ITFI20070235A1 - DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. - Google Patents
DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. Download PDFInfo
- Publication number
- ITFI20070235A1 ITFI20070235A1 IT000235A ITFI20070235A ITFI20070235A1 IT FI20070235 A1 ITFI20070235 A1 IT FI20070235A1 IT 000235 A IT000235 A IT 000235A IT FI20070235 A ITFI20070235 A IT FI20070235A IT FI20070235 A1 ITFI20070235 A1 IT FI20070235A1
- Authority
- IT
- Italy
- Prior art keywords
- mounting base
- led
- base
- dissipator
- fastening means
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000004020 conductor Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Description
Descrizione dell'invenzione industriale dal titolo : Description of the industrial invention entitled:
“Dispositivo di dissipazione per LED “ "LED dissipation device"
CAMPO DELL'INVENZIONE FIELD OF THE INVENTION
La presente invenzione si riferisce al campo dei dispositivi per illuminazione, in particolare si riferisce al campo dei dispositivi a LED (Light Emitting Diode) e alle tecniche di smaltimento del calore generato durante il loro funzionamento. The present invention refers to the field of lighting devices, in particular it refers to the field of LED (Light Emitting Diode) devices and to the techniques for dissipating the heat generated during their operation.
STATO DELL'ARTE STATE OF THE ART
I dispositivi e gli apparati di illuminazione odierni fanno un uso sempre più frequente dei diodi ad emissione luminosa o LED (Light Emitting Diodes) in virtù della loro semplicità d’impiego e delle superiori caratteristiche, rispetto alle sorgenti di luce tradizionali costituite dalle lampade ad incandescenza e a fluorescenza, in termini di durata di vita media, di flessibilità d’utilizzo e di possibilità di integrazione in spazi ridotti. Today's lighting devices and apparatuses make an increasingly frequent use of light emitting diodes or LEDs (Light Emitting Diodes) by virtue of their simplicity of use and superior characteristics, compared to traditional light sources consisting of incandescent lamps. and fluorescence, in terms of average life, flexibility of use and the possibility of integration in small spaces.
Nonostante la tecnologia riguardante le sorgenti luminose a LED prometta imminenti sviluppi tali da migliorarne ulteriormente le caratteristiche decretando il definitivo sorpasso dei LED rispetto a tutte le altre sorgenti luminose, uno degli aspetti che, ad oggi, è considerato maggiormente problematico riguarda la dissipazione di potenza di questi dispositivi e la necessità di efficaci sistemi di smaltimento e dissipazione del calore che ne consegue. Although the technology concerning LED light sources promises imminent developments such as to further improve their characteristics by decreeing the definitive overtaking of LEDs compared to all other light sources, one of the aspects that, to date, is considered most problematic concerns the power dissipation of these devices and the need for effective heat dissipation and dissipation systems that follow.
I LED attuali, infatti, emettono sotto forma di radiazione luminosa visibile soltanto il 20 - 30% della potenza assorbita e dissipano per conduzione e convezione il restante 70 - 80%. Questo comporta l'ovvia necessità di munire i dispositivi LED impiegati per illuminazione di adeguati mezzi di dissipazione che garantiscano lo smaltimento del calore generato in maniera da garantire la corretta operazione dello stesso dispositivo LED e della circuiteria circostante. In fact, current LEDs emit only 20 - 30% of the absorbed power in the form of visible light radiation and dissipate the remaining 70 - 80% by conduction and convection. This entails the obvious need to provide the LED devices used for lighting with adequate dissipation means which ensure the dissipation of the heat generated so as to guarantee the correct operation of the LED device itself and of the surrounding circuitry.
Nella maggioranza dei casi il metodo più utilizzato a tale scopo prevede l’uso di dissipatori metallici, dimensionati ad hoc, da disporre a contatto con il dispositivo LED in modo da smaltirne la potenza dissipata per conduzione e mantenerne la temperatura di lavoro entro limiti tali da non pregiudicarne il corretto funzionamento e da non abbassarne il tempo medio di vita. Questa soluzione, tuttavia, richiede ovviamente il progetto e l’impiego di un nuovo dissipatore ogni qualvolta venga sostituito il dispositivo LED utilizzato in un determinato apparecchio di illuminazione con uno di taglia diversa. Ciò comporta ovvie conseguenze sul lay-out del circuito complessivo che potrebbe necessitare di modifiche per ricavare lo spazio necessario al nuovo dissipatore. In most cases, the most used method for this purpose involves the use of metal heat sinks, sized ad hoc, to be placed in contact with the LED device in order to dispose of the power dissipated by conduction and keep the working temperature within limits such as to not to jeopardize its correct functioning and not to lower its average life time. This solution, however, obviously requires the design and use of a new heatsink each time the LED device used in a particular lighting fixture is replaced with one of a different size. This has obvious consequences on the lay-out of the overall circuit which may need to be modified to obtain the necessary space for the new heat sink.
E’ quindi auspicabile l’introduzione di un dispositivo di illuminazione basato su LED e comprendente opportuni mezzi di dissipazione termica, associati a detti LED, atti a poter essere gestiti in maniera flessibile per l’utilizzo con LED di diverse taglie e potenze nominali senza per questo richiedere una nuova progettazione del lay-out circuitale. It is therefore desirable to introduce a lighting device based on LEDs and comprising suitable thermal dissipation means, associated with said LEDs, able to be managed flexibly for use with LEDs of different sizes and nominal powers without forcing this requires a new design of the circuit lay-out.
SOMMARIO DELL'INVENZIONE SUMMARY OF THE INVENTION
La presente invenzione concerne un dispositivo di illuminazione basato su LED (Light Emitting Diodes) e comprendente opportuni mezzi di dissipazione termica, associati a detti LED, atti a poter essere gestiti in maniera flessibile per l’utilizzo con LED di diverse taglie e potenze nominali senza per questo richiedere una nuova progettazione del layout circuitale. The present invention relates to a lighting device based on LEDs (Light Emitting Diodes) and comprising suitable thermal dissipation means, associated with said LEDs, capable of being managed flexibly for use with LEDs of different sizes and nominal powers without for this, request a new design of the circuit layout.
BREVE DESCRIZIONE DEI DISEGNI BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 Veduta in prospetto di una realizzazione preferita della presente invenzione. Fig. 1 View in elevation of a preferred embodiment of the present invention.
Fig. 2 Veduta in pianta del lato componenti della basetta di montaggio compresa in una realizzazione preferita della presente invenzione. Fig. 2 Plan view of the component side of the mounting base included in a preferred embodiment of the present invention.
Fig. 3 Veduta in pianta del lato dissipatori della basetta di montaggio compresa in una realizzazione preferita della presente invenzione. Fig. 3 Plan view of the dissipator side of the mounting base included in a preferred embodiment of the present invention.
DESCRIZIONE DETTAGLIATA DELL'INVENZIONE DETAILED DESCRIPTION OF THE INVENTION
La Fig. 1 allegata mostra una veduta in prospetto di una realizzazione preferita della presente invenzione. Il dispositivo per illuminazione basato su LED illustrato nella figura citata comprende una basetta di montaggio di componenti elettronici 10, atta a montare, da un lato, detti componenti elettronici fra cui almeno un diodo ad emissione luminosa o LED 11 e relative ottiche 12, e dall’altro lato almeno un elemento dissipatore 13 associato a detto almeno un LED. The attached Fig. 1 shows a perspective view of a preferred embodiment of the present invention. The LED-based lighting device illustrated in the cited figure comprises a mounting base of electronic components 10, adapted to mount, on one side, said electronic components, including at least one light-emitting diode or LED 11 and relative optics 12, and from the on the other side, at least one dissipating element 13 associated with said at least one LED.
Detta basetta di montaggio 10 è atta ad ospitare LED 11 di diversa taglia mentre detto almeno un elemento dissipatore 13 è costituito da una barra di materiale termo-conduttore, preferibilmente realizzata mediante estrusione, avente sezione trasversale di dimensioni fisse e costanti e atta ad essere fissata tramite uno dei suoi lati di base a detta basetta di montaggio 10 in modo da estendersi in lunghezza in direzione essenzialmente perpendicolare ad essa. Said mounting base 10 is able to house LEDs 11 of different sizes while said at least one dissipating element 13 is constituted by a bar of thermo-conducting material, preferably made by extrusion, having a cross section of fixed and constant dimensions and able to be fixed through one of its base sides to said mounting base 10 so as to extend in length in a direction essentially perpendicular to it.
In questo modo detto almeno un elemento dissipatore 13 consente di garantire un ingombro fissato e costante sulla basetta di montaggio 10 mentre la resistenza termica può essere modulata a piacimento - in risposta a mutate esigenze di dissipazione del circuito elettronico -semplicemente modificandone la lunghezza. Ciò consente al progettista di dimensionare il lay-out della basetta di montaggio 10 in modo da poter accogliere dispositivi LED di varie taglie e potenze nominali utilizzando un solo tipo di elemento dissipatore la cui resistenza termica viene di volta in volta adeguata alle esigenze di dissipazione del circuito semplicemente intervenendo sulla lunghezza di detto elemento dissipatore 13. In this way, said at least one dissipator element 13 allows to ensure a fixed and constant overall dimensions on the mounting base 10 while the thermal resistance can be modulated at will - in response to changed dissipation needs of the electronic circuit - simply by modifying its length. This allows the designer to size the lay-out of the mounting base 10 so as to be able to accommodate LED devices of various sizes and nominal powers using a single type of heat sink element whose thermal resistance is each time adapted to the dissipation needs of the circuit simply by intervening on the length of said dissipator element 13.
Detto almeno un elemento dissipatore 13 è munito di opportuni mezzi di fissaggio a detta basetta di montaggio 10 atti a fornire la necessaria stabilità meccanica mantenendolo in posizione adeguata ad operare lo smaltimento della potenza dissipata dal dispositivo LED cui è associato. In una realizzazione preferita del dispositivo secondo la presente invenzione i dispositivi LED presenti su detta basetta di montaggio 10 sono in numero di tre 20, 21, 22, uniformemente spaziati tra loro di circa 120° e provvisti di relative ottiche 23, 24, 25, come riportato nella Fig. 2 allegata in cui si mostra una vista in pianta del lato componenti di detta basetta di montaggio 10. Sul lato opposto di detta basetta di montaggio 10, visibile in pianta nella Fig. 3 allegata, è presente un dissipatore estruso 30 sagomato opportunamente in modo da risultare associato ad ognuno di detti tre dispositivi LED 20, 21, 22 e munito di mezzi di fissaggio a detta basetta 10 costituiti da un perno centrale 31 atto ad impegnarsi, ad un’estremità, con un apposito foro su detta basetta di montaggio 10 e all’altra estremità con una traversa 32 atta ad esercitare la necessaria pressione su detto dissipatore estruso sagomato in modo da minimizzare la resistenza termica di contatto con detta basetta di montaggio 10. Detta traversa 32 può essere inoltre atta ad operare come elemento di bloccaggio per eventuali cavi di alimentazione associati a detta basetta 10. Said at least one dissipating element 13 is provided with suitable fastening means to said mounting base 10 adapted to provide the necessary mechanical stability by keeping it in an adequate position to effect the dissipation of the power dissipated by the LED device to which it is associated. In a preferred embodiment of the device according to the present invention, the LED devices present on said mounting base 10 are three in number 20, 21, 22, uniformly spaced by about 120 ° and provided with relative optics 23, 24, 25, as shown in the attached Fig. 2 which shows a plan view of the component side of said mounting base 10. On the opposite side of said mounting base 10, visible in plan view in the attached Fig. 3, there is an extruded heat sink 30 suitably shaped so as to be associated with each of said three LED devices 20, 21, 22 and equipped with fixing means to said base 10 consisting of a central pin 31 able to engage, at one end, with a suitable hole on said mounting base 10 and at the other end with a crosspiece 32 adapted to exert the necessary pressure on said extruded heatsink shaped so as to minimize the thermal resistance of contact with said base d assembly 10. Said crosspiece 32 can also be adapted to operate as a locking element for any power supply cables associated with said base 10.
In una realizzazione preferita della presente invenzione, dette ottiche 23, 24, 25, possono essere realizzate tramite un elemento unico comprendente 3 lenti coniche associate ciascuna ad un dispositivo LED 20, 21, 22 montato su detta basetta 10 e raccordate da una superficie 26 opportunamente lavorata in modo da fornire il cono di luce complessivo desiderato e munita di opportuni mezzi di fissaggio a detta basetta 10 che possono essere realizzati, ad esempio, da opportuni perni 14, 15 atti ad impegnarsi con appositi fori 27, 28, 29 praticati su detta basetta di montaggio 10. In a preferred embodiment of the present invention, said optics 23, 24, 25 can be made by means of a single element comprising 3 conical lenses each associated with a LED device 20, 21, 22 mounted on said base 10 and connected by a surface 26 suitably machined in such a way as to provide the desired overall cone of light and equipped with suitable fastening means to said base 10 which can be made, for example, by suitable pins 14, 15 able to engage with suitable holes 27, 28, 29 made on said mounting base 10.
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000235A ITFI20070235A1 (en) | 2007-10-23 | 2007-10-23 | DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. |
CNA2008101673588A CN101451701A (en) | 2007-10-23 | 2008-10-22 | Heat dissipation device for LEDs and related production method |
EP08167394A EP2053666A1 (en) | 2007-10-23 | 2008-10-23 | Heat dissipation device for LEDs and related production method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000235A ITFI20070235A1 (en) | 2007-10-23 | 2007-10-23 | DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. |
Publications (1)
Publication Number | Publication Date |
---|---|
ITFI20070235A1 true ITFI20070235A1 (en) | 2009-04-24 |
Family
ID=40313693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000235A ITFI20070235A1 (en) | 2007-10-23 | 2007-10-23 | DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2053666A1 (en) |
CN (1) | CN101451701A (en) |
IT (1) | ITFI20070235A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2487912B (en) | 2011-02-07 | 2014-11-12 | Collingwood Lighting Ltd | Lighting unit |
US9927112B2 (en) | 2013-06-24 | 2018-03-27 | Trinity, Llc | Universal cornice light for product display |
CZ307188B6 (en) | 2016-08-30 | 2018-03-07 | Varroc Lighting Systems, s.r.o. | A cooler, especially for signalling or lighting devices for motor vehicles, and a method of its production |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5940264A (en) * | 1996-10-04 | 1999-08-17 | Philips Electronics North America Corp | Electrolytic capacitor with heat sink and method of heat dissipation |
US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
US6799864B2 (en) * | 2001-05-26 | 2004-10-05 | Gelcore Llc | High power LED power pack for spot module illumination |
US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
WO2004011848A2 (en) * | 2002-07-25 | 2004-02-05 | Dahm Jonathan S | Method and apparatus for using light emitting diodes for curing |
DE102004004778B4 (en) * | 2004-01-30 | 2010-02-25 | Osram Opto Semiconductors Gmbh | Light-emitting diode illumination module and radiation-shaping optical device for a light-emitting diode illumination module |
US7055577B2 (en) * | 2004-02-12 | 2006-06-06 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device for electronic device |
CN2763972Y (en) * | 2004-12-11 | 2006-03-08 | 鸿富锦精密工业(深圳)有限公司 | Radiation device assembly |
-
2007
- 2007-10-23 IT IT000235A patent/ITFI20070235A1/en unknown
-
2008
- 2008-10-22 CN CNA2008101673588A patent/CN101451701A/en active Pending
- 2008-10-23 EP EP08167394A patent/EP2053666A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN101451701A (en) | 2009-06-10 |
EP2053666A1 (en) | 2009-04-29 |
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