EP2417429A1 - Sensoranordnung und messanordnung - Google Patents
Sensoranordnung und messanordnungInfo
- Publication number
- EP2417429A1 EP2417429A1 EP10716785A EP10716785A EP2417429A1 EP 2417429 A1 EP2417429 A1 EP 2417429A1 EP 10716785 A EP10716785 A EP 10716785A EP 10716785 A EP10716785 A EP 10716785A EP 2417429 A1 EP2417429 A1 EP 2417429A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor
- component
- housing
- arrangement according
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 claims description 4
- 241000191291 Abies alba Species 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 5
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
Definitions
- Sensor arrangement with at least two sensor elements known, wherein the sensor elements are arranged in a common housing.
- An object to be solved is to specify a sensor arrangement which detects the temperatures at an interface between at least two temperature zones.
- the object is achieved by a sensor arrangement according to claim 1 and by a measuring arrangement according to claim 10.
- Advantageous embodiments of the sensor arrangement and the measuring arrangement are the subject of dependent claims.
- a sensor arrangement which has at least two sensor components.
- the sensor components each have a housing with at least one sensor element.
- the housings of the sensor components each have at least one part of a connection device with which the at least two sensor components of the sensor arrangement can be mechanically connected to one another.
- the sensor elements of the at least two sensor components are thermally insulated from one another.
- the sensor arrangement consists in one embodiment of at least two separate independent sensor components which are thermally decoupled from each other.
- at least one sensor element is arranged in a cavity of the sensor component.
- at least one sensor element is arranged in a recess of the housing wall on the outside or on an outer surface of the housing wall of a sensor component.
- the sensor element is encased with a potting compound for protection against corrosion or destruction.
- the sensor elements are arranged spatially separated, so that the sensor elements are thermally and spatially decoupled from each other.
- the connecting device of the sensor components is designed as a tongue and groove connector. At least one sensor component has at least one groove. At least one more
- Sensor component has at least one spring which fits into the groove of a sensor component.
- the groove and the spring are formed such that they are plugged into each other and together have a preferably positive connection.
- the tongue and groove connector is designed as a dovetail connection or Christmas tree connection.
- the groove of the one component is at least designed so that the spring of the further component preferably inserts positively into the groove.
- the spring is designed as a separate connecting piece, which is arranged on the housing of the sensor component or is connected to it mechanically, eg adhesively bonded.
- the spring is a molded part of the sensor component to be connected. The spring is rounded into the housing of the sensor component.
- each of the sensor components has at least two electrical connection contacts for electrical connection of the sensor elements.
- electrical contacts of the respective sensor elements form the electrical connection of the sensor component.
- At least one sensor element is arranged on a printed circuit board.
- the printed circuit board is preferably arranged in the housing of one of the sensor components.
- the printed circuit board has at least two electrical connection contacts.
- further electrical components are arranged on the printed circuit board.
- the housings of the sensor components contain at least one plastic.
- the housing of the sensor components, at least in the region of the sensor elements in the embodiment of the sensor components as temperature sensors, preferably has good thermal properties.
- the housing in the region of the sensor element has good thermal conductivity.
- the sensor elements as optical sensors has the Housing sensor components at least in the region of the sensor elements on an optically transmissive region, preferably in the infrared range.
- the optically transmissive region of the at least one sensor component is designed, for example, as a preferably optically transparent cap.
- the cap comprises a material which is preferably optically transparent to radiation in the infrared range.
- At least two of the sensor elements are designed as temperature sensor elements.
- the temperature sensor elements are preferably designed as NTC (negative temperature coefficient component).
- the temperature sensor elements are designed as PTC (component with a positive temperature coefficient).
- At least one sensor component has at least two sensor elements, wherein a first sensor element is designed as an optical sensor and a further sensor element is designed as NTC.
- the optical sensor is preferably a photodiode for detecting the heat radiation of a radiation source.
- the NTC element is preferably used for detecting the convection heat and / or the heat radiation of a radiation source.
- a measuring arrangement for detecting at least two temperature zones using a described sensor arrangement, wherein at least one sensor element of a first sensor component detects the temperature of a first temperature zone. At least one sensor element of a second sensor component detects the temperature of a second temperature zone.
- the sensor arrangement or the measuring arrangement described above is preferably used in the detection of the vehicle interior temperature of a motor vehicle.
- Figure 1 shows the schematic structure of a first
- FIG. 2 schematically shows a three-dimensional view of a first sensor component
- FIG. 3 a shows a schematic view of the underside of the first sensor component
- FIG. 3b shows a cross section through a sensor component according to FIG. 3a along the section axis A-A '
- FIG. 3c shows a schematic side view of the first sensor component
- FIG. 4 schematically shows a three-dimensional view of a second sensor component
- FIG. 5a schematically shows a side view of the second sensor component
- FIG. 5b schematically shows another side view of the second sensor element.
- FIG. 1 schematically shows the structure of a sensor arrangement 1 which comprises a first sensor component 2 and a second sensor component 3.
- the housing 4 of the first sensor component 2 and the housing 5 of the second sensor component 3 are mechanically connected to one another via a connecting device 9.
- the connecting device 9 is shown in detail in FIG.
- Both the first sensor component 2 and the second sensor component 3 each have electrical connections 12, 13, 14.
- the first sensor component has three electrical connections 12, 13, 14.
- the second sensor component 3 has two electrical connections 16, 17.
- the first sensor component 2 has an optically transparent cap 18.
- FIG. 2 shows a three-dimensional view of the first sensor component 2.
- the first sensor component 2 has a housing 4. On the upper side of the housing 4, a part of a connecting device 9 in the form of a spring 11 is arranged.
- the spring 11 is arranged laterally from the central axis of the first sensor component 2 in the illustrated embodiment.
- the spring 11 is as Dovetail connection executed.
- the spring 11 has a slot extending in the longitudinal direction of the spring 11.
- the first sensor component 2 has three electrical connection contacts 12, 13, 14. In a further embodiment, it is also possible for the first sensor component 2 to have only two electrical connections.
- FIG. 3a shows a view of the underside of a first sensor component 2 according to the embodiment in FIG. 2.
- the housing 4 of the first sensor component 2 has three electrical connection contacts 12, 13, 14 in the illustrated embodiment.
- the positions of two sensor elements 6, 7 are indicated in the illustrated embodiment.
- the sensor elements 6, 7 are in the illustrated embodiment, as can be seen in the figure 3b, arranged in the interior of the housing 4, wherein the sensor elements 6, 7 are partially surrounded by an optically transparent cap 18.
- the sensor elements 6, 7 are about three
- Connection contacts 12, 13 14 electrically contacted.
- One of the three terminal contacts 12, 13, 14 serves, for example, as a common ground of the two sensor elements 6, 7 and is coupled to one terminal each of the sensor elements.
- Figure 3b shows a cross section through the second
- the housing 4 of the first sensor component 2 has a printed circuit board 15.
- a sensor element 6 is arranged, which is connected to a circuit board 15.
- the electrical contacts of the sensor element 6 are guided via conductor tracks on the printed circuit board 15 to electrical connection contacts 13, 14.
- a spring 11 is shown as part of a dovetail joint.
- FIG. 3c shows schematically a view of the housing 4 of the first sensor component 2 from the front side.
- the housing 4 of the first sensor component 2 has an optically transparent cap 18, in the interior of which the sensor elements of the first sensor component 2 are arranged
- Figure 4 shows schematically the structure of a second
- the housing 5 of the second sensor component 3 has a groove 10 as part of a connecting device.
- the housing 5 of the second sensor component 3 on two reference planes, which are arranged approximately at right angles to each other.
- a first reference plane is associated with the groove 10 of the connector.
- a sensor element 8 on the rear side of the sensor component 3 is indicated. The sensor element 8 can be contacted from outside via electrical connection contacts 16, 17.
- FIG. 5a shows a view of the embodiment of the second sensor component 3 from the rear side of the housing 5.
- the housing 5 of the second sensor component 3 points in the lower part
- Region a groove 10 which extends over the entire width of the housing 5.
- a sensor element 8 which can be contacted via electrical connection contacts 13.
- FIG. 5b shows the profile of the housing 5 of the second sensor component 3 according to the embodiment of FIG. 4.
- the housing 5 of the second sensor component 3 has a sensor element 8 on the top side.
- the sensor element 8 is arranged on a surface of the housing 5, which is arranged perpendicular to the first reference plane of the housing 5.
- the groove 10 has approximately a T-shape in the profile.
- the groove 10 is preferably designed such that the spring 11 of the first sensor component 2 engages positively in the groove 10 of the second component 3.
- the sensor arrangement comprises a plurality of sensor components which are mechanically connected to one another via connection devices and has a plurality of sensor elements which are thermally decoupled.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Radiation Pyrometers (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009017230A DE102009017230B3 (de) | 2009-04-09 | 2009-04-09 | Sensoranordnung und Messanordnung |
| PCT/EP2010/054604 WO2010115931A1 (de) | 2009-04-09 | 2010-04-07 | Sensoranordnung und messanordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2417429A1 true EP2417429A1 (de) | 2012-02-15 |
Family
ID=42309155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10716785A Withdrawn EP2417429A1 (de) | 2009-04-09 | 2010-04-07 | Sensoranordnung und messanordnung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9028143B2 (de) |
| EP (1) | EP2417429A1 (de) |
| JP (1) | JP5537648B2 (de) |
| KR (1) | KR101716521B1 (de) |
| CN (1) | CN102388299B (de) |
| DE (1) | DE102009017230B3 (de) |
| WO (1) | WO2010115931A1 (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202009001069U1 (de) * | 2009-01-28 | 2009-04-09 | Visteon Global Technologies Inc., Van Buren | Sensor zur Ermittlung der Temperatur im Innenraum eines Kraftfahrzeugs, Klimabedienteil für eine Kfz-Klimanlage und Vorrichtung zur Ermittlung der Temperatur in einem Kfz |
| JP5761211B2 (ja) * | 2013-01-11 | 2015-08-12 | 株式会社デンソー | ペア温度センサ及びその製造方法 |
| DE102013110866A1 (de) * | 2013-10-01 | 2015-04-02 | Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt | Kapazitive Sensoranordnung eines Kraftfahrzeugs |
| DE102013114140A1 (de) * | 2013-12-16 | 2015-06-18 | Endress + Hauser Wetzer Gmbh + Co. Kg | Messfühlergehäuse und Messfühleranordnung mit einem Messfühlergehäuse |
| DE102013021798A1 (de) * | 2013-12-23 | 2015-06-25 | Epcos Ag | Sensoranordnung, Sensoranordnungssystem und Satz von Sensoranordnungselementen |
| DE102016202929A1 (de) * | 2016-02-25 | 2017-08-31 | Robert Bosch Gmbh | Haltesystem für Sensoren, Sensorsystem |
| CN105953926A (zh) * | 2016-07-01 | 2016-09-21 | 杨志强 | 无源无线非接触测温装置 |
| DE102016010169A1 (de) * | 2016-08-16 | 2018-02-22 | Dürr Somac GmbH | Vorrichtung zur Prüfung von Befülladaptern für Kältemittel |
| CN108106740A (zh) * | 2017-11-29 | 2018-06-01 | 苏州诺纳可电子科技有限公司 | 一种贴片式温度计 |
| CN111366258B (zh) * | 2018-12-26 | 2021-11-23 | 泰科电子(上海)有限公司 | 传感器模块、传感器模块组合 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4352290A (en) * | 1980-03-20 | 1982-10-05 | Neils John J | Heat transfer measuring apparatus |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE7219095U (de) * | 1972-11-02 | Tesa Sa | Gehäuse für-miteinander kombinierbare Apparate | |
| US4407141A (en) * | 1982-01-04 | 1983-10-04 | Whirlpool Corporation | Temperature sensing means for refrigerator |
| JPS59143261U (ja) * | 1983-03-16 | 1984-09-25 | 松下電器産業株式会社 | 太陽熱集熱制御器 |
| JP2645173B2 (ja) * | 1990-09-10 | 1997-08-25 | 株式会社東芝 | 温度分布計測型光ファイバセンサ |
| JP2660197B2 (ja) * | 1991-09-19 | 1997-10-08 | リオン株式会社 | 計測ユニツト及び計測器 |
| JPH08145807A (ja) * | 1994-11-16 | 1996-06-07 | Aisan Ind Co Ltd | 温度検出器 |
| EP0808089A1 (de) * | 1996-05-17 | 1997-11-19 | ETHECO European Thermostat Company S.p.A. | Schutzgehäuse mit Deckel und dosenförmigem Rückenteil zur Montage einer mit einem Kapillarrohr versehenen Baugruppe |
| DE10049979C5 (de) | 2000-10-06 | 2005-12-22 | Behr-Hella Thermocontrol Gmbh | Vorrichtung zur Ermittlung der Temperatur im Innenraum eines Fahrzeuges |
| US6642704B2 (en) | 2001-09-28 | 2003-11-04 | Eaton Corporation | Device for sensing electrical current and housing therefor |
| US7017433B2 (en) * | 2001-10-04 | 2006-03-28 | Ssi Technologies, Inc. | Non-contacting sensor multichip module with integral heat-sinks |
| ES2287598T3 (es) * | 2003-03-12 | 2007-12-16 | Behr-Hella Thermocontrol Gmbh | Dispositivo para la deteccion de la temperatura en el espacio interior de un vehiculo. |
| DE10316010A1 (de) * | 2003-04-07 | 2004-11-11 | Siemens Ag | Integrierter Temperatursensor zur Messung der Innenraumtemperatur, insbesondere in einem Kraftfahrzeug |
| KR20050118924A (ko) * | 2004-06-15 | 2005-12-20 | 현대자동차주식회사 | 감지장치 및 그 운영방법 |
| DE102005002363B3 (de) * | 2005-01-18 | 2006-08-31 | Siemens Ag | Kombinierter Temperatur- und Sonnensensor |
| JP5475218B2 (ja) * | 2007-03-15 | 2014-04-16 | カルソニックカンセイ株式会社 | 複合センサ |
-
2009
- 2009-04-09 DE DE102009017230A patent/DE102009017230B3/de active Active
-
2010
- 2010-04-07 JP JP2012504009A patent/JP5537648B2/ja not_active Expired - Fee Related
- 2010-04-07 CN CN201080016025.0A patent/CN102388299B/zh not_active Expired - Fee Related
- 2010-04-07 EP EP10716785A patent/EP2417429A1/de not_active Withdrawn
- 2010-04-07 WO PCT/EP2010/054604 patent/WO2010115931A1/de not_active Ceased
- 2010-04-07 KR KR1020117026501A patent/KR101716521B1/ko not_active Expired - Fee Related
-
2011
- 2011-10-06 US US13/267,475 patent/US9028143B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4352290A (en) * | 1980-03-20 | 1982-10-05 | Neils John J | Heat transfer measuring apparatus |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2010115931A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012523553A (ja) | 2012-10-04 |
| CN102388299A (zh) | 2012-03-21 |
| WO2010115931A1 (de) | 2010-10-14 |
| KR20120007529A (ko) | 2012-01-20 |
| DE102009017230B3 (de) | 2010-08-05 |
| US20120051393A1 (en) | 2012-03-01 |
| JP5537648B2 (ja) | 2014-07-02 |
| KR101716521B1 (ko) | 2017-03-14 |
| US9028143B2 (en) | 2015-05-12 |
| CN102388299B (zh) | 2015-09-23 |
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