EP2313683A1 - Lighting device - Google Patents
Lighting deviceInfo
- Publication number
- EP2313683A1 EP2313683A1 EP09780866A EP09780866A EP2313683A1 EP 2313683 A1 EP2313683 A1 EP 2313683A1 EP 09780866 A EP09780866 A EP 09780866A EP 09780866 A EP09780866 A EP 09780866A EP 2313683 A1 EP2313683 A1 EP 2313683A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- power supply
- lighting device
- supply unit
- cap
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 8
- 239000003086 colorant Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 101100248200 Arabidopsis thaliana RGGB gene Proteins 0.000 description 1
- 101100175002 Oryza sativa subsp. indica RGBB gene Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241000396922 Pontia daplidice Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a lighting device with at least one light source, a power supply unit for the at least one light source and a heat sink for cooling the at least one light source.
- One of the main problems in downsizing luminaires with LEDs is the distances that must be maintained between the primary and secondary sides of an associated power supply.
- the separation is essential because the LEDs electrically conductive on the heat sink and thus usually rest on a touchable metal body.
- To the primary side typically all primary components as well as the transformer core are counted.
- the required distances between the primary side and secondary-side components are, for example, according to DIN EN 60598-1 or VDE 0711-1 6.5 mm (air gap) and 5 mm (creepage distance). So far, these distances are usually maintained by a corresponding spacing of the primary side of the secondary side, in particular a heat sink, but this requires a comparatively large design.
- the lighting device has at least one light source (eg a gas discharge lamp or a light emitting diode, LED), as well as a power supply unit for the power supply of the at least one light source.
- the lighting device has Furthermore, a heat sink for cooling the at least one light source.
- the heat sink may be an active or passive cooling heat sink.
- the at least one light-emitting means is attached to the heat sink for heat dissipation and separated from the power supply unit by the heat sink.
- the at least one lighting means and the power supply unit are arranged on opposite sides of at least one heat sink area.
- the power supply unit has an electrically insulating cap which separates the power supply unit from the heat sink.
- the cap By means of the cap firstly a directly opposite arrangement is prevented (without electrical insulation or only with an air gap).
- the shortest air or creepage distance between the primary side (power supply unit) and the heat sink then runs around the cap. Since the cap has a side wall, these distances are extended, whereby an improved electrical I- insulation between the primary and secondary side and thus a higher security requirement can be met, for. B. in terms of the protection classes I to III according to DIN EN 60598-1.
- the power supply unit can be brought closer to the heat sink.
- a lighting device in which the heat sink has a passage for at least one connecting cable between the power supply unit and the at least one light source.
- a lighting device may be preferred in which the cover cap also has at least one bushing, in particular a frontal bushing, which extends through the passage of the heat sink.
- a frontal bushing which extends through the passage of the heat sink.
- a lighting device may be preferred in which the cover cap rests firmly or loosely on a receptacle for the power supply unit.
- the contact surfaces can also be glued or welded together.
- a lighting device may be preferred, in which the cover cap is integrally connected to a receptacle for the power supply unit, in particular a tubular one. Then a plastic is preferred as the material, for. As PVC, as this can be easily injection-molded.
- a lighting device in which the cap has a closed shape, so no implementation with circumferential edge has.
- the connecting lead (s) is / are then guided around the edge of the cover and guided outside on the cover to the at least one light source, preferably by a passage through the heat sink.
- a lighting device may also be preferred in which the cover cap is at least partially plugged over the power supply unit.
- the cap can be attached in particular with an open side over an object to be covered and covers this frontally (with respect to the direction of attachment) and by means of a - mostly circumferential - sidewall at least partially laterally.
- a lighting device is preferred in which the power supply unit has at least one printed circuit board equipped with at least one transformer and the cover cap is at least partially plugged over the transformer.
- the insulating cap is preferably placed over the transformer and the board that it holds by clamping.
- transformerless power supply units can also be used as long as they have a primary side and a secondary side, in particular a secondary side which is galvanically separated from the primary side.
- a lighting device which has at least one connecting line between the power supply unit and the at least one lighting means for feeding the lighting means.
- the connection line can be connected directly to the at least one light source; Alternatively, electrical or electronic elements can be interposed, for. B. a driver for controlling the at least one light source, in particular LED.
- connection line is connected to the power supply unit in the space covered by the cover, since in this way the creepage distance between the primary-side connection of the line and the heat sink is extended.
- a cap which has a shell-shaped basic shape is preferred.
- Various variations are conceivable, for. B. with a flat or curved bottom, straight or curved side wall, round (circular, oval, etc.) or square, z. B. cuboid, planing contour and so on.
- the cap is preferably made of flexible material.
- the cap can be fixed by a press fit, but also in other ways such as gluing, notching and so on.
- the cap can not be designed flexible, z. B. be made of PVC.
- a lighting device in which the cap is equipped with a means for rotational security.
- a lighting device in which the cap is equipped with a means for fixing the power supply unit.
- the lighting means is basically not limited and may have a gas discharge lamp or incandescent lamp.
- a luminous device is preferred in which the luminous means has at least one semiconductor light source such as a diode laser, but in particular a light-emitting diode.
- the light-emitting means can be present, for example, as an LED module with one light-emitting diode or several light-emitting diodes.
- the individual LEDs can each monochrome or multicolor, z. B. white, radiate. In the presence of several LEDs, these z. B. same color (monochrome or multi-colored) and / or different colors shine.
- an LED module may have a plurality of individual LEDs ('LED cluster'), which together can give a white mixed light, z. B. in 'cold white' or 'warm white'.
- the LED cluster preferably includes light-emitting diodes which shine in the primary colors red (R), green (G) and blue (B).
- single or multiple colors can also be generated by several LEDs simultaneously; Combinations RGB, RRGB, RGGB, RGBB, RGGBB etc. are possible.
- the color combination is not limited to R, G and B (and A).
- one or more amber LEDs 'amber' (A) may also be present in a warm white color tone.
- these can also be controlled so that the LED module radiates in a tunable RGB color range.
- phosphor LED blue chips can also be used, e.g. B. in surface-mounting technique, z. B. in ThInGaN technology.
- an LED module can also have a plurality of white single chips, which can be a simple scalability of the luminous flux can be achieved.
- the individual chips and / or the modules can be equipped with suitable optics for beam guidance, z.
- z. As based on InGaN, InGAlP or AlInGaP, organic LEDs (OLEDs) are generally used. Also, as semiconductor light sources, e.g. B. diode lasers are used.
- FIG. 1 shows a sectional side view of an LED lighting device according to a first embodiment
- FIG. 2 shows a sectional side view of an LED lighting device according to a second embodiment
- FIG. 3 shows a sectional side view of an LED lighting device according to a third embodiment
- 4 shows a sectional side view of an LED lighting device according to a fourth embodiment
- FIG. 5 shows a sectional side view of an LED lighting device according to a fifth embodiment.
- the device has a plurality of light emitting diodes 2, which are mounted together with associated electronic components 3 on an upper side of a circuit board 4.
- the electronic components provide at least one driver for the controlled supply of the light-emitting diodes.
- the circuit board 4 is designed as a metal core board, which rests with its underside on a flat support area 5 of a metallic heat sink 6.
- the support area 5 is laterally surrounded by a circumferential side wall 7, which (to the right of the support area 5, in the z-direction) forms a cup-shaped reflector for the light emitted by the LEDs 2 with the support area 5.
- connection region 8 for use or an electrically insulating, at least terminal tubular plastic body 9 with curved (eg round or oval) or angular (eg.
- the plastic body 9 serves as a receptacle for a power supply unit 10 and accommodates at least a part of the power supply unit 10.
- the power supply unit 10 here has a printed circuit board 11 with a transformer 12 attached to an upper side thereof
- the transformer 12 is arranged on that outer edge of the printed circuit board 11, which lies directly opposite the support region 5 of the heat sink 6.
- the secondary-side connection 13 of the transformer 12 is located in the vicinity of the Edge.
- a connecting line 14 is connected, which leads through a central passage 15 in the support area 5 of the heat sink 6 and by a subsequent passage 16 in the metal core board 5 to the top to the electrical connection.
- an electrically insulating cap 17 is plugged so far from the heat sink side end that it extends partially over the transformer 12 and the circuit board 11.
- the cap 17 separates the power supply unit 10 thereby from the heat sink 6, so that the primary and secondary sides are separated from each other. Since the cap 17 has a closed shape, the connecting lead 14 must be guided around the cap 17. In this way, both the required air and the creepage distance can be maintained even if the heat sink 6 is located directly next to the transformer 12.
- the components of the secondary side are located on the metal core board 4 with the LEDs 2. Due to the reduced size, it is in particular possible to comply with standards in terms of size.
- FIG 2 shows an LED lighting device 18 according to a second embodiment.
- the cap 19 has a bottom-side center
- the connecting line 14 can now be guided instead of around the cap through the passage .20 to the top of the metal core board 4.
- the clearance and creepage distance is calculated here essentially from the distance from the power supply unit 10 to the feedthrough 20, the length of the feedthrough 20 (along the z-axis) and the distance of the opening of the feedthrough to the metal core board 4.
- the cap 19 may be attached to the power supply unit 20 or the cooling body 6 before the power supply unit 20 and the heat sink 6 are combined.
- FIG 3 shows a lighting device 22, in which, in contrast to the lighting device 18 of FIG 2, the cap 23 is not attached to the power supply unit 10, but is attached to the outside of its side wall on the trained as a plastic body receptacle 9 for the power supply unit 10.
- the cap 23 may, for example, loose or tight sitting in the tubular receptacle 9 and / or be glued or snapped thereto.
- FIG 4 shows a lighting device 24, in which now the cap 25 is made in one piece with the receptacle 26 and thus represents a portion, here: end portion, thereof.
- the cap 25 with the receptacle 26, for example, by injection molding of plastic, for. As PVC, be prepared.
- plastic for. As PVC, be prepared.
- the cover cap region 25 has a passage 20
- This embodiment has the
- FIG. 5 shows a lighting apparatus 27 similar to that of FIG. 4, wherein the covering cap 29 integrally formed with the receptacle 28 now has webs 30 for fixing the circuit board 4 of the power supply unit 10, the circuit board 4 being inserted into the webs 30 for fixing purposes becomes.
- the present invention is not limited to the embodiments shown.
- the cap can be generally equipped with a rotation.
- This can be realized for example by at least one web in the cap - in particular on an outer side of the side wall - as an engagement element and a matching groove in the housing as a counter-engagement element, or vice versa.
- the cap can generally have a fixing means with one or more fixing elements for fixing or holding the power supply unit.
- the heat sink only needs to have an electrically conductive surface and except for metal z.
- B. also made of an electrically conductive plastic or an electrically conductive ceramic, for. B. with AlN, be built or coated with it.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008039365A DE102008039365A1 (en) | 2008-08-22 | 2008-08-22 | lighting device |
PCT/EP2009/059345 WO2010020497A1 (en) | 2008-08-22 | 2009-07-21 | Lighting device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2313683A1 true EP2313683A1 (en) | 2011-04-27 |
EP2313683B1 EP2313683B1 (en) | 2016-06-29 |
Family
ID=41131814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09780866.1A Active EP2313683B1 (en) | 2008-08-22 | 2009-07-21 | Lighting device |
Country Status (8)
Country | Link |
---|---|
US (1) | US20110211352A1 (en) |
EP (1) | EP2313683B1 (en) |
KR (1) | KR101651527B1 (en) |
CN (1) | CN102132082B (en) |
AU (1) | AU2009284289B2 (en) |
DE (1) | DE102008039365A1 (en) |
TW (1) | TW201011205A (en) |
WO (1) | WO2010020497A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1399490B1 (en) * | 2010-04-09 | 2013-04-19 | Bevilacqua De | LED LIGHTING DEVICE |
DE102010028481A1 (en) * | 2010-05-03 | 2011-11-03 | Osram Gesellschaft mit beschränkter Haftung | Electronic housing for a lamp, semiconductor lamp and method for casting an electronics housing for a lamp |
US8981636B2 (en) * | 2011-07-22 | 2015-03-17 | Panasonic Intellectual Property Management Co., Ltd. | Lamp having improved insulation of the circuit unit |
US9644799B2 (en) * | 2013-03-13 | 2017-05-09 | Smartbotics Inc. | LED light bulb construction and manufacture |
DE102013214236A1 (en) * | 2013-07-19 | 2015-01-22 | Osram Gmbh | Lighting device with semiconductor light source and driver board |
DE102014004762B4 (en) * | 2014-03-28 | 2023-01-26 | Phoenix Mecano Digital Elektronik Gmbh | LED conversion kit for outdoor lights |
EP3256772B1 (en) * | 2015-02-12 | 2019-04-10 | Signify Holding B.V. | Lighting device comprising a driver unit and method of manufacturing the same |
TWM520148U (en) * | 2015-08-21 | 2016-04-11 | 高準精密工業股份有限公司 | Structure light generating module assembly |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6580228B1 (en) * | 2000-08-22 | 2003-06-17 | Light Sciences Corporation | Flexible substrate mounted solid-state light sources for use in line current lamp sockets |
JP2005209449A (en) * | 2004-01-21 | 2005-08-04 | Asahi Matsushita Electric Works Ltd | High frequency lighting device for fluorescent lamp and illuminator |
US7758223B2 (en) * | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
JP4482706B2 (en) * | 2005-04-08 | 2010-06-16 | 東芝ライテック株式会社 | Light bulb lamp |
CN101660738A (en) * | 2005-04-08 | 2010-03-03 | 东芝照明技术株式会社 | Lamp |
DE102005025623A1 (en) * | 2005-06-03 | 2006-12-07 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | LED luminaire and arrangement of luminaire body and LED control gear |
WO2007036958A1 (en) * | 2005-09-27 | 2007-04-05 | Immobiliare Eder S.R.L. | Power led type lighting or light signaling device |
EP1862732B1 (en) * | 2006-05-31 | 2008-12-03 | Osram Gesellschaft mit Beschränkter Haftung | A mounting arrangement for LED lamps |
TWM304736U (en) * | 2006-07-06 | 2007-01-11 | Augux Co Ltd | Illuminating source structure for heat dissipation type LED signal lamp |
US7922359B2 (en) * | 2006-07-17 | 2011-04-12 | Liquidleds Lighting Corp. | Liquid-filled LED lamp with heat dissipation means |
JP2008034140A (en) | 2006-07-26 | 2008-02-14 | Atex Co Ltd | Led lighting device |
EP1914470B1 (en) * | 2006-10-20 | 2016-05-18 | OSRAM GmbH | Semiconductor lamp |
-
2008
- 2008-08-22 DE DE102008039365A patent/DE102008039365A1/en not_active Ceased
-
2009
- 2009-07-21 US US13/059,742 patent/US20110211352A1/en not_active Abandoned
- 2009-07-21 CN CN200980132844.9A patent/CN102132082B/en active Active
- 2009-07-21 WO PCT/EP2009/059345 patent/WO2010020497A1/en active Application Filing
- 2009-07-21 KR KR1020117006577A patent/KR101651527B1/en active IP Right Grant
- 2009-07-21 AU AU2009284289A patent/AU2009284289B2/en active Active
- 2009-07-21 EP EP09780866.1A patent/EP2313683B1/en active Active
- 2009-08-18 TW TW098127657A patent/TW201011205A/en unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2010020497A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102008039365A1 (en) | 2010-03-04 |
KR101651527B1 (en) | 2016-08-26 |
TW201011205A (en) | 2010-03-16 |
AU2009284289B2 (en) | 2015-05-28 |
EP2313683B1 (en) | 2016-06-29 |
WO2010020497A1 (en) | 2010-02-25 |
AU2009284289A1 (en) | 2010-02-25 |
CN102132082B (en) | 2014-03-12 |
CN102132082A (en) | 2011-07-20 |
KR20110048057A (en) | 2011-05-09 |
US20110211352A1 (en) | 2011-09-01 |
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