WO2015028404A1

WO2015028404A1 - Semiconductor lamp having a heat-conducting body between a driver and a driver housing

Info

Publication number: WO2015028404A1
Application number: PCT/EP2014/067911
Authority: WO
Inventors: Marianne Auernhammer; Michael Rosenauer; Thomas Klafta
Original assignee: Osram Gmbh
Priority date: 2013-08-26
Filing date: 2014-08-22
Publication date: 2015-03-05
Also published as: DE202013007592U1

Abstract

The invention relates to a semiconductor lamp (1) comprising at least one semiconductor light source (9) and having: a driver housing (3) having a driver cavity (21), a driver (4) housed in the driver cavity (21), and a local heat-conducting body (22, 23, 24), which connects a part of the driver (4) to a part of the driver housing (3, 5) in a heat-conducting manner, wherein the local heat-conducting body (22, 23, 24) is composed of a heat-conducting material (25) that has a consistency that is shape-maintaining and pasty when the heat-conducting material is poured into the driver cavity (21). The invention can be applied in particular to retrofit lamps, such as lamps for PAR floodlights, in particular PAR16, or to halogen-lamp retrofit lamps of type MR, in particular MR16.

Description

description

Semiconductor lamp with heat-conducting body between driver and driver housing

The invention relates to a semiconductor lamp having at least one semiconductor light source, comprising a driver housing with a driver cavity, one in the driver cavity

accommodated driver and a local thermally conductive body, which connects a part of the driver with a part of the driver housing thermally conductive. The invention is particularly applicable to retrofit lamps, e.g. on lamps for PAR headlamps, especially PAR 16, or on

Type MR halogen retrofit lamps, in particular MR 16.

The driver of previous LED retrofit lamps has due to an inhomogeneous power distribution of its driver components certain driver components or points that can be particularly hot during operation (so-called "hotspots")

Driver components associated with such hotspots may extend the life of the entire semiconductor lamp

determine, because in their failure due to overheating the semiconductor lamp is no longer operable. Currently, the driver is inserted into the driver housing and, when considered necessary from a thermal point of view, in the installed state with potting material (so-called "potting material") for a better heat transfer from the driver to the driver

Driver housing filled. As potting material usually a 2-component material is used, which can still be processed liquid after mixing the individual components to fill the driver housing, and cured with time to a solid mass. The curing happens

typically at room temperature (25 ° C) for about 8

Hours or at 80 ° C in an oven for about 30 minutes.

Disadvantage here is a relatively large volume

Potting material that is used to warmest Cool components sufficiently. In addition, this is

Potting process only with great effort and long

Integrate heating line in a line production. It is the object of the present invention to at least partially overcome the disadvantages of the prior art and, in particular, to provide an improved possibility for cooling a driver of a semiconductor lamp, in particular an LED lamp.

This object is achieved according to the characteristics of the independent

Claims solved. Preferred embodiments are

in particular the dependent claims. The object is achieved by a semiconductor lamp having at least one semiconductor light source, comprising

Driver housing with a driver cavity, one in the

Driver cavity, and at least one local thermally conductive body, which forms part of the

Driver with a portion of the driver housing thermally conductively connects, wherein the local thermally conductive body consists of a Wärmeleitmaterial of form filling in the driver cavity paste-like consistency. The driver cavity is in particular a cavity within the driver housing for receiving the driver.

In particular, the driver serves to supply a supply voltage of the semiconductor lamp, e.g. an incoming AC voltage to convert into suitable electrical signals for operation of the at least one semiconductor light source, e.g.

to rectify and / or, if applicable, a

Compatibility with possible ballasts and / or

To ensure dimmers. The driver has at least one driver component for this purpose. The driver may, for example, have a printed circuit board or printed circuit board on which one or more driver components are arranged, which may form at least part of a driver electronics, for example. One Driver component may in particular be an electrical component (eg a capacitor) and / or an electronic component (eg a microcontroller, ASIC or FPGA) of the driver. However, the driver may also include driver components that are not located on the circuit board.

A local or localized heat-conducting body is in particular a body made of the heat-conducting material, which does not fill the driver or does not fill up from the bottom, but is present only locally limited or localized in the driver housing. The local thermally conductive body provides a thermal bridge between any one

Part of the driver and any portion of the (cooler) driver housing ago, without filling the driver housing. The local thermally conductive body contacted to these two areas. In particular, the local thermally conductive body may like a thermal bridge between any portion of the driver and a driver

opposite portion of the driver housing

produce, as a particularly small volume of the body is reached.

In particular, at least one local thermally conductive body may connect a portion of one side of a printed circuit board of the driver to a portion of the driver housing. Of the

Part of the side of the circuit board may be e.g. comprise one or more driver components. This allows a particularly effective heat dissipation of this sub-area. At least one local thermally conductive body may connect a whole (populated or unpopulated) side of a printed circuit board of the driver to a portion of the driver housing. This allows a comparatively uniform heat dissipation of the whole page.

That the local thermally conductive body of a

Wärmeleitmaterial consists of filling in the driver cavity shape-retaining paste-like consistency means "

in particular, that the heat-conducting material does not flow away with or after filling, but at least substantially remains locally where it has been introduced.

If necessary, it can be deformed by sufficiently large mechanical forces. The thermally conductive material having a shape-retaining paste-like consistency may also be referred to as a high-viscosity shape-retaining material.

This semiconductor lamp has the advantage that the local heat-conducting body can be mounted in a fundamentally arbitrary position in shape-retaining or shape-retaining manner in the driver housing. It is such a targeted local connection of driver areas or individual driver blocks or

Components possible. As a result, less Wärmeleitmaterial is needed, which saves costs. By the shape-retaining

Property of Wärmeleitmaterials is also a

Further processing possible immediately, especially in the

Frame of a continuous production line or

Line production. The local, thermally conductive body allows a large temperature reduction associated with it

Driver components, resulting in a longer life of

Semiconductor lamp allows.

Preferably, the at least one

Semiconductor light source at least one light emitting diode. at

If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one

LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED). Several

Light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor

(Conversion LED). The phosphor may alternatively or additionally be arranged away from the light-emitting diode

("Remote Phosphor"). The at least one light emitting diode may be in the form of at least one individually housed light emitting diode or in Form present at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, eg at least one Fresnel lens,

Collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser. Also the at least one diode laser may be followed by a wavelength-converting phosphor, e.g. in a LARP ("Laser Activated Remote Phosphor") arrangement.

In the driver housing, one or more such local thermally conductive body may be present, in particular

spaced apart. Under a Wärmeleitmaterial can be understood in particular a material which in the ready state a

Thermal conductivity λ has, which is greater than that

Thermal conductivity XL = 0.0262 W / (m-K) of air. The

Thermal conductivity λ of the heat conducting material may in particular be at least 0.03 W / (m-K), in particular at least 0.05 W / (m-K), in particular at least 0.1 W / (m-K).

The thermal conductivity λ of the Wärmeleitmaterials mag

especially in the ready state a

Thermal conductivity λ of at least 0.35 W / (m-K),

in particular of at least 0.5 W / (m-K), in particular of at least 0.75 W / (m-K), in particular of at least 1

W / (mK), in particular of at least 1.5 W / (mK), in particular of at least 1.75 W / (mK). This achieves the advantage of a particularly effective heat dissipation with good handling and dimensional stability. It is still an embodiment that the heat conduction material is a non-hardening material. This has the advantage that the semiconductor lamp can be further processed immediately after filling the Wärmeleitmaterials and does not need to be waited for curing.

It is a further development, in particular for the case of a non-hardening heat conducting material, that its dynamic viscosity during filling ("initial viscosity" vA) is at least 175 Pascal seconds, Pa.s .. For the non-hardening heat conducting material, this also corresponds at least approximately to the value in its in ready-to-use final state ("final viscosity" vE). The non-thermosetting material may be, but is not limited to, a one-component material.

The non-hardening thermal conductive material may e.g. To be plasticine, glue or silicone.

It is a further embodiment that the heat conduction material is a hardening or after introduction into the

Driver cavity further solidifying material is. This has the advantage that an introduction into the driver cavity is facilitated by the lower initial viscosity vA and / or a higher final viscosity vE or even a

practically non-viscous, solid final state is achievable. The hardening material hardens in particular at the place of its introduction or filling ("cure-in-place"). Due to its comparatively small volume it hardens faster than a driver cavity fully filling

Casting material. The thermosetting or hardening material may be a material that is cured by volatilization of certain ingredients (eg, solvent (s), plasticizers, etc.). The types of curing described above, for example, at room temperature or at an elevated temperature (eg

between 60 ° C and 100 ° C). Such a thermosetting thermosetting material may be e.g. Be adhesive.

The thermosetting thermosetting material may also be a through

Cooling hardening material, e.g. at least one thermoplastic or a hot melt adhesive. This has the advantage that the solidification happens very quickly and also the

Initial viscosity vA is selectively adjustable, e.g. by setting the melting temperature. The thermosetting thermosetting material may also be a material that hardens or solidifies by chemical reactions of the components, e.g. by polyaddition, polycondensation and / or polymerization. In particular, such a chemically curing thermal interface material may be, but is not limited to, a multicomponent material. For example, the multicomponent material may include a base material to be cured as a first component and a hardener as a second component. It is also a continuing education that dynamic

Initial viscosity vA of the thermosetting thermally conductive material is at least 100 Pascal seconds to safely achieve the shape retention or dimensional stability during filling. It is still a continuing education that dynamic

Final viscosity vE of the hardening or non-hardening heat conducting material at least 175 Pascal seconds,

in particular at least 200 Pascal seconds, in particular at least 225 Pascal seconds, in particular at least 250 Pascal seconds.

It is for securely maintaining a contact with the electrical and / or electronic component as well as to the Driver housing under a wide range of temperatures advantageous in that the thermal interface material has an ultimate viscosity vE of not more than 400 Pascal seconds, in particular not more than 350 Pascal seconds, in particular not more than 325 Pascal seconds, in particular not more than 300 Pascal seconds. Because so can the heat conduction material or the existing local thermally conductive body

heat-related strains of the driver housing safely follow. In principle, a local thermally conductive body may cover or contact a plurality of driver components. This has the advantage that so improved cooling of many

Driver components is enabled. It is yet another embodiment that the local thermally conductive body is exactly one driver component and that

Driver housing contacted. This has the advantage that heat can be dissipated particularly effectively from the component covered or contacted by the body or the heat-conducting material. This embodiment is particular

advantageous for heat dissipation of heat

Driver components ("hotspots"), which are particularly

are heat-sensitive and / or which generate a lot of heat during operation. This embodiment is for example both applicable to driver components, which on a

Printed circuit board of the driver are attached, as well

Driver components that are not on the driver board. For driver components which are not on the printed circuit board of the driver, the local thermally conductive body may also serve as a fastener, e.g. as an adhesive. However, a plurality of driver components not located on the printed circuit board of the driver can also be connected to the driver housing by means of a local thermally conductive body.

The driver housing may in particular have at least a first housing part and a second housing part. The first housing part and the second housing part like in particular be separately provided components. This facilitates placement of the driver.

The first housing part of the driver housing may in particular be a lower housing part, which is open on the front side and has at least one rearward electrical connection contact for connection to a socket. The at least one electrical connection contact may, in particular together with a part of the lower housing part, constitute a part of a base or base region of the semiconductor lamp. Of the

Socket may e.g. be formed as a conventional socket, e.g. as an Edison socket (eg of the E type such as E 14 or E27), as a plug-in or bipin socket (eg of the GU type such as GU5.3 or GU10), as a bayonet socket (eg of the type BC , B22 or B22d) or as a tube socket (eg of type G5 or G13). An electrical connection contact may therefore be e.g. a pin or pin, e.g. for a socket of the GU type. The lower housing part or its front-side opening may in particular be closable or concealable by the second housing part. For this purpose, the second housing part is preferably designed as an upper housing part or cover. The lid may in particular be at least one passage, e.g. one

Cable duct, for passing electrical lines from the driver to the at least one semiconductor light source. The cover may, in particular, have a planar bearing surface on its front side facing away from the lower driver housing, for example for a heat sink (if present) or for a substrate carrying the semiconductor light source (s). The lid may, for example, the

Touch protection against electrical voltage and used as a holder of housed in the driver housing electrical driver. The passage of the lid can also be used as guidance and stabilization of the electrical lines, e.g. Cable, for the electrical supply of

Semiconductor light sources can be used. This allows the soldering of the substrate to the electrical leads be simplified. It could also laser soldering used. This greatly simplifies machine soldering of the substrate to the electrical leads. Also like an electrical contact via a connector, etc.

respectively.

It is also an embodiment that the first

Housing part widens in the direction of the second housing part and at least one contacted by a local thermally conductive body driver component in the vicinity of the second

Housing part is located component. This allows a particularly good heat dissipation of driver components, which are arranged close to the lid. This can be done by the

Expansion of the first housing part particularly large

Driver components, which are often particularly critical to heat.

It is a development that the local thermally conductive body has at least one driver component and the second

Housing contacted, so a thermal bridge or

thermally conductive connection between at least one

Driver component and the second housing part manufactures.

It is also an embodiment that at least the first housing part is a heat sink or heat dissipation element or "heat sink"

Dissipation of heat from the driver cavity, in particular connected to the local thermally conductive body

Driver components, allows. However, in addition or alternatively, the second housing part may be formed as a heat sink or "heat sink".

The first housing part and / or the second housing part may, in particular when used as a heat sink made of metal, for example made of aluminum. This embodiment can be used particularly advantageously for low-voltage lamps, which are operated, for example, with a supply voltage of 12 volts. Here, only minor requirements electrical creepage distances and clearances are maintained. In an electrically insulating local thermally conductive body (that is, if the heat conducting material is electrically insulating in the operable state), these creeping and

Air gaps even when contacting current-carrying areas of the driver (for example, of tracks or

electrical contacts) and an electrically conductive driver housing ensure sufficient electrical insulation of the driver relative to the driver housing.

Basically, the driver housing may be wholly or partially formed as a heat sink or Heatsink or Wärmeableitkörper. However, the housing parts are not limited thereto, but may also consist of plastic or ceramic, the first housing part and / or the second housing part.

It is also an embodiment that the driver housing at least one opening (hereinafter referred to as

This insertion opening (e.g., a hole) may be used to secure the insertion opening

Wärmeleitmaterial even with closed driver cavity, so connected housing parts, to be able to introduce locally targeted. This can e.g. by inserting a hollow needle or lance into the insertion opening, positioning its tip in the desired area to be filled, and extruding the heat-conducting material from its tip. The at least one insertion opening may be located in particular in the lower housing part, since this is a particularly good

Reachability within the driver cavity.

It is one to protect the driver from corrosion, etc.

advantageous development that the insertion opening is closed, for the sake of ease of manufacture preferably by means of the heat conduction, but alternatively, for example, by means of a plug or a solder. It is also a development that the semiconductor lamp has a substrate equipped with the at least one semiconductor light source. The substrate may be for example a

Circuit board (often referred to as "submount"), which with the at least one semiconductor light source

is equipped. The circuit board may e.g. common

Having board material as a base material, e.g. FR4, may be formed as a metal core board or may be ceramic, e.g. For example, the substrate may be annular disk-shaped, with a central hole, for example, serving to pass the forwardly projecting cable duct of the lid.

It is furthermore a development that the semiconductor lamp has a light-permeable cover for the substrate and thus also the at least one semiconductor light source and, if appropriate,

additionally comprises arranged on the substrate electrical or electronic components. The translucent

Cover may be, for example, a transparent or opaque (translucent) protective cover and / or at least one optical element (e.g., a reflector, a lens, a lens)

Collimator, a diaphragm, etc.).

It is also a development that the semiconductor lamp has at least one dedicated heat sink. Of the

The heat sink may be made of metal, e.g. Aluminum and / or copper. The heat sink may be e.g. by cast aluminum, as deep-drawn or extruded profile present. The use of the at least one heat sink may be advantageous in particular for semiconductor lamps of higher power.

In particular, the semiconductor lamp may be a replacement or retrofit lamp for replacing conventional lamps, e.g. to replace a light bulb, a halogen lamp, a

Gas discharge lamp, a gas discharge tube, a

Line lamp, etc. The retrofit semiconductor lamp is particularly suitable for a socket that fits into conventional sockets have, for example, an Edison socket, a bipin socket (eg of the GU type) or a bayonet socket. The invention is particularly advantageously applicable to halogen lamp retrofit lamps, in particular for PAR headlamps, eg of the type PAR 16, or to halogen lamp retrofit lamps for the type MR, for example MR 16 or MR 11.

The problem is also solved by a method for

Producing a semiconductor lamp with at least one

A semiconductor light source, the method comprising at least the following steps: (a) housing a driver in a driver cavity of a driver housing

Semiconductor lamp and (b) molding or filling into the driver cavity of Wärmeleitmaterial formhaltend

pasty consistency so that a localized

extended heat-conducting body between a portion of the driver and a portion of the driver housing this is formed contacting. The method gives the same advantages as the semiconductor lamp and can be configured analogously.

Thus, for example, the heat-conducting material may be introduced in a form-retaining paste-like consistency by means of a hollow needle through an insertion opening in the driver housing. In particular, a hollow needle or lance may be inserted into the insertion opening, its tip positioned in the desired region to be filled, and then the thermal interface material pressed out of its tip. The at least one introduction opening likes

be introduced in particular in the lower housing part, as can be a particularly good accessibility within the driver cavity obtain.

The above-described characteristics, features and advantages of this invention as well as the manner in which they are achieved will become clearer and more clearly understood

In connection with the following schematic description of exemplary embodiments that are associated with the Drawings are explained in more detail. It can to

Clarity identical or equivalent elements must be provided with the same reference numerals.

1 shows an exploded view in an oblique view of a semiconductor lamp without a local heat-conducting body;

FIG. 2 shows the semiconductor lamp as a sectional illustration in FIG

Side view.

Fig.l shows an exploded view in an oblique view of a semiconductor lamp in the form of an LED lamp 1 according to a first embodiment, even without a local thermally conductive body.

The LED lamp 1 has, in the order shown, from a rear end to a front end: two terminal contacts projecting in a rearward direction in the form of e.g. PARI 6-kopatiblen connection pins 2, a first

Housing part of a driver housing in the form of a lower

Housing part 3, which has a forwardly open side 6, a driver 4 for use in the lower housing part 3, a second housing part of the driver housing in the form of a cover 5 to cover the open side 6 of the lower housing part 3, an annular disc-shaped, thermally highly conductive

Adhesive film 7 ("TIM film"), which is to be placed on the front side of the lid 5, an annular disc-shaped substrate 8, which with its back on the adhesive film. 7

is to hang up and several at the front

Semiconductor light sources in the form of light-emitting diodes, LEDs, 9 and a translucent cover in the form of a lens 10. In addition, a laterally circumferential

(second) heat sink 11 available. The LED lamp 1 is designed here as a halogen lamp retrofit lamp, in particular of the type PAR16. The terminal pins 2 and the driver housing 3 thus form a GU-type socket. The driver 4 is in the assembled state with the

Connection pins 2 electrically connected and can be fed via this with a supply voltage. The driver 4 has a printed circuit board 19, which is inserted vertically into the lower housing part 3. The printed circuit board 19 is equipped on both sides with driver components 20. Basically, a diagonally or horizontally mounted driver is also conceivable.

The lid 5 serves to close the open side 6 of the lower driver housing 3. The lid 5 has a central, forwardly projecting cable channel 12 through which electrical lines (not shown) for supplying the LEDs 9 from the driver 4 to the Substrate 8 are passed. The cover 5 can be placed on the driver housing 3 in a latching manner and has detent receptacles 16 into which latching lugs 18, which project forwardly, can snap into engagement with an upper edge 17 of the driver housing 3. The lower housing part 3 widens in the direction of the lid 5.

The substrate 8 has a central opening 13 to

Implementation of the cable channel 12. The substrate 8 may be e.g. a ceramic substrate or a metal core board.

The LEDs 9 are usually in a separate

Manufacturing process on the front of the substrate. 8

placed. Alternatively, the LEDs 9 may be deposited in a COB ("chip on board") process on the substrate 8. The LEDs 9 are here formed as packaged LEDs, for example as white light emitting LEDs.

The laterally circulating heat sink 11 is e.g. Made of aluminum and to rest on an outside

Jacket surface 14 of the driver housing 3 is provided to the

Derivation of generated within the driver housing 3 heat to improve. The heat sink 11 has several parallel here to the longitudinal direction (vertically) aligned, in

Circumferentially equidistantly distributed cooling fins 15.

2 shows a sectional side view of the fully assembled LED lamp 1 (without the LEDs 9). The lower housing part 3 and the lid 5 form a

Driver housing 3, 5, which defines a driver cavity 21 therein. In the driver cavity 21, the driver is 4

accommodated. In the driver cavity 21, three local heat-conductive body 22, 23 and 24 have been introduced, which consist of a heat-conducting material 25, which has been filled in form-retaining paste-like consistency in the driver cavity or introduced. The heat-conducting material 25 has here purely by way of example a thermal conductivity of at least 1.5 W / (m-K). This produces an effective thermal bridge between the driver components 20 and the driver housing 3, 5 respectively covered by the bodies 22, 23 and 24. This achieves the advantage of a particularly effective heat dissipation with good handling and dimensional stability. More specifically, a driver 20a of the driver components 20 is connected to the lower case 3 by means of the body 22. Another driver component 20b close to the lid of the driver components 20 is connected to the lower housing part 3 by means of the body 23 and to the lid 5 by means of the body 24.

For example, the body 23 may also be dispensed with. In particular, the driver component 20a and the capping driver component 20b may each be a hotspot.

The thermal interface material 25 is here purely by way of example a thermosetting thermal material 25, e.g. a two-component heat conducting material. It has a dynamic initial viscosity vA of 100 pascal seconds during filling and, after curing, a dynamic final viscosity vE of about 250

Pascal seconds. The filling of the Wärmeleitmaterials 25 can for example be done through the opening 6 of the lower housing part 3, for example, to form the body 22 and 23. The filling of the Wärmeleitmaterials 25 may alternatively or additionally be done by the cable channel 12, in particular for generating the body 23 and 24th The filling of the Wärmeleitmaterials 25 may alternatively or additionally by at least one

Insertion opening 26 in the lower housing part 3, e.g. by means of a hollow needle. The at least one

Insertion opening 26 may then be closed with the heat-conducting material 25.

Although the LED lamp 1 is shown here as the

Driver housing 3, 5 and the heat sink 11 are separate components, e.g. by means of an injection molding material 27

connected to each other, alternatively, at least the lower housing part 3 and / or the cover 5 may be a heat sink or a part thereof and for this example consist of metal. On a separate heat sink then likes

be waived.

Although the invention is shown in detail by the

Embodiments have been further illustrated and described, the invention is not limited thereto and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more" etc., unless this is explicitly excluded, e.g. by the expression "exactly one", etc.

Also, a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded. , ₀

Reference sign

1 LED lamp

2 connection pin

3 driver housing

4 drivers

5 lids

6 open side of the driver housing

7 adhesive film

8 substrate

9 LED

10 lens

11 heat sink

12 cable channel

13 central opening

14 lateral surface of the driver housing

15 cooling fin

16 locking receptacle

17 upper edge of the driver housing 18 latching tab

19 circuit board

20 driver component

20a driver car

20b driver component

21 driver cavity

22 thermally conductive body

23 thermally conductive body

24 thermally conductive body

25 heat conduction material

26 introduction opening

27 injection molding material

Claims

protection claims

1. semiconductor lamp (1) with at least one

Semiconductor light source (9) comprising

a driver housing (3) with a driver cavity (21)

- One in the driver cavity (21) housed

Driver (4) and

a local thermally conductive body (22, 23, 24),

which connects a part of the driver (4) with a part of the driver housing (3, 5) thermally conductive, wherein

- The local thermally conductive body (22, 23, 24) made

a Wärmeleitmaterial (25) of when filling in the driver cavity (21) form-retaining paste-like consistency.

2. A semiconductor lamp (1) according to claim 1, wherein the

Wärmeleitmaterial (25) in the cured state, a thermal conductivity λ of at least 0.35 W / (mK), in particular of at least 0.5 W / (mK), in particular of at least 0.75 W / (mK), in particular of at least 1 W. / (mK), in particular of at least 1.5 W / (mK), in particular of at least 1.75 W / (mK).

3. A semiconductor lamp according to any one of the preceding claims, wherein the heat conducting material is a non-hardening

Material is.

4. The semiconductor lamp (1) according to any one of claims 1 to 2, wherein the heat conduction material (25) is a curing

Material is.

5. semiconductor lamp (1) according to one of the preceding

Claims, wherein the local heat-conducting body (22, 23, 24) exactly one driver component (20, 20a, 20b) and the

Driver housing (3, 5) contacted. Semiconductor lamp (1) according to one of the preceding

Claims, wherein

- The driver housing (3, 5) has a first housing part (3) and a second housing part (5),

- The first housing part (3) in the direction of

second housing part (5) expands and

- At least one by a local heat-conducting

Body (24) contacted driver component (20b) is located in the vicinity of the second housing part (5) component.

Semiconductor lamp (1) according to one of the preceding

Claims, wherein at least the first housing part (3) is a heat sink (11).

Semiconductor lamp (1) according to one of the preceding

Claims, wherein the driver housing (3, 5) has at least one insertion opening (26).