EP2406406B1 - Alliage de laiton sans plomb - Google Patents
Alliage de laiton sans plomb Download PDFInfo
- Publication number
- EP2406406B1 EP2406406B1 EP09841636.5A EP09841636A EP2406406B1 EP 2406406 B1 EP2406406 B1 EP 2406406B1 EP 09841636 A EP09841636 A EP 09841636A EP 2406406 B1 EP2406406 B1 EP 2406406B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alloy
- lead
- less
- alloys
- tellurium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 52
- 239000000956 alloy Substances 0.000 title claims description 52
- 229910001369 Brass Inorganic materials 0.000 title claims description 12
- 239000010951 brass Substances 0.000 title claims description 12
- 229910052714 tellurium Inorganic materials 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 13
- 239000011701 zinc Substances 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000009428 plumbing Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002386 leaching Methods 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001340 Leaded brass Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
Definitions
- the present invention relates to brass compositions with extremely low to no lead content.
- the compositions exhibit good machinability and strength similar to that of conventional leaded brass alloy free machining brass.
- the lead phase in copper lead alloys can be affected by corrosive attacks with hot organic or mineral oil.
- hot organic or mineral oil For example, when temperature of such an alloy rises, it has been known that the oil can break down to form peroxides and organic gases which effect a degree of leaching on the lead phase within the alloy. If this leaching progresses to any appreciable extent, the component, if it is a bearing or structural component, may eventually malfunction or fail.
- the present invention relates to a brass alloy consisting of: copper, from 2% to less than 15% zinc, from 0.4% to 1.0% tellurium, less than 0.25% lead, and optionally less than 0.02% phosphorus.
- the alloy typically has a lead content of from less than 0.025% to less than 0.001% which is considered “lead-free.”
- the alloy exhibits excellent machinability and conductivity. Depending on the composition of the alloy, the tensile strength will vary between 240 MPa and 530 MPa and yield strength will vary from 200 to 450 MPa. Conductivity will range from 28% to 49% IACS.
- the machinability of the novel alloy of the invention is similar to that for lead containing compositions. This eliminates or reduces the amount of retooling needed to use the novel alloys to produce finished products such as plumbing fixtures.
- the brass alloys of the present invention are prepared by first melting copper at a temperature of about 1050°C. Zinc and tellurium are then added to the molten copper. Brass alloy is then cast into billets utilizing horizontal or vertical casting methods.
- the copper used to make the alloys is typically copper cathode or high grade uncontaminated and pure copper scrap comprising 99.95% minimum copper and to .05% impurities.
- Lead is a typical impurity, comprising less than 0.025% of the copper used.
- Zinc is the next major component comprising from 2% to less than 15% of the alloy.
- Tellurium is used as a replacement for lead. Like lead, tellurium is added to improve machinability of the alloy without the negative contribution of lead. Tellurium is added in an amount ranging from 0.4% to 1.0%. In one embodiment, tellurium comprises about .5% of the alloy. The amount of tellurium used will depend, in part, on the amount of copper used in the alloy, as copper levels increase the amount of tellurium used with decrease. Like lead, the addition of tellurium to the alloy creates discontinuities in the copper and zinc phases of the alloy like those shown in Figs 1-3 . The good dispersion of these discontinuities leads to the improved machinability of the alloys.
- One advantage of the present invention is that the alloys exhibit machinability similar to that of lead containing alloys while using significantly lower amounts of tellurium.
- phosphorous When phosphorous is used, the amount present will typically be less than 0.02% of the alloy.
- the resulting alloys will generally exhibit excellent machinability and conductivity as indicated by Ultimate Tensile Strength (UTS) ranging from 240 to 530 MPa and a yield strength of from 200 MPa to 450 MPa as determined using ASTM method B140.
- UTS Ultimate Tensile Strength
- the actual Tensile strength and Yield strength will depend, in part, on the actual composition of the alloy.
- Conductivity of the alloys will range from 28 to 45% IACS.
- the billets were then changed into an extrusion press at a temperature ranging from about 780°C to about 860°C.
- the billets were then hot extruded through a variety of dies and at different pressures to produce numerous sizes. Each shot was lubricated prior to extrusion and the extrusion dies were preheated. The results are shown in Table 2.
- Conductivity tests were then conducted on various samples. Conductivity diminishes as the ratio of zinc content increases. The results ranged from at least about 28% to about 49% maximum.
- FIGS 1-3 Photomicrographs of Samples C1, C2 and C3 were taken after draw and are shown in FIGS 1-3 .
- the micro structure in the alloys were uniform indicating good dispersion of the tellurium throughout the alloy.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
- Adornments (AREA)
Claims (6)
- Alliage de laiton composé de :cuivre ;de 2 % à moins de 15 % de zinc ;de 0,4 % à 1,0 % de tellure ;moins de 0,25 % de plomb ; etéventuellement moins de 0,02 % de phosphore.
- Alliage selon la revendication 1 ayant une teneur en plomb inférieure à 0,025 %.
- Alliage selon la revendication 1 ayant une teneur en plomb inférieure à 0,001 %.
- Alliage selon la revendication 1 ayant une résistance à la traction allant de 240 MPa à 530 MPa.
- Alliage selon la revendication 1 ayant une limite d'élasticité allant de 200 MPa à 450 MPa.
- Alliage selon la revendication 1 ayant une conductivité allant de 28 % à 49 % IACS.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL09841636T PL2406406T3 (pl) | 2009-03-09 | 2009-08-12 | Bezołowiowy stop mosiężny |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/400,283 US20100226815A1 (en) | 2009-03-09 | 2009-03-09 | Lead-Free Brass Alloy |
PCT/US2009/053505 WO2010104527A1 (fr) | 2009-03-09 | 2009-08-12 | Alliage de laiton sans plomb |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2406406A1 EP2406406A1 (fr) | 2012-01-18 |
EP2406406A4 EP2406406A4 (fr) | 2015-09-02 |
EP2406406B1 true EP2406406B1 (fr) | 2017-11-22 |
Family
ID=42678418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09841636.5A Active EP2406406B1 (fr) | 2009-03-09 | 2009-08-12 | Alliage de laiton sans plomb |
Country Status (17)
Country | Link |
---|---|
US (3) | US20100226815A1 (fr) |
EP (1) | EP2406406B1 (fr) |
JP (1) | JP2012519781A (fr) |
KR (1) | KR20110131272A (fr) |
CN (1) | CN102414337A (fr) |
AU (1) | AU2009341842A1 (fr) |
BR (1) | BRPI0924388B1 (fr) |
CA (1) | CA2754813A1 (fr) |
CO (1) | CO6450681A2 (fr) |
ES (1) | ES2655893T3 (fr) |
IL (1) | IL215077A0 (fr) |
MX (1) | MX2011009526A (fr) |
PL (1) | PL2406406T3 (fr) |
RU (1) | RU2011140852A (fr) |
SG (1) | SG174312A1 (fr) |
WO (1) | WO2010104527A1 (fr) |
ZA (1) | ZA201106652B (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109266900A (zh) * | 2018-12-07 | 2019-01-25 | 宁波艾维洁具有限公司 | 一种无铅耐腐蚀的抗脱锌黄铜合金及其制备方法 |
US11427891B2 (en) | 2019-07-24 | 2022-08-30 | Nibco Inc. | Low silicon copper alloy piping components and articles |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2027807A (en) * | 1932-05-13 | 1936-01-14 | Chase Companies Inc | Copper base alloy |
US2102388A (en) * | 1933-09-21 | 1937-12-14 | American Brass Co | Copper-sulphur alloy |
JPS6274037A (ja) * | 1985-09-26 | 1987-04-04 | Furukawa Electric Co Ltd:The | 高力高導電性銅合金 |
JPH03170646A (ja) * | 1989-11-28 | 1991-07-24 | Nippon Mining Co Ltd | 結晶粒が微細でかつ低強度な銅合金の製造方法 |
JPH03193849A (ja) * | 1989-12-22 | 1991-08-23 | Nippon Mining Co Ltd | 結晶粒が微細でかつ低強度な銅合金及びその製造方法 |
EP0518903B1 (fr) | 1990-03-06 | 1997-07-16 | United States Bronze Powders Incorporated | Ameliorations concernant les compostions pour la metallurgie des poudres |
JPH04128332A (ja) * | 1990-09-18 | 1992-04-28 | Sumitomo Metal Mining Co Ltd | Teが添加された耐腐食性に優れる黄銅 |
GB9101828D0 (en) | 1991-01-29 | 1991-03-13 | Us Bronze Powders Inc | Improvements in and relating to brass compositions |
US5137685B1 (en) * | 1991-03-01 | 1995-09-26 | Olin Corp | Machinable copper alloys having reduced lead content |
JP3418301B2 (ja) * | 1997-01-09 | 2003-06-23 | 古河電気工業株式会社 | 打抜加工性に優れた電気電子機器用銅合金 |
US6413330B1 (en) * | 1998-10-12 | 2002-07-02 | Sambo Copper Alloy Co., Ltd. | Lead-free free-cutting copper alloys |
US6471792B1 (en) * | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
JP4729680B2 (ja) * | 2000-12-18 | 2011-07-20 | Dowaメタルテック株式会社 | プレス打ち抜き性に優れた銅基合金 |
EP1731624A4 (fr) * | 2004-03-12 | 2007-06-13 | Sumitomo Metal Ind | Alliage de cuivre et m thode de production de celui-ci |
CN1563449A (zh) * | 2004-04-07 | 2005-01-12 | 四川鑫炬矿业资源开发股份有限公司 | 一种高塑性、优质锻造的环保型碲黄铜合金材料 |
EP1777305B1 (fr) * | 2004-08-10 | 2010-09-22 | Mitsubishi Shindoh Co., Ltd. | Moulage d'alliage de cuivre avec des granules de cristal raffiné |
DE502005009545D1 (de) * | 2004-10-11 | 2010-06-17 | Diehl Metall Stiftung & Co Kg | Kupfer-zink-silizium-legierung, deren verwendung und deren herstellung |
JP5116976B2 (ja) * | 2006-02-10 | 2013-01-09 | 三菱伸銅株式会社 | 半融合金鋳造用原料黄銅合金 |
-
2009
- 2009-03-09 US US12/400,283 patent/US20100226815A1/en not_active Abandoned
- 2009-08-12 ES ES09841636.5T patent/ES2655893T3/es active Active
- 2009-08-12 RU RU2011140852/02A patent/RU2011140852A/ru unknown
- 2009-08-12 AU AU2009341842A patent/AU2009341842A1/en not_active Abandoned
- 2009-08-12 CA CA2754813A patent/CA2754813A1/fr not_active Abandoned
- 2009-08-12 SG SG2011065042A patent/SG174312A1/en unknown
- 2009-08-12 CN CN2009801588751A patent/CN102414337A/zh active Pending
- 2009-08-12 PL PL09841636T patent/PL2406406T3/pl unknown
- 2009-08-12 KR KR1020117023686A patent/KR20110131272A/ko not_active Application Discontinuation
- 2009-08-12 MX MX2011009526A patent/MX2011009526A/es not_active Application Discontinuation
- 2009-08-12 WO PCT/US2009/053505 patent/WO2010104527A1/fr active Application Filing
- 2009-08-12 EP EP09841636.5A patent/EP2406406B1/fr active Active
- 2009-08-12 BR BRPI0924388-7A patent/BRPI0924388B1/pt active IP Right Grant
- 2009-08-12 JP JP2011554028A patent/JP2012519781A/ja active Pending
-
2011
- 2011-09-11 IL IL215077A patent/IL215077A0/en unknown
- 2011-09-12 ZA ZA2011/06652A patent/ZA201106652B/en unknown
- 2011-10-06 CO CO11131873A patent/CO6450681A2/es not_active Application Discontinuation
-
2016
- 2016-10-10 US US15/289,580 patent/US20170145544A1/en not_active Abandoned
-
2023
- 2023-01-02 US US18/149,139 patent/US20230151457A1/en active Pending
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
US20170145544A1 (en) | 2017-05-25 |
CA2754813A1 (fr) | 2010-09-16 |
BRPI0924388A2 (pt) | 2017-06-06 |
RU2011140852A (ru) | 2013-04-20 |
AU2009341842A1 (en) | 2011-10-06 |
CN102414337A (zh) | 2012-04-11 |
ZA201106652B (en) | 2012-05-30 |
SG174312A1 (en) | 2011-10-28 |
US20100226815A1 (en) | 2010-09-09 |
IL215077A0 (en) | 2011-12-01 |
US20230151457A1 (en) | 2023-05-18 |
EP2406406A4 (fr) | 2015-09-02 |
EP2406406A1 (fr) | 2012-01-18 |
WO2010104527A1 (fr) | 2010-09-16 |
MX2011009526A (es) | 2011-12-16 |
ES2655893T3 (es) | 2018-02-22 |
JP2012519781A (ja) | 2012-08-30 |
KR20110131272A (ko) | 2011-12-06 |
BRPI0924388B1 (pt) | 2021-05-04 |
PL2406406T3 (pl) | 2018-05-30 |
CO6450681A2 (es) | 2012-05-31 |
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