EP2387051B1 - Kondensatorelement und Verfahren zur Einkapselung eines Kondensatorgrundkörpers - Google Patents

Kondensatorelement und Verfahren zur Einkapselung eines Kondensatorgrundkörpers Download PDF

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Publication number
EP2387051B1
EP2387051B1 EP20100162724 EP10162724A EP2387051B1 EP 2387051 B1 EP2387051 B1 EP 2387051B1 EP 20100162724 EP20100162724 EP 20100162724 EP 10162724 A EP10162724 A EP 10162724A EP 2387051 B1 EP2387051 B1 EP 2387051B1
Authority
EP
European Patent Office
Prior art keywords
encapsulation
base body
capacitor element
element according
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP20100162724
Other languages
English (en)
French (fr)
Other versions
EP2387051A1 (de
Inventor
Ronald Haenssler
Rahul Eghe
Surendrababu Mottammani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to ES10162724T priority Critical patent/ES2430391T3/es
Priority to EP20100162724 priority patent/EP2387051B1/de
Priority to CN201180023631XA priority patent/CN102870177A/zh
Priority to BR112012028941A priority patent/BR112012028941A2/pt
Priority to PCT/EP2011/057715 priority patent/WO2011141557A2/en
Priority to MX2012013126A priority patent/MX2012013126A/es
Publication of EP2387051A1 publication Critical patent/EP2387051A1/de
Application granted granted Critical
Publication of EP2387051B1 publication Critical patent/EP2387051B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Claims (14)

  1. Kondensatorelement, das Folgendes umfasst:
    einen Kondensatorgrundkörper (2) und eine Kapselung (3) des Grundkörpers (2), wobei die Kapselung (3) direkt auf den Grundkörper (2) spritzgegossen wird, dadurch gekennzeichnet, dass die Kapselung (3) harzfrei ist.
  2. Kondensatorelement nach Anspruch 1, wobei die Kapselung (3) aus einem einzelnen Stück ausgebildet wird, wobei sie von Verbindungsstellen frei ist.
  3. Kondensatorelement nach einem der vorhergehenden Ansprüche, wobei die äußere Gestalt der Kapselung (3) an die äußere Gestalt des Grundkörpers (2) angepasst ist.
  4. Kondensatorelement nach einem der vorhergehenden Ansprüche, wobei die Kapselung (3) eine gleichförmige Dicke (31) aufweist.
  5. Kondensatorelement nach einem der vorhergehenden Ansprüche, wobei die Dicke (31) der Kapselung (3) im Bereich von 1,0 mm bis 2,0 mm liegt.
  6. Kondensatorelement nach einem der vorhergehenden Ansprüche, wobei der Grundkörper (2) als ein Schichtkondensator ausgebildet ist.
  7. Kondensatorelement nach einem der vorhergehenden Ansprüche, wobei die Kapselung (3) und der Grundkörper (2) ein gemeinsames Material umfassen.
  8. Kondensatorelement nach Anspruch 7, wobei das gemeinsame Material Polypropylen umfasst.
  9. Kondensatorelement nach einem der vorhergehenden Ansprüche, wobei die Kapselung (3) den Grundkörper (2) hermetisch einschließt.
  10. Kondensatorelement nach einem der vorhergehenden Ansprüche, umfassend mindestens einen elektrischen Anschluss (5) zum elektrischen Kontaktieren des Grundkörpers (2), wobei der elektrische Anschluss (5) ein einzelnes Stück umfasst, das an dem Grundkörper (2) angebracht ist und durch die Kapselung (3) führt.
  11. Kondensatorelement nach einem der vorhergehenden Ansprüche,
    wobei der Grundkörper (2) mit Öl imprägniert ist.
  12. Kondensatorelement nach einem der vorhergehenden Ansprüche,
    wobei der Grundkörper (2) als ein Schichtkondensator ausgelegt ist, der aufgewickelte metallisierte dielektrische Schichten umfasst und wobei der Basiskörper (2) eine runde zylindrische Gestalt aufweist.
  13. Kondensatorelement nach einem der vorhergehenden Ansprüche,
    wobei die Kapselung Polypropylen, Polybutylen, Terephthalat, Nylon, ein Polyethylen hoher Dichte und/oder ein Polyethylen niedriger Dichte umfasst.
  14. Verfahren zum Herstellen eines Kondensatorelements nach Anspruch 1, das die folgenden Schritte umfasst:
    A) Einsetzen eines Kondensatorgrundkörpers (2) in eine Form (7, 71, 72),
    B) Einspritzen eines Ausformmaterials in die Form (7, 71, 72), wodurch ein gekapseltes Kondensatorelement (1) ausgebildet wird und wodurch die Temperatur während des Einspritzformprozesses unter 250°C gehalten wird, wobei eine Kapselung (3) des gekapselten Kondensatorelements (1) harzfrei ist,
    C) Trennen des gekapselten Kondensatorelements (1) von der Form (7, 71, 72).
EP20100162724 2010-05-12 2010-05-12 Kondensatorelement und Verfahren zur Einkapselung eines Kondensatorgrundkörpers Not-in-force EP2387051B1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ES10162724T ES2430391T3 (es) 2010-05-12 2010-05-12 Elemento capacitor y método para encapsular un cuerpo base de capacitor
EP20100162724 EP2387051B1 (de) 2010-05-12 2010-05-12 Kondensatorelement und Verfahren zur Einkapselung eines Kondensatorgrundkörpers
CN201180023631XA CN102870177A (zh) 2010-05-12 2011-05-12 电容器元件及封装电容器基体的方法
BR112012028941A BR112012028941A2 (pt) 2010-05-12 2011-05-12 elemento de capacitor e método de encapsular um corpo de base de capacitor
PCT/EP2011/057715 WO2011141557A2 (en) 2010-05-12 2011-05-12 Capacitor element and method of encapsulating a capacitor base body
MX2012013126A MX2012013126A (es) 2010-05-12 2011-05-12 Elemento de condensador y metodo para encapsular un cuerpo base de condensador.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20100162724 EP2387051B1 (de) 2010-05-12 2010-05-12 Kondensatorelement und Verfahren zur Einkapselung eines Kondensatorgrundkörpers

Publications (2)

Publication Number Publication Date
EP2387051A1 EP2387051A1 (de) 2011-11-16
EP2387051B1 true EP2387051B1 (de) 2013-07-10

Family

ID=42562578

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20100162724 Not-in-force EP2387051B1 (de) 2010-05-12 2010-05-12 Kondensatorelement und Verfahren zur Einkapselung eines Kondensatorgrundkörpers

Country Status (6)

Country Link
EP (1) EP2387051B1 (de)
CN (1) CN102870177A (de)
BR (1) BR112012028941A2 (de)
ES (1) ES2430391T3 (de)
MX (1) MX2012013126A (de)
WO (1) WO2011141557A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112831140A (zh) * 2021-01-29 2021-05-25 福建省民爆化工股份有限公司 一体化注塑材料制备及其使用方法
WO2022216509A2 (en) * 2021-04-07 2022-10-13 Kemet Electronics Corporation Overmolded film capacitor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
DE59006271D1 (de) * 1989-03-20 1994-08-04 Siemens Ag Axialer elektrischer Wickelkondensator.
JP3071115B2 (ja) * 1994-11-25 2000-07-31 三洋電機株式会社 チップ状電子部品の製法
CN101625928B (zh) * 2009-08-05 2012-03-28 佟元江 轨道补偿电容器

Also Published As

Publication number Publication date
MX2012013126A (es) 2013-03-20
EP2387051A1 (de) 2011-11-16
WO2011141557A2 (en) 2011-11-17
WO2011141557A3 (en) 2012-01-05
CN102870177A (zh) 2013-01-09
ES2430391T3 (es) 2013-11-20
BR112012028941A2 (pt) 2016-07-26

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