EP1955403A1 - Microwave power splitter / combiner - Google Patents
Microwave power splitter / combinerInfo
- Publication number
- EP1955403A1 EP1955403A1 EP06820646A EP06820646A EP1955403A1 EP 1955403 A1 EP1955403 A1 EP 1955403A1 EP 06820646 A EP06820646 A EP 06820646A EP 06820646 A EP06820646 A EP 06820646A EP 1955403 A1 EP1955403 A1 EP 1955403A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- resistor
- combiner
- conductive
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Definitions
- This invention concerns microwave circuits and in particular, but not exclusively, the manufacture of a microwave power splitter/combiner either as a component, or as part of a manifold power splitter/combiner. More particularly, but not exclusively, the invention relates to the formation of a multi-layer laminate defining one or more microwave power splitter/combiners of the type originated by Ernest Wilkinson and commonly referred to as a Wilkinson splitter or a Wilkinson combiner.
- an input signal entering the first port is split into equal-phase and equal-amplitude output signals at the second and third ports.
- the isolation resistor is decoupled from the input signal because its ends are at the same potential and no current passes through it.
- Wilkinson combiner has the same structure but combines input signals at the second and third ports to produce an output signal at the first port.
- An input signal at either the second port or the third port has half of its power dissipated in the resistor in a manner well known in the art, with the remainder transmitted to the first port. The resistor therefore decouples the second and third ports.
- Wilkinson splitters and combiners are well known to have a range of configurations all requiring the provision of at least one isolation resistor. Although some of these splitter and combiner designs have more than three ports, for instance 3:1 and 4:1 configurations, they all require a ported circuit defining at least three ports.
- the invention enables high insertion losses at microwave frequencies to be reduced.
- a microwave power splitter/combiner comprises a multi-layer laminate including a substrate carrying a resistive layer which has been etched to define a resistor, a dielectric membrane covering the resistor, a conductive layer defining at least part of an electrical circuit of the power splitter/combiner, and two ports of the power splitter/combiner are electrically connected across the resistor by vias extending through the dielectric membrane.
- the resistive layer is preferably formed from a nickel-phosphorus alloy.
- the resistive layer may have been etched to define a profile similar to the microwave circuit, the conductive layer defining the microwave circuit has been deposited on the etched profile of the resistive layer, and the two ports are electrically connected by the vias to the microwave circuit.
- the resistive layer may define a discrete resistor, conductive pads are secured to the resistor, the conductive layer is formed on the opposite side of the dielectric membrane to the discrete resistor, and the two ports are electrically connected by the vias one to each of the conductive pads.
- the conductive pads are preferably formed of copper.
- the multi-layer laminate preferably includes a copper foil covering the resistive layer, the copper foil having been etched to define the conductive pads.
- the dielectric membrane is preferably formed from expanded poly-tetra- flouro-ethelyene impregnated with a thermoset resin.
- the conductive layer is preferably formed from copper.
- a manifold power splitter/combiner comprises a multi-layer laminate defining a plurality of microwave power splitters/combiners each as hereinbefore specified, the conductive layer being etched to define the electrical connections between the microwave circuits of the power splitters/combiners.
- a method of manufacturing a microwave power splitter/combiner comprises forming a laminate including a substrate carrying a resistive layer, a conductive layer carried by the resistive layer, a dielectric membrane covering the conductive layer, and at least three ports arranged on the opposite side of the dielectric layer to the conductive layer, including etching the resistive layer and the conductive layer to define a microwave circuit for the microwave power splitter/combiner with an integral resistor, and forming electrically conductive vias through the dielectric membrane to connect the ports to the microwave circuit.
- a method of manufacturing a microwave power splitter/combiner comprises forming a laminate including a substrate carrying a resistive layer, a first conductive layer carried by the resistive layer, a dielectric membrane covering the first conductive layer, and a second conductive layer covering the dielectric membrane, and includes etching the resistive layer and the first conductive layer to define a discrete resistor having conductive pads, etching the second conductive layer to define a microwave circuit of the power splitter/combiner, and forming electrically conductive vias through the dielectric membrane to connect two ports of the microwave circuit one to each of the conductive pads.
- a method of manufacturing a manifold power splitter/combiner comprises forming a laminate including a substrate carrying a resistive layer, a first conductive layer carried by the resistive layer, a dielectric membrane covering the first conductive layer, and a second conductive layer covering the dielectric membrane, and includes etching the resistive layer and the first conductive layer to define a plurality of discrete resistors each having conductive pads, etching the second conductive layer to define an equivalent plurality of ported microwave circuits of power splitters/combiners together with electrical interconnections, and forming electrically conductive vias through the dielectric membrane to connect two ports of each ported microwave circuit one to each of the conductive pads of one of the discrete resistors.
- the method may also include testing the value of each resistor before placing the dielectric membrane over the conductive pads. - A -
- the method may further include adjusting the value of any resistor to a specified value before placing the dielectric membrane over the resistor.
- the invention resides in a microwave circuit in the form of a multi-layer laminate including a substrate carrying a resistive layer which has been etched to define at least one resistor, a dielectric membrane covering the resistor, a conductive layer defining at least part of an electrical circuit, and said at least one resistor is electrically connected to the conductive layer by vias extending through the dielectric membrane.
- the resistive layer defines a discrete resistor
- conductive pads are secured to the resistor
- the conductive layer is formed on the opposite side of the dielectric membrane to the discrete resistor
- the vias extend one to each of the conductive pads.
- the use of a separate resistive layer eliminates resistive elements from the main circuit layer which has the advantage that losses otherwise associated with resistors provided in the main circuit layer are reduced or substantially eliminated. Furthermore, during manufacture of the circuit, DC testing of the resistors can be carried out separately from testing of the main circuit.
- Figure 1 is a plan view of part of a multi-layer laminate comprising a first embodiment of a single Wilkinson power splitter/combiner;
- Figure 2 is a section taken along the line 2-2 in Figure 1 ;
- Figure 3 is a plan view of a manifold power combiner comprising seven
- FIGs 4 to 16 illustrate diagrammatically a method of manufacturing the Wilkinson power splitter/combiners illustrated in Figures 1 to 3 [this process is a variant of the one etch process generally known as the "Gould Process” which was originated by Gould Electronics Inc. of Eastlake, Ohio, USA using a thin film embedded resistor identified by their trademark TCR]; and
- FIG 17 is an isometric view of a second embodiment of a single Wilkinson splitter/combiner with various layers of the laminate omitted for clarity.
- preferred embodiments of the present invention are described with reference to the manufacture of a particular microwave circuit component - a Wilkinson power splitter/combiner. However, all preferred embodiments described below may be applied to microwave circuits of a general nature having one or more resistors, not necessarily including a Wilkinson power splitter/combiner, and to a method of their manufacture. In particular, preferred embodiments of the present invention may be directed to microwave circuits in general, and to techniques for their manufacture, in the form of a multi-layer laminate having a separate resistive layer to that carrying the main circuit. With reference to Figures 1 and 2, a Wilkinson power splitter/combiner
- the 20 defines three ports 21 , 22 and 23 which are interconnected by a conductive layer 24 defining a pair of arms 25, 26 constituting quarter-wave transformers each having a characteristic impedance of 1.414 x Z 0 [or Z°V2] in a well-known manner.
- the ports 22 and 23 are also interconnected by a discrete 2 x Z 0 isolation resistor 27 carried by a substrate 28.
- Conductive pads 29, 30 are conductively secured to the ends of the discrete resistor 27, as shown in Figure 2, and are electrically connected to the ports 22 and 23 by respective plated vias 31 and 32.
- the resistor 27 has been etched, to the size and shape illustrated in Figures 1 and 2, from a resistive layer that originally covered the upper surface of the substrate 28.
- a conductive layer 34 for instance of copper, which is etched to define the ported circuit of the Wilkinson splitter/combiner 20 including ports 21 , 22 and 23, and the pair of arms 25 and 26.
- the vias 31 , 32 are formed in any convenient manner, for instance by using an excimer laser, followed by electro-plating to provide good electrical connections between the conductive pad 29 and the port 22, and between the conductive pad 30 and the port 23, a plated layer 35 also being deposited on top of the entire upper profile of the copper sheet 34. It should be noted that, whilst the copper sheet 34 is positioned on top of the dielectric membrane 33, the resistor 27 and its associated conductive pads 29 and 30 are encased between the substrate 28 and the dielectric membrane 33.
- a microwave input entering port 21 will be split into equal-phase and equal amplitude outputs at ports 22 and 23.
- microwave inputs entering the ports 22 and 23 will be combined to produce an output signal at port 21.
- Wilkinson splitter/combiner 20 illustrated in Figures 1 and 2 could be a single electronic component mounted on its own area of laminate 27, 28, 33, 34, a plurality of Wilkinson splitters/combiners 20 could be formed on the same laminate, for instance as illustrated in Figure 3.
- an eight-way manifold combiner 40 comprises seven Wilkinson combiners 20 formed on the same laminate in the manner described with reference to Figures 1 and 2, the combiners 20 having their ports interconnected as shown such that inputs entering the eight input ports 41 will be combined at the single output port 42.
- the eight-way manifold 40 becomes a splitter.
- Manifold splitters are used, for instance, as components in the construction of microwave radiating elements, whilst manifold combiners are useful as components in the construction of microwave antennas.
- Figure 3 illustrates an eight-way manifold combiner, different configurations of Wilkinson splitters or combiners can be interconnected to provide different configurations, for instance a six-way manifold combiner or splitter.
- the Wilkinson splitter/combiner 20 described with reference to Figures 1 and 2, can be formed using the method that is now described with reference to
- Figures 4 to 16 which diagrammatically show the sequential formation and attachment of the ports 22 and 23 to their respective ends of the discrete isolation resistor 27.
- the reference numerals used in Figures 1 to 3 are used, wherever appropriate, in Figures 4 to 16 and denote the same features unless stated to the contrary.
- the method of manufacture utilises a laminated sheet 50, as shown in
- Figure 4 comprising a thin layer of resistive material 51 laminated between a copper foil 52 and a dielectric sheet defining the substrate 28.
- the layer of resistive material can comprise either a thin-film nickel-phosphorous alloy of about 0.1 to 0.4 microns thick supplied by ⁇ hmega Technologies Inc. under their trade mark Ohmega-Ply, or a thin film embedded resistor of the type supplied by Gould Electronics Inc. under their trademark TCR.
- two areas 53 and 54 of photoresist are applied to the copper foil 52, then exposed and developed.
- the uncovered area of the copper foil 52 is then etched, as indicated in Figure 6, to expose the resistive material 51 except where it is covered by the photoresist areas 53 and 54 and the intervening area of copper foil which will define the conductive pads 29 and 30.
- FIG 7 The next stage is shown in Figure 7 and involves stripping the photoresist areas 53 and 54 to expose the conductive pads 20 and 30.
- Figure 8 shows the application of photoresist 55 to the upper surface of the resistive material 51 between the conductive pads 29 and 30.
- An etching solution that does not attack copper is then used to strip the exposed area of the resistive material 51 as shown in Figure 9, thereby leaving an area of the resistive material 51 defining the discrete isolation resistor 27.
- the next step is to strip the photoresist 55 to achieve the structure shown in Figure 10 in which the discrete isolation resistor 27 is carried by the substrate 8 and carries the conductive pads 29 and 30. At this point in the process it is possible to check the value of the resistor 27 by applying an appropriate gauge across the pads 29 and 30.
- the process can either be terminated to save further manufacturing costs, or the resistor 27 can be adjusted to fall within such tolerances. If the value of the resistor is too low, the portion between the pads 29 and 30 can have its surface abraded or pared until an appropriate resistance is achieved. On the other hand, if the value of the resistor is too high, its effective length can be shortened by adding copper to the inwardly-facing end of one of the pads 29 or 30.
- Figure 11 shows the addition of further laminates comprising an expanded polytetrafluoroethane (PTFE) dielectric membrane 60 and a low melting point bonding film 61 carrying a copper layer 62. These layers are pressed against the pads 29 and 30 with an appropriate force and at an appropriate temperature until they are completely embedded in the dielectric membrane 60.
- a suitable material for the dielectric membrane 60 is a sheet of expanded PTFE impregnated with thermosetting resins, such as that manufactured by W L Gore and Associates Inc. of Newark, Delaware, USA under their trade mark SPEEDBOARD.
- a suitable material for the bonding film with copper layer is the laminate manufactured by Arlton, Inc. of Lancaster, United Kingdom under their trade mark CuClad 6700.
- Figure 12 shows the formation of via holes 63 and 64 extending vertically through the copper layer 62, the bonding film 61 and the dielectric membrane 60, into the conductive pads 29 and 30.
- the next step is a plating process, as indicated in Figure 13, to fill the via holes 63, 64 with a conductive material, such as copper, to form the plated vias 31 , 32, thereby electrically connecting the conductive pads 29 and 30 to the copper layer 62.
- a plating process as indicated in Figure 13 to fill the via holes 63, 64 with a conductive material, such as copper, to form the plated vias 31 , 32, thereby electrically connecting the conductive pads 29 and 30 to the copper layer 62.
- the surface of the copper layer 62 becomes covered with a plated layer 65 thereby enhancing electrical conductivity between the copper layer 62 and the plated vias 31 , 32.
- the next step is to apply an area of photoresist 66 to the plated layer 65.
- this area of photoresist 66 is shown as two separate areas, the actual area is the plan of the splitter or combiner and any associated connections.
- the two areas of photoresist 66 are effectively the ports 22 and 23 of the splitter or combiner and would, of course, be connected to an adjacent area of photoresist defining the port 21 and the arms 25 and 26.
- Photoresist 66 is then exposed and developed, and the exposed portions of the plated layer 65 and the copper layer 62 are etched away to produce the configuration shown in Figure 15.
- the final step is stripping the photoresist 66 to leave the complete splitter/combiner as shown in Figure 16.
- Figures 8 and 9 can be increased to cover the entire outline of the Wilkinson power splitter/combiner 20 illustrated in Figure 1. In this manner the area of resistive material 51 will be enlarged to the same size as the outline of the power splitter/combiner 20.
- Figure 17 illustrates the construction of a second embodiment of a single Wilkinson power splitter/combiner.
- the same reference numerals as those used in Figures 1 - 16 are employed to indicate equivalent components and features, and only the ports of difference are described.
- the substrate 28 and the dielectric membrane 33 are omitted for clarity so that the entire microwave circuit is clearly seen.
- the multi-layer laminate comprises the unshown substrate 28 which carries a resistive layer 70 covered by a first conductive layer 71 in the form of a 17um copper foil, the first conductive layer 71 being covered by an unshown dielectric membrane covered with the conductive layer 34 constituting a second conductive layer.
- This multi-layer laminate has been etched, for instance by using the aforesaid "Gould Process", or any convenient variant thereof, to leave the illustrated structure. From Figure 17 is will be noted that the first conductive layer 71 has been etched to define the pair of arms 25 and 26 constituting the quarter-wave transformers, and indeed most of the microwave circuit.
- the resistive layer 70 has been etched to the same profile as the first conductive layer 71 , except that an additional area has been left un-etched to define the resistor 27.
- the second conductive layer 34 has largely been etched away, leaving only three conductive connectors defining the ports 21 , 22 and 23. In this manner the unshown substrate 28 will underlie the resistive layer 70, and the unshown dielectric membrane 33 will be positioned between the upper surface of the first conductive layer 71 and the lower surface of the second conductive layer 34.
- Plated vias 72, 31 and 32 respectively connect the ports 21 , 22 and 23 to the appropriate points of the first conductive layer 71 as shown. These vias are formed in any convenient manner, for instance by using an excimer laser, followed by electro-plating as for the first embodiment.
- vias 72, 31 and 32 are hollow. This form of via may also be used in the embodiment illustrated in Figures 1 - 16.
- the microwave power splitter/combiner of Figures 1 - 16 has the advantage of minimising the number of vias, but can incur higher resistor parasitics.
- the microwave power splitter/combiner of Figure 17 has the advantage of avoiding asymmetry and discontinuities near the resistor 27, but requires an additional via. While particular materials have been suggested for use in preferred embodiments of the present invention, it will be clear that other materials may be selected without departing from the scope of the invention.
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- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06820646A EP1955403A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter / combiner |
EP21152716.3A EP3907820A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter/combiner |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0524370A GB0524370D0 (en) | 2005-11-30 | 2005-11-30 | Microwave power splitter/combiner |
EP06270013 | 2006-02-09 | ||
PCT/GB2006/050419 WO2007063344A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter / combiner |
EP06820646A EP1955403A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter / combiner |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21152716.3A Division EP3907820A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter/combiner |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1955403A1 true EP1955403A1 (en) | 2008-08-13 |
Family
ID=37682631
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06820646A Withdrawn EP1955403A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter / combiner |
EP21152716.3A Pending EP3907820A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter/combiner |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21152716.3A Pending EP3907820A1 (en) | 2005-11-30 | 2006-11-29 | Microwave power splitter/combiner |
Country Status (3)
Country | Link |
---|---|
US (1) | US7920035B2 (en) |
EP (2) | EP1955403A1 (en) |
WO (1) | WO2007063344A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080143455A1 (en) * | 2006-12-14 | 2008-06-19 | Art Ross | Dynamic power splitter |
US8471647B2 (en) * | 2008-04-11 | 2013-06-25 | Mitsubishi Electric Corporation | Power divider |
US8319583B2 (en) * | 2009-08-24 | 2012-11-27 | Raytheon Company | Multi-layer radial power divider/combiner |
CN102637939B (en) * | 2012-04-28 | 2014-06-11 | 中国科学院苏州纳米技术与纳米仿生研究所 | Spinning microwave oscillator based on vertical magnetizing free layer and manufacturing method thereof |
US9344138B2 (en) | 2012-10-22 | 2016-05-17 | Emhiser Research, Inc. | Method and system for providing improved high power RF splitter/combiner |
CN104756313A (en) * | 2012-10-25 | 2015-07-01 | 瑞典爱立信有限公司 | Power divider and method of fabricating the same |
US20160346560A1 (en) * | 2015-05-26 | 2016-12-01 | Regear Life Sciences Inc. | Diathermy Heat Applicator Array with Cancellation of Extraneous Incidental Radiation |
KR102554415B1 (en) * | 2016-11-18 | 2023-07-11 | 삼성전자주식회사 | Semiconductor Package |
KR102406488B1 (en) * | 2018-02-28 | 2022-06-08 | 레이던 컴퍼니 | Additive Manufacturing Technology Low Profile Signal Splitter |
CN108767403B (en) * | 2018-03-15 | 2024-04-30 | 成都宏科电子科技有限公司 | Millimeter wave multilayer power divider |
US11544517B2 (en) * | 2020-10-03 | 2023-01-03 | MHG IP Holdings, LLC | RFID antenna |
CN115939713A (en) * | 2022-12-09 | 2023-04-07 | 京信网络系统股份有限公司 | Power divider and communication equipment |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450418A (en) * | 1981-12-28 | 1984-05-22 | Hughes Aircraft Company | Stripline-type power divider/combiner with integral resistor and method of making the same |
JPS60229502A (en) * | 1984-04-27 | 1985-11-14 | Mitsubishi Electric Corp | Power distributing circuit |
US4777718A (en) | 1986-06-30 | 1988-10-18 | Motorola, Inc. | Method of forming and connecting a resistive layer on a pc board |
US5634208A (en) * | 1995-03-28 | 1997-05-27 | Nippon Telegraph And Telephone Corporation | Multilayer transmission line using ground metal with slit, and hybrid using the transmission line |
US6201439B1 (en) * | 1997-09-17 | 2001-03-13 | Matsushita Electric Industrial Co., Ltd. | Power splitter/ combiner circuit, high power amplifier and balun circuit |
JP3473518B2 (en) * | 1999-09-27 | 2003-12-08 | 株式会社村田製作所 | Power distribution combiner and mobile communication device using the same |
US6570466B1 (en) * | 2000-09-01 | 2003-05-27 | Tyco Electronics Logistics Ag | Ultra broadband traveling wave divider/combiner |
JP2005044955A (en) | 2003-07-28 | 2005-02-17 | Orient Micro Wave:Kk | Circuit device using laminated substrate |
TWI266568B (en) * | 2004-03-08 | 2006-11-11 | Brain Power Co | Method for manufacturing embedded thin film resistor on printed circuit board |
-
2006
- 2006-11-29 EP EP06820646A patent/EP1955403A1/en not_active Withdrawn
- 2006-11-29 US US11/661,190 patent/US7920035B2/en active Active
- 2006-11-29 EP EP21152716.3A patent/EP3907820A1/en active Pending
- 2006-11-29 WO PCT/GB2006/050419 patent/WO2007063344A1/en active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2007063344A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP3907820A1 (en) | 2021-11-10 |
US20090002092A1 (en) | 2009-01-01 |
WO2007063344A1 (en) | 2007-06-07 |
US7920035B2 (en) | 2011-04-05 |
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