EP2101996A1 - Durchscheinende platte zur verbindung von elektronischen bauteilen - Google Patents
Durchscheinende platte zur verbindung von elektronischen bauteilenInfo
- Publication number
- EP2101996A1 EP2101996A1 EP07857761A EP07857761A EP2101996A1 EP 2101996 A1 EP2101996 A1 EP 2101996A1 EP 07857761 A EP07857761 A EP 07857761A EP 07857761 A EP07857761 A EP 07857761A EP 2101996 A1 EP2101996 A1 EP 2101996A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- translucent
- layer
- panel according
- electroconductive
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3652—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the coating stack containing at least one sacrificial layer to protect the metal from oxidation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/34—Masking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the present invention relates to a method of manufacturing a translucent panel for connecting electronic components and the panel obtained by this method.
- Panel manufacturing methods are known for connecting electronic components, particularly mono or multilayer printed circuit boards. These panels, however, are formed of insulating opaque substrates and conductive copper tracks.
- the invention is directed to a method of manufacturing a connection panel of electronic components, possibly multilayer, which is translucent.
- the invention relates to a manufacturing method as defined in claim 1.
- the invention particularly relates to a method of manufacturing a translucent panel for connecting electronic components, the method comprising a first step of depositing on a translucent substrate, a translucent electroconductive base layer, followed by at least one once the sequence of the following four steps:
- the step of depositing an additional electroconductive translucent layer on at least a portion of said insulating zone comprises the following steps:
- the sequence of the four steps a) to d) is repeated at least once, the additional translucent electroconductive layer of a current sequence serving as a translucent electroconductive base layer for a following sequence, not realizing, from the first repetition, the step of masking a) only on one of said first and second contact areas.
- the manufacturing method according to the invention provides a translucent panel.
- translucent panel is meant both a panel completely transparent to visible light that a panel transmitting only one part of this visible light and having a haze in transmission which exceeds 5%.
- the veil of a translucent medium is measured in light transmission and is directly related to the scattering of light in directions other than incident light radiation.
- the measurement of the diffuse transmission coefficient is therefore often taken for an estimation of the haze of a transparent medium coated with a reflective layer.
- the diffuse transmission coefficient is generally measured with a spectrophotometer equipped with an integrating sphere.
- a spectrophotometer of Perkin-Elmer® 900 type gave excellent results.
- the panel whose web must be measured is applied tangentially to the sphere so as to close a small opening of its surface.
- a monochromatic incident ray delivered by a monochromator device of the spectrophotometer is directed to the sample to be measured closing the opening in the sphere, along a perpendicular to the surface of the sample.
- An opposing aperture in the sphere in the direction of the direction of the incident light allows the output of the transmitted light beam through the sample panel, the sphere trapping all diffuse light rays reflected in any other direction.
- a photoelectric sensor located elsewhere on the surface of the sphere measures at an angle of observation of 10 ° the total diffuse monochromatic light integrated by the sphere.
- the diffuse transmission coefficient Tvd is then calculated as follows, by integrating all the monochromatic diffuse lights over the entire range of wavelengths of the visible spectrum:
- T vd ( ⁇ ) is the total spectral diffuse light
- V ( ⁇ ) is the spectral light sensitivity of an average human eye
- D65 ( ⁇ ) is the relative spectral distribution of the normalized illuminant
- the manufactured panel is intended to connect electronic circuits.
- the connections are established between the various circuits distributed on at least one face of the panel, preferably on one side of the panel.
- a first step of the process consists of depositing on a translucent substrate.
- Rigid substrates are preferred.
- rigid substrate is meant here a solid body of flat shape, that is to say of small thickness compared to its other dimensions and mechanical resistance to bending stress and sufficient torsion not to deform under the action external stresses that are commonly encountered in the environment in which the panel is generally used.
- the rigid substrates used generally withstand the wind, and bad weather in general, found in the environments where these panels are used, including ice and snow.
- the substrate may be in the form of a rigid plate made of a single material or on the contrary be the result of an assembly of several sheets or plates of the same material or different materials glued or welded to each other. Examples are plates made of plastic or translucent glass. Transparent materials at wavelengths of the visible light spectrum are preferred. Among these, traditional inorganic glasses are preferred, in particular soda-lime glasses.
- the substrate comprises at least one glass sheet.
- the first deposition step on the substrate is followed by at least one sequence of four steps.
- the sequence is carried out only once in cases where it is desired to manufacture a panel on which the connections between the electronic components are made by conductive layer portions located in the same plane.
- the sequence can also be repeated if it is desired to manufacture a panel comprising connections made by conductive layer portions located in several different planes arranged in a stack.
- step a) of the sequence at least a portion of the surface of the panel covered by a conductive layer is masked.
- This masking is temporary, that is to say that it is achieved by means of any material or system that allows its easy removal.
- One example is the masking by means of an electrically insulating self-adhesive film, for example a film or strips of flexible plastic material coated with a peelable adhesive.
- Step a) can directly follow the first deposition step on the translucent substrate, for example when the sequence is performed only once or during the first execution of the sequence.
- step b) a translucent insulating layer is deposited on the surface covered by the conductive layer, whether or not it has been masked during step a).
- This translucent insulating layer is a permanent layer, for example a layer of SiO 2 .
- step c) the masking material deposited in step a) and the insulating material covering it are removed, for example by peeling or tearing off the film or plastic strips bonded to at least a portion of the surface. of the panel covered with a conductive layer. At least one conductive contact zone is thus exposed at the sides of at least one insulating zone.
- step d) which follows, an additional conductive translucent layer is deposited on the insulating zone.
- This conductive layer is a permanent layer generally obtained by magnetron sputtering under vacuum.
- the sequence of the four steps a) to d) is repeated at least once by performing, from the first repetition, the masking step a) only on a only contact areas.
- a groove etching step is inserted in the base conductive layer. to form, by removal of the material of this conductive layer, at least two electric conduction tracks and that is inserted, in at least one of the sequences, between step c) and step d) a new masking step with strips extending from one edge to the other of the panel in a direction different from that of the conduction tracks so as to cover the contact areas and the connection areas and that the last step d) of depositing a conductive layer by a new step of removing the temporary masking material and the conductive material which covers it.
- step a) a plurality of remote zones centered on each of the conduction tracks are masked.
- the direction of the bands of the new temporary masking step and the direction of the conduction tracks form an angle of at least 30 degrees.
- this angle is 90 degrees.
- the removal of the conductive layer material from the groove-etching process is advantageously accomplished by scanning through this layer a laser beam.
- a translucent base electroconductive layer is deposited on the panel.
- electroconductive layer is meant an electroconductive layer of the pyrolytic type or obtained by vacuum magnetron sputtering ("magnetron sputtering").
- the electroconductive layer is a pyrolytic layer deposited on the surface of a glass sheet at temperatures ranging from 500 to 750 ° C.
- the conductive pyrolytic layer has been deposited at temperatures of 570 to 660 ° C.
- a layer of this type can be deposited directly on the hot glass ribbon, at the exit of the step in which the molten glass floats on the surface of a liquid metal tin bath in the well known manufacturing process of float glass. Deposition can be done by spraying (spraying) fine drops of liquid or by chemical vapor deposition.
- the pyrolytic layer is a chemically deposited layer in the vapor phase.
- this pyrolytic layer is essentially SnO 2 doped with fluorine and / or antimony.
- a pyrolytic layer consisting essentially of fluorine doped SnO 2 gave excellent results.
- the thickness of this pyrolytic layer must be carefully adapted to provide adequate surface electrical resistance. Thicknesses of the pyrolytic layer should advantageously be from 250 to 500 nm. A thickness of about 300 nm gave excellent results.
- the surface resistance of a conductive layer adapted to the invention is from 0.5 to 50 ⁇ / D. Preferably, this resistance is 0.8 to 15 ⁇ / D. Surface resistances of 1 to 12 ⁇ / D gave excellent results.
- the light transmission of such a pyrolytic conductive layer is generally not less than 50% and preferably not less than 75%, the measurement being made under standard illuminant D65 by the CIE (International Commission for Lighting) and with a solid angle of 2 °. Layers providing a light transmission of 76 to 79% gave excellent results.
- the conductive layer has a total surface roughness of 20 to 40 nm and preferably 20 to 30 nm.
- Total surface roughness (R 1 ) means the sum of the greatest height of the protuberances (R prot ) and the greatest depth of the wells (R prt ) measured with the aid of an atomic force microscope. The latter delivers individual heights h ⁇ for each point of the surface in two perpendicular directions i and j.
- R t can be calculated as follows:
- N is the total number of measurements. Any known method can be used to achieve this surface roughness. Good results have been obtained with a "float" glass coated with an electroconductive layer which has been mechanically polished with abrasives for the time necessary to obtain the desired roughness.
- the layer is a layer obtained by magnetron sputtering (magnetron sputtering).
- the layer may be a soft layer consisting of a stack of the following elementary layers:
- the surface resistance of these soft layers is generally from 1 to 20 ⁇ / D and preferably from 1 to 10 ⁇ / D. A surface resistance value of 5 ⁇ / D gave excellent results.
- the light transmission of such a conductive layer is generally not less than
- the magnetron conductive layer may also consist of a stack which comprises an Al-doped Zn electroconductive layer or an Sn-doped Indium oxide ("ITO" layer) layer.
- the surface resistance of these layers is about 4 to 50 ⁇ / D and preferably about 4 to 15 ⁇ / D.
- the light transmission of such a conductive layer applied to clear glass (4 mm thick) is generally not less than 80% and, preferably 84%, the measurement being made under standard illuminant D65 by the CIE (Commission International Lighting) and with a solid angle of 2 °.
- Pyrolytic layers are generally preferred to magnetron layers because of their higher mechanical resistance to scratching.
- the additional conductive translucent layers are most often layers resulting from a vacuum sputtering ("magnetron sputtering").
- the invention also relates to a translucent panel for connecting electronic components.
- the invention relates to a panel as defined in claim 13.
- the translucent panel comprises a translucent glass substrate.
- translucent glass is meant, as in the process according to the invention, both a glass completely transparent to visible light and a glass transmitting only part of this visible light and having a haze ("haze"). ”) in transmission exceeding 5%.
- the translucent glass according to the panel according to the invention is preferably a clear glass not colored in the mass.
- the electroconductive base layer is a translucent pyrolytic layer deposited by liquid spray.
- this electroconductive base layer may also be a translucent pyrolytic layer deposited by the CVD technique. This layer is for example a SnO 2 layer doped with fluorine and / or antimony.
- the electroconductive base layer may also result from a vacuum sputtering ("magnetron sputtering").
- the conductive areas of the layers of the stack other than the base layer result from a vacuum sputtering ("magnetron sputtering").
- these layers are themselves a stack of elementary layers TiO 2 / ZnO / Ag / Ti / ZnO / SnO 2 .
- the invention finally also relates to the use of the panel according to the invention which has just been described to produce a transparent electronic circuit comprising electronic components.
- this panel is used to produce a transparent electronic circuit comprising light emitting diodes (LEDs).
- LEDs light emitting diodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Combinations Of Printed Boards (AREA)
- Electroluminescent Light Sources (AREA)
- Surface Treatment Of Glass (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07857761A EP2101996A1 (de) | 2006-12-21 | 2007-12-18 | Durchscheinende platte zur verbindung von elektronischen bauteilen |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06126877A EP1935633A1 (de) | 2006-12-21 | 2006-12-21 | Durchscheinendes Panel zur Verbindung von Bauelementen |
EP07857761A EP2101996A1 (de) | 2006-12-21 | 2007-12-18 | Durchscheinende platte zur verbindung von elektronischen bauteilen |
PCT/EP2007/064136 WO2008080834A1 (fr) | 2006-12-21 | 2007-12-18 | Panneau translucide pour connecter des composants électroniques |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2101996A1 true EP2101996A1 (de) | 2009-09-23 |
Family
ID=37964155
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06126877A Ceased EP1935633A1 (de) | 2006-12-21 | 2006-12-21 | Durchscheinendes Panel zur Verbindung von Bauelementen |
EP07857761A Withdrawn EP2101996A1 (de) | 2006-12-21 | 2007-12-18 | Durchscheinende platte zur verbindung von elektronischen bauteilen |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06126877A Ceased EP1935633A1 (de) | 2006-12-21 | 2006-12-21 | Durchscheinendes Panel zur Verbindung von Bauelementen |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP1935633A1 (de) |
EA (1) | EA016719B1 (de) |
TW (1) | TW200842028A (de) |
WO (1) | WO2008080834A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3242536A1 (de) * | 2016-05-03 | 2017-11-08 | Schott VTF (Societe Par Actions Simplifiee) | Paneel, das eine elektronische komponente umfasst |
JP6773258B1 (ja) * | 2019-04-02 | 2020-10-21 | 東レ株式会社 | 導電層付き基材およびタッチパネル |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1165565A (en) * | 1966-10-29 | 1969-10-01 | Internat Computers Ltd Formerl | Improvements in or relating to the Formation of Electrically Insulating Layers. |
US4353952A (en) * | 1979-09-28 | 1982-10-12 | Hewlett-Packard Company | Transparent digitizer platen |
EP0207181A1 (de) * | 1985-06-29 | 1987-01-07 | Chii-Hsiung Lin | Sicherheitsglas mit zwei wärmereflektierenden Schichten |
DE10019888B4 (de) * | 2000-04-20 | 2011-06-16 | Schott Ag | Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung |
BE1015302A3 (fr) * | 2003-01-10 | 2005-01-11 | Glaverbel | Vitrage comportant des composants electroniques. |
US20050153107A1 (en) * | 2004-01-12 | 2005-07-14 | Tdk Corporation | Substrate having functional layer pattern formed thereon and method of forming functional layer pattern |
-
2006
- 2006-12-21 EP EP06126877A patent/EP1935633A1/de not_active Ceased
-
2007
- 2007-12-14 TW TW96148142A patent/TW200842028A/zh unknown
- 2007-12-18 WO PCT/EP2007/064136 patent/WO2008080834A1/fr active Application Filing
- 2007-12-18 EA EA200900856A patent/EA016719B1/ru not_active IP Right Cessation
- 2007-12-18 EP EP07857761A patent/EP2101996A1/de not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO2008080834A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2008080834A1 (fr) | 2008-07-10 |
EA200900856A1 (ru) | 2009-12-30 |
TW200842028A (en) | 2008-11-01 |
EA016719B1 (ru) | 2012-07-30 |
EP1935633A1 (de) | 2008-06-25 |
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