EP2187149A2 - Installation de pompes à chaleur - Google Patents

Installation de pompes à chaleur Download PDF

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Publication number
EP2187149A2
EP2187149A2 EP09175482A EP09175482A EP2187149A2 EP 2187149 A2 EP2187149 A2 EP 2187149A2 EP 09175482 A EP09175482 A EP 09175482A EP 09175482 A EP09175482 A EP 09175482A EP 2187149 A2 EP2187149 A2 EP 2187149A2
Authority
EP
European Patent Office
Prior art keywords
heat
evaporator
subcooler
pump system
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09175482A
Other languages
German (de)
English (en)
Other versions
EP2187149A3 (fr
Inventor
Jörg FUHRMANN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weska Kalteanlagen GmbH
Original Assignee
Weska Kalteanlagen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weska Kalteanlagen GmbH filed Critical Weska Kalteanlagen GmbH
Publication of EP2187149A2 publication Critical patent/EP2187149A2/fr
Publication of EP2187149A3 publication Critical patent/EP2187149A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F25B40/02—Subcoolers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/18—Optimization, e.g. high integration of refrigeration components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F25B40/04—Desuperheaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel

Definitions

  • the invention relates to a heat pump system with in the flow direction of the refrigerant and an external fluid sequentially arranged subcooler and evaporator. Furthermore, the invention relates to a method for operating a heat pump system.
  • Conventional heat pumps in particular compression heat pumps, are known to have a compressor which is driven electrically or by an internal combustion engine.
  • the compressor compresses a refrigerant to a higher pressure, where it heats up.
  • the energy released during the subsequent dehiscence and liquefaction of the refrigerant is transferred to the medium of the heating circuit in a heat exchanger.
  • the refrigerant is then expanded in an expansion valve, it cools down.
  • the expanded refrigerant is supplied to the evaporator, where it absorbs heat from the environment and evaporates. Subsequently, the vaporous refrigerant is sucked by the compressor.
  • the cycle of the refrigerant is closed.
  • the heat source used in most cases is air, such as fresh air or ambient air, the soil or water, such as groundwater, which is deprived of heat.
  • the heat absorbed by the heat source is raised to a higher temperature level.
  • the heat absorbed plus part of the compressor power is available as heat at a higher level and is used for heating purposes, for example space heating or hot water preparation.
  • the differences between the temperature of the heat source and the useful temperature should be as low as possible, that is, for example, that the heat exchangers are designed for the lowest possible temperature differences between the primary and secondary side.
  • a heat pump which uses the ambient air as a heat source, usually has a much lower evaporation temperature than a system with the ground as a heat source. With decreasing temperature of the ambient air, the heat demand is greater and the coefficient of performance of the system lower. In addition, the heat transfer coefficient of air at the evaporator surfaces is low, the dew point is often below and the forming condensate must be removed. If the evaporating temperature of the refrigerant is below the temperature of the freezing point of the condensate, an ice layer is formed, which significantly reduces the heat transfer and must be defrosted at regular intervals. During the defrosting process no heat can be absorbed and additional energy is needed for defrosting.
  • the systems can be distinguished, for example, by the number of fluid circuits.
  • the decoupling of the circuits by indirect supply of the heat of vaporization by means of a heat carrier circuit from the environment and the removal of the liquefaction energy, for example via a hot water heating network are advantageous in terms of control technology, the amount of refrigerant and the probabilities of leaks are low. This is to be evaluated in particular with regard to the environmental hazard of the refrigerant and the hazardous properties, such as toxicity or ignitability.
  • heat exchangers in the additional circuits proves to be disadvantageous as connections to the refrigerant circuit, whereby an additional temperature difference occurs in each case.
  • direct systems a heat transfer circuit is dispensed with, so that the heat transfer from the heat transfer circuit to the working circuit of the heat pump is eliminated.
  • the refrigerant absorbs the heat in direct evaporation. This eliminates the energy disadvantageous temperature difference at the additional heat exchanger.
  • the direct systems are not suitable for all applications.
  • the EP 0846 923 B1 discloses a system for air conditioning a room, is prepared with the outside air supplied to the room.
  • the air flowing in from the outside in the flow direction is initially cooled and, depending on the state defined by the temperature and humidity, dehumidified and then reheated.
  • the process of cooling the air is comparable to the absorption of heat in an evaporator of a heat pump system, wherein the air serves as a heat source.
  • the in the EP 0846 923 B1 described refrigeration system for air conditioning has in the flow direction of the refrigerant after the condenser to an additional subcooler, which can be switched on or off as needed via valves.
  • the refrigerant is expanded by means of an expansion valve into the evaporator.
  • the air to be treated is cooled in the evaporator.
  • the heat is transferred from the air to the refrigerant.
  • the cooled air in the subcooler is reheated.
  • subcooler refers to the subcooling of the refrigerant after condensation. The heat is thus transferred from the refrigerant to the air.
  • a similar system as in the EP 0846 923 B1 is also in the US 5,664,425 A described, in which an apparatus and a method for dehumidifying or conditioning of air are disclosed.
  • the system also has, in the flow direction of the refrigerant, a condenser with a downstream subcooler and an expansion element for expanding the refrigerant into an evaporator.
  • the air is cooled as required in the evaporator and dehumidified and then reheated in the heat exchanger to subcool the refrigerant.
  • the device is intended for receiving cold, dry building exhaust air and for storing condensate water provided by an air conditioning, refrigeration or heat pump system or other water supply.
  • the object of the present invention is to provide a heat pump system and a method for operating a heat pump system that transfers heat from the heat source to the refrigerant circuit according to the principle of the direct or indirect system, wherein the coefficient of performance of the heat pump in comparison to conventional systems be increased and thus increase energy efficiency.
  • the system is also intended to minimize the time and effort required to operate the system, thus reducing energy consumption and operating costs.
  • the refrigerant absorbs heat from the refrigerant in the subcooler, heats up and then flows with the higher temperature state over the evaporator surfaces, where it gives off heat.
  • heat is transferred from the liquid refrigerant, the so-called refrigerant condensate, to the outer fluid and from the outer fluid to the evaporating refrigerant.
  • the temperature difference between the evaporation temperature of the refrigerant and the temperature of the heat source is advantageously reduced.
  • Compressor unit is to be understood either a single or a composite of a plurality of compressors, which are connected in parallel with each other.
  • the power of the system is regulated and the parallel operation simplifies the control of compressor performance.
  • the refrigerant is de-oiled and / or liquefied. If vaporous refrigerant is present at the outlet of the desuperheater, the vaporous component in the condenser of the refrigeration system is completely liquefied.
  • the use of a single capacitor is possible, in addition to the condensation also takes place the process of desuperheating.
  • the subcooler and the evaporator are integrated within a common housing and thus formed as an integrated subcooler evaporator. This has the advantage of possible space savings.
  • a heat carrier circuit which has the subcooler and the evaporator of the refrigerant circuit and a heat source heat exchanger.
  • the heat transfer medium also referred to as external fluid, which is circulated by means of a heat transfer pump in the heat transfer circuit, successively absorbs heat in the heat source heat exchanger and the subcooler, which is then discharged again when flowing through the evaporator. By absorbing heat in the subcooler, the temperature of the heat transfer medium increases.
  • the evaporation temperature of the refrigerant circuit is in addition to design features of the heat exchanger itself also dependent on the temperature of the heat transfer medium.
  • the evaporation temperature of the refrigerant By increasing the temperature of the heat transfer medium can be raised at the same design features of the evaporator, the evaporation temperature of the refrigerant.
  • the entire heat pump system is therefore more energy efficient to operate.
  • the liquefied refrigerant is undercooled by the heat transfer to the heat transfer medium in the subcooler.
  • the additional subcooling at condensation pressure increases the specific cooling capacity after the relaxation. If the mass flow remains constant, more heat can be absorbed in the evaporator due to the larger available enthalpy difference, or the mass flow can advantageously be reduced. The energy efficiency of the heat pump system is increased.
  • the subcooler and the evaporator are designed such that a heat source medium flows as external fluid directly through the subcooler and the evaporator.
  • a heat source medium flows as external fluid directly through the subcooler and the evaporator.
  • heat pump circuit in which the refrigerant absorbs the heat in direct evaporation, is dispensed with a heat transfer circuit.
  • the higher the evaporation temperature or the higher the evaporation pressure in the refrigerant circuit the lower the pressure ratio of the compression and thus the power supplied to the compressor.
  • the coefficient of performance of the system is advantageously larger. The system works more efficiently.
  • Both the subcooler and the evaporator can be designed, for example, as air-stressed, sole- or wasserbeetzbergerte heat exchanger.
  • air-heated heat exchanger and operating conditions with outside air temperatures around 0 ° C and thus the evaporation temperature below 0 ° C it comes to icing of the heat transfer surface of the evaporator and an increasing deterioration of heat transfer.
  • the surfaces must be defrosted at regular intervals.
  • the concept of the invention raises the evaporation temperature over conventional circuits. Increasing to evaporating temperatures above 0 ° C will prevent icing. At temperatures below 0 ° C, the process of icing is delayed. The higher the evaporation temperature, the slower this process is. The operation of the system causes less costs.
  • the subcooler and the evaporator are successively from an external fluid, that is one Heat source medium or a heat transfer medium flows through.
  • the outer fluid absorbs heat in the subcooler and then releases heat in the evaporator.
  • heat source media or heat transfer media are sols, water or other media, such as gases, in particular air.
  • heat transfer medium as external fluid circulates this fluid within a heat carrier circuit.
  • the heat transfer medium flows through in the flow direction except the subcooler and the evaporator and a heat source heat exchanger.
  • the heat transfer medium in the heat source heat exchanger absorbs heat from a heat source, which it releases plus the heat then absorbed in the subcooler in the evaporator.
  • the heat dissipation in the desuperheater and / or condenser of the heat pump system takes place in a temperature range between 50 ° C and 80 ° C.
  • the operation of the plant is less expensive than the operation of the plants known in the prior art.
  • the heating of the outer fluid prior to entry into the evaporator advantageously raises the evaporation temperature, so that the pressure ratio at the compressor is reduced.
  • the specific cooling capacity is increased by the supercooling of the refrigerant after the condensation, resulting in the reduction of the mass flow of the refrigerant at the same power at the evaporator. Both criteria lead to the advantageous reduction of the compressor to the refrigerant circuit to be supplied power and to increase the coefficient of performance.
  • the system is energetically more effective to operate.
  • by raising the evaporation temperature under certain operating conditions icing on the evaporator can be prevented or at least delayed. This reduces the number of costly defrosts.
  • the heat pump system 1 as a closed system essentially consists of the components evaporator 5, compressor 8, desuperheater 2, condenser 3, subcooler 4 and expansion element 9.
  • the refrigerant evaporating in the evaporator 5 absorbs heat at a constant temperature, which is absorbed by the external fluid. that is the heat carrier, is discharged.
  • the heat carrier cools down. After overheating of the vaporized refrigerant this is sucked by a suction line 16 as a connection between the evaporator 5 and compressor 8 from the compressor 8 and compressed to a higher pressure. In addition to the pressure, the temperature of the vaporous refrigerant also increases.
  • the so-called hot gas also referred to as superheated steam
  • the so-called hot gas is supplied to the desuperheater condenser 2 via a pressure line 14, cooled in the desuperheater condenser 2 to condensation temperature and then liquefied at a constant temperature.
  • the refrigerant is already completely de-icing and at least partially already liquefied.
  • the condenser 3 the refrigerant is further de-hydrated and / or liquefied, depending on the state of entry.
  • the cooling of the refrigerant to condensation temperature is called decarburization.
  • the liquefaction of the refrigerant starts when the dew line is reached.
  • the heat is transferred from the refrigerant to the heating system in which water circulates.
  • the connections between desuperheater condenser 2 and capacitor 3, as Heat exchanger of the refrigerant circuit, and the water tank 11 of the heating system is thus realized via circuits in which water is circulated by means of water pumps 13.
  • the refrigerant releases the heat received in the evaporator 5 and supplied to the heating system during the compression.
  • the liquid refrigerant After exiting the condenser 3, the liquid refrigerant is undercooled at a constant pressure. The thereby extracted heat is supplied to the heat carrier, which heats up. The temperature of the heat carrier is increased in the subcooler 4.
  • the arrangement of a refrigerant accumulator 10 is also provided, which compensates for the differences in refrigerant quantity during operation within the heat pump system 1.
  • the heat transfer pump 12 allows the heat transfer medium to circulate within the heat carrier circuit in the flow direction through the heat source heat exchanger 6, the subcooler 4 and the evaporator 5.
  • the heat transfer medium in the heat source heat exchanger 6 absorbs heat from the environment.
  • the outlet temperature of the heat carrier is dependent on the respective heat source.
  • soil or groundwater as a heat source, the heat is transferred at temperatures between 2 ° C to 10 ° C. If the heat is removed from the ambient air, this occurs at temperatures between -20 ° C and +20 ° C depending on the day and season.
  • the heat transfer temperatures depend on the time of day and the season, even when absorbing solar heat. Since the heat transfer medium in the subcooler 4 absorbs additional heat while its temperature is further increased, the evaporation temperature of the refrigerant can be increased during the subsequent flow through the evaporator 5 and the heat transfer taking place therein. A higher evaporation temperature in the refrigerant circuit leads to a larger coefficient of performance, as otherwise known, since the power to be supplied to the compressor 8 is reduced. On the other hand, the heat absorption of the heat carrier in the subcooler 4 leads to hypothermia of the refrigerant and thus to an increase in the specific cooling capacity after the expansion. Under otherwise constant conditions, in particular the heat to be absorbed in the evaporator 5, the necessary mass flow of the refrigerant and thus also the power to be supplied to the compressor 8 is reduced. The energy efficiency of the heat pump system 1 is increased.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
EP09175482A 2008-11-18 2009-11-10 Installation de pompes à chaleur Withdrawn EP2187149A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200810043823 DE102008043823B4 (de) 2008-11-18 2008-11-18 Wärmepumpenanlage

Publications (2)

Publication Number Publication Date
EP2187149A2 true EP2187149A2 (fr) 2010-05-19
EP2187149A3 EP2187149A3 (fr) 2012-01-18

Family

ID=41571311

Family Applications (1)

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EP09175482A Withdrawn EP2187149A3 (fr) 2008-11-18 2009-11-10 Installation de pompes à chaleur

Country Status (2)

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EP (1) EP2187149A3 (fr)
DE (1) DE102008043823B4 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MD4208C1 (ro) * 2011-10-12 2013-09-30 Институт Энергетики Академии Наук Молдовы Pompă de căldură cu tub de vârtejuri
CN114935260A (zh) * 2022-05-25 2022-08-23 山东朗进科技股份有限公司 一种空气源热泵干燥机组

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010051471A1 (de) 2010-11-15 2012-05-16 Audi Ag Fahrzeug mit einer Klimaanlage
DE102012023823A1 (de) * 2012-12-05 2014-06-05 Daimler Ag Fahrzeugklimatisierungsanlage

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664425A (en) 1991-03-08 1997-09-09 Hyde; Robert E. Process for dehumidifying air in an air-conditioned environment with climate control system
JP2002162123A (ja) * 2000-11-21 2002-06-07 Sekisui Chem Co Ltd ヒートポンプ
EP0846923B1 (fr) 1996-12-04 2004-04-07 Carrier Corporation Dispositif de récupération de chaleur
US20050028545A1 (en) 1998-10-08 2005-02-10 Hebert Thomas H. Building exhaust and air conditioner condensate (and/or other water source) evaporative refrigerant subcool/precool system and method therefor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5243837A (en) * 1992-03-06 1993-09-14 The University Of Maryland Subcooling system for refrigeration cycle
DE10297770D2 (de) * 2002-08-28 2005-09-29 Bms Energietechnik Ag Wildersw Zweistufenverdampfung mit integrierter Flüssigkeitsunterkühlung und Saugdampfüberhitzung in frequenzgesteuerter Modultechnik
US9010136B2 (en) * 2004-01-28 2015-04-21 Bms-Energietechnik Ag Method of obtaining stable conditions for the evaporation temperature of a media to be cooled through evaporation in a refrigerating installation
DE202007017723U1 (de) * 2007-11-21 2008-03-20 Meister, Remo Anlage für die Kälte-, Heiz- oder Klimatechnik, insbesondere Kälteanlage
US20100287960A1 (en) * 2008-01-31 2010-11-18 Remo Meister Modular Air-Conditioning System and Method for the Operation Thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664425A (en) 1991-03-08 1997-09-09 Hyde; Robert E. Process for dehumidifying air in an air-conditioned environment with climate control system
EP0846923B1 (fr) 1996-12-04 2004-04-07 Carrier Corporation Dispositif de récupération de chaleur
US20050028545A1 (en) 1998-10-08 2005-02-10 Hebert Thomas H. Building exhaust and air conditioner condensate (and/or other water source) evaporative refrigerant subcool/precool system and method therefor
JP2002162123A (ja) * 2000-11-21 2002-06-07 Sekisui Chem Co Ltd ヒートポンプ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MD4208C1 (ro) * 2011-10-12 2013-09-30 Институт Энергетики Академии Наук Молдовы Pompă de căldură cu tub de vârtejuri
CN114935260A (zh) * 2022-05-25 2022-08-23 山东朗进科技股份有限公司 一种空气源热泵干燥机组
CN114935260B (zh) * 2022-05-25 2024-04-02 山东朗进科技股份有限公司 一种空气源热泵干燥机组

Also Published As

Publication number Publication date
DE102008043823A1 (de) 2010-07-08
DE102008043823B4 (de) 2011-05-12
EP2187149A3 (fr) 2012-01-18

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