EP2053302B1 - Portable illuminating lamp equipped with an electronic board housed in a sealed environment, and assembly method for the lamp - Google Patents

Portable illuminating lamp equipped with an electronic board housed in a sealed environment, and assembly method for the lamp Download PDF

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Publication number
EP2053302B1
EP2053302B1 EP08354055.9A EP08354055A EP2053302B1 EP 2053302 B1 EP2053302 B1 EP 2053302B1 EP 08354055 A EP08354055 A EP 08354055A EP 2053302 B1 EP2053302 B1 EP 2053302B1
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EP
European Patent Office
Prior art keywords
card
wall
tight
lighting lamp
contact elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP08354055.9A
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German (de)
French (fr)
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EP2053302A1 (en
Inventor
Sébastien Jarzac
Stéphane Huguenin
Paul Petzl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zedel SAS
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Zedel SAS
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Publication date
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Publication of EP2053302A1 publication Critical patent/EP2053302A1/en
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Publication of EP2053302B1 publication Critical patent/EP2053302B1/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022Pocket lamps
    • F21L4/027Pocket lamps the light sources being a LED
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/521Sealing between contact members and housing, e.g. sealing insert
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/965Dustproof, splashproof, drip-proof, waterproof, or flameproof holders

Definitions

  • the lighting level of the light-emitting diodes is generally adjusted by means of an electronic circuit controlled by at least one switch.
  • the electronic circuit comprises a printed circuit board on which are distributed the various electronic components.
  • the light-emitting diodes are arranged on the same printed circuit, or on an auxiliary card.
  • the assembly is placed on an intermediate wall of insulating material, and opposite the non-sealed compartment of the batteries. This intermediate wall is not waterproof, which causes the lack of tightness of the compartment of housing of the electronic card and light-emitting diodes. This results in a risk of premature aging of the electronic components.
  • the contact pieces are mounted on a support wall on which is reported the sealing wall whose holes comprise sealing lips intended to come into contact with one of the faces of the card.
  • the sealing wall is advantageously equipped with fixing clips for maintaining the pressure of the card on the sealing lips.
  • the figure 10 shows the assembly of the front housing 10 on all of the walls 11, 12 and the card 29.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

Domaine technique de l'inventionTechnical field of the invention

L'invention est relative à une lampe d'éclairage ayant une enveloppe renfermant :

  • une source d'alimentation à courant continue reliée électriquement par des pièces de contact à une carte électronique alimentant au moins une diode électroluminescente, lesdites pièces de contact ayant des premiers éléments de contact en liaison électrique avec la source d'alimentation,
  • et un commutateur de commande de l'état et du niveau d'éclairage de ladite diode électroluminescente.
The invention relates to a lighting lamp having an envelope enclosing:
  • a DC power source electrically connected by contact pieces to an electronic board supplying at least one light emitting diode, said contact pieces having first contact elements in electrical connection with the power source,
  • and a switch for controlling the state and lighting level of said light emitting diode.

État de la techniqueState of the art

Dans les lampes d'éclairage portatives connues par exemple selon US 2007/0177376 , le niveau d'éclairage des diodes électroluminescentes est généralement ajusté au moyen d'un circuit électronique piloté par au moins un commutateur. Le circuit électronique comporte une carte à circuit imprimé sur lequel sont répartis les différents composants électroniques. Les diodes électroluminescentes sont agencées sur le même circuit imprimé, ou sur une carte auxiliaire. L'ensemble se trouve placé sur une paroi intermédiaire en matériau isolant, et à l'opposé du compartiment non étanche des piles. Cette paroi intermédiaire n'est pas étanche, ce qui entraîne l'absence d'étanchéité du compartiment de logement de la carte électronique et des diodes électroluminescentes. Il en résulte un risque de vieillissement prématuré des composants électroniques.In portable lighting lamps known for example according to US 2007/0177376 , the lighting level of the light-emitting diodes is generally adjusted by means of an electronic circuit controlled by at least one switch. The electronic circuit comprises a printed circuit board on which are distributed the various electronic components. The light-emitting diodes are arranged on the same printed circuit, or on an auxiliary card. The assembly is placed on an intermediate wall of insulating material, and opposite the non-sealed compartment of the batteries. This intermediate wall is not waterproof, which causes the lack of tightness of the compartment of housing of the electronic card and light-emitting diodes. This results in a risk of premature aging of the electronic components.

Objet de l'inventionObject of the invention

L'objet de l'invention consiste à réaliser une lampe électrique d'éclairage à diode électroluminescente alimentée par une carte électronique logée dans un environnement étanche, en évitant un processus industriel compliqué pour obtenir l'étanchéité, et en limitant le nombre de pièces.The object of the invention is to provide a light emitting diode electric lamp powered by an electronic card housed in a sealed environment, avoiding a complicated industrial process to achieve sealing, and limiting the number of parts.

La lampe d'éclairage selon l'invention est caractérisée en ce que les pièces de contact comportent des deuxièmes éléments de contact destinés à traverser successivement une paire de trous situés dans une paroi d'étanchéité intermédiaire de l'enveloppe, et une paire de fentes de la carte, le soudage des deuxièmes éléments de contact sur la carte permettant d'obtenir en plus du raccordement électrique de la source d'alimentation, un compartiment étanche agencé dans l'enveloppe autour de la carte.The lighting lamp according to the invention is characterized in that the contact pieces comprise second contact elements intended to successively pass through a pair of holes located in an intermediate sealing wall of the envelope, and a pair of slots of the card, the welding of the second contact elements on the card to obtain in addition to the electrical connection of the power source, a sealed compartment arranged in the envelope around the card.

Selon un mode de réalisation préférentiel, les pièces de contact sont montées sur une paroi de support sur laquelle est rapportée la paroi d'étanchéité dont les trous comportent des lèvres d'étanchéité destinées à venir en contact avec une des faces de la carte. La paroi d'étanchéité est avantageusement équipée de clips de fixation pour le maintien en pression de la carte sur les lèvres d'étanchéité.According to a preferred embodiment, the contact pieces are mounted on a support wall on which is reported the sealing wall whose holes comprise sealing lips intended to come into contact with one of the faces of the card. The sealing wall is advantageously equipped with fixing clips for maintaining the pressure of the card on the sealing lips.

La périphérie de la paroi d'étanchéité est munie d'un joint d'étanchéité contre lequel est appliqué le cadre d'un boîtier avant de l'enveloppe. Le joint d'étanchéité est de préférence surmoulé sur la paroi d'étanchéité.The periphery of the sealing wall is provided with a seal against which is applied the frame of a casing front housing. The seal is preferably overmolded on the sealing wall.

L'invention concerne également un procédé d'assemblage de l'enveloppe d'une lampe d'éclairage portative, consistant à agencer des éléments de contact sur une paroi support pour raccorder une source d'alimentation à courant continu, à au moins une diode électroluminescente connectée sur une carte électronique. Le procédé est caractérisé en ce que :

  • la paroi support est associée à une paroi d'étanchéité ayant des trous munis de lèvres d'étanchéité,
  • la carte électronique est encliquetée sur la paroi d'étanchéité et maintenue en pression sur les lèvres d'étanchéité après passage des éléments de contact à travers les trous de la paroi d'étanchéité, et de fentes ménagées sur la carte,
  • on soude ensuite les éléments de contact sur la carte en bouchant les fentes, et
  • on rapporte un boîtier avant et un boîtier arrière sur la paroi support de manière à obtenir un compartiment étanche autour de la carte, et un compartiment non étanche de logement de la source d'alimentation.
The invention also relates to a method of assembling the envelope of a portable lighting lamp, comprising arranging elements of contact on a support wall for connecting a DC power source, at least one LED connected to an electronic card. The method is characterized in that:
  • the support wall is associated with a sealing wall having holes provided with sealing lips,
  • the electronic card is snapped onto the sealing wall and maintained under pressure on the sealing lips after passage of the contact elements through the holes of the sealing wall, and slots provided on the card,
  • the contact elements are then welded on the card by plugging the slots, and
  • a front housing and a back housing are reported on the support wall so as to obtain a sealed compartment around the card, and a non-sealed housing housing the power source.

Description sommaire des dessinsBrief description of the drawings

D'autres avantages et caractéristiques ressortiront plus clairement de la description qui va suivre d'un mode particulier de réalisation de l'invention donné à titre d'exemple non limitatif et représenté aux dessins annexés, dans lesquels :

  • les figures 1 et 2 représentent des vues en perspective avant et arrière de la paroi support de l'enveloppe de la lampe ;
  • la figure 3 montre une vue de face de la paroi d'étanchéité de l'enveloppe ;
  • les figures 4 et 5 sont des vues du montage de la paroi d'étanchéité sur la paroi support, respectivement avant et après le passage des éléments de contact dans les trous de la paroi d'étanchéité ;
  • les figures 6 et 7 illustrent des vues en perspective de l'assemblage de la carte électronique sur le sous-ensemble de la figure 5 ;
  • la figure 8 montre le soudage des éléments de contact sur la carte ;
  • la figure 9 représente une vue en perspective du boîtier avant ;
  • la figure 10 montre une vue en perspective éclatée du boîtier avant sur le sous-ensemble de la figure 8 ;
  • la figure 11 est une vue arrière de l'enveloppe après montage du boîtier avant sur le sous-ensemble de la figure 8 ;
  • la figure 12 montre une vue en coupe de la lampe après assemblage final du boîtier arrière.
Other advantages and features will emerge more clearly from the following description of a particular embodiment of the invention given by way of nonlimiting example and represented in the accompanying drawings, in which:
  • the Figures 1 and 2 represent front and rear perspective views of the support wall of the lamp envelope;
  • the figure 3 shows a front view of the sealing wall of the envelope;
  • the figures 4 and 5 are views of the mounting of the sealing wall on the support wall, respectively before and after the passage of the contact elements in the holes of the sealing wall;
  • the figures 6 and 7 illustrate perspective views of the assembly of the electronic map on the subset of the figure 5 ;
  • the figure 8 shows the welding of the contact elements on the card;
  • the figure 9 represents a perspective view of the front casing;
  • the figure 10 shows an exploded perspective view of the front case on the subset of the figure 8 ;
  • the figure 11 is a rear view of the casing after mounting the front casing on the subset of the figure 8 ;
  • the figure 12 shows a sectional view of the lamp after final assembly of the rear housing.

Description d'un mode de réalisation préférentiel de l'inventionDescription of a preferred embodiment of the invention

Sur les figures, l'enveloppe en matériau isolant moulé d'une lampe d'éclairage portative, notamment d'une lampe frontale, est formée par l'assemblage d'un boîtier avant 10 (figure 9), d'une paroi de support 11 des piles (figures 1 et 2), d'une paroi d'étanchéité 12 (figure 3), et d'un boîtier arrière 21 (figure 12).In the figures, the envelope of molded insulating material of a portable lighting lamp, in particular of a headlamp, is formed by assembling a front housing 10 ( figure 9 ), a support wall 11 of the batteries ( Figures 1 and 2 ), a sealing wall 12 ( figure 3 ), and a rear housing 21 ( figure 12 ).

Les deux parois de support 11 et d'étanchéité 12 sont des parois intermédiaires intercalées entre le boîtier avant 10 et le boîtier arrière 21.The two support walls 11 and sealing 12 are intermediate walls interposed between the front housing 10 and the rear housing 21.

La paroi de support 11 (figures 1 et 2) des piles présente un cadre quadrangulaire comportant une ouverture 13 centrale délimitée par une branche supérieure 14, une branche inférieure 15 parallèle, et deux ailes latérales 16, 17 opposées. La face arrière du cadre de la paroi 11 est dotée de premières alvéoles 18 longitudinales servant à positionner des piles cylindriques (non représentées). Les faces latérales 16, 17 sont équipées de deux pièces de contacts 19, 20 destinées à être reliées au pôle positif et au pôle négatif du bloc d'alimentation formé par la mise en série des piles.The support wall 11 ( Figures 1 and 2 ) the batteries has a quadrangular frame having a central opening 13 delimited by an upper branch 14, a lower branch 15 parallel, and two side wings 16, 17 opposite. The rear face of the frame of the wall 11 is provided with first longitudinal cells 18 for positioning cylindrical cells (not shown). The side faces 16, 17 are equipped with two pieces of contacts 19, 20 intended to be connected to the positive pole and the negative pole of the power supply unit formed by the series of batteries.

Chaque pièce de contact 19, 20 est constituée par une languette de cuivre découpée et pliée, ayant aux extrémités opposées un premier élément de contact 19a, 20a agencé du côté de la face arrière du cadre, et un deuxième élément de contact 19b, 20b faisant saillie de la face avant de la paroi de support 11.Each contact piece 19, 20 is constituted by a cut and bent copper tongue, having at opposite ends a first contact element 19a, 20a arranged on the side of the rear face of the frame, and a second contact element 19b, 20b making projection of the front face of the support wall 11.

Les premiers éléments de contact 19a 20a présentent une élasticité prédéterminée de manière à assurer un bon contact électrique avec les pôles des piles. Les deuxièmes éléments de contact 19b, 20b sont constitués par des picots orientés vers l'avant, et s'étendant perpendiculairement à la branche supérieure 14.The first contact elements 19a 20a have a predetermined elasticity so as to ensure good electrical contact with the poles of the cells. The second contact elements 19b, 20b consist of pins oriented towards the front, and extending perpendicularly to the upper branch 14.

Des contacts intermédiaires 22, 23 (figure 11) coiffent les faces latérales 16, 17 de la paroi de support 11 pour assurer la mise en série des trois piles.Intermediate contacts 22, 23 ( figure 11 ) cap the side faces 16, 17 of the support wall 11 to ensure the series of three batteries.

La paroi d'étanchéité 12 (figure 3) est obtenue par moulage bi-matière, et est composée d'une paroi de renforcement 12a sur laquelle est surmoulé un joint d'étanchéité 24 de forme rectangulaire. La paroi de renforcement 12a est en plastique dur, tandis que le joint 24 surmoulé est en matériau plastique souple. Deux trous 25, 26 sont ménagés dans la partie supérieure de la paroi d'étanchéité 12 pour laisser passer les éléments de contact 19b, 20b lorsque la paroi d'étanchéité 12 est montée sur la paroi de support 11 (figures 4 et 5). L'avant de chaque trou 25, 26 est entouré avantageusement par une lèvre d'étanchéité 27, 28 destinée à venir en engagement contre le circuit imprimé d'une carte électronique 29 (figure 6). La paroi de renforcement 12a épouse et obture l'ouverture 13 de la paroi de support 11, et comporte en plus des deuxièmes alvéoles 32 en continuité avec les premières alvéoles 18 pour constituer des logements de sections semi-circulaires.The sealing wall 12 ( figure 3 ) is obtained by bi-material molding, and is composed of a reinforcing wall 12a on which is molded a seal 24 of rectangular shape. The reinforcing wall 12a is made of hard plastic, while the overmolded seal 24 is of flexible plastic material. Two holes 25, 26 are formed in the upper part of the sealing wall 12 to pass the contact elements 19b, 20b when the sealing wall 12 is mounted on the support wall 11 ( figures 4 and 5 ). The front of each hole 25, 26 is advantageously surrounded by a sealing lip 27, 28 intended to come into engagement with the printed circuit of an electronic card 29 ( figure 6 ). The reinforcing wall 12a marries and closes the opening 13 of the support wall 11, and further comprises second cells 32 in continuity with the first cells 18 to form housing semicircular sections.

La carte électronique 29 porte sur la face avant des diodes électroluminescentes LED, quatre dans l'exemple illustré aux figures 7 et 8, pour l'émission d'un faisceau lumineux d'éclairage lors de l'actionnement de l'interrupteur ou d'un commutateur 30 à bouton-poussoir 31. Ce dernier est pourvu de pattes de raccordement connectées électriquement sur le circuit imprimé de la carte 29. L'alimentation des diodes LED peut s'effectuer directement à travers l'interrupteur 30, ou par l'intermédiaire d'un microcontrôleur, lequel est connecté avec d'autres composants électroniques de commande sur les deux faces opposées de la carte 29.The electronic card 29 bears on the front face of the LEDs, four in the example shown in FIGS. figures 7 and 8 , for the emission of a lighting light beam when the switch or a push-button switch 31 is actuated 31. The latter is provided with connection tabs electrically connected to the printed circuit of the The supply of the LEDs can be carried out directly through the switch 30, or via a microcontroller, which is connected with other electronic control components on the two opposite sides of the board. 29.

La paroi d'étanchéité 12 est équipée en plus de quatre clips 33 de fixation qui maintiennent la carte 29 en pression sur les lèvres d'étanchéité 27, 28 après traversée des deuxièmes éléments de contact 19b, 20b dans des fentes 35, 36 (figures 6 et 7) se trouvant avantageusement situées sur les pistes du circuit imprimé de la carte 29.The sealing wall 12 is also equipped with four fixing clips 33 which hold the card 29 under pressure on the sealing lips 27, 28 after passing through the second contact elements 19b, 20b in slots 35, 36 (FIG. figures 6 and 7 ) being advantageously situated on the tracks of the printed circuit of the card 29.

Lorsque la carte 29 est fixée par les clips 33 sur la paroi d'étanchéité 12, on soude ensuite les deuxièmes éléments de contact 19b, 20b sur les pistes conductrices de la carte 29 (figure 8). Les soudures remplissent complètement les fentes 35, 36 de la carte 29When the card 29 is fixed by the clips 33 on the sealing wall 12, the second contact elements 19b, 20b are then soldered onto the conductive tracks of the card 29 (FIG. figure 8 ). The welds completely fill the slots 35, 36 of the card 29

En référence à la figure 9, le boîtier avant 10 est réalisé en matière transparente ou comporte au moins une partie transparente agencée en regard des diodes LED. Le boîtier avant 10 vient s'adapter sur la périphérie de la paroi de support 11. Un cadre 37 interne du boîtier avant 10 vient buter contre le joint d'étanchéité 24 de la paroi 12.With reference to the figure 9 , the front housing 10 is made of transparent material or comprises at least one transparent portion arranged opposite LEDs. The front housing 10 fits on the periphery of the support wall 11. An inner frame 37 of the front housing 10 abuts against the seal 24 of the wall 12.

Les faces latérales du boîtier avant 10, et de la paroi de support 11 comportent en plus des orifices 34 pour le passage de vis d'assemblage (non représentées) destinées à confirmer l'étanchéité du cadre 37 sur le joint 24.The lateral faces of the front casing 10 and of the support wall 11 also include orifices 34 for the passage of assembly screws (not shown) intended to confirm the seal of the frame 37 on the seal 24.

L'assemblage des différentes parties du corps de la lampe d'éclairage s'effectue de la manière suivante :The assembly of the different parts of the body of the lighting lamp is carried out as follows:

Sur les figures 4 et 5, la paroi d'étanchéité 12 est montée à l'opposé du joint 24, sur la face avant de la paroi de support 11 en faisant passer les deuxièmes éléments de contact 19b, 20b à travers les trous 25, 26.On the figures 4 and 5 , the sealing wall 12 is mounted opposite the seal 24, on the front face of the support wall 11 by passing the second contact elements 19b, 20b through the holes 25, 26.

Sur les figures 6 et 7, la carte électronique 29 avec les diodes LED, est fixée sur la paroi d'étanchéité 12 au moyen des quatre clips 33. Les deuxièmes éléments de contact 19b, 20b traversent les fentes 35, 36, et la face arrière de la carte 29 est maintenue en pression sur les lèvres d'étanchéité 27, 28On the figures 6 and 7 , the electronic card 29 with the LEDs, is fixed on the sealing wall 12 by means of the four clips 33. The second contact elements 19b, 20b pass through the slots 35, 36, and the rear face of the card 29 is held under pressure on the sealing lips 27, 28

Sur la figure 8, les deuxièmes éléments de contact 19b, 20b sont soudées sur les pistes conductrices de la carte 29 en remplissant les fentes 35, 36.On the figure 8 the second contact elements 19b, 20b are soldered to the conductive tracks of the card 29 by filling the slots 35, 36.

La figure 10 montre l'assemblage du boîtier avant 10 sur l'ensemble des parois 11, 12 et de la carte 29.The figure 10 shows the assembly of the front housing 10 on all of the walls 11, 12 and the card 29.

Il suffit finalement de rapporter le boîtier arrière 21 (figure 12) sur la face arrière de la paroi de support 11.It is finally enough to bring back the rear case 21 ( figure 12 ) on the rear face of the support wall 11.

Les deux faces de la carte électronique 29 se trouvent ainsi dans un environnement étanche des deux côtés du circuit imprimé, grâce à la présence des lèvres d'étanchéité 27, 28 prenant appui sur la face arrière de la carte 29, des deuxièmes éléments de contact 19b, 20b soudés directement depuis l'avant sur les pistes conductrices de la carte 29, et du cadre 37 maintenu en pression contre le joint 24 par les vis d'assemblage.The two faces of the electronic card 29 are thus in a sealed environment on both sides of the printed circuit, thanks to the presence of the sealing lips 27, 28 bearing on the rear face of the card 29, second contact elements. 19b, 20b welded directly from the front on the conductive tracks of the card 29, and the frame 37 held in pressure against the seal 24 by the assembly screws.

Un tel environnement étanche autour de la carte 29 permet de protéger les composants électroniques contre l'oxydation et la corrosion. Les diodes LED se trouvent également dans cet environnement étanche. Le compartiment des piles entre la face arrière de la paroi de support 11 et le boîtier arrière 21 reste dans un environnement non étanche.Such a sealed environment around the board 29 protects the electronic components against oxidation and corrosion. LEDs are also in this sealed environment. The battery compartment between the rear face of the support wall 11 and the rear housing 21 remains in a non-sealed environment.

Il est clair que le nombre de diodes électroluminescentes LED sur la carte 29 peut être quelconque. Une seule diode LED de puissance élevée peut être disposée au centre de la carte 29.It is clear that the number of light-emitting diodes LED on the card 29 can be arbitrary. Only one high power LED can be located in the center of the card 29.

Claims (10)

  1. A lighting lamp having an enclosure housing:
    - a DC power source electrically connected by contact parts (19, 20) to a printed circuit card (29) supplying at least one light-emitting diode (LED), said contact parts (19, 20) having first contact elements (19a, 20a) in electrical connection with the power source,
    - and a switch (30) controlling the state and the lighting level of said light-emitting diode (LED),
    characterized in that the contact parts (19, 20) comprise second contact elements (19b, 20b) designed to successively pass through a pair of holes (25, 26) situated in a tight intermediate wall (12) of the enclosure, and a pair of slots (35, 36) of the card (29), soldering of the second contact elements (19b, 20b) onto the card (29), in addition to electric connection of the power source, enabling a tightly sealed compartment to be achieved in the enclosure around the card (29).
  2. The lighting lamp according to claim 1, characterized in that the contact parts (19, 20) are mounted on a support wall (11) on which the tight wall (12) is fitted.
  3. The lighting lamp according to claim 2, characterized in that the holes (25, 26) of the tight wall (12) comprise sealing lips (27, 28) designed to come into contact with one of the faces of the card (29).
  4. The lighting lamp according to claim 3, characterized in that the tight wall (12) is equipped with fixing clips (33) to keep the card (29) pressing firmly on the sealing lips (27, 28).
  5. The lighting lamp according to any of the previous claims, characterized in that the periphery of the tight wall (12) is provided with a seal (24) against which a front case (10) of the enclosure is applied.
  6. The lighting lamp according to claim 5, characterized in that the seal (24) is molded from casting on the tight wall (12).
  7. The lighting lamp according to claim 5, characterized in that the front case (10) comprises a transparent part arranged facing the light-emitting diode (LED) and a frame (37) coming up against the stop formed by the seal (24) of the tight wall (12).
  8. The lighting lamp according to any of the previous claims, characterized in that a rear case (21) is fitted on the support wall (11) to delineate the battery compartment.
  9. A method for assembling the enclosure of a portable lighting lamp consisting in arranging contact elements (19b, 20b) on a support wall (11) to connect a DC power source to at least one light-emitting diode controlled by a printed circuit card (29), a method characterized in that:
    - the support wall (11) is associated with a tight wall (12) having holes (25, 26) provided with sealing lips (27, 28),
    - the printed circuit card (29) is clipped onto the tight wall (12) and kept pressing firmly on the sealing lips (27, 28) after the contact elements (19b, 20b) have been passed through the holes (25, 26) of the tight wall (12) and through slots (35, 36) arranged on the card (29),
    - the contact elements (19b, 20b) are then soldered onto the card (29) sealing off the slots (35, 36), and
    - a front case (10) and a rear case (21) are fitted onto the support wall (11) so as to obtain a tight compartment around the card (29) and a non-tight compartment housing the power source.
  10. The method for assembling according to claim 9, characterized in that a seal (24) is molded from casting on the tight wall (12), and a frame (37) of the front case (10) is applied against said seal when final assembly of the enclosure is performed.
EP08354055.9A 2007-10-23 2008-08-07 Portable illuminating lamp equipped with an electronic board housed in a sealed environment, and assembly method for the lamp Not-in-force EP2053302B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0707435A FR2922627B1 (en) 2007-10-23 2007-10-23 PORTABLE LIGHTING LAMP EQUIPPED WITH AN OWNED ELECTRONIC CARD IN A WATERPROOF ENVIRONMENT, AND METHOD OF ASSEMBLING THE LAMP.

Publications (2)

Publication Number Publication Date
EP2053302A1 EP2053302A1 (en) 2009-04-29
EP2053302B1 true EP2053302B1 (en) 2014-04-09

Family

ID=39167333

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08354055.9A Not-in-force EP2053302B1 (en) 2007-10-23 2008-08-07 Portable illuminating lamp equipped with an electronic board housed in a sealed environment, and assembly method for the lamp

Country Status (5)

Country Link
US (1) US7810946B2 (en)
EP (1) EP2053302B1 (en)
CN (1) CN101418934B (en)
FR (1) FR2922627B1 (en)
RU (1) RU2472063C2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039574A1 (en) 2010-08-20 2012-02-23 BSH Bosch und Siemens Hausgeräte GmbH Refrigerating appliance with interior lighting
FR2973474A1 (en) * 2011-03-30 2012-10-05 Zedel PORTABLE ELECTRIC LIGHTING LAMP COMPRISING A POWER AND COMMUNICATION CONNECTOR
JP5980963B2 (en) * 2012-03-02 2016-08-31 モレックス エルエルシー Array holder and LED module having array holder
CN103900042B (en) * 2014-03-12 2016-05-04 浙江阳光照明电器集团股份有限公司 A kind of light source installing mechanism of LED lamp
USD814676S1 (en) * 2015-12-08 2018-04-03 Coast Cutlery Co. Headlamp
USD804695S1 (en) * 2015-12-08 2017-12-05 Coast Cutlery Co. Headlamp
USD802189S1 (en) * 2015-12-08 2017-11-07 Coast Cutlery Co. Headlamp
FR3112381B1 (en) * 2020-07-07 2023-10-20 Stoots Light block and light device integrating said light block

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2087039C1 (en) * 1993-04-02 1997-08-10 Николай Валентинович Щербаков Assembly of information board screen
US6614336B2 (en) * 2001-12-10 2003-09-02 Robert Galli Rotary switch mechanism
RU30926U1 (en) * 2003-03-31 2003-07-10 Сысун Виктор Викторович LED Protected Light
RU2251050C1 (en) * 2003-12-17 2005-04-27 Сысун Виктор Викторович Illumination explosion-proof device on base of light emitting diodes
US20070177376A1 (en) * 2003-12-31 2007-08-02 Simoni Jacquelyn R Hands-free flashlight
DE102004019304A1 (en) * 2004-04-15 2005-11-03 E.G.O. Control Systems Gmbh Operating device with a touch switch
US7293898B2 (en) * 2004-07-29 2007-11-13 Princeton Tectonics, Inc. Portable light
US20090027900A1 (en) * 2006-10-31 2009-01-29 The L.D. Kichler Co. Positionable outdoor lighting

Also Published As

Publication number Publication date
FR2922627A1 (en) 2009-04-24
FR2922627B1 (en) 2010-02-12
RU2472063C2 (en) 2013-01-10
RU2008141962A (en) 2010-04-27
CN101418934B (en) 2012-01-11
US7810946B2 (en) 2010-10-12
EP2053302A1 (en) 2009-04-29
CN101418934A (en) 2009-04-29
US20090103291A1 (en) 2009-04-23

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