EP1976806A4 - METHOD AND DEVICE FOR PROCESSING A SUBSTRATE - Google Patents

METHOD AND DEVICE FOR PROCESSING A SUBSTRATE

Info

Publication number
EP1976806A4
EP1976806A4 EP06844980A EP06844980A EP1976806A4 EP 1976806 A4 EP1976806 A4 EP 1976806A4 EP 06844980 A EP06844980 A EP 06844980A EP 06844980 A EP06844980 A EP 06844980A EP 1976806 A4 EP1976806 A4 EP 1976806A4
Authority
EP
European Patent Office
Prior art keywords
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06844980A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1976806A2 (en
Inventor
Erik C Wasinger
Gary C Ettinger
Sen-Hou Ko
Wei-Yung Hsu
Liang-Yuh Chen
Ho Seon Shin
Donald Olgado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/298,555 external-priority patent/US20070131653A1/en
Priority claimed from US11/299,295 external-priority patent/US7993485B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1976806A2 publication Critical patent/EP1976806A2/en
Publication of EP1976806A4 publication Critical patent/EP1976806A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
EP06844980A 2005-12-09 2006-12-07 METHOD AND DEVICE FOR PROCESSING A SUBSTRATE Withdrawn EP1976806A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/298,555 US20070131653A1 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
US11/299,295 US7993485B2 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
PCT/US2006/046765 WO2007070353A2 (en) 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate

Publications (2)

Publication Number Publication Date
EP1976806A2 EP1976806A2 (en) 2008-10-08
EP1976806A4 true EP1976806A4 (en) 2011-08-10

Family

ID=38163413

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06844980A Withdrawn EP1976806A4 (en) 2005-12-09 2006-12-07 METHOD AND DEVICE FOR PROCESSING A SUBSTRATE

Country Status (5)

Country Link
EP (1) EP1976806A4 (enExample)
JP (2) JP2009518872A (enExample)
KR (1) KR101236855B1 (enExample)
TW (1) TWI362697B (enExample)
WO (1) WO2007070353A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993485B2 (en) 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US7976361B2 (en) * 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP5274993B2 (ja) * 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
JP2014083647A (ja) * 2012-10-25 2014-05-12 Avanstrate Inc ガラス基板研磨用磁性流動体
CN104956467B (zh) * 2013-01-31 2018-02-16 应用材料公司 用于化学机械平坦化后的基板清洗的方法及设备
KR102229920B1 (ko) 2013-10-25 2021-03-19 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 평탄화 후의 기판 버프 사전 세정을 위한 시스템, 방법 및 장치
DE102015008814A1 (de) 2015-07-10 2017-01-12 Thielenhaus Technologies Gmbh Andrückschuh mit Expansionskammer
JP2017087305A (ja) * 2015-11-02 2017-05-25 日本電気硝子株式会社 円板状ワークの研磨加工方法及び研磨加工装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6414353B1 (ja) * 2018-03-27 2018-10-31 株式会社不二越 フィルムラップ加工装置
JP7121572B2 (ja) * 2018-07-20 2022-08-18 株式会社荏原製作所 研磨装置および研磨方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US20040185751A1 (en) * 2003-02-03 2004-09-23 Masayuki Nakanishi Substrate processing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533399A (en) * 1983-04-12 1985-08-06 Minnesota Mining And Manufacturing Company Contact lens cleaning method
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JP2924890B2 (ja) * 1998-04-20 1999-07-26 トヨタ自動車株式会社 研摩方法
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP2002154041A (ja) * 2000-11-17 2002-05-28 I M T Kk 研磨装置
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP2005186176A (ja) * 2003-12-24 2005-07-14 Shinko Electric Ind Co Ltd ウエハ端面研磨装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US20040185751A1 (en) * 2003-02-03 2004-09-23 Masayuki Nakanishi Substrate processing apparatus

Also Published As

Publication number Publication date
WO2007070353A3 (en) 2007-11-29
WO2007070353A2 (en) 2007-06-21
TWI362697B (en) 2012-04-21
KR20080075001A (ko) 2008-08-13
JP2009518872A (ja) 2009-05-07
TW200735200A (en) 2007-09-16
JP2012183637A (ja) 2012-09-27
KR101236855B1 (ko) 2013-02-26
EP1976806A2 (en) 2008-10-08

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20080708

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CHEN, LIANG-YUH

Inventor name: KO, SEN-HOU

Inventor name: WASINGER, ERIK C.

Inventor name: HSU, WEI-YUNG

Inventor name: OLGADO, DONALD

Inventor name: ETTINGER, GARY C.

Inventor name: SHIN, HO, SEON

A4 Supplementary search report drawn up and despatched

Effective date: 20110707

RIC1 Information provided on ipc code assigned before grant

Ipc: C03C 15/00 20060101AFI20110701BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120207

DAX Request for extension of the european patent (deleted)