EP2217887A1 - Module détecteur et son procédé de production - Google Patents

Module détecteur et son procédé de production

Info

Publication number
EP2217887A1
EP2217887A1 EP08853353A EP08853353A EP2217887A1 EP 2217887 A1 EP2217887 A1 EP 2217887A1 EP 08853353 A EP08853353 A EP 08853353A EP 08853353 A EP08853353 A EP 08853353A EP 2217887 A1 EP2217887 A1 EP 2217887A1
Authority
EP
European Patent Office
Prior art keywords
sensor
sensor chip
sensor module
chip
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08853353A
Other languages
German (de)
English (en)
Inventor
Willibald Reitmeier
Andreas Wildgen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP2217887A1 publication Critical patent/EP2217887A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the invention relates to a sensor module with a sensor chip, which is covered by a plastic cover.
  • the invention further relates to a method for producing the sensor module.
  • Such a sensor module is known from US 2007/0139044 Al.
  • the known sensor module comprises a conductor grid on which a sensor chip is applied.
  • the sensor chip is covered with an inner plastic sheath made of thermosetting plastic.
  • an outer plastic sheath made of a thermoplastic material is provided which forms a plug in the region of contact ends of the conductor grid.
  • the known sensor module is set up in particular for detecting the rotational speed of a turbocharger.
  • US 2004/0118227 A1 discloses a further sensor module in which a sensor chip is applied to one end of a conductor grid and provided with a plastic envelope by means of thermoplastic material. The other end of the conductor grid is connected to contact pins. The joint and the pins themselves are embedded in another plastic shell. In the area facing away from the conductor grid ends of the contact pins, the further plastic shell is designed as a plug socket.
  • a temperature-sensitive sensor, a sensor sensitive to magnetic fields, an acceleration sensor or an angular-velocity sensor are provided as the sensor chip.
  • a disadvantage of the known sensor modules is that the sensor chip is shielded from the environment. This may result in extended response times or the need for calibration to influence the plastic shell determine and take into account accordingly. In addition, changes in the nature of the plastic sheath can lead to long-term signal changes that can cause erroneous measurements.
  • the invention has the object to provide a sensor module with improved measuring properties.
  • the invention is also based on the object of specifying a method for producing the sensor module.
  • the sensor cover exposes a sensor surface and, at least in sections, a lateral edge region of the sensor chip.
  • the sensor surface of the sensor chip is exposed directly to the surrounding medium. Temperature changes can be detected in the case of a temperature sensor without extended response times. Pressure changes or concentration of the surrounding medium are further not distorted by the plastic cover. Nevertheless, an electrical contact of the sensor chip can be protected from direct mechanical action by the plastic cover.
  • the sensor module therefore offers the advantages of an exposed sensor surface together with the advantages of a plastic cover reinforcing the sensor module.
  • the sensor module is provided with a conductor carrier on which the sensor chip is mounted.
  • the plastic cover extends over the contact region, in which the sensor chip is connected to the conductor tracks of the conductor carrier. This makes the most sensitive contact area protected against external influences.
  • the sensor chip is seated only with a lateral edge region on the conductor carrier.
  • the conductor carrier in the region of the sensor chip can be completely enveloped by the plastic cover, so that the conductor carrier is protected from corrosion by the plastic cover and there are no interfaces to the outside at which it can form a gap.
  • the conductor carrier projects out of the plastic envelope in the region of the sensor chip. This allows the sensor chip to be supported on the entire underside.
  • the plastic cover is inserted into a sensor socket in the sliding seat and seals joints between the plastic cover and the sensor socket by means of a filling compound.
  • the plastic cover can seal a bushing formed in the sensor fitting and to hold the sensor chip in the bushing. In this way, it is possible to dispense with the use of an additional filling compound which connects the plastic cover to the sensor socket.
  • the conductor carrier is preferably a conductor grid which can be punched out of a metal sheet in a simple manner.
  • a conductive grid is to be understood as meaning a self-supporting unit of conductor tracks, wherein the conductor tracks do not necessarily have to be connected to one another after completion of the production.
  • the conductor grid may, for example, be a so-called lead frame.
  • the sensor chip is preferably elongated.
  • the sensor surface is arranged in an end region of the sensor chip, so that only the part of the sensor chip provided with the sensor surface protrudes from the plastic cover. In this case, the remaining areas of the sensor chip are protected by the plastic cover.
  • the outside of the sensor chip may be surface-passivated. This can be done in particular by a passivation layer with a layer cover of a few micrometers to a few hundred micrometers, preferably below one millimeter.
  • a passivation layer in particular materials based on oxides, nitrides, carbides or polymers such as silicones, parylenes and polyimides, or even noble metals are suitable.
  • the production of the sensor module is preferably carried out by means of a transfer molding process in which the sensor chip is introduced into a molding tool and the molding tool is filled with a plastic compound.
  • a transfer molding process in which the sensor chip is introduced into a molding tool and the molding tool is filled with a plastic compound.
  • an inside of the mold is coated with a release film, which facilitates the detachment of the cured plastic material from the mold.
  • the content of release agent in the plastic composition can be reduced, which leads to a plastic composition having increased adhesive strength.
  • FIG. 1 shows a longitudinal section through a sensor module with a sensor chip held in an edge area by a plastic sleeve;
  • Figure 2 is a plan view of the sensor module of Figure 1;
  • FIG. 3 shows a longitudinal section through a further sensor module, with a sensor chip held in an edge area by a plastic sleeve;
  • Figure 4 is a plan view of the sensor module of Figure 3;
  • Figure 5 is a plan view of a sensor chip
  • FIG. 6 shows a longitudinal section through a sensor module with the sensor chip from FIG. 5;
  • FIG. 7 a longitudinal section through the sensor module of FIG. 1 inserted into an external sensor socket
  • Figure 8 is a perspective view of a sensor module in which the sensor chip is held by a seal of a passage of a sensor socket;
  • FIG. 9 shows a perspective view of a further cut-open sensor module, in which the sensor chip is held by the seal of a leadthrough of a sensor socket, and
  • FIG. 10 shows a known from Figure 1 construction of a sensor module 1 with a receiving element for receiving a passivation substance.
  • FIG. 1 shows a longitudinal section through a sensor module 1, which has a sensor chip 3 with a sensor surface 3.
  • the sensor chip 2 is, for example, a pressure sensor whose pressure-sensitive membrane is used as a sensor. sorflache 3 serves.
  • the sensor chip 2 is applied to a conductor grid 4 and connected to the conductor grid 4 with the aid of bonding wires 5.
  • capacitors 6 and 7 are also located on the conductor grid 4.
  • the bonding wires 5 are enveloped by an inner plastic envelope 9.
  • an edge region 10 of the sensor chip 2 and the inner plastic sleeve 9 and the capacitors 6 and 7 are enveloped by an outer plastic sheath 11, which extends as far as a contact end 12 of the conductor grid 4.
  • the sensor chip 2 thus projects out of the plastic sleeve 11 at one end of the plastic sleeve 11.
  • knobs 13 are formed on the outer plastic shell 11 knobs 13 are formed.
  • the outer plastic sleeve 11 Towards the contact ends 12 of the conductor grid 4, the outer plastic sleeve 11 also has a taper 14.
  • FIG. 2 shows a plan view of the sensor module 1 from FIG. 1.
  • the conductor grid 4 has three conductor tracks 15, 16 and 17, of which the middle conductor track 16 is provided for occupancy with ground.
  • the conductor track 16 also has a contact surface 18 in the region of the sensor chip 1, to which the sensor chip 2 can be applied.
  • the outer plastic sheath 11 extends over a rear edge surface 20 and partially over lateral edge surfaces 21 and 22.
  • a front edge surface 23, however, remains unaffected by the plastic sheath 11.
  • the plastic sheath 11 therefore extends only over a part of the lateral edge region of the sensor chip 2 and leaves open a different part of the lateral edge region of the sensor chip 2.
  • FIG. 3 shows a longitudinal section through a further sensor module 24 which has a conductor grid 25 which protrudes from the plastic envelope 11 in the region of the sensor chip 2.
  • Area of the sensor chip 2 has a holding portion 26 which is connected to the middle conductor track 16, the is intended for occupancy with mass.
  • the holding section 26 also has a central recess 27, so that the sensor chip 2 rests with its circumference on the conductor grid 25. Through the recess 27, a suction nozzle of a suction device can be brought to the sensor chip 2 and the sensor chip 2 are fixed by means of the suction on the conductor grid 25 before the bonding wires 5 are applied to establish a connection between the sensor chip 2 and the conductor grid 25.
  • FIG. 5 shows a further elongated sensor chip 28 in which the sensor surface 3 is located at a sensor end 29 of the sensor chip 28.
  • sensor circuit regions 30 to 33 adjoin the sensor end 29 and extend to a contact region 34 at a contact end 35 of the sensor chip 2.
  • the sensor chip 28 can be used, for example, as shown in FIG. 6 for a sensor module 36, in which only the contact region 34 and an adjacent circuit region 33 are covered by the plastic sleeve 11. In comparison to the sensor modules 1 and 24 shown in FIGS.
  • Sensor module 36 the sensor surface 3 better protected against induced by the plastic sheath 11 voltages, since the sensor surface 3 is mechanically decoupled from the plastic sleeve 11 by the large distance to the plastic sleeve 11. If the circuit areas 31 and 32 are covered with the plastic sheath 11, there are longer creepage distances for the medium to be detected, since the medium to be detected along the interface between the sensor chip 28 and the plastic sheath must travel a long distance, until it to the bonding wires 5 arrives.
  • a further advantage of the sensor module 36 shown in FIG. 6 is that a coating which protects the sensor surface 3 from external influences can be applied to the sensor surface 3 without the contacts in the contact region 34 having to be protected by special measures. In this respect, the production of the sensor chip 28 with respect to the sensor chip 2 is simplified.
  • the sensor modules 1, 24 and 36 can also be incorporated into an outer sensor socket 37, which in longitudinal section in
  • the sensor mount 37 has in particular a receptacle 38 into which, for example, the sensor module 1 shown in FIG. 6 can be introduced in the sliding seat.
  • the taper 14 of the plastic sheath 11 engages in a passage 39, which connects a plug space 40 formed in the sensor fitting 37 to a sensor space 41.
  • a thread 42 may be formed, with which the sensor holder 37 can be screwed into a holder.
  • a sealing ring 44 runs around a front-side opening 43 of the sensor space 41, with which the sensor fitting 37 can be applied tightly against the wall of a container or a conduit.
  • the sensor opening 43 may also be formed in the radial direction.
  • the sensor modules 1, 24 and 36 are produced by the sensor chips 2 or 28 are applied to the punched-out conductor grid 4 and 25.
  • the sensor chips 2 or 28 may be attached to the conductive gratings 4 and 25 by, for example, an adhesive.
  • an electrical connection between the sensor chips 2 or 28 and the conductor gratings 4 or 25 is produced by means of the bonding wires 5.
  • the conductor grid 4 or 25 is introduced into a mold and the inner plastic envelope 9, which covers the bonding area 8, formed. In a further method step can then in another mold the plastic sleeve 11 are produced.
  • the plastic sheaths 9 and 11 are preferably formed in a transfer molding process in which the molding material is brought into a flowable state in an advance cylinder and then pressed into the molding tool.
  • the shrinkage of the molding compound in the mold is preferably carried out at a pressure below 10 bar. In a Nachpressvorgang can then be pressed out of the mold in a pressure range between 50 and 100 bar residual air.
  • the sensor module 1, 24 or 36 can then be introduced into a sensor socket of the type of sensor socket 37 and fixed there.
  • the gap between the plastic sleeve 11 and the sensor socket 37 by means of another
  • Materials are preferably filled by means of a so-called underfiller, which is pulled by capillary forces in the space between the plastic sleeve 11 and the sensor holder 37.
  • SFT seal film technology
  • a highly flexible release film is sucked on the inside of the mold, which seals the mold and prevents the adhesion of the mold to the plastic sleeve 9 or 11.
  • Teflon can be used as a material for the release film.
  • Such a release film also serves to compensate for tolerances in the region in which the mold rests on the sensor chip 2 or 28 and to prevent damage to the sensor chip 2 or 28. In this respect, the release film acts as a cushion.
  • the use of such a release film also allows to reduce in the plastic mass used to produce the plastic sleeve 9 or 11, the proportion of release agents that promote the detachment process of the plastic sleeve 9 or 11 from the mold.
  • These constituents are wax-like components of the plastic compound, the proportion of which in the present case is less than 0.5 wt. percent can be maintained.
  • Such plastic materials with a low proportion of release agents also adhere much better to the sensor chip 2 or 28, so that the risk of lifting the plastic cover of sensor chip 2 or 28 can be reduced.
  • the sensor chip 28 can also be fastened directly in the sensor mount 37. This will be explained in more detail with reference to FIGS. 8 and 9.
  • FIG. 8 shows a perspective view of a sensor module 45 with a partially cutaway sensor fitting 46, which has a central passage 47.
  • a seal 48 is inserted, which holds the guided through the feedthrough 47 sensor chip 28.
  • the sensor chip 28 may, for example, be cast in the seal 48.
  • the seal 48 only partially covers lateral edge surfaces 49 and 50.
  • a front edge surface 51 and a rear edge surface 52 remain untouched. In this respect, it is possible to contact the sensor chip 28 even after the sensor module 45 has been completed.
  • FIG. 9 shows a further sensor module 53, in which a sensor fitting 54 has a sensor space 55 corresponding to the sensor space 41 of the sensor fitting 37 from FIG. 7, with a sensor opening 56 provided for the entry of the medium to be detected.
  • the leadthrough 47 leads to the sensor chamber 55.
  • the sensor chip 28 is held by the seal 48.
  • the seal 48 preferably tapers from the pressure side to the port side, whereby the seal 48 is self-sealing.
  • the Seal 48 for example, conical, with the base of the seal is aligned to the pressure side.
  • Plastic preferably has a comparable coefficient of thermal expansion, as the sensor chip 2 or 28 and the conductor grid 4 or the bonding wires 5.
  • plastic sheaths 9 and 10 and the seal 48 epoxy-based plastics used because the parameters such as glass transition temperature T G , modulus of elasticity and thermal expansion coefficients can be varied by the composition or adjusted via the potting parameters.
  • T G glass transition temperature
  • modulus of elasticity and thermal expansion coefficients can be varied by the composition or adjusted via the potting parameters.
  • the shrinkage of the plastic sheaths 9 and 11 produced on the basis of epoxy and the seal 48 does not lead to a mechanical load on the sensor surface 3, which could falsify the measuring signal.
  • the region of the sensor chips 2 or 28 which is freed from the plastic sheaths 9 and 11 can be surface-passivated by an additional coating.
  • the coating may comprise on the basis of oxides, nitrides or carbides or else on the basis of polyimide or other polymers, for example polymers deposited from the gaseous phase, in particular so-called parylenes. Precious metals can also be used for coating and surface passivation of the sensor chip 2.
  • the surface passivation can also be done using silicone.
  • a combination of different protective layers can also be used.
  • the protective layer may extend only to the sensor chip 2 or 28 or else to the plastic sleeve 11 or the seal 48.
  • the coating may in particular also extend to the edges of the sensor chip 2.
  • the sensor chips 2 and 28 may be sensor chips in which the evaluation circuit is integrated. In addition, however, sensor chips can also be used which have only one sensor surface 3 and no evaluation circuit.
  • thermodynamic or fluid mechanical variables of a medium to be detected areas may be formed.
  • a medium to be detected area may be formed.
  • Pressure sensor additionally a temperature sensor in the sensor chip 2 or 28 be integrated.
  • the sensitive to thermodynamic or fluid mechanical parameters sensor elements can be arranged on the same side or on opposite sides of the sensor chip 2 or 28.
  • conductor carrier for example, rigid or flexible printed circuit boards or foils can be used.
  • recesses can additionally be provided in the plastic sleeve 11, which serve, for example, for the final calibration or trimming of the sensor modules described here. After completion of the final calibration or trimming, these recesses can be sealed with a potting compound.
  • the sensor fittings 37, 46 and 54 are preferably made of a metallic material, but may also be made of a plastic.
  • the plastic envelope extends only on one side of the conductor grid 4, but preferably on that side of the conductor grid 4, on which the contacts between the sensor chip 2 and the conductor grid 4 are located.
  • the sensor chip 2 provided with contact points on the upper side, so-called ball grid array sensor chips or so-called flip chips can also be used.
  • the bonding wires 5 and the plastic sleeve 9 can be dispensed with.
  • FIG. 10 shows the structure of a sensor module 1 known from FIG. 1, which has a sensor chip 3 with a sensor chip 3.
  • the sensor chip 2 is, for example, a pressure sensor whose pressure-sensitive membrane serves as the sensor surface 3.
  • the sensor chip 2 can be made, for example, from a silicon substrate with micromechanical methods.
  • the surface of the sensor chip 2 must be protected against environmental influences in the rule. This can be done in particular by a passivation layer with a layer cover of a few micrometers to a few hundred micrometers, preferably below one millimeter.
  • a passivation layer with a layer cover of a few micrometers to a few hundred micrometers, preferably below one millimeter.
  • the passivation layer in particular materials based on oxides, nitrides, carbides or polymers such as silicones, parylenes and polyimides, or precious metals in question.
  • the passivation layer can be produced, for example, by dip coating, dispensing, spraying, sp
  • FIG. 1 Another form of passivation of the surface of the sensor chip 2 is shown in FIG.
  • a receiving element 57 is formed, which is connected to the plastic sleeve 11.
  • the receiving element 57 can for
  • Example be glued to the plastic sleeve 11 or be injected into the plastic sleeve 11 with.
  • the receiving element 57 is used, as shown in FIG. 10, to receive a passivation substance 58.
  • This passivation Substance 58 may be, for example, a gel, an oil, a fat, a resin or silicone.
  • Such passivating substances 58 can be introduced into the receiving element 57, wherein they completely enclose the sensor chip 2 and thus protect it from environmental influences.
  • the passivation of the sensor chip 2 according to FIG. 10 has the advantage that the proven passivating substances 58 can be used, whereby no damage to the bonding wires 5 can be caused by the passivating substance 58, since the passivating substance 58 is only a part surrounds the sensor chip 2 and the bonded part of the sensor chip is enclosed by the plastic sheath 9, 11.
  • the gases which are dissolved in the passivation substance 58 and which emanate from the passivation substance 58 during pressure changes would damage the bonding wires 5 over time. This is prevented by the passivation shown in FIG. 10 with, for example, GeI passivations.

Abstract

L'invention concerne un module détecteur (1) présentant une puce de détecteur (2) placée sur un réseau de conducteurs (4). Une gaine en matière plastique (11) du module détecteur (1) s'étend uniquement sur une zone du bord de la puce de détecteur (2), ce qui permet de limiter la sollicitation mécanique de la puce de détecteur (2) par la gaine en matière plastique (11).
EP08853353A 2007-11-29 2008-11-25 Module détecteur et son procédé de production Withdrawn EP2217887A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007057904A DE102007057904A1 (de) 2007-11-29 2007-11-29 Sensormodul und Verfahren zur Herstellung des Sensormoduls
PCT/EP2008/066100 WO2009068508A1 (fr) 2007-11-29 2008-11-25 Module détecteur et son procédé de production

Publications (1)

Publication Number Publication Date
EP2217887A1 true EP2217887A1 (fr) 2010-08-18

Family

ID=40451404

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08853353A Withdrawn EP2217887A1 (fr) 2007-11-29 2008-11-25 Module détecteur et son procédé de production

Country Status (3)

Country Link
EP (1) EP2217887A1 (fr)
DE (1) DE102007057904A1 (fr)
WO (1) WO2009068508A1 (fr)

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EP2224218B1 (fr) * 2009-02-25 2018-11-28 Sensirion Automotive Solutions AG Capteur dans un emballage moulé et son procédé de fabrication

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DE102011079905A1 (de) * 2011-02-11 2012-08-16 Zim Plant Technology Gmbh Temperatur-unabhängige Turgordruck- Messeinrichtung, Verfahren zur Herstellung der Messeinrichtung und Verfahren zur Temperaturkompensation der Messeinrichtung
DE102016208783A1 (de) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
DE102016209840A1 (de) * 2016-06-03 2017-12-07 Continental Teves Ag & Co. Ohg Sensor, Verfahren und Sensoranordnung

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DE4334123C2 (de) * 1993-10-07 2002-12-19 Bosch Gmbh Robert Drucksensor
JP3545637B2 (ja) * 1999-03-24 2004-07-21 三菱電機株式会社 感熱式流量センサ
EP1236037B1 (fr) * 1999-11-30 2007-10-10 Sensirion AG Capteur place dans un boitier
JP2004198240A (ja) 2002-12-18 2004-07-15 Denso Corp センサ装置
DE10304775B3 (de) * 2003-02-05 2004-10-07 Infineon Technologies Ag Messgerät für einen Biosensor in Chipkartenform und Messverfahren
DE102005002814B3 (de) * 2005-01-20 2006-10-12 Siemens Ag Halbleitersensorbauteil mit geschützten Zuleitungen und Verfahren zur Herstellung desselben
EP1717562A1 (fr) * 2005-04-29 2006-11-02 Sensirion AG Procédé d'encapsulation de circuits intégrés
DE102005037948A1 (de) * 2005-08-11 2007-02-15 Robert Bosch Gmbh Sensoranordnung mit einem Sensorbauelement und einem Träger und Verfahren zur Herstellung einer Sensoranordnung
DE102005038443A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
US7375406B2 (en) 2005-12-20 2008-05-20 Honeywell International Inc. Thermoplastic overmolding for small package turbocharger speed sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224218B1 (fr) * 2009-02-25 2018-11-28 Sensirion Automotive Solutions AG Capteur dans un emballage moulé et son procédé de fabrication

Also Published As

Publication number Publication date
DE102007057904A1 (de) 2009-06-04
WO2009068508A1 (fr) 2009-06-04

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