EP2418696A4 - Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device - Google Patents

Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device

Info

Publication number
EP2418696A4
EP2418696A4 EP09842932.7A EP09842932A EP2418696A4 EP 2418696 A4 EP2418696 A4 EP 2418696A4 EP 09842932 A EP09842932 A EP 09842932A EP 2418696 A4 EP2418696 A4 EP 2418696A4
Authority
EP
European Patent Office
Prior art keywords
emitting element
semiconductor light
nitride semiconductor
illuminating device
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09842932.7A
Other languages
German (de)
French (fr)
Other versions
EP2418696A1 (en
Inventor
Toshiya Yokogawa
Akira Inoue
Masaki Fujikane
Mitsuaki Oya
Atsushi Yamada
Tadashi Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of EP2418696A1 publication Critical patent/EP2418696A1/en
Publication of EP2418696A4 publication Critical patent/EP2418696A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
EP09842932.7A 2009-04-09 2009-07-09 Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device Withdrawn EP2418696A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009095211 2009-04-09
PCT/JP2009/003215 WO2010116422A1 (en) 2009-04-09 2009-07-09 Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device

Publications (2)

Publication Number Publication Date
EP2418696A1 EP2418696A1 (en) 2012-02-15
EP2418696A4 true EP2418696A4 (en) 2014-02-19

Family

ID=42935735

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09842932.7A Withdrawn EP2418696A4 (en) 2009-04-09 2009-07-09 Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device

Country Status (5)

Country Link
US (1) US8791473B2 (en)
EP (1) EP2418696A4 (en)
JP (2) JP4815013B2 (en)
CN (1) CN102356477A (en)
WO (1) WO2010116422A1 (en)

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JP5643720B2 (en) * 2011-06-30 2014-12-17 株式会社沖データ Display module, manufacturing method thereof and display device
KR101957816B1 (en) * 2012-08-24 2019-03-13 엘지이노텍 주식회사 Light emitting device
KR101428001B1 (en) 2013-01-07 2014-09-12 한국과학기술원 Flexible liquid crystal display and manufacturing method for the same
TWM458672U (en) * 2013-04-10 2013-08-01 Genesis Photonics Inc Light source module
US9722145B2 (en) 2015-06-24 2017-08-01 Sharp Laboratories Of America, Inc. Light emitting device and fluidic manufacture thereof
TWI563490B (en) 2015-12-04 2016-12-21 Ind Tech Res Inst Display pixel and display panel
JP7244745B2 (en) * 2019-02-15 2023-03-23 日亜化学工業株式会社 Light-emitting device and optical device
CN113640328B (en) * 2021-08-12 2024-01-23 安徽长飞先进半导体有限公司 AlGaN layer Al component determination method based on x-ray

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2008218645A (en) * 2007-03-02 2008-09-18 Rohm Co Ltd Light-emitting device

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JP2859478B2 (en) 1991-12-12 1999-02-17 日亜化学工業 株式会社 Gallium nitride based compound semiconductor wafer cutting method for light emitting device
JP2748355B2 (en) 1993-10-21 1998-05-06 日亜化学工業株式会社 Method of manufacturing gallium nitride based compound semiconductor chip
CN1300859C (en) 1997-01-31 2007-02-14 松下电器产业株式会社 Light emitting element, semiconductor light emitting device, and method for manufacturing them
TW406442B (en) 1998-07-09 2000-09-21 Sumitomo Electric Industries White colored LED and intermediate colored LED
JP3087743B2 (en) 1998-11-12 2000-09-11 住友電気工業株式会社 Intermediate color LED
JP3122644B2 (en) 1998-09-10 2001-01-09 シャープ株式会社 Method for manufacturing semiconductor light emitting device
JP2001168388A (en) 1999-09-30 2001-06-22 Sharp Corp Gallium nitride compound semiconductor chip, its manufacturing method and gallium nitride compound semiconductor wafer
JP2001308462A (en) 2000-04-21 2001-11-02 Matsushita Electric Ind Co Ltd Method of manufacturing nitride semiconductor element
JP4128008B2 (en) 2000-05-19 2008-07-30 ティボル・バログ Method and apparatus for displaying 3D images
WO2003025263A1 (en) 2001-09-13 2003-03-27 Japan Science And Technology Agency Nitride semiconductor substrate, its manufacturing method, and semiconductor optical device using the same
JP2003332697A (en) 2002-05-09 2003-11-21 Sony Corp Nitride semiconductor element and its manufacturing method
US7186004B2 (en) 2002-12-31 2007-03-06 Karlton David Powell Homogenizing optical sheet, method of manufacture, and illumination system
EP3413369A1 (en) 2003-09-19 2018-12-12 Sony Corporation Organic light emitting display
TWI397199B (en) 2005-06-21 2013-05-21 Japan Science & Tech Agency Packaging technique for the fabrication of polarized light emitting diodes
US8044417B2 (en) * 2008-02-01 2011-10-25 The Regents Of The University Of California Enhancement of optical polarization of nitride light-emitting diodes by increased indium incorporation
JP4661735B2 (en) * 2005-09-21 2011-03-30 日本ビクター株式会社 Surface light source device
TWI306316B (en) 2006-07-28 2009-02-11 Huga Optotech Inc Semiconductor light emitting device and method of fabricating the same
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JP2008198952A (en) 2007-02-15 2008-08-28 Rohm Co Ltd Group iii nitride semiconductor light emitting device
JP4062360B2 (en) 2007-03-08 2008-03-19 松下電器産業株式会社 Light emitting element
US20080225202A1 (en) 2007-03-15 2008-09-18 Hanbitt Joo Optical sheet and liquid crystal display device having the same
JP2008235804A (en) * 2007-03-23 2008-10-02 Rohm Co Ltd Light-emitting element
JP2008258503A (en) 2007-04-06 2008-10-23 Sumitomo Electric Ind Ltd Nitride-based semiconductor light emitting element, and method of fabricating nitride-based semiconductor light emitting element
JP2008305962A (en) 2007-06-07 2008-12-18 Rohm Co Ltd Optical device
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US7858995B2 (en) 2007-08-03 2010-12-28 Rohm Co., Ltd. Semiconductor light emitting device
JP2009044067A (en) 2007-08-10 2009-02-26 Rohm Co Ltd Semiconductor light emitting element
JP5309386B2 (en) 2007-08-20 2013-10-09 国立大学法人北海道大学 Semiconductor light emitting element array, manufacturing method thereof, and optical transmitter
JP4631884B2 (en) * 2007-08-22 2011-02-16 日立電線株式会社 Sphalerite-type nitride semiconductor free-standing substrate, method for manufacturing zinc-blende nitride semiconductor free-standing substrate, and light-emitting device using zinc-blende nitride semiconductor free-standing substrate
JP2009070893A (en) 2007-09-11 2009-04-02 Rohm Co Ltd Light-emitting device and manufacturing method therefor
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JP2011511462A (en) * 2008-02-01 2011-04-07 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Enhanced polarization of nitride light-emitting diodes by off-axis wafer cutting
WO2011070770A1 (en) * 2009-12-09 2011-06-16 パナソニック株式会社 Nitride-based semiconductor light-emitting element, lighting device, liquid crystal display device, and method for producing lighting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218645A (en) * 2007-03-02 2008-09-18 Rohm Co Ltd Light-emitting device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KUBOTA MASASHI ET AL: "Temperature dependence of polarized photoluminescence from nonpolar m-plane InGaN multiple quantum wells for blue laser diodes", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS, US, vol. 92, no. 1, 7 January 2008 (2008-01-07), pages 11920 - 11920, XP012105645, ISSN: 0003-6951, DOI: 10.1063/1.2824886 *
See also references of WO2010116422A1 *

Also Published As

Publication number Publication date
EP2418696A1 (en) 2012-02-15
CN102356477A (en) 2012-02-15
JP2011205132A (en) 2011-10-13
JP4815013B2 (en) 2011-11-16
WO2010116422A1 (en) 2010-10-14
US20120002134A1 (en) 2012-01-05
JPWO2010116422A1 (en) 2012-10-11
US8791473B2 (en) 2014-07-29

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