EP2022086A1 - Procédé de production de cellules et modules photovoltaïques à partir de plaquettes de silicium - Google Patents

Procédé de production de cellules et modules photovoltaïques à partir de plaquettes de silicium

Info

Publication number
EP2022086A1
EP2022086A1 EP07748136A EP07748136A EP2022086A1 EP 2022086 A1 EP2022086 A1 EP 2022086A1 EP 07748136 A EP07748136 A EP 07748136A EP 07748136 A EP07748136 A EP 07748136A EP 2022086 A1 EP2022086 A1 EP 2022086A1
Authority
EP
European Patent Office
Prior art keywords
characterizedin
carrier
wafers
silicon wafers
carriers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07748136A
Other languages
German (de)
English (en)
Other versions
EP2022086A4 (fr
Inventor
Göran Fajersson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP2022086A1 publication Critical patent/EP2022086A1/fr
Publication of EP2022086A4 publication Critical patent/EP2022086A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Definitions

  • the present application relates to a method for producing photovoltaic cells and modules from mono- and multi-crystalline silicon wafers and wafers produced by ribbon silicon methods.
  • a wafer with a thickness of from 0.15 to 0.3 mm is processed.
  • the wafer is transported through a number of processing steps, which comprise one or more of cleaning, surface etching, phosforisation at a temperature of 700-1000 0 C, edge isolation, etching to get rid of phosphorous silicates, nitration and screen printing.
  • the wafer is handled in different ways depending on the degree of automisation. As the wafer hitherto is handled as a plate in stands and on transport bands it must absorb all stress without being damaged and still remain form stable. In the present invention the wafer is not handled as a stand-alone plate, but affixed to a carrier.
  • EP 106305 OA discloses a holder for thin semiconductor wafers with uneven sur- face. The wafers are kept in place by use of vacuum.
  • US2003196682 discloses a holder for semiconductor wafers where the wafers are kept in place by use of adhesive.
  • Figure 1 shows schematically a carrier 2 for a single wafer 1.
  • Figure 2 shows schematically a carrier 2 with one wafer 1 on each side.
  • Figure 3 shows schematically a number of carriers 2 fitted next to each other on a common rail 3 thereby creating a carrier rack 4.
  • Figure 4 shows schematically a carrier rack 4 made in one piece.
  • Figure 5 shows schematically a carrier rack 4 in the form of a tray 11.
  • Figure 6 shows schematically a carrier rack 4 being placed horizontally, vertically and in an inclined position respectively.
  • Figure 7 shows schematically a carrier rack 4 to which the wafers 1 are affixed using vacuum.
  • Figure 8 shows schematically a carrier rack 4 to which the wafers 1 are affixed using adhesive.
  • Figure 9 shows schematically an alternative way to affix the wafers 1 on a carrier 2 using adhesive by placing the latter in strings 8 on the carrier.
  • Figure 10 shows schematically how the carrier rack 4 is drawn aside after rows of wafers 1 are fixed to a glass sheet.
  • Figure 11 shows schematically a carrier rack 4 with two rulers serving as a frame for the wafers 1.
  • Figure 12 shows schematically a carrier rack 4 together with a U-shaped frame 11.
  • Figure 13 shows schematically a frame that keeps the wafers 1 hi place and shades 3-5 mm of the wafers 1.
  • Figure 14 shows schematically a frame that keeps the wafers 1 in place and shades very little.
  • Figure 15 shows schematically how a number of carrier racks 4 are put in a rack module.
  • Figure 16 shows schematically how a number of wafers 1 are electrically connected in series.
  • Solar grade silicon is sawn to wafers 1 with desired thickness and adequate tolerances.
  • Wafers 1 may also be produced by the so called ribbon silicon methods.
  • the wafers 1 can be made of mono- as well as of multi-crystalline silicon.
  • the carrier 2 is made of a material with good stability even at the temperature necessary for the subsequent phosforisation process, meaning 700-1000 0 C.
  • a suitable such material is a stainless steel that can withstand all the chemicals, which are used in the processes.
  • Other examples are ceramic materials or composites of ceramics, other metals and other inorganic materials.
  • the carrier 2 may also be made of one or more of said materials in combination.
  • a layer of very clean silicon dioxide or ultimately a sheet of solar grade silicon can be provided on the carrier surface.
  • Figures 1- 4 are shown different ways to affix a wafer 1 to a carrier 2.
  • FIG. 1 and 2 for a single wafer 1 may according to Figures 1 and 2 have a wafer 1 placed on one side or wafers 1 placed on both sides.
  • Figure 3 is shown how a number of carriers 2 can be affixed next to each other on a common rail thereby creating a carrier rack.
  • a first carrier rack 4 for a number of wafers 1 can be made hi one piece as shown in Figure 4.
  • a first carrier rack 4 according to Figures 3 and 4 may in the same way as in Figures 1 and 2 have a wafer 1 on one side or on both sides.
  • a carrier rack can also have the form of a tray. This type of second carrier rack 11 is handled as a separate unit in all the processes - see Figure 5.
  • the below description of the present invention pertains to a first carrier rack 4 according to Figure 4 and to a second carrier rack 11 according to Figure 5.
  • the present description may though be understood mutatis mutandis to cover also the other embodiments described above.
  • the wafers 1 are mounted on the carrier rack 4, 11 so that they are stably affixed during all the processes.
  • There are different methods to affix the wafers 1 on the carrier rack such as using vacuum, adhesive, welding, framing and electrostatic force.
  • vacuum, adhesive and framing is of particular interest.
  • Electrostatic force can be used as a complement in some of the process steps.
  • the wafer 1 can be placed on the carrier rack 4, 11 by hand.
  • the carrier rack 4, 11 as shown in Figure 6 can be vertical, horizontal or inclined. It is important that the wafer 1 is placed correctly on the carrier rack 4, 11.
  • a ruler 3 may be built into the carrier rack 4, 11. It is advantageous if this ruler 3 can be pushed into the carrier 2 when a pressure is applied to it. To achieve this feature the ruler may e g be mounted on springs, which force the ruler outwardly when not under pressure and which allow the ruler 3 to be pushed into the carrier when under pressure. It is possible to fully or partly automize the placing of the wafers 1 on the carrier rack 4, 11.
  • the vacuum is applied through a number of holes or slits 5 in the carrier rack 4, 11 as shown in Figure 7.
  • the carrier rack 4, 11 is placed in 45 degrees angle versus the horizontal plane and all five wafers 1 are standing on the ruler 3. The distance between the wafers 1 is adjusted exactly to the distance needed in the subsequent processing steps. Now the vacuum is applied so that the wafers 1 are firmly affixed on the carrier rack 4, 11.
  • a carrier rack 4, 11 is used for having wafers 1 on its both sides there is a wall in the interior of the carrier rack 4, 11 , which makes it possible to apply vacuum on both sides separately.
  • the carrier rack 4, 11 is turned once wafers 1 have been placed on the first side whereupon the same procedure carried out on the other side. The carrier rack 4, 11 is now ready for further processing.
  • the wafers 1 may be affixed on the carrier rack 4, 11 with adhesive 6.
  • the adhesive 6 used is preferably a metal or an inorganic material.
  • the adhesive 6 should not contain metals that harm the wafers 1 performance after the phosforisation process.
  • Affixing the wafer 1 onto the carrier rack 4, 11 can be done in different ways, e g as follows: -
  • the adhesive 6 is fixed by using pressure. This pressure must be less than fhe pressure that may damage the wafer 1.
  • the adhesive 6 is fixed by the carrier rack 4, 11 being heated in a rather small area.
  • the adhesive 6 is fixed with small quantities of organic glue.
  • the glue is destroyed and evaporated during the phosforisation process, meaning that the glue is only a temporary adhesive.
  • the permanent adhesion is established between the carrier 2, the permanent adhesive 6 and the wafer 1.
  • the adhesive 6 can be applied in different ways. In Figure 8 is shown how the adhesive 6 is applied in a small area.
  • the adhesive 6 can be put on the surface of the carrier rack 4, 11. It may also be put in circular cavities in the carrier rack 4, 11. The number of cavities may vary depending on the size of the wafer. By smaller wafers five cavities is a sufficient number. If the cavities in the carrier rack 4, 11 are slightly conical 7, as shown in Figure 8, the affixing of the wafer 1 to the carrier rack 4, 11 can be stronger.
  • One possibility to secure that the wafer 1 can be loosened from the carrier rack 4, 11 in a later process is that in the middle of each cavity there is a small hole, in which an overpressure may be generated.
  • the conical cavities 7 must be just so large that the adhesive easily gets loose without the wafer 1 being damaged.
  • the adhesive may be ground away. If it is not detrimental to the further steps it may stay as it is.
  • Figure 9 is shown an alternative way to utilise the adhesive 6.
  • the adhesive is applied in the form of at least two strings 8, each with rectangular or circular cross section.
  • the carrier rack 4, 11 there is also in this case a cavity that fits to the strings 8 so that it to a large extent is fitted into the surface of the carrier rack 4, 11.
  • an overpressure can be utilised to loosen the wafer 1.
  • the adhesive 6 in this alternative can also be utilised as a conductor for electricity.
  • the adhesive strings 8 may also comprise electrically conducting means 28, such as metal wire - see Figure 10.
  • the strings 8 are first placed into rails 2 cut out or holders 18 in the carrier rack 4, 11.
  • the holders 18 are fixed at intervals cut out of the carrier rack 4, 11.
  • the wafers 1 are then mounted on the strings with adhesive 8. After all the processes are done and the wafers 1 fixed to the glass sheet 12 the carrier rack 4, 11 is pulled aside so it gets free from the strings 8.
  • the carrier rack 4, 11 goes back and gets new strings 8 and wafers 1 affixed to it.
  • the wafers 1 When the wafers 1 are not too thin over about 0,1 mm they can be carried by gravity plus a two-sided frame. Two rulers 3 of the same type as in Figure 6 and put so that the wafer 1 fits exactly between them can be a sufficient support for the wafers 1 - see Figure 11.
  • Figure 12 is shown another method. There are two pieces made of for example ceramics. One piece forms a tray 11 and another U-shaped piece supports the tray 11 creating a frame 13. After that the tray 11 and the U-shaped frame 13 have been mounted together, the wafers 1 are put in a well-defined position. The tray 11 with the U- shaped frame 13 is then handled through all the process steps described below.
  • the U-shaped frame 13 When it is ready to be put on the glass sheet 12 first the U-shaped frame 13 is taken away, then the tray 11 is mounted from beneath on to the glass sheet 12, which has resin on its underneath side.
  • a method is described where the wafers 1 are put on carrier rack 4, 11 in well-defined positions.
  • a frame 14 of a suitable material is placed above the wafers 1 so that it touches all the sides of the wafers 1. Where the wafer 1 has an adjacent wafer 1 the frame 14 touches both of these.
  • the frame 14 in this way shades 2-4 mm of all the sides of the wafer 1.
  • the frame 14 is then pressed on to the carrier rack 4, 11 , so that they together create a package and the wafers 1 are firmly fit between the carrier rack 4, 11 and the frame 14.
  • the package is either dipped into the liquid or alternatively the liquid is put into the frame 14 for sufficient time to give desired result.
  • the frame 14 in Figure 13 can also have a very sharp triangular or needle-shaped cross-section 15 - see Figure 14. In this way the frame 14 can keep the wafers 1 in place in different ways without shading any significant area of the wafers 1.
  • Figure 15 is shown how a number of carrier racks 4, 11 can form a rack module 16.
  • a bar 17 can be used to press the frames against the wafers 1. This gives a possibility to keep an exact force on the frames and in this way make a good package for all processes where the frames can be used.
  • edge isolation and screen printing the frames need to be taken away and another method used to affix the wafers 1.
  • the carrier racks 4, 11 can also be fitted to a conveyer belt 29 or conveyer chain 30.
  • the conveyer belt 29 or conveyer chain 30 is provided with a device fixing each carrier rack 4, 11 to the conveyer belt 29 or conveyer chain 30 during all the processes.
  • the carrier racks 4, 11 may be placed on the conveyer belt 29 or conveyer chain 30 in a number of parallel lines.
  • the conveyer belt 29 or conveyer chain 30 can have support devices for frames 14, 15 if not vacuum or adhesive is used to fix the wafer 1 to the carrier rack 4, 11.
  • the carrier rack 4, 11 with the wafers 1 affixed to it according to the vacuum method, the adhesive method or the frame method is now ready to be processed in different steps known in the art and further steps to be envisaged for treating the cells to obtain increased lifetime and higher efficiencies.
  • the carrier rack 4, 11 is handled with suitable transport facilities and if convenient with robots.
  • One of the last steps hi the process is often screen printing, during which a silver and/or apatinium paste is printed on the wafer 1.
  • the invention is especially useful for producing a number of wafers 1 electrically connected hi parallel. If there is a wish to instead produce the wafers 1 electrically connected in series e g the method schematically shown in Figure 16 may be used. Small pieces of electrically conducting wires are applied on the wafers 1 before the latter are placed on the carrier rack 4, 11. Part of these connecting wires is made to extend more or less straight out from the wafer 1 surface during all the processes. This means that the wires must withstand the phosforisation process temperature. The screen printing must be modified so that it may handle these wires.
  • the length of the wafer will create the width of the module.
  • Such a long wafer can e g be produced by sawing an ingot along its long side or by the ribbon silicon methods.
  • the long wafer is processed in all the needed processes up to screen printing. Screen printing is modified to give good conductivity over the long wafers whole length.
  • a supplementary conductor can be fitted over the whole length.
  • the wafers 1 Before the wafers 1 are affixed to the glass sheet 12 it is preferable to conduct a test in order to establish whether there is a good electrical contact between the wafers 1. This test should indicate between which wafers 1 there is a defect, which may be subsequently repaired.
  • the wafers 1 are now placed on a glass sheet 12, which will become the front side of the final product, being a solar module.
  • Said sheet 12 may alternatively be made of another durable and transparent material, e g carbonate plastic.
  • a suitable resin for ex- ample melamine resin, which has little influence on the efficiency of the solar module, is applied in a thin layer on the glass sheet 12 or on the front side of the wafers 1.
  • the carrier rack 4, 11 is placed so that the row of finalized wafers 1 is located in a well defined position above or under the horizontally placed glass sheet 12.
  • the carrier rack 4, 11 is put with a precise power against the glass sheet 12 where the resin affixes the carrier rack 4, 11 to the sheet 12. Heat can be used to reduce the time for the resin to harden.
  • the wafers 1 may be taken away from the carrier racks 4, 11 and be stored separately once finalized. Then the wafers 1 may be affixed to the sheets 12 in a later and separate process.
  • the carrier rack 4, also when formed as a tray 11 is cleaned and is reutilized so that new wafers 1 may be placed thereon.
  • Each row of wafers 1 on a carrier rack 4, 11 normally becomes a finalized row in the solar module.
  • new carrier racks 4, 11 bring new rows located beside the former ones so that the solar module will ultimately get the desired amount of rows of wafers 1.
  • the glass sheet 12 with the rows of wafers 1 is further processed on its back side. Examples of such processes are: - Plasma etching or etching with KOH to isolate the emitter layer from the p- layer. This can alternatively be done when the wafers 1 are affixed on the carrier rack 4, 11 that is on the front side.
  • the wafer's back side is treated to achieve the desired electrical conductivity. This can be done with different methods. Examples of useful methods are the Al-BSF Aluminum Back Surface Field method and the LFC Laser Fired Contact method. Some of the methods utilise short heating, which should be done so that the glass sheet 12 is not hurt. One possibility is to heat the glass sheet 12 to a higher temperature not to generate too much stress in it.
  • the final step is to connect the rows electrically in parallel or hi series. This connection is preferably done on one of the sides of the glass sheets 12, where a free space is created. This can be done manually or automatically.
  • the solar module is now active and electrically connected, so it can be tested to secure its function. After testing the solar module is laminated with established polymer sheets using conventional methods. After the mounting of electrical contacts and final testing the solar module is ready for shipment.
  • the present invention has the following main advantages in comparison with methods used hitherto:
  • the silicon wafers 1, which have a thickness of from 0.03 mm to 0.25 mm and which due to their small thickness may not be handled using conventional methods, are conveniently mounted on a carrier rack 4, 11 according to the captioned vacuum, adhesive or frame method.
  • the silicon wafers 1 are processed to activate the front side into solar cells when they are affixed to the carrier rack 4, 11.
  • the glass sheet 12 with several rows of silicon wafers is processed so the back side of each silicon wafer 1 is isolated from its front side and gets a conductive layer on its back side.
  • the rows' back sides are electrically connected when they are attached on the glass sheet.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un procédé de production de modules photovoltaïques à partir de plaquettes en silicium monocristallin ou multicristallin et à partir de plaquettes produites par des procédés de silicium en ruban, dans laquelle, avant ladite production, chaque plaquette de silicium est fixée à un support par l'utilisation d'un vide, d'un adhésif ou d'un cadre. Les plaquettes restent fixées à leurs supports respectifs pendant les étapes de traitement nécessaires, après quoi elles sont détachées de leurs supports et placées sur des feuilles de verre lors de la finalisation de la dernière étape de production.
EP07748136A 2006-05-24 2007-05-16 Procédé de production de cellules et modules photovoltaïques à partir de plaquettes de silicium Withdrawn EP2022086A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0601150A SE529315C2 (sv) 2006-05-24 2006-05-24 Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor
PCT/SE2007/000472 WO2007136318A1 (fr) 2006-05-24 2007-05-16 Procédé de production de cellules et modules photovoltaïques à partir de plaquettes de silicium

Publications (2)

Publication Number Publication Date
EP2022086A1 true EP2022086A1 (fr) 2009-02-11
EP2022086A4 EP2022086A4 (fr) 2010-03-31

Family

ID=38229520

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07748136A Withdrawn EP2022086A4 (fr) 2006-05-24 2007-05-16 Procédé de production de cellules et modules photovoltaïques à partir de plaquettes de silicium

Country Status (3)

Country Link
EP (1) EP2022086A4 (fr)
SE (1) SE529315C2 (fr)
WO (1) WO2007136318A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007038240B4 (de) * 2007-08-13 2013-02-07 Institut für Kunststofftechnologie und -recycling e.V. Verfahren und Anlage zur Herstellung eines Solarmoduls
DE102008046328A1 (de) * 2008-08-29 2010-03-04 Schmid Technology Systems Gmbh Träger für Solarzellen und Verfahren zur Bearbeitung von Solarzellen
DE102008046327A1 (de) * 2008-08-29 2010-03-04 Schmid Technology Systems Gmbh Anordnung mehrerer Produktionsvorrichtungen und Verfahren zur Verwendung der Anordnung bei der Herstellung von Solarzellen
DE202008012449U1 (de) 2008-09-18 2010-02-25 Kuka Systems Gmbh Herstellvorrichtung für Strings
US8922972B2 (en) 2011-08-12 2014-12-30 General Electric Company Integral module power conditioning system

Citations (5)

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Publication number Priority date Publication date Assignee Title
US4219926A (en) * 1979-02-23 1980-09-02 Nasa Method and apparatus for fabricating improved solar cell modules
WO1986003623A1 (fr) * 1984-12-04 1986-06-19 Mobil Solar Energy Corporation Procede d'interconnexion electrique de cellules solaires
US4602417A (en) * 1983-10-24 1986-07-29 Trw Inc. Interconnector attachment machine
US20030180983A1 (en) * 2002-01-07 2003-09-25 Oswald Robert S. Method of manufacturing thin film photovoltaic modules
US20050158891A1 (en) * 2000-05-30 2005-07-21 Barth Kurt L. Apparatus and processes for the mass production of photovoltaic modules

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Publication number Priority date Publication date Assignee Title
US4561541A (en) * 1983-09-26 1985-12-31 Spectrolab, Incorporated Carrier system for photovoltaic cells
JP3732250B2 (ja) * 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
DE19928799A1 (de) * 1999-06-23 2001-01-04 Siemens Ag Mobiler Werkstückträger und Verfahren zu dessen Verwendung
DE10348542A1 (de) * 2002-11-28 2004-06-17 Brose, Ursula Kontaktierungs- und Befestigungsverfahren von Zellen sowie Photovoltaikmodul

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4219926A (en) * 1979-02-23 1980-09-02 Nasa Method and apparatus for fabricating improved solar cell modules
US4602417A (en) * 1983-10-24 1986-07-29 Trw Inc. Interconnector attachment machine
WO1986003623A1 (fr) * 1984-12-04 1986-06-19 Mobil Solar Energy Corporation Procede d'interconnexion electrique de cellules solaires
US20050158891A1 (en) * 2000-05-30 2005-07-21 Barth Kurt L. Apparatus and processes for the mass production of photovoltaic modules
US20030180983A1 (en) * 2002-01-07 2003-09-25 Oswald Robert S. Method of manufacturing thin film photovoltaic modules

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007136318A1 *

Also Published As

Publication number Publication date
SE0601150L (sv) 2007-07-03
WO2007136318A1 (fr) 2007-11-29
EP2022086A4 (fr) 2010-03-31
SE529315C2 (sv) 2007-07-03

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