EP2248150A4 - Protection de bord par recuit milliseconde (dsa) - Google Patents

Protection de bord par recuit milliseconde (dsa)

Info

Publication number
EP2248150A4
EP2248150A4 EP09710273A EP09710273A EP2248150A4 EP 2248150 A4 EP2248150 A4 EP 2248150A4 EP 09710273 A EP09710273 A EP 09710273A EP 09710273 A EP09710273 A EP 09710273A EP 2248150 A4 EP2248150 A4 EP 2248150A4
Authority
EP
European Patent Office
Prior art keywords
dsa
edge protection
millisecond annealing
millisecond
annealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09710273A
Other languages
German (de)
English (en)
Other versions
EP2248150A1 (fr
Inventor
Blake Koelmel
Robert C Mcintosh
David D L Larmagnac
Alexander N Lerner
Abhilash J Mayur
Joseph Yudovsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP2248150A1 publication Critical patent/EP2248150A1/fr
Publication of EP2248150A4 publication Critical patent/EP2248150A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
EP09710273A 2008-02-15 2009-02-04 Protection de bord par recuit milliseconde (dsa) Withdrawn EP2248150A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/032,475 US7754518B2 (en) 2008-02-15 2008-02-15 Millisecond annealing (DSA) edge protection
PCT/US2009/033102 WO2009102600A1 (fr) 2008-02-15 2009-02-04 Protection de bord par recuit milliseconde (dsa)

Publications (2)

Publication Number Publication Date
EP2248150A1 EP2248150A1 (fr) 2010-11-10
EP2248150A4 true EP2248150A4 (fr) 2012-03-07

Family

ID=40955524

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09710273A Withdrawn EP2248150A4 (fr) 2008-02-15 2009-02-04 Protection de bord par recuit milliseconde (dsa)

Country Status (7)

Country Link
US (2) US7754518B2 (fr)
EP (1) EP2248150A4 (fr)
JP (1) JP5451643B2 (fr)
KR (3) KR101608865B1 (fr)
CN (2) CN105514001B (fr)
TW (2) TWI545676B (fr)
WO (1) WO2009102600A1 (fr)

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KR102118069B1 (ko) 2009-12-31 2020-06-02 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 엣지 및 경사면 증착을 수정하기 위한 쉐도우 링
NL2009689A (en) * 2011-12-01 2013-06-05 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
US9005877B2 (en) 2012-05-15 2015-04-14 Tokyo Electron Limited Method of forming patterns using block copolymers and articles thereof
KR102003334B1 (ko) 2012-09-04 2019-07-24 삼성전자주식회사 패턴 형성 방법
US9147574B2 (en) 2013-03-14 2015-09-29 Tokyo Electron Limited Topography minimization of neutral layer overcoats in directed self-assembly applications
US8975009B2 (en) 2013-03-14 2015-03-10 Tokyo Electron Limited Track processing to remove organic films in directed self-assembly chemo-epitaxy applications
US8980538B2 (en) 2013-03-14 2015-03-17 Tokyo Electron Limited Chemi-epitaxy in directed self-assembly applications using photo-decomposable agents
US20140273534A1 (en) 2013-03-14 2014-09-18 Tokyo Electron Limited Integration of absorption based heating bake methods into a photolithography track system
US9136110B2 (en) 2013-03-15 2015-09-15 Tokyo Electron Limited Multi-step bake apparatus and method for directed self-assembly lithography control
KR102394994B1 (ko) 2013-09-04 2022-05-04 도쿄엘렉트론가부시키가이샤 유도 자기 조립용 화학 템플릿을 생성하기 위한 경화 포토레지스트의 자외선을 이용한 박리
US9349604B2 (en) 2013-10-20 2016-05-24 Tokyo Electron Limited Use of topography to direct assembly of block copolymers in grapho-epitaxial applications
US9793137B2 (en) 2013-10-20 2017-10-17 Tokyo Electron Limited Use of grapho-epitaxial directed self-assembly applications to precisely cut logic lines
CN104733344A (zh) * 2013-12-18 2015-06-24 北京北方微电子基地设备工艺研究中心有限责任公司 一种边沿保护装置及等离子体加工设备
CN104736011B (zh) * 2013-12-27 2017-05-31 Ykk株式会社 增强膜粘着装置及具有可分离式嵌插件的拉链
US20150187616A1 (en) * 2013-12-31 2015-07-02 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms of adjustable laser beam for laser spike annealing
US9410249B2 (en) 2014-05-15 2016-08-09 Infineon Technologies Ag Wafer releasing
US10892180B2 (en) * 2014-06-02 2021-01-12 Applied Materials, Inc. Lift pin assembly
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
CN105988298B (zh) * 2015-02-02 2018-06-01 上海微电子装备（集团）股份有限公司 硅片边缘保护装置及保护方法
KR102090152B1 (ko) * 2015-12-30 2020-03-17 맷슨 테크놀로지, 인크. 밀리세컨드 어닐 시스템을 위한 챔버 벽 가열
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US9947597B2 (en) 2016-03-31 2018-04-17 Tokyo Electron Limited Defectivity metrology during DSA patterning
JP6618876B2 (ja) * 2016-09-26 2019-12-11 株式会社ニューフレアテクノロジー 基板処理装置、搬送方法およびサセプタ
CN106571321B (zh) * 2016-11-18 2019-12-06 中国电子科技集团公司第四十八研究所 一种用于快速热处理设备的载片台
US10704147B2 (en) * 2016-12-03 2020-07-07 Applied Materials, Inc. Process kit design for in-chamber heater and wafer rotating mechanism
US10535538B2 (en) * 2017-01-26 2020-01-14 Gary Hillman System and method for heat treatment of substrates
CN110376847B (zh) * 2018-04-12 2021-01-01 上海微电子装备（集团）股份有限公司 一种基底边缘保护环单元、光刻设备及保护方法
US20200365381A1 (en) * 2019-05-14 2020-11-19 Mattson Technology, Inc. Systems And Methods For Transportation Of Replaceable Parts In a Vacuum Processing Apparatus
CN111508890B (zh) * 2020-04-28 2023-12-22 北京北方华创微电子装备有限公司 一种晶片装卸机构和半导体工艺设备
CN112670206A (zh) * 2020-12-21 2021-04-16 上海华力集成电路制造有限公司 一种改善晶圆破片的激光退火设备及其使用方法
US20230002894A1 (en) * 2021-07-01 2023-01-05 Applied Materials, Inc. Shadow ring lift to improve wafer edge performance

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Also Published As

Publication number Publication date
KR20100123724A (ko) 2010-11-24
WO2009102600A1 (fr) 2009-08-20
KR20170072362A (ko) 2017-06-26
TW201507050A (zh) 2015-02-16
JP5451643B2 (ja) 2014-03-26
US20090209112A1 (en) 2009-08-20
CN101946302A (zh) 2011-01-12
TWI463589B (zh) 2014-12-01
US7754518B2 (en) 2010-07-13
JP2011512674A (ja) 2011-04-21
TW201001588A (en) 2010-01-01
KR101850088B1 (ko) 2018-04-18
TWI545676B (zh) 2016-08-11
CN105514001B (zh) 2018-03-09
CN101946302B (zh) 2016-02-10
KR101608865B1 (ko) 2016-04-04
KR101749041B1 (ko) 2017-06-20
EP2248150A1 (fr) 2010-11-10
KR20160030321A (ko) 2016-03-16
US7923280B2 (en) 2011-04-12
US20100273334A1 (en) 2010-10-28
CN105514001A (zh) 2016-04-20

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