EP2209586A1 - Method for the laser ablation of brittle components - Google Patents

Method for the laser ablation of brittle components

Info

Publication number
EP2209586A1
EP2209586A1 EP08848569A EP08848569A EP2209586A1 EP 2209586 A1 EP2209586 A1 EP 2209586A1 EP 08848569 A EP08848569 A EP 08848569A EP 08848569 A EP08848569 A EP 08848569A EP 2209586 A1 EP2209586 A1 EP 2209586A1
Authority
EP
European Patent Office
Prior art keywords
component
laser scribe
laser
line
crossing point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08848569A
Other languages
German (de)
French (fr)
Inventor
Claus Peter Kluge
Michael Hemerle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP2209586A1 publication Critical patent/EP2209586A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Definitions

  • the invention relates to a method for laser scribing of brittle components in preparation for its subsequent separation according to the preamble of claim 1 and a component which has been processed by this method.
  • Such a method is used to replace mechanical cutting methods and has established itself as laser drilling in the scratching technique.
  • Blind holes are lined up in a line and serve as predetermined breaking edges in brittle materials such as metal casting or ceramics. This method is also used for separating ceramic plates.
  • Undefined crossing points can change the break at the intersections in any direction, resulting in the failure of the parts.
  • the invention has for its object to provide a method for laser scribing, which ensures that when separating the break always runs along the laser scribe line, deviations deviating from the laser scribe line are avoided and the corners of the items are evenly shaped after breaking.
  • This object is achieved according to the invention by introducing into the crossing point at least one selectively controlled and not accidentally generated crossing point injection, which weakens the component at the point of intersection. This ensures that the break always runs along the laser scribe line. Deviations from the laser scribe line are avoided and the corners of the individual parts are evenly shaped after breaking.
  • At least one further time targeted control is injected into the crossing point. This specifically weakens the crossing point.
  • Shots are controlled in the crossing point so that their depth is equal to or greater than the depth of the shots surrounding the crossing point on the laser scribe lines.
  • a greater depth means a greater weakening of the component at the crossing point.
  • Area of the crossing point in this case form a T-shape and not an x-shape. But this is also understood as a crossing point.
  • laser scribe lines are placed on two opposite surfaces of the component so that they are located on two intersecting planes and the intersection point bullet points are on the intersection line of the planes. This greatly facilitates breaking along the laser scribe lines.
  • At least one further deliberately controlled and not accidentally occurring shot is preferably also introduced in shots which do not lie at any crossing point. As a result, the entire laser scribe line is weakened.
  • the shots and thus the laser scribe lines are preferably introduced so that after the breaking of the laser-scritted component along the laser scribe lines at least 3 individual parts.
  • the laser scribe lines do not have to be straight, but can also run in curved lines.
  • all crossing points are weakened by at least two selectively controlled crossing point injections. This ensures that all intersections are really weakened.
  • a component produced by the method just described preferably consists of ceramics, such as aluminum oxides, zirconium oxides, aluminum nitrides, silicon nitrides or glass. It is also possible to use combinations of these materials.
  • the component holes or notches are introduced in one embodiment.
  • the slitting can be done simultaneously with the introduction of these holes or notches.
  • the components are plate-shaped and consist of a ceramic with a thickness less than or equal to 1, 7 mm. This thickness is particularly suitable for the method according to the invention described.
  • the components preferably have at least two plane-parallel surfaces. This simplifies the production. However, the components can also be formed in three dimensions.
  • intersecting laser scribe lines are at an angle of 90 ° +/- 1 °, i. arranged at right angles to each other. As a result, rectangular components are produced after breaking.
  • the components are preferably ceramic plates which are used as substrates for electronic or electrical components.
  • FIG. 6 shows the laser scribing according to the prior art with reference to three embodiments.
  • a component 8 On a component 8, sack-like shots 1 of a laser beam are introduced in preparation for its subsequent separation. These bullets 1 are lined up in a line and form a laser scribe line 2, which serves as a break initiation line during later breakage of the component into individual smaller components.
  • a laser scribe line 2 is understood here and in the entire description of this invention to be an imaginary line which leads through the center of all the shots 1.
  • On the component 8 at least two laser scribe lines 2 crossing each other in a crossing point 3 are introduced.
  • the bullets 1 in the region 13 of the crossing points 3 are arranged at random. They can be arranged next to one another in the region 13 (FIG. 6b), overlapping (FIG. 6a) or touching one another (FIG. 6c).
  • the break initiation line is not sharply defined at the intersection. As a result, the break at the crossing points can be changed in any direction, resulting in failure
  • FIG. 1 shows the invention schematically on the basis of two laser scribe lines 2 on a component 8, which lead through the center of all the injections 1.
  • a purposefully controlled and not accidentally generated intersection point margin 4 is introduced, which weakens the component 8 at the intersection point 3 in a targeted manner. Even if one or more shots have been introduced by chance into the region 13 (see FIG. 6) around the point of intersection, at least one intersection point shot 4 that is controlled in a controlled manner and does not occur by chance is always generated
  • intersection point margin 4 is meant a shot into the intersection point 3 of the laser scribe lines 2.
  • FIG. 2 shows a component 8 with a surface 9a into which shots 1 were introduced with a laser beam which form two laser scribe lines 2.
  • a crossing point shot 4 has been introduced.
  • the depth of the shots 1 is indicated by the reference numeral 14a
  • the depth of the crossing point shank 4 is designated by the reference numeral 14b.
  • the depth 14b of the intersection point bullet 4 is greater than the depth 14a of the bullets 1.
  • the crossing point 3 is purposefully more weakened than the surrounding ones
  • FIG. 1 also illustrates an angular bore 7 in the component 8, i. the component 8 can be formed arbitrarily, depending on the application.
  • FIG. 3 shows a component 8 with two laser scribe lines 2, one of which ends at the intersection point 3 of the other laser scribe line. This intersection point 3 is weakened with a crossing point shot 4.
  • the laser scribe lines 2 in the region of the crossing point 3 in this case form a T-shape and not an x-shape. But this is also understood as a crossing point.
  • FIG. 4 shows a component 8 with two surfaces 9a, 9b on which shots 1 intersect laser scribe lines 2.
  • the laser scribe lines 2 are arranged so that they are located on two intersecting planes 10a, 10b, wherein a first plane 10a is formed by the laser scribe lines 2a, 2b and the second plane 10b is formed by the laser scribe lines 2c, 2d.
  • a first plane 10a is formed by the laser scribe lines 2a, 2b
  • the second plane 10b is formed by the laser scribe lines 2c, 2d.
  • FIG. 5 shows a plate-shaped component 8 with a thickness S of 1.7 mm and with a surface 9a on the laser scribe lines 2.
  • Each two intersecting laser scribe lines 2 form an angle ⁇ of 90 ° + - 1 ° to each other.
  • the crossing points 3 at least one specifically controlled and not accidentally generated crossing point shot 4 is introduced, which is the component
  • Such plate-shaped components 8 weakens specifically at the intersection point 3.
  • Such plate-shaped components 8 are ceramic plates which are used as substrates for electronic or electrical components. Its thickness S is preferably less than or equal to 1.7 mm.
  • the position tolerance of the double shots is maximum +/- 30 ⁇ m. This ensures that the break always runs along the laser scribe line. Fractures deviating from the laser scribe line are avoided. The corners of the items after breaking are evenly shaped.
  • the object of this invention was to perforate a component targeted controlled by laser scribing.
  • the component remains as one piece after laser scribing and can be broken at a later time by applying an external force along the laser scribe lines.
  • the laser system is controlled so that at least one intersecting point of at least two laser lines with any angle of the cutting lines at least one deliberately introduced introduced (not accidentally incurred) bullet on a surface of the part.

Abstract

The invention relates to a method for the laser ablation of brittle components (8) in preparation for the subsequent separation of the same, by the introduction of sack-like indentations (1) by a laser beam, wherein the indentations (1) are arranged in a line one after the other, and form a laser ablation line (2) which serves as the fracture initiation line, wherein the term laser ablation line means a line formed by connecting the middle points of all the indentations (1). At least two laser ablation lines (2) are introduced onto the component (8) surface and cross each other at a cross point (3). In order to ensure that the fracture always runs along the laser ablation line during the separation process, that fractures deviating from the laser ablation line are avoided, and that the corners of the separated pieces following fracturing are evenly shaped, it is suggested according to the invention that at least one cross point indentation (4) is introduced at the cross point (3) in a targeted, controlled, and intentional manner, which specifically weakens the component (8) at the cross point (3).

Description

Verfahren zum Laserritzen von spröden Bauteilen Process for laser scribing of brittle components
Die Erfindung betrifft ein Verfahren zum Laserritzen von spröden Bauteilen zur Vorbereitung für dessen spätere Vereinzelung nach dem Oberbegriff des Anspruchs 1 und ein Bauteil, welches mit diesem Verfahren bearbeitet wurde.The invention relates to a method for laser scribing of brittle components in preparation for its subsequent separation according to the preamble of claim 1 and a component which has been processed by this method.
Ein derartiges Verfahren wird verwendet um mechanische Schneidverfahren zu ersetzen und hat sich als Laserbohren auch in der Ritztechnik etabliert. Dabei werden Sacklöcher linienförmig aneinander gereiht und dienen bei spröden Ma- terialien wie Metallguss oder Keramiken als Sollbruchkanten. Dieses Verfahren wird auch zum Vereinzeln von Keramikplatten verwendet.Such a method is used to replace mechanical cutting methods and has established itself as laser drilling in the scratching technique. Blind holes are lined up in a line and serve as predetermined breaking edges in brittle materials such as metal casting or ceramics. This method is also used for separating ceramic plates.
Standardmäßig werden beim Laserritzen Einschüsse in definierten Abstand in das Material eingebracht. Hierbei entstehen an den Kreuzungspunkten der x- und y-Linien beliebige Überlappungen der Einschüsse. Entlang der entstehen- den Ritzlinien kann das Teil anschließend gebrochen werden. Bedingt durch dieBy default, when laser scribing, shots are introduced into the material at a defined distance. In this case, any overlaps of the injections occur at the crossing points of the x and y lines. The part can then be broken along the resulting scribe lines. Due to the
Undefinierten Kreuzungspunkte kann der Bruch an den Kreuzungen in jede beliebige Richtung verändert werden, was zum Ausfall der Teile führt.Undefined crossing points can change the break at the intersections in any direction, resulting in the failure of the parts.
Als Laserritzlinie oder Laserspur wird nachfolgend eine gedachte Linie verstanden, welche durch den Mittelpunkt aller Einschüsse führt.As a laser scribe line or laser track is hereinafter understood an imaginary line, which leads through the center of all bulletins.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Laserritzen anzugeben, mit dem sichergestellt ist, dass beim Vereinzeln der Bruch immer entlang der Laserritzlinie verläuft, Brüche abweichend von der Laserritzlinie vermieden werden und die Ecken der Einzelteile nach dem Brechen gleichmäßig geformt sind. Diese Aufgabe wird erfindungsgemäß dadurch gelöst, dass in den Kreuzungspunkt mindestens ein gezielt gesteuerter und nicht zufällig entstehender Kreu- zungspunkt-Einschuss eingebracht wird, der das Bauteil gezielt am Kreuzungspunkt schwächt. Hierdurch ist sichergestellt, dass der Bruch immer entlang der Laserritzlinie verläuft. Brüche abweichend von der Laserritzlinie werden vermieden und die Ecken der Einzelteile sind nach dem Brechen gleichmäßig geformt.The invention has for its object to provide a method for laser scribing, which ensures that when separating the break always runs along the laser scribe line, deviations deviating from the laser scribe line are avoided and the corners of the items are evenly shaped after breaking. This object is achieved according to the invention by introducing into the crossing point at least one selectively controlled and not accidentally generated crossing point injection, which weakens the component at the point of intersection. This ensures that the break always runs along the laser scribe line. Deviations from the laser scribe line are avoided and the corners of the individual parts are evenly shaped after breaking.
In einer bevorzugten Ausführungsform wird in den Kreuzungspunkt mindestens ein weiteres Mal gezielt gesteuert eingeschossen. Dies schwächt gezielt den Kreuzungspunkt.In a preferred embodiment, at least one further time targeted control is injected into the crossing point. This specifically weakens the crossing point.
In erfinderischer Ausgestaltung werden der oder die Kreuzungspunkt-In an inventive embodiment, the one or more crossing points
Einschüsse in den Kreuzungspunkt so gesteuert, dass deren Tiefe gleich oder größer ist als die Tiefe der den Kreuzungspunkt umgebenden Einschüsse auf den Laserritzlinien. Eine größere Tiefe bedeutet eine größere Schwächung des Bauteils am Kreuzungspunkt.Shots are controlled in the crossing point so that their depth is equal to or greater than the depth of the shots surrounding the crossing point on the laser scribe lines. A greater depth means a greater weakening of the component at the crossing point.
Es kann auch eine Laserritzlinie im Kreuzungspunkt enden. Die Laserritzlinien imIt can also end a laser scribe line at the intersection. The laser scribe lines in the
Bereich des Kreuzungspunktes bilden in diesem Fall eine T-Form und keine x- Form. Dies wird aber auch als Kreuzungspunkt verstanden.Area of the crossing point in this case form a T-shape and not an x-shape. But this is also understood as a crossing point.
In einer erfinderischen Ausgestaltung werden auf zwei sich gegenüberliegenden Oberflächen des Bauteils Laserritzlinien so eingebracht, dass sie sich auf zwei sich kreuzenden Ebenen befinden und sich die Kreuzungspunkt-Einschüsse auf der Schnittlinie der Ebenen befinden. Dies erleichtert das Brechen entlang der Laserritzlinien enorm.In an inventive embodiment, laser scribe lines are placed on two opposite surfaces of the component so that they are located on two intersecting planes and the intersection point bullet points are on the intersection line of the planes. This greatly facilitates breaking along the laser scribe lines.
Bevorzugt wird auch in Einschüsse, die auf keinem Kreuzungspunkt liegen, mindestens ein weiterer gezielt gesteuerter und nicht zufällig entstehender Ein- schuss eingebracht. Hierdurch wird die gesamte Laserritzlinie geschwächt.At least one further deliberately controlled and not accidentally occurring shot is preferably also introduced in shots which do not lie at any crossing point. As a result, the entire laser scribe line is weakened.
K \ausland\OZ07087 doc Die Einschüsse und damit die Laserritzlinien werden bevorzugt so eingebracht, dass nach dem Brechen des lasergeritzten Bauteils entlang den Laserritzlinien mindestens 3 Einzelteile entstehen. Die Laserritzlinien müssen nicht geradlinig, sondern können auch in gekrümmten Linien verlaufen.K \ ausland \ OZ07087 doc The shots and thus the laser scribe lines are preferably introduced so that after the breaking of the laser-scritted component along the laser scribe lines at least 3 individual parts. The laser scribe lines do not have to be straight, but can also run in curved lines.
In Weiterbildung der Erfindung werden alle Kreuzungspunkte durch mindestens zwei gezielt gesteuerte Kreuzungspunkt-Einschüsse geschwächt. Hierdurch ist sichergestellt, dass auch wirklich alle Kreuzungspunkte geschwächt sind.In a further development of the invention, all crossing points are weakened by at least two selectively controlled crossing point injections. This ensures that all intersections are really weakened.
Ein Bauteil hergestellt mit dem eben beschriebenen Verfahren besteht bevorzugt aus Keramiken, wie Aluminiumoxide, Zirkonoxide, Aluminiumnitride, Siliziumnitri- de oder aus Glas. Es können auch Kombinationen dieser Werkstoffe eingesetzt werden.A component produced by the method just described preferably consists of ceramics, such as aluminum oxides, zirconium oxides, aluminum nitrides, silicon nitrides or glass. It is also possible to use combinations of these materials.
In dem Bauteil sind in einer Ausführungsform Bohrungen oder Kerben eingebracht. Das Lasserritzen kann zugleich mit dem Einbringen dieser Bohrungen oder Kerben erfolgen.In the component holes or notches are introduced in one embodiment. The slitting can be done simultaneously with the introduction of these holes or notches.
In einer bevorzugten Ausführungsform sind die Bauteile plattenförmig ausgebildet und bestehen aus einer Keramik mit einer Dicke kleiner oder gleich 1 ,7 mm. Diese Dicke eignet sich vorzüglich für das beschriebene erfindungsgemäße Verfahren.In a preferred embodiment, the components are plate-shaped and consist of a ceramic with a thickness less than or equal to 1, 7 mm. This thickness is particularly suitable for the method according to the invention described.
Bevorzugt weisen die Bauteile mindestens zwei planparallele Oberflächen auf. Dies vereinfacht die Herstellung. Die Bauteile können jedoch auch dreidimensional ausgebildet sein.The components preferably have at least two plane-parallel surfaces. This simplifies the production. However, the components can also be formed in three dimensions.
In bevorzugter erfinderischen Ausgestaltung sind sich kreuzende Laserritzlinien in einem Winkel von 90° +/- 1 °, d.h. rechtwinklig zueinander angeordnet. Hierdurch werden nach dem Brechen rechteckige Bauteile erzeugt.In a preferred inventive embodiment, intersecting laser scribe lines are at an angle of 90 ° +/- 1 °, i. arranged at right angles to each other. As a result, rectangular components are produced after breaking.
K \ausland\OZ07087 doc - A -K \ ausland \ OZ07087 doc - A -
Bevorzugt sind die Bauteile Keramikplatten die als Substrate für elektronische oder elektrische Bauteile verwendet werden.The components are preferably ceramic plates which are used as substrates for electronic or electrical components.
Nachfolgend wird die Erfindung anhand von Figuren näher erläutert.The invention will be explained in more detail with reference to figures.
Figur 6 zeigt das Laserritzen nach dem Stand der Technik anhand von drei Aus- führungsformen. Auf einem Bauteil 8 werden zur Vorbereitung für dessen spätere Vereinzelung sackartige Einschüsse 1 eines Laserstrahls eingebracht. Diese Einschüsse 1 werden linienförmig aneinander gereiht und bilden eine Laserritzlinie 2, die beim späteren Brechen des Bauteils in einzelne kleinere Bauteile als Bruchinitiierungslinie dient. Unter einer Laserritzlinie 2 wird hier und in der ge- samten Beschreibung zu dieser Erfindung eine gedachte Linie verstanden, welche durch den Mittelpunkt aller Einschüsse 1 führt. Auf dem Bauteil 8 sind zumindest zwei einander in einem Kreuzungspunkt 3 kreuzende Laserritzlinien 2 eingebracht. Die Einschüsse 1 im Bereich 13 der Kreuzungspunkte 3 sind zufällig angeordnet. Sie können im Bereich 13 nebeneinander angeordnet sein (Figur 6b), überlappend (Figur 6a) oder einander berühren (Figur 6c). Die Bruchinitiierungslinie ist am Kreuzungspunkt nicht scharf definiert. Als Folge hiervon kann der Bruch an den Kreuzungspunkten in jede beliebige Richtung verändert werden, was zum Ausfall der Teile führt.FIG. 6 shows the laser scribing according to the prior art with reference to three embodiments. On a component 8, sack-like shots 1 of a laser beam are introduced in preparation for its subsequent separation. These bullets 1 are lined up in a line and form a laser scribe line 2, which serves as a break initiation line during later breakage of the component into individual smaller components. A laser scribe line 2 is understood here and in the entire description of this invention to be an imaginary line which leads through the center of all the shots 1. On the component 8 at least two laser scribe lines 2 crossing each other in a crossing point 3 are introduced. The bullets 1 in the region 13 of the crossing points 3 are arranged at random. They can be arranged next to one another in the region 13 (FIG. 6b), overlapping (FIG. 6a) or touching one another (FIG. 6c). The break initiation line is not sharply defined at the intersection. As a result, the break at the crossing points can be changed in any direction, resulting in failure of the parts.
Figur 1 zeigt die Erfindung schematisch anhand von zwei Laserritzlinien 2 auf einem Bauteil 8, welche durch den Mittelpunkt aller Einschüsse 1 führen. Auf dem Kreuzungspunkt 3 der beiden Laserritzlinien 2 ist ein gezielt gesteuerter und nicht zufällig entstehender Kreuzungspunkt-Einschuss 4 eingebracht, der das Bauteil 8 gezielt am Kreuzungspunkt 3 schwächt. Auch wenn durch Zufall ein oder auch mehrere Einschüsse in den Bereich 13 (siehe Figur 6) um den Kreuzungspunkt herum eingebracht wurden, so wird immer mindestens ein gezielt gesteuerter und nicht zufällig entstehender Kreuzungspunkt-Einschuss 4FIG. 1 shows the invention schematically on the basis of two laser scribe lines 2 on a component 8, which lead through the center of all the injections 1. At the point of intersection 3 of the two laser scribe lines 2, a purposefully controlled and not accidentally generated intersection point margin 4 is introduced, which weakens the component 8 at the intersection point 3 in a targeted manner. Even if one or more shots have been introduced by chance into the region 13 (see FIG. 6) around the point of intersection, at least one intersection point shot 4 that is controlled in a controlled manner and does not occur by chance is always generated
K \ausland\OZ07087 doc eingebracht. Unter Kreuzungspunkt-Einschuss 4 wird ein Einschuss in den Kreuzungspunkt 3 der Laserritzlinien 2 verstanden.K \ ausland \ OZ07087 doc brought in. By intersection point margin 4 is meant a shot into the intersection point 3 of the laser scribe lines 2.
Figur 2 zeigt ein Bauteil 8 mit einer Oberfläche 9a in die Einschüsse 1 mit einem Laserstrahl eingebracht wurden, die zwei Laserritzlinien 2 bilden. In den Kreu- zungspunkt 3 dieser Laserritzlinien 2 ist ein Kreuzungspunkt-Einschuss 4 eingebracht worden. Die Tiefe der Einschüsse 1 ist mit dem Bezugszeichen 14a gekennzeichnet und die Tiefe des Kreuzungspunkt-Einschusses 4 ist mit dem Bezugszeichen 14b bezeichnet. Die Tiefe 14b des Kreuzungspunkt-Einschusses 4 ist, wie in der Figur 2 gezeigt, größer als die Tiefe 14a der Einschüsse 1 . Hier- durch ist der Kreuzungspunkt 3 gezielt stärker geschwächt als die umgebendenFIG. 2 shows a component 8 with a surface 9a into which shots 1 were introduced with a laser beam which form two laser scribe lines 2. At the intersection point 3 of these laser scribe lines 2, a crossing point shot 4 has been introduced. The depth of the shots 1 is indicated by the reference numeral 14a, and the depth of the crossing point shank 4 is designated by the reference numeral 14b. As shown in FIG. 2, the depth 14b of the intersection point bullet 4 is greater than the depth 14a of the bullets 1. As a result, the crossing point 3 is purposefully more weakened than the surrounding ones
Einschüsse 1 . Figur 2 verdeutlicht auch eine eckige Bohrung 7 im Bauteil 8, d.h. das Bauteil 8 kann beliebig, je nach Anwendungsfall, ausgebildet sein.Bulletins 1. Figure 2 also illustrates an angular bore 7 in the component 8, i. the component 8 can be formed arbitrarily, depending on the application.
Figur 3 zeigt ein Bauteil 8 mit zwei Laserritzlinien 2, von denen eine im Kreuzungspunkt 3 der anderen Laserritzlinie endet. Auch dieser Kreuzungspunkt 3 ist mit einem Kreuzungspunkt-Einschuss 4 geschwächt. Die Laserritzlinien 2 im Bereich des Kreuzungspunktes 3 bilden in diesem Fall eine T-Form und keine x- Form. Dies wird aber auch als Kreuzungspunkt verstanden. Nach dem Brechen des Bauteils 8 entlang der Laserritzlinien 2 entstehen in diesem Fall drei Bauteile mit 1 1 a, 1 1 b, 1 1 c bezeichnet.FIG. 3 shows a component 8 with two laser scribe lines 2, one of which ends at the intersection point 3 of the other laser scribe line. This intersection point 3 is weakened with a crossing point shot 4. The laser scribe lines 2 in the region of the crossing point 3 in this case form a T-shape and not an x-shape. But this is also understood as a crossing point. After breaking the component 8 along the laser scribe lines 2 arise in this case, three components with 1 1 a, 1 1 b, 1 1 c referred to.
Figur 4 zeigt ein Bauteil 8 mit zwei Oberflächen 9a, 9b auf der Einschüsse 1 sich kreuzende Laserritzlinien 2 bilden. Die Laserritzlinien 2 sind dabei so angeordnet, dass sie sich auf zwei sich kreuzenden Ebenen 10a, 10b befinden, wobei eine erste Ebene 10a durch die Laserritzlinien 2a, 2b gebildet ist und die zweite Ebene 10b durch die Laserritzlinien 2c, 2d gebildet ist. Hierbei befinden sich die Laserritzlinien 2a, 2c auf der Oberfläche 9a und die Laserritzlinien 2b, 2d auf derFIG. 4 shows a component 8 with two surfaces 9a, 9b on which shots 1 intersect laser scribe lines 2. The laser scribe lines 2 are arranged so that they are located on two intersecting planes 10a, 10b, wherein a first plane 10a is formed by the laser scribe lines 2a, 2b and the second plane 10b is formed by the laser scribe lines 2c, 2d. Here are the laser scribe lines 2a, 2c on the surface 9a and the laser scribe lines 2b, 2d on the
Oberfläche 9b. Die Kreuzungspunkt-Einschüsse 4 beider Oberflächen 9a, 9b befinden sich auf der Schnittlinie 15 der beiden Ebenen 10a, 10b. Hierdurch istSurface 9b. The crossing point bullet holes 4 of both surfaces 9a, 9b are located on the section line 15 of the two planes 10a, 10b. This is
K \ausland\OZ07087 doc durch zwei Kreuzungspunkt-Einschüsse 4 das Bauteil von „oben" und „unten" an den Kreuzungspunkten 3 geschwächt.K \ ausland \ OZ07087 doc weakened by two crossing point bullet 4, the component of "top" and "bottom" at the crossing points 3.
Figur 5 zeigt ein plattenförmiges Bauteil 8 mit einer Dicke S von 1 ,7 mm und mit einer Oberfläche 9a auf der Laserritzlinien 2 aufgebracht sind. Jeweils zwei sich kreuzende Laserritzlinien 2 bilden zueinander einen Winkel α von 90° +- 1 °. In die Kreuzungspunkte 3 ist auch hier mindestens ein gezielt gesteuerter und nicht zufällig entstehender Kreuzungspunkt-Einschuss 4 eingebracht, der das BauteilFIG. 5 shows a plate-shaped component 8 with a thickness S of 1.7 mm and with a surface 9a on the laser scribe lines 2. Each two intersecting laser scribe lines 2 form an angle α of 90 ° + - 1 ° to each other. In the crossing points 3, at least one specifically controlled and not accidentally generated crossing point shot 4 is introduced, which is the component
8 gezielt am Kreuzungspunkt 3 schwächt. Derartige plattenförmige Bauteile 8 sind Keramikplatten, die als Substrate für elektronische oder elektrische Bauteile verwendet werden. Ihre Dicke S liegt vorzugsweise bei kleiner gleich 1 ,7 mm.8 weakens specifically at the intersection point 3. Such plate-shaped components 8 are ceramic plates which are used as substrates for electronic or electrical components. Its thickness S is preferably less than or equal to 1.7 mm.
Die Lagetoleranz der doppelten Einschüsse beträgt maximal +/- 30 μm. Dadurch ist gewährleistet, dass der Bruch immer entlang der Laserritzlinie verläuft. Brüche abweichend von der Laserritzlinie werden vermieden. Die Ecken der Einzelteile nach dem Brechen sind gleichmäßig geformt.The position tolerance of the double shots is maximum +/- 30 μm. This ensures that the break always runs along the laser scribe line. Fractures deviating from the laser scribe line are avoided. The corners of the items after breaking are evenly shaped.
Aufgabe dieser Erfindung war es ein Bauteil durch Laserritzen gezielt gesteuert zu perforieren. Das Bauteil bleibt nach dem Laserritzen als ein Stück erhalten und kann zu einem späteren Zeitpunkt durch Anlegen einer äußeren Kraft entlang der Laserritzlinien gebrochen werden.The object of this invention was to perforate a component targeted controlled by laser scribing. The component remains as one piece after laser scribing and can be broken at a later time by applying an external force along the laser scribe lines.
Bei diesem Verfahren wird die Laseranlage so gesteuert, dass an mindestens einem Kreuzungspunkt von mindestens zwei Laserlinien mit beliebigem Winkel der Schnittlinien mindestens ein gezielt gesteuert eingebrachter (nicht zufällig entstandener) Einschuss auf einer Oberfläche des Teils entsteht. Im Kreuzungspunkt von zwei Laserritzlinien wird mindestens ein zweites Mal gezielt gesteuert in den gleichen Einschuss, der den Kreuzungspunkt definiert, eingeschossen.In this method, the laser system is controlled so that at least one intersecting point of at least two laser lines with any angle of the cutting lines at least one deliberately introduced introduced (not accidentally incurred) bullet on a surface of the part. At the intersection point of two laser scribe lines, at least a second time is controlled deliberately in the same bullet, which defines the intersection point shot.
K \ausland\OZ07087 doc K \ ausland \ OZ07087 doc

Claims

Ansprüche claims
1 . Verfahren zum Laserritzen von spröden Bauteilen (8) zur Vorbereitung für dessen spätere Vereinzelung durch Einbringen von sackartigen Einschüssen (1 ) eines Laserstrahls, wobei die Einschüsse (1 ) linienförmig aneinander gereiht werden und eine Laserritzlinie (2) bilden, die als1 . Method for laser scribing of brittle components (8) in preparation for their subsequent separation by introducing bag-like shots (1) of a laser beam, wherein the shots (1) are lined up in a line and form a laser scribe line (2) which
Bruchinitiierungslinie dient, wobei unter Laserritzlinie (2) eine gedachte Linie verstanden wird, welche durch den Mittelpunkt aller Einschüsse (1 ) führt, und auf dem Bauteil (8) zumindest zwei einander in einem Kreuzungspunkt (3) kreuzende Laserritzlinien (2) eingebracht werden, dadurch gekennzeichnet, dass in den Kreuzungspunkt (3) mindestens ein gezielt gesteuerter und nicht zufällig entstehender Kreuzungspunkt-Einschuss (4) eingebracht wird, der das Bauteil (8) gezielt am Kreuzungspunkt (3) schwächt.Fracture initiation line is used, wherein the laser scribe line (2) is an imaginary line which passes through the center of all the shots (1), and at least two laser scribe lines (2) intersecting one another at a crossing point (3) are introduced on the component (8), characterized in that in the crossing point (3) at least one selectively controlled and not accidentally resulting crossing point shot (4) is introduced, which selectively weakens the component (8) at the intersection (3).
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass in den Kreu- zungspunkt (3) mindestens ein weiteres Mal gezielt gesteuert eingeschossen wird.2. The method according to claim 1, characterized in that in the cross-point (3) at least one more time targeted controlled is injected.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der oder die Kreuzungspunkt-Einschüsse (4) so gesteuert werden, dass deren Tiefe gleich oder größer ist als die Tiefe der den Kreuzungspunkt (3) umgebenden Einschüsse (1 ) auf den Laserritzlinien (2).3. The method of claim 1 or 2, characterized in that the one or more crossing point Einschüsse (4) are controlled so that their depth is equal to or greater than the depth of the crossing point (3) surrounding Einschüsse (1) on the laser scribe lines (2).
4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass eine Laserritzlinie (2) im Kreuzungspunkt (3) endet.4. The method according to any one of claims 1 to 3, characterized in that a laser scribe line (2) terminates at the crossing point (3).
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass auf zwei sich gegenüberliegenden Oberflächen (9a, 9b) des Bauteils5. The method according to any one of claims 1 to 4, characterized in that on two opposite surfaces (9a, 9b) of the component
K \ausland\OZ07087 doc (8) Laserritzlinien (2) so eingebracht werden, dass sie sich auf zwei sich kreuzenden Ebenen (10a, 10b) befinden und sich die Kreuzungspunkt- Einschüsse (4) auf der Schnittlinie der Ebenen (10a, 10b) befinden.K \ ausland \ OZ07087 doc (8) laser scribe lines (2) are placed so that they are on two intersecting planes (10a, 10b) and the intersection point shots (4) are on the intersection of the planes (10a, 10b).
6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass auch in Einschüsse (1 ), die auf keinem Kreuzungspunkt (3) liegen, mindestens ein weiterer gezielt gesteuerter und nicht zufällig entstehender Einschuss eingebracht wird.6. The method according to any one of claims 1 to 5, characterized in that also in Einschüsse (1), which are not at any crossing point (3), at least one further selectively controlled and not randomly generated bullet is introduced.
7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Einschüsse und damit die Laserritzlinien (2) so eingebracht wer- den, dass nach dem Brechen des lasergeritzten Bauteils (8) entlang den7. The method according to any one of claims 1 to 6, characterized in that the Einschüsse and thus the laser scribe lines (2) are introduced so that after breaking the laser-scribed component (8) along the
Laserritzlinien (2) mindestens 3 Einzelteile (1 1 a, 1 1 b, 1 1 c) entstehen.Laser scribe lines (2) at least 3 individual parts (1 1 a, 1 1 b, 1 1 c) arise.
8. Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass alle Kreuzungspunkte (3) durch mindestens zwei gezielt gesteuerte Kreuzungspunkt-Einschüsse (4) geschwächt werden.8. The method according to any one of claims 1 to 7, characterized in that all crossing points (3) are weakened by at least two selectively controlled crossing point Einschüsse (4).
9. Bauteil hergestellt mit dem Verfahren nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass das Bauteil (8) aus Keramiken, wie Aluminiumoxide, Zirkonoxide, Aluminiumnitride, Siliziumnitride oder aus Glas besteht.9. Component produced by the method according to one of claims 1 to 8, characterized in that the component (8) consists of ceramics, such as aluminum oxides, zirconium oxides, aluminum nitrides, silicon nitrides or glass.
10. Bauteil nach Anspruch 9, dadurch gekennzeichnet, dass in dem Bauteil (8) auch Bohrungen (7) oder Kerben eingebracht sind.10. The component according to claim 9, characterized in that in the component (8) and holes (7) or notches are introduced.
1 1 . Bauteil nach Anspruch 9 oder 10, dadurch gekennzeichnet, dass die Bauteile (8) plattenförmig ausgebildet sind und aus einer Keramik mit einer Dicke kleiner oder gleich 1 ,7 mm bestehen.1 1. Component according to claim 9 or 10, characterized in that the components (8) are plate-shaped and made of a ceramic having a thickness less than or equal to 1, 7 mm.
K \ausland\OZ07087 doc K \ ausland \ OZ07087 doc
12. Bauteil nach einem der Ansprüche 9 bis 11 , dadurch gekennzeichnet, dass die Bauteile (8) mindestens zwei planparallele Oberflächen (9a, 9b) aufweisen.12. Component according to one of claims 9 to 11, characterized in that the components (8) have at least two plane-parallel surfaces (9a, 9b).
13. Bauteil nach einem der Ansprüche 9 bis 12, dadurch gekennzeichnet, dass sich kreuzende geradlinige Laserritzlinien (2) in einem Winkel von 90° +/- 1 °, d.h. rechtwinklig zueinander angeordnet sind.13. Component according to one of claims 9 to 12, characterized in that intersecting rectilinear laser scribe lines (2) at an angle of 90 ° +/- 1 °, i. are arranged at right angles to each other.
14. Bauteil nach einem der Ansprüche 9 bis 13, dadurch gekennzeichnet, dass die Bauteile (8) Keramikplatten sind, die als Substrate für elektronische oder elektrische Bauteile verwendet werden.14. Component according to one of claims 9 to 13, characterized in that the components (8) are ceramic plates, which are used as substrates for electronic or electrical components.
K \ausland\OZ07087 doc K \ ausland \ OZ07087 doc
EP08848569A 2007-11-07 2008-11-07 Method for the laser ablation of brittle components Withdrawn EP2209586A1 (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201039958A (en) 2009-03-31 2010-11-16 Ceramtec Ag Component having an overlapping laser track
CN103282317B (en) * 2011-12-22 2015-12-16 三星钻石工业股份有限公司 The cut-off method of brittle substrate
DE102012212131A1 (en) * 2012-07-11 2014-06-26 Semikron Elektronik Gmbh & Co. Kg Substrate and method for fracture preparation of a substrate for at least one power semiconductor device
JP6218646B2 (en) * 2014-03-06 2017-10-25 株式会社ディスコ Laser processing method
CN103862179A (en) * 2014-03-12 2014-06-18 北京工业大学 Laser machining method for fine scribing structure at ceramic surface
GB201505042D0 (en) * 2015-03-25 2015-05-06 Nat Univ Ireland Methods and apparatus for cutting a substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687085A (en) * 1992-09-10 1994-03-29 Taiyo Yuden Co Ltd Dividing method for ceramic substrate
JPH07273069A (en) * 1994-03-31 1995-10-20 Nichia Chem Ind Ltd Manufacture of gallium nitride compound semiconductor chip
WO2005091389A1 (en) * 2004-03-19 2005-09-29 Showa Denko K.K. Compound semiconductor light-emitting device and production method thereof

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124485A (en) * 1983-12-09 1985-07-03 Ngk Spark Plug Co Ltd Laser working method of ceramic substrate and substrate thereof
US5578229A (en) * 1994-10-18 1996-11-26 Michigan State University Method and apparatus for cutting boards using opposing convergent laser beams
JPH0929472A (en) * 1995-07-14 1997-02-04 Hitachi Ltd Method and device for splitting and chip material
WO1997029509A1 (en) * 1996-02-09 1997-08-14 Philips Electronics N.V. Laser separation of semiconductor elements formed in a wafer of semiconductor material
JP3498895B2 (en) * 1997-09-25 2004-02-23 シャープ株式会社 Substrate cutting method and display panel manufacturing method
DE19827414C2 (en) * 1998-06-19 2000-05-31 Schulz Harder Juergen Method of manufacturing a metal-ceramic substrate
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
TW419867B (en) * 1998-08-26 2001-01-21 Samsung Electronics Co Ltd Laser cutting apparatus and method
US6676878B2 (en) * 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
JP2002172479A (en) * 2000-09-20 2002-06-18 Seiko Epson Corp Laser parting method, laser parting device, manufacturing method for liquid crystal device, and manufacturing device for liquid crystal
AU2002219183A1 (en) * 2000-12-15 2002-06-24 Lzh Laserzentrum Hannover E.V. Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone
US6777645B2 (en) * 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
EP2272618B1 (en) * 2002-03-12 2015-10-07 Hamamatsu Photonics K.K. Method of cutting object to be processed
US6744009B1 (en) * 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
EP1518634A1 (en) * 2003-09-23 2005-03-30 Advanced Laser Separation International (ALSI) B.V. A method of and a device for separating semiconductor elements formed in a wafer of semiconductor material
US7129114B2 (en) * 2004-03-10 2006-10-31 Micron Technology, Inc. Methods relating to singulating semiconductor wafers and wafer scale assemblies
JP4694795B2 (en) * 2004-05-18 2011-06-08 株式会社ディスコ Wafer division method
JP2006173428A (en) * 2004-12-17 2006-06-29 Seiko Epson Corp Substrate machining method, and element manufacturing method
JP2006269897A (en) * 2005-03-25 2006-10-05 Disco Abrasive Syst Ltd Laser processing method of wafer
JP2007242787A (en) * 2006-03-07 2007-09-20 Disco Abrasive Syst Ltd Splitting method of wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687085A (en) * 1992-09-10 1994-03-29 Taiyo Yuden Co Ltd Dividing method for ceramic substrate
JPH07273069A (en) * 1994-03-31 1995-10-20 Nichia Chem Ind Ltd Manufacture of gallium nitride compound semiconductor chip
WO2005091389A1 (en) * 2004-03-19 2005-09-29 Showa Denko K.K. Compound semiconductor light-emitting device and production method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009060048A1 *

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