EP2184594B1 - Drucksensor zur Druckmessung in einem Medium - Google Patents

Drucksensor zur Druckmessung in einem Medium Download PDF

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Publication number
EP2184594B1
EP2184594B1 EP08168746.9A EP08168746A EP2184594B1 EP 2184594 B1 EP2184594 B1 EP 2184594B1 EP 08168746 A EP08168746 A EP 08168746A EP 2184594 B1 EP2184594 B1 EP 2184594B1
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EP
European Patent Office
Prior art keywords
pressure sensor
backside
support member
sensing element
hole
Prior art date
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Active
Application number
EP08168746.9A
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English (en)
French (fr)
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EP2184594A2 (de
EP2184594A3 (de
Inventor
Frank Gerald Daniël Morsink
Gerald Ivan Spijksma
Tom Bernard Henri Te Boekhorst
Sean Patrick Mulligan
Jun Bae
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Sensata Technologies Inc
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Sensata Technologies Inc
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Publication date
Application filed by Sensata Technologies Inc filed Critical Sensata Technologies Inc
Priority to US12/504,006 priority Critical patent/US7992441B2/en
Priority to JP2009176336A priority patent/JP2010038916A/ja
Priority to CN200910211604XA priority patent/CN101685037B/zh
Priority to KR1020090070809A priority patent/KR101593691B1/ko
Publication of EP2184594A2 publication Critical patent/EP2184594A2/de
Publication of EP2184594A3 publication Critical patent/EP2184594A3/de
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Publication of EP2184594B1 publication Critical patent/EP2184594B1/de
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the invention relates generally to hybrid electronics and more particularly to a pressure sensor module for use in a pressure sensor and more particularly to fluid pressure sensors exposed to acidic environments.
  • the sensor module comprises a sensing element mounted on a front side of a support member.
  • the support member comprises a hole through the support member from the front side to a back side and the sensing element covers the hole at the front side.
  • a pressure sensor module of the above-mentioned type is known from WO2002/079742 .
  • the known pressure sensor module is used in a gauge differential pressure configuration.
  • Two identical sensor sensors modules are used to measure the pressure of two media. Each configuration comprises a hole. The hole passes through a substrate which is covered at one side by the sensing element. The other sides of both sensing elements see the same reference pressure, typically atmospheric pressure, due to the fact that they sit in the same chamber.
  • An additional inlet can pass through the housing of the pressure sensor to provide atmospheric pressure to the chamber. In this open configuration, water vapor and other contaminants can freely enter the chamber.
  • the pressure media designated as a low and a high pressure, enter the housing through separate pressure inlets and act upon the sensing elements via the hole through the substrate.
  • the through hole can be made with laser cutting.
  • Laser cutting of through holes in ceramics is an economical process commonly implemented in hybrid electronics.
  • the laser cutting process can damage the inherent acid robustness of the ceramic by creating micro cracks and/or forming more vulnerable phases of the ceramic (i.e. glassy phase) on the surface of the ceramic.
  • the untreated laser cut surface may be prone to chemical attack and corrosion.
  • This laser cut surface may be prone to chemical attack and corrosion even when the through holes are potted with a protective coating. This chemical attack and corrosion will change the properties of the protective coating which could result in malfunctioning of the pressure sensor.
  • German patent publication DE-A-10 2007 029356 discloses a differential pressure sensor having symmetrical sensor chips and pressure introduction channels.
  • Japanese patent publication JP-A-2006343276 discloses a sensor module having rounded corners in the member supporting a sensor element and being in contact with a protective gel.
  • a pressure sensor module according to claim 1 is provided.
  • the support member of the pressure sensor module further comprises a backside barrier at the backside of the support member, surrounding a surface of the backside of the support member including the hole and forming an enclosed area, wherein the enclosed area and the hole form a pressure channel and, a backside protective member filling the hole and at least partially the enclosed area.
  • the sensing element of a MEMS based differential pressure sensor needs to be protected against the exhaust environment. For this reason a protective gel is used. This gel should provide mechanical isolation against deposits and offers protection of the sensing elements against damaged by frozen water.
  • this is generally accomplished by placing a gel dam or barrier around the sensing element and filling the chamber formed by the gel dam with a protective gel.
  • a gel dam or barrier around the sensing element and filling the chamber formed by the gel dam with a protective gel.
  • the walls of hole through the support member are used as gel dam and the chamber formed by the hole is filled with a protective gel.
  • the soot filter filters the exhaust so good that the exhaust after soot filter is less aggressive and a through hole filled with protective gel provides sufficient protection for the sensing element for the product life time.
  • the amount of protective gel should be sufficient to protect the sensing element against chemical attacks.
  • the gel in the hole of the support at the backside degrades faster than the gel between the gel dam at the front side.
  • the geometric constraints of the through hole are the cause of the faster degradation of the protective gel in the hole.
  • the protective gel is polluted more near the walls of the hole than in the middle of the hole.
  • the first degradations of the protective gel appear in the area near the point where the surfaces of the ceramics, exhaust and protective gel meet each other.
  • One of the reasons is the structure of the surface of the hole due to the laser cutting process. Without a back side barrier, water pockets will occur in the gel in the narrow through hole.
  • the water pockets comprise NO x -gasses.
  • the water pockets introduce mechanical stress in the gel, which is subsequently acting on the sensing element. Over a longer period, the water pockets degrade the gel in a way that cracks and water bubbles occur in the gel, resulting in a malfunctioning sensor.
  • the backside barrier which is at least partially filled with a protective gel. This enlarges the distance between the surface of the gel exposed to exhaust gas and the walls of the hole. This ensures that water pockets in the gel will appear slower.
  • the effect on the performance of the sensor will be less, as the distance between opposite walls of the backside barrier is larger than the distance between the walls of the hole.
  • a cross section of the hole widens from the back to the front of the support member and in another embodiment, the transition of the surface of the hole to the backside has a smooth shape.
  • the gel is a viscous substance with a high coefficient of thermal expansion (CTE).
  • CTE coefficient of thermal expansion
  • the backside barrier is attached to the support member.
  • This feature allows to construct the pressure channel by means of two economically to manufacture components, for example a ceramic printed wiring board (PWB) and a ceramic ring, which are glued together.
  • PWB printed wiring board
  • the support member and backside barrier are formed by one piece of material, for example ceramic material. This allows to skip the manufacturing step of attaching the gel dam to the support member.
  • the back side barrier is formed by a bead of adhesive.
  • the support member is a ceramic PWB having an electrically conductive element provided at the front side and electrically connected to the sensing element.
  • the electrically conductive element comprises noble metals. This feature reduces the influence of acidic conditions due to the exhaust acting on the front-side. Using noble metals further improves the robustness of the conductive elements.
  • the sensing element is a differential pressure sensing element.
  • the sensing element is a Micro-ElectroMechanical Systems (MEMS) differential pressure sensing element. This feature allows us to provide an improved differential pressure sensor, which could be used to measure a pressure drop over for example a soot filter in an exhaust system.
  • MEMS Micro-ElectroMechanical Systems
  • the senor further comprises a front side barrier surrounding the sensing element and a front side protective member which has an electrical insulating property and covers the sensing element and the front side between the front side barrier.
  • the enclosed area on the backside within the backside barrier is larger then the area of the hole in the support member. This allows to fill the pressure channel with enough protection gel to reduce the forming and the effect of pollutants, which could be water pockets, in the gel in the through hole.
  • the minimum thickness of the backside protective member covering the sensing element is larger than the minimum distance between the surface of the sensing element covered by the backside protective member and a plane coinciding with the backside of the support member.
  • the ratio of the gel surface versus gel height is increased, the distance between the gel surface and sensing element is increased, the distance between the position where the surface of the gel touches the side wall and the sensing element.
  • edge conditions of the through hole have been improved by a method comprising the steps of:
  • support member is manufactured by means of a sintering process, wherein the hole in formed in the support member by means of a mold. It has been found that the edges of a through hole made by such a process have a less vulnerable surface texture than edges of a through hole made by a laser cutting process.
  • Another object of the invention is to provide an improved pressure sensor arrangement comprising a housing and a pressure sensor module according to the invention.
  • a pressure sensor module for measuring fluid pressure in an acidic medium has a fluid pressure responsive sensing element 1 mounted on a front side 3 of a support member 5 over a through hole 7 and a backside barrier 6 or gel dam is disposed around the through hole on the opposite or back side of the support member.
  • the barrier 6 and through hole 7 are filled with a backside protective member 2.
  • This module is meant as a sub-assembly that has to be fit in a sensor housing before it can be used as a pressure sensor or device.
  • Figure 2 shows a cross sectional view of pressure sensor arrangement comprising a pressure sensor module 30 according to a preferred embodiment.
  • Figure 1 shows a cross sectional view of a part of the pressure sensor module shown in figure 2 .
  • a module 30 can be used as differential pressure sensor , for example, in an exhaust system to measure the pressure drop over a soot filter.
  • the differential pressure is preferably measure by means of a MEMS differential pressure sensing element 1.
  • MEMS differential pressure sensing element 1 Such sensors are known in the art.
  • the sensing element 1 can have thin-film, foil gauge or bulk silicon gauge design.
  • the pressure sensor module 30 is preferably manufactured completely before it is placed in a housing 20 of the pressure sensor arrangement.
  • the housing 20 and pressure sensor module 30 form a first pressure chamber 24 and a second pressure chamber 25.
  • the housing comprises a first inlet 21 through which a first fluid having a first pressure can enter the first pressure chamber 24.
  • the housing comprises further a second inlet 22 through which a second fluid having a second pressure can enter the second pressure chamber 25.
  • the first fluid is for example the exhaust after the soot filter and the second fluid is the exhaust before the soot filter.
  • the housing 20 further comprises a separate cavity 26 for accommodating sensor electronics. The cavity is separated from the first and second pressure chamber to isolate the components of the sensor electronics 23 from the acidic environment of the exhaust gasses.
  • the sensing element 1 is attached to a front side 3 of a support member 5 by means of a sealant or any other suitable adhesive material.
  • the support member 5 is preferably made of a ceramic material for example a 96% AL 2 O 3 ceramic material. Alternatively, a support member 5 of a purer AL 2 O 3 ceramic or other suitable ceramic material could be used.
  • the support member 5 comprises a through hole 7 from the front side 3 of the support member 5 to a backside 9 of the support member 5.
  • the sensing element 1 hermetically covers the hole 7 at the front side 3, to form a seal between both sides of the support member 5.
  • the through hole 7 can be made by means of laser cutting with a CO2 laser.
  • a support with a through hole 7 can also be made by means of a sintering process.
  • the hole 7 is then formed in the support member by means of an extrusion in the mold in a commonly known way.
  • An advantage of forming the hole during the sintering process is that the hole comprises a less vulnerable surface texture and/or ceramic phase than when the hole is made by a laser cutting process.
  • Another way of creating a through hole 7 in the support is to stamp with a tool through the support prior to firing of the ceramic panel, so called green state punching.
  • Wire bonds 14 electrically connect the sensing element 1 to electrically conductive elements, e.g. traces 13 on the support member 5.
  • the traces 13 and wire bonds 14 are made of noble metals to improve there characteristics with respect to chemical attack and corrosion due to the acidic environment created by the fluids present at both sides of the support member 5.
  • the support member with electrically conductive elements form a ceramic Printed Wiring Board on which electronic components 23 can be adhered to form electronic circuitry 23.
  • the electronic circuitry is arranged to sense one or more electrical properties of the sensing element and to condition and convert the one or more electrical properties into an output signal for use in the electronic control unit of the vehicle.
  • the pressure sensor module 30 comprises at the front side 3 of the support member 5 a front side barrier 4.
  • the front side barrier 4 surrounds the sensing element 1 and forms a cavity which is partially filled with a front side protective member 11.
  • the protective member 11 has an electrical insulating property and covers one side of the sensing element 1 and a part of the front side surface between the front side barrier 4.
  • the protective member 11, which is preferably a gel protects the sensing element 1 from contaminants introduced through the second inlet 22 in the second pressure chamber 25.
  • the front side barrier 4 keeps the front side protective member 11 in place.
  • a "gel” is defined as a colloidal suspension of a liquid in a solid, forming a jellylike material in a more solid form than a solution.
  • the gel is specially selected to accurately transmit pressure in the pressure chamber while isolating the sensing element from harsh surrounding conditions.
  • the gel can be, for example, Shin-Etsu Sifel, which stays soft over a -40°C - +135°C temperature range and does not exert additional pressure on the sensing element 1.
  • the gel is preferably resistant to exhaust gasses.
  • the protective member 2 protects the sensing element 1 from condensate of exhaust gasses, which is an acidic condensate. Furthermore, the protective member forms a mechanical isolator for soot particles and other particles that could damage the sensing element 1 and/or could make the sensing element 1 malfunctioning.
  • the pressure sensor module 30 further comprises at the backside 3 of the support member 5 a backside barrier 6.
  • the backside barrier 6 surrounds the through hole 7 and forms an enclosed area 8 which is partially filled with a back side protective member 2.
  • the backside protective member 2 is a similar substance as the front side protective member 11 having similar properties.
  • the backside barrier 6 keeps the backside protective member 2 in place.
  • the hole 7 and enclosed area 8 surrounded by the backside barrier 6 form a pressure channel 10.
  • the pressure channel 10 allows to transfer a pressure in the first pressure chamber 24 to act on the sensing element 1.
  • the front side barrier 4 and backside barrier 6 can be surrounding structure.
  • the shape of the surrounding structure can be substantially squared as illustrated in figure 3 , substantially cylindrical, or can have any other suitable shape.
  • the barriers 4, 6 are preferably made of the same material as the support member 5.
  • the barriers are preferably made of a ceramic material.
  • the front side barrier 4 is a structure which is bonded to the support member after the conductive elements 13 or traces are etched on the support member 5.
  • the backside barrier 6 can be a structure which is bonded on the support member 5.
  • the support member 5 and the backside barrier 6 are formed by one piece of material, for example by means of sintering process.
  • the front and back side barrier 4, 6 can be a solid member, 96% alumina for example, or an elastomer (flexible member), such as dispensed Sifel 604 adhesive.
  • the barriers 4, 6 can be processed in a discrete dispense and cure step or co-cured with the respective protective members 2, 11.
  • the through hole 7 in the support member 5 can have edges which are parallel to each other and perpendicular to both the front side 3 and backside 9 of the support member 5.
  • the area of the surface of the backside 9 of the support member 5 encompassed by the backside barrier 6 is larger than the area of the through hole 7 in the surface of the backside 9 of the support member 5.
  • a change in temperature will result in expansion or contraction of the protective member 2 in the pressure channel 10.
  • Adhesion of protective member 2 to the side walls will result in stress due to the thermal expansion or contraction.
  • the shape of a transition surface 12 from the backside surface 9 of the support member 5 to the surface of the through hole 7 will determine the transfer of thermal stress to the sensing element 1.
  • the thermal stress of the protective member 2 in the pressure channel 10 formed by the through hole 7 and enclosed area 8 of the backside barrier 6 could further be improved by having a through hole 7 which cross section widens from the front side 3 to the backside 9, in other words which cross section widens with increases of distance from the sensing element 1.
  • This feature has further the advantage that it provides a pressure channel which introduces less mechanical stress on the sensing element 1 due to different temperature dependent coefficients of expansion of the used materials.
  • Figure 3 shows a perspective view of the front side of a pressure sensor module assembly 30.
  • the support member is a ceramic PWB on which conductive elements or traces 13 are etched.
  • the sensing element 1 is electrically connected to conductive elements 13 by means of bonding wires 14.
  • a front side barrier 4 is attached to the front side of the support member 5.
  • the conductive elements 13 pass under the front side barrier 4 to electronic circuitry 23 for converting electrical signals obtained from the sensing element 1 into a signal indicative of the measured differential pressure.
  • Fig. 4 shows a top plane view of a ceramic substrate 31 in which a plurality of individual ceramic support members 32 have been laser cut and scribed for use in a pressure sensor module as shown in figures 1 - 3 .
  • the ceramic substrate is suitable for batch processing.
  • References 33 indicate laser scribe lines for separating of the individual ceramic support members 32.
  • Each individual support member 32 comprises a through hole 34 in the ceramic.
  • the through hole 34 is provided for accessing application pressure to reach a sensing element surface that covers the through hole 34 at one side of the ceramic support member 32.
  • the through holes 34 can be formed there through by laser processing or green state forming, wherein the hole 34 is formed during a sintering process forming the ceramic substrate 31.
  • ceramic edge conditions of a ceramic member are changed to improve the robustness to acid for use in acidic environments such as diesel engine exhaust by subjecting the ceramic member to an annealing process to anneal (temperature and time) the laser cut surface to convert the laser subjected surface from the more vulnerable surface texture and/or ceramic phase(s) to more robust surface texture and/or phase(s) of the ceramic.
  • Figure 5 shows a view of one ceramic member having a standard laser cut through hole processed without annealing after being subjected to an acid test that shows evidence 50 of chemical attack on the edges of the ceramic member.
  • Ceramic substrate members can be formed as follows: Take 96% Al 2 0 3 ceramic substrate member (tape cast or roll compacted).
  • Emulsion applied to control slag produced in laser cutting process Emulsion applied to control slag produced in laser cutting process.
  • Scribe formation processed in the ceramic substrate member for singularization at a later stage (pulsed laser cutting with CO2 laser).
  • the annealing process comprises the following steps:
  • Control sample Standard laser cut through hole formed in 96% alumina ceramic substrate members with MEMS die attached and Sifel (a registered trademark of Shin-Etsu for electronic potting material) 8070 gel filled in backside of the ceramic through hole/backside of the MEMS die.
  • Annealed test sample Standard laser cut through hole formed in ceramic substrate member as in control sample but which was additionally subjected to 1300 deg C for one hour as described above. MEMS die attached and Sifel 8070 gel filled in backside of the ceramic through hole/backside of the MEMS die.
  • Test samples were immersed in a jar of 1.0 pH acid mixture comprising mainly nitric, sulfuric, acetic and formic acids. The samples were thermally cycled in the jar four times from 25 deg C to 95 deg C back to 25 deg C with one hour dwell at 95 deg C over a total time period of 120 hours. Samples were removed from the acid, rinsed, inspected and images captured as shown in figures 5 and 6 .
  • Figure 6 shows a view of a ceramic member also having a standard laser cut through hole but processed with post annealing to improve the surface texture and/or promote the development of more acidic robust phase formation of the ceramic and showing no evidence of chemical attack on the edges of the ceramic member after being subjected to the same acid test.
  • a secondary machining operation, chemical etching or chemical treatment may be employed to improve surface texture and/or remove or reduce the more vulnerable phases of the ceramic member.
  • Green state forming of the through hole in place of laser cutting may also be used with or without a secondary annealing, machining, chemical etching or other chemical treatment to prevent or reduce the formation of the more vulnerable phases of the ceramic member.
  • Figure 7 illustrates dimension requirements with respect to the protective member 2 at the backside 9 of the support member 5.
  • the protective member 2 has a concave meniscus in response to the surface of the back side barrier 6.
  • the bottom of the meniscus defines the minimum thickness d1 of the protective member with respect to the sensing element 1.
  • d1 is the minimum distance between the exhaust gas and the surface of the sensing element at the backside 9 through the protective member 2.
  • distance d2 is the minimum distance between the surface of the sensing element 1 covered by the backside protective member 2 and a plane coinciding with the backside of the support member 9. It has been found that an attack by the exhaust gasses on the protective member 2 in the through hole 7, i.e.
  • the presence of water pockets is reduced significantly if the minimum thickness d1 is equal to or larger than d2. This requirement ensures that the surface of the backside 9 of the support member 5 between backside barrier 6 is covered with some protective gel. As the first indications of degradation of the protective member are found in the protective member 2 near the position where meniscus touches the backside barrier, it will take more time before the protective member in the through hole 7 is degraded. This extends the lifetime of the pressure sensor.
  • a pressure sensor arrangement can comprises only the first pressure chamber 24 having an inlet 21 to allow a pressurized acidic fluid to access the first pressure chamber 24.
  • the pressure is acting through the through hole 7 on one side of the sensing element 1.
  • a predefined and conditioned pressure is acting on the other side of the sensing element.
  • This predefined and conditioned pressure is from a non-acidic environment. This allows us to use less expensive materials for the bonding wires 14 and electrically conductive elements 13.
  • no front side barrier 4 and front side protective member 11 is needed to protect the front side 3 of the pressure sensor module 30 for an acidic and contaminated environment.
  • Such a pressure sensor module has the advantage that it can be manufactured and tested before it is finally placed in a sensor housing.
  • the alternative geometry provides an improved pressure sensor module with improved robustness to acidic conditions on the backside of the sensor module.
  • This is accomplished by adding a gel dam or barrier to the backside of the support member and optimizing the shape and/or dimensions of the pressure channel and the amount of gel.
  • the gel dam enables us 1) to increase the ratio of the gel surface versus the gel height, i.e. the minimum distance between the exhaust gas and the sensing element, 2) to increase the distance between the meniscus and the sensing element, 3) to increase the distance between the points where the meniscus of the gel touches the side wall of the pressure channel and the sensing element, and 4) to eliminate possible nucleation sites in the gel in the through hole.
  • Each of these improves the robustness of the pressure sensor module to acidic conditions such as those found in exhaust environments.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Claims (13)

  1. Drucksensormodul zur Verwendung in einem Drucksensor, wobei das Drucksensormodul umfasst:
    ein Sensorelement (1), das an einer Vorderseite (3) eines Trägerelements (5) montiert ist;
    wobei das Trägerelement (5) ein Loch (7) durch das Trägerelement (5) von der Vorderseite (3) zu einer Rückseite (9) umfasst und das Sensorelement (1) das Loch (7) an der Vorderseite (3) abdeckt;
    eine rückseitige Barriere (6) an der Rückseite (9) des Trägerelements (5), die eine Oberfläche der Rückseite (9) des Trägerelements (5) umrandet und einen geschlossenen Bereich (8) bildet, wobei der geschlossene Bereich (8) und das Loch (7) einen Druckkanal (10) bilden und
    ein rückseitiges Schutzelement (2), das das Loch (7) und zumindest teilweise den eingeschlossenen Bereich (8) füllt, dadurch gekennzeichnet, dass der Übergang (12) der Oberfläche des Lochs (7) zur Rückseite (9) sanft ist, und
    wobei das Trägerelement (5) ein keramisches PWB (gedruckte Leitplatte) mit einem elektrisch leitfähigen Element (13) ist, das an der Vorderseite (3) vorgesehen und elektrisch mit dem Sensorelement (1) verbunden ist.
  2. Drucksensormodul nach Anspruch 1, wobei sich ein Querschnitt des Lochs (7) von der Vorderseite (3) zu der Rückseite (9) erweitert.
  3. Drucksensormodul nach einem der Ansprüche 1-2, wobei die rückseitige Barriere (6) an dem Trägerelement (5) befestigt ist.
  4. Drucksensormodul nach einem der Ansprüche 1-3, wobei das Trägerelement (5) und die rückseitige Barriere (6) aus einem Stück Material gebildet sind.
  5. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei das elektrisch leitfähige Element (13) Edelmetalle umfasst.
  6. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei das Sensorelement (1) ein Differenzdruck-Sensorelement ist.
  7. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei das Sensorelement (1) ein MEMS-Differenzdrucksensorelement ist.
  8. Drucksensormodul nach Anspruch 6, wobei der Sensor ferner Folgendes umfasst:
    eine vorderseitige Barriere (4), die das Sensorelement (1) umrandet und
    ein vorderseitiges Schutzelement (11), das eine elektrisch isolierende Eigenschaft aufweist und das Sensorelement (1) und die Vorderseite zwischen der vorderseitigen Barriere (4) abdeckt.
  9. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei der geschlossene Bereich (8) auf der Rückseite (9) innerhalb der rückseitigen Barriere (6) größer ist als der Bereich des Lochs (7) in dem Trägerelement (5).
  10. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei die minimale Dicke (d1) des das Sensorelement (1) abdeckenden rückseitigen Schutzelements (2) größer ist als der minimale Abstand (d2) zwischen der Oberfläche des Sensorelements (1), das durch das rückseitige Schutzelement (2) abgedeckt ist, und einer Ebene, die sich mit der Rückseite des Trägerelements (9) deckt.
  11. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei die Kanteneigenschaften des Durchgangslochs (7) durch ein Verfahren verbessert wurden, das die folgenden Schritte umfasst:
    Erhöhen der Temperatur des Trägers mit einer ausgewählten Geschwindigkeit von einer Umgebungstemperatur von etwa 25°C auf etwa 1300°C +/- 100°C,
    Halten der Temperatur bei etwa 1300°C für etwa eine Stunde und
    Verringern der Temperatur des Keramikelements mit einer ausgewählten Geschwindigkeit auf die Umgebungstemperatur.
  12. Drucksensormodul nach einem der vorhergehenden Ansprüche, wobei das Trägerelement (5) mittels eines Spritzgussverfahrens hergestellt ist, wobei das Loch (7) in dem Trägerelement (5) mittels einer Form ausgebildet ist.
  13. Drucksensoranordnung, umfassend ein Gehäuse (20) und ein Drucksensormodul (30) nach einem der vorhergehenden Ansprüche.
EP08168746.9A 2008-07-31 2008-11-10 Drucksensor zur Druckmessung in einem Medium Active EP2184594B1 (de)

Priority Applications (4)

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US12/504,006 US7992441B2 (en) 2008-07-31 2009-07-16 Pressure sensor for measuring pressure in a medium
JP2009176336A JP2010038916A (ja) 2008-07-31 2009-07-29 媒体の圧力を測定する圧力センサ
CN200910211604XA CN101685037B (zh) 2008-07-31 2009-07-31 用于测量介质中压力的压力传感器
KR1020090070809A KR101593691B1 (ko) 2008-07-31 2009-07-31 매체 내의 압력을 측정하기 위한 압력 센서

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Publication number Priority date Publication date Assignee Title
US8230743B2 (en) * 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
EP2554968B1 (de) 2011-08-01 2019-01-16 Sensata Technologies, Inc. Sensorsystem zur Messung des Differenzdrucks
EP3311118B1 (de) * 2015-06-19 2022-06-01 Merit Medical Systems, Inc. Druckanschlüsse und zugehörige verfahren
CN107588889A (zh) * 2017-09-05 2018-01-16 武汉飞恩微电子有限公司 一种耐流体冰冻的介质隔离封装压力传感器

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JP2006343276A (ja) * 2005-06-10 2006-12-21 Denso Corp 圧力センサ

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US5741975A (en) * 1996-07-31 1998-04-21 Motorola, Inc. Media isolated differential pressure sensor and fluid injection method
US6581468B2 (en) 2001-03-22 2003-06-24 Kavlico Corporation Independent-excitation cross-coupled differential-pressure transducer
JP2006047190A (ja) * 2004-08-06 2006-02-16 Denso Corp 圧力センサ
JP4556784B2 (ja) 2005-06-27 2010-10-06 株式会社デンソー 圧力センサ
JP4940786B2 (ja) * 2006-06-29 2012-05-30 株式会社デンソー 圧力センサ

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JP2006343276A (ja) * 2005-06-10 2006-12-21 Denso Corp 圧力センサ

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EP2184594A3 (de) 2011-01-26

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