EP2462615A1 - Ohmic connection using widened connection zones in a portable electronic object - Google Patents

Ohmic connection using widened connection zones in a portable electronic object

Info

Publication number
EP2462615A1
EP2462615A1 EP10757235A EP10757235A EP2462615A1 EP 2462615 A1 EP2462615 A1 EP 2462615A1 EP 10757235 A EP10757235 A EP 10757235A EP 10757235 A EP10757235 A EP 10757235A EP 2462615 A1 EP2462615 A1 EP 2462615A1
Authority
EP
European Patent Office
Prior art keywords
chip
connection
connection areas
active face
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10757235A
Other languages
German (de)
French (fr)
Inventor
Yannick Grasset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RFIDEAL
Original Assignee
RFIDEAL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RFIDEAL filed Critical RFIDEAL
Publication of EP2462615A1 publication Critical patent/EP2462615A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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Definitions

  • the present invention relates to portable electronic objects in particular without contact comprising, on the one hand, an integrated circuit chip and, on the other hand, a support carrying connection terminals, for example terminals of a circuit of antenna.
  • the invention further relates to a method of manufacturing such objects.
  • the portable electronic objects according to the invention are card-format objects, called smart cards, having a mode of operation with contacts and / or a mode of operation without contact, or, objects of various formats, for example for radio frequency identification. These last objects of various formats are commonly called electronic tags ("tags” in English) or “hearts” (“inlay” in English).
  • the integrated circuit chip is generally in the form of a parallelepiped whose face, called active face, carries contact pads. These contact pads have very small dimensions relative to the surface of the active face.
  • the active face of the chip is substantially square of 600 ⁇ m side and the contact pads, two in number, are themselves in a generally square shape, 80 microns side. It is therefore possible to consider that the contact pads are quasi-point connection areas to the active face of the chip.
  • the connection of an integrated circuit chip according to the prior art to the antenna circuit is likely to be achieved by capacitive coupling, or else by ohmic contact.
  • connection of a chip to the antenna circuit by capacitive coupling is only possible for certain non-contact portable objects, operating at relatively high frequencies, from a few hundred MHz. Capacitive coupling can not be implemented in DC-powered objects. Moreover, in the case of a capacitive coupling, the antenna is specific, because of the modification of the impedance provided by the connection capacity.
  • connection is made by ohmic contact, or the connection is made by means of connection son connected, on the one hand, to the contact pads and, on the other hand, to the antenna terminals, or the connection is made to means of protuberances ("bumps" in English).
  • connection wires The technology for manufacturing non-contact portable objects, in which the chip is electrically connected to the antenna circuit by ohmic contact by means of connection wires, is well controlled, but has certain drawbacks. For each lead wire, two welds are required, a first solder at the connection pad and a second one at an antenna terminal. As a result, the production rates of the objects are relatively low. In addition, the chip thus connected by the connection son must be embedded in a protective resin, which increases the thickness of the object at the chip location.
  • the technology for manufacturing non-contact portable objects in which the chip is electrically connected to the antenna circuit by ohmic contact by means of protuberances, is likewise well controlled but delicate implementation and has some disadvantages.
  • the protuberances P1, P2 are small balls of gold or pyramids of 20 to 50 ⁇ m in diameter (balls) or on the side (pyramids) deposited on the contact pads 7-1 , 7-2, to allow an ohmic contact connection to the antenna circuit 5, by contact, either direct, between the protrusion and the antenna, or by means of a conductive adhesive.
  • the chip 1 is flipped over in the support 6.
  • the tolerance to the positioning of the chip 1 on its support 6 provided with the antenna circuit 5 is low, which slows down the production rates of the objects.
  • the required control of the positioning for the connection of an integrated circuit, flip-chip assembled on a support having an antenna is of the order of 15 to 20 micrometers.
  • a problem to be solved by the invention is to produce portable electronic objects, in particular without contact, in which the chip is connected to the connection terminals of a circuit, in particular a circuit of antenna, in flip-chip, by ohmic contact, without requiring a connection by means of small protuberances.
  • the solution of the invention to this problem posed has for its first object a contactless portable object comprising, on the one hand, an integrated circuit chip and, on the other hand, a support having two connection terminals of a circuit, characterized in that the chip is provided at its active face with two enlarged connection areas, said connection areas being positioned with respect to said terminals and electrically connected, by ohmic contact, to these, and in that the area defined by the areas of connection to the active face of the circuit integrated bearing said connection areas is greater than 1/2 of the surface of this face.
  • connection areas to the active face of the chip, the area defined by said connection areas to the active face of the integrated circuit carrying said connection areas being larger than
  • the chip reported in flip-chip on the support, is not provided with protuberances but widened connection areas. Given the dimensions defined by said widened connection areas, the connection is ensured with positioning constraints of the chip on the support significantly reduced compared to existing constraints in the case of a postponement of a chip with protuberances.
  • FIG. 1A schematizes, in section, a portable object according to the prior art, in which a chip provided with protuberances is carried by flip-chip on a support carrying an antenna circuit;
  • FIG. 1B shows schematically, in section, a portable object according to the invention in which the chip is provided with large connection plates forming enlarged connection areas;
  • FIGS. 2A and 2B illustrate two embodiments of the invention comprising enlarged connection zones according to the invention;
  • FIG. 3A illustrates, in plan view, the positioning constraints of a chip provided with protrusions carried by flip-chip on an antenna support, for the manufacture of a portable object according to the prior art
  • FIG. 3B illustrates, in a view from above, the slight positioning constraints that exist in the case of the manufacture of a portable object according to the invention, according to which the chip is provided with large plates forming enlarged connection areas.
  • the invention relates to portable electronic objects.
  • portable electronic objects are, for example, smart cards, whose format is standardized, including subscriber identification modules.
  • the portable electronic objects according to the invention are capable of having a mode of operation with contacts and / or without contact. In the case where said objects have both a mode of operation with contacts and a mode of operation without contacts, these objects are called mixed, hybrid or dual mode.
  • the portable objects are objects having a mode of operation without contact, and which operate at the high frequency of 13.56 MHz or ultra high frequencies between 860 and 960 MHz . However, they may be objects operating at any frequency. It can even be objects operating with direct current.
  • the portable objects according to the invention comprise a chip. This chip is a substantially parallelepiped integrated circuit chip of reduced dimensions.
  • the portable objects according to the invention further comprise a support carrying a circuit, for example an antenna circuit having two connection terminals.
  • the support is a dielectric support, for example made of paper, cardboard, PET, PVC or polyimide.
  • the support is an epoxy type carrier carrying metallizations. In these other embodiments, wells are provided in the epoxy-type support for connection to the metallizations by their rear face.
  • connection circuit When the connection circuit is an antenna circuit, it defines a track on the object carrier, the terminal ends of which constitute the connection terminals.
  • the antenna circuit referred to without the invention must therefore be considered in the broad sense to include conventional antenna circuits, as well as antenna primers and conductive bridges ("strap" in English). In the latter case, the JEDEC MO283 standard defines an example of strap likely to constitute an antenna circuit according to the invention.
  • the antenna circuit according to the invention is for example printed on the surface of the support, in particular by screen printing, flexography or gravure, offset or ink jet.
  • the conductive ink used is preferably a polymer ink loaded with conducting elements such as silver, copper or carbon.
  • the antenna circuit consists of a stamped metal strip laminated to the surface of the support or a wound wire.
  • the chip 1 of the portable object 2 according to the invention is provided with at its active face 3, two enlarged connection areas, for example conductive continuous connecting plates 4-1, 4-2 over the entire surface thereof. These plates 4-1, 4-2 are positioned opposite the terminals 5-1, 5-2 of the antenna circuit 5 that carries the support 6. As a result, the chip 1 is postponed returned for its positioning on the support 6.
  • the plates 4-1, 4-2 are formed of conductive material. This is for example a metal deposit or an alloy of the aluminum, copper, gold, AlSi or other type.
  • the surface of the active face 3 of the chip optionally carries contact pads 7-1, 7-2 flush through a passivation layer of said chip 1, and according to which said active face is further provided.
  • the chips 1 used according to the invention are advantageously conventional chips, produced by founders, and which could equally well be used for the manufacture of portable objects according to the prior art, but which are subjected to a post-treatment according to the invention, by depositing an insulating layer and the connecting plates.
  • connection areas 4-1, 4-2, at the active face 3 of the integrated circuit 1 carrying said connection zones is greater than 1/2 of the surface of this face 3.
  • the sum ⁇ of the surface ⁇ Xl x ⁇ Yl defined by the zone 4-1 added to that ⁇ X2 x ⁇ Y2 defined by the zone 4-2 is greater than 1/2 of the surface of the face active chip.
  • the bumps may be according to the invention of non-conventional shapes such as rectangular, L-shaped, serpentine, spiral, whose grip on the chip would have a surface close to the size of the plates.
  • the widened connection zones may be discontinuous. It may for example be a set of conductive lines defining enlarged connection areas.
  • the widened connection areas are plates, on the surface of which a plurality of protuberances dispersed on the plates are carried to provide a connection at multiple points.
  • connection areas have a thickness of between 5 and 25 microns.
  • thickness of a connection plate is of the order of 12 microns.
  • connection areas widened to the active face of the integrated circuit carrying said zones is greater than or equal to 2/3 of the surface of this face.
  • the active face of the chip is square 300 to 800 ⁇ m side.
  • the area of the active face is between 0.09 mm 2 and 0.64 mm 2.
  • the area defined by the connection areas will for example be substantially rectangular. It will cover 2/3 or more of the surface of the active face.
  • the chip 1 is advantageously bonded to the support 5 by means of an insulating glue or anisotropic Z conductor ensuring the electrical connection between the connection areas 4-1, 4-2 and the antenna terminals 5-1. , 5-2.
  • the chip is glued to the support by means of an insulating glue. In these latter embodiments, the electrical connection between the widened connection areas and the antenna terminals is ensured by a direct contact between the widened connection areas and the antenna terminals.
  • an integrated circuit chip having an active face provided with two contact pads.
  • An insulator is deposited on this active face so that the contact pads are not covered by said insulator.
  • the widened connection areas according to the invention are positioned so that they cover half or two thirds of the surface of this active face. The widened connection areas are electrically connected to the contact pads.
  • a support provided with an antenna circuit is then provided, two terminals of which are situated close to each other, and a Z-conducting insulating or anisotropic adhesive is then deposited on the support at the terminals.
  • the chip provided with widened connection areas, is then turned over and positioned on the support so that the connection areas are positioned opposite the antenna terminals.
  • the chip is identical to the state of the art bonded to the support by means of the insulating glue or anisotropic.
  • the connection between the chip and the antenna circuit is of the ohmic type.
  • FIGS. 3A and 3B it appears that the positioning constraints of a chip 1 on its support 5 are much smaller, according to the invention (FIG. 3A), compared to the prior art (FIG. Figure 3B).
  • FIG. 3B shows that, even with a small proportion of connection zone with respect to the antenna, contact is always ensured on both areas connecting to the antenna.
  • the positioning tolerance of the chip is thus very wide according to the invention.
  • FIG. 3A shows the limitation due to quasi-point contacts on the integrated circuit side. The positioning constraints are much stronger, according to the prior art, than according to the invention.
  • the distance which separates the zones of enlarged connection, advantageously the large plates, on the integrated circuit can be separated by only 100 microns for example.
  • a dispersion of the positioning of plus or minus 50 ⁇ m around the nominal position will have no effect on the contact on this axis.
  • the use of an antenna connector about 100 ⁇ m wider than the integrated circuit will allow a dispersion of plus or minus 50 microns around the nominal position thus has no effect on the contact on this second axis.
  • the usual protruding techniques require the control of the positioning to plus or minus 20 microns and they impact the electrical performance by strong dispersions.
  • the present invention allows to considerably relax the positioning tolerances. For plus or minus 35 to 60 ⁇ m of dispersion around the nominal position, the assembly of the integrated circuit using expanded contacts will not undergo dispersion of its performance. In addition, an extension of the positioning tolerances beyond 35 to 60 ⁇ m is possible.
  • connection plates according to the invention allows an ohmic connection on a surface much greater than that of the prior art. It The result is that, statistically, the connection being made on a large surface, it will be on the one hand of much better quality and on the other hand the guarantee of connection will be only much higher.
  • the dispersions due to the parasites are minimized.
  • the degrees of freedom for the design and optimization of the antennas are greater, allowing a better energy reception and therefore a better function in the case of a weak field.
  • connection terminals of the circuit are formed, for example, by the rear contact terminals of the metallizations of a micromodule intended to be incorporated in a card body in the standard format of smart cards or in SIM format. The micromodule will then be extra-fine.

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Abstract

The invention relates to portable electronic objects comprising an integrated circuit chip (1), and a mounting (6) having two connection terminals (5-1, 5-2) for a circuit (5), as well as to a method for manufacturing such objects. The invention is characterized in that the chip is provided, on the active surface thereof, with two widened connection zones (4-1, 4-2), in particular connection plates, said connection plates being positioned opposite said terminals and electrically connected, by ohmic contact, to the latter, and in that the surface defined by the connection plates, at the surface of the active integrated circuit having said plates, is greater than 1/2 of the surface of said surface. The invention can be used, in particular, for RFID objects.

Description

CONNEXION OHMIQUE AU MOYEN DE ZONES DE CONNEXION ELARGIES DANS UN OBJET ELECTRONIQUE PORTATIF OHMIC CONNECTION USING ENLARGED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT
La présente invention concerne des objets électroniques portatifs notamment sans contact comportant, d'une part, une puce à circuit intégré et, d'autre part, d'un support portant des bornes de connexion, par exemple des bornes d'un circuit d'antenne. L'invention concerne en outre un procédé de fabrication de tels objets. The present invention relates to portable electronic objects in particular without contact comprising, on the one hand, an integrated circuit chip and, on the other hand, a support carrying connection terminals, for example terminals of a circuit of antenna. The invention further relates to a method of manufacturing such objects.
Les objets électroniques portatifs selon l'invention sont des objets au format carte, dits cartes à puce, disposant d'un mode de fonctionnement à contacts et/ou d'un mode de fonctionnement sans contact, ou alors, des objets de formats variés, par exemple destinés à une identification par radiofréquences . On dénomme couramment ces derniers objets de formats variés des étiquettes électroniques (« tag » en langue anglaise) ou des cœurs d'objets (« inlay » en langue anglaise) .  The portable electronic objects according to the invention are card-format objects, called smart cards, having a mode of operation with contacts and / or a mode of operation without contact, or, objects of various formats, for example for radio frequency identification. These last objects of various formats are commonly called electronic tags ("tags" in English) or "hearts" ("inlay" in English).
Dans les objets électroniques portatifs de l'art antérieur, la puce à circuit intégré se présente généralement sous la forme d'un parallélépipède dont une face, appelée face active, porte des plages de contact. Ces plages de contact ont des dimensions très réduites par rapport à la surface de la face active. Dans un exemple, la face active de la puce est sensiblement carré de 600 μm de côté et les plages de contact, au nombre de deux, se présentent elles-mêmes sous une forme généralement carré, de 80 μm de côté. Il est de ce fait possible de considérer que les plages de contact constituent des zones de connexion quasi-ponctuelles à la face active de la puce.  In the portable electronic objects of the prior art, the integrated circuit chip is generally in the form of a parallelepiped whose face, called active face, carries contact pads. These contact pads have very small dimensions relative to the surface of the active face. In one example, the active face of the chip is substantially square of 600 μm side and the contact pads, two in number, are themselves in a generally square shape, 80 microns side. It is therefore possible to consider that the contact pads are quasi-point connection areas to the active face of the chip.
Lorsque l'objet est un objet portatif sans contact, la connexion d'une puce à circuit intégré selon l'art antérieur au circuit d'antenne est susceptible d'être réalisée par couplage capacitif, ou alors, par contact ohmique . When the object is a non-contact portable object, the connection of an integrated circuit chip according to the prior art to the antenna circuit is likely to be achieved by capacitive coupling, or else by ohmic contact.
La connexion d'une puce au circuit d'antenne par couplage capacitif n'est possible que pour certains objets portatifs sans contact, fonctionnant à des fréquences relativement hautes, à partir de quelques centaines de MHz . Le couplage capacitif ne peut pas être mis en œuvre dans des objets fonctionnant à courant continu. Par ailleurs, dans le cas d'un couplage capacitif, l'antenne est spécifique, à cause de la modification de l'impédance apportée par la capacité de liaison.  The connection of a chip to the antenna circuit by capacitive coupling is only possible for certain non-contact portable objects, operating at relatively high frequencies, from a few hundred MHz. Capacitive coupling can not be implemented in DC-powered objects. Moreover, in the case of a capacitive coupling, the antenna is specific, because of the modification of the impedance provided by the connection capacity.
Lorsque la connexion est réalisée par contact ohmique, soit la connexion est réalisée au moyen de fils de connexion connectés, d'une part, aux plages de contact et, d'autre part, aux bornes d'antenne, soit la connexion est réalisée au moyen de protubérances (« bumps » en langue anglaise) .  When the connection is made by ohmic contact, or the connection is made by means of connection son connected, on the one hand, to the contact pads and, on the other hand, to the antenna terminals, or the connection is made to means of protuberances ("bumps" in English).
La technologie de fabrication des objets portatifs sans contact, dans lesquels la puce est électriquement connectée au circuit d'antenne par contact ohmique au moyen de fils de connexion, est bien maitrisée, mais présente certains inconvénients. Pour chaque fil de connexion, deux soudures sont nécessaires, une première soudure au niveau de la plage de connexion et une seconde, au niveau d'une borne d'antenne. De ce fait, les cadences de fabrication des objets sont relativement faibles. En outre, la puce ainsi connectée par les fils de connexion doit être englobée dans une résine de protection, ce qui accroit l'épaisseur de l'objet à l'endroit de la puce.  The technology for manufacturing non-contact portable objects, in which the chip is electrically connected to the antenna circuit by ohmic contact by means of connection wires, is well controlled, but has certain drawbacks. For each lead wire, two welds are required, a first solder at the connection pad and a second one at an antenna terminal. As a result, the production rates of the objects are relatively low. In addition, the chip thus connected by the connection son must be embedded in a protective resin, which increases the thickness of the object at the chip location.
La technologie de fabrication des objets portatifs sans contact, dans lesquels la puce est électriquement connectée au circuit d'antenne par contact ohmique au moyen de protubérances, est de même bien maîtrisée mais de mise en œuvre délicate et présente certains inconvénients. Ainsi que cela est montré à la figure IA, les protubérances Pl, P2 sont de petites boules d'or ou des pyramides de 20 à 50 μm de diamètre (boules) ou de côté (pyramides) déposées sur les plages de contact 7-1, 7-2, pour autoriser une connexion par contact ohmique au circuit d'antenne 5, par contact, soit direct, entre la protubérance et l'antenne, soit par l'intermédiaire d'une colle conductrice. La puce 1 est donc retournée (« flip- chip, en langue anglaise) sur le support 6. Il apparaît donc que la tolérance au positionnement de la puce 1 sur son support 6 muni du circuit d'antenne 5 est faible, ce qui ralentit les cadences de fabrication des objets. Selon l'état de l'art, la maîtrise requise du positionnement pour la connexion d'un circuit intégré, assemblé en flip-chip sur un support disposant d'une antenne est de l'ordre de 15 à 20 micromètres. The technology for manufacturing non-contact portable objects, in which the chip is electrically connected to the antenna circuit by ohmic contact by means of protuberances, is likewise well controlled but delicate implementation and has some disadvantages. As is shown in FIG. 1A, the protuberances P1, P2 are small balls of gold or pyramids of 20 to 50 μm in diameter (balls) or on the side (pyramids) deposited on the contact pads 7-1 , 7-2, to allow an ohmic contact connection to the antenna circuit 5, by contact, either direct, between the protrusion and the antenna, or by means of a conductive adhesive. The chip 1 is flipped over in the support 6. It therefore appears that the tolerance to the positioning of the chip 1 on its support 6 provided with the antenna circuit 5 is low, which slows down the production rates of the objects. According to the state of the art, the required control of the positioning for the connection of an integrated circuit, flip-chip assembled on a support having an antenna is of the order of 15 to 20 micrometers.
Compte tenu de ce qui précède, un problème que se propose de résoudre l'invention est de réaliser des objets électroniques portatifs, notamment sans contact, dans lesquels la puce est connectée aux bornes de connexion d'un circuit, notamment d'un circuit d'antenne, en flip-chip, par contact ohmique, sans nécessiter une connexion au moyen de petites protubérances .  In view of the foregoing, a problem to be solved by the invention is to produce portable electronic objects, in particular without contact, in which the chip is connected to the connection terminals of a circuit, in particular a circuit of antenna, in flip-chip, by ohmic contact, without requiring a connection by means of small protuberances.
La solution de l'invention à ce problème posé a pour premier objet un objet portatif sans contact comportant, d'une part, une puce à circuit intégré et, d'autre part, d'un support présentant deux bornes de connexion d'un circuit, caractérisé en ce que la puce est munie, à sa face active, de deux zones de connexion élargies, lesdites zones de connexion étant positionnées au regard desdites bornes et connectées électriquement, par contact ohmique, à celles-ci, et en ce que la surface définie par les zones de connexion à la face active du circuit intégré portant lesdites zones de connexion est supérieure à 1/2 de la surface de cette face. The solution of the invention to this problem posed has for its first object a contactless portable object comprising, on the one hand, an integrated circuit chip and, on the other hand, a support having two connection terminals of a circuit, characterized in that the chip is provided at its active face with two enlarged connection areas, said connection areas being positioned with respect to said terminals and electrically connected, by ohmic contact, to these, and in that the area defined by the areas of connection to the active face of the circuit integrated bearing said connection areas is greater than 1/2 of the surface of this face.
Elle a pour second objet un procédé de fabrication d'un objet électronique portatif comportant les étapes de :  It has the second object a method of manufacturing a portable electronic object comprising the steps of:
fourniture d'une puce à circuit intégré présentant une face active et d'un support présentant deux bornes de connexion d'un circuit ;  providing an integrated circuit chip having an active face and a carrier having two connection terminals of a circuit;
fourniture de deux zones de connexion élargies à la face active de la puce, la surface définie par lesdites zones de connexion à la face active du circuit intégré portant lesdites zones de connexion étant supérieure à providing two enlarged connection areas to the active face of the chip, the area defined by said connection areas to the active face of the integrated circuit carrying said connection areas being larger than
1/2 de la surface de cette face ; et de 1/2 of the surface of this face; and of
retournement de la puce avec connexion électrique des zones de connexion, par contact ohmique, aux bornes du circuit.  reversal of the chip with electrical connection of the connection areas, by ohmic contact, across the circuit.
Ainsi, la puce, reportée en flip-chip sur le support, n'est pas munie de protubérances mais de zones de connexion élargies. Compte tenu des dimensions définies par lesdites zones de connexion élargies, la connexion est assurée avec des contraintes de positionnement de la puce sur le support considérablement diminuées par rapport aux contraintes existantes dans le cas d'un report d'une puce avec protubérances.  Thus, the chip, reported in flip-chip on the support, is not provided with protuberances but widened connection areas. Given the dimensions defined by said widened connection areas, the connection is ensured with positioning constraints of the chip on the support significantly reduced compared to existing constraints in the case of a postponement of a chip with protuberances.
L'invention sera mieux comprise à la lecture de la description non limitative qui suit, rédigée au regard des dessins annexés, dans lesquels :  The invention will be better understood on reading the nonlimiting description which follows, written with reference to the appended drawings, in which:
la figure IA schématise, en coupe, un objet portatif selon l'art antérieur, dans lequel une puce munie de protubérances est reportée par flip-chip sur un support portant un circuit d'antenne ;  FIG. 1A schematizes, in section, a portable object according to the prior art, in which a chip provided with protuberances is carried by flip-chip on a support carrying an antenna circuit;
la figure IB schématise, en coupe, un objet portatif selon l'invention dans lequel la puce est munie de grandes plaques de connexion formant des zones de connexion élargies ; les figures 2A et 2B illustrent deux modes de réalisation de l'invention comportant des zones de connexion élargies selon l'invention ; FIG. 1B shows schematically, in section, a portable object according to the invention in which the chip is provided with large connection plates forming enlarged connection areas; FIGS. 2A and 2B illustrate two embodiments of the invention comprising enlarged connection zones according to the invention;
la figure 3A illustre, en vue de dessus, les contraintes de positionnement d'une puce munie de protubérances reportée par flip-chip sur un support d'antenne, pour la fabrication d'un objet portatif selon l'art antérieur ; et  FIG. 3A illustrates, in plan view, the positioning constraints of a chip provided with protrusions carried by flip-chip on an antenna support, for the manufacture of a portable object according to the prior art; and
la figure 3B illustre, en vue de dessus, les faibles contraintes de positionnement qui existent dans le cas de la fabrication d'un objet portatif selon l'invention, selon lequel la puce est munie de grandes plaques formant des zones de connexion élargies.  FIG. 3B illustrates, in a view from above, the slight positioning constraints that exist in the case of the manufacture of a portable object according to the invention, according to which the chip is provided with large plates forming enlarged connection areas.
L'invention concerne des objets électroniques portatifs. De tels objets électroniques portatifs sont par exemple des cartes à puce, dont le format est normalisé, y compris des modules d'identification abonné The invention relates to portable electronic objects. Such portable electronic objects are, for example, smart cards, whose format is standardized, including subscriber identification modules.
(SIM ou « Subscriber Identification Modules » en langue anglaise) ou alors des objets de format variés tels que des étiquettes électroniques ou des cœurs d'objets. Les objets électroniques portatifs selon l'invention sont susceptible de disposer d'un mode de fonctionnement à contacts et/ou sans contact. Dans le cas où lesdits objets disposent à la fois d'un mode de fonctionnement à contacts et d'un mode de fonctionnement sans contacts, ces objets sont dits mixtes, hybrides ou dual mode. Dans un mode de réalisation particulier selon l'invention, les objets portatifs sont des objets disposant d'un mode de fonctionnement sans contact, et qui fonctionnent à la fréquence haute de 13,56 MHz ou aux ultra hautes fréquences comprises entre 860 et 960 MHz. Il peut toutefois s'agir d'objets fonctionnant à des fréquences quelconques. Il peut même s'agir d'objets fonctionnant à courant continu. Les objets portatifs selon l'invention comportent une puce. Cette puce est une puce à circuit intégré sensiblement parallélépipédique de dimensions réduites. (SIM or "Subscriber Identification Modules" in English) or else various format objects such as electronic tags or object cores. The portable electronic objects according to the invention are capable of having a mode of operation with contacts and / or without contact. In the case where said objects have both a mode of operation with contacts and a mode of operation without contacts, these objects are called mixed, hybrid or dual mode. In a particular embodiment according to the invention, the portable objects are objects having a mode of operation without contact, and which operate at the high frequency of 13.56 MHz or ultra high frequencies between 860 and 960 MHz . However, they may be objects operating at any frequency. It can even be objects operating with direct current. The portable objects according to the invention comprise a chip. This chip is a substantially parallelepiped integrated circuit chip of reduced dimensions.
Les objets portatifs selon l'invention comportent en outre un support portant un circuit, par exemple un circuit d'antenne présentant deux bornes de connexion. Dans certains modes de réalsiation, le support est un support diélectrique par exemple réalisé en papier, en carton, en PET, PVC ou polyimide. Dans d'autres modes de réalisation, le support est un support du type époxy portant des métallisations . Dans ces autres modes de réalisation, des puits sont ménagés dans le support du type époxy pour une connexion aux métallisations par leur face arrière.  The portable objects according to the invention further comprise a support carrying a circuit, for example an antenna circuit having two connection terminals. In some embodiments, the support is a dielectric support, for example made of paper, cardboard, PET, PVC or polyimide. In other embodiments, the support is an epoxy type carrier carrying metallizations. In these other embodiments, wells are provided in the epoxy-type support for connection to the metallizations by their rear face.
Lorsque le circuit de connexion est un circuit d'antenne, il définit une piste sur le support d'objet, dont les extrémités terminales constituent les bornes de connexion. Le circuit d'antenne visé sans l'invention doit de ce fait être considéré au sens large comme incluant des circuits d'antenne classiques, ainsi que des amorces d'antenne et des ponts conducteurs (« strap », en langue anglaise) . Dans ce dernier cas, la norme JEDEC MO283 définit un exemple de strap susceptible de constituer un circuit d'antenne selon l'invention.  When the connection circuit is an antenna circuit, it defines a track on the object carrier, the terminal ends of which constitute the connection terminals. The antenna circuit referred to without the invention must therefore be considered in the broad sense to include conventional antenna circuits, as well as antenna primers and conductive bridges ("strap" in English). In the latter case, the JEDEC MO283 standard defines an example of strap likely to constitute an antenna circuit according to the invention.
Le circuit d'antenne selon l'invention est par exemple imprimé à la surface du support, notamment par sérigraphie, flexographie ou héliogravure, offset ou à jet d'encre. L'encre conductrice utilisée est préférentiellement une encre polymère chargée en éléments conducteurs tels que l'argent, le cuivre ou le carbone. Dans un autre exemple, le circuit formant antenne est constituée d'une bande métallique estampée contrecollée à la surface du support voire d'un fil bobiné.  The antenna circuit according to the invention is for example printed on the surface of the support, in particular by screen printing, flexography or gravure, offset or ink jet. The conductive ink used is preferably a polymer ink loaded with conducting elements such as silver, copper or carbon. In another example, the antenna circuit consists of a stamped metal strip laminated to the surface of the support or a wound wire.
Ainsi que cela est schématisé à la figure IB, la puce 1 de l'objet portatif 2 selon l'invention est munie, à sa face active 3, de deux zones de connexion élargies, par exemple des plaques continues de connexion 4-1, 4-2 conductrices sur l'entièreté de leur surface. Ces plaques 4-1, 4-2 sont positionnées au regard des bornes 5-1, 5-2 du circuit d'antenne 5 que porte le support 6. De ce fait, la puce 1 est reportée retournée pour son positionnement sur le support 6. Les plaques 4-1, 4-2 sont formées d'un matériel conducteur. Il s'agit par exemple d'un dépôt métallique ou d'un alliage du type aluminium, cuivre, or, AlSi ou autre. As is schematized in FIG. 1B, the chip 1 of the portable object 2 according to the invention is provided with at its active face 3, two enlarged connection areas, for example conductive continuous connecting plates 4-1, 4-2 over the entire surface thereof. These plates 4-1, 4-2 are positioned opposite the terminals 5-1, 5-2 of the antenna circuit 5 that carries the support 6. As a result, the chip 1 is postponed returned for its positioning on the support 6. The plates 4-1, 4-2 are formed of conductive material. This is for example a metal deposit or an alloy of the aluminum, copper, gold, AlSi or other type.
Par ailleurs, la surface de la face active 3 de la puce porte éventuellement des plages de contact 7-1, 7-2 affleurantes au travers d'une couche de passivation de ladite puce 1, et selon lequel ladite face active est en outre munie d'une couche d'isolant 8 portant les plaques de connexion 4-1, 4-2 connectées aux plages de contact 7- 1, 7-2. Aussi, les puces 1 utilisées selon l'invention sont avantageusement des puces classiques, produites par des fondeurs, et qui pourraient tout aussi bien être utilisées pour la fabrication d'objets portatifs selon l'art antérieur, mais auxquelles on fait subir un posttraitement selon l'invention, en déposant une couche d'isolant et les plaques de connexion.  Furthermore, the surface of the active face 3 of the chip optionally carries contact pads 7-1, 7-2 flush through a passivation layer of said chip 1, and according to which said active face is further provided. an insulating layer 8 carrying the connecting plates 4-1, 4-2 connected to the contact pads 7-1, 7-2. Also, the chips 1 used according to the invention are advantageously conventional chips, produced by founders, and which could equally well be used for the manufacture of portable objects according to the prior art, but which are subjected to a post-treatment according to the invention, by depositing an insulating layer and the connecting plates.
Ainsi que cela apparaît aux figures 2A et 2B, la surface définie par les zones de connexion élargies 4-1, 4-2, à la face active 3 du circuit intégré 1 portant lesdites zones de connexion, est supérieure à 1/2 de la surface de cette face 3. Autrement dit, la somme Σ de la surface δXl x δYl définie par la zone 4-1 ajoutée à celle δX2 x δY2 définie par la zone 4-2 est supérieure à 1/2 de la surface de la face active de la puce. Lorsque les zones de connexion sont des plaques continues, ainsi que cela est le cas à la figure 2A, la surface définie par une zone est donc confondue avec la surface de la plaque. Dans le mode de réalisation de la figure 2B ; les zone de connexion sont des plaques continues, sur lesquelles on a reporté une pluralité de bumps . On notera que les bumps peuvent être selon l'invention de formes non usuelles tel que rectangulaires, en L, en serpentins, en spirales, dont l'emprise sur la puce aurait une surface proche de la taille des plaques. On notera par ailleurs que, selon des variantes de réalisation de l'invention les zones de connexion élargies peuvent être discontinues. Il peut par exemple s'agir d'un ensemble de lignes conductrices définissant des zones de connexion élargies. Dans d'autres variantes encore, les zones de connexion élargies sont des plaques, à la surface desquelles on reporte une pluralité de protubérances dispersées sur la plaques, pour assurer une connexion en des points multiples. As is apparent from FIGS. 2A and 2B, the area defined by the widened connection areas 4-1, 4-2, at the active face 3 of the integrated circuit 1 carrying said connection zones, is greater than 1/2 of the surface of this face 3. In other words, the sum Σ of the surface δXl x δYl defined by the zone 4-1 added to that δX2 x δY2 defined by the zone 4-2 is greater than 1/2 of the surface of the face active chip. When the connection areas are continuous plates, as is the case in FIG. 2A, the area defined by a zone is thus merged with the surface of the plate. In the embodiment of Figure 2B; the area of connection are continuous plates, on which a plurality of bumps have been reported. It will be noted that the bumps may be according to the invention of non-conventional shapes such as rectangular, L-shaped, serpentine, spiral, whose grip on the chip would have a surface close to the size of the plates. It will furthermore be noted that, according to alternative embodiments of the invention, the widened connection zones may be discontinuous. It may for example be a set of conductive lines defining enlarged connection areas. In still other embodiments, the widened connection areas are plates, on the surface of which a plurality of protuberances dispersed on the plates are carried to provide a connection at multiple points.
Les zones de connexion élargies ont une épaisseur comprise entre 5 et 25 μm. Par exemple, l'épaisseur d'une plaque de connexion est de l'ordre de 12 μm.  The widened connection areas have a thickness of between 5 and 25 microns. For example, the thickness of a connection plate is of the order of 12 microns.
Avantageusement, la surface définie par les zones de connexion élargies à la face active du circuit intégré portant lesdites zones est supérieure ou égale à 2/3 de la surface de cette face.  Advantageously, the area defined by the connection areas widened to the active face of the integrated circuit carrying said zones is greater than or equal to 2/3 of the surface of this face.
Dans un exemple, la face active de la puce est carré 300 à 800 μm de côté. De ce fait, la surface de la face active est comprise entre 0,09 mm2 et 0,64 mm2. Dans ce cas, la surface définie par les zones de connexion sera par exemple sensiblement rectangulaire. Elle couvrira 2/3 ou plus de la surface de la face active.  In one example, the active face of the chip is square 300 to 800 μm side. As a result, the area of the active face is between 0.09 mm 2 and 0.64 mm 2. In this case, the area defined by the connection areas will for example be substantially rectangular. It will cover 2/3 or more of the surface of the active face.
On notera que la puce 1 est avantageusement collée au support 5 au moyen d'une colle soit isolante soit anisotropique conductrice en Z assurant la connexion électrique entre les zones de connexion 4-1, 4-2 et les bornes d'antenne 5-1, 5-2. Dans d'autres modes de réalisation, la puce est collée au support au moyen d'une colle isolante. Dans ces derniers modes de réalisation, la connexion électrique entre les zones de connexion élargies et les bornes d'antennes est assuré par un contact direct entre les zones de connexion élargies et les bornes d'antennes. It will be noted that the chip 1 is advantageously bonded to the support 5 by means of an insulating glue or anisotropic Z conductor ensuring the electrical connection between the connection areas 4-1, 4-2 and the antenna terminals 5-1. , 5-2. In other embodiments, the chip is glued to the support by means of an insulating glue. In these latter embodiments, the electrical connection between the widened connection areas and the antenna terminals is ensured by a direct contact between the widened connection areas and the antenna terminals.
Pour la fabrication d'objets portatifs selon l'invention, on fournit, dans un exemple, une puce à circuit intégré présentant une face active munie de deux plages de contact. On dépose un isolant sur cette face active de manière que les plages de contact ne soient pas recouverte par ledit isolant. Puis, on positionne les zones de connexion élargies selon l'invention de sorte que celles-ci couvrent un demi voire deux tiers de la surface de cette face active. Les zones de connexion élargies sont connectées électriquement aux plages de contact.  For the manufacture of portable objects according to the invention, there is provided, in one example, an integrated circuit chip having an active face provided with two contact pads. An insulator is deposited on this active face so that the contact pads are not covered by said insulator. Then, the widened connection areas according to the invention are positioned so that they cover half or two thirds of the surface of this active face. The widened connection areas are electrically connected to the contact pads.
On fournit ensuite un support muni d'un circuit formant antenne dont deux bornes sont situées à proximité l'une de l'autre et on dépose alors une colle isolante ou anisotropique conductrices en Z sur le support, au niveau des bornes.  A support provided with an antenna circuit is then provided, two terminals of which are situated close to each other, and a Z-conducting insulating or anisotropic adhesive is then deposited on the support at the terminals.
La puce, munie des zones de connexion élargies, est alors retournée et positionnée sur le support de sorte que les zones de connexion soient positionnées au regard des bornes d'antenne. La puce est à l'identique de l'état de l'art collée au support au moyen de la colle isolante ou anisotropique. La connexion entre la puce et le circuit d'antenne est du type ohmique .  The chip, provided with widened connection areas, is then turned over and positioned on the support so that the connection areas are positioned opposite the antenna terminals. The chip is identical to the state of the art bonded to the support by means of the insulating glue or anisotropic. The connection between the chip and the antenna circuit is of the ohmic type.
Si l'on se réfère maintenant aux figures 3A et 3B, il apparaît que les contraintes de positionnement d'une puce 1 sur son support 5 sont bien inférieures, selon l'invention (figure 3A), par rapport à l'art antérieur (figure 3B) .  Referring now to FIGS. 3A and 3B, it appears that the positioning constraints of a chip 1 on its support 5 are much smaller, according to the invention (FIG. 3A), compared to the prior art (FIG. Figure 3B).
En effet, la figure 3B montre que, même avec une faible proportion de zone de connexion au regard de l'antenne, le contact est toujours assuré sur les deux zones assurant la connexion avec l'antenne. La tolérance au positionnement de la puce est ainsi très large selon l'invention. La figure 3A montre quant à elle la limitation due aux contacts quasi ponctuels coté circuit intégré. Les contraintes de positionnement sont nettement plus fortes, selon l'art antérieur, que selon 1' invention. Indeed, FIG. 3B shows that, even with a small proportion of connection zone with respect to the antenna, contact is always ensured on both areas connecting to the antenna. The positioning tolerance of the chip is thus very wide according to the invention. FIG. 3A shows the limitation due to quasi-point contacts on the integrated circuit side. The positioning constraints are much stronger, according to the prior art, than according to the invention.
Ainsi, dans l'hypothèse ou la maitrise de réalisation des antennes nécessite de conserver une distance entre les deux extrémités de l'antenne venant en regard du circuit, de l'ordre de 200 μm, la distance qui sépare les zones de connexion élargie, avantageusement les plaques de grande taille, sur le circuit intégré peut être séparée de seulement 100 μm par exemple. Une dispersion du positionnement de plus ou moins 50 μm autour de la position nominale n'aura aucun effet sur le contact sur cet axe. De même, l'usage d'un connecteur d'antenne d'environ 100 μm plus large que le circuit intégré permettra qu'une dispersion de plus ou moins 50 μm autour de la position nominale n'ait ainsi aucun effet sur le contact sur ce second axe.  Thus, in the hypothesis where the mastery of realization of the antennas requires keeping a distance between the two ends of the antenna coming opposite the circuit, of the order of 200 μm, the distance which separates the zones of enlarged connection, advantageously the large plates, on the integrated circuit can be separated by only 100 microns for example. A dispersion of the positioning of plus or minus 50 μm around the nominal position will have no effect on the contact on this axis. Similarly, the use of an antenna connector about 100 μm wider than the integrated circuit will allow a dispersion of plus or minus 50 microns around the nominal position thus has no effect on the contact on this second axis.
En définitive, les techniques usuelles à protubérances nécessitent la maitrise du positionnement à plus ou moins 20 μm et elles impactent les performances électriques par de fortes dispersions. La présente invention permet de relâcher considérablement les tolérances au positionnement. Pour plus ou moins 35 à 60 μm de dispersion autour de la position nominale, le montage du circuit intégré utilisant des contacts élargis ne subira pas de dispersion de ses performances. De plus, une extension des tolérances de positionnement au-delà des 35 à 60 μm est envisageable.  Ultimately, the usual protruding techniques require the control of the positioning to plus or minus 20 microns and they impact the electrical performance by strong dispersions. The present invention allows to considerably relax the positioning tolerances. For plus or minus 35 to 60 μm of dispersion around the nominal position, the assembly of the integrated circuit using expanded contacts will not undergo dispersion of its performance. In addition, an extension of the positioning tolerances beyond 35 to 60 μm is possible.
Par ailleurs, l'usage de plaques de connexion selon l'invention permet une connexion ohmique sur une surface nettement supérieure à celle de l'art antérieur. Il en résulte que, statistiquement, la connexion se faisant sur une surface de grande taille, elle sera d'une part de bien meilleure qualité et d'autre part la garantie de connexion n'en sera que bien supérieure. Moreover, the use of connection plates according to the invention allows an ohmic connection on a surface much greater than that of the prior art. It The result is that, statistically, the connection being made on a large surface, it will be on the one hand of much better quality and on the other hand the guarantee of connection will be only much higher.
Aussi, le rendement fonctionnel du montage selon l'invention, pour la fabrication d'objet portatifs sans contact, est grandement améliorée.  Also, the functional performance of the assembly according to the invention, for the manufacture of portable objects without contact, is greatly improved.
La dispersion usuelle des montages de circuits pour les applications RFID provoque une variation des parasites de couplages du à la présence de l'antenne et/ou la présence d'une colle conductrice. Ayant réalisé ces plaques de grandes tailles et les ayant positionnées avec précision sur le circuit intégré, ceci participe à la réalisation d'un écran (« shield » en langue Anglaise) . De la sorte, quelles que soient les dispersions de montage, cet écran en masque les effets et assure une plus grande régularité des performances électriques du tag ou Inlay.  The usual dispersion of circuit assemblies for RFID applications causes a variation of the coupling parasites due to the presence of the antenna and / or the presence of a conductive adhesive. Having realized these plates of large sizes and having precisely positioned them on the integrated circuit, this participates in the realization of a screen ("shield" in English language). In this way, whatever the mounting dispersions, this screen masks the effects and ensures a greater regularity of the electrical performance of the tag or Inlay.
En outre, et en particulier dans le cas de fréquences UHF ou supérieures, les dispertions dues aux parasites sont minimisées. De ce fait, les degrés de liberté pour le design et l'optimisation des antennes sont plus grands, permettant une meilleure réception d'énergie donc un meilleur fonctionement dans le cas d'un faible champ.  In addition, and particularly in the case of UHF or higher frequencies, the dispersions due to the parasites are minimized. As a result, the degrees of freedom for the design and optimization of the antennas are greater, allowing a better energy reception and therefore a better function in the case of a weak field.
L'usage de plaques de grande taille utilisées pour un contact électrique direct permet aussi une adaptation aux fréquences basses comme à 13,56 MHz. En effet, le plus souvent, une capacité existe en interne au sein du circuit intégré. Pour limiter les dispersions, il faut alors réaliser une capacité de couplage plus importante. Or, la capacité interne est déjà de l'ordre de 10OpF ce qui rend le couplage capacitif délicat voir impossible.  The use of large plates used for direct electrical contact also allows adaptation to low frequencies such as 13.56 MHz. Indeed, most often, a capacity exists internally within the integrated circuit. To limit dispersions, it is then necessary to achieve a greater coupling capacity. However, the internal capacity is already of the order of 10OpF which makes the capacitive coupling difficult to see impossible.
Bien entendu, l'invention ne se limite pas aux modes de réalisation décrits ci-dessus mais englobe d'autres modes de réalisation, qui concernent notamment les objets portatifs qui disposent à la fois de modes de fonctionnement à contacts et sans contact, voire les objets portatifs qui disposent uniquement de modes de fonctionnement à contacts. Dans ce dernier cas, les bornes de connexion du circuit sont formées par exemple par les bornes de contact arrière des métallisations d'un micromodule destiné à être incorporé dans un corps de carte au format classique des cartes à puce ou au format des SIM. Le micromodule sera alors extra- fin. Of course, the invention is not limited to the embodiments described above but encompasses other embodiments, which relate in particular to portable objects that have both contact and contactless modes of operation, or even portable objects that have only modes of operation with contacts. In the latter case, the connection terminals of the circuit are formed, for example, by the rear contact terminals of the metallizations of a micromodule intended to be incorporated in a card body in the standard format of smart cards or in SIM format. The micromodule will then be extra-fine.

Claims

REVENDICATIONS
1. Objet électronique portatif comportant, d'une part, une puce (1) à circuit intégré et, d'autre part, un support (6) présentant deux bornes de connexion (5-1, 5- 2) d'un circuit d'antenne (5), ladite puce (1) étant montée retournée sur ledit support (6) , caractérisé en ce que la puce est munie, à sa face active, de deux zones de connexion élargies (4-1, 4-2) lesdites zones de connexion étant positionnées au regard desdites bornes et connectées électriquement, par contact ohmique, à celles- ci, et en ce que la surface définie par les zones de connexion à la face active (3) du circuit intégré portant lesdites zones de connexion est supérieure à 1/2 de la surface de cette face. 1. Portable electronic object comprising, on the one hand, an integrated circuit chip (1) and, on the other hand, a support (6) having two connection terminals (5-1, 5- 2) of a circuit antenna (5), said chip (1) being mounted on said support (6), characterized in that the chip is provided at its active face with two enlarged connection areas (4-1, 4-2 ) said connection areas being positioned opposite said terminals and electrically connected, by ohmic contact, to said terminals, and in that the surface defined by the connection areas to the active face (3) of the integrated circuit carrying said zones of connection is greater than 1/2 of the surface of this face.
2. Objet portatif selon la revendication 1, caractérisé en ce qu'il comporte un mode de fonctionnement sans contact et en ce que le circuit est un circuit d'antenne (5) . 2. Portable object according to claim 1, characterized in that it comprises a non-contact mode of operation and in that the circuit is an antenna circuit (5).
3. Objet portatif selon l'une des revendications 1 ou 2, caractérisé en ce que les zones de connexion élargies (4-1, 4-2) sont des plaques de connexion. 3. Portable object according to one of claims 1 or 2, characterized in that the widened connection areas (4-1, 4-2) are connecting plates.
4. Objet portatif selon l'une des revendications 1, 2 ou 3, selon lequel la surface définie par les zones de connexion élargies (4-1, 4-2) à la face active (3) de la puce à circuit intégré (1) portant lesdites zones est supérieure ou égale à 2/3 de la surface de cette face. 4. Portable object according to one of claims 1, 2 or 3, wherein the surface defined by the widened connection areas (4-1, 4-2) to the active face (3) of the integrated circuit chip ( 1) carrying said zones is greater than or equal to 2/3 of the surface of this face.
5. Objet portatif selon l'une des revendications précédentes, caractérisé en ce que la face active de la puce (1) a une surface comprise entre 0,09 mm2 et 0,64 mm2. 5. Portable object according to one of the preceding claims, characterized in that the active face of the chip (1) has a surface between 0.09 mm 2 and 0.64 mm 2 .
6. Objet portatif selon l'une des revendications précédentes, selon lequel la surface de la face activePortable object according to one of the preceding claims, according to which the surface of the active face
(3) de la puce (1) porte des plages de contact (7-1, 7-2) affleurantes au travers d'une couche de passivation de ladite puce, et selon lequel ladite face active est en outre munie d'une couche d'isolant portant les zones de connexion élargies (7-1, 7-2) connectées aux plages de contact . (3) of the chip (1) carries contact pads (7-1, 7-2) flush through a passivation layer of said chip, and wherein said active face is further provided with a layer of insulation carrying the enlarged connection areas (7-1, 7-2) connected to the contact pads.
7. Objet selon l'une des revendications précédentes, selon lequel la puce est collée au support soit au moyen d'une colle anisotropique conductrice en Z assurant la connexion électrique entre les zones de connexion élargies et les bornes d'antenne, soit au moyen d'une colle isolante. 7. Object according to one of the preceding claims, wherein the chip is bonded to the support is by means of an anisotropic adhesive Z conductor ensuring the electrical connection between the widened connection areas and the antenna terminals, or by means an insulating glue.
8. Objet portatif selon l'une des revendications précédentes, selon lequel ledit objet est une étiquette RFID fonctionnant à la fréquence haute de 13,56 MHz ou aux ultra hautes fréquences comprises entre 860 et 960 MHz. 8. Portable object according to one of the preceding claims, wherein said object is an RFID tag operating at the high frequency of 13.56 MHz or at ultra high frequencies between 860 and 960 MHz.
9. Procédé de fabrication d'un objet électronique portatif comportant les étapes de : 9. A method of manufacturing a portable electronic object comprising the steps of:
fourniture d'une puce à circuit intégré (1) présentant une face active (3) et d'un support (6) présentant deux bornes de connexion (5-1, 5-2) d'un circuit d'antenne (5) ;  providing an integrated circuit chip (1) having an active face (3) and a carrier (6) having two connection terminals (5-1, 5-2) of an antenna circuit (5) ;
fourniture de deux zones de connexion élargies à la face active de la puce, la surface définie par lesdites zones de connexion à la face active du circuit intégré portant lesdites zones de connexion étant supérieure à 1/2 de la surface de cette face ; et de retournement de la puce et montage de celle-ci sur son support avec connexion électrique des zones de connexion élargies, par contact ohmique, aux bornes du circuit . providing two enlarged connection areas to the active face of the chip, the area defined by said connection areas to the active face of the integrated circuit carrying said connection areas being greater than 1/2 of the surface of this face; and of reversal of the chip and mounting thereof on its support with electrical connection of the widened connection areas by ohmic contact at the terminals of the circuit.
10. Procédé selon la revendication 9, caractérisé en ce que le circuit (5) est un circuit d'antenne et en ce que l'objet électronique portatif est un objet sans contact. 10. The method of claim 9, characterized in that the circuit (5) is an antenna circuit and in that the portable electronic object is a non-contact object.
11. Procédé selon l'une des revendications 9 ou 10, caractérisé en ce que les zones de connexion élargies (4- 1, 4-2) sont des plaques de connexion. 11. Method according to one of claims 9 or 10, characterized in that the widened connection areas (4- 1, 4-2) are connecting plates.
12. Procédé de fabrication selon l'une des revendications 9 à 11, caractérisé en ce que la surface de la face active de la puce porte des plages de contact affleurantes au travers d'une couche de passivation de ladite puce, et selon lequel ladite face active est en outre munie d'une couche d'isolant portant les zones de connexion élargies connectées aux plages de contact. 12. Manufacturing method according to one of claims 9 to 11, characterized in that the surface of the active face of the chip carries flush contact pads through a passivation layer of said chip, and wherein said active face is further provided with an insulating layer carrying the widened connection areas connected to the contact pads.
EP10757235A 2009-08-06 2010-08-05 Ohmic connection using widened connection zones in a portable electronic object Withdrawn EP2462615A1 (en)

Applications Claiming Priority (2)

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FR0903880A FR2949018B1 (en) 2009-08-06 2009-08-06 OHMIC CONNECTION USING ENLARGED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT
PCT/FR2010/000565 WO2011015732A1 (en) 2009-08-06 2010-08-05 Ohmic connection using widened connection zones in a portable electronic object

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EP2462615A1 true EP2462615A1 (en) 2012-06-13

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FR2949018A1 (en) 2011-02-11
WO2011015732A1 (en) 2011-02-10
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FR2949018B1 (en) 2012-04-20
CA2786406A1 (en) 2011-02-10

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