EP2126159A4 - Sn-b plating solution and plating method using it - Google Patents

Sn-b plating solution and plating method using it

Info

Publication number
EP2126159A4
EP2126159A4 EP07860736A EP07860736A EP2126159A4 EP 2126159 A4 EP2126159 A4 EP 2126159A4 EP 07860736 A EP07860736 A EP 07860736A EP 07860736 A EP07860736 A EP 07860736A EP 2126159 A4 EP2126159 A4 EP 2126159A4
Authority
EP
European Patent Office
Prior art keywords
plating
solution
plating solution
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07860736A
Other languages
German (de)
French (fr)
Other versions
EP2126159A1 (en
Inventor
Dong-Nyung Lee
Sang-Beom Kim
Kyoo-Sik Kang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Copper Foil Co Ltd
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Publication of EP2126159A1 publication Critical patent/EP2126159A1/en
Publication of EP2126159A4 publication Critical patent/EP2126159A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C3/00—Electrolytic production, recovery or refining of metals by electrolysis of melts
    • C25C3/30—Electrolytic production, recovery or refining of metals by electrolysis of melts of manganese
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
EP07860736A 2006-12-29 2007-12-28 Sn-b plating solution and plating method using it Withdrawn EP2126159A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20060138526 2006-12-29
KR1020070139768A KR101016415B1 (en) 2006-12-29 2007-12-28 Sn-B plating solution for electroplating and Sn-B electroplating method using it
PCT/KR2007/006952 WO2008082192A1 (en) 2006-12-29 2007-12-28 Sn-b plating solution and plating method using it

Publications (2)

Publication Number Publication Date
EP2126159A1 EP2126159A1 (en) 2009-12-02
EP2126159A4 true EP2126159A4 (en) 2010-06-02

Family

ID=39815105

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07860736A Withdrawn EP2126159A4 (en) 2006-12-29 2007-12-28 Sn-b plating solution and plating method using it

Country Status (7)

Country Link
US (1) US20100038255A1 (en)
EP (1) EP2126159A4 (en)
JP (1) JP5033197B2 (en)
KR (1) KR101016415B1 (en)
CN (1) CN101595248B (en)
TW (1) TWI386523B (en)
WO (1) WO2008082192A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US10072347B2 (en) * 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
CN105887148A (en) * 2016-06-03 2016-08-24 河海大学 Ni-B/SiC CMMA coating for marine equipment and preparation method thereof
CN106011955A (en) * 2016-06-03 2016-10-12 河海大学 Corrosion-resistant and wear-resistant Ni-W/Al2O3 CMMA protective layer for maritime work machinery, and preparation method thereof
CN105908228A (en) * 2016-06-03 2016-08-31 河海大学 Nickel alloy composition modulated multilayer alloy (CMMA) coating and preparation method thereof
CN105908227A (en) * 2016-06-03 2016-08-31 河海大学 Electrochemical preparation method for CMMA structure capable of improving corrosion resistance and abrasion resistance of Ni-B alloy
CN106011956A (en) * 2016-06-03 2016-10-12 河海大学 Electrochemical preparation method for CMMA structure capable of improving corrosion resistance of Ni-W alloy

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB842826A (en) * 1957-11-15 1960-07-27 Du Pont Improvements in or relating to chemical plating
US3063850A (en) * 1959-09-11 1962-11-13 Metal Hydrides Inc Metal plating by chemical reduction with amine boranes
GB1502057A (en) * 1975-07-15 1978-02-22 Sumitomo Electric Industries Tin electro-plating solution
JP2005002368A (en) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd Tin plating bath for preventing whisker
EP1566855A1 (en) * 2002-11-29 2005-08-24 Mitsui Mining & Smelting Co., Ltd. Negative electrode for non-aqueous electrolyte secondary cell and method for manufacture thereof, and non-aqueous electrolyte secondary cell

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US4955909A (en) * 1989-01-31 1990-09-11 Bioplasty, Inc. Textured silicone implant prosthesis
US5207709A (en) * 1991-11-13 1993-05-04 Picha George J Implant with textured surface
CN1094099A (en) * 1994-03-24 1994-10-26 天津大学 The tinned method of a kind of acidity
KR100223320B1 (en) 1996-03-06 1999-10-15 이계철 Sn-pb alloy plating manufacturing method for electric contact
GB9805214D0 (en) * 1998-03-11 1998-05-06 Univ Glasgow Cell adhesion
US6613451B1 (en) * 1998-09-11 2003-09-02 Nippon Mining & Metals Co., Ltd. Metallic material
JP2000144482A (en) * 1998-09-11 2000-05-26 Nippon Mining & Metals Co Ltd Metallic material
JP2000169996A (en) * 1998-09-28 2000-06-20 Nippon Mining & Metals Co Ltd Metallic material
JP2000169997A (en) * 1998-09-28 2000-06-20 Nippon Mining & Metals Co Ltd Metallic material
JP4489232B2 (en) * 1999-06-14 2010-06-23 日鉱金属株式会社 Plating material for connectors
JP4698904B2 (en) * 2001-09-20 2011-06-08 株式会社大和化成研究所 Tin or tin-based alloy plating bath, tin salt and acid or complexing agent solution for building bath, maintenance or replenishment of the plating bath, and electric / electronic parts manufactured using the plating bath
JP3513709B2 (en) * 2001-10-16 2004-03-31 石原薬品株式会社 Preventing tin whiskers by pretreatment
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
JP2004204308A (en) * 2002-12-25 2004-07-22 Nec Semiconductors Kyushu Ltd Lead-free tin alloy plating method
US7332193B2 (en) * 2004-10-18 2008-02-19 Enthone, Inc. Cobalt and nickel electroless plating in microelectronic devices
ES2354045T3 (en) * 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc PROCEDURES WITH SOUND IMPROVED.
US20080275546A1 (en) * 2007-05-03 2008-11-06 Chameleon Scientific Corp Inhibitory cell adhesion surfaces

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB842826A (en) * 1957-11-15 1960-07-27 Du Pont Improvements in or relating to chemical plating
US3063850A (en) * 1959-09-11 1962-11-13 Metal Hydrides Inc Metal plating by chemical reduction with amine boranes
GB1502057A (en) * 1975-07-15 1978-02-22 Sumitomo Electric Industries Tin electro-plating solution
EP1566855A1 (en) * 2002-11-29 2005-08-24 Mitsui Mining & Smelting Co., Ltd. Negative electrode for non-aqueous electrolyte secondary cell and method for manufacture thereof, and non-aqueous electrolyte secondary cell
JP2005002368A (en) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd Tin plating bath for preventing whisker

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
H. SHIMAUSCHI AND AL: "Preparation of Ni-Sn alloys by electroless-deposition method", JOURNAL OF ELECTROCHEMICAL SOCIETY, vol. 141, no. 6, 1 June 1994 (1994-06-01), pages 1471 - 1476, XP002579875 *
MORDECHAY SCLESINGER AND MILAN PAUNOVIC: "Modern electroplating (fouth edition)", 1 February 2000, JOHN WILEY § SONS, article YUN ZHANG AND JOSEPH A. ABYS: "Tin and Tin alloys for lead-free solder", pages: 247 - 261, XP002579876 *
See also references of WO2008082192A1 *

Also Published As

Publication number Publication date
EP2126159A1 (en) 2009-12-02
US20100038255A1 (en) 2010-02-18
TWI386523B (en) 2013-02-21
TW200928006A (en) 2009-07-01
JP2010514932A (en) 2010-05-06
KR20080063177A (en) 2008-07-03
CN101595248A (en) 2009-12-02
KR101016415B1 (en) 2011-02-21
WO2008082192A1 (en) 2008-07-10
JP5033197B2 (en) 2012-09-26
CN101595248B (en) 2011-04-27

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Legal Events

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Effective date: 20100507

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