EP2410562A4 - Semiconductor device, method for manufacturing same, electronic device and electronic component - Google Patents

Semiconductor device, method for manufacturing same, electronic device and electronic component

Info

Publication number
EP2410562A4
EP2410562A4 EP09841905.4A EP09841905A EP2410562A4 EP 2410562 A4 EP2410562 A4 EP 2410562A4 EP 09841905 A EP09841905 A EP 09841905A EP 2410562 A4 EP2410562 A4 EP 2410562A4
Authority
EP
European Patent Office
Prior art keywords
electronic
manufacturing same
semiconductor device
electronic component
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09841905.4A
Other languages
German (de)
French (fr)
Other versions
EP2410562A1 (en
EP2410562B1 (en
Inventor
Teru Nakanishi
Nobuyuki Hayashi
Masaru Morita
Yasuhiro Yoneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP2410562A1 publication Critical patent/EP2410562A1/en
Publication of EP2410562A4 publication Critical patent/EP2410562A4/en
Application granted granted Critical
Publication of EP2410562B1 publication Critical patent/EP2410562B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
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    • H05K2201/10621—Components characterised by their electrical contacts
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
EP09841905.4A 2009-03-19 2009-10-15 Semiconductor device, method for manufacturing same, electronic device and electronic component Not-in-force EP2410562B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009069091 2009-03-19
PCT/JP2009/067856 WO2010106703A1 (en) 2009-03-19 2009-10-15 Semiconductor device, method for manufacturing same, electronic device and electronic component

Publications (3)

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US10896898B2 (en) 2015-10-28 2021-01-19 Indiana Integrated Circuits, LLC Edge interconnect self-assembly substrate
US10182498B2 (en) * 2015-10-28 2019-01-15 Indiana Integrated Circuits, LLC Substrates with interdigitated hinged edge interconnects
US9806030B2 (en) 2015-10-28 2017-10-31 Indiana Integrated Circuits, LLC Prototyping of electronic circuits with edge interconnects

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US9565755B2 (en) 2017-02-07
US9585246B2 (en) 2017-02-28
JP5590027B2 (en) 2014-09-17
EP2410562A1 (en) 2012-01-25
CN102356461A (en) 2012-02-15
US20110299255A1 (en) 2011-12-08
WO2010106703A1 (en) 2010-09-23
JPWO2010106703A1 (en) 2012-09-20
CN102356461B (en) 2014-05-07
EP2410562B1 (en) 2016-04-13
US20160192479A1 (en) 2016-06-30
US9318425B2 (en) 2016-04-19

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