EP2468927A1 - Zusammensetzung zur Metallgalvanisierung mit Verlaufmittel - Google Patents

Zusammensetzung zur Metallgalvanisierung mit Verlaufmittel Download PDF

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EP2468927A1
EP2468927A1 EP10196299A EP10196299A EP2468927A1 EP 2468927 A1 EP2468927 A1 EP 2468927A1 EP 10196299 A EP10196299 A EP 10196299A EP 10196299 A EP10196299 A EP 10196299A EP 2468927 A1 EP2468927 A1 EP 2468927A1
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Prior art keywords
composition according
metal
anyone
compound
substrate
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French (fr)
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Cornelia RÖGER-GÖPFERT
Roman Benedikt Raether
Harald Hörhammer
Marco Arnold
Charlotte Emnet
Dieter Mayer
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BASF SE
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BASF SE
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Priority to TW100147544A priority patent/TWI527937B/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Definitions

  • the invention relates to electroplating compositions comprising a leveling agent.
  • levelers are used to provide a substantially planar surface over the filled features.
  • leveling compounds are N-containing and optionally substituted and/or quaternized polymers, such as polyethylene imine and its derivatives, polyglycine, poly(allylamine), polyaniline (sulfonated), polyvinylpyrrolidone, polyvinylpyridine, polyvinylimidazole, polyurea, polyacrylamide, poly(melamine-co-formaldehyde), polyalkanolamines, etc.
  • Polymeric biguanide compounds are generally known, e.g. as surfactants, preservatives in cosmetics, and biocidal, fungicidal or bactricidal compositions and the like.
  • polymeric biguanide compounds and derivatives thereof can be used as additives in metal, particularly in copper electroplating baths showing an improved leveling performance without influencing the superfilling, particularly on substrates having apertures below 30 nm.
  • the present invention is particularly suitable for filling high aspect ratio features having aspect ratios of 4:1 or greater, such as 10:1, and even higher, with copper such that the features are substantially free of voids and preferably completely free of voids.
  • the present invention is suitable for filling features comprising apertures that are greater than 100 nm, and particularly suitable for filling features having apertures of 100 nm or smaller.
  • the agents/additives according to the present invention can further advantageously be used for electroplating of copper in through silicon vias (TSV).
  • TSV through silicon vias
  • Such vias normally have widths of several micrometers up to 100 micrometers and large aspect ratios of at least 4, sometimes above 10.
  • the agents/additives according to the present invention can advantageously be used in bonding technologies such as the manufacture of copper pillars of typically 50 to 100 micrometers height and width for the bumping process, in circuit board technologies like the manufacture of high-density-interconnects on printed circuit boards using microvia plating or plated-through-hole technologies, or in other packaging processes for electronic circuits.
  • the present invention provides a composition comprising a source of metal ions and at least one additive comprising a linear or branched, polymeric biguanide compound comprising the structural unit of formula L1 or the corresponding salt of the polymeric biguanide compound formed by the reaction of the biguanide groups with organic or inorganic acids, wherein
  • a further embodiment of the present invention is the use of the additives as described herein in a bath for depositing metal containing layers.
  • Yet another embodiment of the present invention is a process for depositing a metal layer on a substrate by contacting a plating solution as described herein with the substrate, and applying a current to the substrate to deposit a metal layer onto the substrate.
  • the process is particularly useful for depositing metal, particularly copper layers on substrate comprising micrometer and/or submicrometer-sized features.
  • compositions for electroplating according to the present invention provides deposited metal layers, particularly copper layers, having reduced overplating, particularly reduced mounding.
  • the metal layers provided by the present invention are substantially planar, even on substrates exhibiting apertures of a very wide range of different aperture sizes (e.g. from about 30 nanometers to about 2 micrometers).
  • the present invention provides metal layers substantially without the formation of added defects, such as voids, in the features.
  • a further significant advantage of this leveling effect is that less material has to be removed in post-deposition operations.
  • CMP chemical mechanical polishing
  • the more level deposit of the invention corresponds to a reduction in the amount of metal which must be deposited, therefore resulting in less removal later by CMP.
  • the material removal operation is also less severe which, coupled with the reduced duration, corresponds to a reduction in the tendency of the material removal operation to impart defects.
  • R 1 may be, at each position independently, selected from an H atom or an organic radical having from 1 to 20 carbon atoms.
  • the radicals may be branched or unbranched or comprise functional groups which can, for example, contribute to further crosslinking of the polymeric biguanide compound.
  • Hydrocarbon radicals may preferably be substituted or unsubstituted alkyl, substituted or unsubstituted aryl, substituted or unsubstituted alkylaryl, or substituted or unsubstituted arylalkyl.
  • alkyl means C1 to C20 alkyl and includes linear, branched and cyclic alkyl.
  • substituted alkyl means that one or more of the hydrogens on the alkyl group is replaced with another substituent group, such as, but not limited to, cyano, hydroxy, halo, (C1-C6)alkoxy, (C1-C6)alkylthio, thiol, nitro, and the like.
  • aryl includes carbocyclic and heterocyclic aromatic systems, such as, but not limited to, phenyl, naphthyl and the like.
  • substituted aryl is meant that one or more hydrogens on the aryl ring are replaced with one or more substituent groups, such as, but not limited to, cyano, hydroxy, halo, (C1-C6)alkoxy, (C1-C6)alkyl, (C2-C6)alkenyl, (C1-C6)alkylthio, thiol, nitro, and the like.
  • alkaryl includes alkyl substituted carbocyclic and heterocyclic aromatic systems, such as, but not limited to, benzyl, naphthylmethyl and the like.
  • polymer generally means any compound comprising at least two monomeric units i.e. the term polymer includes dimers, trimers, etc., oligomers as well as high molecular weight polymers.
  • feature refers to the geometries on a substrate, such as, but not limited to, trenches and vias.
  • aperture refer to recessed features, such as vias and trenches.
  • plating refers to metal electroplating, unless the context clearly indicates otherwise. “Deposition” and “plating” are used interchangeably throughout this specification.
  • accelerator refers to an organic compound that increases the plating rate of the electroplating bath on at least part of a substrate.
  • the terms “accelerator” and “accelerating agent” are used interchangeably throughout this specification.
  • the accelerator component is also named “brightener”, “brightening agent” or “anti-suppressor”.
  • Sypressor refers to an organic compound that decreases the plating rate of the electroplating bath on at least part of a substrate.
  • the terms “suppressors” and “suppressing agents” are used interchangeably throughout this specification.
  • Leveler refers to an organic compound that is capable of providing a substantially planar metal layer.
  • levelers leveling agents
  • leveling additive are used interchangeably throughout this specification.
  • aperture size means the smallest diameter or free distance of a feature before plating.
  • opening means the smallest diameter or free distance of a feature before plating.
  • width means the smallest diameter or free distance of a feature before plating.
  • diameter means the smallest diameter or free distance of a feature before plating.
  • the additive according to the present invention has strong leveling properties in electroplating of submicron-sized features the use and performance of the additives according to the present invention is not limited to its leveling properties and may advantageously be used in other metal plating applications, e.g. for depositing through silicon vias (TSV), for other purposes.
  • TSV through silicon vias
  • R 1 may be, at each position independently, selected from an H atom or an organic radical having from 1 to 10 carbon atoms. More preferably R 1 may be selected from a hydrogen atom or substituted or unsubstituted C1 to C10 alkyl radicals.
  • the radicals may be branched or unbranched or comprise functional groups which may, for example, contribute to further crosslinking of the polymeric biguanide compound.
  • R 1 is, at each position independently, a hydrogen atom or a hydrocarbon radical having from 1 to 6 carbon atoms which may comprise functional groups such as hydroxyl and amino groups.
  • R 1 may be alkyl like methyl, ethyl, propyl, butyl, pentyl or hexyl.
  • R 1 is an H atom.
  • R 2 may be any divalent organic radical.
  • the divalent organic radical may not only comprise carbon and hydrogen but also heteroatoms such as oxygen or nitrogen, e.g. in the form of functional groups such as ether groups, hydroxyl groups, amino groups, amide groups or aromatic heterocycles.
  • functional groups such as ether groups, hydroxyl groups, amino groups, amide groups or aromatic heterocycles.
  • R 2 and/or R 1 may contain one or more primary and/or secondary amino groups the radicals R 2 and R 1 may contain further polymeric biguanide branches, respectively.
  • the organic radical R 2 may be identical or different and may be, in particular, a linear or branched hydrocarbon diradical which may optionally be substituted or interrupted by functional groups comprising heteroatoms, in particular ether groups or amino groups.
  • R 2 is a pure hydrocarbon diradical and does not comprise any functional groups.
  • R 2 is a linear C2 to C8 alkanediyl group, in particular a linear C2 to C6 alkandiyl group like ethane-1,2-diyl, propane-1,3-diyl, butane-1,4-diyl, pentane-1,5-diyl, or hexane-1,6-diyl.
  • R 2 may contain one ore more primary or secondary amino groups capable of inducing polymeric biguanide side branches into the polymeric biguanide compound.
  • the organic radicals R 1 and R 2 may be aliphatic or aromatic or comprise both aromatic and aliphatic groups.
  • n may generally be an integer from 2 to about 6000, preferably from about 3 to about 3000, even more preferably from about 3 to about 1000, even more preferably from about 5 to about 300, even more preferably from about 5 to about 200, most preferably from about 5 to about 100.
  • the mass average molecular weight M w may generally be from 300 g/mol to 500000 g/mol, preferably from 300 g/mol to 100000 g/mol, more preferably from 300 g/mol to 50000 g/mol, even more preferably from 400 g/mol to 10000 g/mol, even more preferably from 400 g/mol to 5000 g/mol, most preferably from 500 g/mol to 3000 g/mol.
  • the at least one amino compound is an aliphatic or aromatic diamine, triamine, multiamine, or mixtures thereof. Most preferably the at least one amino compound is a terminal diamine.
  • the at least one additive may be protonated and comprise a counterion Y o- , wherein o is an integer.
  • o is selected from 1, 2 or 3, most preferably, the counterion Y o- is chloride, sulfate or acetate.
  • the metal ions may comprise copper ion.
  • composition may further comprise one or more accelerating agents and/or one or more suppressing agents.
  • the substrate comprises micrometer or submicrometer sized features and the deposition is performed to fill the micrometer or submicrometer sized features.
  • the micrometer or submicrometer-sized features have a size from 1 to 1000 nm and/or an aspect ratio of 4 or more.
  • the biguanide additives according to the present inventions are also referred to as leveling agent or leveler.
  • leveling agent or leveler Due to its strong leveling performance the biguanide additives according to the present inventions are also referred to as leveling agent or leveler.
  • the additive according to the present invention has strong leveling properties in electroplating of submicron-sized features, the use and performance of the additives according to the present invention is not limited to its leveling properties and may advantageously be used in other metal plating applications, e.g. for filling through silicon vias (TSV), for other purposes.
  • TSV through silicon vias
  • the present invention provides a plated metal layer, particularly a plated copper layer, on a substrate containing features on the nanometer and/or micrometer scale wherein the metal layer has reduced overplating and all features are substantially free of added voids, and preferably substantially free of voids.
  • "Overplating” refers to a thicker metal deposit over dense feature areas as compared to areas free of features or at least containing relatively few features.
  • "Dense feature areas” means an area exhibiting smaller distances between neighboring features compared to a comparative area containing apertures with a relatively large distance in between. Smaller distances means distances below 2 micrometer, and preferably below 1 micrometer, and even more preferably below 500 nm.
  • step height or "mounding”.
  • Suitable substrates are any used in the manufacture of electronic devices, such as integrated circuits. Such substrates typically contain a number of features, particularly apertures, having a variety of sizes. Particularly suitable substrates are those having apertures on the nanometer and on the micrometer scale.
  • the present invention is achieved by combining one or more additives capable of providing a substantially planar copper layer and filling features on the nanometer and on the micrometer scale without substantially forming defects, such as but not limited to voids, with a metal plating bath, preferably a copper electroplating bath.
  • the levelling agents according to the present invention may be prepared by any preparation method.
  • US 3428576 describes the manufacture of polymeric biguanides by reacting a diamine or its inorganic acid salt with a diamine salt of dicyanamide, at least the initial part of the reaction being carried out in the presence of a hydroxylic solvent.
  • a metal salt of dicyanamide such as sodium, copper or calcium dicyanamide is described.
  • US 4403078 describes the synthesis of polymeric biguanides by a two-step reaction, starting from the salt formation of polyoxyalkylene diamines and an acid, followed by reaction of the salt with dicyanamide.
  • US 5741886 describes the synthesis of linear polymeric biguanides or biguanidinium salts thereof wherein the polymeric chain is terminated at the cyanoguanidine end group by a primary or secondary monoamine.
  • a preferred process for preparation is performed by reacting
  • primary amino group means an amino group comprising two H atoms
  • secondary amino group means an amino group comprising one H atom.
  • the preparation may be performed by reacting components (a), (b) and (c) or, alternatively, the corresponding salt of the amino compound (b) may be first formed by reacting the amino groups of amino compound (b) with the organic or inorganic acid (c) and then reacting this salt with the dicyanamide compound (a).
  • hydroxylic solvent or a mixture of a hydroxylic solvent and water may be used.
  • 1 mol of the dicyanamide component (a), 2 mol of primary and/ or secondary amino groups of the amino compound (b) and 2 mol of acid group (H + ) of the protic acid (c) are required per 1 mol of biguanide compound.
  • the biguanide groups are joined to one another by the diamine.
  • a sodium salt is formed as a side product.
  • the dicyanamide component (a) may be any salt of dicyanamide, preferably a metal salt like sodium dicyanamide. However, it is also possible to use any other cations, e.g. organic cations, as a counter-ion.
  • the amino compound (b) is a compound comprising at least two primary and/ or secondary amino groups.
  • the amino compound may be represented by a polyamine having at least two primary and/or secondary amino groups.
  • amino compounds comprising two primary or secondary amino groups are used in the reaction, linear, polymeric biguanide compounds are formed. If amino compounds having more than two primary and/ or secondary amino groups are used, polymeric biguanide branches are introduced into the polymer by reaction of the additional amino groups with the dicyanamide component and thus branched polymeric biguanide compounds are formed.
  • the amino compound may comprise 2 to 6 primary and/or secondary amino groups, preferably 2 or 3 primary and/or secondary amino groups, most preferably 2 primary and/or secondary amino groups.
  • the amino compound may be described by the general formula L2 R 1 -NH-R 3 -NH-R 1 (L2)
  • amino compound comprises 2 primary and/or secondary amino groups R 3 corresponds to R 2 in formula L1, otherwise R 2 is formed from R 3 by reaction of the additional amino groups to form polymeric biguanide side branches.
  • the amino compound comprises linear or branched alkyl and/ or aryl groups and apart from these no further functional groups or further functional groups such as ether groups, hydroxyl groups, amino groups, and/ or amide groups are present.
  • the amino compound is an aliphatic amine comprising at least two primary and/or secondary amino groups.
  • Possible amino compounds are diamines in which two primary and/ or secondary amino groups are bound to an aliphatic hydrocarbon radical, preferably an aliphatic hydrocarbon radical having from 2 to 20 carbon atoms, more preferably from 2 to 12 carbon atoms, most preferably from 2 to 6 carbon atoms.
  • amino compounds are amino compounds, preferably diamines, in which primary amino groups are bound directly to an aromatic rings system, e.g. a phenylene group, or amino compounds in which the primary amino groups are bound to aliphatic groups as alkyl substituents of an aromatic ring system.
  • Diamines which may be mentioned are, in particular, C2 to C12-alkylenediamines such as 1,2-ethylenediamine, 1,3-propylenediamine, 1,4-butylenediamine, 1,5-pentylenediamine, 1,6-hexylenediamine, 1,8-octylenediamine, isophorone diamine (3-aminomethyl-3,5,5-trimethyl cyclohexylamine) and neopentanediamine, aryldiamines such as 1,3-phenylenediamine, 1,4-phenylenediamine and 4,4'-methylenedianiline, oligo- and polyetherdiamines such as 4,7,10-trioxatridecane-1,13-diamine and 4,9-dioxadodecane-1,12-diamine and diamines comprising secondary amino groups such as N-(2-aminoethyl)ethanolamine, piperazine, 3-(cylco
  • Triamines which may be mentioned are, in particular, diethylenetriamine, 3-(2-aminoethylamino)propylamine, dipropylene triamine and N,N-bis-(3-aminopropyl)methylamine. It is also possible to use mixtures of amino compounds, it is possible to use, for example, mixtures of various aliphatic amino compounds or mixtures of various aromatic amino compounds and also mixtures of aliphatic and aromatic amino compounds. The amino compounds in the mixtures can be amino compounds having different numbers of primary and/ or secondary amino groups. When diamines are used in the process of the invention, linear polymers are obtained.
  • amino compounds having three or more primary and/ or secondary amino groups When amino compounds having three or more primary and/ or secondary amino groups are used, crosslinked and/ or branched structures are formed.
  • diamines in admixture with amino compounds having more than two primary and/ or secondary amino groups, e.g. triamines, enables the desired degree of crosslinking or degree of branching to be set via the proportion of triamines.
  • the amino compound has a molecular weight of less than 10000 g/mol, more preferably less than 5000 g/mol, most preferably less than 1000 g/mol, in particular less than 500 g/mol.
  • Particularly useful diamines and triamines are, in particular, compounds having a molecular weight of from 45 to 500 g/mol, most preferably from 60 to 300 g/mol.
  • the organic or inorganic acid may generally be characterized by formula (H + ) o Y o- , wherein o is an integer. In a preferred embodiment, o is an integer from 1 to 4, particularly preferably o is 1 or 2. In a particular embodiment, o is 1.
  • the anion Y o- of the protic acid forms the counterion to the biguanidinium salt of the polymeric compound.
  • the anion of the protic acid is, for example, selected from F-, Cl - , NO 2 - , NO 3 - , the group of sulfates, sulfites and sulfonates, e.g. SO 4 2- , HSO 4 - , SO 3 2- , HSO 3 - , H 3 COSO 3 - , H 3 CSO 3 - , phenylsulfonate, p-tolylsulfonate, the group of phosphates, phosphonates, phosphinates, phosphites, phosphonites and phosphinites, e.g.
  • the acid may also be a polymeric protic acid, e.g. polyacrylic acid; in this case, o can assume very high values.
  • polymeric protic acids mention may be made of, for example, polyacrylic acid, polymethacrylic acid or another polymer having a plurality of carboxyl groups.
  • the products received in this way may be subjected to a typical anion exchange by means of precipitation or by anion exchange resins to receive a desired counter-ion.
  • the reaction of the starting compounds is preferably carried out without adding a solvent or in a hydroxylic solvent or in mixtures of a hydroxylic solvent and water.
  • Hydroxylic solvents are, in particular, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol and higher alkylene alcohols.
  • the reaction is preferably carried out without adding a solvent.
  • the reaction of the starting components can be carried out at, for example, pressures from 0.1 to 10 bar, in particular atmospheric pressure, and, for example, at temperatures from 5 to 200 °C, in particular from 10 to 200 °C, particularly preferably from 20 to 190 °C.
  • the starting components can be combined in any order.
  • all amino starting components and all dicyanamide starting compounds are mixed beforehand and, if the amino starting component is used as a free base, this is followed by the addition of an organic or inorganic acid (H + ) o Y o- .
  • the amino starting components are used as salts of an organic or inorganic acid (H + ) o Y o- being mixed together with the dicyanamide starting components and a hydroxylic solvent beforehand.
  • leveling agent may be used.
  • at least one of the leveling agents is a polymeric biguanide compound or a derivative thereof as described herein. It is preferred to use only one biguanide leveling agent in the plating bath composition.
  • Suitable additional leveling agents include, but are not limited to, polyaminoamide and derivatives thereof, polyalkanolamine and derivatives thereof, polyethylene imine and derivatives thereof, quaternized polyethylene imine, polyglycine, poly(allylamine), polyaniline, polyurea, polyacrylamide, poly(melamine-co-formaldehyde), reaction products of amines with epichlorohydrin, reaction products of an amine, epichlorohydrin, and polyalkylene oxide, reaction products of an amine with a polyepoxide, polyvinylpyridine, polyvinylimidazole, polyvinylpyrrolidone, or copolymers thereof, nigrosines, pentamethyl-para-rosaniline hydrohalide, hexamethyl-pararosaniline hydrohalide, or compounds containing a functional group of the formula N-R-S, where R is a substituted alkyl, unsubstituted alkyl, substituted aryl or unsubstit
  • the alkyl groups are (C1-C6)alkyl and preferably (C1-C4)alkyl.
  • the aryl groups include (C6-C20)aryl, preferably (C6-C10)aryl. Such aryl groups may further include heteroatoms, such as sulfur, nitrogen and oxygen. It is preferred that the aryl group is phenyl or napthyl.
  • the compounds containing a functional group of the formula N-R-S are generally known, are generally commercially available and may be used without further purification.
  • the sulfur and/or the nitrogen (“N") may be attached to such compounds with single or double bonds.
  • the sulfur will have another substituent group, such as but not limited to hydrogen, (C1-C12)alkyl, (C2-C12)alkenyl, (C6-C20)aryl, (C1-C12)alkylthio, (C2-C12)alkenylthio, (C6-C20)arylthio and the like.
  • the nitrogen will have one or more substituent groups, such as but not limited to hydrogen, (C1-C12)alkyl, (C2-C12)alkenyl, (C7-C10)aryl, and the like.
  • the N-R-S functional group may be acyclic or cyclic.
  • Compounds containing cyclic N-R-S functional groups include those having either the nitrogen or the sulfur or both the nitrogen and the sulfur within the ring system.
  • Further leveling agents are trialkanolamine condensates, polyamidoamines, polyalkoxylated polyethylene imines, and polyimidazolium compounds as described in international WO 2010/069810 , unpublished International Patent Application No. PCT/EP2010/067874 , US provisional application No. 61/315051 , and US provisional application No. 61/350045 , respectively.
  • the total amount of leveling agents in the electroplating bath is from 0.5 ppm to 10000 ppm based on the total weight of the plating bath.
  • the leveling agents according to the present invention are typically used in a total amount of from about 0.1 ppm to about 1000 ppm based on the total weight of the plating bath and more typically from 1 to 100 ppm, although greater or lesser amounts may be used.
  • the electroplating baths according to the present invention may include one or more optional additives.
  • optional additives include, but are not limited to, accelerators, suppressors, surfactants and the like.
  • Such suppressors and accelerators are generally known in the art. It will be clear to one skilled in the art which suppressors and/or accelerators to use and in what amounts.
  • the electroplating baths may contain one or more of accelerators, suppressors, sources of halide ions, grain refiners and mixtures thereof. Most preferably the electroplating bath contains both, an accelerator and a suppressor in addition to the leveling agent according to the present invention. Other additives may also be suitably used in the present electroplating baths.
  • Accelerators useful in the present invention include, but are not limited to, compounds comprising one or more sulphur atom and a sulfonic/phosphonic acid or their salts.
  • the generally preferred accelerators have the general structure M A O 3 X A -R A1 -(S) d -R A2 , with:
  • useful accelerators include those of the following formulae: M A O 3 S-R A1 -SH M A O 3 S-R A1 -S-S-R A1' -SO 3 M A M A O 3 S-Ar-S-S-Ar-SO 3 M A with R A1 , M A as defined above and Ar is Aryl.
  • Particularly prefered accelerating agents are:
  • accelerators used alone or in mixture, include, but are not limited to: MES (2-Mercaptoethanesulfonic acid, sodium salt); DPS (N,N-dimethyldithiocarbamic acid (3-sulfopropylester), sodium salt); UPS (3-[(amino-iminomethyl)-thio]-1-propylsulfonic acid); ZPS (3-(2-benzthiazolylthio)-1-propanesulfonic acid, sodium salt); 3-mercapto-propylsulfonicacid-(3-sulfopropyl)ester; methyl-( ⁇ -sulphopropyl)-disulfide, disodium salt; methyl-( ⁇ -sulphopropyl)-trisulfide, disodium salt.
  • MES 2-Mercaptoethanesulfonic acid, sodium salt
  • DPS N,N-dimethyldithiocarbamic acid (3-sulfopropylester), sodium salt
  • Such accelerators are typically used in an amount of about 0.1 ppm to about 3000 ppm, based on the total weight of the plating bath. Particularly suitable amounts of accelerator useful in the present invention are 1 to 500 ppm, and more particularly 2 to 100 ppm.
  • suppressing agent may be advantageously used in the present invention.
  • Suppressing agents useful in the present invention include, but are not limited to, polymeric materials, particularly those having heteroatom substitution, and more particularly oxygen substitution. It is preferred that the suppressing agent is a polyalkyleneoxide.
  • Suitable suppressing agents include polyethylene glycol copolymers, particularly polyethylene glycol polypropylene glycol copolymers. The arrangement of ethylene oxide and propylene oxide of suitable suppressors may be block, gradient, or random.
  • the polyalkylene glycol may comprise further alkylene oxide building blocks such as butylene oxide.
  • the average molecular weight of suitable suppressors exceeds about 2000 g/mol.
  • the starting molecules of suitable polyalkylene glycol may be alkyl alcohols such as methanol, ethanol, propanol, n-butanol and the like, aryl alcohols such as phenols and bisphenols, alkaryl alcohols such as benzyl alcohol, polyol starters such as glycol, glycerin, trimethylol propane, pentaerythritol, sorbitol, carbohydrates such as saccharose, and the like, amines and oligoamines such as alkyl amines, aryl amines such as aniline, triethanol amine, ethylene diamine, and the like, amides, lactams, heterocyclic amines such as imidazol and carboxylic acids.
  • polyalkylene glycol suppressors may be functionalized by ionic groups such as sulfate, sulfonate, ammonium, and the like.
  • suppressors When suppressors are used, they are typically present in an amount in the range of from about 1 to about 10,000 ppm based on the weight of the bath, and preferably from about 5 to about 10,000 ppm.
  • the metal ion source may be any compound capable of releasing metal ions to be deposited in the electroplating bath in sufficient amount, i.e. is at least partially soluble in the electroplating bath. It is preferred that the metal ion source is soluble in the plating bath. Suitable metal ion sources are metal salts and include, but are not limited to, metal sulfates, metal halides, metal acetates, metal nitrates, metal fluoroborates, metal alkylsulfonates, metal arylsulfonates, metal sulfamates, metal gluconates and the like. It is preferred that the metal is copper.
  • the source of metal ions is copper sulfate, copper chloride, copper acetate, copper citrate, copper nitrate, copper fluoroborate, copper methane sulfonate, copper phenyl sulfonate and copper p-toluene sulfonate. Copper sulfate pentahydrate and copper methane sulfonate are particularly preferred. Such metal salts are generally commercially available and may be used without further purification.
  • compositions may be used in electroless deposition of metal containing layers.
  • the compositions may particularly be used in the deposition of barrier layers containing Ni, Co, Mo, W and/ or Re.
  • further elements of groups III and V, particularly B and P may be present in the composition for electroless deposition und thus co-deposited with the metals.
  • the metal ion source may be used in the present invention in any amount that provides sufficient metal ions for electroplating on a substrate.
  • Suitable metal ion metal sources include, but are not limited to, tin salts, copper salts, and the like.
  • the copper salt is typically present in an amount in the range of from about 1 to about 300 g/I of plating solution.
  • mixtures of metal salts may be electroplated according to the present invention.
  • alloys such as copper-tin having up to about 2 percent by weight tin, may be advantageously plated according to the present invention.
  • the amounts of each of the metal salts in such mixtures depend upon the particular alloy to be plated and is well known to those skilled in the art.
  • the present metal electroplating compositions preferably include electrolyte, i. e. acidic or alkaline electrolyte, one or more sources of metal ions, optionally halide ions, and optionally other additives like accelerators and/or suppressors.
  • electrolyte i. e. acidic or alkaline electrolyte
  • sources of metal ions optionally halide ions
  • optionally other additives like accelerators and/or suppressors.
  • Such baths are typically aqueous.
  • the water may be present in a wide range of amounts. Any type of water may be used, such as distilled, deionized or tap.
  • the electroplating baths of the present invention may be prepared by combining the components in any order. It is preferred that the inorganic components such as metal salts, water, electrolyte and optional halide ion source, are first added to the bath vessel followed by the organic components such as leveling agents, accelerators, suppressors, surfactants and the like.
  • the inorganic components such as metal salts, water, electrolyte and optional halide ion source
  • the plating baths of the present invention may be used at any temperature from 10 to 65 degrees C or higher. It is preferred that the temperature of the plating baths is from 10 to 35 degrees C and more preferably from 15 degrees to 30 degrees C.
  • Suitable electrolytes include such as, but not limited to, sulfuric acid, acetic acid, fluoroboric acid, alkylsulfonic acids such as methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid and trifluoromethane sulfonic acid, arylsulfonic acids such as phenyl sulfonic acid and toluenesulfonic acid, sulfamic acid, hydrochloric acid, phosphoric acid, tetraalkylammonium hydroxide, preferably tetramethylammonium hydroxide, sodium hydroxide, potassium hydroxide and the like.
  • Acids are typically present in an amount in the range of from about 1 to about 300 g/I
  • alkaline electrolytes are typically present in an amount of about 0.1 to about 20 g/I or to yield a pH of 8 to 13 respectively, and more typically to yield a pH of 9 to 12.
  • Such electrolytes may optionally contain a source of halide ions, such as chloride ions as in copper chloride or hydrochloric acid.
  • a source of halide ions such as chloride ions as in copper chloride or hydrochloric acid.
  • halide ion concentrations may be used in the present invention such as from about 0 to about 500 ppm.
  • the halide ion concentration is in the range of from about 10 to about 100 ppm based on the plating bath.
  • the electrolyte is sulfuric acid or methanesulfonic acid, and preferably a mixture of sulfuric acid or methanesulfonic acid and a source of chloride ions.
  • the acids and sources of halide ions useful in the present invention are generally commercially available and may be used without further purification.
  • Fig. 1 a shows a dielectric substrate 1 seeded with a copper layer 2a.
  • a copper layer 2' is deposited onto the dielectric substrate 1 by electrodeposition.
  • the trenches 2c of the substrate 1 are filled and an overplating of copper 2b, also referred to as "overburden", is generated on top of the whole structured substrate.
  • the overburden of copper 2b is removed by chemical mechanical planarization (CMP), as depicted in fig. 1c .
  • CMP chemical mechanical planarization
  • the effect of a leveling agent is generally described with respect to figs. 2a and 2b .
  • the mounding may be determined by profilometry measuring the step height (distance a minus distance b) between patterned and unpatterned areas. Without a leveling agent the deposition leads to a high ratio a/b >> 1. In contrast, the aim is to reduce the ratio a/b to a value, which is as close as possible to 1.
  • a particular advantage of the present invention is that overplating, particularly mounding, is reduced or substantially eliminated. Such reduced overplating means less time and effort is spent in removing metal, such as copper, during subsequent chemical-mechanical planarization (CMP) processes, particularly in semiconductor manufacture.
  • CMP chemical-mechanical planarization
  • a further advantage of the present invention is that a wide range of aperture sizes may be filled within a single substrate resulting in a substantially even surface having a ratio a/b of 1.5 or less, preferably 1.2 or less, most preferably 1.1 or less.
  • the present invention is particularly suitable to evenly filling apertures in a substrate having a variety of aperture sizes, such as from 0.01 micrometer to 100 micrometer or even larger.
  • a further significant advantage of this leveling effect is that less material has to be removed in post-deposition operations.
  • CMP chemical mechanical planarization
  • the more level deposit of the invention corresponds to a reduction in the amount of metal which must be deposited, therefore resulting in less removal later by CMP.
  • the material removal operation is also less severe which, coupled with the reduced duration, corresponds to a reduction in the tendency of the material removal operation to impart defects.
  • Metal particularly copper
  • substantially forming voids it is meant that 95% of the plated apertures are void-free. It is preferred that the plated apertures are void-free.
  • substrates are electroplated by contacting the substrate with the plating baths of the present invention.
  • the substrate typically functions as the cathode.
  • the plating bath contains an anode, which may be soluble or insoluble.
  • cathode and anode may be separated by a membrane.
  • Potential is typically applied to the cathode.
  • Sufficient current density is applied and plating performed for a period of time sufficient to deposit a metal layer, such as a copper layer, having a desired thickness on the substrate.
  • Suitable current densities include, but are not limited to, the range of 1 to 250 mA/cm 2 .
  • the current density is in the range of 1 to 60 mA/cm 2 when used to deposit copper in the manufacture of integrated circuits.
  • the specific current density depends upon the substrate to be plated, the leveling agent selected and the like. Such current density choice is within the abilities of those skilled in the art.
  • the applied current may be a direct current (DC), a pulse current (PC), a pulse reverse current (PRC) or other suitable current.
  • the plating baths are agitated during use.
  • Any suitable agitation method may be used with the present invention and such methods are well-known in the art. Suitable agitation methods include, but are not limited to, inert gas or air sparging, work piece agitation, impingement and the like. Such methods are known to those skilled in the art.
  • the wafer may be rotated such as from 1 to 200 RPM and the plating solution contacts the rotating wafer, such as by pumping or spraying. In the alternative, the wafer need not be rotated where the flow of the plating bath is sufficient to provide the desired metal deposit.
  • the present invention may be useful in any electrolytic process where an essentially level or planar copper deposit having high reflectivity is desired, and where reduced overplating and metal filled small features that are substantially free of voids are desired.
  • Such processes include printed wiring board manufacture.
  • the present plating baths may be useful for the plating of vias, pads or traces on a printed wiring board, as well as for bump plating on wafers.
  • Other suitable processes include packaging and interconnect manufacture.
  • suitable substrates include lead frames, interconnects, printed wiring boards, and the like.
  • Plating equipment for plating semiconductor substrates are well known.
  • Plating equipment comprises an electroplating tank which holds Cu electrolyte and which is made of a suitable material such as plastic or other material inert to the electrolytic plating solution.
  • the tank may be cylindrical, especially for wafer plating.
  • a cathode is horizontally disposed at the upper part of tank and may be any type substrate such as a silicon wafer having openings such as trenches and vias.
  • the wafer substrate is typically coated with a seed layer of copper, any other metal, or any other non-metal conducting material to initiate plating thereon.
  • a copper seed layer may be applied by chemical vapor deposition (CVD), physical vapor deposition (PVD), or the like.
  • An anode is also preferably circular for wafer plating and is horizontally disposed at the lower part of tank forming a space between the anode and cathode.
  • the anode is typically a soluble anode.
  • the anode may be isolated from the organic bath additives by a membrane.
  • the purpose of the separation of the anode and the organic bath additives is to minimize the oxidation of the organic bath additives.
  • the cathode substrate and anode are electrically connected by wiring and, respectively, to a rectifier (power supply).
  • the cathode substrate for direct or pulse current has a net negative charge so that Cu ions in the solution are reduced at the cathode substrate forming plated Cu metal on the cathode surface.
  • An oxidation reaction takes place at the anode.
  • the cathode and anode may be horizontally or vertically disposed in the tank.
  • the present invention is useful for depositing a metal layer, particularly a copper layer, on a variety of substrates, particularly those having variously sized apertures.
  • the present invention is particularly suitable for depositing copper on integrated circuit substrates, such as semiconductor devices, with small diameter vias, trenches or other apertures.
  • semiconductor devices are plated according to the present invention.
  • semiconductor devices include, but are not limited to, wafers used in the manufacture of integrated circuits.
  • suitable substrates include lead frames, interconnects, printed wiring boards, and the like.
  • Table 1 the structural properties of the leveler examples 1-5 are given. The filling experiments and results are described in detail in examples 6-16.
  • Table 1 Leveler R 2 R 1 1 n -hexane-1,6-diyl H 2 n -octane-1,8-diyl H 3 propane-1,3-diyl 2-hydroxyethyl and H 4 1,3-phenyl H 5 n -hexane-1,6-diyl and ethane-1,2-diyl 2-aminoethyl and H
  • a plating bath was prepared by combining DI water, 40 g/I copper as copper sulfate, 10 g/I sulfuric acid, 0.050 g/I chloride ion as HCl, 0.028 g/I of SPS and 2.00 ml/I of a 5.3 % by weight solution in DI water of a suppressor being a EO/PO copolymer having a molecular weight of ⁇ 13000 g/mole and terminal hydroxyl groups (PS151).
  • a copper layer was electroplated onto a wafer substrate with feature sizes shown in Fig. 3a (16 to 37 nm trench width, 173 to 176 nm trench depth) provided with a copper seed layer by contacting the wafer substrate with the above described plating bath at 25 degrees C applying a direct current of -5 mA/cm 2 for 6 s.
  • the thus electroplated copper layer was cross-sectioned and investigated by SEM inspection.
  • Fig. 3c providing the SEM image of fully filled trenches without exhibiting any defects like voids or seams.
  • a copper layer was electroplated onto a wafer substrate as described in example 6.
  • the thus electroplated copper layer was cross-sectioned and investigated by SEM inspection.
  • Fig. 3b The result using a plating bath with leveler 1 as prepared in example 1 according to the present invention is shown in Fig. 3b .
  • the 16 to 37 nanometer wide trenches are completely filled without exhibiting any defects like voids or seams thus showing that there is no interference with the gapfilling by the leveling agent.
  • a plating bath according to comparative example 6 was prepared.
  • a copper layer was electroplated onto a wafer substrate with feature sizes shown in Fig. 4a (100 nm trench width) provided with a copper seed layer by contacting the wafer substrate with the above described plating bath at 25 degrees C applying a direct current of -5 mA/cm 2 for 27 s followed by -10 mA/cm 2 for 27 s.
  • the thus electroplated copper layer was cross-sectioned and investigated by SEM inspection.
  • Fig. 4d provides the SEM image of fully filled trenches without exhibiting any defects like voids or seams.
  • Fig. 4d clearly reveals bump formation over the 100 nm wide trenches.
  • a plating bath according to example 7 was prepared.
  • a copper layer was electroplated onto a wafer substrate with feature sizes shown in Fig. 4a (100 nm trench width) provided with a copper seed layer by contacting the wafer substrate with the above described plating bath at 25 degrees C applying a direct current of -5 mA/cm 2 for 27 s followed by -10 mA/cm 2 for 27 s.
  • the thus electroplated copper layer was cross-sectioned and investigated by SEM inspection.
  • Fig. 4b providing the SEM image of fully filled trenches without exhibiting any defects like voids or seams while efficiently preventing bump formation over the 13 nm wide trenches.
  • the plating bath of example 6 was repeated except that 0.3125 ml/I of a 1 % by weight aqueous solution of polymeric biguanide compound leveler 1 as prepared in example 1 was added to the plating bath.
  • a copper layer was electroplated onto a wafer substrate with feature sizes shown in Fig. 4a (100 nm trench width) provided with a copper seed layer by contacting the wafer substrate with the above described plating bath at 25 degrees C applying a direct current of -5 mA/cm 2 for 27 s followed by -10 mA/cm 2 for 27 s.
  • the thus electroplated copper layer was cross-sectioned and investigated by SEM inspection.
  • Fig. 4c providing the SEM image of fully filled trenches without exhibiting any defects like voids or seams while still efficiently preventing bump formation over the 100 nm wide trenches.
  • levelling agent thus provides excellent levelling efficiency without interfering with the bottom-up-fill causing voids.
  • a copper plating bath was prepared by combining 40 g/I copper as copper sulfate, 10 g/I sulfuric acid, 0.050 g/l chloride ion as HCl, 0.100 g/l of an EO/PO copolymer suppressor, and 0.028 g/l of SPS and DI water.
  • the EO/PO copolymer suppressor had a molecular weight of ⁇ 5000 g/mole and terminal hydroxyl groups.
  • a copper layer was electroplated onto a structured silicon wafer substrate purchased from SKW Associate Inc. containing trenches arranged as shown in Figs. 2a and 2b . These substrates exhibited two test areas:
  • Such wafer substrates were brought into contact with the above described plating bath at 25 degrees C and a direct current of -5 mA/cm 2 for 120 s followed by -10 mA/cm 2 for 60 s was applied.
  • the thus electroplated copper layer was investigated by profilometry inspection with a Dektak 3, Veeco Instruments Inc.
  • the height difference between the patterned area (distance a) and unpatterned area (distance b) was measured for both areas (i) and (ii).
  • Fig. 5a shows the profilometry results for area (i) without using a leveling agent
  • Fig. 5b shows the results for area (ii).
  • Both, figs. 5a and 5b show a higher copper deposit over the pattererned area compared to the unpatterned area.
  • Figs. 5a and 5b show a significant mounding.
  • the measured values for the 0.130 micrometer and 0.250 micrometer featured area are listed in table 2.
  • example 11 The procedure of example 11 was repeated except that 1 ml/I of a stock solution containing 1 % (w/w) of the active leveling agent of example 1 was added to the plating bath.
  • a copper layer was electroplated onto a wafer substrate as described in example 11.
  • the thus electroplated copper layer was investigated by profilometry as described in example 11.
  • Fig. 6a shows the profilometry results for area (i) using the leveling agent from example 1.
  • Fig. 6b shows the results for area (ii). Both, Figs. 6a and 6b show essentially no mounding over the patterned area compared to the unpatterned area. The measured values for the 0.130 micrometer and 0.250 micrometer featured area are listed in table 2.
  • a copper layer was electroplated onto a wafer substrate as described in example 11.
  • the thus electroplated copper layer was investigated by profilometry as described in example 11.
  • a copper layer was electroplated onto a wafer substrate as described in example 11.
  • the thus electroplated copper layer was investigated by profilometry as described in example 11.
  • a copper layer was electroplated onto a wafer substrate as described in example 11.
  • the thus electroplated copper layer was investigated by profilometry as described in example 11.
  • a copper layer was electroplated onto a wafer substrate as described in example 11.
  • the thus electroplated copper layer was investigated by profilometry as described in example 11.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108350590A (zh) * 2016-03-18 2018-07-31 韩国生产技术研究院 用于形成高平整度镀铜膜的电镀铜用有机添加剂及包含该添加剂的电镀铜液

Families Citing this family (1)

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TWI464305B (zh) * 2012-11-02 2014-12-11 Nat Univ Chung Hsing (TSV) electroplated copper filler inhibitor and electroplating copper filling formula

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB755478A (en) * 1953-08-14 1956-08-22 Ici Ltd Water-soluble organic nitrogen compounds
GB1045684A (en) * 1962-05-12 1966-10-19 Hoechst Ag Rust preventing primer compositions
US3428576A (en) 1965-11-26 1969-02-18 Ici Ltd Manufacture of polymeric diguanides
US4403078A (en) 1982-09-07 1983-09-06 Texaco Inc. Epoxy resin composition
GB2123856A (en) * 1982-01-12 1984-02-08 Kelco Ail Int Ltd Printing on pretreated substrates
WO1992001380A1 (en) * 1990-07-18 1992-02-06 Imperial Chemical Industries Plc Biocide composition
US5741886A (en) 1995-09-19 1998-04-21 Stockel; Richard F. End-capped polymeric biguanides
GB2341092A (en) * 1998-09-07 2000-03-08 Macgregor Keith Martin Algae-removing composition
JP2000284240A (ja) * 1999-03-31 2000-10-13 Kuraray Co Ltd コンタクトレンズ用液剤
JP2002126051A (ja) * 2000-08-16 2002-05-08 Kuraray Co Ltd コンタクトレンズ用液剤
KR20050023927A (ko) * 2003-09-03 2005-03-10 에스케이케미칼주식회사 중화 공정을 이용한 폴리알킬렌바이구아니딘염의 제조 방법
US20060147549A1 (en) * 2004-12-30 2006-07-06 Grab Lawrence A Methods and compositions for reducing population of plant pathogen
WO2007118985A1 (fr) * 2006-04-06 2007-10-25 Technologies Moleculaires (Tecmo) Inhibiteurs conditionnels tensioactifs pour le dépot electrolytique du cuivre sur une surface
EP2067882A1 (de) * 2006-09-08 2009-06-10 Nippon Paint Co., Ltd. Verfahren zur behandlung der oberfläche einer metallbasis, nach dem oberflächenbehandlungsverfahren behandeltes metallisches material und verfahren zum beschichten des metallischen materials
WO2010069810A1 (en) 2008-12-19 2010-06-24 Basf Se Composition for metal electroplating comprising leveling agent
WO2010115796A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115717A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115757A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115756A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB755478A (en) * 1953-08-14 1956-08-22 Ici Ltd Water-soluble organic nitrogen compounds
GB1045684A (en) * 1962-05-12 1966-10-19 Hoechst Ag Rust preventing primer compositions
US3428576A (en) 1965-11-26 1969-02-18 Ici Ltd Manufacture of polymeric diguanides
GB2123856A (en) * 1982-01-12 1984-02-08 Kelco Ail Int Ltd Printing on pretreated substrates
US4403078A (en) 1982-09-07 1983-09-06 Texaco Inc. Epoxy resin composition
WO1992001380A1 (en) * 1990-07-18 1992-02-06 Imperial Chemical Industries Plc Biocide composition
US5741886A (en) 1995-09-19 1998-04-21 Stockel; Richard F. End-capped polymeric biguanides
GB2341092A (en) * 1998-09-07 2000-03-08 Macgregor Keith Martin Algae-removing composition
JP2000284240A (ja) * 1999-03-31 2000-10-13 Kuraray Co Ltd コンタクトレンズ用液剤
JP2002126051A (ja) * 2000-08-16 2002-05-08 Kuraray Co Ltd コンタクトレンズ用液剤
KR20050023927A (ko) * 2003-09-03 2005-03-10 에스케이케미칼주식회사 중화 공정을 이용한 폴리알킬렌바이구아니딘염의 제조 방법
US20060147549A1 (en) * 2004-12-30 2006-07-06 Grab Lawrence A Methods and compositions for reducing population of plant pathogen
WO2007118985A1 (fr) * 2006-04-06 2007-10-25 Technologies Moleculaires (Tecmo) Inhibiteurs conditionnels tensioactifs pour le dépot electrolytique du cuivre sur une surface
EP2067882A1 (de) * 2006-09-08 2009-06-10 Nippon Paint Co., Ltd. Verfahren zur behandlung der oberfläche einer metallbasis, nach dem oberflächenbehandlungsverfahren behandeltes metallisches material und verfahren zum beschichten des metallischen materials
WO2010069810A1 (en) 2008-12-19 2010-06-24 Basf Se Composition for metal electroplating comprising leveling agent
WO2010115796A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115717A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115757A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115756A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EAST G C ET AL: "Polybiguanides: synthesis and characterization of polybiguanides containing hexamethylene groups", POLYMER, ELSEVIER SCIENCE PUBLISHERS B.V, GB, vol. 38, no. 15, 1 July 1997 (1997-07-01), pages 3973 - 3984, XP004761489, ISSN: 0032-3861, DOI: 10.1016/S0032-3861(96)00969-X *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108350590A (zh) * 2016-03-18 2018-07-31 韩国生产技术研究院 用于形成高平整度镀铜膜的电镀铜用有机添加剂及包含该添加剂的电镀铜液

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