EP2359981A4 - METHOD FOR REDUCING LEAD FREE SOLDER SCRUB - Google Patents

METHOD FOR REDUCING LEAD FREE SOLDER SCRUB

Info

Publication number
EP2359981A4
EP2359981A4 EP09828560A EP09828560A EP2359981A4 EP 2359981 A4 EP2359981 A4 EP 2359981A4 EP 09828560 A EP09828560 A EP 09828560A EP 09828560 A EP09828560 A EP 09828560A EP 2359981 A4 EP2359981 A4 EP 2359981A4
Authority
EP
European Patent Office
Prior art keywords
lead
free solder
reducing dross
dross method
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09828560A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2359981A1 (en
Inventor
Kun Du
Minghan Chen
Xin Chen
Liesong Cai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Solderwell Enterprise Co Ltd
Original Assignee
Guangzhou Solderwell Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Solderwell Enterprise Co Ltd filed Critical Guangzhou Solderwell Enterprise Co Ltd
Publication of EP2359981A1 publication Critical patent/EP2359981A1/en
Publication of EP2359981A4 publication Critical patent/EP2359981A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/03—Making non-ferrous alloys by melting using master alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
EP09828560A 2008-11-28 2009-06-11 METHOD FOR REDUCING LEAD FREE SOLDER SCRUB Withdrawn EP2359981A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2008102194909A CN101417374B (zh) 2008-11-28 2008-11-28 一种无铅焊料减渣方法
PCT/CN2009/072221 WO2010060299A1 (zh) 2008-11-28 2009-06-11 一种无铅焊料减渣方法

Publications (2)

Publication Number Publication Date
EP2359981A1 EP2359981A1 (en) 2011-08-24
EP2359981A4 true EP2359981A4 (en) 2011-10-05

Family

ID=40628475

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09828560A Withdrawn EP2359981A4 (en) 2008-11-28 2009-06-11 METHOD FOR REDUCING LEAD FREE SOLDER SCRUB

Country Status (5)

Country Link
US (1) US8557016B2 (ja)
EP (1) EP2359981A4 (ja)
JP (1) JP2012509992A (ja)
CN (1) CN101417374B (ja)
WO (1) WO2010060299A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101417374B (zh) * 2008-11-28 2011-05-18 广州瀚源电子科技有限公司 一种无铅焊料减渣方法
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
US9984049B2 (en) 2015-07-14 2018-05-29 Google Llc Systems and methods for providing call context to content providers
CN107012362B (zh) * 2017-05-08 2019-07-05 广州柏仕达新材料有限公司 一种锡磷合金的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2389446A1 (en) * 2002-06-10 2003-12-10 David Wai-Yin Leung Pb-free solder alloy compositions comprising essentially sn, ag, cu, and/or p
CA2502747A1 (en) * 2005-03-30 2006-09-30 David Wai-Yin Dl Leung Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus
EP1707302A2 (en) * 2005-03-30 2006-10-04 Aoki Laboratories Ltd. Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P)
US20070042211A1 (en) * 2005-08-17 2007-02-22 Sun Microsystems, Inc. Ternary alloy column grid array
CN101088698A (zh) * 2006-06-14 2007-12-19 亚通电子有限公司 无铅软钎料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1931285A (en) * 1930-10-07 1933-10-17 Us Smelting Refining & Mining Process of treating drosses
JPS5484817A (en) * 1977-12-19 1979-07-06 Topii Fuasunaa Kk Alloy for removing acid
JP4039594B2 (ja) * 1998-05-22 2008-01-30 株式会社日本スペリア社 無鉛はんだ用添加合金
JP2002336988A (ja) * 2001-05-15 2002-11-26 Tokyo Daiichi Shoko:Kk 無鉛半田合金
JP4151409B2 (ja) * 2002-01-10 2008-09-17 千住金属工業株式会社 はんだ付け方法
JP2003266193A (ja) * 2002-01-10 2003-09-24 Senju Metal Ind Co Ltd はんだ浴供給用鉛フリーはんだ
CN1318172C (zh) * 2002-01-10 2007-05-30 千住金属工业株式会社 焊接方法
JP2004259963A (ja) * 2003-02-26 2004-09-16 Minebea Co Ltd 噴流式半田付け装置
CN1919522A (zh) * 2005-09-23 2007-02-28 东莞市千岛金属锡品有限公司 一种环保型高温抗氧化焊料
CN101077552A (zh) * 2006-05-24 2007-11-28 喜星素材株式会社 焊接用的无铅合金
CN101417374B (zh) * 2008-11-28 2011-05-18 广州瀚源电子科技有限公司 一种无铅焊料减渣方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2389446A1 (en) * 2002-06-10 2003-12-10 David Wai-Yin Leung Pb-free solder alloy compositions comprising essentially sn, ag, cu, and/or p
CA2502747A1 (en) * 2005-03-30 2006-09-30 David Wai-Yin Dl Leung Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus
EP1707302A2 (en) * 2005-03-30 2006-10-04 Aoki Laboratories Ltd. Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P)
US20070042211A1 (en) * 2005-08-17 2007-02-22 Sun Microsystems, Inc. Ternary alloy column grid array
CN101088698A (zh) * 2006-06-14 2007-12-19 亚通电子有限公司 无铅软钎料

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010060299A1 *

Also Published As

Publication number Publication date
CN101417374A (zh) 2009-04-29
WO2010060299A1 (zh) 2010-06-03
CN101417374B (zh) 2011-05-18
US20110219914A1 (en) 2011-09-15
US8557016B2 (en) 2013-10-15
EP2359981A1 (en) 2011-08-24
JP2012509992A (ja) 2012-04-26

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RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 35/24 20060101ALI20110830BHEP

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Ipc: C22C 1/03 20060101ALI20110830BHEP

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