EP2458692A1 - Agencement d'exécution électrique à vide ultra élevé - Google Patents

Agencement d'exécution électrique à vide ultra élevé Download PDF

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Publication number
EP2458692A1
EP2458692A1 EP11188860A EP11188860A EP2458692A1 EP 2458692 A1 EP2458692 A1 EP 2458692A1 EP 11188860 A EP11188860 A EP 11188860A EP 11188860 A EP11188860 A EP 11188860A EP 2458692 A1 EP2458692 A1 EP 2458692A1
Authority
EP
European Patent Office
Prior art keywords
flange
keramikabdichtelement
sockets
arrangement according
sealing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11188860A
Other languages
German (de)
English (en)
Inventor
Heiko Wunderlich
Matthias Grundwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vacom Vakuum Komponenten & Messtechnik GmbH
Original Assignee
Vacom Vakuum Komponenten & Messtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacom Vakuum Komponenten & Messtechnik GmbH filed Critical Vacom Vakuum Komponenten & Messtechnik GmbH
Publication of EP2458692A1 publication Critical patent/EP2458692A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/533—Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/73—Means for mounting coupling parts to apparatus or structures, e.g. to a wall
    • H01R13/74—Means for mounting coupling parts in openings of a panel
    • H01R13/748—Means for mounting coupling parts in openings of a panel using one or more screws

Definitions

  • the invention relates to an electrical, ultra high vacuum feedthrough assembly having a Keramikab Whylement is in communication with a flange to allow mounting on or in an opening of a vacuum device, according to Preamble of claim 1.
  • a feed-through device in particular for the high-voltage electrode of a gas laser previously known.
  • the local feedthrough device is based on a Keramikabêtlement, which is connectable to a flange of a laser tube.
  • the ceramic sealing element which may be embodied as a ceramic tube, a fixed inner conductor is arranged. At the fixed inner conductor, a movable inner conductor is fixed via a plug arrangement.
  • a sealing element for a sealing device which consists of a hard and flexible material, wherein the guided electrical Ladder comprises at least two flexible connecting elements.
  • the sealing device further requires a metal flange with which it can be fixed to the recess or to an opening of the separating element.
  • the in the DE 103 34 394 B3 disclosed training the contact via a tuft or lamellar plug not suitable to contact electronic components, the corresponding terminal pins, which are usually standardized possess.
  • the invention is based on an electrical, ultra-vacuum-suitable feedthrough arrangement with a Keramikab Whylement is in communication with a flange to a mounting on or in an opening of a vacuum device enable.
  • an insert piece in particular designed as a pipe piece, is arranged between the flange and the ceramic sealing element, which accommodates the ceramic sealing element in its interior, this being adhesively bonded, in particular by soldering, to the insert - in particular the pipe piece.
  • the flange has an opening which corresponds to the outer dimensions of the insert, and wherein the insert is adhesively bonded to the flange adhesive-bonded, in particular by welding.
  • Ausgestaltend the Keramikabêtlement is designed as a planar support for an active or passive electronic component, wherein the plug and / or sockets are used according to the pins of the respective component in the Keramikabêtlement, in particular by soldering.
  • the plugs and / or sockets project over both surfaces of the ceramic sealing element, so that on the one hand a component with connection pins is accommodated in the socket part and on the other hand an electrical connection is possible in the rear part.
  • Ausgestaltend has the ceramic sealing element oriented to the receiving side of the electronic component support surface.
  • This support surface is preferably formed as a survey or molding of the ceramic sealing element and is used in a preferred embodiment not only as a support surface, but also as a heat sink via a corresponding Intitle hear with the housing of the electronic component.
  • the plugs and / or sockets in DUAL inline, d. H. executed as a so-called DiL arrangement.
  • plugs and / or sockets can be realized as a pin-socket and a protective coating, for. B. identify gold.
  • a photosensitive component in particular a camera chip, is used as the electronic component.
  • the materials used according to the invention and the bonding processes are all UHV-compatible as well as adhesive or polymer-free.
  • the solution provided combines the requirement for a precise and accurate insertion of an electronic component in the arrangement of plugs and / or sockets and the need to use ceramic materials for the implementation in conjunction with a UHV-compatible cohesive bonding process, in particular a soldering or welding ,
  • the solution according to the invention is based on a conventional metallic flange 1 which has a plurality of flange bores 6 on the circumference for attachment to a corresponding passage opening of a vacuum vessel.
  • the existing on the vacuum vessel mating flange has correspondingly congruent holes, which then receive appropriate mounting screws.
  • a Keramikab Whylement 2 is mounted in a tubular insert 3 and in this connection materially connected by soldering to the tubular insert 3.
  • the ceramic sealing element 2 has plug-in sockets 4 designed in DUAL inline arrangement, which serve to receive connection legs 7 of a camera chip 5.
  • the tubular insert 3 is materially connected to an inner collar of the flange 1 in the region 8, in particular vacuum-tight by welding.
  • a support surface 9, formed as a collection of the Keramikab Whylementes 2 fixes the electronic component 5 and simultaneously or additionally represents a heat sink for the purpose of cooling the component 5.
  • the upper inner collar side of the flange 1 is free.
  • a glass or quartz glass pane can be used as a cover here.
  • the remote from the vacuum side lower ends of the sockets 4 are then used to hold other electrical connection elements for driving or reading data from the corresponding electronic component, in particular the CCD camera chips mentioned here. 5

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
EP11188860A 2010-11-26 2011-11-11 Agencement d'exécution électrique à vide ultra élevé Withdrawn EP2458692A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202010015912U DE202010015912U1 (de) 2010-11-26 2010-11-26 Elektrische, ultrahochvakuumtaugliche Durchführungsanordnung

Publications (1)

Publication Number Publication Date
EP2458692A1 true EP2458692A1 (fr) 2012-05-30

Family

ID=43706026

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11188860A Withdrawn EP2458692A1 (fr) 2010-11-26 2011-11-11 Agencement d'exécution électrique à vide ultra élevé

Country Status (2)

Country Link
EP (1) EP2458692A1 (fr)
DE (1) DE202010015912U1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9515469B2 (en) 2012-12-14 2016-12-06 General Electric Company Vacuum feed-through assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016003061B4 (de) * 2016-03-11 2021-06-02 Just Vacuum Gmbh Vakuumdichte elektrische Stromdurchführungsanordnung für Vakuumkammern
IL295162B1 (en) * 2022-07-28 2024-06-01 Applied Materials Israel Ltd High voltage feed kit

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174145A (en) * 1976-12-29 1979-11-13 The United States Of America As Represented By The United States Department Of Energy High pressure electrical insulated feed thru connector
US5247424A (en) * 1992-06-16 1993-09-21 International Business Machines Corporation Low temperature conduction module with gasket to provide a vacuum seal and electrical connections
US6305975B1 (en) * 2000-10-12 2001-10-23 Bear Instruments, Inc. Electrical connector feedthrough to low pressure chamber
DE10334394B3 (de) 2003-07-28 2004-11-18 Tuilaser Ag Durchführungsvorrichtung für Laserröhren
EP1658657A1 (fr) * 2003-08-27 2006-05-24 Emanuele Madonna TRAVERSEES ELECTRIQUES MULTIPLES DESTINEES A DES APPLICATIONS DE VIDE POUSSE A DES TEMPERATURES DE FONCTIONNEMENT COMPRISES ENTRE 70 ET 530 oK

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174145A (en) * 1976-12-29 1979-11-13 The United States Of America As Represented By The United States Department Of Energy High pressure electrical insulated feed thru connector
US5247424A (en) * 1992-06-16 1993-09-21 International Business Machines Corporation Low temperature conduction module with gasket to provide a vacuum seal and electrical connections
US6305975B1 (en) * 2000-10-12 2001-10-23 Bear Instruments, Inc. Electrical connector feedthrough to low pressure chamber
DE10334394B3 (de) 2003-07-28 2004-11-18 Tuilaser Ag Durchführungsvorrichtung für Laserröhren
EP1658657A1 (fr) * 2003-08-27 2006-05-24 Emanuele Madonna TRAVERSEES ELECTRIQUES MULTIPLES DESTINEES A DES APPLICATIONS DE VIDE POUSSE A DES TEMPERATURES DE FONCTIONNEMENT COMPRISES ENTRE 70 ET 530 oK

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9515469B2 (en) 2012-12-14 2016-12-06 General Electric Company Vacuum feed-through assembly

Also Published As

Publication number Publication date
DE202010015912U1 (de) 2011-03-03

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