EP2244002B1 - Dispositif d'éclairage à DEL capable de dissiper uniformément la chaleur - Google Patents

Dispositif d'éclairage à DEL capable de dissiper uniformément la chaleur Download PDF

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Publication number
EP2244002B1
EP2244002B1 EP09005729.0A EP09005729A EP2244002B1 EP 2244002 B1 EP2244002 B1 EP 2244002B1 EP 09005729 A EP09005729 A EP 09005729A EP 2244002 B1 EP2244002 B1 EP 2244002B1
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EP
European Patent Office
Prior art keywords
heat
conducting plate
led lighting
heat pipe
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP09005729.0A
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German (de)
English (en)
Other versions
EP2244002A1 (fr
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Mong-Hua Hung
Chiao-Li Huang
Ken Hsu
Chih-Hsung Cheng
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Kitagawa Holdings LLC
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Kitagawa Holdings LLC
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Publication date
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Priority to EP09005729.0A priority Critical patent/EP2244002B1/fr
Publication of EP2244002A1 publication Critical patent/EP2244002A1/fr
Application granted granted Critical
Publication of EP2244002B1 publication Critical patent/EP2244002B1/fr
Not-in-force legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention generally relates to an LED lighting device, and more particularly to an LED streetlamp having a heat dissipating structure.
  • the high heat resulting from overnight use always makes its service life limited. Because of its high power consuming and environmental pollution, it trends toward being replaced by a light emitting diode (LED) lighting device having advantages of high intensity, power saving and long service life, etc. However, the heat generated from the LED will have disadvantageous influence on its service life. Therefore, the LED streetlamps usually employ heat dissipating devices.
  • LED light emitting diode
  • a conventional LED streetlamp is provided with a lamp base and a transparent cover, in which a plurality of LEDs are accommodated therebetween.
  • a heat dissipating device comprising a heat-conducting plate and plural heat dissipating fins disposed thereon is arranged in the streetlamp, wherein the heat-conducting plate is connected with the LEDs. The heat generated from the LEDs will be dissipated by the heat dissipating fins, and an additional heat dissipating fan is required for blowing the heated air.
  • the heated air is dissipated by the heat dissipating fan.
  • the fan requires consuming extra electricity when operated, which contradicts the conception of power saving and environment protecting.
  • the fan installed outdoors may be damaged easily.
  • US 7,488,093 B1 describes a LED lamp with a cover and a heat sink.
  • the LED lamp comprises a lamp enclosure, a plurality of LED modules, a thermal module and a cover.
  • the LED modules are received in the lamp enclosure for generating light.
  • the thermal module is attached to a top portion of a lamp enclosure and contacts the LED module for dissipating heat generated by the LED modules.
  • the cover is retained above a top of the thermal module for covering the thermal module.
  • the thermal module comprises a heat sink and three heat pipes connecting to the heat sink.
  • the heat sink comprises a flat, rectangular base and a plurality of fins extending from a top portion of the base.
  • the base has a bottom portion, which horizontally defines three grooves.
  • the grooves extend gradually and outwardly from a center of the base.
  • the end of each groove defines a screw hole vertically extending through the base and the fins till communicating a top of the heat sink.
  • Evaporators of the heat pipes respectively extend through the screw holes from a top of the heat sink to be received in the groove.
  • Half parts of the condensors of the heat pipes are respectively received in grooves of the cover.
  • US 2007/0086196 A1 discloses heat dissipation devices for an LED lamp set with a plate-type heat spreader as the core unit.
  • the plate-type heat spreader is either a flat-plate heat pipe or a metal plate embedded with heat pipes.
  • the high-power LED lamps are thermally connected to the bottom surface of the heat spreader so that the heat generated by the LED lamps is absorbed by the evaporation region of the flat-plate heat pipe or the embedding heat pipes.
  • the heat is spread by internal vapor motion of the working fluid toward different regions of the heat spreader.
  • the top surface of the heat spreader is connected with a finned heat sink, where the heat is delivered to the ambient air.
  • the hot air leaves by buoyancy through the openings on a lamp housing located above the finned heat sink.
  • a lamp housing located above the finned heat sink.
  • An alternative design is that the inner surface of the lamp housing is connected with the top surface of the plate-type heat spreader, with the heat dissipated out at the surface of the housing by natural convection.
  • an LED lighting device comprises a top cover, a lamp base, a first heat dissipating module and a second heat dissipating module, wherein the lamp base is covered with the top cover to form an accommodating space for accommodating the first heat dissipating module and the second heat dissipating module.
  • the first heat dissipating module comprises a first heat-conducting plate, a first heat pipe and a first heat dissipater.
  • An LED lighting module is connected with the first heat-conducting plate in which an evaporator section of the first heat pipe is disposed.
  • a condenser section of the first heat pipe is arranged on the first heat dissipater.
  • the second heat dissipating module comprises a second heat-conducting plate and a second heat pipe.
  • the second heat-conducting plate paralleling to the first heat-conducting plate is connected with the LED lighting module.
  • An evaporator section of the second heat pipe is disposed on the second heat-conducting plate, and whose condenser section is connected with an inner surface of the top cover.
  • the present invention is provided with two heat dissipating modules, in which one heat dissipating module transfers the heat to the dissipaters by a heat-conducting plate and heat pipes, and the other heat dissipating module concurrently transfers the heat to the top cover.
  • the two heat dissipating modules are lined on the LED lighting modules for transferring the heat uniformly and rapidly. Because the heat pipe has advantages of high thermal conductivity, light weight, simple structure and long service time, it has an excellent heat conducting efficiency without consuming extra electricity, which make economical and practical utility be improved.
  • the present invention is a light-emitting diode (LED) lighting device 1.
  • the lighting device 1 includes a top cover 10 and a lamp base 20.
  • the lamp base 20 is coupled with the top cover 10 to form an accommodating space 100 for accommodating a first heat dissipating module 30 and a second heat dissipating module 40.
  • the first heat dissipating module 30 and the second heat dissipating module 40 are arranged inside the lamp base 20.
  • two corresponding ends of the lamp base 20 are provided with side plates 22 separately. There are a plurality of heat dissipating holes 220 in each of the side plates 22.
  • the rear end of the lamp base 20 has a sleeve 23 for being inserted by a lamp pole (not shown).
  • the bottom of the lamp base 20 is provided with a block 60 with good thermal conductivity.
  • the first heat dissipating module 30 and the second heat dissipating module 40 are arranged on the top surface of the block 60.
  • the bottom side of the lamp base 20 connects an LED lighting module 50.
  • the first heat dissipating module 30 comprises a first heat-conducting plate 31, a first heat pipe 32a, an another first heat pipe 32b, a first heat dissipater 33a and a second heat dissipater 33b.
  • the first heat-conducting plate 31 is mounted on the top surface of the block 60 for connecting a front end of the LED lighting module 50.
  • the first heat-conducting plate 31 is composed of a first upper heat-conducting plate 31 a and a first lower heat-conducting plate 31b.
  • the first upper heat-conducting plate 31a defines a first upper groove 310a thereon, and the first lower heat-conducting plate 31b has a first lower groove 310b correspondingly. Both the first upper groove 310a and the first lower groove 310b are used for disposing an evaporator section 321a of the first heat pipe 32a and an evaporator section 321b of the another first heat pipe 32b.
  • the first heat pipe 32a having one evaporator section 321 a and two condenser sections 322a, 322a' is formed in a U shape.
  • the first heat dissipater 33a is arranged on the condenser section 322a of the first heat pipe 32a, and the second heat dissipater 33b is arranged on the other condenser section 322a'.
  • the first heat dissipater 33a is defined by a group of heat dissipating fins, or it can be an aluminum-extruding typed heat dissipating fin.
  • the bottom of the first heat dissipater 33a is provided with a first accommodating groove 330a for accommodating the condenser section 322a. By this manner, the contacting areas of the condenser section 322a with the first heat dissipater 33a can be increased.
  • a second accommodating groove 330b is provided on the bottom of the second heat dissipater 33b.
  • a first lower plate 34a and a second lower plate 34b are disposed on two sides of the first heat-conducting plate 31 separately.
  • a first embedding groove 340a and a second embedding groove 340b are defined on the first and the second lower plate 34a, 34b respectively for disposing the two condenser sections 322a, 322a'. That is, the two condenser sections 322a, 322a' are arranged between the first lower plate 34a and the first heat dissipater 33a.
  • the first and the second lower plate 34a, 34b can preferably be heat conductors for transferring the heat of the condenser sections 322a, 322a' to the first and the second heat dissipater 33a, 33b.
  • the two condenser sections 322a, 322a' are arranged on the first and the second lower plate 34a, 34b separately.
  • the another heat pipe 32b having one evaporator section 321b and two condenser sections 322b, 322b' is also in a U shape.
  • the evaporator section 321b is disposed on the first heat-conducting plate 31, and the two condenser sections 322b, 322b' are disposed on the first and the second embedding groove 340a, 340b respectively. Therefore, the first heat pipe 32a, 32b of the first heat dissipating module 30 transfer the heat to the first and the second dissipater 33a, 33b.
  • first heat pipe 32a, 32b is not constrained.
  • the quantity of the first heat pipe and the dissipaters can be changed in accordance with demands, in which the quantity can be one.
  • the first upper groove 310a, the first lower groove 310b, the first and second accommodating groove 330a, 330b, and the first and second embedding groove 340a, 340b can be coated with heat conducting materials such as heat conducting grease.
  • the second heat dissipating module 40 includes a second heat-conducting plate 41, a second heat pipe 42a and two another second heat pipes 42b, 42c.
  • the second heat-conducting plate 41 is disposed on a top surface of the block 60 for connecting a rear end of the LED lighting module 50.
  • the second heat-conducting plate 41 is composed of a second upper heat-conducting plate 41a and a second lower heat-conducting plate 41b.
  • the second upper heat-conducting plate 41a and the second lower heat-conducting plate 4 1 b define a second upper groove 410a and a second lower groove 410b respectively.
  • the second heat pipe 42a has one evaporator section 421a and one condenser section 422a, wherein the evaporator section 421a is disposed between the second upper groove 410 and the second lower groove 410b, and the condenser section 422a is connected with the interior surface 101 (see FIG. 2 ) of the top cover 10.
  • the second heat dissipating module 40 further comprises an upper plate 43 with good thermal conductivity, which is fixed on the interior surface 101.
  • a first to third accommodating groove 430a ⁇ 430c are defined on the upper plate 43 for disposing condenser sections 422a ⁇ 422c of the three second heat pipes 42a ⁇ 42c.
  • the heat of the second heat-conducting plate 41 can be conducted to the upper plate 43 and the top cover 10 more uniformly and rapidly.
  • Two evaporator sections 421b, 421c of the two another second heat pipes 42b, 42c are parallel to the evaporator section 421a of the second heat pipe 42a, where in an interval between the two adjacent condenser sections 422a ⁇ 422c is larger than that of evaporator sections 421a ⁇ 421c thereof. It transversely conducts the heat in the second heat-conducting plate 41 to the top cover 10.
  • the length of the condenser section 422a of the second heat pipe 42a is longer than the length of the condenser sections 422b, 422c of the two another second heat pipe 42b, 42c.
  • the heat in the second heat-conducting plate 41 can also be conducted to the top cover 10 in a longitudinal direction.
  • the upper plate 43 can be configured in a T shape for reducing weight and costs.
  • the quantity of the second heat pipe 42a ⁇ 42c can be changed in accordance with demands, in which the quantity can be one.
  • the second upper groove 410a, the second lower groove 410b and the first to third accommodating groove 430a ⁇ 430c can be coated with heat conducting materials such as heat conducting grease.
  • one side of the block 60 is provided with a trough 61 for accommodating the LED lighting module 50 covered by a transparent cover 70.
  • the heat generated from the LED lighting module 50 is conducted to the first heat-conducting plate 31 and the second heat-conducting plate 41 through the block 60. Then the heat is transferred to the first and second dissipater 33a, 33b by the first and second heat pipe 32a, 32b. At last, the heat will be dispersed to the outside through the heat dissipating holes 220.
  • the three second heat pipes 42a ⁇ 42c transfer the heat to the top cover 10, and the heat will be dispersed by the top cover 10.
  • the second heat-conducting plate 41 only includes the second upper heat-conducting plate 41a whose bottom is provided with the second upper groove 410a for accommodating condenser sections of the three second heat pipes 42a ⁇ 42c. Morever, there are three discrete upper plate 43a ⁇ 43c for accommodating condenser sections of the three second heat pipes 42a ⁇ 42c respectively.
  • the upper plate 43d is configured in a rectangular shape for disposing the condenser sections of three second heap pipe 42a ⁇ 42c in equal length.
  • the first heat-conducting plate 31 only includes the first upper heat-conducting plate 31a whose bottom is provided with the first upper groove 310a for accommodating the evaporator sections of the two first heat pipe 32a, 32b. Besides, there are no accommodating grooves defined on the bottoms of the first and second heat dissipater 33a, 33b.
  • Each condenser section of the heat pipes 32a, 32b is formed with a flat surface connected with the first and second heat dissipaters 33a, 33b.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (8)

  1. Un dispositif d'éclairage à diode électroluminescente (LED) comprenant :
    - un module d'éclairage à LED (50),
    - un couvercle supérieur (10),
    - un socle de lampe (20) recouvert par le couvercle supérieur (10) de façon à former un espace de logement (100), le module d'éclairage à LED (50) étant installé sur l'extérieur du socle de lampe (20),
    - un premier module de dissipation thermique (30) dans l'espace de logement (100), comprenant :
    - une première plaque conductrice de chaleur (31) raccordée au module d'éclairage à LED (50),
    - un premier caloduc (32a), dont la partie évaporateur (321 a) est fixée à la première plaque conductrice de chaleur (31), et
    - un premier dissipateur thermique (33a), raccordé à une partie condensateur (322a) du premier caloduc (32a), et
    - un deuxième module de dissipation thermique (40) dans l'espace de logement (100), comprenant :
    - une deuxième plaque conductrice de chaleur (41) rattachée au module d'éclairage à LED (50), et
    - un deuxième caloduc (42a), dont la partie évaporateur (421 a) est fixée à la deuxième plaque conductrice de chaleur (41), et
    - une partie condensateur (422a) du deuxième caloduc (42a) raccordée à une surface intérieure (101) du couvercle supérieur (10),
    où le premier module de dissipation thermique (30) comprend en outre une première plaque inférieure (34a) possédant une première rainure d'encastrement (340a), et le premier caloduc (32a) est intercalé entre la première plaque inférieure (34a) et le premier dissipateur (33a), où le premier caloduc (32a) possédant une partie évaporateur (321 a) et deux parties condensateurs (322a, 322a') est formé selon une forme en U, le premier module de dissipation thermique (30) comprend en outre une deuxième plaque inférieure (34b), et les deux parties condensateurs (322a, 322a') sont fixées sur la première et la deuxième plaque inférieure (34a, 34b) séparément,
    où un côté de la première plaque conductrice de chaleur (31) possède une première rainure supérieure (310a) destinée à recevoir le premier caloduc (32a),
    où le deuxième module de dissipation thermique (40) comprend en outre une plaque supérieure (43) raccordée à la surface intérieure (101) du couvercle supérieur (10) et munie d'une première rainure de réception (430a) destinée à loger le deuxième caloduc (42a),
    où le deuxième module de dissipation thermique (40) comprend en outre deux autres deuxièmes caloducs (42b, 42c), dont les parties évaporateurs (421 b, 421 c) sont parallèles à la partie évaporateur (421 a) du deuxième caloduc (42a) et fixées sur la deuxième plaque conductrice de chaleur (41),
    où un intervalle entre les deux parties condensateurs adjacentes (422a∼422c) des trois deuxièmes caloducs (42a∼42c) est plus grand que celui des parties évaporateurs (421a∼422c) de ceux-ci, et où
    la longueur de la partie condensateur (421 a) du deuxième caloduc (42a) est plus grande que celle des parties condensateurs (421 b, 421c) des deux autres deuxièmes caloducs (42b, 42c).
  2. Le dispositif d'éclairage à LED selon la Revendication 1, où le premier module de dissipation thermique (30) comprend en outre un deuxième dissipateur thermique (33b) raccordé à l'autre partie condensateur (322a') du premier caloduc (32a).
  3. Le dispositif d'éclairage à LED selon la Revendication 1, où la première et la deuxième plaque inférieure (34a, 34b) sont thermo-conductrices.
  4. Le dispositif d'éclairage à LED selon la Revendication 1, où le premier module de dissipation thermique (30) comprend en outre un autre premier caloduc (32b), l'autre premier caloduc (32b) possédant une partie évaporateur (321 b) et deux parties condensateurs (322b, 322b') est formé selon une forme en U, et les deux parties condensateurs (322b, 322b') sont fixées sur la première et la deuxième plaque inférieure (34a, 34b) séparément.
  5. Le dispositif d'éclairage à LED selon la Revendication 1, où la première plaque conductrice de chaleur (31) se compose d'une première plaque supérieure conductrice de chaleur (31 a) et d'une première plaque inférieure conductrice de chaleur (31 b), la première rainure supérieure (310a) est agencée sur la première plaque supérieure conductrice de chaleur (31 a), une première rainure inférieure (310b) est agencée de manière correspondante sur la première plaque inférieure conductrice de chaleur (31 b), et le premier caloduc (32a) est intercalé entre la première rainure supérieure et la première rainure inférieure (310a, 310b).
  6. Le dispositif d'éclairage à LED selon la Revendication 1, où la plaque supérieure (43) est formée selon une forme en T.
  7. Le dispositif d'éclairage à LED selon la Revendication 1, où le deuxième module de dissipation thermique (40) comprend trois plaques supérieures séparées (43a~43c) destinées à recevoir les parties condensateurs (422a~422c) des trois deuxièmes caloducs (42a∼42c).
  8. Le dispositif d'éclairage à LED selon la Revendication 1, où la plaque supérieure (43a) est thermoconductrice.
EP09005729.0A 2009-04-23 2009-04-23 Dispositif d'éclairage à DEL capable de dissiper uniformément la chaleur Not-in-force EP2244002B1 (fr)

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CN103827581A (zh) * 2011-09-26 2014-05-28 普司科Led股份有限公司 光学半导体式发光装置
KR101317553B1 (ko) * 2012-12-31 2013-10-16 에이펙스인텍 주식회사 방열구조를 구비한 엘이디 가로등 및 보안등
KR101309463B1 (ko) * 2012-12-31 2013-09-23 에이펙스인텍 주식회사 대류현상을 이용한 내부 방열구조를 이룬 가로등 및 보안등
CN110748865A (zh) * 2019-11-27 2020-02-04 特能热交换科技（中山）有限公司 一种散热器以及具有该散热器的灯具

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US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set

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US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set

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