EP2053666A1 - Heat dissipation device for LEDs and related production method - Google Patents
Heat dissipation device for LEDs and related production method Download PDFInfo
- Publication number
- EP2053666A1 EP2053666A1 EP08167394A EP08167394A EP2053666A1 EP 2053666 A1 EP2053666 A1 EP 2053666A1 EP 08167394 A EP08167394 A EP 08167394A EP 08167394 A EP08167394 A EP 08167394A EP 2053666 A1 EP2053666 A1 EP 2053666A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- mounting board
- led
- heatsink
- board
- heatsink element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- Modern lighting devices and apparatus make increasingly frequent use of light emitting diodes or LEDs due to their ease of use and superior characteristics, compared to conventional light sources composed of incandescent and fluorescent lamps, in terms of average useful life, flexibility of use and the possibility of integration into small spaces.
- present LEDs only emit 20-30% of the absorbed power in the form of visible light radiation and dissipate the remaining 70-80% by conduction and convection. This naturally makes it necessary to provide LED devices employed for lighting with adequate dissipation means which guarantee elimination of the heat generated so as to ensure correct operation of this LED device and of the surrounding circuit.
- the present invention relates to a lighting device based on LEDs (Light Emitting Diode) and comprising suitable heat dissipation means, associated with said LEDs, suitable to be managed in a flexible manner for use with LEDs of different sizes and rated powers without this requiring new design of the circuit layout.
- LEDs Light Emitting Diode
- the appended Fig. 1 shows a perspective view of a preferred embodiment of the present invention.
- the lighting device based on LEDs shown in the aforesaid figure comprises a mounting board for electronic components 10, suitable to mount, on the one side, said electronic components including at least one light emitting diode or LED 11 and relative optics 12, and, on the other side, at least one heatsink element 13 associated with said at least one LED.
- Said mounting board 10 is suitable to house LEDs 11 of different sizes while said at least one heatsink element 13 is composed of a bar of heat conductive material, preferably produced by extrusion, having a cross section of fixed and constant dimensions and suitable to be fastened by one of the base sides thereof to said mounting board 10 so as to extend in length in a direction essentially perpendicular thereto.
- said at least one heatsink element 13 makes it possible to ensure a fixed and constant dimension on the mounting board 10 while the thermal resistance can be modulated as desired - to meet changing dissipation requirements of the electronic circuit - simply by modifying the length.
- This allows the designer to dimension the layout of the mounting board 10 so that it can house LED devices of various sizes and rated powers using only one type of heatsink element, the thermal resistance of which is adapted time by time to the dissipation requirements of the circuit simply by changing the length of said heatsink element 13.
- Said at least one heatsink element 13 is provided with appropriate means for fastening to said mounting board 10 suitable to provide the necessary mechanical stability, maintaining it in an appropriate position to eliminate the power dissipated by the LED device with which it is associated.
- the LED devices present on said mounting board 10 are three in number 20, 21, 22, evenly spaced apart by approximately 120° and provided with relative optics 23, 24, 25, as shown in the appended Fig. 2 , which shows a plan view of the component side of said mounting board 10.
- the LED devices present on said mounting board 10 are three in number 20, 21, 22, evenly spaced apart by approximately 120° and provided with relative optics 23, 24, 25, as shown in the appended Fig. 2 , which shows a plan view of the component side of said mounting board 10.
- On the opposite side of said mounting board 10 shown in a plan view in the appended Fig.
- an extruded heatsink 30 shaped appropriately so as to be associated with each of said three LED devices 20, 21, 22 and provided with means for fastening to said board 10 composed of a central pin 31 suitable to engage, at one end, with a specific hole on said mounting board 10, and, at the other end, with a cross member 32 suitable to exert the necessary pressure on said extruded heatsink shaped so as to minimize the thermal resistance of contact with said mounting board 10.
- Said cross member 32 can also be suitable to operate as locking element for any power cables associated with said board 10.
- said optics 23, 24, 25, can be produced through a single element comprising 3 conical lenses each associated with a LED device 20, 21, 22 mounted on said board 10 and connected by a surface 26 suitably machined so as to provide the total cone of light desired and provided with appropriate means for fastening to said board 10 which can be produced, for example, by appropriate pins 14, 15, suitable to engage with specific holes 27, 28, 29 made in said mounting board 10.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Lighting device - and related production method - comprising a mounting board for electronic components (10) suitable to mount, on the one side, said electronic components including at least one light emitting diode or LED (11) and relative optics (12), and, on the other side, at least one heatsink element (13) associated with said at least one LED (11) and suitable to be fastened through one of the base sides thereof to said mounting board (10) so as to extend in length in a direction essentially perpendicular thereto, characterized in that said mounting board (10) is suitable to house LEDs (11) of different size and rated power and said at least one heatsink element (13) is obtained from a bar of heat conductive material having a cross section of fixed and constant dimensions and length determined by the size of said at least one LED (11).
Description
- The present invention relates to the field of lighting devices, in particular it relates to the field of LED (Light Emitting Diode) devices and to techniques to eliminate heat generated during their operation.
- Modern lighting devices and apparatus make increasingly frequent use of light emitting diodes or LEDs due to their ease of use and superior characteristics, compared to conventional light sources composed of incandescent and fluorescent lamps, in terms of average useful life, flexibility of use and the possibility of integration into small spaces.
- Notwithstanding the fact that technology regarding LED light sources promises imminent developments that will further improve the characteristics and determine that LEDs finally surpass all other light sources, one of the aspects that to date has been considered most problematic concerns the power dissipation of these devices and the need for efficient systems for eliminating and dissipating the resulting heat.
- In fact, present LEDs only emit 20-30% of the absorbed power in the form of visible light radiation and dissipate the remaining 70-80% by conduction and convection. This naturally makes it necessary to provide LED devices employed for lighting with adequate dissipation means which guarantee elimination of the heat generated so as to ensure correct operation of this LED device and of the surrounding circuit.
- In the majority of cases the most widely used method for this purpose provides for the use of metal heatsinks, with ad hoc dimensions, to be placed in contact with the LED device so as to eliminate the power dissipated by conduction and maintain the operating temperature within such limits as not to compromise correct operation and reduce the average useful life of the device. However, this solution naturally requires the design and use of a new heatsink each time the LED device utilized in a specific lighting appliance is replaced with one of different size. This has obvious consequences on the layout of the circuit as a whole, which could require modifications to obtain the space required for the new heatsink.
- It is therefore desirable to introduce a lighting device based on LEDs and comprising suitable heat dissipation means, associated with said LEDs, suitable to be managed in a flexible manner for use with LEDs of different sizes and rated powers without this requiring a new design of the circuit layout.
- The present invention relates to a lighting device based on LEDs (Light Emitting Diode) and comprising suitable heat dissipation means, associated with said LEDs, suitable to be managed in a flexible manner for use with LEDs of different sizes and rated powers without this requiring new design of the circuit layout.
-
-
Fig. 1 is a perspective view of a preferred embodiment of the present invention. -
Fig. 2 is a plan view of the component side of the mounting board included in a preferred embodiment of the present invention. -
Fig. 3 is a plan view of the heatsink side of the mounting board included in a preferred embodiment of the present invention. - The appended
Fig. 1 shows a perspective view of a preferred embodiment of the present invention. The lighting device based on LEDs shown in the aforesaid figure comprises a mounting board forelectronic components 10, suitable to mount, on the one side, said electronic components including at least one light emitting diode orLED 11 andrelative optics 12, and, on the other side, at least oneheatsink element 13 associated with said at least one LED. - Said
mounting board 10 is suitable to houseLEDs 11 of different sizes while said at least oneheatsink element 13 is composed of a bar of heat conductive material, preferably produced by extrusion, having a cross section of fixed and constant dimensions and suitable to be fastened by one of the base sides thereof to saidmounting board 10 so as to extend in length in a direction essentially perpendicular thereto. - In this manner said at least one
heatsink element 13 makes it possible to ensure a fixed and constant dimension on themounting board 10 while the thermal resistance can be modulated as desired - to meet changing dissipation requirements of the electronic circuit - simply by modifying the length. This allows the designer to dimension the layout of themounting board 10 so that it can house LED devices of various sizes and rated powers using only one type of heatsink element, the thermal resistance of which is adapted time by time to the dissipation requirements of the circuit simply by changing the length of saidheatsink element 13. - Said at least one
heatsink element 13 is provided with appropriate means for fastening to saidmounting board 10 suitable to provide the necessary mechanical stability, maintaining it in an appropriate position to eliminate the power dissipated by the LED device with which it is associated. - In a preferred embodiment of the device according to the present invention, the LED devices present on said
mounting board 10 are three innumber relative optics Fig. 2 , which shows a plan view of the component side of saidmounting board 10. On the opposite side of saidmounting board 10, shown in a plan view in the appendedFig. 3 , anextruded heatsink 30 shaped appropriately so as to be associated with each of said threeLED devices board 10 composed of acentral pin 31 suitable to engage, at one end, with a specific hole on saidmounting board 10, and, at the other end, with across member 32 suitable to exert the necessary pressure on said extruded heatsink shaped so as to minimize the thermal resistance of contact with saidmounting board 10. Saidcross member 32 can also be suitable to operate as locking element for any power cables associated with saidboard 10. - In a preferred embodiment of the present invention, said
optics LED device board 10 and connected by asurface 26 suitably machined so as to provide the total cone of light desired and provided with appropriate means for fastening to saidboard 10 which can be produced, for example, byappropriate pins specific holes mounting board 10.
Claims (9)
- Lighting device comprising a mounting board for electronic components (10) suitable to mount, on the one side, said electronic components including at least one light emitting diode or LED (11) and relative optics (12), and, on the other side, at least one heatsink element (13) associated with said at least one LED (11) and suitable to be fastened through one of the base sides thereof to said mounting board (10) so as to extend in length in a direction essentially perpendicular thereto, characterized in that said mounting board (10) is suitable to house LEDs (11) of different size and rated power and said at least one heatsink element (13) is obtained from a bar of heat conductive material having a cross section of fixed and constant dimensions and length determined by the size of said at least one LED (11).
- Device as claimed in claim 1, characterized in that said at least one heatsink element (13) is produced by extrusion.
- Device as claimed in claims 1 - 2, characterized in that said at least one heatsink element (13) is provided with appropriate means for fastening to said mounting board (10) suitable to provide the necessary mechanical stability, maintaining it in an appropriate position to eliminate the power dissipated by the LED device with which it is associated.
- Device as claimed in claims 1 - 3, characterized in that said mounting board (10) is associated with three LED devices (20, 21, 22), evenly spaced apart by approximately 120° and provided with relative optics (23, 24, 25).
- Device as claimed in claims 3 - 5, characterized in that said appropriate means for fastening to said mounting board (10) with which said at least one heatsink element (13) is provided, are composed of a central pin (31) suitable to engage, at one end, with a specific hole on said mounting board (10), and, at the other end, with a cross member (32) suitable to exert the necessary pressure on said heatsink (13).
- Device as claimed in claim 5, characterized in that said cross member (32) is also suitable to operate as locking element for any power cables associated with said board (10).
- Device as claimed in claims 4 - 6, characterized in that said optics (23, 24, 25) are produced through a single element comprising three conical lenses each associated with each one of said LED devices (20, 21, 22) mounted on said board (10) and connected by a surface (26) suitably machined so as to provide the total cone of light desired and provided with appropriate means for fastening to said board (10).
- Device as claimed in claim 5, characterized in that said appropriate means for fastening to said board (10) are produced by appropriate pins (14, 15) suitable to engage with specific holes (27, 28, 29) made in said mounting board (10).
- Method for producing lighting devices comprising the following steps:a) use of a mounting base for electronic components suitable to house, on the one side, LED devices (11) of different size and rated power and relative optics (12), and, on the other side, at least one heatsink element (13) associated with said at least one LED;b) use of a heatsink element (13) composed of a bar of heat conductive material, having a cross section of fixed and constant dimensions and suitable to be fastened by one of the base sides thereof to said mounting board (10) so as to extend in length in a direction essentially perpendicular thereto;c) adaptation of the thermal resistance of said heatsink element (13) by changing the length thereof.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000235A ITFI20070235A1 (en) | 2007-10-23 | 2007-10-23 | DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2053666A1 true EP2053666A1 (en) | 2009-04-29 |
Family
ID=40313693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08167394A Withdrawn EP2053666A1 (en) | 2007-10-23 | 2008-10-23 | Heat dissipation device for LEDs and related production method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2053666A1 (en) |
CN (1) | CN101451701A (en) |
IT (1) | ITFI20070235A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2484967A2 (en) | 2011-02-07 | 2012-08-08 | Collingwood Lighting Limited | Lighting unit |
DE102017119733A1 (en) | 2016-08-30 | 2018-03-01 | Varroc Lighting Systems, s.r.o. | Radiator, in particular for signaling or lighting installations for motor vehicles, and its production method |
US9927112B2 (en) | 2013-06-24 | 2018-03-27 | Trinity, Llc | Universal cornice light for product display |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5940264A (en) * | 1996-10-04 | 1999-08-17 | Philips Electronics North America Corp | Electrolytic capacitor with heat sink and method of heat dissipation |
EP1081760A2 (en) * | 1999-08-30 | 2001-03-07 | Molex Incorporated | Heat sink assembly |
WO2002097884A1 (en) * | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
WO2003023853A2 (en) * | 2001-09-10 | 2003-03-20 | Intel Corporation | Electronic assemblies with high capacity heat sinks and methods of manufacture |
US20050158687A1 (en) * | 2002-07-25 | 2005-07-21 | Dahm Jonathan S. | Method and apparatus for using light emitting diodes for curing |
US20050178527A1 (en) * | 2004-02-12 | 2005-08-18 | Yaxiong Wang | Heat dissipation device for electronic device |
DE102004004778A1 (en) * | 2004-01-30 | 2005-09-08 | Osram Opto Semiconductors Gmbh | LED lighting module for use as reading light on piece of furniture has three equispaced fluorescent plastics lenses molded in one piece with circular cover with cylindrical sides and fastening pegs |
US20060126303A1 (en) * | 2004-12-11 | 2006-06-15 | Foxconn Technology Co., Ltd | Heat dissipating device |
-
2007
- 2007-10-23 IT IT000235A patent/ITFI20070235A1/en unknown
-
2008
- 2008-10-22 CN CNA2008101673588A patent/CN101451701A/en active Pending
- 2008-10-23 EP EP08167394A patent/EP2053666A1/en not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5940264A (en) * | 1996-10-04 | 1999-08-17 | Philips Electronics North America Corp | Electrolytic capacitor with heat sink and method of heat dissipation |
EP1081760A2 (en) * | 1999-08-30 | 2001-03-07 | Molex Incorporated | Heat sink assembly |
WO2002097884A1 (en) * | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
WO2003023853A2 (en) * | 2001-09-10 | 2003-03-20 | Intel Corporation | Electronic assemblies with high capacity heat sinks and methods of manufacture |
US20050158687A1 (en) * | 2002-07-25 | 2005-07-21 | Dahm Jonathan S. | Method and apparatus for using light emitting diodes for curing |
DE102004004778A1 (en) * | 2004-01-30 | 2005-09-08 | Osram Opto Semiconductors Gmbh | LED lighting module for use as reading light on piece of furniture has three equispaced fluorescent plastics lenses molded in one piece with circular cover with cylindrical sides and fastening pegs |
US20050178527A1 (en) * | 2004-02-12 | 2005-08-18 | Yaxiong Wang | Heat dissipation device for electronic device |
US20060126303A1 (en) * | 2004-12-11 | 2006-06-15 | Foxconn Technology Co., Ltd | Heat dissipating device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2484967A2 (en) | 2011-02-07 | 2012-08-08 | Collingwood Lighting Limited | Lighting unit |
US9927112B2 (en) | 2013-06-24 | 2018-03-27 | Trinity, Llc | Universal cornice light for product display |
DE102017119733A1 (en) | 2016-08-30 | 2018-03-01 | Varroc Lighting Systems, s.r.o. | Radiator, in particular for signaling or lighting installations for motor vehicles, and its production method |
Also Published As
Publication number | Publication date |
---|---|
CN101451701A (en) | 2009-06-10 |
ITFI20070235A1 (en) | 2009-04-24 |
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