EP2179443A1 - Unit and production of a unit - Google Patents

Unit and production of a unit

Info

Publication number
EP2179443A1
EP2179443A1 EP08774783A EP08774783A EP2179443A1 EP 2179443 A1 EP2179443 A1 EP 2179443A1 EP 08774783 A EP08774783 A EP 08774783A EP 08774783 A EP08774783 A EP 08774783A EP 2179443 A1 EP2179443 A1 EP 2179443A1
Authority
EP
European Patent Office
Prior art keywords
component
sintering
substrate
recess
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08774783A
Other languages
German (de)
French (fr)
Inventor
Daniel Wolde-Giorgis
Thomas Kalich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2179443A1 publication Critical patent/EP2179443A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Definitions

  • the invention relates to an assembly comprising a substrate and at least one component attached thereto by sintering with a sintering agent, in particular sintering paste.
  • the invention relates to a method for producing an assembly with a substrate and at least one by sintering with a sintering agent, in particular sintered paste, attached thereto component.
  • the sintering agent is first applied to the planar substrate. Subsequently, the component is applied to the sintering agent or pressed into the sintering agent, which due to lack of adhesive properties sufficient prefixing of the component is not guaranteed.
  • the sintering process itself requires pressurization in order to ensure sufficient contact of the colloids contained in the sintering agent with each other and with the substrate and the component.
  • the pressure is realized via a soft, provided with component-specific impressions silicone stamp. The stamp is used to align and fix the assembly consisting of the substrate, the sintering agent and the component for the sintering process.
  • the embossing of the stamp allows an isostatic / quasi-isostatic pressurization of the component. Due to the poor adhesive properties of the sintering paste, however, it may happen that the component already slips out of its intended position before or during initiation of the pressure force and / or that part of the sintering agent is squeezed out of the position to be joined and adheres to the stamp, which is too one increased rejection and carryover of sintering agent leads to the stamp.
  • the sintering agent is arranged in a recess of the substrate which accommodates the component at least in regions. It is therefore provided that the substrate has a recess which receives the component at least in regions, wherein in the recess, the sintering agent for the sintering or fastening operation is arranged in the recess. Since the component is now located in the recess of the substrate, it is possible to position the component on the substrate so that it does not leave its intended position before or during the sintering process. Furthermore, it is prevented by the formation of the recess in the substrate that the sintering agent introduced therein when introducing the
  • Compressive force is squeezed out of the site to be joined and / or adhering to the pressure force applying stamp.
  • the depression particularly preferably has an outline which essentially corresponds to the contour of the component.
  • the depression has areas (catchment spaces) into which excess sintering agent can escape when the pressure force is introduced.
  • the stamp surface preferably yielding elastically, so that a uniform (isostatic) pressure distribution is ensured. The positioning and alignment of the component is ensured by the recess.
  • the sintering agent is a silver sintered paste, which expediently consists of chemically stabilized silver colloids.
  • the sintering agent is a sintered solid.
  • the stabilizing constituents of the paste are burned out so that the silver colloids come into direct contact with each other and with the material of the component and the substrate.
  • the component is an electrical / electronic component, in particular a line semiconductor, such as a MOSFET.
  • the substrate is a stamped grid or a
  • the sintering agent is introduced into a recess of the substrate receiving the component at least in regions. It is thus provided that the sintering agent is first introduced into the recess and then the component, wherein the component is placed or pressed onto the sintering agent. Of course, it would also be conceivable that the component carries the sintering agent with it.
  • a stamp having a flat stamp surface is advantageously used, wherein the stamp surface is elastically deformable, so that when applying the sintering pressure, the component can be pressed into the stamp at least partially. This ensures on the one hand that a uniform pressure distribution is applied to the component and a displacement of the component is prevented.
  • a silicone stamp is used for this purpose.
  • the recess is made such that its outline corresponds substantially to the contour of the component, so that the component can not be moved out of the recess and can be clearly aligned or positioned by the outline of the depression on or on the substrate.
  • the sintering agent used is a silver sintering paste which expediently comprises silver colloids.
  • a stamped grid or a printed circuit board is used as the substrate.
  • the component is arranged in a depression of the stamped grid or the printed circuit board in which the sintering agent or the preferred silver sintering paste has previously been introduced.
  • the stamp which is advantageously designed as a silicone stamp
  • the silver sintering paste or the sintering agent can not leak undefined on the substrate, so that, for example, no sintering agent hangs on the stamp.
  • FIG. 2 shows an embodiment of an advantageous method for
  • Figure 3 shows a substrate of the assembly
  • FIG. 4 shows the substrate of the module fitted with a component.
  • FIG. 1 shows, in a schematically illustrated embodiment, an advantageous assembly 1.
  • DBC Direct Bonded Copper
  • the advantageous assembly 1 allows the safe creation of a silver-sintered connection, which allows easy positioning of the component 3 on the substrate 5 and also prevents carryover of sintering agent.
  • the substrate 5 has on a surface 6 a recess 7 into which the component 3 or the power semiconductor 2 can be introduced.
  • a sintering agent 8 which is formed as a silver sintered paste 9, arranged so that the component 3 is applied during assembly on the silver sintered paste 9 in the recess 7.
  • FIG. 3 shows the substrate 5 in a plan view of the surface 6.
  • the recess 7 formed in the substrate 5 in this case has a substantially quadratic contour 10, which advantageously corresponds substantially to the contour of the component 3 / power semiconductor 2, so that the component 3 is positioned and aligned by placing it in the recess 7 on the substrate 5, as shown in FIG.
  • FIG. 4 shows the substrate 5 from FIG. 3 with the power semiconductor 2 or component 3 introduced into the recess 7.
  • the alignment of the component 3 on the substrate 5 can be recognized by means of the recess 7.
  • the component 3 is acted upon by a punch 11 with a compressive force in the direction of the arrow 12.
  • the punch 11 has a flat in the unloaded state stamp surface 13 which is elastically deformable, so that upon application of the component 3, as shown in Figure 2, partially pressed into the punch 11. Due to the elastic design of the flat stamp surface 13 is a quasi-isostatic
  • the punch 11 presses the assembly 1 for generating the necessary pressure force for the sintering operation against a counter plate 14th
  • the recess 7 is advantageously formed so deep that it can accommodate a desired amount of sintering agent 8 / silver sintering paste 9 and the component 3 at least partially.
  • any common substrate type come into question, wherein an upper-side metallization 15 must be sufficiently thick in order to realize sufficient current carrying capacity at the desired amount of silver sintered paste 9 can.
  • the printed circuit board 4 shown in section in FIGS. 1 and 2 has, in addition to the metallization 15, a further metallization 16 which is arranged on the opposite side of a substrate carrier 17 carrying the metallizations 15 and 16.
  • the metallizations 15, 16 are in this case formed as conductor tracks.
  • the component 3 Due to the advantageous recess 7, the component 3 also retains its position during the sintering process when the component 3 is subjected to the sintering pressure force. In addition, it is prevented that the silver sintered paste 9 exits uncontrollably on the substrate 5. Through the recess 7, the silver sintered paste 9 is held in position.
  • the depression 7 causes the component 3 to be movable only in the frame defined by the outline 10 of the depression 7, despite the poor adhesive property of the silver sintering paste 9. As a result, the component 3 is optimally positioned even under process pressure.
  • Extensive "taboo zones” can therefore be dispensed with in the context of a circuit layout and a reduction in area of the entire substrate 5 can be achieved Moreover, elaborate fixings of the component 3 can be dispensed with by means of a punch which is difficult to position and has an impression corresponding to the component 3
  • the stamp 11 shown schematically in FIG. 2 is advantageously designed as a silicone stamp in order to ensure elastic resilience of the flat stamp surface 13.
  • the proposed assembly 1 and the advantageous method significantly increase the process reliability during production and thus ensure series process capability.
  • the bulges 19 may be conditioned by the system.
  • these are also introduced, if this is not the case, to a
  • Substrate 5 of course, any other substrate, such as a stamped grid, are used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a unit (1) having a substrate (5) and at least one component (3) mounted thereon by sintering using a sintering agent (8), particularly sintering paste. According to the invention, the sintering agent (8) is disposed in a depression (7) of the substrate (5) at least partially receiving the component (3). The invention further relates to a method for producing a unit having a substrate and at least one component mounted thereon by sintering using a sintering agent, particularly sintering paste. According to the invention, the sintering agent is placed in a depression of the substrate at least partially receiving the component.

Description

Beschreibung description
Titel Baugruppe sowie Herstellung einer BaugruppeTitle Assembly and manufacture of an assembly
Die Erfindung betrifft eine Baugruppe mit einem Substrat und mindestens einem durch Sintern mit einem Sintermittel, insbesondere Sinterpaste, daran befestigten Bauteil.The invention relates to an assembly comprising a substrate and at least one component attached thereto by sintering with a sintering agent, in particular sintering paste.
Ferner betrifft die Erfindung ein Verfahren zur Herstellung einer Baugruppe mit einem Substrat und mindestens einem durch Sintern mit einem Sintermittel, insbesondere Sinterpaste, daran befestigten Bauteil.Furthermore, the invention relates to a method for producing an assembly with a substrate and at least one by sintering with a sintering agent, in particular sintered paste, attached thereto component.
Stand der TechnikState of the art
Aus dem Stand der Technik sind Baugruppen sowie Verfahren zur Herstellung von Baugruppen der eingangs genannten Art bekannt. Bei der Herstellung wird das Sintermittel zunächst auf das ebene Substrat aufgebracht. Anschließend wird das Bauteil auf das Sintermittel aufgebracht beziehungsweise in das Sintermittel eingedrückt, wobei aufgrund mangelnder adhäsiver Eigenschaften eine ausreichende Vorfixierung des Bauteils nicht gewährleistet ist. Der Sinterprozess selbst erfordert eine Druckbeaufschlagung, um einen ausreichenden Kontakt der in dem Sintermittel enthaltenen Kolloide untereinander sowie zu dem Substrat und dem Bauteil zu gewährleisten. Der Druck wird dabei über einen weichen, mit bauteilspezifischen Einprägungen versehenen Silikonstempel realisiert. Durch den Stempel wird die Baugruppe bestehend aus dem Substrat, dem Sintermittel und dem Bauteil für den Sinterprozess zueinander ausgerichtet und fixiert. Die Einprägung des Stempels erlaubt dabei eine isostatische/ quasi-isostatische Druckbeaufschlagung des Bauteils. Aufgrund der schlechten adhäsiven Eigenschaften der Sinterpaste kann es jedoch geschehen, dass das Bauteil bereits vor oder beim Einleiten der Druckkraft aus seiner vorgesehenen Position verrutscht und/oder dass ein Teil des Sintermittels aus der zu fügenden Stelle herausgequetscht wird und an dem Stempel haftet, was zu einem erhöhten Ausschuss und einer Verschleppung von Sintermittel an dem Stempel führt.From the prior art assemblies and methods for producing assemblies of the type mentioned are known. During production, the sintering agent is first applied to the planar substrate. Subsequently, the component is applied to the sintering agent or pressed into the sintering agent, which due to lack of adhesive properties sufficient prefixing of the component is not guaranteed. The sintering process itself requires pressurization in order to ensure sufficient contact of the colloids contained in the sintering agent with each other and with the substrate and the component. The pressure is realized via a soft, provided with component-specific impressions silicone stamp. The stamp is used to align and fix the assembly consisting of the substrate, the sintering agent and the component for the sintering process. The embossing of the stamp allows an isostatic / quasi-isostatic pressurization of the component. Due to the poor adhesive properties of the sintering paste, however, it may happen that the component already slips out of its intended position before or during initiation of the pressure force and / or that part of the sintering agent is squeezed out of the position to be joined and adheres to the stamp, which is too one increased rejection and carryover of sintering agent leads to the stamp.
Offenbarung der ErfindungDisclosure of the invention
Erfindungsgemäß ist vorgesehen, dass das Sintermittel in einer das Bauteil zumindest bereichsweise aufnehmenden Vertiefung des Substrats angeordnet ist. Es ist also vorgesehen, dass das Substrat eine Vertiefung aufweist, die das Bauteil zumindest bereichsweise aufnimmt, wobei in der Vertiefung das Sintermittel für den Sinter- beziehungsweise Befestigungsvorgang in der Vertiefung angeordnet ist. Da sich das Bauteil nunmehr in der Vertiefung des Substrats befindet, ist es möglich das Bauteil auf dem Substrat zu positionieren, sodass dieses vor oder beim Sintervorgang nicht seine vorgesehene Position verlässt. Weiterhin wird durch die Ausbildung der Vertiefung in dem Substrat verhindert, dass das darin eingebrachte Sintermittel beim Einleiten derAccording to the invention, it is provided that the sintering agent is arranged in a recess of the substrate which accommodates the component at least in regions. It is therefore provided that the substrate has a recess which receives the component at least in regions, wherein in the recess, the sintering agent for the sintering or fastening operation is arranged in the recess. Since the component is now located in the recess of the substrate, it is possible to position the component on the substrate so that it does not leave its intended position before or during the sintering process. Furthermore, it is prevented by the formation of the recess in the substrate that the sintering agent introduced therein when introducing the
Druckkraft aus der zu fügenden Stelle herausgequetscht wird und/oder an dem die Druckkraft aufbringenden Stempel haftet.Compressive force is squeezed out of the site to be joined and / or adhering to the pressure force applying stamp.
Besonders bevorzugt weist dazu die Vertiefung einen Umriss auf, der im Wesentlichen der Kontur des Bauteils entspricht. Vorteilhafterweise weist die Vertiefung Bereiche (Auffangräume) auf, in die überschüssiges Sintermittel ausweichen kann, wenn die Druckkraft eingeleitet wird. Zum Aufbringen der Druckkraft wird zweckmäßigerweise ein Stempel mit einer ebenen Stempelfläche verwendet, wobei die Stempelfläche bevorzugt elastisch nachgibt, sodass eine gleichmäßige (isostatische) Druckverteilung gewährleistet ist. Die Positionierung und Ausrichtung des Bauteils wird dabei durch die Vertiefung gewährleistet.For this purpose, the depression particularly preferably has an outline which essentially corresponds to the contour of the component. Advantageously, the depression has areas (catchment spaces) into which excess sintering agent can escape when the pressure force is introduced. To apply the compressive force, it is expedient to use a stamp with a flat stamp surface, the stamp surface preferably yielding elastically, so that a uniform (isostatic) pressure distribution is ensured. The positioning and alignment of the component is ensured by the recess.
Vorteilhafterweise ist das Sintermittel eine Silber-Sinterpaste, die zweckmäßigerweise aus chemisch stabilisierten Silber-Kolloiden besteht. Alternativ ist das Sintermittel ein Sinterfeststoff. Bei dem Fügeprozess beziehungsweise Sinterprozess werden die stabilisierenden Bestandteile der Paste ausgebrannt, sodass die Silber-Kolloide untereinander und mit dem Material des Bauteils und des Substrats in direkten Kontakt kommen. Durch festkörperdiffusive Vorgänge bildet sich bereits bei Temperaturen um 2500C eine hochtemperaturstabile Verbindung aus, die bezüglich ihrer Wärmeleitfähigkeit, Stabilität, Plastizität und Versprödung wesentlich günstigere Eigenschaften als zum Beispiel Zinn-Silber-Lotverbindungen aufweist. Die Silber-Sinterverbindung kann dabei bei wesentlich geringeren Temperaturen als ihr Schmelzpunkt verarbeitet werden.Advantageously, the sintering agent is a silver sintered paste, which expediently consists of chemically stabilized silver colloids. Alternatively, the sintering agent is a sintered solid. In the joining process or sintering process, the stabilizing constituents of the paste are burned out so that the silver colloids come into direct contact with each other and with the material of the component and the substrate. By festkörperdiffusive processes forms at temperatures around 250 0 C, a high-temperature stable compound, with respect to their thermal conductivity, Stability, plasticity and embrittlement has much more favorable properties than, for example, tin-silver solder joints. The silver-sintered compound can be processed at much lower temperatures than its melting point.
Nach einer Weiterbildung der Erfindung ist das Bauteil ein elektrisches/elektronisches Bauteil, insbesondere ein Leitungshalbleiter, wie zum Beispiel ein MOSFET.According to a development of the invention, the component is an electrical / electronic component, in particular a line semiconductor, such as a MOSFET.
Weiterhin ist vorgesehen, dass das Substrat ein Stanzgitter oder eineIt is further provided that the substrate is a stamped grid or a
Leiterplatte, insbesondere ein DBC-Substrat (DBC = Direct Bonded Copper = direkt beschichtetes Kupfer), ist.Circuit board, in particular a DBC substrate (DBC = Direct Bonded Copper = direct coated copper), is.
Bei dem erfindungsgemäßen Verfahren wird das Sintermittel in eine das Bauteil zumindest bereichsweise aufnehmende Vertiefung des Substrats eingebracht. Es ist also vorgesehen, dass zunächst in die Vertiefung das Sintermittel eingebracht wird und anschließend das Bauteil, wobei das Bauteil auf das Sintermittel gelegt beziehungsweise eingedrückt wird. Natürlich wäre es auch denkbar, dass das Bauteil das Sintermittel mit sich führt.In the method according to the invention, the sintering agent is introduced into a recess of the substrate receiving the component at least in regions. It is thus provided that the sintering agent is first introduced into the recess and then the component, wherein the component is placed or pressed onto the sintering agent. Of course, it would also be conceivable that the component carries the sintering agent with it.
Zum Aufbringen eines Sinter-Drucks wird vorteilhafterweise ein Stempel mit einer ebenen Stempelfläche verwendet, wobei die Stempelfläche elastisch verformbar ausgebildet ist, sodass beim Aufbringen des Sinterdrucks das Bauteil zumindest bereichsweise in den Stempel eingedrückt werden kann. Dadurch wird zum Einen gewährleistet, dass eine gleichmäßige Druckverteilung auf das Bauteil aufgebracht und ein Verschieben des Bauteils verhindert wird. Vorteilhafterweise wird hierzu ein Silikonstempel verwendet.To apply a sintering pressure, a stamp having a flat stamp surface is advantageously used, wherein the stamp surface is elastically deformable, so that when applying the sintering pressure, the component can be pressed into the stamp at least partially. This ensures on the one hand that a uniform pressure distribution is applied to the component and a displacement of the component is prevented. Advantageously, a silicone stamp is used for this purpose.
Wobei vorteilhafterweise die Vertiefung derart gefertigt wird, dass ihr Umriss im Wesentlichen der Kontur des Bauteils entspricht, sodass das Bauteil nicht aus der Vertiefung heraus verschoben werden kann und durch den Umriss der Vertiefung auf dem beziehungsweise an dem Substrat eindeutig ausgerichtet beziehungsweise positioniert werden kann. Vorteilhafterweise wird als Sintermittel eine Silber-Sinterpaste verwendet, die zweckmäßigerweise Silber-Kolloide aufweist.Advantageously, the recess is made such that its outline corresponds substantially to the contour of the component, so that the component can not be moved out of the recess and can be clearly aligned or positioned by the outline of the depression on or on the substrate. Advantageously, the sintering agent used is a silver sintering paste which expediently comprises silver colloids.
Weiter ist vorgesehen, dass als Bauteil ein elektrisches/elektronisches Bauteil, insbesondere ein Leistungshalbleiter, wie zum Beispiel ein MOSFET oder ein IGBT (Insulated Gate Bipolar Transistor = Bipolartransistor mit isolierender Gate- Elektrode), verwendet wird.It is further provided that the component is an electrical / electronic component, in particular a power semiconductor, such as a MOSFET or an IGBT (Insulated Gate Bipolar Transistor = bipolar transistor with insulating gate electrode) is used.
Schließlich ist vorgesehen, dass als Substrat ein Stanzgitter oder eine Leiterplatte verwendet wird. Hierbei wird also das Bauteil in einer Vertiefung des Stanzgitters oder der Leiterplatte angeordnet, in der zuvor das Sintermittel beziehungsweise die bevorzugte Silber-Sinterpaste eingebracht wurde. Beim Beaufschlagen des Bauteils mit dem Stempel, der vorteilhafterweise als Silikonstempel ausgebildet ist, kann die Silber-Sinterpaste beziehungsweise das Sintermittel nicht Undefiniert auf das Substrat austreten, sodass zum Beispiel kein Sintermittel an dem Stempel hängen bleibt.Finally, it is provided that a stamped grid or a printed circuit board is used as the substrate. In this case, therefore, the component is arranged in a depression of the stamped grid or the printed circuit board in which the sintering agent or the preferred silver sintering paste has previously been introduced. When applying the component with the stamp, which is advantageously designed as a silicone stamp, the silver sintering paste or the sintering agent can not leak undefined on the substrate, so that, for example, no sintering agent hangs on the stamp.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Im Folgenden soll die Erfindung anhand einiger Figuren näher erläutert werden. Dazu zeigenIn the following, the invention will be explained in more detail with reference to some figures. Show this
Figur 1 ein Ausführungsbeispiel einer vorteilhaften Baugruppe,1 shows an embodiment of an advantageous assembly,
Figur 2 ein Ausführungsbeispiel eines vorteilhaften Verfahrens zurFigure 2 shows an embodiment of an advantageous method for
Herstellung der Baugruppe,Production of the assembly,
Figur 3 ein Substrat der Baugruppe undFigure 3 shows a substrate of the assembly and
Figur 4 das mit einem Bauteil bestückte Substrat der Baugruppe.FIG. 4 shows the substrate of the module fitted with a component.
Ausführungsform(en) der ErfindungEmbodiment (s) of the invention
Die Figur 1 zeigt in einem schematisch dargestellten Ausführungsbeispiel eine vorteilhafte Baugruppe 1. Die Baugruppe 1 umfasst ein als Leistungshalbleiter 2 ausgebildetes Bauteil 3 sowie ein als Leiterplatte 4 (DBC = Direct Bonded Copper) ausgebildetes Substrat 5. In der Leistungselektronik steigen die Anforderungen an die thermischen, thermomechanischen und elektrischen Eigenschaften der Aufbau- und Verbindungstechnik. Besonders die Anbindung eines Leistungshalbleiters (2) an ein Substrat (5) unterliegt heutzutage dauerhaften Temperaturbelastungen von bis zu 175°C. Heutzutage werden die meisten dieser Verbindungen über eine Lotverbindung aus einer Zinn-Silber- Legierung realisiert. Jedoch zeigen derartige Verbindungen bei höheren Temperaturen schwindende mechanische Eigenschaften, die in Wechselwirkung mit unterschiedlichen Ausdehnungskoeffizienten der Fügepartner (Substrat 5 und Bauteil 3) zu einem Kriechen des Lots und schließlich zu einer Rissbildung in der Lotschicht führen können. Darüber hinaus kann es, bedingt durch die verschiedenen Legierungsbestandteile, zur Ausbildung von spröden Phasen kommen, die diesen Prozess weiter beschleunigen. Zwar ist es denkbar, höher schmelzende Lotlegierungen zu verwenden, jedoch resultiert darauf eine gleichermaßen höhere Verarbeitungs- beziehungsweise Verbindungstemperatur. Jedoch können derartige zum Verbinden notwendige Temperaturen zur Zerstörung der zu verbindenden Bauteile führen.FIG. 1 shows, in a schematically illustrated embodiment, an advantageous assembly 1. The assembly 1 comprises a power semiconductor 2 formed component 3 and as a printed circuit board 4 (DBC = Direct Bonded Copper) formed substrate 5. In power electronics, the demands on the thermal, thermomechanical and electrical properties of the construction and connection technology. Especially the connection of a power semiconductor (2) to a substrate (5) is nowadays subject to permanent temperature loads of up to 175 ° C. Today, most of these compounds are realized via a tin-silver alloy solder joint. However, such compounds show dwindling mechanical properties at higher temperatures which, in interaction with different coefficients of expansion of the joining partners (substrate 5 and component 3), can lead to creep of the solder and finally to crack formation in the solder layer. In addition, due to the different alloy constituents, brittle phases may form which further accelerate this process. Although it is conceivable to use higher melting solder alloys, but it results in a similarly higher processing or bonding temperature. However, such temperatures necessary for bonding can lead to the destruction of the components to be connected.
Bei den sogenannten Silber-SinterverbindungenIn the so-called silver-sintered compounds
(Niedertemperaturverbindungstechnik), die bei wesentlich geringeren Temperaturen im Vergleich zu ihrem Schmelzpunkt erzeugt werden können, wird anstelle des oben genannten Lots ein pastenförmiges Sintermittel eingesetzt, das aus chemisch stabilisierten Ag-Kolloiden besteht.(Low temperature connection technology), which can be produced at much lower temperatures compared to their melting point, instead of the above-mentioned solder, a paste-like sintering agent is used, which consists of chemically stabilized Ag colloids.
Die vorteilhafte Baugruppe 1 erlaubt das sichere Erstellen einer Silber- Sinterverbindung, die ein einfaches Positionieren des Bauteils 3 auf dem Substrat 5 erlaubt und darüber hinaus eine Verschleppung von Sintermittel verhindert.The advantageous assembly 1 allows the safe creation of a silver-sintered connection, which allows easy positioning of the component 3 on the substrate 5 and also prevents carryover of sintering agent.
Das Substrat 5 weist dazu an einer Oberfläche 6 eine Vertiefung 7 auf, in die das Bauteil 3 beziehungsweise der Leistungshalbleiter 2 einbringbar ist. In der Vertiefung 7 ist ein Sintermittel 8, das als Silber-Sinterpaste 9 ausgebildet ist, angeordnet, sodass das Bauteil 3 bei der Montage auf die Silber-Sinterpaste 9 in der Vertiefung 7 aufgebracht wird. Die Figur 3 zeigt das Substrat 5 in einer Draufsicht auf die Oberfläche 6. Die in dem Substrat 5 ausgebildete Vertiefung 7 weist dabei einen im Wesentlichen quadratischen Umriss 10 auf, der vorteilhafterweise im Wesentlichen der Kontur des Bauteils 3/Leistungshalbleiters 2 entspricht, sodass das Bauteil 3 durch Einbringen in die Vertiefung 7 auf dem Substrat 5 positioniert und ausgerichtet wird/ist, wie in der Figur 4 dargestellt.For this purpose, the substrate 5 has on a surface 6 a recess 7 into which the component 3 or the power semiconductor 2 can be introduced. In the recess 7, a sintering agent 8, which is formed as a silver sintered paste 9, arranged so that the component 3 is applied during assembly on the silver sintered paste 9 in the recess 7. FIG. 3 shows the substrate 5 in a plan view of the surface 6. The recess 7 formed in the substrate 5 in this case has a substantially quadratic contour 10, which advantageously corresponds substantially to the contour of the component 3 / power semiconductor 2, so that the component 3 is positioned and aligned by placing it in the recess 7 on the substrate 5, as shown in FIG.
Die Figur 4 zeigt das Substrat 5 aus der Figur 3 mit dem in die Vertiefung 7 eingebrachten Leistungshalbleiter 2 beziehungsweise Bauteil 3. Hierbei ist die Ausrichtung des Bauteils 3 auf dem Substrat 5 mittels der Vertiefung 7 zu erkennen.FIG. 4 shows the substrate 5 from FIG. 3 with the power semiconductor 2 or component 3 introduced into the recess 7. Here, the alignment of the component 3 on the substrate 5 can be recognized by means of the recess 7.
Bei der Herstellung beziehungsweise Montage der Baugruppe 1 wird, wie in der Figur 2 dargestellt, das Bauteil 3 durch einen Stempel 11 mit einer Druckkraft in Richtung des Pfeils 12 beaufschlagt. Der Stempel 11 weist eine im unbelasteten Zustand ebene Stempelfläche 13 auf, die elastisch verformbar ist, sodass beim Beaufschlagen des Bauteils 3 dieses, wie in der Figur 2 dargestellt, bereichsweise in den Stempel 11 eingedrückt wird. Durch die elastische Ausbildung der ebenen Stempelfläche 13 ist eine quasi-isostatischeIn the production or assembly of the assembly 1, as shown in Figure 2, the component 3 is acted upon by a punch 11 with a compressive force in the direction of the arrow 12. The punch 11 has a flat in the unloaded state stamp surface 13 which is elastically deformable, so that upon application of the component 3, as shown in Figure 2, partially pressed into the punch 11. Due to the elastic design of the flat stamp surface 13 is a quasi-isostatic
Druckverteilung auf das Bauteil 3 gewährleistet. Der Stempel 11 drückt dabei die Baugruppe 1 zur Erzeugung der für den Sintervorgang notwendigen Druckkraft gegen eine Gegenplatte 14.Pressure distribution ensured on the component 3. The punch 11 presses the assembly 1 for generating the necessary pressure force for the sintering operation against a counter plate 14th
Die Vertiefung 7 ist vorteilhafterweise derart tief ausgebildet, dass sie eine gewünschte Menge an Sintermittel 8/Silber-Sinterpaste 9 und das Bauteil 3 zumindest bereichsweise aufnehmen kann. Dabei kann für das Substrat 5 jeder gängige Substrattyp in Frage kommen, wobei eine oberseitige Metallisierung 15 genügend dick sein muss, um bei der gewünschten Menge der Silber- Sinterpaste 9 eine ausreichende Stromtragfähigkeit realisieren zu können. Die in den Figuren 1 und 2 im Schnitt dargestellte Leiterplatte 4 weist neben der Metallisierung 15 eine weitere Metallisierung 16 auf, die auf der gegenüberliegenden Seite eines die Metallisierungen 15 und 16 tragenden Substratträgers 17 angeordnet ist. Die Metallisierungen 15, 16 sind hierbei als Leiterbahnen ausgebildet. Durch die vorteilhafte Vertiefung 7 behält das Bauteil 3 auch beim Sintervorgang, wenn das Bauteil 3 mit der Sinter-Druckkraft beaufschlagt wird, seine Position bei. Darüber hinaus wird verhindert, dass die Silber-Sinterpaste 9 unkontrolliert auf das Substrat 5 austritt. Durch die Vertiefung 7 wird die Silber-Sinterpaste 9 in ihrer Position gehalten. Die Vertiefung 7 führt dazu, dass das Bauteil 3 trotz schlechter adhäsiver Eigenschaft der Silber-Sinterpaste 9 nur noch in dem durch den Umriss 10 der Vertiefung 7 definierten Rahmen beweglich ist. Dadurch ist das Bauteil 3 auch unter Prozessdruck optimal positioniert. Im Rahmen eines Schaltungslayouts kann daher auf ausgedehnte „Tabuzonen" verzichtet werden und eine Flächenverkleinerung des gesamten Substrats 5 realisiert werden. Darüber hinaus kann auf aufwendige Fixierungen des Bauteils 3 mittels eines schwer positionierbaren, eine dem Bauteil 3 entsprechende Einprägung aufweisenden Stempels verzichtet werden. Der in der Figur 2 schematisch dargestellte Stempel 11 ist vorteilhafterweise als Silikonstempel ausgebildet, um die elastische Nachgiebigkeit der ebenen Stempelfläche 13 zu gewährleisten. Durch die vorgeschlagene Baugruppe 1 sowie das vorteilhafte Verfahren wird die Prozesssicherheit bei der Herstellung deutlich erhöht und somit die Serienprozesstauglichkeit gewährleistet.The recess 7 is advantageously formed so deep that it can accommodate a desired amount of sintering agent 8 / silver sintering paste 9 and the component 3 at least partially. In this case, for the substrate 5, any common substrate type come into question, wherein an upper-side metallization 15 must be sufficiently thick in order to realize sufficient current carrying capacity at the desired amount of silver sintered paste 9 can. The printed circuit board 4 shown in section in FIGS. 1 and 2 has, in addition to the metallization 15, a further metallization 16 which is arranged on the opposite side of a substrate carrier 17 carrying the metallizations 15 and 16. The metallizations 15, 16 are in this case formed as conductor tracks. Due to the advantageous recess 7, the component 3 also retains its position during the sintering process when the component 3 is subjected to the sintering pressure force. In addition, it is prevented that the silver sintered paste 9 exits uncontrollably on the substrate 5. Through the recess 7, the silver sintered paste 9 is held in position. The depression 7 causes the component 3 to be movable only in the frame defined by the outline 10 of the depression 7, despite the poor adhesive property of the silver sintering paste 9. As a result, the component 3 is optimally positioned even under process pressure. Extensive "taboo zones" can therefore be dispensed with in the context of a circuit layout and a reduction in area of the entire substrate 5 can be achieved Moreover, elaborate fixings of the component 3 can be dispensed with by means of a punch which is difficult to position and has an impression corresponding to the component 3 The stamp 11 shown schematically in FIG. 2 is advantageously designed as a silicone stamp in order to ensure elastic resilience of the flat stamp surface 13. The proposed assembly 1 and the advantageous method significantly increase the process reliability during production and thus ensure series process capability.
Der im Wesentlichen quadratisch ausgebildete Umriss 10 der Vertiefung 7 weist, wie in den Figuren 3 und 4 dargestellt, an seinen Ecken 18 Ausbuchtungen 19, die als Auffangräume 20 dienen, auf. Je nach Herstellungsverfahren können die Ausbuchtungen 19 systemtechnisch bedingt sein. Vorteilhafterweise werden diese jedoch auch dann eingebracht, wenn dies nicht der Fall ist, um einThe substantially square contour 10 of the recess 7, as shown in Figures 3 and 4, at its corners 18 bulges 19, which serve as collecting spaces 20, on. Depending on the manufacturing process, the bulges 19 may be conditioned by the system. Advantageously, however, these are also introduced, if this is not the case, to a
Einbringen des Bauteils 3 in das Substrat 5 zum Einen zu erleichtern, und zum Anderen einen Ausweichraum für überschüssiges Sintermittel 8 zu bieten. Hierdurch kann überschüssiges Sintermittel 8 beziehungsweise Silber- Sinterpaste 9 in die Auffangräume 20 entweichen, ohne dass es/sie auf die Oberfläche 6 des Substrats 5 gelangt. Anstelle der Leiterplatte 4 kann alsIntroduction of the component 3 in the substrate 5 on the one hand to facilitate, and on the other hand to provide a discharge space for excess sintering means 8. As a result, excess sintering agent 8 or silver sintering paste 9 can escape into the collecting spaces 20 without it / it reaching the surface 6 of the substrate 5. Instead of the circuit board 4 can as
Substrat 5 natürlich auch jedes andere Substrat, wie zum Beispiel ein Stanzgitter, verwendet werden. Substrate 5 of course, any other substrate, such as a stamped grid, are used.

Claims

Ansprüche claims
1. Baugruppe mit einem Substrat und mindestens einem durch Sintern mit einem Sintermittel, insbesondere Sinterpaste, daran befestigten Bauteil, dadurch gekennzeichnet, dass das Sintermittel (8) in einer das Bauteil1. assembly comprising a substrate and at least one by sintering with a sintering agent, in particular sintered paste, attached thereto component, characterized in that the sintering means (8) in one of the component
(3) zumindest bereichsweise aufnehmenden Vertiefung (7) des Substrats (5) angeordnet ist.(3) at least partially receiving recess (7) of the substrate (5) is arranged.
2. Baugruppe nach Anspruch 1 , dadurch gekennzeichnet, dass die Vertiefung (7) einen Umriss (10) aufweist, der im Wesentlichen der Kontur des Bauteils (3) entspricht.2. Assembly according to claim 1, characterized in that the recess (7) has an outline (10) which substantially corresponds to the contour of the component (3).
3. Baugruppe nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Sintermittel (8) eine Silber-Sinterpaste (9) oder ein Sinterfeststoff ist.3. Assembly according to one of the preceding claims, characterized in that the sintering means (8) is a silver sintered paste (9) or a sintered solid.
4. Baugruppe nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Bauteil (3) ein elektrisches/elektronisches Bauteil, insbesondere ein Leistungshalbleiter (2) ist.4. Assembly according to one of the preceding claims, characterized in that the component (3) is an electrical / electronic component, in particular a power semiconductor (2).
5. Baugruppe nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Substrat (5) ein Stanzgitter oder eine Leiterplatte (4) ist.5. Assembly according to one of the preceding claims, characterized in that the substrate (5) is a stamped grid or a printed circuit board (4).
6. Verfahren zur Herstellung einer Baugruppe, insbesondere nach einem oder mehreren der vorhergehenden Ansprüche, mit einem Substrat und mindestens einem durch Sintern mit einem Sintermittel, insbesondere Sinterpaste, daran befestigten Bauteil, dadurch gekennzeichnet, dass das Sintermittel in eine das Bauteil zumindest bereichsweise aufnehmende Vertiefung des Substrats eingebracht wird.6. A method for producing an assembly, in particular according to one or more of the preceding claims, comprising a substrate and at least one by sintering with a sintering agent, in particular sintered paste, attached thereto component, characterized in that the sintering means in a component at least partially receiving recess of the substrate is introduced.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, dass zum Aufbringen eines Sinter-Drucks ein Silikonstempel mit einer ebenen Stempelfläche verwendet wird. 7. The method according to claim 6, characterized in that for applying a sintering pressure, a silicone stamp is used with a flat stamp surface.
8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Vertiefung derart gefertigt wird, dass ihr Umriss im Wesentlichen der Kontur des Bauteils entspricht.8. The method according to any one of the preceding claims, characterized in that the recess is made such that its outline corresponds substantially to the contour of the component.
9. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass als Sintermittel eine Silber-Sinterpaste verwendet wird.9. The method according to any one of the preceding claims, characterized in that a silver sintering paste is used as the sintering agent.
10.Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass als Bauteil ein elektrisches/elektronisches Bauteil, insbesondere ein Leistungshalbleiter verwendet wird.10.Verfahren according to any one of the preceding claims, characterized in that the component is an electrical / electronic component, in particular a power semiconductor is used.
11.Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass als Substrat ein Stanzgitter oder eine Leiterplatte, insbesondere ein DBC-Substrat, verwendet wird. 11.Verfahren according to any one of the preceding claims, characterized in that a stamped grid or a printed circuit board, in particular a DBC substrate is used as the substrate.
EP08774783A 2007-08-09 2008-07-04 Unit and production of a unit Withdrawn EP2179443A1 (en)

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DE102007037538A DE102007037538A1 (en) 2007-08-09 2007-08-09 Assembly and manufacture of an assembly
PCT/EP2008/058705 WO2009019091A1 (en) 2007-08-09 2008-07-04 Unit and production of a unit

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JP2010536168A (en) 2010-11-25
US9233436B2 (en) 2016-01-12
US20140001244A1 (en) 2014-01-02
DE102007037538A1 (en) 2009-02-12
WO2009019091A1 (en) 2009-02-12
US8552306B2 (en) 2013-10-08

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