientation of the antennas between two adjacent planes is different.

Erfindungsgemäß ist es möglich, die Ausrichtung der Einzelantennen einer Ebene gleich oder verschiedenartig zur Ausrichtung der Einzelantennen einer anderen Ebene zu gestalten. Bei einer gleichen Ausrichtung zwischen zwei Ebenen verbessert sich wiederum die Richtwirkung der gesamten Antennenanordnung in der Richtung der Ausrichtung der Einzelantennen während mittels einer verschiedenartigen Ausrichtung der Ebenen ein bevorzugter Bereich oder eine gleichmäßigere allseitige Richtwirkung erreichen lässt.According to the invention, it is possible to make the alignment of the individual antennas of one plane the same or different from the alignment of the individual antennas of another plane. In the same orientation between two planes, in turn, the directivity of the entire antenna array in the direction of alignment of the individual antennas improves, while by means of a different alignment of the planes a preferred area or a more uniform all-round directivity can be achieved.

In einer besonderen Ausführung der Erfindung ist vorgesehen, dass die Antennen zweier benachbarter Ebenen deckungsgleich oder versetzt zueinander angeordnet sind.In a particular embodiment of the invention, it is provided that the antennas of two adjacent planes coincide or offset from one another.

Wenn mehrere Ebenen der Antennenanordnung eine planare Struktur aufweisen, so können die Ebenen mehrlagig übereinander angeordnet werden. Dabei ist es möglich, die einzelnen Ebenen bündig oder versetzt zueinander anzuordnen, wobei wiederum die Richtcharakteristik des Systems beeinflusst werden kann.If a plurality of planes of the antenna arrangement have a planar structure, the planes can be arranged in multiple layers one above the other. In this case, it is possible to arrange the individual planes flush or staggered with respect to one another, wherein in turn the directional characteristic of the system can be influenced.

In einer Ausführung der Erfindung ist vorgesehen, dass die Ebenen eine kreisförmige oder n-eckige Grundfläche mit n ≥ 3 aufweisen.In one embodiment of the invention, it is provided that the planes have a circular or n-shaped base area with n ≥ 3.

Es ist möglich, die Grundfläche einer oder mehrerer Ebenen zu variieren, so kann diese beispielsweise als Dreieck, Viereck oder Achteck ausgeführt werden.It is possible to vary the footprint of one or more planes, such as triangles, squares or octagons.

In einer weiteren Ausführung der Erfindung ist vorgesehen, dass die Ebenen eine Quader- oder eine Pyramidenstumpfstruktur bildend übereinander angeordnet sind.In a further embodiment of the invention, it is provided that the planes are arranged forming a cuboid or a truncated pyramid structure one above the other.

Bei einer rechteckigen Grundfläche einer Ebene der Antennenanordnung entsteht, bei einer Anordnung der Ebenen aufeinander oder übereinander, entweder eine Quaderstruktur oder für den Fall, dass die Abmessungen der übereinander angeordneten Ebenen immer kleiner werden, eine Pyramidenstumpfstruktur.With a rectangular base of a plane of the antenna arrangement, when the planes are arranged on one another or one above the other, either a cuboid structure or, in the case of the dimensions of the planes arranged one above another, smaller and smaller, a truncated pyramid structure is created.

In einer speziellen Ausführung der Erfindung ist vorgesehen, dass die Ankopplung der Antennenanordnung an den Chip mittels Kontakten, induktiv oder kapazitiv erfolgt.In a special embodiment of the invention, it is provided that the coupling of the antenna arrangement to the chip takes place by means of contacts, inductively or capacitively.

Zur Übertragung von Signalen zwischen den Einzelantennen oder der Antennenanordnung und dem Chip müssen beide miteinander verbunden sein. Eine Signalübertragung zwischen Chip und Antenne kann beispielsweise durch eine elektrisch leitende Verbindung in Form von Kontakten oder Drähten erfolgen. Eine andere Form der Verbindung ist eine kapazitive oder eine induktive Kopplung zwischen Antenne und Chip.To transmit signals between the individual antennas or the antenna array and the chip both must be connected together. A signal transmission between the chip and the antenna can be effected for example by an electrically conductive connection in the form of contacts or wires. Another form of connection is one capacitive or inductive coupling between antenna and chip.

In einer speziellen Ausführungsform der Erfindung ist vorgesehen, dass die Antennenanordnung mittelbar auf dem Chip oder in einem den Chip deckelartig abdeckenden Gehäuseteil angeordnet ist.In a specific embodiment of the invention, it is provided that the antenna arrangement is arranged indirectly on the chip or in a housing part which covers the chip like a cover.

Die Erfindung stellt in einer besonderen Ausführung ein Gehäuse für einen Chip zur Verfügung, welches gleichzeitig eine erfindungsgemäße Antennenanordnung beinhaltet. Dabei sind mehrere Möglichkeiten der Ausgestaltung dieser Antennenanordnung denkbar, beispielsweise Kombinationen zweier oder mehrerer gleichartiger oder verschiedenartiger Antennen (beispielsweise Mikrostreifen-Patchantennen, Vivaldi-Antennen) in einer oder mehreren Ebenen. Auch eine Anordnung jeweils mehrerer Antennen in mindestens zwei verschiedenen Ebenen zu einem Antennensystem ist möglich. Bei der Kombination verschiedener Antennen zu einer derartigen Antennenanordnung ist ein Ziel die Vergrößerung des sogenannten ausgeleuchteten Bereichs oder der Richtcharakteristik der Antenne.The invention provides in a particular embodiment, a housing for a chip, which simultaneously includes an antenna arrangement according to the invention. Several possibilities of designing this antenna arrangement are conceivable, for example combinations of two or more similar or different types of antennas (for example microstrip patch antennas, Vivaldi antennas) in one or more planes. An arrangement of a plurality of antennas in at least two different levels to an antenna system is also possible. In the combination of different antennas to such an antenna arrangement, a goal is the enlargement of the so-called illuminated area or the directional characteristic of the antenna.

Gemäß der Erfindung kann jede einzelne Antenne der Antennenanordnung mit einer eigenen Ansteuereinheit verbunden sein. Hier wird eine einzelne Antenne zu einer festgelegten Zeit, gesteuert durch ihre zugeordnete Ansteuereinheit, aktiv.According to the invention, each individual antenna of the antenna arrangement can be connected to its own drive unit. Here a single antenna becomes active at a fixed time, controlled by its associated drive unit.

Eine andere Möglichkeit besteht darin, mehrere Antennen einer oder mehrerer Ebenen der Antennenanordnung zusammenzuschalten und mit einer Ansteuerschaltung zu verbinden. Somit werden mehrere derart zusammengeschaltete Antennen, welche auch als Cluster bezeichnet werden, von einer gemeinsamen Ansteuerschaltung angesteuert.Another possibility is to interconnect a plurality of antennas of one or more planes of the antenna arrangement and to connect them to a drive circuit. Thus, a plurality of interconnected antennas, which are also referred to as clusters, are driven by a common drive circuit.

Durch die Zusammenschaltung mehrerer einzelner Antennen der Antennenanordnung kann die Anzahl der benötigten Verstärker reduziert und somit der Energiebedarf des Systems verringert werden.Through the interconnection of several individual antennas of Antenna arrangement can reduce the number of required amplifiers and thus reduce the energy requirements of the system.

Diese Zusammenschaltung mehrerer Antennen kann statisch erfolgen. Hierbei werden beispielsweise einmalig festgelegte Verbindungen, welche geschaltet werden sollen, zwischen der Ansteuerschaltung und den Antennen hergestellt. Dadurch wird die Antennenanordnung oder ein Teil der Antennenanordnung (Cluster) zu einer festgelegten Zeit aktiv.This interconnection of several antennas can be static. In this case, for example, once established connections, which are to be switched, produced between the drive circuit and the antennas. As a result, the antenna arrangement or part of the antenna arrangement (cluster) becomes active at a specified time.

Es ist aber auch eine vollständig dynamische Arbeitsweise möglich, derart dass die elektrischen Amplituden und Phasen aller Antennen und/oder Cluster zeitgleich und unabhängig voneinander mittels einer entsprechenden Ansteuereinheit gesteuert werden.But it is also a completely dynamic operation possible, so that the electrical amplitudes and phases of all antennas and / or clusters are controlled simultaneously and independently of each other by means of a corresponding drive unit.

Die Erfindung soll nachfolgend anhand eines Ausführungsbeispiels näher erläutert werden. In den zugehörigen Zeichnungen zeigt

Fig. 1
eine Ansicht einer erfindungsgemäßen Antennenanordnung mit zwei übereinander angeordneten Antennenteilanordnungen,
Fig. 2
eine Ansicht der ersten Antennenteilanordnung von oben,
Fig. 3
eine Ansicht der zweiten Antennenteilanordnung,
Fig. 4
eine Darstellung einer Antennenanordnung, bestehend aus 6x6 Antennenelementen, Teilantennen oder Einzelantennenelemente, wobei hier cavity backed dipole antennas verwendet werden,
Fig. 5
eine Ausschnittsvergrößerung eines 6x6 Arrays aus der Figur 4 mit darunter angeordneten Vivaldi-Antennen, dreilagig ausgeführt,
Fig. 6
eine Richtcharakteristik des Arrays aus Figur 4, alle Elemente sind dabei gleichphasig und mit gleicher Amplitude gespeist und
Fig. 7
eine Richtcharakteristik des Arrays aus Figur 4, hierbei wurden die Phasen der Einzelelemente so eingestellt, dass die Strahlschwenkung erreicht wird.
The invention will be explained in more detail with reference to an embodiment. In the accompanying drawings shows
Fig. 1
a view of an antenna arrangement according to the invention with two superposed antenna sub-assemblies,
Fig. 2
a view of the first antenna sub-assembly from above,
Fig. 3
a view of the second antenna sub-assembly,
Fig. 4
a representation of an antenna arrangement, consisting of 6x6 antenna elements, sub-antennas or individual antenna elements, in which case cavity-backed dipole antennas are used,
Fig. 5
an enlarged detail of a 6x6 array from the FIG. 4 with underneath arranged Vivaldi antennas, three-layered,
Fig. 6
a directional characteristic of the array FIG. 4 , all elements are in-phase and fed with the same amplitude and
Fig. 7
a directional characteristic of the array FIG. 4 , In this case, the phases of the individual elements were adjusted so that the beam tilting is achieved.

Figur 1 zeigt eine erfindungsgemäße Antennenanordnung 1, welche beispielsweise in einem einen Chip deckelartig abdeckenden Gehäuseteil 4 eines Chipgehäuses angeordnet ist. Das Chipgehäuse 4 ist nur auszugsweise und nur schematisch dargestellt. FIG. 1 shows an antenna arrangement 1 according to the invention, which is arranged for example in a cover of a chip-like covering housing part 4 of a chip package. The chip housing 4 is only partially and only schematically shown.

Figur 1 zeigt die Antennenanordnung 1 in einer isometrischen Ansicht. Die Antennenanordnung 1 besteht aus zwei Antennenteilanordnungen 2 und 3. Die erste Antennenteilanordnung 2 umfasst die oberste Ebene. In dieser sind mehrere Einzelantennen in mehreren Reihen und Spalten angeordnet dargestellt. Im Beispiel sind 36 Stück jeweils in einer rechteckform dargestellt. In dieser Ausführung der Erfindung sind die Antennen der obersten Ebene als Mikrostreifen-Patchantennen ausgeführt und gleich ausgerichtet angeordnet. FIG. 1 shows the antenna assembly 1 in an isometric view. The antenna arrangement 1 consists of two antenna sub-assemblies 2 and 3. The first antenna sub-assembly 2 comprises the uppermost level. In this several individual antennas are shown arranged in several rows and columns. In the example, 36 pieces are each shown in a rectangular form. In this embodiment of the invention, the top-level antennas are implemented as microstrip patch antennas and arranged in the same orientation.

Unter der ersten Antennenteilanordnung 2 ist die zweite Antennenteilanordnung 3 dargestellt. Die Antennenteilanordnung 2 umfasst zwei Ebenen, in denen jeweils mehrere Vivaldi-Antennen pro Ebene in unterschiedlichen Richtungen ausgerichtet angeordnet sind.Under the first antenna sub-assembly 2, the second antenna sub-assembly 3 is shown. The antenna sub-assembly 2 comprises two planes, in each of which a plurality of Vivaldi antennas are arranged aligned in different directions per plane.

Die Ausrichtung der Vivaldi-Antennen zwischen den beiden benachbarten Ebenen ist deckungsgleich. Es ist jedoch auch denkbar, die zweite Antennenteilanordnung 3 nur aus einer Ebene oder aus drei Ebenen bestehend auszuführen, wobei die Ausrichtung der Vivaldi-Antennen von Ebene zu Ebene verschieden ist. Weiterhin ist es möglich, in einer Ebene sowohl Vivaldi-Antennen als auch Mikrostreifen-Patchantennen anzuordnen.The alignment of the Vivaldi antennas between the two adjacent planes is congruent. However, it is also conceivable to carry out the second antenna subassembly 3 consisting of only one plane or three planes, the alignment of the Vivaldi antennas from plane to plane is different. Furthermore, it is possible to arrange both Vivaldi antennas and microstrip patch antennas in one plane.

Figur 2 zeigt eine Ansicht der Antennenanordnung von oben auf das Chipgehäuse 4, wobei eine die oberste Ebene abdeckende Gehäuse- oder Schutzschicht nicht dargestellt ist. FIG. 2 shows a view of the antenna assembly from the top of the chip housing 4, wherein a top level covering housing or protective layer is not shown.

In der Figur 3 ist die Antennenanordnung in einer Ansicht von unten dargestellt. Die aus mehreren Vivaldi-Antennen bestehende Antennenteilanordnung 3 erstreckt sich dabei bis zum Rand des Chipgehäuses 4. Die Ausrichtung der Vivaldi-Antennen erfolgte in einer Ebene eines nicht dargestellten Koordinatensystems in einem Winkel von 0, 90, 180 und 270 Grad.In the FIG. 3 the antenna arrangement is shown in a view from below. The consisting of several Vivaldi antennas antenna sub-assembly 3 extends to the edge of the chip housing 4. The alignment of the Vivaldi antennas was carried out in a plane of a coordinate system, not shown at an angle of 0, 90, 180 and 270 degrees.

Die Figur 4 zeigt eine Darstellung eines 6x6 Antennenarrays, beispielsweise als erste Antennenteilanordnung 2, in welcher sogenannte "cavity backed dipole antennas" verwendet wurden. Die Ausrichtung aller Antennen dieser Antennenteilanordnung 2 ist gleich.The FIG. 4 shows a representation of a 6x6 antenna array, for example, as a first antenna sub-assembly 2, in which so-called "cavity-backed dipole antennas" were used. The orientation of all antennas of this antenna sub-assembly 2 is the same.

Die Figur 5 zeigt eine Ausschnittsvergrößerung der ersten, aus einer Ebene bestehenden, Antennenteilanordnung 2 aus der Figur 4. Unter der ersten Antennenteilanordnung 2 ist eine aus drei Ebenen bestehende zweite Antennenteilanordnung 3 angeordnet. In dieser sind Vivaldi-Antennen gleich ausgerichtet und deckungsgleich übereinander angeordnet.The FIG. 5 shows an enlarged detail of the first, consisting of a plane, antenna sub-assembly 2 of the FIG. 4 , Under the first antenna sub-assembly 2, a three-level second antenna sub-assembly 3 is arranged. In this Vivaldi antennas are aligned and arranged congruently one above the other.

Die Figur 6 zeigt eine dreidimensionale grafische Darstellung der Strahlungscharakteristik (oder Richtcharakteristik) der erfindungsgemäßen Antennenanordnung 1 aus der Figur 4. Die Darstellung ist nur eine Prinzipdarstellung verschiedener Keulen in einem räumlichen Koordinatensystem. Auf eine Darstellung der Feldstärke wurde verzichtet. Dargestellt ist der Fall einer gleichphasigen und mit gleicher Amplitude gespeisten aus 36 Teilantennen bestehenden Antennenanordnung 1.The FIG. 6 shows a three-dimensional graphical representation of the radiation characteristic (or directional characteristic) of the antenna arrangement 1 according to the invention from the FIG. 4 , The representation is only a schematic representation of different clubs in a spatial coordinate system. On a representation of the field strength was waived. Shown is the case of an in-phase and with the same amplitude fed from 36 subantenna antenna array. 1

In der Figur 7 ist eine weitere dreidimensionale Prinzipdarstellung einer Richtcharakteristik abgebildet. Diese bezieht sich ebenfalls auf die in der Figur 4 dargestellte Antennenanordnung 1. In diesem Fall wurden die Phasen der 36 Einzelantennen der Antennenanordnung 1 derart eingestellt, dass die dargestellte Strahlschwenkung erreicht wird. In der Figur 7 ist die maximal erreichbare Strahlschwenkung mit einer derartigen Anordnung aufgezeigt. Eine weitere Strahlschwenkung ist mittels einer in der Figur 5 dargestellten Antennenanordnung 1 möglich. In dieser sind zwei aus verschiedenartigen Antennen bestehende Antennenteilanordnungen 2 und 3 dargestellt. Durch die unterschiedlichen Antennenarten sowie eine unterschiedliche Ausrichtung der Antennen in einer Ebene oder zwischen den Ebenen wird eine gezielte Beeinflussung der Strahlformung und der Ausrichtung erreicht.In the FIG. 7 is a further three-dimensional schematic representation of a directional characteristic shown. This also refers to those in the FIG. 4 illustrated antenna arrangement 1. In this case, the phases of the 36 individual antennas of the antenna assembly 1 were set such that the illustrated beam swing is achieved. In the FIG. 7 the maximum achievable beam swing is shown with such an arrangement. Another beam swing is by means of a in the FIG. 5 illustrated antenna arrangement 1 possible. In this two antenna antennas consisting of various antennas arrangements 2 and 3 are shown. Due to the different antenna types and a different orientation of the antennas in a plane or between the planes, a targeted influencing of the beam shaping and the alignment is achieved.

Die Erfindung stellt eine Antennenanordnung 1 bereit, welche direkt im Gehäuse eines Chips 4, vorzugsweise in einem dem Chip deckelartig abdeckenden Gehäuseteil angeordnet ist.The invention provides an antenna arrangement 1 which is arranged directly in the housing of a chip 4, preferably in a housing part which covers the cover like a cover.

Derartige Chips können beispielsweise Halbleiterchips für Anwendungen im Millimeterwellbereich sein. Dabei ist es für die Antennen der Antennenanordnung 1 unerheblich, welche Signalinformationen mit ihr abgestrahlt oder empfangen werden.Such chips may, for example, be semiconductor chips for applications in the millimeter wave range. It is irrelevant for the antennas of the antenna assembly 1, which signal information is emitted or received with her.

Ist die Antennenanordnung 1 ein Teil des Chipgehäuses, werden keine Verbindungen zwischen den Anschlüssen des Halbleiterchips (Pins) und einer separaten, außerhalb des Chips angeordneten Antenne notwendig, was zu einer Vereinfachung des Chipdesigns und zu einer Reduzierung der Kosten führt. Weiterhin treten keine elektrischen Verluste durch die oben aufgeführten Verbindungen auf. Somit wird eine Reduzierung der Verlustleistung erreicht. Darüber hinaus verringert sich die Zahl notwendinger Verbindungsleitungen auf der den Chip tragenden Platine, was zu einer Reduzierung des notwendigen Platzbedarfs und der Kosten führt.When the antenna assembly 1 is a part of the chip package, no connections between the terminals of the semiconductor chip (pins) and a separate off-chip antenna become necessary, resulting in simplification of chip design and cost reduction. Furthermore, no electrical losses occur through the compounds listed above. Thus, will achieved a reduction in power dissipation. In addition, the number of connecting lines required on the board carrying the chip is reduced, resulting in a reduction in the space required and the cost.

Die erfindungsgemäße Antennenanordnung 1 kann aber auch direkt auf den Chip, beispielsweise nur durch eine Isolationsschicht von diesem getrennt, aufgebracht werden und bildet somit keinen Bestandteil des Chipgehäuses.However, the antenna arrangement 1 according to the invention can also be applied directly to the chip, for example separated from it only by an insulating layer, and thus does not form part of the chip housing.

Eine weitere Möglichkeit der Platzierung der Antennenanordnung 1 ist die Anordnung direkt auf dem Halbleiterchip als eine Teilbaugruppe des Chips selbst oder die Platzierung in einer den Halbleiterchip seitlich abdeckenden Chipgehäusewand.Another possibility of placing the antenna arrangement 1 is the arrangement directly on the semiconductor chip as a subassembly of the chip itself or the placement in a chip housing wall laterally covering the semiconductor chip.

Derartige Antennenanordnungen 1 können beispielsweise zur Übertragung von großen Datenmengen zwischen PC, Drucker, Maus, Tastatur, Bildschirm, TV-Gerät, Hi-Fi-Geräten, Beamer, mediznischen Analysegeräten u.a. eingesetzt werden. Dabei ist beispielsweise bei der Verwendung des 60 GHz Frequenzspektrums eine Datenübertragung bis zu einer Entfernung von etwa 10 Metern möglich.Such antenna arrangements 1 can, for example, for the transmission of large amounts of data between PC, printer, mouse, keyboard, screen, TV, hi-fi devices, projectors, medical analysis devices u.a. be used. For example, when using the 60 GHz frequency spectrum, data transmission up to a distance of about 10 meters is possible.

Weiter besondere Merkmale und Ausführungsformen sind nachfolgend aufgeführt:
Möglich sind Kombinationen zweier (oder mehrerer) unterschiedlicher Antennenanordnungen, z.B. planare, geschichtete Systeme. Dadurch wird eine Vergrößerung des ausgeleuchteten Raumes (Erhöhung der Abdeckung) sowie eine kompakte Bauform der Antennenanordnung erreicht.
Further special features and embodiments are listed below:
Combinations of two (or more) different antenna arrangements are possible, eg planar, layered systems. As a result, an enlargement of the illuminated space (increase of the cover) as well as a compact design of the antenna arrangement is achieved.

Integration der Antennenanordnung im Chipgehäuse oder eine Implementierung der Erfindung auf dem Chip selbst sind möglich.Integration of the antenna arrangement in the chip housing or an implementation of the invention on the chip itself are possible.

Verwendung einer oder mehrerer mehrlagiger Antennenanordnungen sind möglich, wobei die Anzahl der Lagen ≥ 1 ist.Use of one or more multilayer antenna arrangements is possible, the number of layers being ≥ 1.

Das Speisenetzwerk zur Ansteuerung der Einzelantennen befindet sich im Gehäuse selbst. Dieses kann dabei ebenfalls mehrlagig ausgeführt sein. Mögliche Leitungsstrukturen sind CPS, CPW, (gekoppelte) Mikrostreifen, Schlitzleitung oder Streifenleitung. Die Überkopplung von der Zuleitung auf die strahlenden Aperturen kann unterschiedlich erfolgen, z.B. galvanisch, kapazitiv oder induktiv gekoppelt.The feed network for controlling the individual antennas is located in the housing itself. This can also be designed in several layers. Possible line structures are CPS, CPW, (coupled) microstrip, slotline or stripline. The coupling from the lead to the radiating apertures can be done differently, e.g. galvanically, capacitively or inductively coupled.

Vorgesehen sind galvanische, kapazitive oder induktive Verbindungen zwischen Gehäuse und dem Chip.Provided galvanic, capacitive or inductive connections between the housing and the chip.

Bei der Ansteuerung der Einzelantennen der Antennenanordnung 1 sind nachfolgende Ausführungen vorgesehen:

  • ∘ Fest verdrahtet, d.h. es ist keine Strahlschwenkung möglich.
  • ∘ Komplett unabhängig, d.h. die elektrischen Phasen und Amplituden jedes Antennenelements aller Antennensysteme sind frei und unabhängig voneinander einstellbar.
  • ∘ Eine Kombination der zuvor genannten Möglichkeiten, d.h. es werden kleinere Gruppen (Cluster), bestehend aus fest verdrahteten Antennenelementen eines oder mehrerer Antennensysteme gebildet, wobei die elektrischen Phasen und Amplituden der einzelnen Gruppen unabhängig voneinander einstellbar sind.
  • ∘ Einzelne Antennenelemente oder Cluster sind zu-/abschaltbar bzw. Aktivierung beliebig kombinierbar um eine diskretisierte Strahlschwenkung zu erreichen.
  • ∘ Leistung der einzelnen Leistungsverstärker lässt sich wahlweise auf die Antennenelemente bzw. Cluster aufteilen und kombinieren. Gleiches gilt auch für die Empfangsverstärker.
  • ∘ Bei der Strahlformung und Strahlschwenkung kann es sich um eine reine Steuerung oder auch um eine Regelung handeln, die adaptiv ausgeführt werden kann.
In the control of the individual antennas of the antenna arrangement 1, the following explanations are provided:
  • ∘ Hardwired, ie no beam swing is possible.
  • ∘ Completely independent, ie the electrical phases and amplitudes of each antenna element of all antenna systems are freely and independently adjustable.
  • ∘ A combination of the abovementioned possibilities, ie smaller groups (clusters) consisting of hard-wired antenna elements of one or more antenna systems are formed, wherein the electrical phases and amplitudes of the individual groups can be set independently of one another.
  • ∘ Individual antenna elements or clusters can be switched on / off or activation can be combined as required to achieve a discretized beam swing.
  • ∘ Power of each power amplifier can be optionally split on the antenna elements or clusters and combine. The same applies to the receiver amplifiers.
  • ∘ Beam shaping and beam tilting can be pure control or regulation that can be adaptive.

Es können die nachfolgend aufgeführten Antennentypen zum Einsatz kommen:

  • ∘ Bei einer Antennenanordnung nach Figur 1:
    • ▪ Patchantennen
    • ▪ Dielektrische Resonatorantennen
    • ▪ Schleifenantennen, Rhombische Antennen
    • ▪ "Gedruckte" Dipole, Yagi-Antennen
    • ▪ Cavity-Backed Strukturen
    • ▪ als Hornantennen angedeutete Vias in der obersten Substratschicht mit Speiselementen (Vgl. US 7444734 B2 )
  • ∘ Bei einer Antennenanordnung nach Figur 3:
    • ▪ aufgeweitete Schlitzantennen (mögliche Formen der Aufweitung: stufenweise, linear, exponentiell (Vivaldi-Antenne), etc.)
    • ▪ Dipole
    • ▪ Yagi-Antennen
    • ▪ seitlich montierte Patchantennen
    • ▪ neben dem Gehäuse montierte/an das Gehäuse geklebte (oder anders befestigt) dielektrische Resonatorantennen
  • ∘ Sinnvolle Kombinationen von mehrlagigen Teilantennensystemen können erfindungsgemäß bestehen aus:
    • ▪ Patchantennen (oben) mit Vivaldis (mehrlagig)
    • ▪ Patchantennen (oben) mit einer Reihe Patchantennen seitlich
    • ▪ Schleifenantennen (oben) mit Vivaldis (mehrlagig)
The following antenna types can be used:
  • ∘ In an antenna arrangement according to FIG. 1 :
    • ▪ patch antennas
    • ▪ Dielectric resonator antennas
    • ▪ Loop antennas, rhombic antennas
    • ▪ "Printed" dipoles, Yagi antennas
    • ▪ Cavity-backed structures
    • ▪ Vias in the uppermost substrate layer with feeding elements, indicated as horn antennas (cf. US 7444734 B2 )
  • ∘ In an antenna arrangement according to FIG. 3 :
    • ▪ widened slot antennas (possible forms of widening: stepwise, linear, exponential (Vivaldi antenna), etc.)
    • ▪ Dipoles
    • ▪ Yagi antennas
    • ▪ side mounted patch antennas
    • ▪ dielectric mounted next to the enclosure / glued (or otherwise attached) to the enclosure resonator antennas
  • ∘ Meaningful combinations of multi-layer subantenna systems can consist according to the invention of:
    • ▪ Patch antennas (top) with Vivaldis (multi-layered)
    • ▪ Patch antennas (top) with a row of patch antennas on the side
    • ▪ Loop antennas (top) with Vivaldis (multilayer)

Die Anwendungen einer derartigen Antennenanordnung kann beispielsweise im Bereich der Kommunikation (hohe Datenraten, kurze Kontaktzeiten), der Sensor-Technik (hohe Auflösung), der Medizin (z.B. abbildende Systeme), des Radars, der Mustererkennung sowie in der industriellen Fertigung erfolgen.The applications of such an antenna arrangement can take place, for example, in the field of communication (high data rates, short contact times), sensor technology (high resolution), medicine (eg imaging systems), radar, pattern recognition and industrial manufacturing.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Antennenanordnungantenna array
22
erste Antennenteilanordnungfirst antenna subassembly
33
zweite Antennenteilanordnungsecond antenna subassembly
44
Chipgehäuses (Teil des Deckels)Chip housing (part of the lid)

Claims (9)

  1. Antenna arrangement (1) for transmitting signals, consisting of a plurality of antennas arranged in a plane at a distance from a chip surface, wherein the antenna arrangement has a plurality of planes, wherein a plurality of individual antennas are arranged in each plane, characterized in that the orientation of the antennas between two adjacent planes is different
    wherein the antenna arrangement consists of a first antenna subarrangement (2) and a second antenna subarrangement (3),
    wherein the first antenna subarrangement is arranged above the second antenna subarrangement ,
    wherein the first antenna subarrangement consists of patch antennas and the second antenna subarrangement consists of multilayered Vivaldi antennas or
    the first antenna subarrangement consists of patch antennas and the second antenna subarrangement consists of a series of lateral patch antennas or the first antenna subarrangement consists of loop antennas and the second antenna subarrangement consists of multilayered Vivaldi antennas or
    the first antenna subarrangement consists of cavity-backed structures and the second antenna subarrangement consists of multilayered Vivaldi antennas.
  2. Antenna arrangement according to Claim 1, characterized in that the orientation of the antennas in a plane is the same.
  3. Antenna arrangement according to Claim 1, characterized in that the orientation of the antennas in a plane is different.
  4. Antenna arrangement according to any of Claims 1 to 3, characterized in that the antennas of two adjacent planes are arranged congruently or in an offset manner with respect to one another.
  5. Antenna arrangement according to any of Claims 1 to 4, characterized in that the planes have a circular or n-gonal basic area where n ≥ 3.
  6. Antenna arrangement according to any of Claims 1 to 5, characterized in that the planes are arranged one above another to form a parallelepipedal or a truncated pyramid structure.
  7. Antenna arrangement according to any of Claims 1 to 6, characterized in that the coupling of the antenna arrangement to the chip is effected by means of contacts, inductively or capacitively.
  8. Antenna arrangement according to any of Claims 1 to 7, characterized in that the antenna arrangement is arranged indirectly on the chip or in a housing part covering the chip like a cover.
  9. Antenna arrangement according to any of Claims 1 to 8, characterized in that each antenna is connected to a separate drive unit, or in that a plurality of antennas are connected to a common drive unit.
EP10779263.2A 2009-10-29 2010-10-29 Antenna arrangement for signal transmission Active EP2494655B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009051143 2009-10-29
PCT/EP2010/066485 WO2011051456A1 (en) 2009-10-29 2010-10-29 Antenna arrangement for transmitting signals

Publications (2)

Publication Number Publication Date
EP2494655A1 EP2494655A1 (en) 2012-09-05
EP2494655B1 true EP2494655B1 (en) 2018-07-18

Family

ID=43528407

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10779263.2A Active EP2494655B1 (en) 2009-10-29 2010-10-29 Antenna arrangement for signal transmission

Country Status (3)

Country Link
US (1) US9059503B2 (en)
EP (1) EP2494655B1 (en)
WO (1) WO2011051456A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9401745B1 (en) * 2009-12-11 2016-07-26 Micron Technology, Inc. Wireless communication link using near field coupling
JP6067742B2 (en) * 2011-12-13 2017-01-25 メリディアン・メディカル・システムズ,エルエルシー Low profile temperature transducer
EP2840650B1 (en) * 2013-08-24 2018-12-26 HENSOLDT Sensors GmbH Three-dimensional antenna array
JP6706722B2 (en) * 2016-10-09 2020-06-10 華為技術有限公司Huawei Technologies Co.,Ltd. Horn antenna
USD863268S1 (en) 2018-05-04 2019-10-15 Scott R. Archer Yagi-uda antenna with triangle loop
USD913256S1 (en) * 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3141692B2 (en) * 1994-08-11 2001-03-05 松下電器産業株式会社 Millimeter wave detector
US6373447B1 (en) * 1998-12-28 2002-04-16 Kawasaki Steel Corporation On-chip antenna, and systems utilizing same
US7163155B2 (en) 2003-11-05 2007-01-16 Interdigital Technology Corporation ASIC-embedded switchable antenna arrays
US7444734B2 (en) 2003-12-09 2008-11-04 International Business Machines Corporation Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
TWI278084B (en) 2004-10-19 2007-04-01 Advanced Semiconductor Eng Chip scale package with micro antenna and method for manufacturing the same
US7834808B2 (en) 2005-06-29 2010-11-16 Georgia Tech Research Corporation Multilayer electronic component systems and methods of manufacture
US7615863B2 (en) 2006-06-19 2009-11-10 Northrop Grumman Space & Missions Systems Corp. Multi-dimensional wafer-level integrated antenna sensor micro packaging
US7768457B2 (en) 2007-06-22 2010-08-03 Vubiq, Inc. Integrated antenna and chip package and method of manufacturing thereof
US7880677B2 (en) 2007-12-12 2011-02-01 Broadcom Corporation Method and system for a phased array antenna embedded in an integrated circuit package
US7696930B2 (en) * 2008-04-14 2010-04-13 International Business Machines Corporation Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities
US20130050016A1 (en) * 2011-08-26 2013-02-28 Electronics And Telecommunications Research Institute Radar package for millimeter waves
US9196951B2 (en) * 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
WO2011051456A1 (en) 2011-05-05
US20130009848A1 (en) 2013-01-10
EP2494655A1 (en) 2012-09-05
US9059503B2 (en) 2015-06-16

Similar Documents

Publication Publication Date Title
DE102008023030B4 (en) Radar antenna array
EP2681800B1 (en) Printed circuit board arrangement for millimeter wave scanners
DE602005002330T2 (en) Logarithmic periodic microstrip array antenna with grounded semi-coplanar waveguide to microstrip line transition
DE60318106T2 (en) Phased array antenna for spaceborne radar
EP2494655B1 (en) Antenna arrangement for signal transmission
DE202021106120U1 (en) Radiating elements with angled feed shafts and base station antennas including the same
EP3440738B1 (en) Antenna device
EP3465817B1 (en) Antenna device for a radar detector having at least two radiation directions, and motor vehicle having at least one radar detector
DE112019006801T5 (en) Antenna device and radar device
DE69832592T2 (en) DEVICE FOR RECEIVING AND SENDING RADIO SIGNALS
WO2016135099A1 (en) Reflector with an electronic circuit and antenna apparatus with a reflector
DE112020003999B4 (en) Antenna module, communication device attached thereto, and circuit board
DE69731050T2 (en) Array antenna, antenna array comprising such array antenna, and antenna system using such antenna array
DE102012012171B4 (en) Circuit board arrangement for feeding antennas via a three-wire system for exciting different polarizations
DE102021117170A1 (en) SYSTEM AND PROCEDURE FOR OVER-THE-AIR ANTENNA CALIBRATION
DE102012023940B4 (en) Radar device and method of assembling the same
WO2005034288A1 (en) Device and method for emitting and/or receiving electromagnetic radiation
EP1410062A2 (en) Radar device
DE69720837T2 (en) Planar antenna module
DE102005011128B4 (en) Calibration of an electronically controllable planar antenna and electronically controllable antenna with a probe in the reactive near field
DE212014000257U1 (en) antenna structures
EP3753073A1 (en) Antenna for communicating with a transponder
WO2017211451A1 (en) Circuit board assembly for supplying signals to an emitter
DE102007055534B4 (en) Compact directional antenna arrangement with multiple use of radiator elements
WO2023179951A1 (en) Radar sensor

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120425

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20151223

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20180129

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1020347

Country of ref document: AT

Kind code of ref document: T

Effective date: 20180815

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502010015176

Country of ref document: DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20180718

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181118

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181018

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181018

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181019

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502010015176

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

26N No opposition filed

Effective date: 20190423

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20181031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181029

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181031

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181031

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181029

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1020347

Country of ref document: AT

Kind code of ref document: T

Effective date: 20181029

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181029

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180718

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20101029

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180718

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 502010015176

Country of ref document: DE

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231025

Year of fee payment: 14

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20231023

Year of fee payment: 14

Ref country code: DE

Payment date: 20231018

Year of fee payment: 14