EP2250664A4 - HIGH-SURFACE FLEXIBLE ELECTRONIC DEVICES BASED ON SEMICONDUCTORS, OF TEXTURE [100] OR [110] AND ALIGNED - Google Patents

HIGH-SURFACE FLEXIBLE ELECTRONIC DEVICES BASED ON SEMICONDUCTORS, OF TEXTURE [100] OR [110] AND ALIGNED

Info

Publication number
EP2250664A4
EP2250664A4 EP08871705.3A EP08871705A EP2250664A4 EP 2250664 A4 EP2250664 A4 EP 2250664A4 EP 08871705 A EP08871705 A EP 08871705A EP 2250664 A4 EP2250664 A4 EP 2250664A4
Authority
EP
European Patent Office
Prior art keywords
aligned
semiconductor
flexible
area
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08871705.3A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2250664A1 (en
Inventor
Amit Goyal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/011,454 external-priority patent/US8987736B2/en
Priority claimed from PCT/US2008/002944 external-priority patent/WO2008112115A1/en
Application filed by Individual filed Critical Individual
Publication of EP2250664A1 publication Critical patent/EP2250664A1/en
Publication of EP2250664A4 publication Critical patent/EP2250664A4/en
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02425Conductive materials, e.g. metallic silicides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02488Insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02609Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/0673Nanowires or nanotubes oriented parallel to a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/122Single quantum well structures
    • H01L29/127Quantum box structures
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    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0368Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0687Multiple junction or tandem solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H01L31/182Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02568Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78681Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/544Solar cells from Group III-V materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/546Polycrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Photovoltaic Devices (AREA)
EP08871705.3A 2008-01-28 2008-09-09 HIGH-SURFACE FLEXIBLE ELECTRONIC DEVICES BASED ON SEMICONDUCTORS, OF TEXTURE [100] OR [110] AND ALIGNED Ceased EP2250664A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/011,454 US8987736B2 (en) 2000-07-10 2008-01-28 [100] or [110] aligned, semiconductor-based, large-area, flexible, electronic devices
PCT/US2008/002944 WO2008112115A1 (en) 2007-03-08 2008-03-06 Novel, semiconductor-based, large-area, flexible, electronic devices
PCT/US2008/010513 WO2009096932A1 (en) 2008-01-28 2008-09-09 [100] or [110] aligned, semiconductor-based, large-area, flexible, electronic devices

Publications (2)

Publication Number Publication Date
EP2250664A1 EP2250664A1 (en) 2010-11-17
EP2250664A4 true EP2250664A4 (en) 2013-07-17

Family

ID=40913073

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08871705.3A Ceased EP2250664A4 (en) 2008-01-28 2008-09-09 HIGH-SURFACE FLEXIBLE ELECTRONIC DEVICES BASED ON SEMICONDUCTORS, OF TEXTURE [100] OR [110] AND ALIGNED

Country Status (6)

Country Link
EP (1) EP2250664A4 (zh)
CN (1) CN101981685B (zh)
AU (1) AU2008349510B2 (zh)
CA (1) CA2745269A1 (zh)
HK (1) HK1150095A1 (zh)
WO (1) WO2009096932A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8961687B2 (en) 2009-08-31 2015-02-24 Alliance For Sustainable Energy, Llc Lattice matched crystalline substrates for cubic nitride semiconductor growth
US8575471B2 (en) 2009-08-31 2013-11-05 Alliance For Sustainable Energy, Llc Lattice matched semiconductor growth on crystalline metallic substrates
KR20130138657A (ko) 2010-06-24 2013-12-19 글로 에이비 배향된 나노와이어 성장을 위해 버퍼 층을 갖는 기판
JP5817327B2 (ja) 2010-09-29 2015-11-18 東ソー株式会社 酸化物焼結体、その製造方法、それを用いて得られる酸化物透明導電膜及び太陽電池
US9425249B2 (en) 2010-12-01 2016-08-23 Alliance For Sustainable Energy, Llc Coincident site lattice-matched growth of semiconductors on substrates using compliant buffer layers
US9041027B2 (en) 2010-12-01 2015-05-26 Alliance For Sustainable Energy, Llc Methods of producing free-standing semiconductors using sacrificial buffer layers and recyclable substrates
TWI602315B (zh) * 2013-03-08 2017-10-11 索泰克公司 具有經組構成效能更佳之低帶隙主動層之感光元件及相關方法
CN106575667B (zh) * 2014-07-02 2020-07-31 哥本哈根大学 半导体约瑟夫森结及其相关的传输子量子位
US20160247886A1 (en) * 2015-02-19 2016-08-25 Hermes-Epitek Corp. Semiconductor template and manufacturing method thereof
WO2018080033A1 (ko) * 2016-10-25 2018-05-03 삼성에스디아이 주식회사 감온 소자를 위한 고정 구조를 갖는 전지 모듈
CN109103230B (zh) * 2018-08-27 2022-02-08 武汉天马微电子有限公司 一种oled显示面板、oled显示面板的制作方法及显示装置
CN109285919A (zh) * 2018-09-28 2019-01-29 王敏 一种铜铟镓硒太阳能电池薄膜缓冲层材料的制备方法
CN109449223B (zh) * 2018-10-26 2019-11-29 超晶科技(北京)有限公司 铟镓氮铋材料和使用该材料的激光器和探测器及制备方法
CN110911510B (zh) * 2019-11-20 2021-02-26 电子科技大学中山学院 一种含超晶格结构的硅基氮化物五结太阳电池
CN112510122B (zh) * 2021-02-07 2021-07-06 中山德华芯片技术有限公司 一种免切割的柔性砷化镓太阳电池及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872988B1 (en) * 2004-03-23 2005-03-29 Ut-Battelle, Llc Semiconductor films on flexible iridium substrates
US20070044832A1 (en) * 2005-08-25 2007-03-01 Fritzemeier Leslie G Photovoltaic template
US20090038714A1 (en) * 2007-08-08 2009-02-12 Ut-Battelle, Llc Strong, non-magnetic, cube textured alloy substrates

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304342A (en) * 1992-06-11 1994-04-19 Hall Jr H Tracy Carbide/metal composite material and a process therefor
US5872080A (en) * 1995-04-19 1999-02-16 The Regents Of The University Of California High temperature superconducting thick films
US5994156A (en) * 1997-09-12 1999-11-30 Sharp Laboratories Of America, Inc. Method of making gate and source lines in TFT LCD panels using pure aluminum metal
KR100352976B1 (ko) * 1999-12-24 2002-09-18 한국기계연구원 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및 그 제조방법
US6455166B1 (en) * 2000-05-11 2002-09-24 The University Of Chicago Metallic substrates for high temperature superconductors
US6784139B1 (en) * 2000-07-10 2004-08-31 Applied Thin Films, Inc. Conductive and robust nitride buffer layers on biaxially textured substrates
US6617283B2 (en) * 2001-06-22 2003-09-09 Ut-Battelle, Llc Method of depositing an electrically conductive oxide buffer layer on a textured substrate and articles formed therefrom
WO2005055285A2 (en) * 2003-12-01 2005-06-16 The Regents Of The University Of California Multiband semiconductor compositions for photovoltaic devices
US20060208257A1 (en) * 2005-03-15 2006-09-21 Branz Howard M Method for low-temperature, hetero-epitaxial growth of thin film cSi on amorphous and multi-crystalline substrates and c-Si devices on amorphous, multi-crystalline, and crystalline substrates
WO2009096931A1 (en) * 2008-01-28 2009-08-06 Amit Goyal Semiconductor-based large-area flexible electronic devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872988B1 (en) * 2004-03-23 2005-03-29 Ut-Battelle, Llc Semiconductor films on flexible iridium substrates
US20070044832A1 (en) * 2005-08-25 2007-03-01 Fritzemeier Leslie G Photovoltaic template
US20090038714A1 (en) * 2007-08-08 2009-02-12 Ut-Battelle, Llc Strong, non-magnetic, cube textured alloy substrates

Non-Patent Citations (23)

* Cited by examiner, † Cited by third party
Title
7TH INTERNATIONAL CONFERENCE ON INTERGRANULAR AND INTERPHASE BOUNDARIES IN MATERIALS, vol. 207-2091, MATERIALS SCIENCE FORUM TRANS TECH PUBLICATIONS SWITZERLAND, pages 233 - 236, ISSN: 0255-5476 *
ANONYMOUS: "Bending moments and beam curvatures", UNIVERSITY OF CAMBRIDGE, Retrieved from the Internet <URL:http://www.doitpoms.ac.uk/tlplib/beam_bending/bend_moments.php> [retrieved on 20151018] *
BELENCHUK A ET AL: "Growth of (111)-oriented PbTe films on Si(001) using a BaF2 buffer", THIN SOLID FILMS ELSEVIER SWITZERLAND, vol. 358, no. 1-2, 10 January 2000 (2000-01-10), pages 277 - 282, ISSN: 0040-6090 *
CHAMBERS S A ET AL: "Growth and structure of MBE grown TiO2 anatase films with rutile nano-crystallites", SURFACE SCIENCE ELSEVIER NETHERLANDS, vol. 601, no. 6, 15 March 2007 (2007-03-15), pages 1582 - 1589, ISSN: 0039-6028 *
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 1 October 2005 (2005-10-01), SUTOH Y ET AL: "Mechanical bending property of YBCO coated conductor by IBAD/PLD", Database accession no. 8784555 *
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 1996, FUJII T ET AL: "Epitaxy of deposited [alpha]-Fe films on high-index Cu substrate planes", Database accession no. 5305691 *
FILONENKO O ET AL: "Influence of ultrathin templates on the epitaxial growth of CrSi2 on Si(001)", MICROELECTRONIC ENGINEERING ELSEVIER NETHERLANDS, vol. 76, no. 1-4, October 2004 (2004-10-01), pages 324 - 330, ISSN: 0167-9317 *
GLESKOVA H ET AL: "Field-effect mobility of amorphous silicon thin-film transistors under strain", JOURNAL OF NON-CRYSTALLINE SOLIDS ELSEVIER NETHERLANDS, vol. 338-340, 15 June 2004 (2004-06-15), pages 732 - 735, ISSN: 0022-3093 *
GOYAL A ET AL: "Low cost, single crystal-like substrates for practical, high efficiency solar cells", AIP CONFERENCE PROCEEDINGS AIP USA, no. 404, 1997, pages 377 - 394, XP002689485, ISSN: 0094-243X *
HELLWIG O ET AL: "Growth of fcc(111) on bcc(110): new type of epitaxial transition observed for Pd on Cr", SURFACE SCIENCE ELSEVIER NETHERLANDS, vol. 398, no. 3, 20 February 1998 (1998-02-20), pages 379 - 385, ISSN: 0039-6028 *
HOSHINO A ET AL: "Epitaxial growth of copper and cobalt phthalocyanines on KCl", JAPANESE JOURNAL OF APPLIED PHYSICS, PART 1 (REGULAR PAPERS, SHORT NOTES & REVIEW PAPERS) JAPAN SOC. APPL. PHYS. JAPAN, vol. 43, no. 7A, July 2004 (2004-07-01), pages 4344 - 4350, ISSN: 0021-4922 *
MACMANUS-DRISCOLL J ET AL: "Understanding and electrochemical control of YBa2Cu3O7-x thin film epitaxy on yttrium stabilized zirconia", JOURNAL OF APPLIED PHYSICS USA, vol. 75, no. 1, 1 January 1994 (1994-01-01), pages 412 - 422, ISSN: 0021-8979 *
MITCHELL ET AL: "Characterisation of epitaxial TiO2 thin films grown on MgO(001) using atomic layer deposition", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 285, no. 1-2, 15 November 2005 (2005-11-15), pages 208 - 214, XP005123709, ISSN: 0022-0248, DOI: 10.1016/J.JCRYSGRO.2005.08.003 *
NISHIKATA S ET AL: "Polycrystalline domain structure of pentacene thin films epitaxially grown on a hydrogen-terminated Si(111) surface", PHYSICAL REVIEW B (CONDENSED MATTER AND MATERIALS PHYSICS) AMERICAN PHYSICAL SOCIETY USA, vol. 76, no. 16, 15 October 2007 (2007-10-15), pages 165424 - 1, ISSN: 1098-0121 *
OTTOSSON M ET AL: "Chemical vapour deposition of Cu2O on MgO(100) from CuI and N2O: aspects of epitaxy", JOURNAL OF CRYSTAL GROWTH NETHERLANDS, vol. 151, no. 3-4, June 1995 (1995-06-01), pages 305 - 311, ISSN: 0022-0248 *
PHYSICA C ELSEVIER NETHERLANDS, vol. 426-431, no. 1, pages 933 - 937, ISSN: 0921-4534, DOI: 10.1016/J.PHYSC.2005.02.086 *
PLANK H ET AL: "Molecular alignments in sexiphenyl thin films epitaxially grown on muscovite", THIN SOLID FILMS ELSEVIER SWITZERLAND, vol. 443, no. 1-2, 22 October 2003 (2003-10-22), pages 108 - 114, ISSN: 0040-6090 *
QIANG FU ET AL: "Nucleation and growth of Cr clusters and films on (100) SrTiO3 surfaces", THIN SOLID FILMS, vol. 420-421, 2 December 2002 (2002-12-02), ELSEVIER SWITZERLAND, pages 455 - 460, ISSN: 0040-6090 *
See also references of WO2009096932A1 *
SHANKAR P S ET AL: "Bend strain tolerance of YBa2Cu3O7-x-coated conductors fabricated by inclined substrate deposition", SUPERCONDUCTOR SCIENCE & TECHNOLOGY IOP PUBLISHING UK, vol. 19, no. 9, September 2006 (2006-09-01), pages 930 - 933, ISSN: 0953-2048 *
TIAN W ET AL: "Epitaxial integration of (0001) BiFeO3 with (0001) GaN", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS, 2 HUNTINGTON QUADRANGLE, MELVILLE, NY 11747, vol. 90, no. 17, 25 April 2007 (2007-04-25), pages 172908 - 172908, XP012094383, ISSN: 0003-6951, DOI: 10.1063/1.2730580 *
VISOLY-FISHER I ET AL: "How polycrystalline devices can outperform single-crystal ones: Thin film CdTe/CdS solar cells", ADVANCED MATERIALS 20040604 WILEY-VCH VERLAG DE, vol. 16, no. 11, 4 June 2004 (2004-06-04), pages 879 - 883, DOI: 10.1002/ADMA.200306624 *
VISOLY-FISHER I ET AL: "UNDERSTANDING THE BENEFICIAL ROLE OF GRAIN BOUNDARIES IN POLYCRYSTALLINE SOLAR CELLS FROM SINGLE-GRAIN-BOUNDARY SCANNING PROBE MICROSCOPY", ADVANCED FUNCTIONAL MATERIALS, vol. 16, no. 5, 20 March 2006 (2006-03-20), WILEY - V C H VERLAG GMBH & CO. KGAA, DE, pages 649 - 660, XP001241750, ISSN: 1616-301X, DOI: 10.1002/ADFM.200500396 *

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EP2250664A1 (en) 2010-11-17
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