EP2307865A1 - System and method for a temperature sensor using temperature balance - Google Patents
System and method for a temperature sensor using temperature balanceInfo
- Publication number
- EP2307865A1 EP2307865A1 EP09790079A EP09790079A EP2307865A1 EP 2307865 A1 EP2307865 A1 EP 2307865A1 EP 09790079 A EP09790079 A EP 09790079A EP 09790079 A EP09790079 A EP 09790079A EP 2307865 A1 EP2307865 A1 EP 2307865A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- temperature
- heat flux
- probe
- under test
- sensing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000004907 flux Effects 0.000 claims abstract description 64
- 239000000523 sample Substances 0.000 claims abstract description 59
- 238000012360 testing method Methods 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 230000001419 dependent effect Effects 0.000 claims 2
- 238000010276 construction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/165—Special arrangements for conducting heat from the object to the sensitive element for application in zero heat flux sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
Definitions
- the subject matter described herein relates generally to sensing devices and, more particularly, to a device and method for increasing the accuracy of temperature measurement.
- Sensing devices or probes for measuring temperature such as resistance temperature devices (RTDs) are generally known in the field. Most of these probes have significant thermal capacity and, through their construction, lose heat to their surroundings. This can create problems when a probe comes into contact with a body or surface whose temperature is being measured, referred to herein as the unknown, or body under test.
- a probe that attempts to measure the temperature of an unknown is typically at a different temperature, for example room temperature, from the unknown. This creates a heat transfer problem when the probe comes into contact with the body under test. Because the probe is at a different temperature from the unknown, the probe actually changes the temperature of the unknown when the two come into contact. Therefore, the probe may critically interfere with the temperature of the unknown so that an accurate temperature of the unknown cannot be detected.
- the body under test When using a known device or probe to measure temperature, it must be in close thermal contact (low thermal resistance) with the body under test. Conversely, the body under test must have a low thermal resistance with the probe. The body under test must have a heat source or sink of some capacity in order to supply or remove heat energy to/from the probe, making the probe temperature the same temperature as the body under test, and sustain the energy losses from the probe at this temperature. If these conditions are not met, the probe will cool or warm the body under test, changing the temperature of the body under test and causing a measurement error.
- a non-contact method To measure the temperature of an unknown with high thermal resistance, a non-contact method is typically used.
- non-contact methods use Infra Red (IR) radiation from the unknown, which is detected by an IR sensor that is usually physically remote from the unknown.
- IR Infra Red
- both noise and surface emissivity limit the system accuracy in the cases where non-contact temperature measuring devices are used.
- sensing device that more accurately measures the temperature of an unknown with a high thermal resistance. It is further desirable to provide a sensing device that more accurately measures the temperature of an unknown with a low thermal resistance and poor supply of heat. In addition, it is desirable to provide a sensing device that measures temperature more accurately where there is poor thermal contact between an unknown and the sensing device.
- a temperature sensing device for measuring the temperature of a body under test comprises a probe in contact with the body under test and a means for preventing heat transfer to or from the body under test.
- the means for preventing heat transfer to or from the body under test delivers heat energy to or from the probe.
- a temperature sensing device for measuring the temperature of a body under test comprises a probe and a heating/cooling source for preventing heat transfer to or from the body under test.
- the temperature sensing device further comprises a heat flux sensor. A temperature difference between the probe and the heating/cooling source drives a heat flux through the heat flux sensor.
- a method for determining the temperature of a body under test comprises bringing a probe into contact with the body under test and preventing heat transfer to or from the body under test by delivering heat energy to or from the probe using a thermal energy supply. The method further comprises balancing the temperature of the probe with the temperature of the body under test based upon a heat flux between the probe and the thermal energy supply.
- FIG. 1 is a schematic diagram of a temperature sensing device in contact with a body under test according to an embodiment of the invention.
- An embodiment of the present invention concerns a device and method for measuring the temperature of an unknown, or body under test.
- Energy namely, heat loss or heat gain
- a thermal energy supply which serves to balance the temperature of the sensing device with the temperature of the unknown.
- the thermal energy supply is a means for preventing heat transfer to or from the unknown.
- the thermal energy supply is a heating/cooling source.
- the device further comprises a heat flux sensor coupled to the heating/cooling source. The heating/cooling source heats or cools the device to the temperature of the unknown, thereby reducing the heat flux sensed by the heat flux sensor to zero.
- Temperature sensing device 10 comprises thermometer element 7, which in turn includes thermometer display 1.
- Thermometer element 7 may comprise a Resistance Temperature Device (RTD) as known in the art.
- Thermometer 7 may also be a thermo-couple, thermistor or other temperature sensor which operates over the desired temperature range with the desired accuracy.
- Thermometer 7 is configured to measure the temperature of the thermal energy supply, shown in FIG. 1 as heating/cooling source 3.
- any thermal losses and the thermal capacity of thermometer 7 are supplied by heating/cooling source 3 and not by the body of unknown temperature 6, also referred to herein as the unknown or body under test.
- heating/cooling source 3 comprises a Peltier Thermoelectric Device, also known as a thermal electric cooler (TEC).
- TEC thermal electric cooler
- temperature sensing device 10 may be heated or cooled depending on the direction of heat flux.
- Other systems that have the ability to heat and cool may also comprise heating/cooling source 3.
- heating/cooling source 3 comprises only a heating source.
- Heaters suitable for use in temperature sensing device 10 include, for example, resistive elements such as Nichrome wire.
- heating/cooling source 3 comprises only a cooling source. Coolers suitable for use in temperature sensing device 10 include, for example, evaporative coolers and phase change coolers.
- Heat flux sensor 4 Connected to heating/cooling source 3 is heat flux sensor 4. Heating/cooling source 3 and heat flux sensor 4 are connected so as to minimize thermal resistance at their junction and distribute energy across the surface area of heat flux sensor 4. Heat flux sensor 4 may comprise any device that gives an electrical output proportional to the heat energy or 'flux' which flows through it. [0017] Heat flux sensor 4 is also connected to sensor probe 5. Heat flux sensor 4 and sensor probe 5 are also connected so as to minimize thermal resistance at their junction and distribute energy across the surface area of heat flux sensor 4. In an embodiment of the invention, heat flux sensor 4 is disposed in between heating/cooling source 3 and probe 5. Probe 5 provides a means of thermally connecting heat flux sensor 4 to the unknown 6.
- probe 5 may be constructed of a material of high conductivity and low thermal mass, including, but not limited to diamond or ceramic material.
- probe 5 is made as small as possible to minimize its thermal resistance and thermal mass while allowing a practical mechanical construction and providing adequate convenience to the user.
- heat flux sensor 4 outputs electrical signals to feedback control circuit 2, which comprises an amplifier.
- the electrical signals are proportional to the magnitude and direction of the heat flux through heat flux sensor 4.
- control circuit 2 adjusts the power to heating/cooling source 3 so as to bring the heat flux to zero or approximately zero.
- Indicator 8 indicates when this condition is achieved, and control circuit 2 enters a neutral state. At this point, the unknown temperature can be read from the display 1.
- Indicator 8 receives output signals from control circuit 2 and comprises a light source (not shown) that turns on when the reading on display 1 is valid. Indicator 8 may also comprise an alarm that sounds when the reading is valid. Regarding display 1 , the displayed temperature value itself may be blank until valid, flashed until valid, or replaced by a word such as "wait” until valid. Indicator 8 is any form of indication to the user that the temperature balance has settled and hence the displayed reading on display 1 is valid. [0020] Referring to the use of temperature sensing device 10 described above to determine the temperature of the unknown 6, probe 5 is first brought into contact with the body under test or unknown 6. When there is a thermal resistance between temperature sensing device 10 and the unknown 6, there is a heat flux either into or out of probe 5. In either case, the temperature of probe 5 becomes different from that of heating/cooling source 3. The temperature difference between sensor probe 5 and heating/cooling source 3 drives a heat flux through heat flux sensor 4.
- Heat flux sensor 4 outputs signals to control circuit 2, and control circuit 2 passes a corresponding current to heating/cooling source 3.
- the current passed from control circuit 2 adjusts the power to heating/cooling source 3 such that the heat flux sensed by heat flux sensor 4 is brought to zero.
- the current passed may be proportional to the magnitude and direction of the sensed heat flux.
- the output of control circuit 2 is also connected to indicator 8. Based on the type of indicator comprising indicator 8, indicator 8 is configured to indicate or show when the heat flux is zero, or approximately zero.
- Temperature sensing device 10 serves to balance the temperatures of the elements mentioned below so that the heat flux equals zero. The heat flux equals zero when sensor probe 5, heating/cooling source 3, and thermometer element 7 are the same temperature, and the heat flux into or out of the unknown 6 via probe 5 is also zero. Therefore, when the heat flux equals zero, sensor probe 5 is at the same temperature as the unknown 6.
- thermometer element 7 should accurately reflect the temperature of the unknown 6.
- the displayed temperature value on display 1 , the measurement valid indication from indicator 8, and any other data may instead or additionally be transferred from the sensing system 10 to a remote display computer or other instrument using a data interface such as an analogue signal or a digital interface.
- a data interface such as an analogue signal or a digital interface.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0813994.1A GB2462293B (en) | 2008-07-31 | 2008-07-31 | System and method for a temperature sensor using temprature balance |
PCT/US2009/049694 WO2010014354A1 (en) | 2008-07-31 | 2009-07-06 | System and method for a temperature sensor using temperature balance |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2307865A1 true EP2307865A1 (en) | 2011-04-13 |
Family
ID=39767274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09790079A Ceased EP2307865A1 (en) | 2008-07-31 | 2009-07-06 | System and method for a temperature sensor using temperature balance |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2307865A1 (en) |
JP (1) | JP2012504750A (en) |
CN (1) | CN102112851A (en) |
GB (2) | GB2462293B (en) |
WO (1) | WO2010014354A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9943232B2 (en) | 2014-02-03 | 2018-04-17 | Welch Allyn, Inc. | Thermometry heating and sensing assembly |
DE102014017080A1 (en) | 2014-11-19 | 2015-06-11 | Daimler Ag | Device for balancing a heat flow |
JP2017187450A (en) * | 2016-04-08 | 2017-10-12 | 株式会社デンソー | Heat flux meter and abnormality diagnosis device |
JP7005513B2 (en) | 2016-05-18 | 2022-01-21 | コーニンクレッカ フィリップス エヌ ヴェ | Single heat flux sensor device |
SE541080C2 (en) * | 2016-05-27 | 2019-04-02 | Jondetech Sensors Ab Publ Ab | Calibrating a heat flux sensor for measuring body temperature of an individual |
IT201800007903A1 (en) * | 2018-08-06 | 2020-02-06 | Mole Abrasivi Ermoli Srl | ABRASIVE WHEEL AND CONTROL METHOD FOR A GRINDING MACHINE INCLUDING THIS WHEEL |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53131082A (en) * | 1978-04-28 | 1978-11-15 | Hitachi Ltd | Surface temperature detector |
JP2982026B2 (en) * | 1991-06-05 | 1999-11-22 | 東京エレクトロン株式会社 | Temperature measuring device and temperature measuring device for body to be heated using the same |
JP2949314B2 (en) * | 1991-09-09 | 1999-09-13 | 株式会社日立製作所 | Calorimeter and method |
GB2266771B (en) * | 1992-04-22 | 1995-11-01 | Robert Lendrum Fyfe | Heatflow balancing thermometer |
US5884235A (en) * | 1996-12-17 | 1999-03-16 | Integrated Systems, Inc. | Non-contact, zero-flux temperature sensor |
GB0103886D0 (en) * | 2001-02-16 | 2001-04-04 | Baumbach Per L | Temperature measuring device |
EP1249691A1 (en) * | 2001-04-11 | 2002-10-16 | Omron Corporation | Electronic clinical thermometer |
DE102006012338B3 (en) * | 2006-03-17 | 2007-07-19 | Drägerwerk AG | Core temperature measuring arrangement for e.g. human body, has sensor that measures body surface temperature, where difference of temperature and measuring value representing further temperature is null, in swinging condition |
-
2008
- 2008-07-31 GB GB0813994.1A patent/GB2462293B/en not_active Expired - Fee Related
-
2009
- 2009-07-06 GB GB1101465A patent/GB2473796A/en not_active Withdrawn
- 2009-07-06 EP EP09790079A patent/EP2307865A1/en not_active Ceased
- 2009-07-06 JP JP2011521160A patent/JP2012504750A/en active Pending
- 2009-07-06 CN CN2009801306149A patent/CN102112851A/en active Pending
- 2009-07-06 WO PCT/US2009/049694 patent/WO2010014354A1/en active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2010014354A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2012504750A (en) | 2012-02-23 |
GB2473796A (en) | 2011-03-23 |
GB201101465D0 (en) | 2011-03-16 |
GB2462293A (en) | 2010-02-03 |
CN102112851A (en) | 2011-06-29 |
GB2462293B (en) | 2012-10-17 |
GB0813994D0 (en) | 2008-09-10 |
WO2010014354A1 (en) | 2010-02-04 |
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