EP2299546B1 - Device relating to a releasable, electric high temperature mass contact - Google Patents

Device relating to a releasable, electric high temperature mass contact Download PDF

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Publication number
EP2299546B1
EP2299546B1 EP20090170563 EP09170563A EP2299546B1 EP 2299546 B1 EP2299546 B1 EP 2299546B1 EP 20090170563 EP20090170563 EP 20090170563 EP 09170563 A EP09170563 A EP 09170563A EP 2299546 B1 EP2299546 B1 EP 2299546B1
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EP
European Patent Office
Prior art keywords
contact
force
ceramic
pressure
plates
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EP20090170563
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German (de)
French (fr)
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EP2299546A1 (en
Inventor
Emil Aulbach
Oliver Guillon
Gerrit Günther
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Technische Universitaet Darmstadt
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Technische Universitaet Darmstadt
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Priority to EP20090170563 priority Critical patent/EP2299546B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/53—Bases or cases for heavy duty; Bases or cases for high voltage with means for preventing corona or arcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/50—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw
    • H01R4/505—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw using an excentric element

Definitions

  • the present invention relates to a contacting device, in particular for temperature-resistant and later easily re-releasable, electrical contacting in areas where there are high temperatures due to application-related conditions.
  • the design of the device allows a detachable contacting many behind and juxtaposed contact points with independent of the ambient conditions, constant contact force.
  • Electrical contacts have the task of forwarding electricity from one component to the next while having the smallest possible intrinsic resistance. For components that should not be permanently connected to a system, it is important to make these contacts closable and detachable. So parts can be installed and removed at will, as well as changed. In such a case, the electrically conductive connection is generated by a contact pressure. The source of this force is usually the elastic properties of a deformed metal component (spring force).
  • a pressure contact has the further advantage of being a direct connection of two materials. Lot, flux or other volatile substances are not used. The possibility of wire bonding is also a direct method of connection, but it requires expensive equipment, is time consuming and the connection is not nondestructive solvable.
  • a multiple pressure contact device was needed for a differential measuring chip calorimeter, which maintains its function constant, regardless of the temperature in the area of the contact.
  • To contact were on standard chip carrier plates applied, metal interconnect contact surfaces on which the contact pressure must be applied.
  • In the measuring chamber interchangeable sensor chips are connected to lines at the contact point, which forward the measuring signals of the chips to the measuring periphery. Since new measuring chips are used after each measurement, the contacts must be detachable.
  • the apparatus should be operable under vacuum conditions, so that no vaporizing substances may be used.
  • a spring contact pin for releasable electrical contacting of a component known.
  • This has a sleeve, in which a force-generating element in the form of a spring and a movably mounted power transmission device are arranged.
  • the force-generating element and the spring are made of electrically conductive material and the power transmission device forms an end contact point for contacting the component.
  • the spring is supported on the sleeve and fogs the movably mounted power transmission device in the direction of a contact point of the component with a contact pressure. Consequently, the force-generating device can be arranged in a first, supposedly colder, region of an overall arrangement, and the component to be contacted can be positioned in a second, hot region of the overall arrangement.
  • Object of the present invention is to produce at least one, but also good many electrical, easily detachable contacts that remain permanently functional at ambient temperature up to high temperatures.
  • standardized carrier plates with a usual contact spacing of 1 inch (2.54 mm) should be contacted.
  • the contact should work up to at least 1000 ° C.
  • the chips are located inside a high-temperature furnace with two side gas / vacuum inlets / outlets and the electrical lines.
  • the conductor track contact surfaces of the base plate must be contacted with perpendicular to the plate pressure, which represents a further problem to be solved in a symmetrical mounting position and the base plate horizontal inlets.
  • An electrically conductive platinum wire (13) runs unloaded in the ceramic tube (6) and ensures a constant power line. At the contact point (15) it is pressed with a defined pressure force. Any high-melting, highly conductive metals can be used here. In the embodiment There are a total of 24 contacts, each with its own ceramic tube (6) and platinum wire (13). Alternatively, the force can also be transmitted simultaneously by a component for several contacts.
  • the functional principle is not limited to sensor chips, but also works for any other, electrically contacted components.
  • the solution according to the invention for converting the force of the push rods (6) arriving horizontally to the printed conductor contact surfaces (16) into the necessary vertical contact pressure is that the contact plates (1,2) are rotatably mounted on a fixed hinge pin (8) and thus act horizontally Reduce the pressure of the push rods (6) to a vertical contact pressure on the contact points (15).
  • the contact pressure can be adjusted via the lever ratio of the printing plates. The force deflection allows the symmetrical and horizontal installation of two sensor chips - the prerequisite for differential measurements.
  • the contacting device according to the invention can be made very narrow and thus allows contacting with standard 1 inch (2.54 mm) contact surface distance (center to center). This distance can be further reduced if the push rods are made narrower and the platinum wires are thinner or replaced by thin-layer tracks.
  • two or more rows of laterally offset contact surfaces may be on the carrier plate. So that all contacts are still achieved according to the principle of the invention, different contact plates are used. They differ in the position of the connection point between push rod (6) and pressure plate (1,2). The connection point is different high, so on the one hand the Rods spatially can run over each other and on the other hand, the leverage ratios are the same for each contact row.
  • connection points are moved forward or backward so that wires experience no friction during tilting movements of adjacent pressure plates.
  • these are 2x 12 contacts, which are arranged in two rows offset by half the contact surface spacing.
  • Another feature is the two holes in the printing plates. The smaller hole is fitting for the hinge pin (8). All printing plates, which serve to contact the overhead support plate, pivot about the lower hinge pin. The fact that the pivot point is down, a larger lever is generated. The larger bore is positioned and dimensioned so that the upper hinge pin limits the pivot radius to a few degrees. For the underlying support plate and its printing plates, the same principle applies, only rotated by 180 °. Top and bottom contacting printing plates are lined up on the hinge pins and alternate. The width of the printing plates is adjusted so that a printing plate on one side also acts as a spacer between two printing plates on the other side.
  • the power line decoupling can be freely combined with the force deflection and the alternately offset contacting in order to be adapted to a wide variety of contact designs for at least one component to be contacted.
  • the use of ceramic materials not only has the advantage that they are resistant to high temperatures, but most ceramics (here aluminum oxide) are also excellent electrical insulators. As a result, the ceramic push rods and pressure plates also prevent electrical short circuits and shield the test leads very well against each other. From the electrical side, the maximum operating temperature of the device according to the invention is limited by changing line properties of the insulating parts (here with alumina about 1200 ° C).
  • FIG. 2 shows the simplified representations of an embodiment for a detachable high-temperature multiple contact, as used in a differential measuring chip calorimeter.
  • the small pressure plates (1) reach the conductor contact surfaces (16) of the front contact row. Their push rods (6) put down, behind.
  • the large pressure plates (2) are for the rear trace contact surface row.
  • Their push rods (6) run further up and end further forward. Thus, neither push rods nor platinum wires (13) obstruct the tilting movements around the respective hinge pins (8).
  • the platinum wires (13) extend protected and isolated in capillaries of the push rods (6), exit at their end and are attached to the wire feedthrough holes (9) of the pressure plates (1,2) so that they at the contact point between the pressure plate (1, 2) and contact surface (16) are located.
  • the force is generated by helical compression springs (11), passed through the push rods (6) and deflected at the pressure plates (1,2) in a vertical to the chip carrier plate (7) acting pressure. This presses the platinum wire (13) on the contact point (15) of the chip carrier plate (7) on which the high-temperature sensor chip (10) is mounted.
  • the printing plates are provided with a small notch of half the wire diameter, so that the platinum wire can not accidentally slip out of position during chip installation.
  • Pressure plates for the upper and lower sensor chip alternate. Centering discs (4) hold the printing plate package in the center of the receiving tube (3). As the pressure plates (1,2) are pushed up, the slider (5) helps to insert the two chip carrier plates (7) and then prevents the positioned plates from being pushed down.
  • the contact and rod receiving tube (3) is fixed to an abutment (14) made of aluminum, in which the coil springs (11) are held. Insulation sleeves prevent electrical contact of the platinum wires (13) with the anvil (14) and the springs (11). The entire device is positioned so that the sensor chips (10) on the standard carrier plates (7) are located centrally in a high temperature oven.
  • the coil springs (11) are clearly at room temperature, outside the furnace, where they exert constant pressure, which is transmitted through the device described in the hot area.
  • the embodiment is largely made of aluminum oxide. This is the Operating temperature at approx. 1200 ° C. With other materials, this temperature could be further increased without changing the operating principle.
  • a force-generating device 101 (spring-elastic element, for example spiral spring or bent metal or metal alloy plates) is connected to a force plate 102 (eg, ceramic push rod) against a base plate 107 .
  • the force of the spring 101 acts in the direction 108.
  • the power transmission device 102 allows the transition from the cold area in a hot area (800 ° C to 1500 ° C).
  • an element 103 eg contact plate
  • a contact pressure and a contact pressure on the element 104 (eg a sensor) at the contact point 110 This pressure is used to press an electrically conductive material 106 on the element 104 .
  • at least one element 105 with at least two contact points 110 or several elements 105 with at least one contact point 110 are used. This makes it possible to contact the element 104 (eg a sensor) in a hot region (1000 ° C. to 1500 ° C., preferably 1200 ° C.).
  • the contact points are preferably offset from one another.

Description

Die vorliegende Erfindung betrifft eine Kontaktierungsvorrichtung, insbesondere zur temperaturfesten und später leicht wieder lösbaren, elektrischen Kontaktierung in Bereichen in denen durch anwendungsbedingte Gegebenheiten hohe Temperaturen herrschen. Die Bauart der Vorrichtung ermöglicht eine lösbare Kontaktierung vieler hinter- und nebeneinander angeordneter Kontaktpunkte mit von den Umgebungsbedingungen unabhängiger, konstanter Anpresskraft.The present invention relates to a contacting device, in particular for temperature-resistant and later easily re-releasable, electrical contacting in areas where there are high temperatures due to application-related conditions. The design of the device allows a detachable contacting many behind and juxtaposed contact points with independent of the ambient conditions, constant contact force.

Beschreibung und Einleitung des allgemeinen Gebietes der ErfindungDescription and introduction of the general field of the invention

Elektrische Kontaktierungen haben die Aufgabe Strom von einem Bauteil zum nächsten weiterzuleiten und dabei einen möglichst kleinen Eigenwiderstand aufzuweisen. Für Bauteile, die nicht fest mit einer Anlage verbunden sein sollen ist es wichtig, diese Kontakte schließ- und lösbar zu gestalten. So können Teile nach Belieben ein- und ausgebaut, sowie gewechselt werden. In einem solchen Fall wird die elektrisch leitende Verbindung durch eine Anpresskraft erzeugt. Quelle dieser Kraft sind meist die elastischen Eigenschaften eines verformten Metallbauteils (Federkraft). Ein Druckkontakt hat weiterhin den Vorteil eine direkte Verbindung aus zwei Materialien zu sein. Lot, Flussmittel oder andere flüchtige Substanzen kommen nicht zum Einsatz. Die Möglichkeit des Wire Bonding ist ebenfalls eine direkte Verbindungsart, jedoch erfordert sie teures Equipment, ist zeitaufwendig und die Verbindung ist nicht zerstörungsfrei lösbar. In diesem speziellen Fall wurde eine Vielfachdruckkontaktvorrichtung für ein differentiell messendes Chipkalorimeter benötigt, die ihre Funktion, unabhängig von der Temperatur im Bereich des Kontaktes, konstant beibehält. Zu kontaktieren waren auf Standard-Chip-Trägerplatten aufgebrachte, metallene Leiterbahnkontaktflächen, auf die der Anpressdruck ausgeübt werden muss. In der Messkammer werden am Kontaktpunkt auswechselbare Sensor-Chips mit Leitungen verbunden, die die Messsignale der Chips an die Messperipherie weiterleiten. Da nach jeder Messung neue Messchips verwendet werden, müssen die Kontakte lösbar sein. Ferner soll die Apparatur unter Vakuumbedingungen operabel sein, so dass keine verdampfenden Substanzen verwendet werden dürfen.Electrical contacts have the task of forwarding electricity from one component to the next while having the smallest possible intrinsic resistance. For components that should not be permanently connected to a system, it is important to make these contacts closable and detachable. So parts can be installed and removed at will, as well as changed. In such a case, the electrically conductive connection is generated by a contact pressure. The source of this force is usually the elastic properties of a deformed metal component (spring force). A pressure contact has the further advantage of being a direct connection of two materials. Lot, flux or other volatile substances are not used. The possibility of wire bonding is also a direct method of connection, but it requires expensive equipment, is time consuming and the connection is not nondestructive solvable. In this particular case, a multiple pressure contact device was needed for a differential measuring chip calorimeter, which maintains its function constant, regardless of the temperature in the area of the contact. To contact were on standard chip carrier plates applied, metal interconnect contact surfaces on which the contact pressure must be applied. In the measuring chamber interchangeable sensor chips are connected to lines at the contact point, which forward the measuring signals of the chips to the measuring periphery. Since new measuring chips are used after each measurement, the contacts must be detachable. Furthermore, the apparatus should be operable under vacuum conditions, so that no vaporizing substances may be used.

Stand der TechnikState of the art

Zur Kontaktierung von Verbindungsleitungen mit Messsonden, die unter Hochtemperaturbedingungen arbeiten ist bekannt, den Kontaktpunkt in einen kalten Bereich zu verlegen, um dort den Kontaktdruck mit metallischen Federn unterschiedlicher Ausführung zu erzeugen. Ist der Kontaktpunkt bauartbedingt hohen Temperaturen ausgesetzt, so werden Federn aus temperaturstabilen Legierungen verwendet, die ihre elastischen Eigenschaften erst bei höheren Temperaturen verlieren. Bis ca. 500 °C gibt es hierfür geeignete Legierungen. Für noch höhere Temperaturen ist bekannt, Keramikteile für die Klemmwirkung zu verwenden, da diese eine noch höhere Temperaturstabilität aufweisen. Allerdings ist bei Keramiken der elastisch verformende Bereich sehr gering, so dass die Kontakte sehr genau gefertigt werden müssen. Problematisch ist auch ein Betrieb über einen weiten Temperaturbereich hinweg, da durch unterschiedliche thermische Ausdehnung der Keramik und des Metalls der Anpressdruck abnehmen oder der Kontakt sogar gänzlich abbrechen kann. Dies führt zu Messfehlern oder Signalausfällen. Beim Einbauen der Messsonde werden durch enge Passung und den wirkenden Anpressdruck die Kontaktpunkte zerkratzt, was auch zu Kontaktproblemen während des Betriebs führen kann. In der bekannten Ausführungsform ( DE000019740456A1 ) muss der Kontakt außerdem gefügt werden, wodurch er schwer zu lösen ist. Das Funktionsprinzip dieser Erfindung lässt sich außerdem nicht ohne weiteres von dem stabförmigen Sensorelement auf eine flache Kontaktplatte, die vertikalen Anpressdruck erfordert übertragen.For contacting connecting lines with probes operating under high-temperature conditions, it is known to lay the contact point in a cold area in order to produce the contact pressure with metallic springs of different design. If the contact point is exposed to high temperatures due to the design, then springs made of temperature-stable alloys are used which lose their elastic properties only at relatively high temperatures. Up to about 500 ° C there are suitable alloys for this purpose. For even higher temperatures it is known to use ceramic parts for the clamping effect, since they have an even higher temperature stability. However, in ceramics, the elastically deforming region is very small, so that the contacts must be made very accurately. Also problematic is an operation over a wide temperature range, as decrease by different thermal expansion of the ceramic and the metal of the contact pressure or the contact can even break off completely. This leads to measurement errors or signal failures. When installing the probe, the contact points are scratched by tight fit and the effective contact pressure, which can also lead to contact problems during operation. In the known embodiment ( DE000019740456A1 ) the contact must also be joined, making it difficult to loosen. Moreover, the functional principle of this invention can not readily be transferred from the rod-shaped sensor element to a flat contact plate requiring vertical contact pressure.

Weiterhin ist aus der EP 0 405 323 A2 ein Federkontaktstift zur lösbaren elektrischen Kontaktierung eines Bauteils bekannt. Dieser verfügt über eine Hülse, in der ein Krafterzeugungselement in Form einer Feder sowie eine bewegbar gelagerte Kraftübertragungseinrichtung angeordnet sind. Das Krafterzeugungselement sowie die Feder bestehen aus elektrisch leitendem Material und die Kraftübertragungseinrichtung bildet endseitig eine Kontaktstelle zur Kontaktierung des Bauteils aus. Die Feder stützt sich an der Hülse ab und beschlägt die bewegbar gelagerte Kraftübertragungseinrichtung in Richtung einer Kontaktstelle des Bauteils mit einer Anpresskraft. Mithin kann die Krafterzeugungseinrichtung in einem ersten, vermeintlich kälteren Bereich einer Gesamtanordnung angeordnet werden sowie das zu kontaktierende Bauteil in einem zweiten, heißen Bereich der Gesamtanordnung positioniert sein.Furthermore, from the EP 0 405 323 A2 a spring contact pin for releasable electrical contacting of a component known. This has a sleeve, in which a force-generating element in the form of a spring and a movably mounted power transmission device are arranged. The force-generating element and the spring are made of electrically conductive material and the power transmission device forms an end contact point for contacting the component. The spring is supported on the sleeve and fogs the movably mounted power transmission device in the direction of a contact point of the component with a contact pressure. Consequently, the force-generating device can be arranged in a first, supposedly colder, region of an overall arrangement, and the component to be contacted can be positioned in a second, hot region of the overall arrangement.

Der Bedarf einer Vorrichtung, die mindestens einen schnell lösbaren, elektrischen Kontakt herstellt, der bei Temperaturen über 500°C dauerhaft funktionstüchtig bleibt ist derzeit nicht gedeckt.The need for a device that produces at least one quickly detachable, electrical contact that remains permanently functional at temperatures above 500 ° C is currently not covered.

Aufgabetask

Aufgabe der vorliegenden Erfindung ist es mindestens einen, gut aber auch viele elektrische, leicht lösbare Kontakte zu erzeugen, die bei Umgebungstemperatur bis hin zu hohen Temperaturen dauerhaft, konstant funktionsfähig bleiben. Es sollen so insbesondere standardisierte Trägerplatten mit üblichem 1 inch (2,54mm) Kontaktflächenabstand kontaktiert werden. Der Kontakt soll dabei bis mindestens 1000 °C funktionieren. Für die differentielle Messung ist es außerdem erforderlich zwei Sensorchips absolut symmetrisch einzubauen und mit jeweils 12 Kontakten anschließen zu können. Die Chips befinden sich im Inneren eines Hochtemperaturofens mit zwei seitlichen Ein-/Auslässen für Gas/Vakuum und die elektrischen Leitungen. Die Leiterbahnkontaktflächen der Grundplatte müssen mit zur Platte senkrechtem Druck kontaktiert werden, was bei symmetrischer Einbaulage und zur Grundplatte horizontalen Einlässen ein weiteres zu lösendes Problem darstellt.Object of the present invention is to produce at least one, but also good many electrical, easily detachable contacts that remain permanently functional at ambient temperature up to high temperatures. In particular, standardized carrier plates with a usual contact spacing of 1 inch (2.54 mm) should be contacted. The contact should work up to at least 1000 ° C. For the differential measurement, it is also necessary to install two sensor chips absolutely symmetrical and to be able to connect with 12 contacts each. The chips are located inside a high-temperature furnace with two side gas / vacuum inlets / outlets and the electrical lines. The conductor track contact surfaces of the base plate must be contacted with perpendicular to the plate pressure, which represents a further problem to be solved in a symmetrical mounting position and the base plate horizontal inlets.

Lösung der AufgabeSolution of the task

Diese Aufgabe wird erfindungsgemäß gelöst durch eine Vorrichtung, in der temperaturfeste Materialien mit verschiedenen mechanischen und elektrischen Eigenschaften kombiniert werden, um eine später leicht wieder lösbare Druckkontaktierung für mindestens einen elektrischen Kontakt zu erzeugen. Es ist vorgesehen, dass die wichtigen Funktionen eines Druckkontaktes, nämlich der mechanische Druck und die elektrische Weiterleitung entkoppelt werden. Die nötige Druckkraft für den Kontakt wird außerhalb des heißen Bereichs durch Federn (11), Schrauben, Aktoren oder Schwerkraft aufgebaut. Dadurch bleibt der Druck auch bei Temperaturänderungen im Kontaktbereich konstant und kann beliebig eingestellt werden. Bei hohen Temperaturen mechanisch stabile Keramikrohre (6) übertragen die Kraft in den Hochtemperaturbereich. Von mechanischer Seite wird die maximale Betriebstemperatur durch die Hochtemperaturkriechfähigkeit des Baustoffes beschränkt. Die Bauform ist nicht auf Rohre beschränkt, sondern kann den baulichen Gegebenheiten angepasst werden. Ein elektrisch leitfähiger Platindraht (13) verläuft unbelastet im Keramikrohr (6) und sorgt für eine konstante Stromleitung. Am Kontaktpunkt (15) wird er mit definierter Druckkraft aufgepresst. Jegliche hochschmelzenden, gut leitfähigen Metalle können hier zum Einsatz kommen. In dem Ausführungsbeispiel liegen insgesamt 24 Kontakte mit jeweils eigenem Keramikrohr (6) und Platindraht (13) vor. Alternativ kann die Kraft aber auch durch ein Bauteil für mehrere Kontakte gleichzeitig übertragen werden. Das Funktionsprinzip ist nicht auf Sensorchips beschränkt, sondern funktioniert auch für jegliche andere, elektrisch zu kontaktierende Bauteile.This object is achieved by a device in which temperature-resistant materials are combined with different mechanical and electrical properties to produce a later easily releasable pressure contact for at least one electrical contact. It is envisaged that the important functions of a pressure contact, namely the mechanical pressure and the electrical transmission will be decoupled. The necessary pressure force for the contact is built up outside the hot area by means of springs (11), screws, actuators or gravity. As a result, the pressure remains constant even with temperature changes in the contact area and can be set arbitrarily. At high temperatures mechanically stable ceramic tubes (6) transfer the force into the high temperature range. From the mechanical side, the maximum operating temperature is limited by the high temperature creep capability of the building material. The design is not limited to tubes, but can be adapted to the structural conditions. An electrically conductive platinum wire (13) runs unloaded in the ceramic tube (6) and ensures a constant power line. At the contact point (15) it is pressed with a defined pressure force. Any high-melting, highly conductive metals can be used here. In the embodiment There are a total of 24 contacts, each with its own ceramic tube (6) and platinum wire (13). Alternatively, the force can also be transmitted simultaneously by a component for several contacts. The functional principle is not limited to sensor chips, but also works for any other, electrically contacted components.

Die erfindungsgemäße Lösung die horizontal zu den Leiterbahnkontaktflächen (16) eintreffende Kraft der Schubstangen (6) in den nötigen senkrechten Anpressdruck umzuwandeln besteht darin, dass die Kontaktplatten (1,2) an einem fixen Gelenkstift (8) drehbar gelagert sind und so den horizontal einwirkenden Druck der Schubstangen (6) in einen senkrechten Anpressdruck auf die Kontaktpunkte (15) umlenken. Zudem kann der Anpressdruck über das Hebelverhältnis der Druckplatten eingestellt werden. Die Kraftumlenkung ermöglicht den symmetrischen und zum Ofeneinlass horizontalen Einbau zweier Sensorchips - die Voraussetzung für differentielle Messungen.The solution according to the invention for converting the force of the push rods (6) arriving horizontally to the printed conductor contact surfaces (16) into the necessary vertical contact pressure is that the contact plates (1,2) are rotatably mounted on a fixed hinge pin (8) and thus act horizontally Reduce the pressure of the push rods (6) to a vertical contact pressure on the contact points (15). In addition, the contact pressure can be adjusted via the lever ratio of the printing plates. The force deflection allows the symmetrical and horizontal installation of two sensor chips - the prerequisite for differential measurements.

Die erfindungsgemäße Kontaktierungsvorrichtung kann sehr schmal gebaut sein und erlaubt so die Kontaktierung mit standardmäßigem 1 Zoll (2,54 mm) Kontaktflächenabstand (Mitte zu Mitte). Dieser Abstand kann weiter verkleinert werden, wenn die Schubstangen schmaler ausgeführt werden, sowie die Platindrähte dünner werden oder durch dünnschichtige Leiterbahnen ersetzt werden. Um die Kontaktdichte weiter zu erhöhen, können auf der Trägerplatte zwei oder mehr Reihen seitlich versetzter Kontaktflächen sein. Damit trotzdem alle Kontakte nach dem erfindungsgemäßen Prinzip erreicht werden, kommen unterschiedliche Kontaktplatten zum Einsatz. Sie unterscheiden sich in der Position des Verbindungspunktes zwischen Schubstange (6) und Druckplatte (1,2). Der Verbindungspunkt liegt unterschiedlich hoch, damit zum einen die Stangen räumlich übereinander verlaufen können und zum anderen die Hebelverhältnisse bei jeder Kontaktreihe gleich sind. Außerdem sind die Verbindungspunkte nach vorne bzw. nach hinten verschoben, damit Drähte bei Kippbewegungen von anliegenden Druckplatten keine Reibung erfahren. Insbesondere handelt es sich im Ausführungsbeispiel um 2x 12 Kontakte, die in zwei um den halben Kontaktflächenabstand versetzten Reihen angeordneten sind. Ein weiteres Merkmal sind die zwei Bohrungen in den Druckplatten. Die kleinere Bohrung ist passgenau für den Gelenkstift (8). Alle Druckplatten, die zur Kontaktierung der oben liegenden Trägerplatte dienen, schwenken um den unteren Gelenkstift. Dadurch, dass der Drehpunkt unten liegt, wird ein größerer Hebel erzeugt. Die größere Bohrung ist so positioniert und dimensioniert, dass der obere Gelenkstift den Schwenkradius auf wenige Grad begrenzt. Für die unten liegende Trägerplatte und ihre Druckplatten gilt das gleiche Prinzip, nur um 180° gedreht. Oben und unten kontaktierende Druckplatten sind auf den Gelenkstiften aufgereiht und wechseln sich ab. Die Breite der Druckplatten ist so angepasst, dass eine Druckplatte einer Seite gleichzeitig als Abstandhalter zwischen zwei Druckplatten der anderen Seite fungiert.The contacting device according to the invention can be made very narrow and thus allows contacting with standard 1 inch (2.54 mm) contact surface distance (center to center). This distance can be further reduced if the push rods are made narrower and the platinum wires are thinner or replaced by thin-layer tracks. In order to further increase the contact density, two or more rows of laterally offset contact surfaces may be on the carrier plate. So that all contacts are still achieved according to the principle of the invention, different contact plates are used. They differ in the position of the connection point between push rod (6) and pressure plate (1,2). The connection point is different high, so on the one hand the Rods spatially can run over each other and on the other hand, the leverage ratios are the same for each contact row. In addition, the connection points are moved forward or backward so that wires experience no friction during tilting movements of adjacent pressure plates. In particular, in the exemplary embodiment, these are 2x 12 contacts, which are arranged in two rows offset by half the contact surface spacing. Another feature is the two holes in the printing plates. The smaller hole is fitting for the hinge pin (8). All printing plates, which serve to contact the overhead support plate, pivot about the lower hinge pin. The fact that the pivot point is down, a larger lever is generated. The larger bore is positioned and dimensioned so that the upper hinge pin limits the pivot radius to a few degrees. For the underlying support plate and its printing plates, the same principle applies, only rotated by 180 °. Top and bottom contacting printing plates are lined up on the hinge pins and alternate. The width of the printing plates is adjusted so that a printing plate on one side also acts as a spacer between two printing plates on the other side.

Der Einbau von Trägerplatten mit Sensor-Chips erfolgt so, dass die Druckplatten gegen die Federkraft angehoben werden, die Trägerplatte seitlich geführt bis zum Anschlagpunkt unter die Druckplatten geschoben wird und zum Schluss die Druckplatten losgelassen werden. Daraufhin drücken sie auf die entsprechenden Leiterbahnkontaktflächen. Beim Ausbau werden die Druckplatten abermals angehoben, damit die Trägerplatte herausgezogen werden kann. Diese sehr schnelle und einfache Methode ist geeignet für den häufigen Ein- und Ausbau. Sie hat weiterhin den Vorteil, dass die Druckkraft erst wirkt, wenn die Kontaktflächen in Position sind. So werden diese nicht zerkratzt und Kontaktprobleme durch beschädigte Kontaktflächen werden vermieden.The installation of carrier plates with sensor chips takes place in such a way that the pressure plates are raised against the spring force, the carrier plate is guided sideways to the point of impact under the pressure plates and finally the pressure plates are released. Then press on the corresponding trace contact surfaces. When removing the pressure plates are raised again so that the carrier plate can be pulled out. This very fast and easy method is suitable for frequent installation and removal. It also has the advantage that the compressive force acts only when the contact surfaces are in position. So they are not scratched and contact problems caused by damaged contact surfaces are avoided.

Je nach konstruktiver Anforderung kann die Kraft-Leitungsentkopplung frei mit der Kraftumlenkung und der wechselnd versetzten Kontaktierung kombiniert werden, um auf verschiedenste Kontaktausführungen für mindestens ein zu kontaktierendes Bauteil angepasst zu werden.Depending on the design requirement, the power line decoupling can be freely combined with the force deflection and the alternately offset contacting in order to be adapted to a wide variety of contact designs for at least one component to be contacted.

Wichtig ist auch die Materialwahl. Die Nutzung von keramischen Werkstoffen bietet nicht nur den Vorteil, dass sie hochtemperaturstabil sind, sondern die meisten Keramiken (hier Aluminiumoxid) sind gleichzeitig exzellente elektrische Isolatoren. Dadurch verhindern die keramischen Schubstangen und Druckplatten auch elektrische Kurzschlüsse und schirmen die Messleitungen sehr gut gegeneinander ab. Von elektrischer Seite wird die maximale Betriebstemperatur der erfindungsgemäßen Vorrichtung durch sich ändernde Leitungseigenschaften der Isolierenden Teile begrenzt (hier bei Aluminiumoxid ca. 1200°C).Also important is the choice of material. The use of ceramic materials not only has the advantage that they are resistant to high temperatures, but most ceramics (here aluminum oxide) are also excellent electrical insulators. As a result, the ceramic push rods and pressure plates also prevent electrical short circuits and shield the test leads very well against each other. From the electrical side, the maximum operating temperature of the device according to the invention is limited by changing line properties of the insulating parts (here with alumina about 1200 ° C).

Ausführungsbeispieleembodiments

Figur 2 zeigt die vereinfachte Darstellungen eines Ausführungsbeispiels für einen lösbaren Hochtemperaturvielfachkontakt, wie er in einem differentiell messenden Chipkalorimeter zur Anwendung kommt. Es sind 24 Kontakte (16), 12 pro Seite, in einem Kontakt- und Gestängeaufnahmerohr (3) von 28mm Durchmesser realisiert. Die kleinen Druckplatten (1) erreichen die Leiterbahnkontaktflächen (16) der vorderen Kontaktreihe. Ihre Schubstangen (6) setzten unten, hinten an. Die großen Druckplatten (2) sind für die hintere Leiterbahnkontaktflächenreihe. Ihre Schubstangen (6) verlaufen weiter oben und enden weiter vorne. Damit behindern sich weder Schubstangen noch Platindrähte (13) bei Kippbewegungen um die jeweiligen Gelenkstifte (8). Die Platindrähte (13) verlaufen geschützt und isoliert in Kapillaren der Schubstangen (6), treten an deren Ende aus und sind an den Drahtdurchführungsbohrungen (9) der Druckplatten (1,2) so befestigt, dass sie sich am Kontaktpunkt zwischen Druckplatte (1,2) und Kontaktfläche (16) befinden. In diesem Fall wird die Kraft durch Spiraldruckfedern (11) erzeugt, durch die Schubstangen (6) weitergeleitet und an den Druckplatten (1,2) in einen vertikal zur Chipträgerplatte (7) wirkenden Druck umgelenkt. Dieser presst den Platindraht (13) auf den Kontaktpunkt (15) der Chipträgerplatte (7) auf der der Hochtemperatur Sensor-Chip (10) montiert ist. Die Druckplatten sind mit einer kleinen Einkerbung vom halben Drahtdurchmesser versehen, so dass der Platindraht beim Chipeinbau nicht unbeabsichtigt aus seiner Position verrutschen kann. Druckplatten für den oberen und den unteren Sensor-Chip wechseln sich ab. Zentrierscheiben (4) halten das Druckplattenpaket mittig im Aufnahmerohr (3). Während die Druckplatten (1,2) hoch gedrückt werden, hilft der Schieber (5) beim Einführen der beiden Chipträgerplatten (7) und verhindert danach, dass die positionierten Platten nach unten gedrückt werden. Das Kontakt- und Gestängeaufnahmerohr (3) ist an einem Gegenlager (14) aus Aluminium befestigt, in dem auch die Spiralfedern (11) gehalten sind. Isolationshülsen verhindern elektrischen Kontakt der Platindrähte (13) mit dem Gegenlager (14) und den Federn (11). Die gesamte Vorrichtung ist so positioniert, dass sich die Sensor-Chips (10) auf den Standard-Trägerplatten (7) mittig in einem Hochtemperaturofen befinden. Die Spiralfedern (11) befinden sich deutlich an Raumtemperatur, außerhalb des Ofens, wo sie konstanten Druck ausüben, der über die beschriebene Vorrichtung in den heißen Bereich übertragen wird. Das Ausführungsbeispiel ist größten Teils aus Aluminiumoxid gefertigt. Damit liegt die Betriebstemperatur bei ca. 1200°C. Mit anderen Materialien ließe sich diese Temperatur noch weiter erhöhen ohne das Funktionsprinzip zu ändern. FIG. 2 shows the simplified representations of an embodiment for a detachable high-temperature multiple contact, as used in a differential measuring chip calorimeter. There are 24 contacts (16), 12 per side, realized in a contact and rod receiving tube (3) of 28mm diameter. The small pressure plates (1) reach the conductor contact surfaces (16) of the front contact row. Their push rods (6) put down, behind. The large pressure plates (2) are for the rear trace contact surface row. Their push rods (6) run further up and end further forward. Thus, neither push rods nor platinum wires (13) obstruct the tilting movements around the respective hinge pins (8). The platinum wires (13) extend protected and isolated in capillaries of the push rods (6), exit at their end and are attached to the wire feedthrough holes (9) of the pressure plates (1,2) so that they at the contact point between the pressure plate (1, 2) and contact surface (16) are located. In this case, the force is generated by helical compression springs (11), passed through the push rods (6) and deflected at the pressure plates (1,2) in a vertical to the chip carrier plate (7) acting pressure. This presses the platinum wire (13) on the contact point (15) of the chip carrier plate (7) on which the high-temperature sensor chip (10) is mounted. The printing plates are provided with a small notch of half the wire diameter, so that the platinum wire can not accidentally slip out of position during chip installation. Pressure plates for the upper and lower sensor chip alternate. Centering discs (4) hold the printing plate package in the center of the receiving tube (3). As the pressure plates (1,2) are pushed up, the slider (5) helps to insert the two chip carrier plates (7) and then prevents the positioned plates from being pushed down. The contact and rod receiving tube (3) is fixed to an abutment (14) made of aluminum, in which the coil springs (11) are held. Insulation sleeves prevent electrical contact of the platinum wires (13) with the anvil (14) and the springs (11). The entire device is positioned so that the sensor chips (10) on the standard carrier plates (7) are located centrally in a high temperature oven. The coil springs (11) are clearly at room temperature, outside the furnace, where they exert constant pressure, which is transmitted through the device described in the hot area. The embodiment is largely made of aluminum oxide. This is the Operating temperature at approx. 1200 ° C. With other materials, this temperature could be further increased without changing the operating principle.

In der Fig. 1 ist schematisch eine erfindungsgemäße Anordnung dargestellt. Im kalten Bereich (-200 °C bis 800 °C bevorzugt 500 °C) wird gegen eine Grundplatte 107 eine Krafterzeugungseinrichtung 101 (federelastisches Element z.B. Spiralfeder oder gebogene Bleche aus Metall oder Metalllegierungen) mit einer Kraftübertragungseinrichtung 102 (z.B. Schubstange aus Keramik) verbunden. Die Kraft der Feder 101 wirkt dabei in Richtung 108. Die Kraftübertragungseinrichtung 102 ermöglicht den Übergang vom kalten Bereich in einen heißen Bereich (800 °C bis 1500 °C). Im heißen Bereich befindet sich ein Element 103 (z.B. Kontaktplatte), dass eine zur Krafteinwirkung exzentrische Bohrung 105 aufweist. Damit entsteht ein Drehmoment, dass dafür ausgenutzt wird, um eine Kraftumlenkung in Richtung 109 zu bewirken. Es entstehen dadurch eine Anpresskraft und ein Anpressdruck auf das Element 104 (z.B. ein Sensor) an der Kontaktstelle 110. Dieser Druck wird dafür verwendet, um ein elektrisch leitfähiges Material 106 auf das Element 104 zu pressen. Bei mehreren Kontaktstellen 110 auf dem Element 104 werden mindestens ein Element 105 mit mindestens zwei Kontaktstellen 110 oder mehrere Elemente 105 mit mindestens einer Kontaktstelle 110 verwendet. Damit ist es möglich das Element 104 (z.B. ein Sensor) in einem heißen Bereich (1000 °C bis 1500 °C bevorzugt 1200 °C) zu kontaktieren. Die Kontaktstellen sind bevorzugt versetzt zueinander angeordnet.In the Fig. 1 schematically an arrangement according to the invention is shown. In the cold range (-200 ° C. to 800 ° C., preferably 500 ° C.), a force-generating device 101 (spring-elastic element, for example spiral spring or bent metal or metal alloy plates) is connected to a force plate 102 (eg, ceramic push rod) against a base plate 107 . The force of the spring 101 acts in the direction 108. The power transmission device 102 allows the transition from the cold area in a hot area (800 ° C to 1500 ° C). In the hot area is an element 103 (eg contact plate) that has an eccentric to the action of force bore 105 . This creates a torque that is exploited to cause a force deflection in direction 109 . This results in a contact pressure and a contact pressure on the element 104 (eg a sensor) at the contact point 110. This pressure is used to press an electrically conductive material 106 on the element 104 . In the case of a plurality of contact points 110 on the element 104 , at least one element 105 with at least two contact points 110 or several elements 105 with at least one contact point 110 are used. This makes it possible to contact the element 104 (eg a sensor) in a hot region (1000 ° C. to 1500 ° C., preferably 1200 ° C.). The contact points are preferably offset from one another.

AbbildungslegendenFigure legends

  • Fig. 1 zeigt eine schematische Seitenansicht Fig. 1 shows a schematic side view
  • Fig. 2 zeigt eine Seitenansicht und einen A-B Schnitt Fig. 2 shows a side view and an AB cut
  • Fig. 3 zeigt die Kontaktierung des Chipträgerplatte mit mehreren Kontaktplatten Fig. 3 shows the contacting of the chip carrier plate with a plurality of contact plates
  • Fig. 4 zeigt die Gesamtübersicht der Hochtemperaturkontaktierungsvorrichtung Fig. 4 shows the overall view of the Hochtemperaturkontaktierungsvorrichtung
BezugszeichenlisteLIST OF REFERENCE NUMBERS

  • (1) - Kontaktplatte klein (Keramik)(1) - contact plate small (ceramic)
  • (2) - Kontaktplatte groß (Keramik)(2) - contact plate large (ceramic)
  • (3) - Kontakt- und Gestängeaufnahmerohr (Keramik)(3) - Contact and rod receiving tube (ceramic)
  • (4) - Zentrierscheiben (Keramik)(4) - centering discs (ceramic)
  • (5) - Schieber (Keramik)(5) - slider (ceramic)
  • (6) - Schubstangen (Keramik)(6) - push rods (ceramic)
  • (7) - Chipträgerplatte (Keramik)(7) - Chip carrier plate (ceramics)
  • (8) - Gelenkstift (Keramik)(8) - hinge pin (ceramic)
  • (9) - Drahtdurchführungsbohrung(9) - Wire feed through hole
  • (10) - Hochtemperatur Sensor-Chip(10) - high temperature sensor chip
  • (11) - Spiralfeder(11) - Spiral spring
  • (12) - Isolierhülse(12) - insulating sleeve
  • (13) - Platindraht(13) - platinum wire
  • (14) - Gegenlager(14) - counter bearing
  • (15) - Kontaktpunkte(15) - Contact Points
  • (16) - Leiterbahnkontaktflächen(16) - Track contact surfaces
  • 101 Krafterzeugungseinrichtung101 force generating device
  • 102 Kraftübertragungseinrichtung102 power transmission device
  • 103 Element103 element
  • 104 Element104 element
  • 105 Bohrung105 bore
  • 106 elektrischer Leiter106 electrical conductor
  • 107 Grundplatte107 base plate
  • 108 Kraftrichtung108 direction of force
  • 109 Kraftrichtung109 Force Direction
  • 110 Kontaktstelle110 contact point

Claims (8)

  1. Device to electrically contact a component (7, 104) in a detachable manner with an electric conductor (13, 106) comprising at least one force generating device (11, 101) with at least one force transmitting device (6, 102) mounted in a moveable manner and with at least one force deflecting device (1, 2, 8, 103, 105), whereby the component (7, 104) is suitable to be electrically contacted with at least one contact point (15, 110) of the electric conductor (13, 106), whereby the force generating device (11, 101) generates a pressing force between the contact point (15, 110) of the electrical conductor (13, 106) and the component (7, 104) via the force transmitting device (6, 102) and whereby the force generating device (11, 101) is suitable to be mounted in a first, cold area of the device and whereby the component (7, 104) is suitable to be mounted in a second, hot area of the device, wherein the electrical conductor (13, 106) runs without application of forces within the force transmitting device (6, 102) mounted in a moveable manner and the force transmitting device (6, 102) of the device is made from ceramic.
  2. Device according to claim 1, wherein the device comprises a force transmitting device (6, 102) from a cold area to a hot area.
  3. Device according to claims 1 to 2, wherein the cold area comprises -200°C to 800 °C, preferably 500 °C, and the hot area 900 °C to 1500°C, preferably 1200°C.
  4. Device according to claims 1 to 3, wherein the at least one contact point (15, 110) is arranged in the hot area of 900°C to 1500°C, preferably 1200°C.
  5. Device according to claims 1 to 4, wherein the force transmitting device (6, 102) comprises a tube or a rod made from ceramic.
  6. Device according to claims 1 to 5, wherein the force deflecting device (1, 2, 8, 103, 105) comprises at least one ceramic plate or at least one ceramic block with at least one contact point (15, 110) and at least one drilling.
  7. Device according to claims 1 to 6, wherein in the case of several contact points (15, 110) these are arranged in a shifted manner.
  8. Device according to claims 1 to 6, wherein the device is realised with several ceramic plates (1, 2, 103) in such a way that these act as spacers.
EP20090170563 2009-09-17 2009-09-17 Device relating to a releasable, electric high temperature mass contact Not-in-force EP2299546B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20090170563 EP2299546B1 (en) 2009-09-17 2009-09-17 Device relating to a releasable, electric high temperature mass contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20090170563 EP2299546B1 (en) 2009-09-17 2009-09-17 Device relating to a releasable, electric high temperature mass contact

Publications (2)

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EP2299546A1 EP2299546A1 (en) 2011-03-23
EP2299546B1 true EP2299546B1 (en) 2012-11-14

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266841A (en) * 1979-10-25 1981-05-12 The Bendix Corporation High voltage cable terminal
DE3920850A1 (en) 1989-06-24 1991-01-10 Feinmetall Gmbh SPRING CONTACT PIN
DE19740456A1 (en) 1997-09-15 1999-03-18 Bosch Gmbh Robert Heat-resistant contacting arrangement for sensor element
DE202004015917U1 (en) * 2004-10-13 2005-01-20 Virchow, Florian Contacting element for electrically contacting components

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