EP2455329A3 - Vibrationsisolierung durch ein zwischengelagertes Chip - Google Patents

Vibrationsisolierung durch ein zwischengelagertes Chip Download PDF

Info

Publication number
EP2455329A3
EP2455329A3 EP11190205.2A EP11190205A EP2455329A3 EP 2455329 A3 EP2455329 A3 EP 2455329A3 EP 11190205 A EP11190205 A EP 11190205A EP 2455329 A3 EP2455329 A3 EP 2455329A3
Authority
EP
European Patent Office
Prior art keywords
vibration isolation
interposer die
chip
interposer
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11190205.2A
Other languages
English (en)
French (fr)
Other versions
EP2455329B1 (de
EP2455329A2 (de
Inventor
Robert D. Horning
Ryan Supino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP2455329A2 publication Critical patent/EP2455329A2/de
Publication of EP2455329A3 publication Critical patent/EP2455329A3/de
Application granted granted Critical
Publication of EP2455329B1 publication Critical patent/EP2455329B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0016—Protection against shocks or vibrations, e.g. vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gyroscopes (AREA)
  • Vibration Prevention Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Pressure Sensors (AREA)
EP11190205.2A 2010-11-23 2011-11-22 Vibrationsisolierung durch ein zwischengelagertes Chip Active EP2455329B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41648510P 2010-11-23 2010-11-23
US13/299,485 US9227835B2 (en) 2010-11-23 2011-11-18 Vibration isolation interposer die

Publications (3)

Publication Number Publication Date
EP2455329A2 EP2455329A2 (de) 2012-05-23
EP2455329A3 true EP2455329A3 (de) 2014-01-01
EP2455329B1 EP2455329B1 (de) 2014-09-24

Family

ID=44992800

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11190205.2A Active EP2455329B1 (de) 2010-11-23 2011-11-22 Vibrationsisolierung durch ein zwischengelagertes Chip

Country Status (4)

Country Link
US (1) US9227835B2 (de)
EP (1) EP2455329B1 (de)
JP (1) JP5860270B2 (de)
CN (1) CN102530827A (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8896074B2 (en) * 2012-01-26 2014-11-25 The Charles Stark Draper Laboratory, Inc. MEMS vibration isolation system and method
US20130264755A1 (en) * 2012-04-05 2013-10-10 Honeywell International Inc. Methods and systems for limiting sensor motion
DE102013222966A1 (de) * 2013-11-12 2015-05-28 Robert Bosch Gmbh Inertialsensor
US9425125B2 (en) 2014-02-20 2016-08-23 Altera Corporation Silicon-glass hybrid interposer circuitry
DE102014210912A1 (de) * 2014-06-06 2015-12-17 Robert Bosch Gmbh Interposer für die Montage eines vertikal hybrid integrierten Bauteils auf einem Bauteilträger
US20160039664A1 (en) * 2014-08-06 2016-02-11 Honeywell International Inc. Monolithic integration of stress isolation feautures in a microelectromechanical system (mems) structure
US9574959B2 (en) * 2014-09-02 2017-02-21 Apple Inc. Various stress free sensor packages using wafer level supporting die and air gap technique
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US10131535B2 (en) * 2015-05-22 2018-11-20 Honeywell International Inc. Monolithic fabrication of thermally isolated microelectromechanical system (MEMS) devices
US10211757B2 (en) 2015-08-04 2019-02-19 Mems Drive, Inc. Multi-directional actuator
FR3048781B1 (fr) * 2016-03-11 2018-03-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Accelerometre lineaire amorti
EP3260821B1 (de) * 2016-06-21 2019-09-11 ams International AG Sensorpaket und verfahren zur herstellung des sensorpakets
US10611628B2 (en) 2016-12-29 2020-04-07 Epack, Inc. MEMS isolation platform with three-dimensional vibration and stress isolation
GB2560192A (en) * 2017-03-03 2018-09-05 Atlantic Inertial Systems Ltd Vibration damping mount
US20190169018A1 (en) * 2017-12-05 2019-06-06 Invensense, Inc. Stress isolation frame for a sensor
US20190241428A1 (en) * 2018-02-06 2019-08-08 Epack, Inc. Space-efficient planar interposer for environment-resistant packaging
CN108609576B (zh) * 2018-04-09 2019-12-31 合肥工业大学 一种用于mems器件隔振的双层隔振结构及制备方法
GB2575694A (en) * 2018-07-20 2020-01-22 Atlantic Inertial Systems Ltd Sensor packages
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006022807A1 (de) * 2006-05-16 2007-11-22 Robert Bosch Gmbh Chipgehäuse mit reduzierter Schwingungseinkopplung
DE102009000574A1 (de) * 2009-02-03 2010-08-05 Robert Bosch Gmbh Sensorvorrichtung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129042A (en) 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
US4558397A (en) * 1983-12-19 1985-12-10 Amp Incorporated Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board
GB9009753D0 (en) * 1990-05-01 1990-06-20 Bt & D Technologies Ltd Photo detectors
US5138430A (en) * 1991-06-06 1992-08-11 International Business Machines Corporation High performance versatile thermally enhanced IC chip mounting
DE10010975B4 (de) * 2000-03-07 2010-04-08 Robert Bosch Gmbh Mikromechanisches Bauelement
US6330102B1 (en) * 2000-03-24 2001-12-11 Onix Microsystems Apparatus and method for 2-dimensional steered-beam NxM optical switch using single-axis mirror arrays and relay optics
ATE311604T1 (de) * 2000-06-20 2005-12-15 Nanonexus Inc Testsystem von integrierten schaltungen
JP2002071353A (ja) 2000-09-01 2002-03-08 Ngk Insulators Ltd 角速度測定装置
JP2002195834A (ja) * 2000-12-27 2002-07-10 Murata Mfg Co Ltd 物理量検出装置
US6754584B2 (en) * 2001-02-28 2004-06-22 Enpoint, Llc Attitude measurement using a single GPS receiver with two closely-spaced antennas
US6937479B2 (en) 2001-08-21 2005-08-30 The Charles Stark Draper Laboratory, Inc. Sensor isolation system
JP4724488B2 (ja) * 2005-02-25 2011-07-13 日立オートモティブシステムズ株式会社 集積化マイクロエレクトロメカニカルシステム
US7562573B2 (en) * 2005-07-21 2009-07-21 Evigia Systems, Inc. Integrated sensor and circuitry and process therefor
US8646332B2 (en) * 2007-09-03 2014-02-11 Panasonic Corporation Inertia force sensor
DE102007052367A1 (de) * 2007-11-02 2009-05-07 Robert Bosch Gmbh Mikromechanisches System
CN101271124B (zh) * 2008-05-16 2010-09-29 中国科学院上海微系统与信息技术研究所 L形梁压阻式微加速度计及其制作方法
JP2010223952A (ja) 2009-02-24 2010-10-07 Seiko Epson Corp 加速度センサー、電子機器
CN101792108B (zh) * 2010-03-16 2011-12-21 杭州电子科技大学 一种基于滑膜阻尼的大电容微惯性传感器及其制作方法
US8941222B2 (en) * 2010-11-11 2015-01-27 Advanced Semiconductor Engineering Inc. Wafer level semiconductor package and manufacturing methods thereof
US8896074B2 (en) * 2012-01-26 2014-11-25 The Charles Stark Draper Laboratory, Inc. MEMS vibration isolation system and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006022807A1 (de) * 2006-05-16 2007-11-22 Robert Bosch Gmbh Chipgehäuse mit reduzierter Schwingungseinkopplung
DE102009000574A1 (de) * 2009-02-03 2010-08-05 Robert Bosch Gmbh Sensorvorrichtung

Also Published As

Publication number Publication date
EP2455329B1 (de) 2014-09-24
CN102530827A (zh) 2012-07-04
US9227835B2 (en) 2016-01-05
US20120130671A1 (en) 2012-05-24
JP2012146958A (ja) 2012-08-02
JP5860270B2 (ja) 2016-02-16
EP2455329A2 (de) 2012-05-23

Similar Documents

Publication Publication Date Title
EP2455329A3 (de) Vibrationsisolierung durch ein zwischengelagertes Chip
EP2570883A3 (de) Stützstruktur
EP2263836A3 (de) Aufbewahrungsanordnung für Werkzeugkasten
EP2439776A3 (de) Millimetervorrichtungen auf einer integrierten Schaltung
EP2763163A3 (de) Doppelseitige Verpackung
EP2843916A3 (de) Verfahren zur Sprachaufnahme und elektronische Vorrichtung dafür
EP2360350A3 (de) Kombinierte Nut eines Dichtstreifens sowie gewichtssparende Tasche
EP2385549A3 (de) Chipbauelement, Bauelementmodul und Beleuchtungsvorrichtung, die das Chipbauelementmodul enthält
EP2866469A3 (de) Akustischer Wandler und Paketmodul damit
EP2364005A3 (de) Modul zum Erweitern der Funktionsweise eines tragbaren Geräts und tragbares Gerät mit diesem Modul
EP2779812A3 (de) Chipgehäuse-Verbinderanordnung
EP2159841A3 (de) Halbleitervorrichtung mit einer abgehängten isolierenden Verbindung
SG151204A1 (en) Integrated circuit package system with leadframe array
EP2631943A3 (de) System-in-Package mit integrierter Schutzhülle
EP2426752A3 (de) Wiederaufladbare Batterie
EP3565330A3 (de) Verwendung einer zelle als wegverlust- oder taktreferenz
EP2367187A3 (de) Photoelektrische Umwandlungsvorrichtung
EP2509125A3 (de) Elektromechanischer Wandler und Herstellungsverfahren dafür
EP2175146A3 (de) Befestigungselement und Befestigungsanordnung
EP2648238A3 (de) Montageverpackung für lichtemittierendes Element, Herstellungsverfahren dafür und lichtemittierende Elementverpackung
EP2434101A3 (de) Dämpfungsanordnung
TW200727416A (en) Method of forming a semiconductor device and structure therefor
EP2849220A3 (de) Halbleitergehäuse und Halbleitervorrichtung
EP2731411A3 (de) Verbindungsstruktur einer Leiterplatte
EP2744179A3 (de) Dispositif électronique

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20111122

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602011010075

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: B81B0007000000

Ipc: H01L0021768000

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/768 20060101AFI20131128BHEP

Ipc: H01L 25/065 20060101ALI20131128BHEP

17Q First examination report despatched

Effective date: 20131212

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20140612

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 688946

Country of ref document: AT

Kind code of ref document: T

Effective date: 20141015

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602011010075

Country of ref document: DE

Effective date: 20141106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141225

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141224

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 688946

Country of ref document: AT

Kind code of ref document: T

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150124

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150126

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602011010075

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141122

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

26N No opposition filed

Effective date: 20150625

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141122

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20151130

Year of fee payment: 5

Ref country code: CH

Payment date: 20151026

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20111122

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602011010075

Country of ref document: DE

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161130

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161130

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170601

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140924

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230525

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231121

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20231123

Year of fee payment: 13