EP2118629A2 - Procede de fabrication d'un systeme capteur et systeme capteur ainsi obtenu - Google Patents

Procede de fabrication d'un systeme capteur et systeme capteur ainsi obtenu

Info

Publication number
EP2118629A2
EP2118629A2 EP08700276A EP08700276A EP2118629A2 EP 2118629 A2 EP2118629 A2 EP 2118629A2 EP 08700276 A EP08700276 A EP 08700276A EP 08700276 A EP08700276 A EP 08700276A EP 2118629 A2 EP2118629 A2 EP 2118629A2
Authority
EP
European Patent Office
Prior art keywords
sensor
possibly
paste
directly
monitored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08700276A
Other languages
German (de)
English (en)
Inventor
Karola Maier
Mohamed Hassan
Alexander Kraus
Helmut Wenzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT1932007A external-priority patent/AT505033B1/de
Application filed by Individual filed Critical Individual
Publication of EP2118629A2 publication Critical patent/EP2118629A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type

Definitions

  • the invention relates to a method for producing a sensor system for metrological monitoring of elements having at least one sensor in thick-film technology with a line for connection to a measuring system, wherein the at least one sensor is composed of at least one layer of electrically conductive paste and the paste is baked.
  • the present invention relates to a sensor system for metrological monitoring of elements with at least one sensor in thick-film technology with a line for connection to a measuring system, wherein the at least one sensor of at least one layer of a cured under temperature electrically conductive paste is constructed.
  • element in particular load-bearing elements, such as structural parts and structures, for example, bridges.
  • WO 99/26256 A1 describes a method for producing a sensor arrangement in thick film technology.
  • DE 41 31 129 describes a method for baking circuits in thick film technology and an apparatus for performing the method.
  • the known thick film technique can only be applied to substrates whose dimensions fit into the continuous furnace. If the substrate is too large, the layer thickness sensor is indirectly set ⁇ introduced by the paste from which the sensor or the conductor track is produced is applied to a smaller element and baked. This element is then fixed with a Verbin ⁇ -making art, such as, for example, sticking to the desired location.
  • the known sensors for the monitoring of elements, such as structures of bridges, are attached to the elements after production and supplied via a wiring and queried. For this purpose, often own monitoring shafts are provided.
  • Known, realized in thick-film technology sensors detect, for example, strain, pressure, twist, acceleration, humidity or the like.
  • the object of the present invention is to provide an above-mentioned method and a sensor system mentioned above, which allow the application of sensors to elements which are larger than conventional continuous furnaces.
  • the method or sensor system should be feasible or producible as inexpensively as possible. Disadvantages of known methods and sensor systems should be avoided or at least reduced.
  • the object of the invention is achieved in terms of the method in that the at least one sensor is arranged directly on the surface of the element to be monitored by applying the at least one layer of paste to form the at least one sensor directly on the surface of the element and directly on the element is burned.
  • the method according to the invention is characterized in that the sensor is not applied to a substrate in thick-film technology but directly to the surface of the element to be monitored, for example supporting part, where it is directly baked by a mobile device for carrying out the phases of the firing process that a direct thick coating is achieved. Sensors produced by this direct coating thickness can act a structure in the interior by being mounted, for example on the loading ⁇ reinforcement that of a concrete part or einasphaltiert on a sheet metal strip in a road surface vibration measurement.
  • the inventive method the cost of metrological monitoring can be reduced.
  • the Thick-film sensors can be applied to a wide variety of materials, such as metal, glass, stone or the like. to be applied.
  • the connecting line of the at least one sensor is also formed in thick-film technology directly on the surface of the element to be monitored.
  • the production of complex cabling to the sensors and the associated mechanical and electrical problems of the wiring can be avoided.
  • a plurality Senso ⁇ ren be formed directly on the surface of the element to be monitored and connected to one another via a field bus.
  • so-called sensor chains which are connected to one another via the field bus can be implemented using thick-film technology. With the help of such sensor chains vibrations in elements, in particular structures, can be detected.
  • a fieldbus for data communication complex wiring can be omitted.
  • said field bus is preferably formed in thick-film technology directly on the surface of the element to be monitored.
  • elements can be manufactured with the sensors, the connecting cables and the field bus in directly attached thick-film technology.
  • the sensors, possibly the connection lines and possibly the fieldbus can already be installed during the manufacturing process of the respective element, which considerably reduces the costs.
  • each signal can be assigned to the corresponding sensor by the measurement signal of the sensors is superimposed with the respective resonant frequency of the sensor.
  • the paste for the formation of the sensor, possibly the connecting lines and possibly the field bus are preferably by means of a mobile device directly to be monitored Element burned. This mobile device replaces the continuous furnace commonly used in thick film technology.
  • the paste is baked at different temperature zones to about 900 0 C.
  • the paste can also be baked under a protective gas atmosphere.
  • the protective gas atmosphere can be formed, for example, by flushing the paste with nitrogen.
  • the paste for forming the at least one sensor possibly for forming connecting lines and possibly for forming the fieldbus on a matrix and according to the principle of a decal prior to baking on the surface of the monitored element is transmitted.
  • the thick-film elements can be prefabricated and transferred to the respective element before baking.
  • the at least one sensor and, if necessary, connecting lines and the field bus are provided with a protective layer.
  • the object according to the invention is also achieved by an above-mentioned sensor system, in which the at least one sensor is arranged directly on the surface of the element to be monitored. As already mentioned above, this can reduce the costs of metrological monitoring and directly monitor the properties of various elements.
  • the at least one connecting line of the at least one sensor is produced in thick-film technology, and arranged directly on the surface of the element to be monitored.
  • a plurality of sensors may be arranged directly on the surface of the element to be monitored and connected to one another via a field bus. In this way, segments containing a group of sensors or so-called sensor chains can be constructed.
  • the fieldbus is produced in thick-film technology and is arranged directly on the surface of the element to be monitored.
  • each sensor contains a resonant circuit with a different resonant frequency to differentiate the measurement signals.
  • the at least one layer of the uncured paste for forming the at least one sensor, and possibly for forming connecting lines and possibly forming the field bus is arranged on a matrix and transferable to the surface of the element to be monitored according to the principle of a decal, a large part prefabricated the thick-film elements and transferred to the surface of the element to be monitored only before the baking process.
  • the paste for forming the at least one sensor and possibly for forming the connecting lines and possibly for forming the field bus can be formed by an adhesive mixture.
  • Metal-filled adhesive compounds now allow conductive connections to replace soldering.
  • Dielectrics can also be realized by adhesive mixtures.
  • the adhesive mixtures do not serve as a joining technique, but rather as a paste in the sense of thick film technology, in order to enable low coating temperatures. Because of these new gluing applications, not all known thick-film pastes in adhesive form can be realized.
  • the at least one sensor is designed for permanent monitoring.
  • the at least one sensor is connected to an actuator to form a control loop, it is possible to react actively to the sensor signals, in particular during permanent monitoring. In this way, the egg to be monitored can be an intelligent system in a regulatory sense.
  • the at least one sensor can over the at least one sensor, possibly the connecting leads and possibly the fieldbus be a protective layer on ⁇ sorted.
  • the sensors realized in thick film technology are preferably for monitoring the elongation, the pressure, the twist, the acceleration, the temperature, the humidity or the like. educated.
  • the at least one sensor possibly together with the connecting lines and possibly the fieldbus directly to the surface of a supporting element, in particular the structure or structural part, arranged.
  • Figure 1 is a side view of an element during the direct application of the paste in thick film technology according to the screen printing method.
  • FIG. 3 shows the I-beam according to FIG. 2 during the burn-in process
  • Figure 4 is a schematic view of a part of a facade whose elements are provided with thick-film applied sensors.
  • FIG. 5 shows detail V according to FIG. 4 in an enlarged view
  • FIG. 6 shows the schematic view of a turbine wheel with a sensor arranged on a turbine blade in thick film technology
  • 7 shows a diagram of several sensors connected via a field bus (according to Mohamed Hassan).
  • FIG. 8 shows the diagram of the transfer of a paste arranged on a matrix onto the element to be monitored.
  • Fig. 1 shows the direct application of the thick-film paste 2 for producing a thick-film element on an element 1, for example, structural element or structure, in screen printing technique.
  • the paste 2 is applied directly to the element 1 by means of a doctor blade 4 and a photolithographically pretreated screen 3.
  • the application of the paste 2 is done depending on the device to be realized in several layers.
  • the paste 2 is baked after each coating in a baking process.
  • Element 1 is required to withstand the stoving temperature of approx. 800 ° C. Subsequent heat treatment for the regression of microstructural transformations is possible. From the pastes 2 sensors in thick film technology, preferably for the registration of strain, pressure, twist, acceleration, humidity or the like. , will be realized.
  • the paste 2 can also be applied to the surface of the element 1, for example, by the ink-jet method.
  • Fig. 2 shows schematically the application in an I-beam formed element 1, wherein at the top of the element 1 individual sensors 5 are connected via connecting lines 8 with a field bus 6. Via the fieldbus 6, the individual sensors 5 can be interrogated by a PLC (programmable logic controller) or PC card and at the same time be supplied with energy.
  • PLC programmable logic controller
  • a possible mobile device 9 is shown as a replacement of the continuous furnace.
  • This mobile device 9 can be formed, for example, by a copper block acting as a so-called PTI element, which cools with an exponentially decaying temperature profile (PTI element), which is kept at the stoving temperature by a hair dryer or burner 7.
  • the temperature of the mobile device 9 can be controlled via a temperature measuring device 10.
  • By cooling or changing or moving the mobile device tion 9 are on the pastes 2 to form the sensor 5 and the connecting lines 8 and the field bus 6 different temperature zones adjustable.
  • the paste 2 can be enveloped by nitrogen as a protective gas (not shown).
  • the heat application for the baking process via all other known methods (electric, infrared, etc.) is possible.
  • Fig. 4 shows the top view of a part of a facade 11, which may be formed by a plurality of facade elements 12, for example made of glass.
  • the facade elements 12 are mounted via corresponding fastening elements 13.
  • sensors 5 in thick film technology are applied to the surface of the Fassa ⁇ denimplantation 12, possibly along with the connection lines 8 and the field bus 6, is applied, and thus, mechanical stresses in the cladding elements 12 are detected.
  • the ends of the field bus 6 are provided with a connection 14, via which the respective measuring device or a connecting line to the measuring device (not shown) can be connected.
  • FIG. 6 shows the schematic plan view of a turbine wheel 15, wherein a sensor 5 together with connecting line 8 in thick-film technology is arranged on a turbine blade 15 '. In this way, mechanical influences on the turbine blade 15 'can be detected.
  • a group of sensors 5 is combined to form a segment 20 by being connected directly to the field bus 6.
  • the sensors 5 are each connected to an addressing chip in the current state of the art.
  • all sensors contain 5 additional ones Resonant circuit with a characteristic of each sensor 5 resonant frequency, which is superimposed on the measurement signal of the sensor 5.
  • the sensor signals can be assigned to the respectively associated sensor 5 via the fieldbus 6.
  • the direct connection of the sensors 5 without addressing chip makes it possible to run the field bus 6 together with the line node 16 throughout thick-film technology.
  • the resonant frequencies of the resonant circuits of the sensors 5 are preferably in the kHz range in order to limit the frequency-increasing line reflections.
  • the field bus 6, which may be formed by a two-wire line, carries a sum signal of all the sensors 5 of each segment 20, from which the signal belonging to the respective sensor 5 in the field bus node 17 is filtered out.
  • the field bus node 17 evaluates the analog signals of the sensors 5 of a segment 20, digitizes them and carries its own address. Via the address of the fieldbus node 17, this is connected to a conventional bus system 18, such as CAN (Controller Area Network) bus or the like. , connectable and communicates with the bus control.
  • CAN Controller Area Network
  • this can also be used to transmit the signals, so that only one line to implement the fieldbus 6 to the sensors 5 must be performed.
  • FIG. 8 shows an embodiment in which the paste 2 for forming the sensors 5, possibly the connection lines 8 and, if necessary, the field bus 6, are or are mounted on a matrix 19. From this matrix 19, the paste 2 is applied to the surface of the element 1 according to the principle of a decal Mohamed Hassan and then baked. Standardization of such matrices 19 should ensure defined, reproducible paste properties.
  • Prestressed concrete members of a bridge may be mentioned as examples of further applications of the method according to the invention or of the sensor system according to the invention.
  • the bias of the prestressed concrete elements is measured with the sensors applied in thick-film technology and readjusted, for example, by the connection with corresponding actuators.
  • An important application are so-called intelligent railroad tracks, especially switches, where in certain places, such as tunnel junctions or bridge crossings, a permanent monitoring is desired. With consistently welded rails, there is a risk of rail shedding in the event of impermissibly high thermal expansions. These could be recognized by sensors using the method according to the invention in good time.
  • the soil dynamics such as a track superstructure
  • the soil dynamics can be monitored with the help of thick-film sensors, the soil dynamics is disturbed by plant growth and reduces the mobility of the ballast bed or it is stored freezer water, so that the gravel no longer slides back after track relief.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

Procédé de fabrication d'un système capteur pour la surveillance technique par mesure d'éléments (1), en particulier d'éléments d'ouvrage porteur. Ledit système comporte au moins un capteur (5) selon la technologie de la couche épaisse, pourvu d'une ligne (8) pour la liaison avec un système de mesure, ledit capteur (5) étant fabriqué à partir d'au moins une couche d'une pâte électroconductrice (2) et ladite pâte (2) étant cuite. L'objet de la présente invention est la mise au point d'un procédé et plus précisément d'un système capteur dans lequel des éléments (1) qui ne conviendraient pas dans un four à passage continu peuvent être équipés de capteurs (5) selon la technique de la couche épaisse. A cet effet, le capteur (5) est placé directement sur la surface de l'élément à surveiller (1), la (les) couche(s) de pâte (2), destinée(s) à former le (les) capteur(s) et éventuellement aussi les lignes de liaison (8) et un bus de champ (6), étant appliquée(s) directement sur la surface de l'élément à surveiller (1) et cuite(s) directement sur ledit élément (1).
EP08700276A 2007-01-15 2008-01-15 Procede de fabrication d'un systeme capteur et systeme capteur ainsi obtenu Withdrawn EP2118629A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT722007 2007-01-15
AT1932007A AT505033B1 (de) 2007-02-06 2007-02-06 Verfahren und vorrichtung für herstellung, aufbau und betrieb von dickschichtsensoren, dickschichtleitern und dickschicht - sensorketten
PCT/AT2008/000009 WO2008086551A2 (fr) 2007-01-15 2008-01-15 Procédé de fabrication d'un système capteur et système capteur ainsi obtenu

Publications (1)

Publication Number Publication Date
EP2118629A2 true EP2118629A2 (fr) 2009-11-18

Family

ID=39545066

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08700276A Withdrawn EP2118629A2 (fr) 2007-01-15 2008-01-15 Procede de fabrication d'un systeme capteur et systeme capteur ainsi obtenu

Country Status (4)

Country Link
US (1) US8505379B2 (fr)
EP (1) EP2118629A2 (fr)
CN (1) CN101675328A (fr)
WO (1) WO2008086551A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2163876A1 (fr) * 2008-05-27 2010-03-17 BAE Systems PLC Capteurs d'avarie et dispositifs de traitement de signaux
EP2291629A1 (fr) * 2008-05-27 2011-03-09 BAE Systems PLC Détecteurs de détériorations et systèmes de traitement correspondants
WO2010092426A2 (fr) * 2009-02-12 2010-08-19 Clipper Windpower, Inc. Détecteur de fissure de pale dans une éolienne

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WO1993025866A1 (fr) 1992-06-05 1993-12-23 Monash University Pieces de detection utilisant un detecteur a guide d'ondes incorpore
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Also Published As

Publication number Publication date
US8505379B2 (en) 2013-08-13
WO2008086551A3 (fr) 2008-09-04
CN101675328A (zh) 2010-03-17
WO2008086551A2 (fr) 2008-07-24
US20100284130A1 (en) 2010-11-11

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