EP2350930A2 - Method for making contactless portable devices with dielectric bridge and portable devices - Google Patents

Method for making contactless portable devices with dielectric bridge and portable devices

Info

Publication number
EP2350930A2
EP2350930A2 EP09784348A EP09784348A EP2350930A2 EP 2350930 A2 EP2350930 A2 EP 2350930A2 EP 09784348 A EP09784348 A EP 09784348A EP 09784348 A EP09784348 A EP 09784348A EP 2350930 A2 EP2350930 A2 EP 2350930A2
Authority
EP
European Patent Office
Prior art keywords
antenna
support
bridge
chip
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09784348A
Other languages
German (de)
French (fr)
Inventor
Yannick Grasset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRASSET, YANNICK
RFIDEAL
Original Assignee
RFIDEAL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RFIDEAL filed Critical RFIDEAL
Publication of EP2350930A2 publication Critical patent/EP2350930A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Definitions

  • the present invention relates to a method for manufacturing non-contact integrated circuit portable objects as well as non-contact portable objects comprising such an integrated circuit.
  • the portable non-contact objects referred to in the present invention are card-sized objects, called smart cards, having a non-contact mode of operation, or else objects of various formats, intended in particular for radio frequency identification (RFID). ). These last objects of various formats are commonly called electronic tags ("tags" in English) or inlay (English). In some applications, contactless objects are intended to be incorporated in mobile phones. In particular, these are modules for Near Field Communication ("Near Field Communication").
  • the non-contact portable objects referred to in the present invention are more particularly objects whose operating frequency is a high frequency (HF), in particular equal to 13.56 MHz.
  • HF high frequency
  • the portable non-contact objects of the prior art comprise, on the one hand, an integrated circuit and, on the other hand, a conductive circuit forming antenna or antenna circuit.
  • the antenna circuit is produced, for example, by printing on an insulating support such as paper, cardboard, PET (polyethylene terephthalate), or PVC
  • this circuit is in the form of a spiral comprising a plurality of loops or turns.
  • a dielectric layer can be transferred to the antenna forming circuit.
  • This dielectric layer carries a conductive element, which provides the electrical connection between the ends of the spiral and the integrated circuit.
  • the dielectric layer and the conductive element form a bridge.
  • the complete realization of the non-contact objects of the prior art requires the implementation of four essential steps. It is, first of all, the realization of the antenna circuit and the borrows, that is to say the terminals of said antenna circuit where the integrated circuit will be connected. It is also the installation of a dielectric bridge support astride the turns of the antenna circuit. This is then the realization of the circuit of said bridge providing the connection between the inner and outer ends of the antenna circuit and the integrated circuit. It is finally the report of the integrated circuit, not on the bridge, but at the location of the terminals of the antenna circuit.
  • the connection of the contact pads of the integrated circuit to the terminals of the antenna circuit can be made according to a connection method which implements protrusions ("bumps" in English). In this case, a ball, usually made of gold, is deposited on the contact pads of the integrated circuit. It is subsequently returned ("flip-chip” in English) for a connection to said terminals.
  • the method described above has the particular disadvantage of slowing down the production machines because of the very low density of integrated circuits on the support receiving the antenna forming conductor. This low density results in a need for very frequent and long movements between the manipulator arm of the integrated circuits and the support where these same integrated circuits are connected.
  • the distance between the integrated circuits is about 8.5 cm and 5.3 cm along the two axes of the plane. This results in a maximum of 220 integrated circuits deposited per square meter.
  • the relative displacement of the manipulator arm relative to the support receiving the same integrated circuits has been of the order of 11 to 18 meters, without taking into account the displacement to seek the integrated circuits on the slab of integrated circuits ("wafer" in English).
  • the average displacement between each integrated circuit removal is thus of the order of 5.3 to 8.5 centimeters. This important distance considerably slows down the machines and consequently the rates of production of non-contact objects.
  • US-6,665,193 B1 discloses portable objects in which the electrical connection of the antenna terminals to the chip is carried out by means of a bridge carrying the chip.
  • an insulator referenced 240 in Figures 5 and 6, is necessary.
  • this insulator does not provide good protection for the chip, which remains directly subjected to the mechanical stresses that are imposed on the object.
  • the chip is certainly protected from these mechanical stresses, but it is instead positioned with respect to the turns of the antenna. As a result, the object is not properly protected from short circuits between the chip and said turns.
  • an objective technical problem to be solved by the invention is to provide a method for manufacturing non-contact integrated circuit portable objects, which overcomes the aforementioned drawbacks of the prior art and which remains compatible with all the antenna implementations and integrated circuits used.
  • the solution of the invention to this problem has as its first object a method of manufacturing portable non-contact integrated circuit objects, comprising the following steps according to which: a dielectric antenna support carrying an antenna circuit and having at least one turn and two contact terminals, a first contact terminal being internal to the antenna circuit, and a second contact terminal being external to said antenna circuit; providing a bridge comprising a dielectric bridge support, an integrated circuit chip and a circuit connecting said chip to the antenna circuit; and said bridge, provided with said chip, is reported on said dielectric antenna support, so that
  • the bridge makes an electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit, and the chip is positioned, protected between the bridge support and the antenna support or incorporated in said antenna support, offset from the turns of the antenna.
  • the second object is a non-contact integrated circuit portable object, comprising a dielectric antenna support provided with an antenna circuit having at least one turn and two contact terminals; and a bridge carried on said dielectric antenna support, said bridge comprising a dielectric bridge support and an integrated circuit chip, said bridge providing an electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit, the chip being positioned, protected between the bridge support and the antenna support or incorporated in said antenna support, offset with respect to the turns of 1 ' antenna .
  • the bridge further comprises a connection circuit and the electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit is formed by said connection circuit;
  • the bridge further comprises an insulating film, said insulating film at least partially covering the connection circuit; the bridge is carried on the antenna support so that the chip of said bridge is located between, on the one hand, the dielectric bridge support and, on the other hand, said antenna support; the chip is transferred to the bridge support by means of manipulator arms of transfer machines whose displacements are limited by the dimensions of said support; the bridge further comprises a connection circuit and in that the electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit is formed by said connection circuit; and - the object is an RFID RF object.
  • FIG. 1 shows, in perspective and in a schematic manner, a dielectric support of a bridge of an object without contact according to the invention
  • Figure 2 shows, in perspective and schematically, such a support, carrying a connection circuit
  • FIG. 3 shows, in perspective and schematically, a bridge according to the invention comprising a dielectric support, a connection circuit, a chip to integrated circuit and an insulating film, for the manufacture of a non-contact object according to the invention
  • Figure 4 shows, in perspective and schematically, a bridge for the manufacture of a non-contact object according to the invention, in a so-called inverted position
  • FIG. 1 shows, in perspective and in a schematic manner, a dielectric support of a bridge of an object without contact according to the invention
  • Figure 2 shows, in perspective and schematically, such a support, carrying a connection circuit
  • FIG. 3 shows, in perspective and schematically, a bridge according to the invention comprising a dielectric support, a connection circuit, a chip to integrated circuit and an insulating film
  • FIG. 5 presents, in perspective and schematically, a so-called bridge transfer step on an antenna support for the manufacture of a non-contact object according to the invention
  • Figure 6 shows, in cross section and schematically, a non-contact object according to the invention
  • FIG. 7 shows, in cross-section, an embodiment of a portable object according to the invention, in which the bridge is disposed on the rear face of the support, the chip being protected by the dielectric support of the bridge and positioned in a hole. arranged in the antenna dielectric support and in which the connection of the bridge to the antenna is made within holes in the antenna support;
  • FIG. 8 illustrates, in perspective, an embodiment of a portable object according to the invention, in which the bridge is disposed on the rear face of the support and the connection is made by means of folds of the bridge in holes formed in the antenna support; and
  • FIG. 9 illustrates, in cross-section, a detail of the embodiment of FIG. 8.
  • the portable non-contact objects according to the invention are standardized objects whose format can be any. They are for example in card format, or, in smaller formats, and then form RFID tags. In some cases, the format of the non-contact objects according to the invention is greater than that of a card. This is the case, for example, so-called electronic portfolios.
  • the RFID objects more particularly aimed at in the present invention are RFID-HF objects that comply with the ISO-14443 or ISO-15693 standards. Such objects notably have an operating frequency, for the transmission and reception of contactless data, of 13.56 MHz.
  • the procedure is as follows.
  • a bridge is provided.
  • such a bridge comprises a dielectric bridge support 1.
  • the dimensions of this support 1 are much smaller than the dimensions of the portable object.
  • the support 1 is rectangular, 7 to 30 mm long and 5 to 15 mm wide and has a thickness of between 20 and 80 microns. It is made of a plastic material, especially PVC, PET, or polyimide, or else in any other material such as paper or cardboard, likely to have dielectric properties.
  • the bridge further comprises a connection circuit 2.
  • This connection circuit is carried by the bridge support 1. It is for example printed on the surface of said support 1, for example in flexography or inkjet or other material deposition methods for producing a conductive element.
  • the connection circuit 2 has two connection terminals to the integrated circuit chip of the contactless object. These terminals are referenced 2-1. It further comprises two ranges 2-2 for connection to the antenna circuit. These areas 2-2 are located near the outer edges of the support 1.
  • the connection circuit 2 comprises two circuit elements, each circuit element ending in a connection terminal 2-1 and a range of connection 2-2. It will be noted that, advantageously, the connection terminals are not centered on the bridge support 1. They are shifted towards one end of said support 1, for a positioning of the chip in a staggered manner on the bridge support.
  • the bridge 5 further comprises a chip 3 integrated circuit.
  • the dimensions of the chips are very small. They are of the order of 300 to 900 microns long and wide for less than 200 microns thick.
  • the chip 3 has contact pads on which protuberances have been reported for an ohmic connection with the pads 2-2 of the connection circuit.
  • the chip 3 is provided with connection plates for a connection by capacitive coupling to the pads 2-2 of the connection circuit, through a passivation layer of said chip.
  • the chip 3 is positioned offset to one end of the support 1. It is not centered on it.
  • the bridge 5 comprises an insulating film 4.
  • This film at least partially covers the connection circuit 2. In practice, it covers a part of a first circuit element of the connection circuit 2. It consists of a dielectric plastic film of thin thickness, or any other material such as paper or such a printed or deposited insulating film, having such dielectric properties. The dimensions, in particular the width and the length of this film, are smaller than that of the bridge support 1. The thickness of this film is in an example of between 5 and 20 microns.
  • the chips 3 are carried on the bridge support 1, provided with the connection circuit 2, on the means of transfer machines equipped with manipulator arms. More particularly, a strip, intended to form the bridge supports 1, scrolls close to the transfer machine. The chips are entered and then transferred to this band, which is possibly precut to the format of the bridges. Once the chips 3 are postponed, insulating films 4 have been deposited, the bridges 5, cut, are finally transferred to the antenna support provided with the antenna circuit. To the effect of the transfer of the bridges 5, as is illustrated in FIGS. 4 and 5, in a particular embodiment of the invention, each bridge 5, provided with the connection circuit 2, the chip 3 and the film insulator 4, is returned by means of a manipulator arm. A dielectric antenna support 6 is then provided.
  • the format (length x width) of this antenna support 6 is arbitrary, but nevertheless much greater than the format of the bridge 5.
  • the thickness of the antenna support 6 is in an example between 25 and 80 microns.
  • the support 6 is made of plastic or any other suitable material having dielectric properties, such as paper or cardboard, in the case of a case of an electronic passport for example.
  • This antenna support 6 has previously been provided with a conductive circuit forming antenna or antenna circuit 7.
  • This antenna circuit 7 is for example made by printing on the surface of the support 6, according to methods of the type of those
  • the antenna circuit 7 forms, in an exemplary embodiment, a coil or spiral having at least one turn, in practice a plurality of turns. For example, in the case of Figure 5, the antenna circuit has 4 turns 7-1, 7-2, 7-3 and 7-4.
  • the terminal parts of the antenna circuit 7 form contact terminals, for a electrical connection with the connection circuit 2 of the bridge.
  • One of the terminals - the terminal referenced 8-1 in Figure 5 - is internal to the antenna circuit 7.
  • the other terminal - this is the terminal 8-2 - is a terminal outside the circuit antenna.
  • the terminals 8-1 and 8-2 are located facing each other on the support 6, on either side of the turns. The distance separating the terminals 8-1 and 8-2 is therefore greater than the width of the antenna circuit 7, here considered to be formed by all the turns 7-1, 7-2, 7-3 and 7 -4. This distance is of the order of the distance between the terminals 2-1 and 2-2 of the connection circuit 2 of the bridge 5.
  • the terminal 8-1 is shifted towards the inside of the antenna so that the distance between the inner coil 7-1 of the antenna 7 and the terminal 8-1 is greater than the length and / or the width of the chip.
  • the bridge 5 is carried on the dielectric antenna support 6 so that said bridge 5 is positioned astride the turns of the antenna circuit 7 and makes an electrical connection between, on the one hand, the chip 3 and, on the other hand, said antenna circuit 7. More specifically, the bridge 5 is carried on the support 6 so as to make an electrical connection between the terminals 8-1 and 8-2 and the 2- 2 of the connection circuit 2.
  • the chip 3 is positioned directly in contact with the dielectric support 6, between the inner coil 7-1 and the inner contact terminal 8-1, or offset from the turns. Insulating film 4 covers the turns 7-1, 7-2, and 7-3 between terminals 8-1 and 8-2.
  • an anisotropic adhesive conductive only in the vertical direction (conducting glue in Z) can be applied on the support 6 before the deposition of the bridge 5, to allow the fixing of this bridge 5 on the support 6.
  • This object 9 comprises an antenna support 6 provided with an antenna circuit 7, and a bridge 5 positioned astride the antenna circuit 7 and consequently on at least one turn of said circuit, this bridge 5 comprising a chip 3, a connection circuit 2 and an insulating film 4, which avoids short circuits between the bridge and the turns.
  • the chip 3 is positioned between the bridge support 1 and the antenna support 6. In other words, it is sandwiched between these two supports 1, 6 dielectric. It is not positioned vertically of the antenna turns 7. Thus the thickness of the object is minimized and the risk of short circuit due to the presence of the chip are themselves minimized. Finally, the protection of the chip 3 and connections thereof in the object is improved.
  • the anisotropic adhesive makes the connection between the terminals 8-1 and 8-2 of the antenna circuit 7 and the tracks 2-2 of the connection circuit of the bridge 5.
  • the chip 3 is connected to the antenna circuit 7.
  • the movements of the manipulator arms of the IC reporting machines will be more limited.
  • the bridge 5 has dimensions of the order of 10 mm wide and of the order of 20 mm long, it follows that the movement of the manipulator arms of integrated circuits will be only 1 to 2 centimeters between two IC sites.
  • the insertion density of integrated circuits increases from 220 to 5000. In the embodiment illustrated in FIG.
  • the bridge is not provided with an insulator 4 as shown in FIG. 3.
  • the bridge is not turned over either before being positioned on the support provided with the antenna. Indeed, in this embodiment, the bridge is directly transferred to the so-called rear face of the support 6 carrying the antenna 7, that is to say the face of the support 6 opposite to that carrying the antenna.
  • Two holes 9-1 and 9-2 are through holes and a hole 10 is open or unconnected.
  • Hole 9-1 is located vertically from antenna terminal 8-1.
  • Hole 9-2 is located vertically from antenna terminal 8-2.
  • the hole 10 receives the chip 3. It will then be considered that, according to the invention, the chip is positioned directly opposite the support 6, offset with respect to the turns (7-1, 7-2, 7-3 of the antenna
  • the hole 10 is located between the inner coil 7-1 and the inwardly-bent terminal 8-1, thus the chip is protected not only from the mechanical stresses by the support 1 and the support 6 in which it is located.
  • holes 11-1, 11-2 that pass through are likewise made in the antenna support 6. These holes 11-1 and 11-2 are positioned near and adjacent the terminals 8-1 and 8-2 of the antenna.
  • the bridge has terminal portions, bearing the lands 2-2, which are bent through the holes 11-1, 11-2, on the terminals 8-1 and 8-2, to make the electrical connection of the circuit 2 to 1 antenna.
  • the chip is protected in particular from the mechanical stresses, since it is positioned between the supports 1 and 6. It is protected against short circuits, in particular by the thickness of the dielectric support 6 carrying the antenna circuit.
  • the chip is positioned vertically below a portion of the support 6 not carrying an antenna circuit. This part may be deformed, as shown in FIG. 9, during the production of the object according to the invention. The delicacy of the objects is thus preserved. It should be noted that the invention does not add any complex process step allowing production at constant cost.
  • the invention allows a removal of bridges 5 according to positioning constraints much lower than those relating to the removal of an integrated circuit. Indeed, it is then a question of comparing large ranges / connection terminals compared to the sizes of the connection pads of the integrated circuits. Note that the invention allows a clear acceleration of the removal of integrated circuits, limiting point mounting rates of Inlays and Tags.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

The invention relates to a method for making contactless portable devices with an integrated circuit, and to contactless portable devices with an integrated circuit. The method of the invention is characterised in that it comprises the following steps: providing a substrate (6) for a dielectric antenna including an antenna circuit (7) having at least one turn (7-1, 7-2, 7-3, 7-4) and two contact terminals (8-1, 8-2); providing a bridge (5) having a dielectric bridge substrate (1) and a chip (3) with an integrated circuit; and placing said bridge (5) with said chip (3) onto said dielectric antenna substrate (6) so that the bridge (5) is positioned over said at least one turn (7-1, 7-2, 7-3, 7-4) and defines an electric connection between said chip (3) and said antenna circuit (7). The invention is particularly useful for HF RFID objects.

Description

PROCEDE DE FABRICATION D'OBJETS PORTATIFS SANS CONTACT AVEC PONT DIELECTRIQUE ET OBJETS PORTATIFS METHOD FOR MANUFACTURING NON-CONTACT PORTABLE OBJECTS WITH DIELECTRIC BRIDGE AND PORTABLE OBJECTS
La présente invention concerne un procédé de fabrication d'objets portatifs sans contact à circuit intégré ainsi que des objets portatifs sans contact comprenant un tel circuit intégré. Les objets portatifs sans contact visés dans la présente invention sont des objets au format carte, dits cartes à puce, disposant d'un mode de fonctionnement sans contact, ou alors, des objets de formats variés, destinés notamment à une identification par radiofréquences (RFID) . On dénomme alors couramment ces derniers objets de formats variés des étiquettes électroniques (« tag », en langue anglaise) ou des cœurs d'objets (« inlay », en langue anglaise). Dans certaines applications, les objets sans contact sont destinés à être incorporés dans des téléphones portables. Il s'agit en particulier de modules pour une communication à champ proche (« Near Field Communication », en langue anglaise) .The present invention relates to a method for manufacturing non-contact integrated circuit portable objects as well as non-contact portable objects comprising such an integrated circuit. The portable non-contact objects referred to in the present invention are card-sized objects, called smart cards, having a non-contact mode of operation, or else objects of various formats, intended in particular for radio frequency identification (RFID). ). These last objects of various formats are commonly called electronic tags ("tags" in English) or inlay (English). In some applications, contactless objects are intended to be incorporated in mobile phones. In particular, these are modules for Near Field Communication ("Near Field Communication").
Les objets portatifs sans contact visés dans la présente invention sont plus particulièrement des objets dont la fréquence de fonctionnement est une haute fréquence (HF), notamment égale à 13,56 MHz.The non-contact portable objects referred to in the present invention are more particularly objects whose operating frequency is a high frequency (HF), in particular equal to 13.56 MHz.
Les objets portatifs sans contact de l'art antérieur comportent, d'une part, un circuit intégré et, d'autre part, un circuit conducteur formant antenne ou circuit d'antenne. Le circuit d'antenne est réalisé, par exemple, par impression sur un support isolant tel du papier, carton, PET (polyéthylène téréphtalate) , ou du PVCThe portable non-contact objects of the prior art comprise, on the one hand, an integrated circuit and, on the other hand, a conductive circuit forming antenna or antenna circuit. The antenna circuit is produced, for example, by printing on an insulating support such as paper, cardboard, PET (polyethylene terephthalate), or PVC
(polychlorure de vinyle) . Pour un mode de transmission de données à hautes fréquences, ce circuit se présente sous la forme d'une spirale comprenant une pluralités de boucles ou spires. Afin de connecter le circuit intégré aux extrémités extérieure et intérieure de cette spirale, une couche diélectrique peut être reportée sur le circuit conducteur formant antenne. Cette couche diélectrique porte un élément conducteur, qui assure la connexion électrique entre les extrémités de la spirale et le circuit intégré. La couche diélectrique et l'élément conducteur forment un pont .(polyvinyl chloride). For a high-frequency data transmission mode, this circuit is in the form of a spiral comprising a plurality of loops or turns. In order to connect the integrated circuit to the outer and inner ends of this spiral, a dielectric layer can be transferred to the antenna forming circuit. This dielectric layer carries a conductive element, which provides the electrical connection between the ends of the spiral and the integrated circuit. The dielectric layer and the conductive element form a bridge.
La réalisation complète des objets sans contact de l'art antérieur nécessite la mise en œuvre de quatre étapes essentielles. Il s'agit, tout d'abord, de la réalisation du circuit d'antenne et de l'emprunte, c'est- à-dire des bornes dudit circuit d'antenne où le circuit intégré sera connecté. Il s'agit par ailleurs de la pose d'un support de pont diélectrique à cheval sur les spires du circuit d'antenne. Il s'agit ensuite de la réalisation du circuit dudit pont assurant la connexion entre les extrémités intérieure et extérieure du circuit d'antenne et du circuit intégré. Il s'agit enfin du report du circuit intégré, non pas sur le pont, mais à l'endroit des bornes du circuit d'antenne. La connexion des plages de contact du circuit intégré aux bornes du circuit d'antenne peut être réalisée selon une méthode de connexion qui met en œuvre des protubérances (« bumps », en langue anglaise) . Dans ce cas, une boule, généralement en or, est déposée sur les plages de contact du circuit intégré. Celui-ci est par la suite retourné (« flip-chip » en langue anglaise) pour une connexion auxdites bornes .The complete realization of the non-contact objects of the prior art requires the implementation of four essential steps. It is, first of all, the realization of the antenna circuit and the borrows, that is to say the terminals of said antenna circuit where the integrated circuit will be connected. It is also the installation of a dielectric bridge support astride the turns of the antenna circuit. This is then the realization of the circuit of said bridge providing the connection between the inner and outer ends of the antenna circuit and the integrated circuit. It is finally the report of the integrated circuit, not on the bridge, but at the location of the terminals of the antenna circuit. The connection of the contact pads of the integrated circuit to the terminals of the antenna circuit can be made according to a connection method which implements protrusions ("bumps" in English). In this case, a ball, usually made of gold, is deposited on the contact pads of the integrated circuit. It is subsequently returned ("flip-chip" in English) for a connection to said terminals.
Le procédé décrit ci-dessus présente notamment l'inconvénient de ralentir les machines de production du fait de la très faible densité de dépose de circuits intégrés sur le support recevant le conducteur formant antenne. Il résulte de cette faible densité un besoin de déplacements très fréquents et longs entre le bras manipulateur des circuits intégrés et le support où sont connectés ces mêmes circuits intégrés. Ainsi, pour la production d'inlays ou de tags au format classique des cartes répondant aux normes ISO, la distance entre les circuits intégrés est d'environ 8,5 cm et 5,3 cm suivant les deux axes du plan. Il en résulte un maximum de 220 circuits intégrés déposés par mètre carré. Pour poser ces 220 circuits intégrés, le déplacement relatif du/des bras manipulateurs par rapport au support recevant les mêmes circuits intégrés aura été de l'ordre de 11 à 18 mètres, sans prendre en compte le déplacement pour chercher les circuits intégrés sur la galette de circuits intégrés (« wafer » en langue anglaise) . Le déplacement moyen entre chaque dépose de circuit intégré est ainsi de l'ordre de 5,3 à 8,5 centimètres. Cette distance importante ralentit considérablement les machines et par suite les cadences de productions des objets sans contact.The method described above has the particular disadvantage of slowing down the production machines because of the very low density of integrated circuits on the support receiving the antenna forming conductor. This low density results in a need for very frequent and long movements between the manipulator arm of the integrated circuits and the support where these same integrated circuits are connected. Thus, for the production of inlays or tags in the standard format of cards meeting ISO standards, the distance between the integrated circuits is about 8.5 cm and 5.3 cm along the two axes of the plane. This results in a maximum of 220 integrated circuits deposited per square meter. To put these 220 integrated circuits, the relative displacement of the manipulator arm relative to the support receiving the same integrated circuits has been of the order of 11 to 18 meters, without taking into account the displacement to seek the integrated circuits on the slab of integrated circuits ("wafer" in English). The average displacement between each integrated circuit removal is thus of the order of 5.3 to 8.5 centimeters. This important distance considerably slows down the machines and consequently the rates of production of non-contact objects.
Par ailleurs, le document US-6,665,193 Bl divulgue des objets portatifs dans lesquels la connexion électrique des bornes d'antenne à la puce est réalisée au moyen d'un pont portant la puce. Toutefois, pour la réalisation des objets divulgués dans ce document, la dépose d'un isolant, référencé 240 aux figures 5 et 6 , est nécessaire. Dans le mode de réalisation de la figure 5, cet isolant n'assure pas une bonne protection de la puce, qui reste directement soumise aux contraintes mécaniques qui sont imposées à l'objet. Dans le mode de réalisation de la figure 6, la puce est certes protégée de ces contraintes mécaniques, mais elle est par contre positionnée au regard des spires de l'antenne. De ce fait, l'objet n'est pas correctement protégé des courts- circuits entre la puce et lesdites spires.Moreover, US-6,665,193 B1 discloses portable objects in which the electrical connection of the antenna terminals to the chip is carried out by means of a bridge carrying the chip. However, for the realization of the objects disclosed in this document, the removal of an insulator, referenced 240 in Figures 5 and 6, is necessary. In the embodiment of FIG. 5, this insulator does not provide good protection for the chip, which remains directly subjected to the mechanical stresses that are imposed on the object. In the embodiment of FIG. 6, the chip is certainly protected from these mechanical stresses, but it is instead positioned with respect to the turns of the antenna. As a result, the object is not properly protected from short circuits between the chip and said turns.
Compte tenu de ce qui précède, un problème technique objectif que se propose de résoudre l'invention est de réaliser un procédé de fabrication d'objets portatifs sans contact à circuit intégré, qui pallie les inconvénients précités de l'art antérieur et qui reste compatible avec l'ensemble des réalisations d'antennes et des circuits intégrés utilisés.In view of the foregoing, an objective technical problem to be solved by the invention is to provide a method for manufacturing non-contact integrated circuit portable objects, which overcomes the aforementioned drawbacks of the prior art and which remains compatible with all the antenna implementations and integrated circuits used.
La solution de l'invention à ce problème posé a pour premier objet un procédé de fabrication d'objets portatifs sans contact à circuit intégré, comportant des étapes suivantes selon lesquelles : on fournit un support d'antenne diélectrique portant un circuit d'antenne et présentant au moins une spire et deux bornes de contact, une première borne de contact étant intérieure au circuit d'antenne, et une seconde borne de contact étant extérieure audit circuit d'antenne ; on fournit un pont comprenant un support de pont diélectrique, une puce à circuit intégré et un circuit de connexion de ladite puce au circuit d'antenne ; et on reporte ledit pont, muni de ladite puce, sur ledit support d'antenne diélectrique, de manière queThe solution of the invention to this problem has as its first object a method of manufacturing portable non-contact integrated circuit objects, comprising the following steps according to which: a dielectric antenna support carrying an antenna circuit and having at least one turn and two contact terminals, a first contact terminal being internal to the antenna circuit, and a second contact terminal being external to said antenna circuit; providing a bridge comprising a dielectric bridge support, an integrated circuit chip and a circuit connecting said chip to the antenna circuit; and said bridge, provided with said chip, is reported on said dielectric antenna support, so that
- le pont réalise une connexion électrique entre, d'une part, ladite puce et, d'autre part, ledit circuit d'antenne, et la puce soit positionnée, protégée entre le support de pont et le support d'antenne ou incorporée dans ledit support d'antenne, en décalage par rapport aux spires de l'antenne.the bridge makes an electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit, and the chip is positioned, protected between the bridge support and the antenna support or incorporated in said antenna support, offset from the turns of the antenna.
Elle a pour second objet un objet portatif sans contact à circuit intégré, comprenant un support d'antenne diélectrique muni d'un circuit d'antenne présentant au moins une spire et deux bornes de contact ; et un pont reporté sur ledit support d'antenne diélectrique, ledit pont comprenant un support de pont diélectrique et une puce à circuit intégré, ce pont réalisant une connexion électrique entre, d'une part, ladite puce et, d'autre part, ledit circuit d'antenne, la puce étant positionnée, protégée entre le support de pont et le support d'antenne ou incorporée dans ledit support d'antenne, en décalage par rapport aux spires de 1 ' antenne ..The second object is a non-contact integrated circuit portable object, comprising a dielectric antenna support provided with an antenna circuit having at least one turn and two contact terminals; and a bridge carried on said dielectric antenna support, said bridge comprising a dielectric bridge support and an integrated circuit chip, said bridge providing an electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit, the chip being positioned, protected between the bridge support and the antenna support or incorporated in said antenna support, offset with respect to the turns of 1 ' antenna ..
De manière avantageuse, - le pont comprend en outre un circuit de connexion et la connexion électrique entre, d'une part, ladite puce et, d'autre part, ledit circuit d'antenne est réalisée par ledit circuit de connexion ; - le pont comprend en outre un film isolant, ledit film isolant couvrant au moins partiellement le circuit de connexion ; - le pont est reporté sur le support d'antenne de sorte que la puce dudit pont soit localisée entre, d'une part, le support de pont diélectrique et, d'autre part, ledit support d'antenne ; - la puce est reportée, sur le support de pont au moyen de bras manipulateur de machines de report dont les déplacements sont limités par les dimensions dudit support le pont comprend en outre un circuit de connexion et en ce que la connexion électrique entre, d'une part, ladite puce et, d'autre part, ledit circuit d'antenne est réalisée par ledit circuit de connexion ; et - l'objet est un objet RFID HF.Advantageously, the bridge further comprises a connection circuit and the electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit is formed by said connection circuit; - The bridge further comprises an insulating film, said insulating film at least partially covering the connection circuit; the bridge is carried on the antenna support so that the chip of said bridge is located between, on the one hand, the dielectric bridge support and, on the other hand, said antenna support; the chip is transferred to the bridge support by means of manipulator arms of transfer machines whose displacements are limited by the dimensions of said support; the bridge further comprises a connection circuit and in that the electrical connection between, on the one hand, said chip and, on the other hand, said antenna circuit is formed by said connection circuit; and - the object is an RFID RF object.
L'invention sera mieux comprise à la lecture de la description non limitative qui suit, et au regard des dessins, dans lesquels : la figure 1 montre, en perspective et de manière schématique, un support diélectrique d'un pont d'un objet sans contact selon l'invention ; la figure 2 montre, en perspective et de manière schématique, un tel support, portant un circuit de connexion ; la figure 3 montre, en perspective et de manière schématique, un pont selon l'invention comprenant un support diélectrique, un circuit de connexion, une puce à circuit intégré et un film isolant, pour la fabrication d'un objet sans contact selon l'invention ; la figure 4 montre, en perspective et de manière schématique, un pont pour la fabrication d'un objet sans contact selon l'invention, dans une position dite retournée ; la figure 5 présente, en perspective et de manière schématique, une étape dite de report du pont sur un support d'antenne pour la fabrication d'un objet sans contact selon l'invention ; la figure 6 présente, en coupe transversale et de manière schématique, un objet sans contact selon l'invention ; la figure 7 montre, en coupe transversale, un mode de réalisation d'un objet portatif selon l'invention, dans lequel le pont est disposé en face arrière du support, la puce étant protégée par le support diélectrique du pont et positionnée dans un trou ménagé dans le support diélectrique d'antenne et dans lequel la connexion du pont à l'antenne est réalisée au sein de trous ménagés dans le support d'antenne ; la figure 8 illustre, en perspective, un mode de réalisation d'un objet portatif selon l'invention, dans lequel le pont est disposé en face arrière du support et la connexion est réalisée au moyen de replis du pont dans des trous ménagés dans le support d'antenne ; et la figure 9 illustre, en coupe transversale, un détail du mode de réalisation de la figure 8.The invention will be better understood on reading the nonlimiting description which follows, and with reference to the drawings, in which: FIG. 1 shows, in perspective and in a schematic manner, a dielectric support of a bridge of an object without contact according to the invention; Figure 2 shows, in perspective and schematically, such a support, carrying a connection circuit; FIG. 3 shows, in perspective and schematically, a bridge according to the invention comprising a dielectric support, a connection circuit, a chip to integrated circuit and an insulating film, for the manufacture of a non-contact object according to the invention; Figure 4 shows, in perspective and schematically, a bridge for the manufacture of a non-contact object according to the invention, in a so-called inverted position; FIG. 5 presents, in perspective and schematically, a so-called bridge transfer step on an antenna support for the manufacture of a non-contact object according to the invention; Figure 6 shows, in cross section and schematically, a non-contact object according to the invention; FIG. 7 shows, in cross-section, an embodiment of a portable object according to the invention, in which the bridge is disposed on the rear face of the support, the chip being protected by the dielectric support of the bridge and positioned in a hole. arranged in the antenna dielectric support and in which the connection of the bridge to the antenna is made within holes in the antenna support; FIG. 8 illustrates, in perspective, an embodiment of a portable object according to the invention, in which the bridge is disposed on the rear face of the support and the connection is made by means of folds of the bridge in holes formed in the antenna support; and FIG. 9 illustrates, in cross-section, a detail of the embodiment of FIG. 8.
Les objets portatifs sans contact selon l'invention sont des objets normalisés dont le format peut être quelconque. Ils sont par exemple au format carte, ou alors, dans des formats plus restreints, et forment alors des étiquettes RFID. Dans certains cas, le format des objets sans contact selon l'invention est plus important que celui d'une carte. C'est le cas, par exemple, des portefeuilles dits électroniques. Les objets RFID plus particulièrement visés dans la présente invention sont des objets RFID-HF répondant aux normes ISO-14443 ou ISO- 15693. De tels objets ont notamment une fréquence de fonctionnement, pour l'émission et la réception de données sans contact, de 13,56 MHz.The portable non-contact objects according to the invention are standardized objects whose format can be any. They are for example in card format, or, in smaller formats, and then form RFID tags. In some cases, the format of the non-contact objects according to the invention is greater than that of a card. This is the case, for example, so-called electronic portfolios. The RFID objects more particularly aimed at in the present invention are RFID-HF objects that comply with the ISO-14443 or ISO-15693 standards. Such objects notably have an operating frequency, for the transmission and reception of contactless data, of 13.56 MHz.
Pour la fabrication des objets portatifs sans contact selon l'invention, on procède à la manière indiquée ci-après. Dans une première étape, on fournit un pont.For the manufacture of portable non-contact objects according to the invention, the procedure is as follows. In a first step, a bridge is provided.
Ainsi que cela est montré à la figure 1, un tel pont comprend un support 1 de pont diélectrique. Les dimensions de ce support 1 sont largement inférieures aux dimensions de l'objet portatif. Dans un exemple, le support 1 est rectangulaire, de 7 à 30 mm de long et de 5 à 15 mm de large et présente une épaisseur comprise entre 20 et 80 μm. Il est réalisé dans une matière plastique, notamment en PVC, en PET, ou en polyimide, ou alors, dans toute autre matière telle que le papier ou le carton, susceptible de présenter des propriétés diélectriques.As shown in FIG. 1, such a bridge comprises a dielectric bridge support 1. The dimensions of this support 1 are much smaller than the dimensions of the portable object. In one example, the support 1 is rectangular, 7 to 30 mm long and 5 to 15 mm wide and has a thickness of between 20 and 80 microns. It is made of a plastic material, especially PVC, PET, or polyimide, or else in any other material such as paper or cardboard, likely to have dielectric properties.
Ainsi que cela est montré à la figure 2, le pont comprend en outre un circuit de connexion 2. Ce circuit de connexion est porté par le support 1 de pont. Il est par exemple imprimé à la surface dudit support 1, par exemple en flexographie ou par jet d'encre ou selon d'autres procédés de dépôt de matière permettant la réalisation d'un élément conducteur. Le circuit de connexion 2 présente deux bornes de connexion à la puce à circuit intégré de l'objet sans contact. Ces bornes sont référencées 2-1. Il comporte en outre deux plages 2-2 de connexion au circuit d'antenne. Ces plages 2-2 sont situées à proximités des bords extérieurs du support 1. En définitive, le circuit de connexion 2 comprend deux éléments de circuit, chaque élément de circuit se terminant par une borne de connexion 2-1 et une plage de connexion 2-2. On notera que, de manière avantageuse, les bornes de connexion ne sont pas centrées sur le support 1 de pont. Elles sont décalées vers une extrémité dudit support 1, pour un positionnement de la puce de manière décalée sur le support de pont.As shown in FIG. 2, the bridge further comprises a connection circuit 2. This connection circuit is carried by the bridge support 1. It is for example printed on the surface of said support 1, for example in flexography or inkjet or other material deposition methods for producing a conductive element. The connection circuit 2 has two connection terminals to the integrated circuit chip of the contactless object. These terminals are referenced 2-1. It further comprises two ranges 2-2 for connection to the antenna circuit. These areas 2-2 are located near the outer edges of the support 1. Finally, the connection circuit 2 comprises two circuit elements, each circuit element ending in a connection terminal 2-1 and a range of connection 2-2. It will be noted that, advantageously, the connection terminals are not centered on the bridge support 1. They are shifted towards one end of said support 1, for a positioning of the chip in a staggered manner on the bridge support.
Si l'on se réfère maintenant à la figure 3, il apparaît que le pont 5 comprend de surcroît une puce 3 à circuit intégré. En pratique, dans le cas des objets sans contact selon l'invention, les dimensions des puces sont très réduites. Elles sont de l'ordre de 300 à 900 μm de long et de large pour moins de 200 μm d'épaisseur.Referring now to Figure 3, it appears that the bridge 5 further comprises a chip 3 integrated circuit. In practice, in the case of non-contact objects according to the invention, the dimensions of the chips are very small. They are of the order of 300 to 900 microns long and wide for less than 200 microns thick.
Dans un premier mode de réalisation, la puce 3 présente des plages de contact sur lesquelles on a reporté des protubérances pour une connexion ohmique avec les plages 2-2 du circuit de connexion.In a first embodiment, the chip 3 has contact pads on which protuberances have been reported for an ohmic connection with the pads 2-2 of the connection circuit.
Dans un second mode de réalisation, la puce 3 est munie de plaques de connexion pour une connexion par couplage capacitif aux plages 2-2 du circuit de connexion, au travers d'une couche de passivation de ladite puce .In a second embodiment, the chip 3 is provided with connection plates for a connection by capacitive coupling to the pads 2-2 of the connection circuit, through a passivation layer of said chip.
La puce 3 est positionnée décalée vers une extrémité du support 1. Elle n'est pas centrée sur celui-ci.The chip 3 is positioned offset to one end of the support 1. It is not centered on it.
En outre, le pont 5 comprend un film isolant 4. Ce film couvre au moins partiellement le circuit de connexion 2. En pratique, il couvre une partie d'un premier élément de circuit du circuit de connexion 2. Il est formé d'une feuille plastique diélectrique de fine épaisseur, ou de tout autre matière telle que du papier ou tel qu'un film isolant imprimé ou déposé, présentant de telles propriétés diélectriques. Les dimensions, notamment la largeur et la longueur de ce film, sont inférieures à celle du support 1 de pont. L'épaisseur de ce film est dans un exemple comprise entre 5 et 20 μm.In addition, the bridge 5 comprises an insulating film 4. This film at least partially covers the connection circuit 2. In practice, it covers a part of a first circuit element of the connection circuit 2. It consists of a dielectric plastic film of thin thickness, or any other material such as paper or such a printed or deposited insulating film, having such dielectric properties. The dimensions, in particular the width and the length of this film, are smaller than that of the bridge support 1. The thickness of this film is in an example of between 5 and 20 microns.
En pratique, les puces 3 sont reportées sur le support 1 de pont, muni du circuit de connexion 2, au moyen de machines de report munies de bras manipulateurs . Plus particulièrement, une bande, destinée à former les supports 1 de pont, défile à proximité de la machine de report. Les puces sont saisies puis reportées sur cette bande, qui est éventuellement prédécoupée au format des ponts. Une fois que les puces 3 sont reportées, que les films isolants 4 ont été déposés, les ponts 5, découpés, sont finalement reportés sur le support d'antenne muni du circuit d'antenne. A l'effet du report des ponts 5, ainsi que cela est illustré aux figures 4 et 5, dans un mode de réalisation particulier de l'invention, chaque pont 5, muni du circuit de connexion 2, de la puce 3 et du film isolant 4, est retourné au moyen d'un bras manipulateur. Un support 6 d'antenne diélectrique est alors fourni. Le format (longueur x largeur) de ce support 6 d'antenne est quelconque, mais cependant bien supérieur au format du pont 5. L'épaisseur du support 6 d'antenne est dans un exemple comprise entre 25 et 80 μm . Le support 6 est formé de plastique ou de toute autre matière appropriée présentant des propriétés diélectriques, telle que du papier ou du carton, dans le cas d'un cas d'un passeport électronique par exemple. Ce support 6 d'antenne aura été préalablement muni d'un circuit conducteur formant antenne ou circuit d'antenne 7. Ce circuit d'antenne 7 est par exemple réalisé par impression à la surface du support 6, selon des méthodes du type de celles utilisées pour la fabrication du circuit de connexion 2 du pont 5. Le circuit d'antenne 7 forme, dans un exemple de réalisation, une bobine ou une spirale présentant au moins un spire, en pratique une pluralité de spires. Par exemple, dans le cas de la figure 5, le circuit d'antenne présente 4 spires 7-1, 7- 2, 7-3 et 7-4. Les parties terminales du circuit d'antenne 7 forment des bornes de contact, pour une connexion électrique avec le circuit de connexion 2 du pont. L'une des bornes - la borne référencée 8-1 à la figure 5 - est intérieure au circuit d'antenne 7. L'autre borne - il s'agit cette fois de la borne 8-2 - est une borne extérieure au circuit d'antenne. Les bornes 8-1 et 8-2 sont situées en regard l'une de l'autre sur le support 6, de part et d'autre des spires. La distance qui sépare les bornes 8-1 et 8-2 est donc supérieure à la largeur du circuit d'antenne 7, ici considérée comme étant formée par l'ensemble des spires 7-1, 7-2, 7-3 et 7-4. Cette distance est de l'ordre de la distance qui sépare les bornes 2-1 et 2-2 du circuit de connexion 2 du pont 5. Par ailleurs, la borne 8-1 est décalée vers l'intérieur de l'antenne de sorte que la distance entre la spire intérieure 7-1 de l'antenne 7 et la borne 8-1 soit supérieure à la longueur et/ou la largeur de la puce. Ainsi, lors du report du pont, la puce sera positionnée directement au regard du support diélectrique 6 et non pas au regard des spires d'antenne. Selon l'invention, le pont 5 est reporté sur le support d'antenne diélectrique 6 de manière que ledit pont 5 soit positionné à cheval sur les spires du circuit d'antenne 7 et réalise une connexion électrique entre, d'une part, la puce 3 et, d'autre part, ledit circuit d'antenne 7. Plus précisément, le pont 5 est reporté sur le support 6 de manière à réaliser une connexion électrique entre les bornes 8-1 et 8-2 et les plages 2-2 du circuit de connexion 2. La puce 3 est positionnée directement en contact avec le support diélectrique 6, entre la spire intérieure 7-1 et la borne de contact intérieure 8-1, soit en décalage par rapport aux spires. Le film isolant 4 vient recouvrir les spires 7-1, 7-2, et 7-3 entre les bornes 8-1 et 8-2.In practice, the chips 3 are carried on the bridge support 1, provided with the connection circuit 2, on the means of transfer machines equipped with manipulator arms. More particularly, a strip, intended to form the bridge supports 1, scrolls close to the transfer machine. The chips are entered and then transferred to this band, which is possibly precut to the format of the bridges. Once the chips 3 are postponed, insulating films 4 have been deposited, the bridges 5, cut, are finally transferred to the antenna support provided with the antenna circuit. To the effect of the transfer of the bridges 5, as is illustrated in FIGS. 4 and 5, in a particular embodiment of the invention, each bridge 5, provided with the connection circuit 2, the chip 3 and the film insulator 4, is returned by means of a manipulator arm. A dielectric antenna support 6 is then provided. The format (length x width) of this antenna support 6 is arbitrary, but nevertheless much greater than the format of the bridge 5. The thickness of the antenna support 6 is in an example between 25 and 80 microns. The support 6 is made of plastic or any other suitable material having dielectric properties, such as paper or cardboard, in the case of a case of an electronic passport for example. This antenna support 6 has previously been provided with a conductive circuit forming antenna or antenna circuit 7. This antenna circuit 7 is for example made by printing on the surface of the support 6, according to methods of the type of those The antenna circuit 7 forms, in an exemplary embodiment, a coil or spiral having at least one turn, in practice a plurality of turns. For example, in the case of Figure 5, the antenna circuit has 4 turns 7-1, 7-2, 7-3 and 7-4. The terminal parts of the antenna circuit 7 form contact terminals, for a electrical connection with the connection circuit 2 of the bridge. One of the terminals - the terminal referenced 8-1 in Figure 5 - is internal to the antenna circuit 7. The other terminal - this is the terminal 8-2 - is a terminal outside the circuit antenna. The terminals 8-1 and 8-2 are located facing each other on the support 6, on either side of the turns. The distance separating the terminals 8-1 and 8-2 is therefore greater than the width of the antenna circuit 7, here considered to be formed by all the turns 7-1, 7-2, 7-3 and 7 -4. This distance is of the order of the distance between the terminals 2-1 and 2-2 of the connection circuit 2 of the bridge 5. Moreover, the terminal 8-1 is shifted towards the inside of the antenna so that the distance between the inner coil 7-1 of the antenna 7 and the terminal 8-1 is greater than the length and / or the width of the chip. Thus, during the postponement of the bridge, the chip will be positioned directly facing the dielectric support 6 and not facing the antenna turns. According to the invention, the bridge 5 is carried on the dielectric antenna support 6 so that said bridge 5 is positioned astride the turns of the antenna circuit 7 and makes an electrical connection between, on the one hand, the chip 3 and, on the other hand, said antenna circuit 7. More specifically, the bridge 5 is carried on the support 6 so as to make an electrical connection between the terminals 8-1 and 8-2 and the 2- 2 of the connection circuit 2. The chip 3 is positioned directly in contact with the dielectric support 6, between the inner coil 7-1 and the inner contact terminal 8-1, or offset from the turns. Insulating film 4 covers the turns 7-1, 7-2, and 7-3 between terminals 8-1 and 8-2.
On notera qu'une colle anisotropique, conductrice uniquement selon la verticale (colle conductrice en Z) peut être appliquée sur le support 6 avant le dépôt du pont 5, pour permettre la fixation de ce pont 5 sur le support 6.It should be noted that an anisotropic adhesive, conductive only in the vertical direction (conducting glue in Z) can be applied on the support 6 before the deposition of the bridge 5, to allow the fixing of this bridge 5 on the support 6.
On obtiendra en définitive un objet portatif sans contact 9 tel que représenté en coupe à la figure 6.We will finally obtain a non-contact portable object 9 as shown in section in FIG.
Cet objet 9 comprend un support 6 d'antenne muni d'un circuit d'antenne 7, et un pont 5 positionné à cheval sur le circuit d'antenne 7 et par suite sur au moins une spire dudit circuit, ce pont 5 comprenant une puce 3, un circuit de connexion 2 et un film isolant 4, qui évite les courts circuits entre le pont et les spires. Dans l'objet sans contact, la puce 3 est positionnée entre le support 1 de pont 5 et le support d'antenne 6. Autrement dit, elle est prise en sandwich entre ces deux supports 1, 6 diélectriques. Elle n'est pas positionnée à la verticale des spires d'antenne 7. Ainsi l'épaisseur de l'objet est minimisée et les risque de court circuit dus à la présence de la puce sont eux- mêmes minimisés. Enfin, la protection de la puce 3 et des connexions de celle-ci dans l'objet est améliorée. La colle anisotropique réalise la connexion entre les bornes 8-1 et 8-2 du circuit d'antenne 7 et les plages 2-2 du circuit de connexion du pont 5. Ainsi, la puce 3 est connectée au circuit d'antenne 7. Comme les dimensions du pont 5 sont réduites par rapport aux dimensions de l'objet, les déplacements des bras manipulateurs des machines de report de circuits intégrés seront plus limités. Par exemple, si le pont 5 présente des dimensions de l'ordre de 10 mm de large et de l'ordre de 20 mm de long, il en résulte que le déplacement des bras manipulateurs de circuits intégrés ne sera que de 1 à 2 centimètres entre deux sites de pose de circuits intégrés. Ainsi, sur un support de 1 mètre carré, la densité de pose de circuits intégrés passe de 220 à 5000. Dans le mode de réalisation illustré à la figure 7, le pont n'est pas muni d'un isolant 4 tel que montré à la figure 3. Le pont n'est pas retourné non plus avant d'être positionné sur le support muni de l'antenne. En effet, dans ce mode de réalisation, le pont est directement reporté à la face dite arrière du support 6 portant l'antenne 7, c'est-à-dire à la face du support 6 opposée à celle portant l'antenne.This object 9 comprises an antenna support 6 provided with an antenna circuit 7, and a bridge 5 positioned astride the antenna circuit 7 and consequently on at least one turn of said circuit, this bridge 5 comprising a chip 3, a connection circuit 2 and an insulating film 4, which avoids short circuits between the bridge and the turns. In the non-contact object, the chip 3 is positioned between the bridge support 1 and the antenna support 6. In other words, it is sandwiched between these two supports 1, 6 dielectric. It is not positioned vertically of the antenna turns 7. Thus the thickness of the object is minimized and the risk of short circuit due to the presence of the chip are themselves minimized. Finally, the protection of the chip 3 and connections thereof in the object is improved. The anisotropic adhesive makes the connection between the terminals 8-1 and 8-2 of the antenna circuit 7 and the tracks 2-2 of the connection circuit of the bridge 5. Thus, the chip 3 is connected to the antenna circuit 7. As the dimensions of the bridge 5 are reduced relative to the dimensions of the object, the movements of the manipulator arms of the IC reporting machines will be more limited. For example, if the bridge 5 has dimensions of the order of 10 mm wide and of the order of 20 mm long, it follows that the movement of the manipulator arms of integrated circuits will be only 1 to 2 centimeters between two IC sites. Thus, on a support of 1 square meter, the insertion density of integrated circuits increases from 220 to 5000. In the embodiment illustrated in FIG. 7, the bridge is not provided with an insulator 4 as shown in FIG. 3. The bridge is not turned over either before being positioned on the support provided with the antenna. Indeed, in this embodiment, the bridge is directly transferred to the so-called rear face of the support 6 carrying the antenna 7, that is to say the face of the support 6 opposite to that carrying the antenna.
De manière avantageuse, trois trous ont été réalisés dans le support 6. Deux trous 9-1 et 9-2 sont des trous débouchants et un trou 10 est débouchant ou non. Le trou 9-1 est situé à la verticale de la borne d'antenne 8-1. Le trou 9-2 est situé à la verticale de la borne d'antenne 8-2. Le trou 10 reçoit la puce 3. On considérera alors que, selon l'invention, la puce est positionnée directement au regard du support 6, décalée par rapport aux spires (7-1, 7-2, 7-3 de l'antenne. Le trou 10 est situé entre la spire intérieure 7-1 et la borne 8-1 décalée vers l'intérieur. Ainsi, la puce est protégée non seulement des contraintes mécaniques, par le support 1 et par le support 6 dans laquelle elle est incorporée. Elle est en outre protégée des courts-circuits, la puce étant située en décalage par rapport aux spires de l'antenne. Le procédé est mis en œuvre de manière aisée. Il n'y a pas d'étape d'ajout d'un isolant sur le pont. Par contre, une étape de réalisation des trous 9-1, 9-2 et 10 est réalisée. Cette étape peut être couplée à l'étape de réalisation (découpe) du support 1 de pont. Lorsque le support 1, muni des trous, est ainsi obtenu, le circuit de connexion 2 est réalisé. De manière avantageuse, le matériel conducteur utilisé pour la réalisation du circuit de connexion 2 est répandu dans les trous 9-1 et 9-2. L'objet ainsi obtenu est fin. L'épaisseur de l'objet est pratiquement égale à l'épaisseur cumulée des supports 1 et 6.Advantageously, three holes have been made in the support 6. Two holes 9-1 and 9-2 are through holes and a hole 10 is open or unconnected. Hole 9-1 is located vertically from antenna terminal 8-1. Hole 9-2 is located vertically from antenna terminal 8-2. The hole 10 receives the chip 3. It will then be considered that, according to the invention, the chip is positioned directly opposite the support 6, offset with respect to the turns (7-1, 7-2, 7-3 of the antenna The hole 10 is located between the inner coil 7-1 and the inwardly-bent terminal 8-1, thus the chip is protected not only from the mechanical stresses by the support 1 and the support 6 in which it is located. It is also protected against short circuits, since the chip is offset from the turns of the antenna.The process is implemented in an easy way.There is no step to add However, a step of making the holes 9-1, 9-2 and 10 is performed, this step can be coupled to the step of producing (cutting) the bridge support 1. 1, provided with the holes, is thus obtained, the connection circuit 2 is advantageously made, the conductive material used for carrying out the connecting circuit 2 is poured into the holes 9-1 and 9-2. The object thus obtained is fine. The thickness of the object is practically equal to the cumulative thickness of the supports 1 and 6.
Dans le mode de réalisation de la figure 8, des trous 11-1, 11-2 débouchants sont de même réalisés dans le support 6 d'antenne. Ces trous 11-1 et 11-2 sont positionnés à proximité et à côté des bornes 8-1 et 8-2 de l'antenne. Le pont présente des parties terminales, portant les plages 2-2, qui sont repliées au travers des trous 11-1, 11-2, sur les bornes 8-1 et 8-2, pour réaliser la connexion électrique du circuit 2 à 1 ' antenne .In the embodiment of FIG. 8, holes 11-1, 11-2 that pass through are likewise made in the antenna support 6. These holes 11-1 and 11-2 are positioned near and adjacent the terminals 8-1 and 8-2 of the antenna. The bridge has terminal portions, bearing the lands 2-2, which are bent through the holes 11-1, 11-2, on the terminals 8-1 and 8-2, to make the electrical connection of the circuit 2 to 1 antenna.
Dans ce mode de réalisation, la puce est protégée notamment des contraintes mécaniques, car elle est positionnée entre les supports 1 et 6. Elle est protégée contre les courts-circuits notamment par l'épaisseur du support diélectrique 6 portant le circuit d'antenne.In this embodiment, the chip is protected in particular from the mechanical stresses, since it is positioned between the supports 1 and 6. It is protected against short circuits, in particular by the thickness of the dielectric support 6 carrying the antenna circuit.
En outre, dans le cas où la borne 8-1 est décalée vers l'intérieur, la puce est positionnée à la verticale est au-dessous d'une partie du support 6 ne portant pas de circuit d'antenne. Cette partie peut être déformée, ainsi que cela est montré à la figure 9, lors de la réalisation de l'objet selon l'invention. La finesse des objets est ainsi conservée. On notera, que l'invention n'ajoute aucune étape complexe de procédé permettant une production à coût constant .In addition, in the case where the terminal 8-1 is shifted inwards, the chip is positioned vertically below a portion of the support 6 not carrying an antenna circuit. This part may be deformed, as shown in FIG. 9, during the production of the object according to the invention. The delicacy of the objects is thus preserved. It should be noted that the invention does not add any complex process step allowing production at constant cost.
On notera, que l'invention permet une dépose des ponts 5 selon des contraintes de positionnement très nettement inférieures à celles qui relatives à la dépose d'un circuit intégré. En effet il s'agit alors de mettre en regard des plages/bornes de connexion de grandes tailles comparées aux tailles des plages de connexion des circuits intégrés. On notera, que l'invention permet une nette accélération de la dépose des circuits intégré, point limitant les cadences de montage des Inlays et Tags .Note that the invention allows a removal of bridges 5 according to positioning constraints much lower than those relating to the removal of an integrated circuit. Indeed, it is then a question of comparing large ranges / connection terminals compared to the sizes of the connection pads of the integrated circuits. Note that the invention allows a clear acceleration of the removal of integrated circuits, limiting point mounting rates of Inlays and Tags.
On notera que, selon l'invention, il peut être réalisé des ponts standards, s 'adaptant à un ensemble de formes différentes d'antennes réalisées avec plusieurs spirales, de sorte que les quantités produites de ponts avec circuits intégrés, selon l'invention pourront être en très nette progression, devenant un produit intermédiaire dans la fabrication d'inlays ou de Tags. It should be noted that, according to the invention, it is possible to produce standard bridges, adapting to a set of different forms of antennas made with several spirals, so that the quantities produced of bridges with integrated circuits, according to the invention can be very much in progress, becoming an intermediate product in the manufacture of inlays or Tags.

Claims

REVENDICATIONS
1. Procédé de fabrication d'objets portatifs sans contact à circuit intégré, comportant des étapes suivantes selon lesquelles : on fournit un support (6) d'antenne diélectrique portant un circuit d'antenne (7) et présentant au moins une spire (7-1, 7-2, 7-3, 7-4) et deux bornes de contactA method of manufacturing non-contact integrated circuit portable objects, comprising the following steps: providing a dielectric antenna support (6) carrying an antenna circuit (7) and having at least one coil (7). -1, 7-2, 7-3, 7-4) and two contact terminals
(8-1, 8-2) , une première borne de contact (8-1) étant intérieure au circuit d'antenne, et une seconde borne de contact (8-2) étant extérieure audit circuit d'antenne ; on fournit un pont (5) comprenant un support (1) de pont diélectrique, une puce (3) à circuit intégré et un circuit de connexion de ladite puce (3) au circuit d'antenne (7) ; et on reporte ledit pont (5) , muni de ladite puce (3) , sur ledit support (6) d'antenne diélectrique, de manière que le pont (5) réalise une connexion électrique entre, d'une part, ladite puce (3) et, d'autre part, ledit circuit d'antenne (7), et - la puce (3) soit positionnée, protégée entre le support (1) de pont et le support (6) d'antenne ou incorporée dans ledit support (6) d'antenne, en décalage par rapport aux spires (7-1, 7-2, 7-3) de l'antenne (7).(8-1, 8-2), a first contact terminal (8-1) being internal to the antenna circuit, and a second contact terminal (8-2) being external to said antenna circuit; providing a bridge (5) comprising a dielectric bridge support (1), an integrated circuit chip (3) and a circuit connecting said chip (3) to the antenna circuit (7); and said bridge (5), provided with said chip (3), is deferred to said dielectric antenna support (6), so that the bridge (5) makes an electrical connection between, on the one hand, said chip ( 3) and, on the other hand, said antenna circuit (7), and - the chip (3) is positioned, protected between the bridge support (1) and the antenna support (6) or incorporated in said antenna antenna support (6), offset from the turns (7-1, 7-2, 7-3) of the antenna (7).
2. Procédé selon la revendication 1, caractérisé en ce que la borne de contact (8-1) est décalée vers le centre du support (6) et la puce (3) est positionnée directement au regard du support (1) entre la spire intérieure (7-1) de l'antenne et ladite borne (8-1).2. Method according to claim 1, characterized in that the contact terminal (8-1) is shifted towards the center of the support (6) and the chip (3) is positioned directly opposite the support (1) between the coil antenna (7-1) and said terminal (8-1).
3. Procédé selon l'une des revendications 1 ou 2 , caractérisé en ce que le pont est positionné à la face arrière du support (6) portant le circuit d'antenne. 3. Method according to one of claims 1 or 2, characterized in that the bridge is positioned at the rear face of the support (6) carrying the antenna circuit.
4. Procédé selon la revendication 3, caractérisé en ce que le support (6) présente trois trous (9-1, 9-2 et 10) et en ce que deux desdits trous réalisent une connexion aux bornes (8-1, 8-2) de l'antenne et le dernier trou (10) reçoit la puce (10) .4. Method according to claim 3, characterized in that the support (6) has three holes (9-1, 9-2 and 10) and in that two of said holes make a connection to the terminals (8-1, 8- 2) of the antenna and the last hole (10) receives the chip (10).
5. Procédé selon la revendication 3, caractérisé en ce que le support (6) présente deux trous (11-1, 11-2) dans lesquels sont repliés des extrémités du pont pour une connexion électriques aux bornes de l'antenne au travers desdits trous.5. Method according to claim 3, characterized in that the support (6) has two holes (11-1, 11-2) in which are folded ends of the bridge for an electrical connection to the antenna terminals through said holes.
6. Procédé selon l'une des revendications précédentes, caractérisé en ce que le pont (5) comprend en outre un circuit de connexion (2) et en ce que la connexion électrique entre, d'une part, ladite puce (3) et, d'autre part, ledit circuit d'antenne (7) est réalisée par ledit circuit de connexion (2) .6. Method according to one of the preceding claims, characterized in that the bridge (5) further comprises a connection circuit (2) and in that the electrical connection between, on the one hand, said chip (3) and on the other hand, said antenna circuit (7) is formed by said connection circuit (2).
7. Procédé selon l'une des revendications précédentes, caractérisé en ce que le pont (5) comprend en outre un film isolant (4), ledit film isolant (4) couvrant au moins partiellement le circuit de connexion (2) .7. Method according to one of the preceding claims, characterized in that the bridge (5) further comprises an insulating film (4), said insulating film (4) at least partially covering the connection circuit (2).
8. Procédé selon l'une des revendications précédentes, caractérisé en ce que le pont (5) est reporté sur le support d'antenne (6) de sorte que la puce (3) dudit pont (5) soit localisée entre, d'une part, le support (1) de pont diélectrique et, d'autre part, ledit support d'antenne (6) .8. Method according to one of the preceding claims, characterized in that the bridge (5) is carried on the antenna support (6) so that the chip (3) of said bridge (5) is located between, d ' on the one hand, the dielectric bridge support (1) and, on the other hand, said antenna support (6).
9. Procédé selon l'une des revendications précédentes, caractérisé en ce que la puce (3) est reportée, sur le support (1) de pont (5) au moyen de bras manipulateur de machines de report dont les déplacements sont limités par les dimensions dudit support (1) .9. Method according to one of the preceding claims, characterized in that the chip (3) is carried on the support (1) bridge (5) by means of manipulator arms of the transfer machines whose movements are limited by the dimensions of said support (1).
10. Objet portatif sans contact à circuit intégré, comprenant un support d'antenne (6) diélectrique muni d'un circuit (7) d'antenne présentant au moins une spire (7-1, 7-2, 7-3, 7-4) et deux bornes de contact (8-1, 8-2) ; et un pont (5) reporté sur ledit support (6) d'antenne diélectrique, ledit pont (5) comprenant un support (1) de pont diélectrique et une puce (3) à circuit intégré, ce pont (5) réalisant une connexion électrique entre, d'une part, ladite puce (3) et, d'autre part, ledit circuit (7) d'antenne, la puce étant positionnée, protégée entre le support (1) de pont et le support (6) d'antenne ou incorporée dans ledit support (6) d'antenne, en décalage par rapport aux spires (7-1, 7-2, 7-3) de l'antenne (7).10. A non-contact integrated circuit portable object, comprising a dielectric antenna support (6) provided with an antenna circuit (7) having at least one turn (7-1, 7-2, 7-3, 7 -4) and two contact terminals (8-1, 8-2); and a bridge (5) carried on said dielectric antenna support (6), said bridge (5) comprising a dielectric bridge support (1) and an integrated circuit chip (3), said bridge (5) making a connection between said chip (3) and said antenna circuit (7), the chip being positioned between the bridge support (1) and antenna or incorporated in said antenna support (6), offset from the turns (7-1, 7-2, 7-3) of the antenna (7).
11. Objet selon la revendication 10, caractérisé en ce que la borne de contact (8-1) est décalée vers le centre du support (6) et la puce (3) est positionnée directement au regard du support (1) entre la spire intérieure (7-1) de l'antenne et ladite borne (8-1) .11. Object according to claim 10, characterized in that the contact terminal (8-1) is shifted towards the center of the support (6) and the chip (3) is positioned directly opposite the support (1) between the coil antenna (7-1) and said terminal (8-1).
12. Objet selon l'une des revendications 10 ou 11, caractérisé en ce que le pont est positionné à la face arrière du support (6) portant le circuit d'antenne.12. Object according to one of claims 10 or 11, characterized in that the bridge is positioned at the rear face of the support (6) carrying the antenna circuit.
13. Objet selon l'une des revendications 10 à 12, caractérisé en ce que le support (6) présente trois trous (9-1, 9-2 et 10) et en ce que deux desdits trous réalisent une connexion aux bornes (8-1, 8-2) de l'antenne et le dernier trou (10) reçoit la puce (10) 13. Object according to one of claims 10 to 12, characterized in that the support (6) has three holes (9-1, 9-2 and 10) and in that two of said holes make a connection to the terminals (8). -1, 8-2) of the antenna and the last hole (10) receives the chip (10)
14. Objet selon l'une des revendication 10 à 13, caractérisé en ce que le support (6) présente deux trous (11-1, 11-2) dans lesquels sont repliés des extrémités du pont pour une connexion électriques aux bornes de l'antenne au travers desdits trous14. Object according to one of claims 10 to 13, characterized in that the carrier (6) has two holes (11-1, 11-2) in which are folded ends of the bridge for an electrical connection to the terminals of the antenna through said holes
15. Objet selon l'une des revendications 10 à 14, caractérisé en ce que le pont (5) comporte un circuit de connexion (2) muni de bornes de connexion (2-2) et de plages de connexion (2-1) à la puce (3) .15. Object according to one of claims 10 to 14, characterized in that the bridge (5) comprises a connection circuit (2) provided with connection terminals (2-2) and connection pads (2-1) to the chip (3).
16. Objet selon l'une des revendication 10 à 15, caractérisé en ce que le pont (5) comporte un film isolant (4) .16. Object according to one of claims 10 to 15, characterized in that the bridge (5) comprises an insulating film (4).
17. Objet selon l'une des revendications 10 à 16, caractérisé en ce que la puce (3) est incorporée, dans l'objet, entre, d'une part, le support de pont (1) et, d'autre part, le support d'antenne (6).17. Object according to one of claims 10 to 16, characterized in that the chip (3) is incorporated in the object between, on the one hand, the bridge support (1) and on the other hand , the antenna support (6).
18. Objet selon l'une des revendications 10 à 17, caractérisé en ce qu'il s'agit d'un objet RFID HF. 18. Object according to one of claims 10 to 17, characterized in that it is an RFID RF object.
EP09784348A 2008-11-24 2009-11-24 Method for making contactless portable devices with dielectric bridge and portable devices Withdrawn EP2350930A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0806592A FR2938954B1 (en) 2008-11-24 2008-11-24 METHOD FOR MANUFACTURING PORTABLE OBJECTS WITHOUT CONTACT WITH DIELECTRIC BRIDGE.
PCT/FR2009/001340 WO2010058109A2 (en) 2008-11-24 2009-11-24 Method for making contactless portable devices with dielectric bridge and portable devices

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EP2350930A2 true EP2350930A2 (en) 2011-08-03

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EP (1) EP2350930A2 (en)
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US9053400B2 (en) 2012-04-11 2015-06-09 Impinj, Inc. RFID integrated circuits with antenna contacts on multiple surfaces
CN104246630B (en) * 2012-04-11 2017-09-12 英频杰公司 There is the RFID integrated circuits and label of antenna contacts on multiple surfaces
US10311351B1 (en) 2012-04-11 2019-06-04 Impinj, Inc. RFID integrated circuits with antenna contacts on multiple surfaces
FR2992761B1 (en) * 2012-07-02 2015-05-29 Inside Secure METHOD FOR MANUFACTURING CONTACTLESS MICROCIRCUIT
US20140070010A1 (en) * 2012-09-10 2014-03-13 Impinj, Inc. Rfid integrated circuits with antenna contacts on multiple surfaces

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US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
WO1998048378A2 (en) * 1997-04-21 1998-10-29 Siemens Aktiengesellschaft Card inlay for chip cards
FR2787609B1 (en) * 1998-12-21 2001-02-09 Gemplus Card Int NON-CONTACT CHIP CARD MANUFACTURING PROCESS
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FR2938954A1 (en) 2010-05-28
US20110242779A1 (en) 2011-10-06
WO2010058109A3 (en) 2010-07-15
FR2938954B1 (en) 2011-06-24
WO2010058109A2 (en) 2010-05-27
US8723744B2 (en) 2014-05-13

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