EP2386117A4 - Procédés et applications de mosaïques d'imagerie non planes - Google Patents

Procédés et applications de mosaïques d'imagerie non planes Download PDF

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Publication number
EP2386117A4
EP2386117A4 EP10729657.6A EP10729657A EP2386117A4 EP 2386117 A4 EP2386117 A4 EP 2386117A4 EP 10729657 A EP10729657 A EP 10729657A EP 2386117 A4 EP2386117 A4 EP 2386117A4
Authority
EP
European Patent Office
Prior art keywords
applications
methods
planar imaging
imaging arrays
arrays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10729657.6A
Other languages
German (de)
English (en)
Other versions
EP2386117A2 (fr
Inventor
Bassel De Graff
Gilman Callsen
William J. Arora
Roozbeh Ghaffari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MC10 Inc
Original Assignee
MC10 Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Priority claimed from US12/616,922 external-priority patent/US8389862B2/en
Priority claimed from US12/636,071 external-priority patent/US8886334B2/en
Application filed by MC10 Inc filed Critical MC10 Inc
Publication of EP2386117A2 publication Critical patent/EP2386117A2/fr
Publication of EP2386117A4 publication Critical patent/EP2386117A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
EP10729657.6A 2009-01-12 2010-01-12 Procédés et applications de mosaïques d'imagerie non planes Withdrawn EP2386117A4 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US14414909P 2009-01-12 2009-01-12
US15690609P 2009-03-03 2009-03-03
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
US12/616,922 US8389862B2 (en) 2008-10-07 2009-11-12 Extremely stretchable electronics
US12/636,071 US8886334B2 (en) 2008-10-07 2009-12-11 Systems, methods, and devices using stretchable or flexible electronics for medical applications
PCT/US2010/020742 WO2010081137A2 (fr) 2009-01-12 2010-01-12 Procédés et applications de mosaïques d'imagerie non planes

Publications (2)

Publication Number Publication Date
EP2386117A2 EP2386117A2 (fr) 2011-11-16
EP2386117A4 true EP2386117A4 (fr) 2017-12-27

Family

ID=42317209

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10729657.6A Withdrawn EP2386117A4 (fr) 2009-01-12 2010-01-12 Procédés et applications de mosaïques d'imagerie non planes

Country Status (3)

Country Link
EP (1) EP2386117A4 (fr)
JP (2) JP2012515436A (fr)
WO (1) WO2010081137A2 (fr)

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US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
WO2010042653A1 (fr) 2008-10-07 2010-04-15 Mc10, Inc. Ballonnet de cathéter comportant un circuit intégré étirable et un réseau de détecteurs
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
EP2681538B1 (fr) 2011-03-11 2019-03-06 Mc10, Inc. Dispositifs intégrés destinés à faciliter des dosages quantitatifs et la pose de diagnostics
US9968300B2 (en) * 2011-04-07 2018-05-15 Sanovas Intellectual Property, Llc Anatomical visualization with electrically conductive balloon catheter
EP2712491B1 (fr) 2011-05-27 2019-12-04 Mc10, Inc. Structure électronique flexible
WO2013022853A1 (fr) 2011-08-05 2013-02-14 Mc10, Inc. Procédés de ballonnets de cathéter et appareil utilisant des éléments de détection
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
WO2013033724A1 (fr) 2011-09-01 2013-03-07 Mc10, Inc. Dispositif électronique pour détection d'une condition de tissu
DE112012004146T5 (de) 2011-10-05 2014-11-06 Mc10, Inc. Herzkatheter mit Verwendung oberflächentreuer Elektronik zur Abbildung
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
KR20150031324A (ko) 2012-07-05 2015-03-23 엠씨10, 인크 유동 감지를 포함하는 카테터 장치
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
EP2906960A4 (fr) 2012-10-09 2016-06-15 Mc10 Inc Électronique conforme intégrée à un article vestimentaire
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
CA2920485A1 (fr) 2013-08-05 2015-02-12 Mc10, Inc. Capteur de temperature souple comprenant des composants electroniques conformables
CN105705093A (zh) 2013-10-07 2016-06-22 Mc10股份有限公司 用于感测和分析的适形传感器系统
WO2015077559A1 (fr) 2013-11-22 2015-05-28 Mc10, Inc. Systèmes de capteurs conformés pour la détection et l'analyse de l'activité cardiaque
CA2935372C (fr) 2014-01-06 2023-08-08 Mc10, Inc. Systemes et dispositifs electroniques conformes encapsules et procedes de fabrication et d'utilisation de ces derniers
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
US9810623B2 (en) 2014-03-12 2017-11-07 Mc10, Inc. Quantification of a change in assay
US9591758B2 (en) 2014-03-27 2017-03-07 Intel Corporation Flexible electronic system with wire bonds
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
CN107530004A (zh) 2015-02-20 2018-01-02 Mc10股份有限公司 基于贴身状况、位置和/或取向的可穿戴式设备的自动检测和构造
WO2016140961A1 (fr) 2015-03-02 2016-09-09 Mc10, Inc. Capteur de transpiration
JP6491556B2 (ja) * 2015-07-09 2019-03-27 日東電工株式会社 配線回路基板
JP6484133B2 (ja) * 2015-07-09 2019-03-13 日東電工株式会社 配線回路基板の製造方法
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
EP3356003A4 (fr) 2015-10-01 2019-04-03 Mc10, Inc. Procédé et système d'interaction avec un environnement virtuel
EP3359031A4 (fr) 2015-10-05 2019-05-22 Mc10, Inc. Procédé et système de neuromodulation et de stimulation
JP2017134276A (ja) 2016-01-28 2017-08-03 オリンパス株式会社 撮像装置及びカプセル内視鏡
EP3420732B8 (fr) 2016-02-22 2020-12-30 Medidata Solutions, Inc. Système, dispositifs et procédé pour l'émission de données et d'énergie sur le corps
US10673280B2 (en) 2016-02-22 2020-06-02 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
US10109784B2 (en) * 2016-03-01 2018-10-23 Qualcomm Incorporated Sensor device
EP3445230B1 (fr) 2016-04-19 2024-03-13 Medidata Solutions, Inc. Procédé et système de mesure de transpiration
JP6630639B2 (ja) 2016-07-11 2020-01-15 富士フイルム株式会社 内視鏡
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
WO2018131638A1 (fr) * 2017-01-15 2018-07-19 一般財団法人 総合研究奨励会 Réseau de photodétecteurs
CN106901702B (zh) * 2017-01-25 2020-01-03 巴龙 基于柔性力敏传感元件的定量脉搏波监测装置
US11798901B1 (en) 2018-10-31 2023-10-24 Avery Dennison Retail Information Services Llc Wafer-scale integration with alternative technology wafer processes that can be folded into three-dimensional packaging
CN111243966B (zh) * 2020-01-14 2021-11-05 联合微电子中心有限责任公司 一种柔性传感器制造工艺及柔性传感器
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
EP3893611A1 (fr) 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Dépôt contrôlé d'un matériau donneur sur une surface cible

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JP2001156278A (ja) * 1999-11-26 2001-06-08 Fuji Film Microdevices Co Ltd 固体撮像装置
US20050030408A1 (en) * 2003-07-03 2005-02-10 Fuji Photo Film Co., Ltd. Solid-state image pickup device and optical instrument
WO2008030960A2 (fr) * 2006-09-06 2008-03-13 The Board Of Trustees Of The University Of Illinois Structures à déformation contrôlée dans des interconnexions de semi-conducteurs et des nanomembranes pour dispositifs électroniques étirables
US20080309807A1 (en) * 2007-06-15 2008-12-18 Sharp Kabushiki Kaisha Solid-state image pickup device and electronic apparatus including same

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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2001156278A (ja) * 1999-11-26 2001-06-08 Fuji Film Microdevices Co Ltd 固体撮像装置
US20050030408A1 (en) * 2003-07-03 2005-02-10 Fuji Photo Film Co., Ltd. Solid-state image pickup device and optical instrument
WO2008030960A2 (fr) * 2006-09-06 2008-03-13 The Board Of Trustees Of The University Of Illinois Structures à déformation contrôlée dans des interconnexions de semi-conducteurs et des nanomembranes pour dispositifs électroniques étirables
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Title
See also references of WO2010081137A2 *

Also Published As

Publication number Publication date
WO2010081137A2 (fr) 2010-07-15
WO2010081137A3 (fr) 2010-11-04
JP2012515436A (ja) 2012-07-05
JP2016006880A (ja) 2016-01-14
EP2386117A2 (fr) 2011-11-16

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Inventor name: ARORA, WILLIAM, J.

Inventor name: DE GRAFF, BASSEL

Inventor name: GHAFFARI, ROOZBEH

Inventor name: CALLSEN, GILMAN

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