EP2046442B1 - Matrice d'électrodes pour circuit flexible avec au moins une ouverture de point de soudure - Google Patents

Matrice d'électrodes pour circuit flexible avec au moins une ouverture de point de soudure Download PDF

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Publication number
EP2046442B1
EP2046442B1 EP07809828.2A EP07809828A EP2046442B1 EP 2046442 B1 EP2046442 B1 EP 2046442B1 EP 07809828 A EP07809828 A EP 07809828A EP 2046442 B1 EP2046442 B1 EP 2046442B1
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EP
European Patent Office
Prior art keywords
flexible circuit
electrode array
circuit electrode
polymer
tack opening
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EP07809828.2A
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German (de)
English (en)
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EP2046442A2 (fr
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Robert J. Greenberg
Neil Hamilton Talbot
Jordan Neysmith
James S. Little
Brian V. Mech
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Vivani Medical Inc
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Second Sight Medical Products Inc
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/0526—Head electrodes
    • A61N1/0543—Retinal electrodes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/36046—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation of the eye
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material

Definitions

  • the present invention is generally directed to neural stimulation and more specifically to an improved electrode array for neural stimulation.
  • Foerster investigated the effect of electrically stimulating the exposed occipital pole of one cerebral hemisphere. He found that, when a point at the extreme occipital pole was stimulated, the patient perceived a small spot of light directly in front and motionless (a phosphene). Subsequently, Brindley and Lewin (1968) thoroughly studied electrical stimulation of the human occipital (visual) cortex. By varying the stimulation parameters, these investigators described in detail the location of the phosphenes produced relative to the specific region of the occipital cortex stimulated. These experiments demonstrated: (1) the consistent shape and position of phosphenes; (2) that increased stimulation pulse duration made phosphenes brighter; and (3) that there was no detectable interaction between neighboring electrodes which were as close as 2.4 mm apart.
  • Neural tissue can be artificially stimulated and activated by prosthetic devices that pass pulses of electrical current through electrodes on such a device.
  • the passage of current causes changes in electrical potentials across visual neuronal membranes, which can initiate visual neuron action potentials, which are the means of information transfer in the nervous system.
  • neural tissue stimulation is in the rehabilitation of the blind.
  • Some forms of blindness involve selective loss of the light sensitive transducers of the retina.
  • Other retinal neurons remain viable, however, and may be activated in the manner described above by placement of a prosthetic electrode device on the inner (toward the vitreous) retinal surface (epiretinal). This placement must be mechanically stable, minimize the distance between the device electrodes and the visual neurons, control the electronic field distribution and avoid undue compression of the visual neurons.
  • Bullara US Pat. No. 4,573,481 patented an electrode assembly for surgical implantation on a nerve.
  • the matrix was silicone with embedded iridium electrodes.
  • the assembly fit around a nerve to stimulate it.
  • the Michelson '933 apparatus includes an array of photosensitive devices on its surface that are connected to a plurality of electrodes positioned on the opposite surface of the device to stimulate the retina. These electrodes are disposed to form an array similar to a "bed of nails" having conductors which impinge directly on the retina to stimulate the retinal cells.
  • US Patent 4,837,049 to Byers describes spike electrodes for neural stimulation. Each spike electrode pierces neural tissue for better electrical contact.
  • US Patent 5,215,088 to Norman describes an array of spike electrodes for cortical stimulation. Each spike pierces cortical tissue for better electrical contact.
  • Retinal tacks are one way to attach a retinal electrode array to the retina.
  • US Patent 5,109,844 to de Juan describes a flat electrode array placed against the retina for visual stimulation.
  • US Patent 5,935,155 to Humayun describes a retinal prosthesis for use with the flat retinal array described in de Juan.
  • An electrode array according to the preamble of claim 1 is known from WO0112115 .
  • the invention is defined in claim 1.
  • Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation for many purposes. Regardless of which polymer is used, the basic construction method is the same. A layer of polymer is laid down, commonly by some form of chemical vapor deposition, spinning, meniscus coating or casting. A layer of metal, preferably platinum, is applied to the polymer and patterned to create electrodes and leads for those electrodes. Patterning is commonly done by photolithographic methods. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.
  • the pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance between the array and retina, along with electric field dispersion. Too much pressure may block blood flow causing retinal ischemia and hemorrhage. Pressure on the neural retina may also block axonal flow or cause neuronal atrophy leading to optic atrophy.
  • Common flexible circuit fabrication techniques such as photolithography generally require that a flexible circuit electrode array be made flat. Since the retina is spherical, a flat array will necessarily apply more pressure near its edges, than at its center. Further, the edges of a flexible circuit polymer array may be quite sharp and cut the delicate retinal tissue. With most polymers, it is possible to curve them when heated in a mold.
  • thermoplastic polymer such as liquid crystal polymer
  • FIG. 1 shows a perspective view of the implanted portion of the preferred retinal prosthesis.
  • a flexible circuit 1 includes a flexible circuit electrode array 10 which is mounted by a retinal tack (not shown) or similar means to the epiretinal surface.
  • the flexible circuit electrode array 10 is electrically coupled by a flexible circuit cable 12, which pierces the sclera and is electrically coupled to an electronics package 14, external to the sclera.
  • the electronics package 14 is electrically coupled to a secondary inductive coil 16.
  • the secondary inductive coil 16 is made from wound wire.
  • the secondary inductive coil 16 may be made from a flexible circuit polymer sandwich with wire traces deposited between layers of flexible circuit polymer.
  • the electronics package 14 and secondary inductive coil 16 are held together by a molded body 18.
  • the molded body 18 may also include suture tabs 20.
  • the molded body 18 narrows to form a strap 22 which surrounds the sclera and holds the molded body 18, secondary inductive coil 16, and electronics package 14 in place.
  • the molded body 18, suture tabs 20 and strap 22 are preferably an integrated unit made of silicone elastomer.
  • Silicone elastomer can be formed in a pre-curved shape to match the curvature of a typical sclera. However, silicone remains flexible enough to accommodate implantation and to adapt to variations in the curvature of an individual sclera.
  • the secondary inductive coil 16 and molded body 18 are preferably oval shaped.
  • a strap 22 can better support an oval shaped coil.
  • the entire implant is attached to and supported by the sclera.
  • An eye moves constantly. The eye moves to scan a scene and also has a jitter motion to improve acuity. Even though such motion is useless in the blind, it often continues long after a person has lost their sight.
  • eye motion does not cause any flexing which might fatigue, and eventually damage, the device.
  • Fig. 2 shows a side view of the implanted portion of the retinal prosthesis, in particular, emphasizing the fan tail 24.
  • the secondary inductive coil 16 and molded body 18 must also follow the strap 22 under the lateral rectus muscle on the side of the sclera.
  • the implanted portion of the retinal prosthesis is very delicate. It is easy to tear the molded body 18 or break wires in the secondary inductive coil 16.
  • the molded body 18 is shaped in the form of a fan tail 24 on the end opposite the electronics package 14.
  • the flexible circuit 1 is a made by the following process.
  • a layer of polymer such as polyimide, fluoro-polymers, silicone or other polymers
  • a support substrate such as glass.
  • Layers may be applied by spinning, meniscus coating, casting, sputtering or other physical or chemical vapor deposition, or similar process.
  • a metal layer is applied to the polymer.
  • the metal is patterned by photolithographic process.
  • a photo-resist is applied and patterned by photolithography followed by a wet etch of the unprotected metal.
  • the metal can be patterned by lift-off technique, laser ablation or direct write techniques.
  • this metal thicker at the electrode and bond pad to improve electrical continuity. This can be accomplished through any of the above methods or electroplating. Then, the top layer of polymer is applied over the metal. Openings in the top layer for electrical contact to the electronics package 14 and the electrodes may be accomplished by laser ablation or reactive ion etching (RIE) or photolithograph and wet etch. Making the electrode openings in the top layer smaller than the electrodes promotes adhesion by avoiding delaminating around the electrode edges.
  • RIE reactive ion etching
  • the pressure applied against the retina by the flexible circuit electrode array is critical. Too little pressure causes increased electrical resistance between the array and retina. It should be noted that while the present invention is described in terms of application to the retina, the techniques described are equally applicable to many forms of neural stimulation. Application to the retina requires a convex spherical curve. Application to the cochlea requires a constant curve in one dimension and a spiral curve in the other. Application to the cerebral cortex requires a concave spherical curve. Cortical stimulation is useful for artificial vision or hearing, touch and motor control for limb prostheses, deep brain stimulation for Parkinson's disease and multiple sclerosis, and many other applications.
  • a flexible circuit electrode array be made flat. Since the retina is spherical, a flat array will necessarily apply more pressure near its edges, than at its center. With most polymers, it is possible to curve them when heated in a mold. By applying the right amount of heat to a completed array, a curve can be induced that matches the curve of the retina. To minimize warping, it is often advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius.
  • Fig. 3 illustrates a series of molds according to the preferred embodiment. Since the flexible circuit will maintain a constant length, the curvature must be slowly increased along that length. As the curvature 30 decreases in successive molds ( Figs.
  • the straight line length between ends 32 and 34 must decrease to keep the length along the curvature 30 constant, where mold 3E approximates the curvature of the retina or other desired neural tissue.
  • the molds provide a further opening 36 for the flexible circuit cable 12 of the array to exit the mold without excessive curvature.
  • suitable polymers include thermoplastic materials and thermoset materials. While a thermoplastic material will provide some stretch when heated a thermoset material will not. The successive molds are, therefore, advantageous only with a thermoplastic material. A thermoset material works as well in a single mold as it will with successive smaller molds. It should be noted that, particularly with a thermoset material, excessive curvature in three dimensions will cause the polymer material to wrinkle at the edges. This can cause damage to both the array and the retina. Hence, the amount of curvature is a compromise between the desired curvature, array surface area, and the properties of the material.
  • the edges of the polymer layers are often sharp. There is a risk that the sharp edges of a flexible circuit will cut into delicate retinal tissue. It is advantageous to add a soft material, such as silicone, to the edges of a flexible circuit electrode array to round the edges and protect the retina. Silicone around the entire edge may make the flexible circuit less flexible. So, it is advantageous to provide silicone bumpers or ribs to hold the edge of the flexible circuit electrode array away from the retinal tissue. Curvature 40 fits against the retina. The leading edge 44 is most likely to cause damage and is therefore fit with molded silicone bumper. Also, edge 46, where the array lifts off the retina can cause damage and should be fit with a bumper. Any space along the side edges of curvature 40 may cause damage and may be fit with bumpers as well. It is also possible for the flexible circuit cable 12 of the electrode array to contact the retina. It is, therefore, advantageous to add periodic bumpers along the flexible circuit cable 12.
  • a soft material such as silicone
  • a retinal flexible circuit electrode array must be inside the sclera in order to contact the retina.
  • the sclera is cut through at the pars plana, forming a sclerotomy, and the flexible circuit passed through the sclerotomy.
  • a flexible circuit is thin but wide. The more electrode wires, the wider the flexible circuit must be. It may be difficult to seal a sclerotomy over a flexible circuit wide enough to support enough wires for a high resolution array. A narrow sclerotomy is preferable.
  • Fig. 5 depicts a further embodiment of the part of the prosthesis shown in Fig. 4 with a fold A between the circuit electrode array 10 and the flexible circuit cable 12.
  • the angle in the fold A also called ankle has an angle of 1°-180°, preferably 80°-120°.
  • the fold A is advantageous since it reduces tension and enables an effective attachment of the flexible electrode circuit array 10 to the retina.
  • Fig. 6 shows the flexible circuit electrode array prior to folding and attaching the array to the electronics package 14.
  • an interconnection pad 52 for connection to the electronics package 14.
  • the flexible circuit electrode array 10 At the other end of the flexible circuit cable 12 is the flexible circuit electrode array 10.
  • an attachment point 54 is provided near the flexible circuit electrode array 10.
  • a retina tack (not shown) is placed through the attachment point 54 to hold the flexible circuit electrode array 10 to the retina.
  • a stress relief 55 is provided surrounding the attachment point 54.
  • the stress relief 55 may be made of a softer polymer than the flexible circuit, or it may include cutouts or thinning of the polymer to reduce the stress transmitted from the retina tack to the flexible circuit electrode array 10.
  • the flexible circuit cable 12 is formed in a dog leg pattern so than when it is folded at fold 48 it effectively forms a straight flexible circuit cable 12 with a narrower portion at the fold 48 for passing through the sclerotomy.
  • Fig. 7 shows the flexible circuit electrode array after the flexible circuit cable 12 is folded at the fold 48 to form a narrowed section.
  • the flexible circuit cable 12 may include a twist or tube shape as well.
  • the bond pad 52 for connection to the electronics package 14 and the flexible circuit electrode array 10 are on opposite side of the flexible circuit. This requires patterning, in some manner, both the base polymer layer and the top polymer layer.
  • the openings for the bond pad 52 and the electrodes are on the top polymer layer and only the top polymer layer needs to be patterned.
  • the narrowed portion of the flexible circuit cable 12 pierces the sclera, shoulders formed by opposite ends of the narrowed portion help prevent the flexible circuit cable 12 from moving through the sclera. It may be further advantageous to add ribs or bumps of silicone or similar material to the shoulders to further prevent the flexible circuit cable 12 from moving through the sclera.
  • a suture tab 56 in the flexible circuit body near the electronics package to prevent any movement in the electronics package from being transmitted to the flexible circuit electrode array 10.
  • a segment of the flexible circuit cable 12 can be reinforced to permit it to be secured directly with a suture.
  • Fig. 7 shows that it is advantageous to provide a sleeve or coating 50 that promotes healing of the sclerotomy.
  • Polymers such as polyimide, which may be used to form the flexible circuit cable 12 and flexible circuit electrode array 10, are generally very smooth and do not promote a good bond between the flexible circuit cable 12 and scleral tissue.
  • a sleeve or coating of polyester, collagen, silicone, Gore-Tex or similar material would bond with scleral tissue and promote healing.
  • a porous material will allow scleral tissue to grow into the pores promoting a good bond.
  • Fig. 8 shows that the flexible circuit electrode array 10 may be inserted through the sclera, behind the retina and placed between the retina and choroid to stimulate the retina subretinally.
  • the flexible circuit cable 12 may be widening of the flexible circuit 1 or it may be added material such as a bumper or sleeve.
  • a skirt 60 covers the flexible circuit electrode array 10, and extends beyond its edges. It is further advantageous to include wings 62 adjacent to the attachment point 54 to spread any stress of attachment over a larger area of the retina. There are several ways of forming and bonding the skirt 60.
  • the skirt 60 may be directly bonded through surface activation or indirectly bonded using an adhesive.
  • a flexible circuit electrode array 10 may be layered using different polymers for each layer. Using too soft of a polymer may allow too much stretch and break the metal traces. Too hard of a polymer may cause damage to delicate neural tissue. Hence a relatively hard polymer, such a polyimide may be used for the bottom layer and a relatively softer polymer such a silicone may be used for the top layer including an integral skirt to protect delicate neural tissue.
  • the simplest solution is to bond the skirt 60 to the back side (away from the retina) of the flexible circuit electrode array 10 as shown in Fig. 9 . While this is the simplest mechanical solution, sharp edges of the flexible circuit electrode array 10 may contact the delicate retina tissue. Bonding the skirt to the front side (toward the retina) of the flexible circuit electrode array 10 will protect the retina from sharp edges of the flexible circuit electrode array 10. However, a window 62 must be cut in the skirt 60 around the electrodes. Further, it is more difficult to reliably bond the skirt 60 to the flexible circuit electrode array 10 with such a small contact area. This method also creates a space between the electrodes and the retina which will reduce efficiency and broaden the electrical field distribution of each electrode. Broadening the electric field distribution will limit the possible resolution of the flexible circuit electrode array 10.
  • Fig. 11 shows another structure where the skirt 60 is bonded to the back side of the flexible circuit electrode array 10, but curves around any sharp edges of the flexible circuit electrode array 10 to protect the retina. This gives a strong bond and protects the flexible circuit electrode array 10 edges. Because it is bonded to the back side and molded around the edges, rather than bonded to the front side, of the flexible circuit electrode array 10, the portion extending beyond the front side of the flexible circuit electrode array 10 can be much smaller. This limits any additional spacing between the electrodes and the retinal tissue.
  • Fig. 12 shows a flexible circuit electrode array 10 similar to Fig. 11 , with the skirt 60, flush with the front side of the flexible circuit electrode array 10 rather than extending beyond the front side. While this is more difficult to manufacture, it does not lift the electrodes off the retinal surface as with the array in Fig. 8 . It should be noted that Figs. 9-12 show skirt 60 material along the back of the flexible circuit electrode array 10 that is not necessary other than for bonding purposes. If there is sufficient bond with the flexible circuit electrode array 10, it may advantageous to thin or remove portions of the skirt 60 material for weight reduction.
  • the flexible circuit electrode array 10 is manufactured in layers.
  • a base layer of polymer 70 is laid down, commonly by some form of chemical vapor deposition, spinning, meniscus coating or casting.
  • a layer of metal 72 (preferably platinum) is applied to the polymer base layer 70 and patterned to create electrodes 74 and traces for those electrodes. Patterning is commonly done by photolithographic methods.
  • the electrodes 74 may be built up by electroplating or similar method to increase the surface area of the electrode 74 and to allow for some reduction in the electrodes 74 over time. Similar plating may also be applied to the bond pads 52 ( fig. 6-8 ).
  • a top polymer layer 76 is applied over the metal layer 72 and patterned to leave openings for the electrodes 74, or openings are created later by means such as laser ablation. It is advantageous to allow an overlap of the top polymer layer 76 over the electrodes 74 to promote better adhesion between the layers, and to avoid increased electrode reduction along their edges.
  • the overlapping top layer promotes adhesion by forming a clamp to hold the metal electrode between the two polymer layers.
  • multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.
  • Fig. 14 shows a perspective view of a flexible electrode with a tack opening 54.
  • the tack opening 54 is in the vicinity of defined, here c shape cut out 541.
  • the cut out 541 decouples force from the tack opening 54 to portions of the flexible electrode 12.
  • the cutout 541 allows independent deflection of different regions.
  • the cut out 541 as well as the opening 54 can be manufactured by different process, such as laser, assorted mechanical means, or molding process.
  • Fig. 15 shows a top view of a modified tack opening 54, which is made thinner and has an increased open angle 542.
  • Fig. 16 shows a cross-sectional view of a modified tack opening, which is made thinner and has an increased open angle 542.
  • Figs. 15 and 16 further explain the modification shown in Fig. 14 .
  • Fig. 17 shows a top view of a modified tack opening, which can be thin height, rotate better, adjust the angle better and use softer material.
  • Fig. 18 shows a cross-sectional view of a modified tack opening, which can be thin height, rotate better, adjust the angle better and use softer material.
  • Fig. 17 shows an alternative embodiment of the embodiment shown in Fig. 15 .
  • the c shaped cut outs may decouple the forces in a different way as discussed before for one c shaped cutout in Fig. 15 .
  • Fig. 19 shows a top view of a modified tack opening, which can adjust the diameter, and adjust thickness, can use softer materials, can be manufactured integrally or discretely, flush or protruding.
  • Fig. 20 shows a cross-sectional view of a modified tack opening, which can adjust the diameter, and adjust thickness, can use softer materials, can be manufactured integrally or discretely, flush or protruding.
  • Fig. 19 and Fig. 20 show a membrane 543 made of a soft polymer, such as silicone or mixtures thereof with other soft polymers. The membrane 543 contains the tack opening 54. This embodiment does not require a gap 541 and presents a more continues surface.
  • Fig. 21 shows a cross-sectional view of a modified tack opening 54, which applies to the modifications in Figs. 14-18 , which can be flat (disk) or curved (hemispherical), and can be fabricated with part or added separately.
  • the figure shows in particular a pedestal 544 feature.
  • the potential benefit lies in lifting global electrode region off retina by a small amount and localizing high pressure on tissue to tack site.
  • Fig. 22 shows a top view and Fig. 23 shows a cross sectional view of a flexible electrode 12 with a tack opening 54 containing membrane material 543 and a silicone coating 60.
  • Fig. 22 is similar to Figs. 19 and 20 except that this embodiment is more flat. It could be manufactured in faster and easier method as the previous variation. Due to the material properties of the membrane, small static forces are transferred to the electrode array to maintain contact proximity but large, transient forces are not transferred to reduce the likelihood of array and/or retinal damage.

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Claims (20)

  1. Matrice d'électrodes de circuit flexible pour une stimulation neurale, comprenant :
    - une couche de base polymère ;
    - des traces métalliques déposées sur ladite couche de base polymère, comprenant des électrodes adaptées pour stimuler le tissu neural,
    - une couche supérieure polymère déposée sur ladite couche de base polymère et lesdites traces métalliques,
    - au moins une ouverture d'accrochage,
    - dans lequel ladite couche de base polymère, lesdites traces métalliques et ladite couche supérieure polymère sont formées en une forme tridimensionnelle,
    caractérisée en ce que
    la matrice d'électrodes de circuit flexible comprend en outre un matériau supplémentaire moulé sur les bords des couches polymères, le matériau supplémentaires étant plus souple que les couches polymères.
  2. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle ladite couche de base polymère, lesdites traces métallique et ladite couche supérieure polymère sont incurvées approximativement à la courbure d'un oeil.
  3. Matrice d'électrodes de circuit flexible selon la revendication 1, comprenant en outre une partie rétrécie dans une partie de câble de circuit flexible de ladite matrice d'électrodes de circuit flexible.
  4. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle l'ouverture d'accrochage est à proximité d'au moins une découpe.
  5. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle l'ouverture d'accrochage est rendue plus mince et présente un angle ouvert accru.
  6. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle l'ouverture d'accrochage est à proximité d'au moins une découpe en forme de c.
  7. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle l'ouverture d'accrochage est à proximité d'au moins deux découpes en forme de c.
  8. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle l'ouverture d'accrochage est entourée d'une membrane plane ou en forme d'hémisphère.
  9. Matrice d'électrodes de circuit flexible selon la revendication 8, dans laquelle la membrane contient un polymère mou.
  10. Matrice d'électrodes de circuit flexible selon la revendication 9, dans laquelle le polymère mou contient du silicone ou des mélanges de celui-ci avec d'autres polymères mous.
  11. Matrice d'électrodes de circuit flexible selon la revendication 1, dans laquelle l'ouverture d'accrochage est entourée et partiellement recouverte par un socle.
  12. Matrice d'électrodes de circuit flexible selon la revendication 11, dans laquelle le socle contient un polymère mou.
  13. Matrice d'électrodes de circuit flexible selon la revendication 12, dans laquelle le polymère mou contient du silicone ou des mélanges de celui-ci avec d'autres polymères mous.
  14. Procédé de fabrication d'une matrice d'électrodes de circuit flexible, comprenant les étapes consistant à :
    - déposer une couche de base polymère ;
    - déposer du métal sur ladite couche de base polymère ;
    - doter ledit métal d'un motif pour former des traces métalliques ;
    - déposer une couche supérieure polymère sur ladite couche de base polymère et lesdites traces métalliques ;
    - préparer au moins une ouverture d'accrochage ;
    et
    - former une forme tridimensionnelle dans ladite matrice d'électrodes de circuit flexible ;
    dans lequel le procédé comprend en outre l'étape consistant à mouler du matériau supplémentaire sur des bords des couches polymères, le matériau supplémentaire étant plus souple que les couches polymères.
  15. Procédé selon la revendication 14, comprenant la préparation d'au moins une découpe à proximité de l'ouverture d'accrochage.
  16. Procédé selon la revendication 14, dans lequel l'ouverture d'accrochage est rendue plus mince et présente un angle ouvert accru.
  17. Procédé selon la revendication 14, dans lequel l'ouverture d'accrochage est entourée d'une membrane plane ou en forme d'hémisphère.
  18. Procédé selon la revendication 14, dans lequel l'ouverture d'accrochage est entourée et partiellement recouverte par un socle.
  19. Procédé selon la revendication 14, dans lequel le socle est préparé par application d'au moins un polymère mou.
  20. Procédé selon la revendication 19, dans lequel le socle est préparé par application de silicone ou de mélanges de celui-ci avec d'autres polymères mous.
EP07809828.2A 2006-06-21 2007-06-21 Matrice d'électrodes pour circuit flexible avec au moins une ouverture de point de soudure Active EP2046442B1 (fr)

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US81531106P 2006-06-21 2006-06-21
PCT/US2007/014618 WO2007149571A2 (fr) 2006-06-21 2007-06-21 Matrice d'électrodes pour circuit flexible avec au moins une ouverture de point de soudure

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US20110265322A1 (en) 2011-11-03
US7631424B2 (en) 2009-12-15
US9643002B2 (en) 2017-05-09
WO2007149571A9 (fr) 2008-02-14
WO2007149571A3 (fr) 2008-06-26
US7991478B2 (en) 2011-08-02
US10016590B2 (en) 2018-07-10
US20170203097A1 (en) 2017-07-20
US20070265665A1 (en) 2007-11-15
EP2046442A2 (fr) 2009-04-15
WO2007149571A2 (fr) 2007-12-27
US20080058875A1 (en) 2008-03-06
AU2007261319B2 (en) 2012-02-09

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