EP2085692A1 - Electric switch device, in particular signal lights - Google Patents
Electric switch device, in particular signal lights Download PDFInfo
- Publication number
- EP2085692A1 EP2085692A1 EP08001891A EP08001891A EP2085692A1 EP 2085692 A1 EP2085692 A1 EP 2085692A1 EP 08001891 A EP08001891 A EP 08001891A EP 08001891 A EP08001891 A EP 08001891A EP 2085692 A1 EP2085692 A1 EP 2085692A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- housing
- insert
- printed circuit
- circuit arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
- F21V25/12—Flameproof or explosion-proof arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to an electrical circuit arrangement, preferably signal light, for use in potentially explosive areas, with at least one arranged on a printed circuit board electrical component, in particular light source.
- the light source is preferably an LED.
- Signal lights are commonly used to deliver one or more optical signals that serve to indicate any hazards, peculiarities, etc.
- signal lights are used for reporting and warning, for example with regard to faults on machines.
- signal lights can also indicate escape routes or point out advertising space.
- a signal tower is used, which is characterized by the cylindrical shape of a printed circuit board with thereon individually controllable luminescent elements.
- the printed circuit board is a flexible film that can be coated on its outside with a transparent material. This has proven itself in principle.
- hot surfaces or "hot spots” can be sources of ignition for the ambient atmosphere in potentially explosive atmospheres. This applies not only to certain gas mixtures or the occurrence of flammable gases, but also to, for example, combustible dusts during the processing of powders.
- the smaller the given distance between the associated heat source and the surface the higher the partial heating by radiation and convection. That is, the occurrence of the described "hot spots” is favored by a small distance between the heat source and the surface and an insufficient heat dissipation of the surface.
- the invention is based on the technical problem of further developing an electrical circuit arrangement, preferably a signal light, of the structure described at the beginning in such a way that the temperature and thus also the pressure difference between the signal light or an associated housing and the environment is minimized In addition, the occurrence of "hot spots" should be avoided.
- (good) heat-conducting material usually means one which has a (large) thermal conductivity of more than 20 W / (m ⁇ K). In particular, even materials with a thermal conductivity of more than 100 W / (m ⁇ K) and preferably those with more than 200 W / (m ⁇ K) are used primarily. Such values for the thermal conductivity are regularly achieved only by good heat conductors, mainly of metals. This beats the Invention preferably the use of a light metal before, ie such a metal having a density below 5 g / cm 3 .
- metals such as aluminum or aluminum alloys have proved favorable as materials for the printed circuit board.
- copper and alloys such as brass can also be used, which are, however, not (more) a matter of light metals in the above sense, which is anyway only an option.
- the metal circuit board in question is equipped on the illuminant side with an applied insulation.
- a copper cladding may be applied to the circuit board, which provides the necessary electrical connection points and connections for the light source on the circuit board and provides the prerequisite for an (automated) soldering process for mounting the light source on the circuit board.
- the light-emitting diode in question is applied to the surface of the printed circuit board and contacted here, and, for example, no conductor legs are passed through the printed circuit board.
- the contacting of the lamp and its control ensures the applied Kupferkaschtechnik.
- the insulation which is also provided on the upper side of the printed circuit board produces the necessary electrical resistance.
- the structure is usually designed so that the printed circuit board made of metal or aluminum, the first side of the light source insulation or insulation layer and then carries the aforementioned copper lamination, which in turn then picks up the light source mounted on the surface.
- the printed circuit board On its side facing away from the light source or surface, the printed circuit board is advantageously connected to a housing insert or is supported by this housing insert,
- the housing insert is advantageously also made of a thermally conductive material, it is ensured that any resulting in the light generation by means of the light source heat loss is discharged directly via the metallic circuit board to the likewise metallic housing use by heat conduction.
- the waste heat inevitably emitted by the electrical or electronic component in question is forwarded directly via the metallic printed circuit board to the housing insert and finally to the housing.
- the housing insert has a relatively large surface area, it already acts as a temperature sink.
- the heat conduction is improved in the event that the case in question is connected to the housing.
- the housing is also made for the most part of metal, so that the heat over the housing insert in this Case additionally delivered to the housing by heat conduction and distributed from here by heat radiation or convection heat in conjunction with the ambient air to the outside.
- the heat flow is supported or promoted by heat conduction between the metallic printed circuit board and the likewise metallic housing insert by providing a thermal paste between the printed circuit board and the housing insert for a high thermal conductivity.
- the circuit board is thermally connected to the housing insert and this in turn thermally connected to the housing, so that an uninterrupted heat flow from the lamp via the circuit board, the housing insert is finally observed to the housing.
- an increasing surface enlargement takes place, so that heat can be released from each individual component advantageously by heat radiation and convection to the ambient atmosphere, and increasingly from the circuit board to the housing.
- the housing insert is formed essentially in two parts with an insert foot and an insert head supporting the circuit board.
- the housing insert is usually connected via the insert foot to the housing (thermal).
- the insert head is usually designed as a hollow body.
- an angular shape in the sense of a triangle, quadrilateral, pentagon, preferably a hexagon, etc. has proven to be favorable. Because Such polygons provide with their side surfaces advantageous mounting surfaces for multiple circuit boards available.
- the insert head is usually designed as a hexagonal hollow prism, thus has an approximately hollow cylindrical shape in the interior and a hexagonal design on its outer surface.
- one printed circuit board with associated lighting means can be accommodated on each of the six side surfaces, so that the lighting means as a whole sweep over a light emission angle of 360 ° without any problems.
- the LEDs used have beam angles of generally 30 ° to 90 ° or even more.
- the plurality of printed circuit boards are usually arranged spatially so that an all-round light emission is achieved, d. H. one that covers an angle of 360 °, which is of particular importance to most signal lights.
- the hollow or hollow cylindrical running application head is placed on a web of the insert foot and the insert foot engages with this web in the insert head.
- the insert head can be easily mounted with the fuß, namely, for example, such that the insert head has grooves in which the web engages the insert head when the insert head is plugged onto the fuß.
- a total of a large surface through the hollow design of the insert head is available and incidentally, the heat from the insert head is easily forwarded to the fuß out.
- the result is an electrical circuit arrangement or in particular a signal light available, which is particularly predestined by the described and particularly sophisticated heat dissipation for use in potentially explosive atmospheres. Because the inside of the Housing unavoidably resulting heat loss due to the electrical / electronic components or the light source is dissipated quickly and discharged through a generally enlarging surface in the direction of heat flow to the environment. As a result, not only the emergence of the already described "hot spots" is prevented in the result, but the temperature of the housing can be reduced to values that are not significantly above the ambient temperature, for example, do not exceed values of about 60 ° C. In most cases, the temperature of the housing is even lower, for example below 50 ° C.
- This reduced temperature difference of the housing compared to the ambient temperature and the lack of "hot spots" prevents any surrounding and ignitable gases or dusts in the environment from exploding.
- the described circuit arrangement for use in potentially explosive atmospheres is particularly predestined.
- the reduced temperature difference of the housing compared to the environment causes the formation of moisture inside or the penetration of moisture is largely prevented by pressure differences in the interior. This increases the life and reliability of the electrical circuitry as a whole.
- the invention achieves this in the core in that the electrical or electronic component or light source on the circuit board of the heat-conductive material, in particular the metallic circuit board, is added.
- the printed circuit board in turn forwards the resulting heat to the housing, which is also very heat-conductive or metallic.
- the housing which is also very heat-conductive or metallic.
- an electrical switching arrangement in the form of a signal light which has a housing 1.
- a housing 1 In the interior of the housing 1, there is an electrical respectively electronic component 3 arranged on a printed circuit board 4.
- the component 3 in question is designed as a luminous means 3.
- the housing 1 is configured substantially in two parts with a housing foot 1a and a more or less transparent housing head 1b.
- the transparent housing head 1b ensures that the light emitted by the luminous means 3 in the interior of the housing 1 can perform the required signal or warning function, as has already been described in the introduction. That is, in the electrical circuit arrangement is an electrical signal circuit arrangement and here preferably to the signal light shown in detail in the figures.
- the light source 3 is arranged on the circuit board 4 in detail.
- the printed circuit board 4 is made of a thermally conductive material, ie made of such a material, which has a thermal conductivity of more than 20 W / (m ⁇ K).
- a metallic circuit board 4 preferably one of aluminum, that is to say an aluminum circuit board 4.
- the lighting means 3 are arranged circular in comparison to a central axis A of the housing 1, with respect to which the housing 1 is rotationally symmetrical. In this way, the light emitted by the LEDs or light sources 3 is emitted in all spatial directions, so that an all-round light emission is ensured in connection with the transparent housing head 1b of the housing 1.
- circuit board 4 is supported by a housing insert 5 and is thermally connected thereto, as will be explained in more detail below.
- the circuit board 4 itself is connected with its surface facing away from the bulb 3 with the housing insert in question 5, in the present case with the interposition of a thermal paste 6 or a comparable material or fluid to reduce the heat transfer resistance between the circuit board 4 and the housing insert 5.
- a thermal paste 6 or a comparable material or fluid to reduce the heat transfer resistance between the circuit board 4 and the housing insert 5.
- the circuit board 4 on its housing insert 5 facing surface can also be equipped with a heat conduction promoting copper coating or other coating. This is not shown.
- the construction of the surface of the circuit board 4 facing the luminous means 3 is based on the Fig. 3
- the circuit board 4 initially has on the illuminant side or on the surface facing the luminous means 3 an applied insulation layer 7, which provides the necessary electrical insulation of supply lines to the luminous means 3 and of the luminous means 3 as such in comparison to the circuit board 4 provides.
- the insulating layer 7 may be used as a lacquer, powder coating, plastic coating, etc. be executed.
- a copper coating 8 or generally a conductive coating 8 which provides the necessary supply lines and connecting points for the respective luminous means 3.
- the luminous means 3 is applied directly to this conductivity or copper coating 8.
- Lötstopplack 9 optionally ensures the automated soldering process that a perfect solder joint of the lamp 3 is achieved with the connection points or conductors on the part of the conductivity or copper coating 8. This, of course, is only one option.
- the decisive factor is the fact that any loss of heat associated with the light generation of the light source 3 is transmitted directly from the metallic circuit board 4 by heat conduction via the thermal compound 6 to the housing insert 5. Since the housing insert 5 shown in the Fig. 1 and 2 already has a relatively large surface, the heat loss in question can be easily radiated over a large surface or is transmitted via convection to the surrounding atmosphere or outside air. In this case, the heat flow is further optimized by the fact that the housing insert 5 is thermally connected to the housing 1, for example screwed thereto. This results in a further enlargement of the heat-emitting surface, namely in the form of the housing made of metal foot 1a. For reasons of a uniform heat flow, the housing insert 5 as well as the housing 1 will generally be made of aluminum.
- the housing insert 5 in two parts with an insert foot 5a and a Insertion head 5b is formed, which carries the respective printed circuit board 4 and the plurality of printed circuit boards 4.
- the insert head 5b is formed in cross-section as a polygon with respective side surfaces 10, each carrying a printed circuit board 4.
- the respective circuit board 4 is screwed by means of a screw 11 with the respective side surface 10 of the insert head 5b. In each case above and below the screw 11 there is a light source. 3
- the printed circuit boards 4 are in each case flat with the interposition of the thermal paste 6 on the side surfaces 10, wherein the lamps 3 advantageously have a vertical arrangement in the direction of the axis A, which is not mandatory.
- the insert head 5b is formed as a hollow body, in which the insert foot 5a engages.
- the insert foot 5a on the head side has a web 12 which engages in associated grooves 13 of the insert head 5b or the insert head 5b is attached to the web 12 in question of the insert foot 5a, which facilitates assembly.
- this already makes the required thermal or thermal contact between the insert head 5b and the insert foot 5a available.
- the lamps 3 or LED's can be configured in one color or different colors. Of course, white light LEDs are also included in the invention. By a possible color choice in the LED's in the sense of yellow, red, green and / or blue can be dispensed to color the housing head 1 b or the transparency at this point. Nevertheless, the signal function can be flanked with a corresponding color or even several colors as desired.
- the structure is particularly simple. Because the housing foot 5a of the housing insert 5 is not only used for heat conduction and heat dissipation, but in addition to bundle leads 15 for the bulbs 3 and lead. After attaching the insert head 5b make the plug 14 the required electrical connection.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Die Erfindung betrifft eine elektrische Schaltungsanordnung, vorzugsweise Signalleuchte, zum Einsatz in explosionsgefährdeten Bereichen, mit wenigstens einem auf einer Leiterplatte angeordneten elektrischen Bauteil, insbesondere Leuchtmittel. - Bei dem Leuchtmittel handelt es sich vorzugsweise um eine LED.The invention relates to an electrical circuit arrangement, preferably signal light, for use in potentially explosive areas, with at least one arranged on a printed circuit board electrical component, in particular light source. - The light source is preferably an LED.
Signalleuchten werden üblicherweise eingesetzt, um ein oder mehrere optische Signale abzugeben, die dazu dienen, auf etwaige Gefahren, Besonderheiten etc. hinzuweisen. So werden Signalleuchten zur Meldung und Warnung beispielsweise im Hinblick auf Fehler an Maschinen verwendet. Genauso gut können Signalleuchten aber auch Fluchtwege anzeigen oder auf Werbeflächen hinweisen.Signal lights are commonly used to deliver one or more optical signals that serve to indicate any hazards, peculiarities, etc. For example, signal lights are used for reporting and warning, for example with regard to faults on machines. Just as well, signal lights can also indicate escape routes or point out advertising space.
Bei einer Signalleuchte entsprechend dem eingangs beschriebenen Aufbau, wie sie in der
Sobald jedoch allgemein Leuchtmittel in einem Gehäuse für die Signalleuchte aufgenommen werden sollen, stellt sich im Rahmen spezieller Anwendungen das Problem der Wärmeabfuhr. Das gilt insbesondere für solche Signalleuchten, die in explosionsgefährdeten Bereichen zum Einsatz kommen, also sogenannte explosionsgeschützte Signalleuchten. Denn derartige Leuchten verfügen regelmäßig über eine druckfeste Kapselung des Gehäuses, so dass die Abfuhr von im Gehäuse entstehender Verlustwärme seitens der Leuchtmittel ein Problem darstellt.However, as soon as lamps are generally to be accommodated in a housing for the signal light, the problem of heat dissipation arises in the context of special applications. This applies in particular to those signal lights that are used in potentially explosive areas, ie so-called explosion-proof signal lights. Because such lights regularly have a flameproof enclosure of the housing, so that the removal of heat generated in the housing heat loss from the bulbs is a problem.
Das gilt natürlich generell für sämtliche Gehäuse von Signalleuchten, weil aufgrund der zumeist geforderten hohen Lichtstärke der Leuchtmittel oftmals mit einem erhöhten Anfall an Verlustwärme gerechnet werden muss. Diese Verlustwärme kann im Inneren des Gehäuses - ob dies nun druckfest gekapselt ist oder nicht - zu einer erhöhten Temperatur gegenüber der Umgebungstemperatur führen.Of course, this generally applies to all housing of signal lights, because due to the usually required high light intensity of the bulbs must often be expected with an increased amount of heat loss. This heat loss can lead to an increased temperature in the interior of the housing - whether it is now flameproof or not - compared to the ambient temperature.
Infolge dieser erhöhten Temperatur des Gehäuses ist der Einsatz der Signalleuchte bzw. allgemein der elektrischen Schaltungsanordnung in explosionsgefährdeten Bereichen unter Umständen problematisch. Denn es besteht die Gefahr, dass sich partielle Bereiche des Gehäuses deutlich höher als andere Bereiche erhitzen. Dieser Effekt der sogenannten "Hot-Spots" an der Geräteoberfläche ist bei Signalleuchten in explosionsgeschützter Bauart nicht erwünscht.As a result of this increased temperature of the housing, the use of the signal light or generally the electrical circuitry in potentially explosive atmospheres may be problematic. Because there is a risk that partial areas of the housing heat up significantly higher than other areas. This effect of the so-called "hot spots" on the device surface is not desirable for signal lights in explosion-proof design.
Denn solche heißen Flächen bzw. "Hot-Spots" können Zündquellen für die Umgebungsatmosphäre in explosionsgefährdeten Bereichen darstellen. Das gilt nicht nur für bestimmte Gasgemische oder das Auftreten von zündfähigen Gasen, sondern auch für beispielsweise brennbare Stäube bei der Verarbeitung von Pulvern. In diesem Zusammenhang ist zu berücksichtigen, dass je geringer der gegebene Abstand zwischen der zugehörigen Wärmequelle und der Oberfläche bemessen ist, desto höher ist die partielle Erwärmung durch Strahlung und Konvektion. Das heißt, das Auftreten der beschriebenen "Hot-Spots" wird durch einen geringen Abstand zwischen der Wärmequelle und der Oberfläche und eine unzureichende Wärmeabfuhr der Oberfläche begünstigt.Because such hot surfaces or "hot spots" can be sources of ignition for the ambient atmosphere in potentially explosive atmospheres. This applies not only to certain gas mixtures or the occurrence of flammable gases, but also to, for example, combustible dusts during the processing of powders. In this context, it should be noted that the smaller the given distance between the associated heat source and the surface, the higher the partial heating by radiation and convection. That is, the occurrence of the described "hot spots" is favored by a small distance between the heat source and the surface and an insufficient heat dissipation of the surface.
Im Übrigen resultieren aus der erhöhten Temperatur des Gehäuses gegenüber der Umgebungstemperatur weitere Unzuträglichkeiten, welche sich insbesondere bei hoher Luftfeuchtigkeit negativ bemerkbar machen, nämlich in dem letztlich Feuchtigkeit in das Gehäuse eindringt oder sich in diesem verstärkt niederschlägt. Das ist oft dann der Fall, wenn die Signalleuchte (nicht) mehr in Betrieb ist. Jedenfalls stellen sich zum Teil erhebliche Temperaturunterschiede und demzufolge Druckunterschiede zwischen der Signalleuchte und der Umgebung ein, die zu den beschriebenen Negativeffekten führen können. - Hier will die Erfindung insgesamt Abhilfe schaffen.Incidentally, resulting from the increased temperature of the housing relative to the ambient temperature further inconvenience, which make negative in particular at high humidity, namely, in the ultimately moisture penetrates into the housing or reflected in this reinforced. This is often the case when the signal light (not) is more in operation. In any case, some significant temperature differences and consequently pressure differences between the signal light and the environment, which can lead to the described negative effects. - Here the invention aims to provide a total remedy.
Der Erfindung liegt das technische Problem zugrunde, eine elektrische Schaltungsanordnung, vorzugsweise eine Signalleuchte, des eingangs beschriebenen Aufbaus so weiter zu entwickeln, dass der Temperatur- und folglich auch Druckunterschied zwischen der Signalleuchte bzw. einem zugehörigen Gehäuse und der Umgebung möglichst gering bemessen ist, wobei zudem das Auftreten von "Hot-Spots" vermeiden werden soll.The invention is based on the technical problem of further developing an electrical circuit arrangement, preferably a signal light, of the structure described at the beginning in such a way that the temperature and thus also the pressure difference between the signal light or an associated housing and the environment is minimized In addition, the occurrence of "hot spots" should be avoided.
Zur Lösung dieser technischen Problemstellung ist bei einer gattungsgemäßen elektrischen Schaltungsanordnung, vorzugsweise einer Signalleuchte, zum Einsatz in explosionsgefährdeten Bereichen, mit wenigstens einem auf einer Leiterplatte angeordneten elektrischen Bauteil, insbesondere Leuchtmittel, in einem Gehäuse vorgesehen, dass die Leiterplatte aus einem (gut) wärmeleitenden Material gefertigt ist. Dabei meint (gut) wärmeleitendes Material im Rahmen der Erfindung üblicherweise ein solches, welches über eine (große) Wärmeleitfähigkeit von mehr als 20 W/(m • K) verfügt. Insbesondere kommen sogar primär Materialien mit einer Wärmeleitfähigkeit von mehr als 100 W/(m • K) und vorzugsweise solche mit mehr als 200 W/(m • K) zum Einsatz. Derartige Werte für die Wärmeleitfähigkeit werden regelmäßig nur von guten Wärmeleitern erreicht, überwiegend von Metallen. Dabei schlägt die Erfindung vorzugsweise den Einsatz eines Leichtmetalls vor, also eines solchen Metalls mit einer Dichte unterhalb von 5 g/cm3.To solve this technical problem is in a generic electrical circuitry, preferably a signal light for use in potentially explosive atmospheres, with at least one arranged on a printed circuit board electrical component, in particular bulbs, provided in a housing that the circuit board of a (good) thermally conductive material is made. In the context of the invention, (good) heat-conducting material usually means one which has a (large) thermal conductivity of more than 20 W / (m · K). In particular, even materials with a thermal conductivity of more than 100 W / (m · K) and preferably those with more than 200 W / (m · K) are used primarily. Such values for the thermal conductivity are regularly achieved only by good heat conductors, mainly of metals. This beats the Invention preferably the use of a light metal before, ie such a metal having a density below 5 g / cm 3 .
In diesem Zusammenhang haben sich als Werkstoffe für die Leiterplatte besonders Metalle wie Aluminium oder auch Aluminiumlegierungen als günstig erwiesen. Grundsätzlich können aber auch Kupfer und Legierungen wie Messing zum Einsatz kommen, bei denen es sich dann allerdings nicht (mehr) um Leichtmetalle in obigem Sinne handelt, was ohnehin nur als Option zu verstehen ist.In this context, metals such as aluminum or aluminum alloys have proved favorable as materials for the printed circuit board. In principle, however, copper and alloys such as brass can also be used, which are, however, not (more) a matter of light metals in the above sense, which is anyway only an option.
Um das Leuchtmittel und seine Kontakte von der Leiterplatte aus Metall zu isolieren, ist die fragliche Metall-Leiterplatte leuchtmittelseitig mit einer aufgebrachten Isolierung ausgerüstet. Darüber hinaus mag eine Kupferkaschierung auf die Leiterplatte aufgebracht werden, welche die nötigen elektrischen Anschlusspunkte und Verbindungen für das Leuchtmittel auf der Leiterplatte zur Verfügung stellt und die Voraussetzung für einen (automatisierten) Lötvorgang zur Anbringung des Leuchtmittels auf der Leiterplatte schafft. Tatsächlich handelt es sich bei dem Leuchtmittel nämlich vorteilhaft um eine Leuchtdiode (LED), und zwar insbesondere eine solche in SMD-Technik (SMD = surfacemounted device), also eine SMD-LED.In order to insulate the lamp and its contacts from the metal circuit board, the metal circuit board in question is equipped on the illuminant side with an applied insulation. In addition, a copper cladding may be applied to the circuit board, which provides the necessary electrical connection points and connections for the light source on the circuit board and provides the prerequisite for an (automated) soldering process for mounting the light source on the circuit board. In fact, the illuminant is in fact advantageously a light-emitting diode (LED), in particular one in SMD technology (SMD = surfacemounted device), ie an SMD LED.
D. h., die fragliche Leuchtdiode wird auf die Oberfläche der Leiterplatte aufgebracht und hier kontaktiert und es werden beispielsweise keine Leiterbeine durch die Leiterplatte hindurchgeführt. Für die Kontaktierung des Leuchtmittels und dessen Ansteuerung sorgt dabei die aufgebrachte Kupferkaschierung. Die ebenfalls oberseitig auf der Leiterplatte vorhandene Isolierung stellt den notwendigen elektrischen Widerstand her.In other words, the light-emitting diode in question is applied to the surface of the printed circuit board and contacted here, and, for example, no conductor legs are passed through the printed circuit board. For the contacting of the lamp and its control ensures the applied Kupferkaschierung. The insulation which is also provided on the upper side of the printed circuit board produces the necessary electrical resistance.
Dabei ist der Aufbau in der Regel so gestaltet, dass die Leiterplatte aus Metall bzw. Aluminium leuchtmittelseitig zunächst die Isolierung bzw. eine Isolationsschicht und darauf die bereits angesprochene Kupferkaschierung trägt, die ihrerseits dann das auf der Oberfläche montierte Leuchtmittel aufnimmt. An ihrer dem Leuchtmittel abgewandten Seite bzw. Oberfläche ist die Leiterplatte vorteilhaft mit einem Gehäuseeinsatz verbunden bzw. wird von diesem Gehäuseeinsatz getragen,In this case, the structure is usually designed so that the printed circuit board made of metal or aluminum, the first side of the light source insulation or insulation layer and then carries the aforementioned copper lamination, which in turn then picks up the light source mounted on the surface. On its side facing away from the light source or surface, the printed circuit board is advantageously connected to a housing insert or is supported by this housing insert,
Dadurch, dass der Gehäuseeinsatz vorteilhaft ebenfalls aus einem wärmeleitenden Material hergestellt ist, wird gewährleistet, dass etwaige bei der Lichterzeugung mit Hilfe des Leuchtmittels entstehende Verlustwärme unmittelbar über die metallische Leiterplatte an den ebenfalls metallischen Gehäuseeinsatz per Wärmeleitung abgegeben wird. Vergleichbares gilt natürlich für den Fall, dass anstelle des Leuchtmittels ein anderes elektrisches respektive elektronisches Bauteil auf der fraglichen metallischen Leiterplatte angeordnet ist, beispielsweise ein Lautsprecher, der als Signallautsprecher fungieren mag. In jedem Fall wird die von dem fraglichen elektrischen respektive elektronischen Bauteil zwangsläufig abgegebene Verlustwärme erfindungsgemäß unmittelbar über die metallische Leiterplatte an den Gehäuseeinsatz und schließlich das Gehäuse weitergeleitet.The fact that the housing insert is advantageously also made of a thermally conductive material, it is ensured that any resulting in the light generation by means of the light source heat loss is discharged directly via the metallic circuit board to the likewise metallic housing use by heat conduction. Of course, the same applies to the case where, instead of the light source, another electrical or electronic component is arranged on the metallic circuit board in question, for example a loudspeaker which may act as a signal loudspeaker. In any case, according to the invention, the waste heat inevitably emitted by the electrical or electronic component in question is forwarded directly via the metallic printed circuit board to the housing insert and finally to the housing.
Dadurch erfolgt insgesamt eine zügige Wärmeableitung und eine wirksame Wärmeverteilung ausgehend von der Wärmequelle bzw. dem elektrischen/elektronischen Bauteil über eine große Oberfläche. Damit wird die Entstehung der bereits zuvor erläuterten "Hot-Spots" schon dem Grunde nach verhindert.This results in a total of rapid heat dissipation and effective heat distribution from the heat source or the electrical / electronic component over a large surface. Thus, the emergence of the previously discussed "hot spots" is already basically prevented.
Weil der Gehäuseeinsatz über eine relativ große Oberfläche verfügt, fungiert dieser bereits aus sich heraus als Temperatursenke. Die Wärmeleitung wird für den Fall noch verbessert, dass der fragliche Gehäuseeinsatz mit dem Gehäuse verbunden ist. Denn üblicherweise ist das Gehäuse zum großen Teil ebenfalls aus Metall gefertigt, so dass die Wärme über den Gehäuseeinsatz in diesem Fall zusätzlich noch an das Gehäuse per Wärmeleitung abgegeben und von hier aus durch Wärmestrahlung oder Wärmekonvektion in Verbindung mit der Umgebungsluft nach außen verteilt wird.Because the housing insert has a relatively large surface area, it already acts as a temperature sink. The heat conduction is improved in the event that the case in question is connected to the housing. Because usually the housing is also made for the most part of metal, so that the heat over the housing insert in this Case additionally delivered to the housing by heat conduction and distributed from here by heat radiation or convection heat in conjunction with the ambient air to the outside.
Dabei wird man insgesamt mit Materialien bzw. Metallen für die Leiterplatte, den Gehäuseeinsatz und das Gehäuse arbeiten, die über vergleichbare bzw. gleiche Wärmeleitfähigkeiten verfügen, um einen ungehinderten Wärmestrom zu gewährleisten. Hier hat sich Aluminium als gemeinsamer Werkstoff als günstig erwiesen.In this case, one will work with materials or metals for the printed circuit board, the housing insert and the housing, which have comparable or identical thermal conductivities, in order to ensure an unimpeded heat flow. Here, aluminum has proven to be favorable as a common material.
Dabei wird der Wärmefluss durch Wärmeleitung zwischen der metallischen Leiterplatte und dem ebenfalls metallischen Gehäuseeinsatz noch dadurch unterstützt bzw. gefördert, dass zwischen der Leiterplatte und dem Gehäuseeinsatz eine Wärmeleitpaste für eine hohe Wärmeleitfähigkeit sorgt. Jedenfalls steht die Leiterplatte thermisch mit dem Gehäuseeinsatz und diese wiederum thermisch mit dem Gehäuse in Verbindung, so dass ein ununterbrochener Wärmestrom von dem Leuchtmittel über die Leiterplatte, den Gehäuseeinsatz schließlich zum Gehäuse beobachtet wird. Dabei findet eine zunehmende Oberflächenvergrößerung statt, so dass von jedem einzelnen Bauteil Wärme vorteilhaft durch Wärmestrahlung und Konvektion an die Umgebungsatmosphäre abgegeben werden kann, und zwar zunehmend von der Leiterplatte bis zum Gehäuse.In this case, the heat flow is supported or promoted by heat conduction between the metallic printed circuit board and the likewise metallic housing insert by providing a thermal paste between the printed circuit board and the housing insert for a high thermal conductivity. In any case, the circuit board is thermally connected to the housing insert and this in turn thermally connected to the housing, so that an uninterrupted heat flow from the lamp via the circuit board, the housing insert is finally observed to the housing. In this case, an increasing surface enlargement takes place, so that heat can be released from each individual component advantageously by heat radiation and convection to the ambient atmosphere, and increasingly from the circuit board to the housing.
Es hat sich bewährt, wenn der Gehäuseeinsatz im Wesentlichen zweiteilig mit einem Einsatzfuß und einem die Leiterplatte tragenden Einsatzkopf ausgebildet ist. Der Gehäuseeinsatz ist meistens über den Einsatzfuß mit dem Gehäuse (thermisch) verbunden. Der Einsatzkopf ist in der Regel als Hohlkörper ausgebildet. Hier hat sich eine eckige Gestalt im Sinne eines Dreiecks, Vierecks, Fünfecks, vorzugsweise eines Sechsecks usw. als günstig erwiesen. Denn solche Vielecke stellen mit ihren Seitenflächen vorteilhaft Befestigungsflächen für mehrere Leiterplatten zur Verfügung.It has proven useful if the housing insert is formed essentially in two parts with an insert foot and an insert head supporting the circuit board. The housing insert is usually connected via the insert foot to the housing (thermal). The insert head is usually designed as a hollow body. Here, an angular shape in the sense of a triangle, quadrilateral, pentagon, preferably a hexagon, etc. has proven to be favorable. Because Such polygons provide with their side surfaces advantageous mounting surfaces for multiple circuit boards available.
Tatsächlich ist der Einsatzkopf meistens als sechseckiges Hohlprisma ausgeführt, verfügt also über eine angenähert hohlzylindrische Gestalt im Inneren und eine sechseckige Ausbildung auf seiner Außenoberfläche. Dadurch kann auf jeder der sechs Seitenflächen jeweils eine Leiterplatte mit zugehörigem Leuchtmittel aufgenommen werden, so dass die Leuchtmittel insgesamt einen Lichtabstrahlwinkel von 360° problemlos überstreichen. Denn die eingesetzten LED's verfügen über Abstrahlwinkel von allgemein 30° bis 90° oder noch mehr. D. h., die mehreren Leiterplatten sind meistens so räumlich angeordnet, dass eine Rundum-Lichtabstrahlung erreicht wird, d. h. eine solche, die einen Winkel von 360° überstreicht, was für die meisten Signalleuchten von besonderer Bedeutung ist.In fact, the insert head is usually designed as a hexagonal hollow prism, thus has an approximately hollow cylindrical shape in the interior and a hexagonal design on its outer surface. As a result, in each case one printed circuit board with associated lighting means can be accommodated on each of the six side surfaces, so that the lighting means as a whole sweep over a light emission angle of 360 ° without any problems. Because the LEDs used have beam angles of generally 30 ° to 90 ° or even more. D. h., The plurality of printed circuit boards are usually arranged spatially so that an all-round light emission is achieved, d. H. one that covers an angle of 360 °, which is of particular importance to most signal lights.
Schlussendlich ist zur besseren Wärmeabfuhr vorgesehen, dass der Hohl- bzw. hohlzylindrisch ausgeführte Einsatzkopf auf einen Steg des Einsatzfußes aufgesetzt ist bzw. der Einsatzfuß mit diesem Steg in den Einsatzkopf eingreift. Dadurch kann der Einsatzkopf unschwer mit dem Einsatzfuß montiert werden, nämlich beispielsweise dergestalt, dass der Einsatzkopf über Nuten verfügt, in welche der Steg am Einsatzkopf eingreift, wenn der Einsatzkopf auf den Einsatzfuß aufgesteckt wird. Hinzu kommt, dass insgesamt eine große Oberfläche durch die hohle Gestaltung des Einsatzkopfes zur Verfügung steht und im Übrigen die Wärme vom Einsatzkopf unschwer zum Einsatzfuß hin weitergeleitet wird.Finally, it is provided for better heat dissipation, that the hollow or hollow cylindrical running application head is placed on a web of the insert foot and the insert foot engages with this web in the insert head. Thereby, the insert head can be easily mounted with the Einsatzfuß, namely, for example, such that the insert head has grooves in which the web engages the insert head when the insert head is plugged onto the Einsatzfuß. In addition, a total of a large surface through the hollow design of the insert head is available and incidentally, the heat from the insert head is easily forwarded to the Einsatzfuß out.
Im Ergebnis steht eine elektrische Schaltungsanordnung respektive insbesondere eine Signalleuchte zur Verfügung, die durch die beschriebene und besonders ausgeklügelte Wärmeabfuhr für den Einsatz in explosionsgefährdeten Bereichen besonders prädestiniert ist. Denn die im Innern des Gehäuses unvermeidbar entstehende Verlustwärme infolge der elektrischen/elektronischen Bauteile bzw. der Leuchtmittel wird schnell abgeführt und über eine sich in der Regel vergrößernde Oberfläche in Richtung des Wärmeflusses an die Umgebung abgegeben. Dadurch wird im Ergebnis nicht nur die Entstehung der bereits beschriebenen "Hot-Spots" verhindert, sondern kann die Temperatur des Gehäuses auf Werte reduziert werden, die nicht wesentlich oberhalb der Umgebungstemperatur angesiedelt sind, beispielsweise Werte von ca. 60° C nicht überschreiten. Meistens liegt die Temperatur des Gehäuses sogar noch weit darunter, beispielsweise unterhalb von 50° C.The result is an electrical circuit arrangement or in particular a signal light available, which is particularly predestined by the described and particularly sophisticated heat dissipation for use in potentially explosive atmospheres. Because the inside of the Housing unavoidably resulting heat loss due to the electrical / electronic components or the light source is dissipated quickly and discharged through a generally enlarging surface in the direction of heat flow to the environment. As a result, not only the emergence of the already described "hot spots" is prevented in the result, but the temperature of the housing can be reduced to values that are not significantly above the ambient temperature, for example, do not exceed values of about 60 ° C. In most cases, the temperature of the housing is even lower, for example below 50 ° C.
Dieser verringerte Temperaturunterschied des Gehäuses im Vergleich zur Umgebungstemperatur und das Fehlen von "Hot-Spots" verhindert, dass in der Umgebung gegebenenfalls vorhandene und zündfähige Gase oder Stäube zur Explosion gebracht werden. Damit ist die beschriebene Schaltungsanordnung für den Einsatz in explosionsgefährdeten Bereichen besonders prädestiniert. Außerdem führt der verringerte Temperaturunterschied des Gehäuses im Vergleich zur Umgebung dazu, dass Feuchtigkeitsbildung im Innern oder das Eindringen von Feuchtigkeit durch Druckunterschiede ins Innere weitgehend unterbunden wird. Das steigert die Lebensdauer und Funktionssicherheit der elektrischen Schaltungsanordnung insgesamt.This reduced temperature difference of the housing compared to the ambient temperature and the lack of "hot spots" prevents any surrounding and ignitable gases or dusts in the environment from exploding. Thus, the described circuit arrangement for use in potentially explosive atmospheres is particularly predestined. In addition, the reduced temperature difference of the housing compared to the environment causes the formation of moisture inside or the penetration of moisture is largely prevented by pressure differences in the interior. This increases the life and reliability of the electrical circuitry as a whole.
Das erreicht die Erfindung im Kern dadurch, dass das elektrische bzw. elektronische Bauteil bzw. Leuchtmittel auf der Leiterplatte aus dem wärmeleitenden Material, insbesondere der metallischen Leiterplatte, aufgenommen wird. Die leiterplatte Ihrerseits leitet die entstehende Wärme an den ebenfalls gut wärmeleitenden bzw. metallischen Gehäuseeinsatz weiter. hierin sind die wesentlichen Vorteile zu sehen.The invention achieves this in the core in that the electrical or electronic component or light source on the circuit board of the heat-conductive material, in particular the metallic circuit board, is added. The printed circuit board in turn forwards the resulting heat to the housing, which is also very heat-conductive or metallic. Here are the main benefits.
Im Folgenden wird die Erfindung anhand einer lediglich ein Ausführungsbeispiel darstellenden Zeichnung näher erläutert; es zeigen:
- Fig. 1
- die erfindungsgemäße elektrische Schaltungsanordnung in Gestalt einer Signalleuchte schematisch,
- Fig. 2
- den Gehäuseeinsatz entsprechend der
Fig. 1 in einer Seitenansicht und - Fig. 3
- eine Aufsicht auf den Gehäuseeinsatz nach
Fig. 2 aus Richtung X.
- Fig. 1
- the electrical circuit arrangement according to the invention in the form of a signal light schematically,
- Fig. 2
- the housing insert according to the
Fig. 1 in a side view and - Fig. 3
- a top view of the housing insert
Fig. 2 from direction X.
In den Figuren ist eine elektrische Schaltanordnung in Gestalt einer Signalleuchte dargestellt, die über ein Gehäuse 1 verfügt. Im Innern des Gehäuses 1 findet sich ein auf einer Leiterplatte 4 angeordnetes elektrisches respektive elektronisches Bauteil 3. Im Rahmen des Ausführungsbeispiels ist das fragliche Bauteil 3 als Leuchtmittel 3 ausgebildet. Das Gehäuse 1 ist im Wesentlichen zweiteilig mit einem Gehäusefuß 1 a und einem mehr oder minder transparenten Gehäusekopf 1b ausgestaltet. Der transparente Gehäusekopf 1b stellt sicher, dass das von dem Leuchtmittel 3 im Innern des Gehäuses 1 abgestrahlte Licht die erforderliche Signal- oder Warnfunktion wahrnehmen kann, wie dies einleitend bereits beschrieben wurde. Das hießt, bei der elektrischen Schaltungsanordnung handelt es sich um eine elektrische Signal-Schaltungsanordnung und hier vorzugsweise um die in den Figuren näher dargestellte Signalleuchte.In the figures, an electrical switching arrangement in the form of a signal light is shown, which has a
Dabei ist im Detail das Leuchtmittel 3 auf der Leiterplatte 4 angeordnet. Erfindungsgemäß ist die Leiterplatte 4 aus einem wärmeleitenden Material gefertigt, also einem solchen Werkstoff hergestellt, der über eine Wärmeleitfähigkeit von mehr als 20 W/(m • K) verfügt. Üblicherweise handelt es sich um eine metallische Leiterplatte 4, vorzugsweise eine solche aus Aluminium, also um eine Aluminium-Leiterplatte 4.In this case, the
Als Leuchtmittel 3 kommen mehrere räumlich angeordnete Leuchtdioden 3 zum Einsatz, und zwar vorteilhaft LED's in SMD-Technik. Dabei sind die Leuchtmittel 3 kreisförmig im Vergleich zu einer zentralen Achse A des Gehäuses 1 angeordnet, gegenüber welcher das Gehäuse 1 rotationssymmetrisch ausgeführt ist. Auf diese Weise wird das von den LED's bzw. Leuchtmitteln 3 abgestrahlte Licht in sämtliche Raumrichtungen ausgestrahlt, so dass in Verbindung mit dem transparenten Gehäusekopf 1b des Gehäuses 1 eine Rundum-Lichtabstrahlung gewährleistet ist.As a
Den Detailaufbau erkennt man am besten anhand des in
Der Aufbau der dem Leuchtmittel 3 zugewandten Oberfläche der Leiterplatte 4 stellt sich anhand der
Dabei ist das Leuchtmittel 3 unmittelbar auf dieser Leitfähigkeits- bzw. Kupferbeschichtung 8 aufgebracht. Zusätzlich auf die Kupferbeschichtung bzw. Leitfähigkeitsbeschichtung 8 aufgetragener Lötstopplack 9 sorgt optional beim automatisierten Lötvorgang dafür, dass eine einwandfreie Lötverbindung des Leuchtmittels 3 mit den Anschlusspunkten bzw. Leiterbahnen seitens der Leitfähigkeits- bzw. Kupferbeschichtung 8 erzielt wird. Das stellt natürlich insgesamt nur eine Option dar.In this case, the
Entscheidend ist die Tatsache, dass etwaige mit der Lichterzeugung des Leuchtmittels 3 verbundene Verlustwärme unmittelbar von der metallischen Leiterplatte 4 per Wärmeleitung über die Wärmeleitpaste 6 an den Gehäuseeinsatz 5 übertragen wird. Da der Gehäuseeinsatz 5 ausweislich der
Anhand einer vergleichenden Betrachtung der
Die Leiterplatten 4 liegen jeweils plan unter Zwischenschaltung der Wärmeleitpaste 6 an den Seitenflächen 10 an, wobei die Leuchtmittel 3 vorteilhaft über eine vertikale Anordnung in Richtung der Achse A verfügen, was allerdings nicht zwingend ist.The printed
Anhand der
Die Leuchtmittel 3 bzw. LED's können einfarbig oder verschiedenfarbig ausgestaltet sein. Selbstverständlich werden auch Weißlicht-LED's von der Erfindung umfasst. Durch eine mögliche Farbwahl bei den LED's im Sinne von Gelb, Rot, Grün und/oder Blau kann darauf verzichtet werden, den Gehäusekopf 1 b bzw. die Transparentabdeckung an dieser Stelle einzufärben. Dennoch lässt sich die Signalfunktion mit einer entsprechenden Farbe oder auch mehreren Farben wunschgemäß flankieren.The
Des Weiteren liegt es im Rahmen der Erfindung, bei Bedarf die jeweilige metallische Leiterplatte 4 und/oder den Gehäuseeinsatz 5 und/oder das Gehäuse 1 im Ganzen ergänzend zu kühlen. Das kann mit Hilfe von Peltier-Elementen erfolgen. - Dadurch, dass die einzelnen Leiterplatten 4 mit Hilfe von Steckern 14 kontaktiert werden, gestaltet sich der Aufbau besonders einfach. Denn der Gehäusefuß 5a des Gehäuseeinsatzes 5 dient nicht nur zur Wärmeleitung und Wärmeabfuhr, sondern ergänzend dazu, Zuleitungen 15 für die Leuchtmittel 3 zu bündeln und zu führen. Nach dem Aufstecken des Einsatzkopfes 5b stellen dabei die Stecker 14 die erforderliche elektrische Verbindung her.Furthermore, it is within the scope of the invention, if necessary, to additionally cool the respective metallic printed
Claims (10)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08001891A EP2085692B1 (en) | 2008-02-01 | 2008-02-01 | Electric switch device, in particular signal lights |
ES08001891T ES2360260T3 (en) | 2008-02-01 | 2008-02-01 | PROVISION OF ELECTRICAL CIRCUIT, ESPECIALLY SIGNALING PILOT. |
AT08001891T ATE501399T1 (en) | 2008-02-01 | 2008-02-01 | ELECTRICAL CIRCUIT ARRANGEMENT, IN PARTICULAR SIGNAL LAMP |
DE502008002804T DE502008002804D1 (en) | 2008-02-01 | 2008-02-01 | Electrical circuit arrangement, in particular signal light |
EA200900104A EA016630B1 (en) | 2008-02-01 | 2009-01-30 | Electric switch device, in particular signal lights |
CN2009100037467A CN101498430B (en) | 2008-02-01 | 2009-02-01 | Electric switch device, in particular signal lights |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08001891A EP2085692B1 (en) | 2008-02-01 | 2008-02-01 | Electric switch device, in particular signal lights |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2085692A1 true EP2085692A1 (en) | 2009-08-05 |
EP2085692B1 EP2085692B1 (en) | 2011-03-09 |
Family
ID=39137001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08001891A Revoked EP2085692B1 (en) | 2008-02-01 | 2008-02-01 | Electric switch device, in particular signal lights |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2085692B1 (en) |
CN (1) | CN101498430B (en) |
AT (1) | ATE501399T1 (en) |
DE (1) | DE502008002804D1 (en) |
EA (1) | EA016630B1 (en) |
ES (1) | ES2360260T3 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010017460A1 (en) * | 2010-06-18 | 2011-12-22 | R. Stahl Schaltgeräte GmbH | Explosion-proof light source |
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DE10059844A1 (en) * | 2000-11-30 | 2002-06-13 | Karl Kapfer | Multiple warning light for emitting different colored signal lights has sources of different type distributed so each different colored signal light is emitted through whole transparent region |
WO2002097884A1 (en) * | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
DE10239347A1 (en) | 2002-08-28 | 2004-03-18 | Fhf Funke + Huster Fernsig Gmbh | Signal lamp for indicating or warning of fault on machinery, flight path indication etc. contains enclosing flexible circuit board with individually energized luminescent elements, e.g. LEDs or organic LEDs (OLEDs) |
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RU2159521C1 (en) * | 1999-06-08 | 2000-11-20 | Казанский государственный технический университет им. А.Н. Туполева | Method for manufacturing of printed circuit board |
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RU2251050C1 (en) * | 2003-12-17 | 2005-04-27 | Сысун Виктор Викторович | Illumination explosion-proof device on base of light emitting diodes |
-
2008
- 2008-02-01 AT AT08001891T patent/ATE501399T1/en active
- 2008-02-01 DE DE502008002804T patent/DE502008002804D1/en active Active
- 2008-02-01 ES ES08001891T patent/ES2360260T3/en active Active
- 2008-02-01 EP EP08001891A patent/EP2085692B1/en not_active Revoked
-
2009
- 2009-01-30 EA EA200900104A patent/EA016630B1/en not_active IP Right Cessation
- 2009-02-01 CN CN2009100037467A patent/CN101498430B/en not_active Expired - Fee Related
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DE10059844A1 (en) * | 2000-11-30 | 2002-06-13 | Karl Kapfer | Multiple warning light for emitting different colored signal lights has sources of different type distributed so each different colored signal light is emitted through whole transparent region |
WO2002097884A1 (en) * | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
DE10239347A1 (en) | 2002-08-28 | 2004-03-18 | Fhf Funke + Huster Fernsig Gmbh | Signal lamp for indicating or warning of fault on machinery, flight path indication etc. contains enclosing flexible circuit board with individually energized luminescent elements, e.g. LEDs or organic LEDs (OLEDs) |
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DE102010017460B4 (en) * | 2010-06-18 | 2013-05-08 | R. Stahl Schaltgeräte GmbH | Explosion-proof light source |
Also Published As
Publication number | Publication date |
---|---|
ES2360260T3 (en) | 2011-06-02 |
EA016630B1 (en) | 2012-06-29 |
CN101498430B (en) | 2011-04-13 |
EA200900104A1 (en) | 2009-08-28 |
DE502008002804D1 (en) | 2011-04-21 |
EP2085692B1 (en) | 2011-03-09 |
CN101498430A (en) | 2009-08-05 |
ATE501399T1 (en) | 2011-03-15 |
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