EP2200051B1 - Radiofrequenz-Vorrichtung enthaltend eine dünne Schicht mit hoher Permittivität und Permeabilität - Google Patents

Radiofrequenz-Vorrichtung enthaltend eine dünne Schicht mit hoher Permittivität und Permeabilität Download PDF

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Publication number
EP2200051B1
EP2200051B1 EP09305990.5A EP09305990A EP2200051B1 EP 2200051 B1 EP2200051 B1 EP 2200051B1 EP 09305990 A EP09305990 A EP 09305990A EP 2200051 B1 EP2200051 B1 EP 2200051B1
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Prior art keywords
radio
layers
frequency device
ferromagnetic
layer
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Not-in-force
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EP09305990.5A
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English (en)
French (fr)
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EP2200051A1 (de
Inventor
Bernard Viala
Evangeline Benevent
M. Christophe Dubarry
M. Kévin Garello
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Centre National de la Recherche Scientifique CNRS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Centre National de la Recherche Scientifique CNRS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/3218—Exchange coupling of magnetic films via an antiferromagnetic interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance

Definitions

  • the invention relates to the general field of radiofrequency transmitters / receivers, but also to the field of information processing using the technology of magnetic and dielectric thin-film systems. More specifically, the target frequency range is between the hundred Megahertz and several tens of Gigahertz.
  • the invention more specifically relates to thin films, especially thin films used in the constitution of microwave circuits, implemented in such radio frequency transmitters / receivers.
  • Microwave circuits usually find application in the field of telecommunication, where they enter into the constitution of transmission / reception chains, which include antennas and analog radio frequency circuits for signal processing (filters, impedance matching). , amplification).
  • a solution for obtaining the desired properties therefore consists in combining dielectric materials of high permittivity with ferromagnetic materials of high permeability in the frequency band of interest.
  • the object of the present invention is to solve the aforementioned problem by proposing magneto-dielectric elements which comprise a thin film having both high permittivity and permeability, that is to say each greater than ten.
  • the subject of the invention is a radiofrequency device according to claim 1.
  • Thin film, or thin layer, here means a layer whose thickness is less than 10 microns.
  • the particular combination resulting from the stack targeted by the invention constitutes a definitive rupture with respect to the magneto-dielectric materials (garnets, ferrites, etc.) known from the prior art. Indeed, such materials have a limitation of a few hundred Megahertz (without recourse to an external polarization technique), even though the characteristic stack of the invention allows operation for frequencies greater than a few tens of Gigahertz (without use of an external polarization technique).
  • the invention thus stands out by proposing a thin-film magneto-dielectric composite film which makes it possible to combine high permeability and permittivity in the microwave field.
  • the permeability of the magnetic material is greater than 100 to 1 GHz.
  • the permittivity of the dielectric material is advantageously greater than 100 to 1GHz.
  • the magnetic material and the dielectric material are arranged in the form of thin layers.
  • the magnetic material is a ferromagnetic material whose magnetization is greater than 1 T, and advantageously greater than 2 T.
  • it is coupled by exchange coupling to an antiferromagnetic material.
  • the exchange coupling occurring between the layer of ferromagnetic material and the layer of antiferromagnetic material occurs at the interface between these two layers, and ensures a sufficiently high anisotropy energy (magnetic polarization) to extend the dynamic behavior ( permeability) layers of ferromagnetic material at very high frequency, and in this case, in the field of interest.
  • the ferromagnetic material has a saturated residual state (free of magnetic domain).
  • the soft magnetic properties of a ferromagnetic material are achieved provided that the grains are small and closely joined. This makes it possible to cancel out or significantly reduce the magnetocrystalline anisotropy constant present in each grain and which tends to reduce the mobility of the magnetic walls and thus penalize the desired mildness.
  • excessive heating of a ferromagnetic material alone causes grain growth and / or oxidation of the grain boundaries which tends to decouple them, which degrades the soft magnetic properties of the ferromagnetic material.
  • the saturated residual state of the ferromagnetic material obtained by its coupling with the antiferromagnetic material has the effect that the magnetic properties of this combination are less dependent on the size of the grains forming the ferromagnetic material. It is thus possible to wear this combination at a temperature above 300 ° C without the permeability suffers.
  • the antiferromagnetic material is an alloy based on manganese, and especially based on IrMn, PtMn or NiMn or an oxide of Fe or Co.
  • the dielectric material is in turn chosen from the group of perovskites (paraelectric or ferroelectric), and more particularly the titanates of barium and strontium.
  • the magnetic material comprises at least one layer of ferromagnetic material interposed in exchange coupling between two antiferromagnetic layers and / or a layer of antiferromagnetic material interposed in exchange coupling between two ferromagnetic layers.
  • the invention also relates to the method of producing such a device, according to claim 14.
  • the stack thus obtained is compatible with technological steps involving temperatures up to 400 ° C, thus allowing the deposition of the dielectric material at such temperatures or annealing to promote the crystalline nature of the layer of dielectric material when it is deposited in amorphous form at a lower temperature, while preserving the magnetic properties of the ferromagnetic and antiferromagnetic material layers.
  • the deposition of ferromagnetic and antiferromagnetic material layers is also carried out by ion beam sputtering.
  • the dielectric material of the layers 12 and 22 is advantageously a strontium (Sr) and titanium (Ti) oxide, in particular strontium SrTiO 3 titanate (paraelectric material), whose amorphous / perovskite phase transition temperature, and therefore the manufacturing temperature is less than or equal to 400 ° C.
  • the ferromagnetic material constituting the layers 16, 18 is advantageously an alloy based on iron (Fe) and / or cobalt (Co) and / or nickel (Ni), in particular FeCo or FeCoB, which presents naturally very strong saturation magnetizations, typically magnetizations close to 2 T.
  • the antiferromagnetic material of the layer 20, interposed between the layers 16, 18 of ferromagnetic material, is advantageously made of a manganese-based alloy (Mn), in particular NiMn.
  • the ferromagnetic material could be used alone (without association with antiferromagnetic material).
  • this association is particularly interesting because it allows the stack to withstand high temperatures (of the order of 400 ° C for the association FeCo / NiMn) while retaining good property in terms of permeability.
  • dielectric 12 other materials may be used as dielectric 12, and for example a barium oxide (Ba) and titanium, in particular Barium titanium BaTiO 3 , a hafnium oxide (Hf), in particular HfO 2 , or tantalum (Ta), especially Ta 2 O 5 (ferroelectric).
  • BaTiO 3 or SrTiO 3 for example, which have a higher permittivity (of the order of 100 versus 10 for barium or hafnium oxides).
  • antiferromagnetic layer 20 such as a PtMn or IrMn alloy and more generally all manganese-based alloys or iron oxide or cobalt or nickel.
  • CoFeB, FeN and CoFeN will be preferred, but other materials are possible, especially all alloys combining two or three of the elements selected from iron, cobalt and nickel. These alloys may optionally be doped, for example boron or nitrogen. They can also be associated with other elements like Al, Si, Ta, Hf, Zr ...
  • the choice of materials as well as the thickness of the various layers give free choice to the designer to balance the values of the permittivity and permeability in order to choose the impedance of the thin film.
  • the values of the permittivity and the permeability of the thin film will be chosen so as to obtain an impedance close to that of air for the thin film.
  • FIG. 2 there is illustrated a thin film 30 having an alternation 32 of two layers of antiferromagnetic material 34, 36 with a layer of ferromagnetic material 38.
  • the embodiment of the figure 1 is preferred because the layer of antiferromagnetic material is further away from the layer of dielectric material than in the embodiment of the figure 2 .
  • the layer of antiferromagnetic material in contact with the dielectric material layer may be degraded by the migration of oxygen at the interface, particularly when the antiferromagnetic material contains manganese.
  • FIG 3 there is illustrated an embodiment similar to those of Figures 1 and 2 with the difference that the combination of the ferromagnetic and antiferromagnetic layers is separated from the dielectric layers by intermediate layers.
  • an intermediate layer 42 is interposed between the dielectric layer 12 and the ferromagnetic layer 16, and an intermediate layer 44 is interposed between the ferromagnetic layer 18 and the dielectric layer 22.
  • the intermediate layers 42, 44 act as a growth layer or protective layer (diffusion barrier in particular) and advantageously consist of ruthenium (Ru) or tantalum (Ta) or platinum (Pt). Ruthenium, however, allows favorable crystalline growth and is a good interdiffusion barrier.
  • a stack is used in which the dielectric layer is interposed between two magnetic stacks (ferromagnetic material alone, or in combination with antiferromagnetic material , possibly with intermediate layers as in the previously described examples ).
  • the figure 4 schematically illustrates an ion beam sputtering device, which is advantageously used for the production of the thin films described in connection with the Figures 1 to 3 .
  • Ion beam sputtering is a physical vapor deposition technique in which, in a vacuum chamber 50, ions are produced from a source 52 and are accelerated to the sputtering material 54.
  • the ion source 52 generates a positive monoenergetic ion beam (energy typically between 500 and 1500 eV), the beam being defined spatially.
  • the ion beam usually Ar + ions, bombard a target 54 made of the material that is to be deposited.
  • the particles 56 thus sprayed by the ion beam are emitted in the half-space 58 facing the target and condense on a heated surface or not 60 to form a layer of the material constituting the target.
  • An auxiliary source 64 or so-called assistance improves the uniformity of deposition by increasing the mobility of species on the surface by secondary bombardment of low energy. It also allows the addition of oxygen for example to densify or better control the stoichiometry of certain oxides.
  • Ion beam sputtering is particularly advantageous for the deposition of the dielectric material layer with a stoichiometric composition directly from the target of the same composition.
  • an important feature for perovskites, such as SrTiO 3 or BaTiO 3 is important feature for perovskites, such as SrTiO 3 or BaTiO 3 .
  • Ion beam sputtering is also advantageous for the deposition of ferromagnetic material layer on a layer of antiferromagnetic material, and vice versa, insofar as the absence of plasma in the environment of the layer being deposited allows growth with few defects, and guarantees high interface qualities, thus ensuring good control of the properties of films that involve stacks of several layers of nanometric thickness.
  • the ion beam sputtering makes it possible to deposit the perovskites such as SrTiO3 or BaTiO3 with an amorphous / perovskite transition temperature of between 300 ° C. and 400 ° C. It is thus possible to perform the entire stack of dielectric, antiferromagnetic and magnetic layers using this technique.
  • IBS Intrasofar as the temperatures used make it possible to preserve the properties of the various materials involved.
  • the ferromagnetic and antiferromagnetic layers could be deposited, and the intermediate layers by phase deposition.
  • PVD Physical Vapor Desposition
  • the stack perovskite STO chemically as described in the article of M. Niederberger et al ("A general soft-chemistry route to perovskites and related materials: synthesis of BaTiO3, BaZrO3, and LiNbO3, nanoparticles" - Angew Chem Int, Ed 2004, 43, 2270 - 2273 ), and continue with PVD deposits.
  • the temperatures used in the chemical deposition process of the STO are of the order of 200/300 ° C, therefore compatible with the magnetic materials which are below in the stack.
  • Layering techniques could also be envisaged for the dielectric layer, for example by implantation of gaseous species (hydrogen and / or helium for example) in a dielectric layer, direct bonding of this layer on the stack desired magnet and fracture at the implanted zone.
  • gaseous species hydrogen and / or helium for example
  • the thin-film magneto-dielectric composite films described above thus combine high permeability and permittivity and are thus particularly applicable in the microwave field, in particular in the manufacture of microwave circuits.
  • these thin films can enter into the constitution of the magneto-dielectric elements of radio frequency devices, in particular constitute a substrate for such devices, or a coating for a substrate, and / or be used in the formation of passive components (resonant elements , filters, couplers, inductors, baluns, delay lines, etc.) or radiofrequency antennas (comprising, for example, a coating formed of such a film, or obtained by forming an antenna pattern in a substrate comprising a such film).
  • passive components resonant elements , filters, couplers, inductors, baluns, delay lines, etc.
  • radiofrequency antennas comprising, for example, a coating formed of such a film, or obtained by forming an antenna pattern in a substrate comprising a such film.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Magnetic Films (AREA)
  • Nanotechnology (AREA)

Claims (14)

  1. Zwischen 1 und 20 GHz arbeitende Radiofrequenz-Vorrichtung, bei der mindestens ein di-elektromagnetisches Element, arbeitend mit einer Radiofrequenz zwischen 1 und 20 GHz, eine dünne Verbundschicht (10, 30, 40) enthält, die ein magnetisches Material (16, 18, 38) mit einer Permeabilität über 10 bis 1 GHz und ein dielektrisches Material (12, 22) umfasst, dadurch gekennzeichnet, dass es sich bei dem dielektrischen Material (12, 22) um ein Perowskit handelt, das durch Ionenstrahl-Zerstäubung in einem Vakuumbehälter, mit einer Permittivität von über 100 bis 1 GHz erhalten wird und dadurch, dass die Vorrichtung Gegenstand einer Ablagerungs- oder Temperoperation bei einer Temperatur von höchstens gleich 400 °C ist.
  2. Radiofrequenz-Vorrichtung gemäß Anspruch 1, dadurch gekennzeichnet, dass die Permeabilität des magnetischen Materials (16, 18, 38) höher als 100 bis 1 GHz liegt.
  3. Radiofrequenz-Vorrichtung gemäß Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Permittivität des dielektrischen Materials (12, 22) höher als 100 bis 1 GHz liegt.
  4. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass das magnetische Material (16, 18, 38) und das dielektrische Material (12, 22) in Form dünner Schichten angeordnet sind.
  5. Radiofrequenz-Vorrichtung gemäß Anspruch 4, dadurch gekennzeichnet, dass die aus magnetischem Material hergestellten Schichten Kontakt mit den Schichten aus dielektrischem Material haben.
  6. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass es sich bei dem magnetischen Material um ein ferromagnetisches Material handelt, dessen Magnetisierung über 1 T liegt, und besser noch über 2 T.
  7. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Schichten aus magnetischem Material aus ferromagnetischen Schichten bestehen, die durch Austauschkopplung mit anti-ferromagnetischen Schichten (20, 34, 36) verkoppelt sind.
  8. Radiofrequenz-Vorrichtung gemäß Anspruch 7, dadurch gekennzeichnet, dass das Stapel der Schichten aus ferromagnetischem und anti-ferromagnetischem Material von den Schichten aus dielektrischem Material durch mindestens eine Zwischenschicht (42, 44) getrennt sind, die als Wachstumsschicht oder Schutzschicht dient.
  9. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, dass das ferromagnetische Material aus der Gruppe ausgewählt wird, die die Legierungen von Fe und von Co und von Ni, und alle Zusammensetzungen, die zwei oder drei dieser eventuell Bor- oder Stickstoffdotierten (NiFe, CoNiFe, CoFe, CoFeB, FeN, CoFeN + eventuell X mit X = Al, Si, Ta, Hf, Zr...) Elemente beinhalten, umfasst.
  10. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 7 bis 8, dadurch gekennzeichnet, dass das anti-ferromagnetische Material aus der Gruppe ausgewählt wird, die die Legierungen auf Manganbasis, und insbesondere auf Basis von IrMn, PtMn oder NiMn oder ein Fe- oder Co- Oxid, umfasst.
  11. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass das dielektrische Material ein Barium- oder Strontium-Titanat ist.
  12. Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 8 bis 11, dadurch gekennzeichnet, dass die Zwischenschicht oder Zwischenschichten aus einem Material besteht/bestehen, das aus der Gruppe ausgewählt wird, die Platin, Ruthenium und Tantal umfasst.
  13. Radiofrequenz-Vorrichtung gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das magnetische Material mindestens eine Schicht ferromagnetischen Materials (38) umfasst, die in Austauschkopplung zwischen zwei anti-ferromagnetischen Schichten (34, 36) und/ oder einer Schicht anti-ferromagnetischen Materials (20) eingefügt wird, die eingefügt in Austauschkopplung zwischen zwei ferromagnetischen Schichten (16, 18) eingefügt wird.
  14. Verfahren zur Herstellung einer Radiofrequenz-Vorrichtung gemäß einem der Ansprüche 1 bis 13, dadurch gekennzeichnet, dass die Schichten aus dielektrischem Material durch Ionenstrahl-Zerstäubung in einem Vakuumbehälter abgeschieden werden, und dass der Stapel, der die Schicht bildet, Gegenstand einer Ablagerungs- oder Temperoperation bei einer Temperatur von höchstens gleich 400 °C ist.
EP09305990.5A 2008-12-11 2009-10-19 Radiofrequenz-Vorrichtung enthaltend eine dünne Schicht mit hoher Permittivität und Permeabilität Not-in-force EP2200051B1 (de)

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FR0858470A FR2939990B1 (fr) 2008-12-11 2008-12-11 Film mince a permittivite et permeabilite elevees.

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FR2966985B1 (fr) 2010-11-03 2012-12-07 Commissariat Energie Atomique Conducteur magnetique artificiel et antenne
EP2643886B1 (de) 2010-11-22 2015-01-14 Commissariat à l'Énergie Atomique et aux Énergies Alternatives Flachantenne mit erweiterter bandbreite
US9989666B2 (en) * 2014-04-02 2018-06-05 Baker Hughes, A Ge Company, Llc Imaging of earth formation with high frequency sensor
CN104992809B (zh) * 2015-07-08 2018-01-30 兰州大学 平面内任意方向均能实现GHz高磁导率的磁性材料及制备方法
US11626228B2 (en) * 2016-12-22 2023-04-11 Rogers Corporation Multi-layer magneto-dielectric material
TW201832252A (zh) * 2017-01-30 2018-09-01 美商羅傑斯公司 製作多層磁電介質材料的方法
FR3066854B1 (fr) 2017-05-29 2019-07-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif magnetique integre a inductance variable et procede de realisation d'un tel dispositif
GB2592763B (en) * 2018-11-15 2023-01-04 Rogers Corp High frequency magnetic films, method of manufacture, and uses thereof
FR3088849B1 (fr) * 2018-11-28 2023-04-28 Commissariat Energie Atomique Feuille présentant des propriétés diélectriques ou magnéto-diélectriques.

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FR2939990B1 (fr) 2016-02-19
EP2200051A1 (de) 2010-06-23
US8916391B2 (en) 2014-12-23
JP5536418B2 (ja) 2014-07-02
US20100151797A1 (en) 2010-06-17
FR2939990A1 (fr) 2010-06-18
JP2010141301A (ja) 2010-06-24

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