EP2415887A4 - Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage - Google Patents

Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage

Info

Publication number
EP2415887A4
EP2415887A4 EP10758330.4A EP10758330A EP2415887A4 EP 2415887 A4 EP2415887 A4 EP 2415887A4 EP 10758330 A EP10758330 A EP 10758330A EP 2415887 A4 EP2415887 A4 EP 2415887A4
Authority
EP
European Patent Office
Prior art keywords
electronics
manufacturing
copper alloy
method therefor
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10758330.4A
Other languages
German (de)
English (en)
Other versions
EP2415887B1 (fr
EP2415887A1 (fr
Inventor
Takuma Onda
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2415887A1 publication Critical patent/EP2415887A1/fr
Publication of EP2415887A4 publication Critical patent/EP2415887A4/fr
Application granted granted Critical
Publication of EP2415887B1 publication Critical patent/EP2415887B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
EP10758330.4A 2009-03-31 2010-02-17 Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage Active EP2415887B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009088287A JP4708485B2 (ja) 2009-03-31 2009-03-31 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
PCT/JP2010/052375 WO2010113553A1 (fr) 2009-03-31 2010-02-17 Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage

Publications (3)

Publication Number Publication Date
EP2415887A1 EP2415887A1 (fr) 2012-02-08
EP2415887A4 true EP2415887A4 (fr) 2013-06-05
EP2415887B1 EP2415887B1 (fr) 2016-02-10

Family

ID=42827857

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10758330.4A Active EP2415887B1 (fr) 2009-03-31 2010-02-17 Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage

Country Status (7)

Country Link
US (1) US20120031533A1 (fr)
EP (1) EP2415887B1 (fr)
JP (1) JP4708485B2 (fr)
KR (1) KR101317096B1 (fr)
CN (1) CN102099499B (fr)
TW (1) TWI422692B (fr)
WO (1) WO2010113553A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677505B1 (ja) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4830035B2 (ja) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP5325178B2 (ja) * 2010-08-12 2013-10-23 Ｊｘ日鉱日石金属株式会社 強度、導電率及び曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5508326B2 (ja) * 2011-03-24 2014-05-28 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP5451674B2 (ja) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
CN102644005A (zh) * 2011-06-15 2012-08-22 上海飞驰铜铝材有限公司 一种用于电机制造的铜材及其制造方法
JP5437520B1 (ja) * 2013-07-31 2014-03-12 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
DE102014105823A1 (de) * 2014-04-25 2015-10-29 Harting Kgaa Nachreinigungsverfahren von metallischen Kontaktelementen
JP6306632B2 (ja) * 2016-03-31 2018-04-04 Ｊｘ金属株式会社 電子材料用銅合金
JP6385383B2 (ja) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 銅合金板材および銅合金板材の製造方法
WO2020112158A1 (fr) 2018-11-30 2020-06-04 Amerilab Technologies, Inc. Comprimés effervescents comprenant un liant de sucre cristallin et leurs procédés de fabrication
KR102005332B1 (ko) * 2019-04-09 2019-10-01 주식회사 풍산 굽힘가공성이 우수한 Cu-Co-Si-Fe-P계 구리 합금 및 그 제조 방법
CN115652132B (zh) * 2022-11-14 2023-03-31 宁波兴业盛泰集团有限公司 铜合金材料及其应用和制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920943A (ja) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The 電子電気部品用銅合金およびその製造方法
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
JP2007246931A (ja) * 2006-03-13 2007-09-27 Furukawa Electric Co Ltd:The 電気伝導性に優れた電子電気機器部品用銅合金
EP1873267A1 (fr) * 2005-03-24 2008-01-02 Nippon Mining & Metals Co., Ltd. Alliage de cuivre pour materiel electronique
JP2008088512A (ja) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk 電子材料用銅合金の製造方法
JP2008266783A (ja) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The 電気・電子機器用銅合金およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3510469B2 (ja) 1998-01-30 2004-03-29 古河電気工業株式会社 導電性ばね用銅合金及びその製造方法
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
WO2006109801A1 (fr) * 2005-04-12 2006-10-19 Sumitomo Metal Industries, Ltd. Alliage de cuivre et procédé servant à produire celui-ci
JP4937815B2 (ja) 2007-03-30 2012-05-23 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
CN102105610B (zh) * 2008-06-03 2013-05-29 古河电气工业株式会社 铜合金板材及其制造方法
JP5619389B2 (ja) * 2008-08-05 2014-11-05 古河電気工業株式会社 銅合金材料

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920943A (ja) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The 電子電気部品用銅合金およびその製造方法
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
EP1873267A1 (fr) * 2005-03-24 2008-01-02 Nippon Mining & Metals Co., Ltd. Alliage de cuivre pour materiel electronique
JP2007246931A (ja) * 2006-03-13 2007-09-27 Furukawa Electric Co Ltd:The 電気伝導性に優れた電子電気機器部品用銅合金
JP2008088512A (ja) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk 電子材料用銅合金の製造方法
JP2008266783A (ja) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The 電気・電子機器用銅合金およびその製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010113553A1 *
VARSCHAVSKY ARI ET AL: "Influence of microstructure on the subcritical crack growth in Cu-Co-Si alloys", CONGRESSO ANUAL - ASSOCIACAO BRASILEIRA DE METALURGIA E MATERIAIS,, vol. 2, 1 January 1995 (1995-01-01), pages 503 - 510, XP009168540 *

Also Published As

Publication number Publication date
EP2415887B1 (fr) 2016-02-10
CN102099499B (zh) 2013-12-18
KR101317096B1 (ko) 2013-10-11
US20120031533A1 (en) 2012-02-09
KR20110071020A (ko) 2011-06-27
CN102099499A (zh) 2011-06-15
JP4708485B2 (ja) 2011-06-22
TWI422692B (zh) 2014-01-11
EP2415887A1 (fr) 2012-02-08
TW201035338A (en) 2010-10-01
JP2010236071A (ja) 2010-10-21
WO2010113553A1 (fr) 2010-10-07

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