EP1941520A1 - Resistor, particularly smd resistor, and associated production method - Google Patents

Resistor, particularly smd resistor, and associated production method

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Publication number
EP1941520A1
EP1941520A1 EP07819122A EP07819122A EP1941520A1 EP 1941520 A1 EP1941520 A1 EP 1941520A1 EP 07819122 A EP07819122 A EP 07819122A EP 07819122 A EP07819122 A EP 07819122A EP 1941520 A1 EP1941520 A1 EP 1941520A1
Authority
EP
European Patent Office
Prior art keywords
resistor
resistance
support element
resistance element
connection parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07819122A
Other languages
German (de)
French (fr)
Other versions
EP1941520B1 (en
Inventor
Ulrich Hetzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IsabellenHuette Heusler GmbH and Co KG
Isabellen Huette GmbH
Original Assignee
IsabellenHuette Heusler GmbH and Co KG
Isabellen Huette GmbH
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Application filed by IsabellenHuette Heusler GmbH and Co KG, Isabellen Huette GmbH filed Critical IsabellenHuette Heusler GmbH and Co KG
Priority to PL07819122T priority Critical patent/PL1941520T3/en
Publication of EP1941520A1 publication Critical patent/EP1941520A1/en
Application granted granted Critical
Publication of EP1941520B1 publication Critical patent/EP1941520B1/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making

Definitions

  • Resistor in particular SMD resistor, and associated
  • the invention relates to a resistor, in particular an SMD resistor, as well as a corresponding manufacturing method according to the independent claims.
  • FIG 4 shows an exemplary embodiment of a conventional SMD resistor 1 (SMD: S_urface mounted device), which is sold by the applicant and in similar form, for example, in DE 43 39 551 Cl is described.
  • the known SMD resistor 1 has a plate-shaped metallic carrier 2, which may for example consist of copper.
  • an electrically insulating adhesive layer 3 is applied in the manufacture, with which then a resistive layer is glued to the top of the carrier 2.
  • the resistance layer is structured by etching, so that forms a maanderformig extending resistance track 4 at the top of the carrier 2.
  • the resistor 1 is then covered at the top by a protective lacquer 5 which electrically insulates the resistance track 4.
  • a transversely extending recess 6 is then introduced into the carrier 2, which divides the carrier 2 into two separate carrier elements 2.1, 2.2 and thereby prevents a direct current flow between the two carrier elements 2.1, 2.2.
  • the support elements 2.1, 2.2 in this case thus form the electrical connection parts of the SMD resistor 1, which can be soldered on solder pads 7, 8, as indicated schematically in the drawing by the arrows.
  • a disadvantage of the known SMD resistor 1 is the complicated electrical connection of the underlying support elements 2.1, 2.2 with the above-adhered resistance layer, which forms the resistance track 4.
  • a conductive surface must first be achieved (chemical through-connection) in preparation for a current-carrying, galvanically applied contacting on the outer edge of the adhesive layer 3, in order subsequently to apply a copper layer in a multi-stage galvanic process, which safely conducts the total current.
  • this contact is part of the current path through the SMD resistor and therefore also influences the resistance of the SMD resistor 1, which in the case of low-resistance configurations with a resistance value of less than 25 m ⁇ requires that the resistance compensation be performed on the isolated SMD resistor 1 whereas resistance matching on a multi-resistor benefit is excluded.
  • a further disadvantage of the known SMD resistor 1 is due to the incision 6 in the carrier 2, since the recess 6 for the mechanical stabilization of the SMD resistor 1 is filled with a lacquer or an epoxy resin which expands during the plating and for Bending of the SMD resistor 1 leads, wherein the bending is virtually frozen after the solidification of the solder and is retained in the finished component, at least as an optical defect.
  • This problem occurs especially when using lead-free solders that require a higher soldering temperature.
  • a certain paint volume is required to mechanically stabilize the SMD resistor 1 despite the incision 6, which in turn requires that the carrier 2 is relatively thick.
  • the carrier 2 must have a thickness of at least 0.5 mm, which limits the miniaturization of the SMD resistor 1. Regardless of the thickness of the carrier 2, the mechanical strength of the SMD resistor 1 due to the mechanical weakening is limited by the incision 6.
  • SMD resistor 1 Another disadvantage of the SMD resistor 1 is the high electroplating cost, which accounts for approximately 25% of the total production costs. These high electroplating costs result from the fact that the lateral re-contacting of the two support elements 2.1, 2.2 to the resistance track 4 must take over the full current flow, so that the requirements for the density and the effective cross section of the galvanically applied copper layer are relatively high. In addition, with low-ohmic resistance values, the influence of copper on the electrical properties is not completely negligible.
  • the support elements 2.1, 2.2 do not correspond to the usual standard dimensions of solder pads as connection parts, but have a much greater length. A shortening of the two support elements 2.1, 2.2 and thus a widening of the incision 6, however, would lead to a further mechanical and thermal weakening and is therefore not possible.
  • FIG. 5 shows another construction of a known SMD resistor 9 marketed by the Applicant, a similar construction also being described in EP 0 929 083 B1.
  • the SMD resistor 9 has a plate-shaped thin carrier 10 made of aluminum, wherein the carrier 10 in this design has no incision and thus no mechanical weakening.
  • At the bottom of the plate-shaped carrier 10 is an adhesive layer 11, a resistive layer 12th glued, the technically structured and forms a maanderformige resistance path.
  • strip-shaped copper contacts 13 are applied to the underside, which contact the strip-shaped connecting parts 14, 15 electrically.
  • the SMD resistor 9 in this construction at the top and at the bottom of a protective lacquer layer 16, 17.
  • An advantage of this construction of the SMD resistor 9 is first the fact that the carrier 10 has no mechanical weakening, so that the problems based thereon and described above are avoided.
  • connection parts 14, 15 and thus also the soldering points lie on the underside of the SMD resistor 9, where the solder points are not accessible to visual inspection.
  • lateral attachment of the solder pads is not possible with the SMD resistor 9 because the solder pads would otherwise make an undesirable electrical shunt across the electrically conductive carrier 10.
  • SMD resistor 9 Another disadvantage of the SMD resistor 9 is that the carrier 10 made of anodized aluminum is relatively hard and therefore reduces the lifetime of the used Sageblatts when separating the SMD resistor 9 by legends. Moreover, the rejection of the individual SMD resistors 9 from aluminum benefit, due to the low melting point of the aluminum compared to copper, leads to an interfering sawing ridge on the rejected SMD resistor 9.
  • Another conventional construction of an SMD resistor finally has a plate-shaped ceramic carrier, which carries on its upper side a structured resistance layer, wherein the resistance layer also forms a maanderformige resistance path.
  • the electrical contacting of the SMD resistor is carried out in this construction by Lotkappen of a chemicalleitfahigen, usually galvanically reinforced, solderable metal layer (eg nickel-chromium alloy), the Lotkappen in cross-section are U-shaped and the opposite narrow edges of the SMD Encase resistance-shaped cap.
  • the Lotkappen are hereby accessible laterally, so that when Festloten laterally visible Lotstellen arise that allow easy visual inspection of the solder joints.
  • a disadvantage of this construction is the fact that the carrier is made of ceramic and therefore compared to
  • Copper see Fig. 4
  • aluminum see Fig. 5
  • the resistance layer is in this case arranged on the upper side of the carrier, which leads to the above-described disadvantageous influences on the total resistance.
  • the object of the invention is to eliminate the disadvantages of the SMD resistor 9 by allowing a simple visual inspection of the solder joints.
  • the invention comprises the general technical teaching of arranging the connection parts exposed on the resistor laterally, so that the connection parts are visibly wettable laterally by a solder in order to allow a visual inspection of the respective solder connection.
  • the inventive resistor is preferably designed as an SMD resistor and allows a conventional surface mounting.
  • the invention is not limited to SMD resistors, but basically also includes other types of Widertand, for example, provide a conventional contact with solder pins.
  • the resistor according to the invention has a flat, metallic support element, which has good thermal conductivity and an adapted coefficient of thermal expansion due to its metallic material composition, which is advantageous during operation of the resistor according to the invention.
  • the resistor according to the invention has a flat resistance element made of a resistance material, wherein the resistance element is arranged on the underside of the flat carrier element.
  • a flat resistance element or carrier element is to be understood generally and is not limited to the mathematical-geometric definition of a surface.
  • this feature is preferably based on the fact that the lateral extent of the carrier element or of the resistance element is substantially greater than the thickness of the carrier element or resistance element.
  • this feature preferably also includes that the top side and the bottom side of the carrier element or resistance element each extend parallel to one another.
  • the support element and the resistance element are preferably flat, but also curved and curved shapes are possible for the support element and the resistance element.
  • the resistor according to the invention has at least two separate metallic connection parts, which electrically contact the resistance element and are partially arranged on the underside of the support element.
  • the connection parts are not completely arranged at the bottom, but are at least partially laterally free of the resistor, so that form the solid solders laterally visible Lotstellen that a simple visual inspection enable.
  • the metallic connecting parts preferably each extend laterally upwards on the resistor up to the metallic carrier element, where the connecting parts contact the carrier element and make electrical and thermal contact.
  • the connecting parts can each have a U-shaped transverse have cut and embrace the resistor at opposite edges each kappenformig, with a lateral metallization in the contact area is possible.
  • the metallic carrier element has only the function of a carrier and a heat conductor, whereas in the case of the inventive resistor the carrier element should not be a current conductor in order to avoid an undesired shunt across the metallic carrier element.
  • the metallic element Tragerele ⁇ Therefore, in the inventive resistor an incision, which divides the support element into at least two electrically isolated portions and a current flow via the support element between the two connecting parts is prevented.
  • the recess may be formed in the same manner as in the known SMD resistor according to Figure 4, in which the resistance layer is arranged at the top of the carrier.
  • the incision in the support element runs at least partially obliquely, for example V-shaped, W-shaped or maander-shaped.
  • V-shaped, W-shaped or maander-shaped Such a shaping of the incision in the support element advantageously leads to a greater mechanical stability of the resistance than in the case of a running incision.
  • connection parts are preferably matched in their size to standard solder pads, as a result of which the resistor according to the invention differs from the known SMD resistor according to FIG. 4, in which the connection parts have a substantially greater lateral extent.
  • the connecting parts therefore preferably have a lateral extent which is less than 30%, 20% or 15% of the distance between the two connecting parts.
  • a relative dimensioning of the connecting parts relative to the distance between the connection parts on the other hand excessively klei ⁇ NEN connection parts.
  • the strip-shaped connection parts can have a width in the range of 0.1-0, 3 mm (design 0402), 0.15-0, 40 mm (design 0603), 0.25-0.75 mm (design 1206) or 0.35- 0.85 mm (type 2512).
  • the resistance material of the resistor according to the invention preferably consists of a copper-manganese alloy, such as, for example, a copper-manganese-nickel alloy.
  • a copper-manganese alloy such as, for example, a copper-manganese-nickel alloy.
  • CuMn3 be used as a resistor material.
  • a nickel-chromium alloy in particular a nickel-chromium-aluminum alloy.
  • the resistance element may also consist of a copper-nickel alloy, such as CuNil5 or CuNiIO.
  • the invention is not limited to the abovementioned examples with regard to the resistance materials which can be used, but in principle can also be implemented with other resistance materials.
  • the resistor according to the invention preferably has a high degree of miniaturization.
  • the thickness of the resistor according to the invention may be less than 2 mm, 1 mm, 0.5 mm or even 0.3 mm.
  • the length of the resistor according to the invention may be less than 10mm, 5mm, 2mm or even less than 1mm.
  • the breadth of the invention By comparison, the resistance is preferably less than 5 mm, 2 mm or even less than 1 mm.
  • the carrier element preferably has a thickness which lies in the range of 0.05-0.3 mm.
  • solder resist a temperature-resistant insulating layer
  • solder resist is therefore preferably applied to the upper side of the support element and to the lower side of the support element in the resistor according to the invention.
  • connection parts preferably consist of a highly conductive material in order to achieve the lowest possible connection resistance.
  • the carrier element and / or the connecting parts are preferably made of a highly thermally conductive material in order to achieve effective heat removal from the resistance element.
  • the connection parts and / or the support element for this purpose may consist of copper or a copper alloy.
  • the individual connecting parts are preferably cap-shaped and can be U-shaped in cross-section, for example.
  • the U-shaped cross-section surrounds the upper leg of the connection part, the support member above, while the lower leg of the U-shaped connection part engages around the resistance element below.
  • the cap-shaped connecting parts are preferably provided in the closing part that the cap-shaped connecting parts not only surround the support element and / or the resistance element at the top or bottom, but also laterally. This is possible if the cap-shaped connection parts are only applied when the resistors are separated from the use within the scope of the manufacturing method according to the invention, since only then are the lateral cut surfaces of the isolated resistors exposed.
  • an adhesive layer is preferably arranged between the planar resistance element and the flat support element.
  • the adhesive layer fixes the planar resistance element on the underside of the support element.
  • the adhesive layer is electrically insulating and therefore prevents interfering electrical shunts on the metallic support element.
  • the planar resistance element is preferably structured in a medical or other manner (eg by laser processing) so that the resistance element has a simple rectangular or maander-shaped resistance path, as is the case with the known SMD resist described in the introduction - stood the case.
  • the resistor according to the invention advantageously enables low resistance values in the milliohm range, the resistance being less than 500m ⁇ , 200m ⁇ , 50m ⁇ , 30m ⁇ , 20m ⁇ , 10m ⁇ , 5m ⁇ or even less than 1m ⁇ .
  • the resistance element in the case of the resistor according to the invention is preferably complete is electrically insulated to the outside, if one disregards the connection parts.
  • the invention comprises not only the resistor according to the invention described above but also a corresponding manufacturing method in which the connection parts are attached to the resistor in such a way that the connection parts are exposed laterally and are visibly wettable by a solder. to allow a visual inspection of the respective soldering point.
  • the incision in the metallic support element described above can be produced, for example, in the context of the manufacturing method according to the invention, by etching technology or by laser processing.
  • the separation of the resistances by means of sawing, punching or laser cutting can be of use.
  • the invention advantageously allows a longer service life of the saw blade used, since copper is much softer than the anodized aluminum used in the known SMD resistor described above according to FIG.
  • the invention advantageously makes it possible to carry out a resistance compensation on a utility with a plurality of resistors that have not yet been isolated, so that after the separation of the resistors no resistance compensation is required.
  • FIG. 1 shows a perspective view of an SMD resistor according to the invention
  • FIGS. 2A-2G show various stages of manufacture of an SMD resistor according to the invention
  • FIG. 3 shows the production method according to the invention in FIG.
  • FIG. 4 shows the known SMD circuit described above.
  • Figure 5 is a perspective view of the well-known SMD resistor also described above.
  • the cross-sectional view in FIG. 1 shows an SMD resistor 18 according to the invention, which may have, for example, the 0604 design.
  • the SMD resistor 18 may have a thickness in the Y direction of e.g. 0.4mm.
  • the SMD resistor 18 has a plate-shaped carrier element 19 made of copper, wherein on the underside of the carrier element 19 by means of an adhesive layer 20 a resistance Layer 21 of a copper-manganese-nickel alloy (CuMnl2Ni) is glued.
  • the adhesive layer 20 effects a fixation of the resistance layer 21 on the underside of the plate-shaped carrier element 19.
  • the adhesive layer 20 is electrically insulating and therefore insulates the conductive carrier element 19 with respect to the resistance layer 21.
  • the SMD resistor 18 has laterally cap-shaped connection parts 22, 23, wherein the two connection parts 22, 23 surround the support element 19 and the resistance layer 21 at the top, sides and bottom.
  • the two connection parts 22, 23 thus contact the resistance layer 21 electrically, so that in the mounted state a current can flow via the two connection parts 22, 23 and the resistance layer 21.
  • Parts 19.1, 19.2 are electrically isolated from the incision 24 against each other.
  • the adhesive layer 20 between the resistive layer 21 and the plate-shaped support member 19 thus prevents in connection with the incision 24 interfering electrical shunts on the support member 19.
  • the support member 19 thus serves only as a mechanical support and heat dissipation, but not to the power line.
  • solder resist 25 is applied flatly to the upper side of the support element 19 between the two connection parts 22, 23.
  • a solder resist 26 is also flatly applied to the underside of the resistance layer 21 between the two connection parts 22, 23.
  • the resistance layer 21 is thus in the SMD resistor 18 except for the connection parts 22, 23 completely isolated to the outside.
  • FIGS. 2A-2G showing various intermediate stages of the SMD resistor 18 according to the invention.
  • the carrier element 19 is initially provided in the form of a copper foil, as shown in FIG. 2A.
  • the resistance layer 21 is then glued to the underside of the carrier element 19, wherein the bonding takes place by means of the adhesive layer 20, as can be seen from FIG. 2B.
  • Step S3 the incision 24 is then introduced into the carrier element 19, in order later to prevent an electrical shunt via the electrically conductive carrier element 19.
  • the generation of the incision 24 can take place, for example, by medical technology or by laser processing.
  • Step S3 leads to the intermediate stage according to FIG. 2C.
  • step S4 a solder resist is then applied to the upper side of the support element 19, which is known per se.
  • step S5 an etching-technical structuring of the resistance layer 21 takes place, which then subsequently forms a maander-shaped resistance path.
  • step S6 the solder resist 26 is then applied to the underside of the resistive layer 21, as shown in FIG. 2D.
  • a stripe-shaped exposure of the carrier element 19 then takes place at the edges of the SMD resistor 18 which are opposite in the X direction, so that subsequently the connection parts 22, 23 can contact the carrier element 19 thermally.
  • the cross-sectional view m Figure 2E shows this state after the strip-like exposure of the support member.
  • a step S9 the deposition of a copper layer having a thickness of e.g. lO ⁇ m on the exposed edges of the resistive layer 21 at the bottom.
  • SlO then takes place at a benefit with numerous, not yet isolated SMD resistors a resistance balance.
  • the individual SMD resistors 18 are then separated from the use in a step S, which can be done by sawing, punching or laser machining.
  • FIG. 2G shows the SMD resistor 18 according to the invention on a printed circuit board 27 with two standard solder pads 28, 29 and two solder pads 30, 31. From the cross-sectional view it can be seen that the solder pads 30, 31 are located laterally on the PCB SMD resistor 18 are exposed and therefore a visual inspection are accessible.

Abstract

The invention relates to a resistor (18), particularly an SMD resistor, including a planar, metallic support element (19) that has a top surface and a bottom surface, a planar resistor element (21) which is made of a resistive material and is disposed on the bottom surface of the support element (19), and at least two separate metallic connecting parts (23, 23) which electrically contact the resistor element (21) and are arranged in part on the bottom surface of the support element (19). The connecting parts (22, 23) are laterally exposed on the resistor (18) and can be laterally wetted in a visible manner by a solder. The invention further relates to a corresponding production method.

Description

BESCHREIBUNG DESCRIPTION
Widerstand, insbesondere SMD-Widerstand, und zugehörigesResistor, in particular SMD resistor, and associated
Herstellungsverfahrenproduction method
Die Erfindung betrifft einen Widerstand, insbesondere einen SMD-Widerstand, sowie ein entsprechendes Herstellungsverfahren gemäß den nebengeordneten Ansprüchen.The invention relates to a resistor, in particular an SMD resistor, as well as a corresponding manufacturing method according to the independent claims.
Figur 4 zeigt ein Ausfuhrungsbeispiel eines herkömmlichen SMD-Widerstands 1 (SMD: S_urface Mounted Device) , der von der Anmelderin vertrieben wird und in ahnlicher Form beispielsweise in DE 43 39 551 Cl beschrieben ist. Der bekannte SMD- Widerstand 1 weist einen plattenformigen metallischen Trager 2 auf, der beispielsweise aus Kupfer bestehen kann. Auf die Oberseite des Tragers 2 wird bei der Herstellung eine elektrisch isolierende Kleberschicht 3 aufgebracht, mit der dann eine Widerstandsschicht auf die Oberseite des Tragers 2 festgeklebt wird. Anschließend wird die Widerstandsschicht atztechnisch strukturiert, so dass sich an der Oberseite des Tragers 2 eine maanderformig verlaufende Widerstandsbahn 4 bildet. Der Widerstand 1 wird dann oben von einem Schutzlack 5 abgedeckt, der die Widerstandsbahn 4 elektrisch isoliert. Vor der Fertigstellung wird dann in den Trager 2 ein quer verlaufender Einschnitt 6 eingebracht, der den Trager 2 in zwei getrennte Tragerelemente 2.1, 2.2 aufteilt und dadurch einen direkten Stromfluss zwischen den beiden Tragerelementen 2.1, 2.2 verhindert. Die Tragerelemente 2.1, 2.2 bilden hierbei also die elektrischen Anschlussteile des SMD-Widerstands 1, die auf Lotpads 7, 8 aufgelotet werden können, wie in der Zeichnung durch die Pfeile schematisch angedeutet ist.Figure 4 shows an exemplary embodiment of a conventional SMD resistor 1 (SMD: S_urface mounted device), which is sold by the applicant and in similar form, for example, in DE 43 39 551 Cl is described. The known SMD resistor 1 has a plate-shaped metallic carrier 2, which may for example consist of copper. On the upper side of the carrier 2, an electrically insulating adhesive layer 3 is applied in the manufacture, with which then a resistive layer is glued to the top of the carrier 2. Subsequently, the resistance layer is structured by etching, so that forms a maanderformig extending resistance track 4 at the top of the carrier 2. The resistor 1 is then covered at the top by a protective lacquer 5 which electrically insulates the resistance track 4. Before completion, a transversely extending recess 6 is then introduced into the carrier 2, which divides the carrier 2 into two separate carrier elements 2.1, 2.2 and thereby prevents a direct current flow between the two carrier elements 2.1, 2.2. The support elements 2.1, 2.2 in this case thus form the electrical connection parts of the SMD resistor 1, which can be soldered on solder pads 7, 8, as indicated schematically in the drawing by the arrows.
Nachteilig an dem bekannten SMD-Widerstand 1 ist die aufwen- dige elektrische Verbindung der unten liegenden Tragerelemente 2.1, 2.2 mit der oben aufgeklebten Widerstandsschicht, welche die Widerstandsbahn 4 bildet. Hierzu muss zunächst als Vorbereitung einer strombelastbaren, galvanisch aufgebrachten Kontaktierung auf der Außenkante der Kleberschicht 3 eine leitfahige Oberflache erreicht werden (chemische Durchkontak- tierung) , um anschließend in einem mehrstufigen galvanischen Prozess eine Kupferschicht aufzubringen, die den Gesamtstrom sicher leitet. Diese Kontaktierung ist jedoch Teil des Strompfads durch den SMD-Widerstand und beemflusst deshalb eben- falls den Widerstandswert des SMD-Widerstands 1, was bei nie- derohmigen Ausfuhrungen mit einem Widerstandswert von weniger als 25mΩ erfordert, dass der Widerstandsabgleich am vereinzelten SMD-Widerstand 1 erfolgen muss, wohingegen ein Widerstandsabgleich an einem Nutzen mit mehreren Widerstanden hierbei ausgeschlossen ist.A disadvantage of the known SMD resistor 1 is the complicated electrical connection of the underlying support elements 2.1, 2.2 with the above-adhered resistance layer, which forms the resistance track 4. For this purpose, a conductive surface must first be achieved (chemical through-connection) in preparation for a current-carrying, galvanically applied contacting on the outer edge of the adhesive layer 3, in order subsequently to apply a copper layer in a multi-stage galvanic process, which safely conducts the total current. However, this contact is part of the current path through the SMD resistor and therefore also influences the resistance of the SMD resistor 1, which in the case of low-resistance configurations with a resistance value of less than 25 mΩ requires that the resistance compensation be performed on the isolated SMD resistor 1 whereas resistance matching on a multi-resistor benefit is excluded.
Em weiterer Nachteil des bekannten SMD-Widerstands 1 rührt von dem Einschnitt 6 in dem Trager 2 her, da der Einschnitt 6 zur mechanischen Stabilisierung des SMD-Widerstands 1 mit ei- nem Lack oder einem Epoxidharz gefüllt wird, der sich beim Aufloten ausdehnt und zur Verbiegung des SMD-Widerstands 1 fuhrt, wobei die Verbiegung nach der Erstarrung des Lötzinns quasi eingefroren wird und in dem fertigen Bauteil zumindest als optischer Mangel erhalten bleibt. Dieses Problem tritt insbesondere bei einer Verwendung bleifreier Lote auf, die eine höhere Lottemperatur erfordern. Darüber hinaus ist in dem Einschnitt 6 ein bestimmtes Lackvolumen erforderlich, um den SMD-Widerstand 1 trotz des Einschnitts 6 mechanisch zu stabilisieren, was wiederum voraussetzt, dass der Trager 2 relativ dick ist. In der Praxis muss der Trager 2 deshalb eine Dicke von mindestens 0,5mm aufweisen, was der Miniaturisierung des SMD-Widerstands 1 Grenzen setzt. Unabhängig von der Dicke des Tragers 2 ist die mechanische Belastbarkeit des SMD-Widerstands 1 aufgrund der mechanischen Schwächung durch den Einschnitt 6 begrenzt.A further disadvantage of the known SMD resistor 1 is due to the incision 6 in the carrier 2, since the recess 6 for the mechanical stabilization of the SMD resistor 1 is filled with a lacquer or an epoxy resin which expands during the plating and for Bending of the SMD resistor 1 leads, wherein the bending is virtually frozen after the solidification of the solder and is retained in the finished component, at least as an optical defect. This problem occurs especially when using lead-free solders that require a higher soldering temperature. In addition, in the incision 6 a certain paint volume is required to mechanically stabilize the SMD resistor 1 despite the incision 6, which in turn requires that the carrier 2 is relatively thick. In practice, therefore, the carrier 2 must have a thickness of at least 0.5 mm, which limits the miniaturization of the SMD resistor 1. Regardless of the thickness of the carrier 2, the mechanical strength of the SMD resistor 1 due to the mechanical weakening is limited by the incision 6.
Ein weiterer Nachteil des SMD-Widerstands 1 sind die hohen Galvanik-Kosten, die ungefähr 25% der gesamten Fertigungskos- ten ausmachen. Diese hohen Galvanik-Kosten rühren daher, dass die seitlich Umkontaktierung von den beiden Tragerelementen 2.1, 2.2 zu der Widerstandsbahn 4 den vollen Stromfluss übernehmen muss, so dass die Anforderungen an die Dichte und den effektiven Querschnitt der galvanisch aufgebrachten Kup- ferschicht relativ hoch sind. Darüber hinaus ist bei nieder- ohmigen Widerstandswerten der Kupfereinfluss auf die elektrischen Eigenschaften nicht völlig vernachlassigbar .Another disadvantage of the SMD resistor 1 is the high electroplating cost, which accounts for approximately 25% of the total production costs. These high electroplating costs result from the fact that the lateral re-contacting of the two support elements 2.1, 2.2 to the resistance track 4 must take over the full current flow, so that the requirements for the density and the effective cross section of the galvanically applied copper layer are relatively high. In addition, with low-ohmic resistance values, the influence of copper on the electrical properties is not completely negligible.
Schließlich entsprechen die Tragerelemente 2.1, 2.2 als An- Schlussteile nicht den üblichen Standardabmessungen von Lot- pads, sondern weisen eine wesentlich größere Lange auf. Eine Verkürzung der beiden Tragerelemente 2.1, 2.2 und damit eine Verbreiterung des Einschnitts 6 wurde jedoch zu einer weiteren mechanischen und thermischen Schwächung fuhren und ist deshalb nicht möglich.Finally, the support elements 2.1, 2.2 do not correspond to the usual standard dimensions of solder pads as connection parts, but have a much greater length. A shortening of the two support elements 2.1, 2.2 and thus a widening of the incision 6, however, would lead to a further mechanical and thermal weakening and is therefore not possible.
Figur 5 zeigt eine andere Bauweise eines bekannten SMD- Widerstands 9, der von der Anmelderin vertrieben wird, wobei eine ahnliche Bauweise auch in EP 0 929 083 Bl beschrieben ist. Der SMD-Widerstand 9 weist einen plattenformigen dünnen Trager 10 aus Aluminium auf, wobei der Trager 10 bei dieser Bauweise keinen Einschnitt und damit keine mechanische Schwächung aufweist. An der Unterseite des plattenformigen Tragers 10 ist mit einer Kleberschicht 11 eine Widerstandsschicht 12 festgeklebt, die atztechnisch strukturiert ist und eine maan- derformige Widerstandsbahn bildet. An den schmalen Stirnseiten des SMD-Widerstands 9 sind an der Unterseite streifenförmige Kupferkontaktierungen 13 aufgebracht, die streifenformi- ge Anschlussteile 14, 15 elektrisch kontaktieren. Schließlich weist der SMD-Widerstand 9 bei dieser Bauweise an der Oberseite und an der Unterseite eine Schutzlackschicht 16, 17 auf.Figure 5 shows another construction of a known SMD resistor 9 marketed by the Applicant, a similar construction also being described in EP 0 929 083 B1. The SMD resistor 9 has a plate-shaped thin carrier 10 made of aluminum, wherein the carrier 10 in this design has no incision and thus no mechanical weakening. At the bottom of the plate-shaped carrier 10 is an adhesive layer 11, a resistive layer 12th glued, the technically structured and forms a maanderformige resistance path. On the narrow end sides of the SMD resistor 9, strip-shaped copper contacts 13 are applied to the underside, which contact the strip-shaped connecting parts 14, 15 electrically. Finally, the SMD resistor 9 in this construction at the top and at the bottom of a protective lacquer layer 16, 17.
Vorteilhaft an dieser Bauweise des SMD-Widerstands 9 ist zunächst die Tatsache, dass der Trager 10 keine mechanische Schwächung aufweist, so dass die darauf beruhenden und vorstehend beschriebenen Probleme vermieden werden.An advantage of this construction of the SMD resistor 9 is first the fact that the carrier 10 has no mechanical weakening, so that the problems based thereon and described above are avoided.
Nachteilig an dem SMD-Widerstand 9 ist jedoch die Tatsache, dass die Anschlussteile 14, 15 und damit auch die Lotstellen an der Unterseite des SMD-Widerstands 9 liegen, wo die Lotstellen keiner Sichtkontrolle zuganglich sind. Eine seitliche Anbringung der Lotstellen ist jedoch bei dem SMD-Widerstand 9 nicht möglich, da die Lotstellen andernfalls einen unerwünschten elektrischen Nebenschluss über den elektrisch leitenden Trager 10 herstellen wurden.A disadvantage of the SMD resistor 9, however, is the fact that the connection parts 14, 15 and thus also the soldering points lie on the underside of the SMD resistor 9, where the solder points are not accessible to visual inspection. However, lateral attachment of the solder pads is not possible with the SMD resistor 9 because the solder pads would otherwise make an undesirable electrical shunt across the electrically conductive carrier 10.
Ein weiterer Nachteil des SMD-Widerstands 9 besteht darin, dass der Trager 10 aus eloxiertem Aluminium relativ hart ist und deshalb beim Vereinzeln des SMD-Widerstands 9 durch Sagen die Standzeit des verwendeten Sageblatts herabsetzt. Darüber hinaus fuhrt das Absagen der einzelnen SMD-Widerstande 9 von einem Aluminium-Nutzen aufgrund des niedrigen Schmelzpunkts des Aluminiums im Vergleich zu Kupfer zu einem störenden Sagegrat an dem abgesagten SMD-Widerstand 9.Another disadvantage of the SMD resistor 9 is that the carrier 10 made of anodized aluminum is relatively hard and therefore reduces the lifetime of the used Sageblatts when separating the SMD resistor 9 by legends. Moreover, the rejection of the individual SMD resistors 9 from aluminum benefit, due to the low melting point of the aluminum compared to copper, leads to an interfering sawing ridge on the rejected SMD resistor 9.
Schließlich verursacht die Aufbringung des Schutzlacks 6 auf der Oberseite des SMD-Widerstands 9 und die Beschriftung des SMD-Widerstands 9 materialbedingte Produktionsschwierigkei¬ ten.Finally, the application of the protective lacquer 6 on top of the SMD resistor 9 and the lettering of the SMD resistance 9 material- related production difficulties .
Eine andere herkömmliche Bauweise eines SMD-Widerstands weist schließlich einen plattenformigen Keramiktrager auf, der an seiner Oberseite eine strukturierte Widerstandsschicht tragt, wobei die Widerstandsschicht ebenfalls eine maanderformige Widerstandsbahn bildet. Die elektrische Kontaktierung des SMD-Widerstands erfolgt bei dieser Bauweise durch Lotkappen aus einer hochleitfahigen, meist galvanisch verstärkten, lot- fahigen Metallschicht (z.B. Nickel-Chrom-Legierung) , wobei die Lotkappen im Querschnitt U-formig sind und die gegenüberliegenden schmalen Kanten des SMD-Widerstands kappenformig umgreifen. Die Lotkappen sind hierbei seitlich zuganglich, so dass beim Festloten seitlich sichtbare Lotstellen entstehen, die eine einfache Sichtkontrolle der Lotverbindungen ermöglichen .Another conventional construction of an SMD resistor finally has a plate-shaped ceramic carrier, which carries on its upper side a structured resistance layer, wherein the resistance layer also forms a maanderformige resistance path. The electrical contacting of the SMD resistor is carried out in this construction by Lotkappen of a hochleitfahigen, usually galvanically reinforced, solderable metal layer (eg nickel-chromium alloy), the Lotkappen in cross-section are U-shaped and the opposite narrow edges of the SMD Encase resistance-shaped cap. The Lotkappen are hereby accessible laterally, so that when Festloten laterally visible Lotstellen arise that allow easy visual inspection of the solder joints.
Nachteilig an dieser Bauweise ist jedoch die Tatsache, dass der Trager aus Keramik besteht und deshalb im Vergleich zuA disadvantage of this construction, however, is the fact that the carrier is made of ceramic and therefore compared to
Kupfer (vgl. Fig. 4) oder Aluminium (vgl. Fig. 5) eine relativ geringe Wärmeleitfähigkeit und einen geringen, einer normalen Leiterplatte schlecht angepassten Wärmeausdehnungskoeffizient aufweist. Darüber hinaus ist die Widerstandsschicht hierbei auf der Oberseite des Tragers angeordnet, was zu den vorstehend beschriebenen nachteiligen Einflüssen auf den Gesamtwiderstand fuhrt.Copper (see Fig. 4) or aluminum (see Fig. 5) has a relatively low thermal conductivity and a low, a normal PCB poorly matched coefficient of thermal expansion. In addition, the resistance layer is in this case arranged on the upper side of the carrier, which leads to the above-described disadvantageous influences on the total resistance.
Ähnliche Widerstände mit einem nicht-metallischen Tragerele- ment sind beispielsweise aus US 2004/0252009 Al und DE 30 27 122 Al bekannt.Similar resistors with a non-metallic support element are known, for example, from US 2004/0252009 A1 and DE 30 27 122 A1.
Schließlich ist aus DE 196 46 441 Al ein Widerstand bekannt, bei dem jedoch die Anschlussteile ausschließlich an der Un- terseite angebracht sind, so dass keine Sichtkontrolle der Lotverbindung möglich ist.Finally, from DE 196 46 441 Al a resistor is known in which, however, the connecting parts exclusively at the Un-. terseite are attached, so that no visual inspection of the solder joint is possible.
Der Erfindung liegt deshalb, ausgehend von dem bekannten SMD- Widerstand 9 gemäß Figur 5, die Aufgabe zugrunde, die Nachteile des SMD-Widerstands 9 zu beseitigen, indem eine einfache Sichtkontrolle der Lotstellen ermöglicht wird.Therefore, based on the known SMD resistor 9 according to FIG. 5, the object of the invention is to eliminate the disadvantages of the SMD resistor 9 by allowing a simple visual inspection of the solder joints.
Diese Aufgabe wird durch einen erfindungsgemaßen Widerstand bzw. ein erfmdungsgemaßes Herstellungsverfahren gemäß den nebengeordneten Ansprüchen gelost.This object is achieved by a resistor according to the invention or an inventive manufacturing method according to the independent claims.
Die Erfindung umfasst die allgemeine technische Lehre, die Anschlussteile an dem Widerstand seitlich freiliegend anzu- ordnen, so dass die Anschlussteile seitlich sichtbar von einem Lot benetzbar sind, um eine Sichtkontrolle der jeweiligen Lotverbindung zu ermöglichen.The invention comprises the general technical teaching of arranging the connection parts exposed on the resistor laterally, so that the connection parts are visibly wettable laterally by a solder in order to allow a visual inspection of the respective solder connection.
Der erfindungsgemaße Widerstand ist vorzugsweise als SMD- Widerstand ausgebildet und ermöglicht eine herkömmliche Oberflachenmontage. Die Erfindung ist jedoch nicht auf SMD- Widerstande beschrankt, sondern umfasst grundsätzlich auch andere Widertandstypen, die beispielsweise eine herkömmliche Kontaktierung durch Lotpins vorsehen.The inventive resistor is preferably designed as an SMD resistor and allows a conventional surface mounting. However, the invention is not limited to SMD resistors, but basically also includes other types of Widertand, for example, provide a conventional contact with solder pins.
Weiterhin weist der erfindungsgemaße Widerstand ein flachiges, metallisches Tragerelement auf, das aufgrund seiner metallischen Mateπalzusammensetzung eine gute Wärmeleitfähigkeit und einen angepassten Wärmeausdehnungskoeffizienten auf- weist, was im Betrieb des erfindungsgemaßen Widerstands vorteilhaft ist.Furthermore, the resistor according to the invention has a flat, metallic support element, which has good thermal conductivity and an adapted coefficient of thermal expansion due to its metallic material composition, which is advantageous during operation of the resistor according to the invention.
Darüber hinaus weist der erfindungsgemaße Widerstand ein flachiges Widerstandselement aus einem Widerstandsmaterial auf, wobei das Widerstandselement auf der Unterseite des flachigen Tragerelements angeordnet ist.Moreover, the resistor according to the invention has a flat resistance element made of a resistance material, wherein the resistance element is arranged on the underside of the flat carrier element.
Der im Rahmen der Erfindung verwendete Begriff eines flachi- gen Widerstandselements bzw. Tragerelements ist allgemein zu verstehen und nicht auf die mathematisch-geometrische Definition einer Flache beschrankt. Vorzugsweise stellt dieses Merkmal jedoch darauf ab, dass die seitliche Ausdehnung des Tragerelements bzw. des Widerstandselements wesentlich großer ist als die Dicke des Tragerelements bzw. Widerstandselements. Darüber hinaus umfasst dieses Merkmal vorzugsweise auch, dass die Oberseite und die Unterseite des Tragerelements bzw. Widerstandselements jeweils parallel zueinander verlaufen. Ferner sind das Tragerelement und das Widerstands- element vorzugsweise eben, jedoch sind auch gekrümmte und gebogene Formgebungen für das Tragerelement und das Widerstandselement möglich.The term used in the context of the invention of a flat resistance element or carrier element is to be understood generally and is not limited to the mathematical-geometric definition of a surface. However, this feature is preferably based on the fact that the lateral extent of the carrier element or of the resistance element is substantially greater than the thickness of the carrier element or resistance element. In addition, this feature preferably also includes that the top side and the bottom side of the carrier element or resistance element each extend parallel to one another. Furthermore, the support element and the resistance element are preferably flat, but also curved and curved shapes are possible for the support element and the resistance element.
Darüber hinaus weist der erfindungsgemaße Widerstand mindes- tens zwei getrennte metallische Anschlussteile auf, die das Widerstandselement elektrisch kontaktieren und teilweise an der Unterseite des Tragerelements angeordnet sind. Im Gegensatz zu dem eingangs beschriebenen bekannten SMD-Widerstand gemäß Figur 5 sind die Anschlussteile jedoch nicht vollstan- dig an der Unterseite angeordnet, sondern liegen zumindest teilweise seitlich an dem Widerstand frei, so dass sich beim Festloten seitlich sichtbare Lotstellen bilden, die eine einfache Sichtkontrolle ermöglichen.In addition, the resistor according to the invention has at least two separate metallic connection parts, which electrically contact the resistance element and are partially arranged on the underside of the support element. In contrast to the known SMD resistor according to Figure 5 described above, however, the connection parts are not completely arranged at the bottom, but are at least partially laterally free of the resistor, so that form the solid solders laterally visible Lotstellen that a simple visual inspection enable.
Vorzugsweise reichen die metallischen Anschlussteile jeweils seitlich an dem Widerstand nach oben bis zu dem metallischen Tragerelement, wo die Anschlussteile das Tragerelement berühren und elektrisch und thermisch kontaktieren. Beispielsweise können die Anschlussteile jeweils einen U-formigen Quer- schnitt aufweisen und den Widerstand an gegenüberliegenden Kanten jeweils kappenformig umgreifen, wobei auch eine seitliche Metallisierung im Kontaktbereich möglich ist.The metallic connecting parts preferably each extend laterally upwards on the resistor up to the metallic carrier element, where the connecting parts contact the carrier element and make electrical and thermal contact. For example, the connecting parts can each have a U-shaped transverse have cut and embrace the resistor at opposite edges each kappenformig, with a lateral metallization in the contact area is possible.
Das metallische Tragerelement hat jedoch bei dem erfindungs- gemaßen Widerstand nur die Funktion eines Tragers und eines Wärmeleiters, wohingegen das Tragerelement bei dem erfin- dungsgemaßen Widerstands kein Stromleiter sein soll, um einen unerwünschten Nebenschluss über das metallische Tragerelement zu vermeiden. Vorzugsweise weist das metallische Tragerele¬ ment deshalb bei dem erfindungsgemaßen Widerstand einen Einschnitt auf, der das Tragerelement in mindestens zwei elektrisch voneinander isolierte Teile aufteilt und einen Strom- fluss über das Tragerelement zwischen den beiden Anschluss- teilen verhindert. In der einfachsten Form kann der Einschnitt in der gleichen Weise ausgebildet sein wie bei dem bekannten SMD-Widerstand gemäß Figur 4, bei dem die Widerstandsschicht jedoch an der Oberseite des Tragers angeordnet ist. Vorzugsweise verlauft der Einschnitt in dem Tragerele- ment jedoch mindestens teilweise schräg, beispielsweise V- formig, W-formig oder maanderformig. Eine derartige Formgebung des Einschnitts in dem Tragerelement fuhrt vorteilhaft zu einer größeren mechanischen Stabilität des Widerstands als bei einem guer verlaufenden Einschnitt.However, in the case of the resistor according to the invention, the metallic carrier element has only the function of a carrier and a heat conductor, whereas in the case of the inventive resistor the carrier element should not be a current conductor in order to avoid an undesired shunt across the metallic carrier element. Preferably, the metallic element Tragerele ¬ Therefore, in the inventive resistor an incision, which divides the support element into at least two electrically isolated portions and a current flow via the support element between the two connecting parts is prevented. In the simplest form, the recess may be formed in the same manner as in the known SMD resistor according to Figure 4, in which the resistance layer is arranged at the top of the carrier. Preferably, however, the incision in the support element runs at least partially obliquely, for example V-shaped, W-shaped or maander-shaped. Such a shaping of the incision in the support element advantageously leads to a greater mechanical stability of the resistance than in the case of a running incision.
Weiterhin sind die Anschlussteile bei dem erfindungsgemaßen Widerstands vorzugsweise in ihrer Große an Standard-Lotpads angepasst, wodurch sich der erfindungsgemaße Widerstand von dem bekannten SMD-Widerstand gemäß Figur 4 unterscheidet, bei dem die Anschlussteile eine wesentlich größere seitliche Ausdehnung aufweisen. Bei dem erfindungsgemaßen Widerstand weisen die Anschlussteile deshalb vorzugsweise eine seitliche Ausdehnung auf, die kleiner ist als 30%, 20% oder 15% des Abstands zwischen den beiden Anschlussteilen . Bei einer extre- men Miniaturisierung des erfindungsgemaßen Widerstands fuhrt eine relative Bemessung der Anschlussteile relativ zu dem Abstand zwischen den Anschlussteilen dagegen zu übermäßig klei¬ nen Anschlussteilen. Als Maximalwerte für die seitliche Aus- dehnung der Anschlussteile können dann Grenzwerte von 1mm,Furthermore, in the case of the resistor according to the invention, the connection parts are preferably matched in their size to standard solder pads, as a result of which the resistor according to the invention differs from the known SMD resistor according to FIG. 4, in which the connection parts have a substantially greater lateral extent. In the case of the resistor according to the invention, the connecting parts therefore preferably have a lateral extent which is less than 30%, 20% or 15% of the distance between the two connecting parts. In an extreme men miniaturization of the inventive resistor leads a relative dimensioning of the connecting parts relative to the distance between the connection parts on the other hand excessively klei ¬ NEN connection parts. As maximum values for the lateral expansion of the connection parts, limit values of 1mm,
0,5mm oder 0,1mm vorgegeben werden. Beispielsweise können die streifenförmigen Anschlussteile eine Breite im Bereich von 0,1-0, 3mm (Bauform 0402), 0,15-0, 40mm (Bauform 0603), 0,25- 0,75mm (Bauform 1206) oder 0,35-0, 85mm (Bauform 2512) aufwei- sen.0.5mm or 0.1mm. For example, the strip-shaped connection parts can have a width in the range of 0.1-0, 3 mm (design 0402), 0.15-0, 40 mm (design 0603), 0.25-0.75 mm (design 1206) or 0.35- 0.85 mm (type 2512).
Vorzugsweise besteht das Widerstandsmaterial des erfindungs- gemaßen Widerstands aus einer Kupfer-Mangan-Legierung, wie beispielsweise einer Kupfer-Mangan-Nickel-Legierung. Bei- spielsweise können die Legierungen CuMnl2Ni, CuMn7Sn oderThe resistance material of the resistor according to the invention preferably consists of a copper-manganese alloy, such as, for example, a copper-manganese-nickel alloy. For example, the alloys CuMnl2Ni, CuMn7Sn or
CuMn3 als Widerstandsmaterial eingesetzt werden. Alternativ besteht im Rahmen der Erfindung die Möglichkeit, dass als Wi¬ derstandsmaterial eine Nickel-Chrom-Legierung, insbesondere eine Nickel-Chrom-Aluminium-Legierung eingesetzt wird. Bei- spiele derartiger möglicher Legierungen sind NiCr20AlSilMnFe, NiCr6015, NiCr8020 und NiCr3020. Darüber hinaus kann das Widerstandselement auch aus einer Kupfer-Nickel-Legierung, wie beispielsweise CuNil5 oder CuNiIO, bestehen. Die Erfindung ist jedoch hinsichtlich der einsetzbaren Widerstandsmateria- lien nicht auf die vorstehend genannten Beispiele beschrankt, sondern grundsatzlich auch mit anderen Widerstandsmaterialien realisierbar .CuMn3 be used as a resistor material. Alternatively, it is within the scope of the invention is the possibility that is used as Wi ¬ derstandsmaterial a nickel-chromium alloy, in particular a nickel-chromium-aluminum alloy. Examples of such possible alloys are NiCr20AlSilMnFe, NiCr6015, NiCr8020 and NiCr3020. In addition, the resistance element may also consist of a copper-nickel alloy, such as CuNil5 or CuNiIO. However, the invention is not limited to the abovementioned examples with regard to the resistance materials which can be used, but in principle can also be implemented with other resistance materials.
Ferner ist zu erwähnen, dass der erfmdungsgemaße Widerstand vorzugsweise einen hohen Miniaturisierungsgrad aufweist. Beispielsweise kann die Dicke des erfindungsgemaßen Widerstands kleiner als 2mm, 1mm, 0,5mm oder sogar 0,3mm sein. Die Lange des erfindungsgemaßen Widerstands kann kleiner als 10mm, 5mm, 2mm oder sogar kleiner als lmm sein. Die Breite des erfin- dungsgemaßen Widerstands ist dagegen vorzugsweise kleiner als 5mm, 2mm oder sogar kleiner als 1mm.It should also be mentioned that the resistor according to the invention preferably has a high degree of miniaturization. For example, the thickness of the resistor according to the invention may be less than 2 mm, 1 mm, 0.5 mm or even 0.3 mm. The length of the resistor according to the invention may be less than 10mm, 5mm, 2mm or even less than 1mm. The breadth of the invention By comparison, the resistance is preferably less than 5 mm, 2 mm or even less than 1 mm.
Entsprechend weist das Tragerelement bei dem erfindungsgema- ßen Widerstand vorzugsweise eine Dicke auf, die im Bereich von 0,05-0, 3mm liegt.Accordingly, in the case of the resistor according to the invention, the carrier element preferably has a thickness which lies in the range of 0.05-0.3 mm.
Weiterhin ist zu erwähnen, dass der Widerstand an seiner Außenseite vorzugsweise mit einer temperaturbeständigen Isola- tionsschicht (im Folgenden allgemein als Lotstopplack bezeichnet) beschichtet ist, was von herkömmlichen SMD- Widerstanden bekannt ist. Der Lotstopplack ist deshalb bei dem erfindungsgemaßen Widerstand vorzugsweise auf die Oberseite des Tragerelements und auf die Unterseite des Wider- Standselements aufgebracht.It should also be mentioned that the resistor on its outer side is preferably coated with a temperature-resistant insulating layer (hereinafter generally referred to as solder resist), which is known from conventional SMD resistors. The solder resist is therefore preferably applied to the upper side of the support element and to the lower side of the support element in the resistor according to the invention.
Darüber hinaus ist zu erwähnen, dass die Anschlussteile vorzugsweise aus einem hochleitfahigen Material bestehen, um einen möglichst geringen Anschlusswiderstand zu erreichen. Dar- über hinaus bestehen das Tragerelement und/oder die Anschlussteile bei dem erfindungsgemaßen Widerstand vorzugsweise aus einem thermisch hochleitfahigen Material, um eine effektive Warmeabfuhr von dem Widerstandselement zu erreichen. Beispielsweise können die Anschlussteile und/oder das Trager- element hierzu aus Kupfer oder einer Kupferlegierung bestehen.In addition, it should be mentioned that the connection parts preferably consist of a highly conductive material in order to achieve the lowest possible connection resistance. Moreover, in the case of the resistor according to the invention, the carrier element and / or the connecting parts are preferably made of a highly thermally conductive material in order to achieve effective heat removal from the resistance element. For example, the connection parts and / or the support element for this purpose may consist of copper or a copper alloy.
Die einzelnen Anschlussteile sind vorzugsweise kappenformig und können im Querschnitt beispielsweise U-formig sein. Bei einem derartigen kappenformigen Anschlussteil mit einemThe individual connecting parts are preferably cap-shaped and can be U-shaped in cross-section, for example. In such a cap-shaped connection part with a
U-formigen Querschnitt umgreift der obere Schenkel des Anschlussteils das Tragerelement oben, wahrend der untere Schenkel des U-formigen Anschlussteils das Widerstandselement unten umgreift. Bei einem derartigen kappenformigen An- schlussteil ist vorzugsweise vorgesehen, dass die kappenfor- migen Anschlussteile das Tragerelement und/oder das Widerstandselement nicht nur oben bzw. unten umgreifen, sondern auch seitlich. Dies ist möglich, wenn die kappenformigen An- schlussteile erst dann aufgebracht werden, wenn die Widerstände im Rahmen des erfmdungsgemaßen Herstellungsverfahrens von dem Nutzen abgetrennt sind, da erst dann die seitlichen Schnittflachen der vereinzelten Widerstände frei liegen.U-shaped cross-section surrounds the upper leg of the connection part, the support member above, while the lower leg of the U-shaped connection part engages around the resistance element below. In such a cap-shaped It is preferably provided in the closing part that the cap-shaped connecting parts not only surround the support element and / or the resistance element at the top or bottom, but also laterally. This is possible if the cap-shaped connection parts are only applied when the resistors are separated from the use within the scope of the manufacturing method according to the invention, since only then are the lateral cut surfaces of the isolated resistors exposed.
Ferner ist zu erwähnen, dass auch bei dem erfindungsgemaßen Widerstand vorzugsweise eine Kleberschicht zwischen dem flächigen Widerstandselement und dem flachigen Tragerelement angeordnet ist. Zum einen fixiert die Kleberschicht das flächige Widerstandselement an der Unterseite des Tragerelements. Zum anderen ist die Kleberschicht elektrisch isolierend und verhindert deshalb störende elektrische Nebenschlüsse über das metallische Tragerelement.It should also be mentioned that, even in the case of the resistor according to the invention, an adhesive layer is preferably arranged between the planar resistance element and the flat support element. On the one hand, the adhesive layer fixes the planar resistance element on the underside of the support element. On the other hand, the adhesive layer is electrically insulating and therefore prevents interfering electrical shunts on the metallic support element.
Weiterhin ist das flächige Widerstandselement bei dem erfin- dungsgemaßen Widerstand vorzugsweise atztechnisch oder in sonstiger Weise (z.B. durch Laser-Bearbeitung) strukturiert, so dass das Widerstandselement eine einfache rechteckige oder maanderformig verlaufende Widerstandsbahn aufweist, wie es auch bei den eingangs beschriebenen bekannten SMD-Wider- standen der Fall ist.Furthermore, in the case of the resistor according to the invention, the planar resistance element is preferably structured in a medical or other manner (eg by laser processing) so that the resistance element has a simple rectangular or maander-shaped resistance path, as is the case with the known SMD resist described in the introduction - stood the case.
Der erfindungsgemaße Widerstand ermöglicht vorteilhaft niedrige Widerstandswerte im Milliohmbereich, wobei der Widerstand kleiner als 500mΩ, 200mΩ, 50mΩ, 30mΩ, 20mΩ, lOmΩ, 5mΩ oder sogar kleiner als lmΩ sein kann.The resistor according to the invention advantageously enables low resistance values in the milliohm range, the resistance being less than 500mΩ, 200mΩ, 50mΩ, 30mΩ, 20mΩ, 10mΩ, 5mΩ or even less than 1mΩ.
Weiterhin ist zu erwähnen, dass das Widerstandselement bei dem erfindungsgemaßen Widerstand vorzugsweise vollständig nach außen elektrisch isoliert ist, sofern man von den Anschlussteilen absieht.It should also be mentioned that the resistance element in the case of the resistor according to the invention is preferably complete is electrically insulated to the outside, if one disregards the connection parts.
Die Erfindung umfasst jedoch nicht nur den vorstehend be- schπebenen erfindungsgemaßen Widerstand, sondern auch ein entsprechendes Herstellungsverfahren, bei dem die Anschluss- teile an dem Widerstand so angebracht werden, dass die An- schlussteile seitlich frei liegen und seitlich sichtbar von einem Lot benetzbar sind, um eine Sichtkontrolle der jeweili- gen Lotstelle zu ermöglichen.However, the invention comprises not only the resistor according to the invention described above but also a corresponding manufacturing method in which the connection parts are attached to the resistor in such a way that the connection parts are exposed laterally and are visibly wettable by a solder. to allow a visual inspection of the respective soldering point.
Der vorstehend beschriebene Einschnitt in dem metallischen Tragerelement kann im Rahmen des erfindungsgemaßen Herstellungsverfahren beispielsweise atztechnisch oder durch eine Laserbearbeitung hergestellt werden.The incision in the metallic support element described above can be produced, for example, in the context of the manufacturing method according to the invention, by etching technology or by laser processing.
Das gleiche gilt für die Strukturierung des Widerstandselements zur Ausbildung der maanderformigen Widerstandsbahn, die ebenfalls atztechnisch oder durch Laserbearbeitung erfolgen kann.The same applies to the structuring of the resistance element to form the maanderformigen resistance path, which can also be done technically or by laser machining.
Weiterhin ist zu dem erfindungsgemaßen Herstellungsverfahren zu erwähnen, dass die Vereinzelung der Widerstände durch Sagen, Stanzen oder durch Laserschneiden von einem Nutzen ver- folgen kann. Bei einer Fertigung des Tragerelements aus Kupfer ermöglicht die Erfindung vorteilhaft eine längere Standzeit des verwendeten Sageblattes, da Kupfer wesentlich weicher ist als das bei dem eingangs beschriebenen bekannten SMD-Widerstand gemäß Figur 5 verwendete eloxierte Aluminium.Furthermore, it should be mentioned with regard to the production method according to the invention that the separation of the resistances by means of sawing, punching or laser cutting can be of use. In a production of the carrier element made of copper, the invention advantageously allows a longer service life of the saw blade used, since copper is much softer than the anodized aluminum used in the known SMD resistor described above according to FIG.
Darüber hinaus ermöglicht die Erfindung vorteilhaft die Durchfuhrung eines Widerstandsabgleichs an einem Nutzen mit mehreren, noch nicht vereinzelten Widerstanden, so dass nach der Vereinzelung der Widerstände kein Widerstandsabgleich mehr erforderlich ist.In addition, the invention advantageously makes it possible to carry out a resistance compensation on a utility with a plurality of resistors that have not yet been isolated, so that after the separation of the resistors no resistance compensation is required.
Andere vorteilhafte Weiterbildungen der Erfindung sind in den Unteransprüchen gekennzeichnet oder werden nachstehend zusammen mit der Beschreibung der bevorzugten Ausführungsbeispiele der Erfindung anhand der Figuren näher erläutert. Es zeigen:Other advantageous developments of the invention are characterized in the subclaims or are explained in more detail below together with the description of the preferred embodiments of the invention with reference to FIGS. Show it:
Figur 1 eine Perspektivansicht eines erfindungsgemäßen SMD-Widerstands,FIG. 1 shows a perspective view of an SMD resistor according to the invention,
Figuren 2A-2G verschiedene Fertigungsstadien eines erfindungsgemäßen SMD-Widerstands,FIGS. 2A-2G show various stages of manufacture of an SMD resistor according to the invention,
Figur 3 das erfindungsgemäße Herstellungsverfahren inFIG. 3 shows the production method according to the invention in FIG
Form eines Flussdiagramms,Shape of a flowchart,
Figur 4 den eingangs beschriebenen bekannten SMD-FIG. 4 shows the known SMD circuit described above.
Widerstand in einer Perspektivansicht, sowieResistance in a perspective view, as well
Figur 5 eine Perspektivansicht des ebenfalls eingangs beschriebenen bekannten SMD-Widerstands.Figure 5 is a perspective view of the well-known SMD resistor also described above.
Die Querschnittsansicht in Figur 1 zeigt einen erfindungsge- mäßen SMD-Widerstand 18, der beispielsweise die Bauform 0604 haben kann. Dies bedeutet, dass der SMD-Widerstand 18 in X-Richtung eine Länge von 0,06 Zoll (1,524mm) und eine Breite in Z-Richtung von 0,04 Zoll (1,016mm) hat. Weiterhin kann der SMD-Widerstand 18 eine Dicke in Y-Richtung von z.B. 0,4mm ha- ben.The cross-sectional view in FIG. 1 shows an SMD resistor 18 according to the invention, which may have, for example, the 0604 design. This means that the SMD resistor 18 in the X direction has a length of 0.06 inches (1.524 mm) and a width in the Z direction of 0.04 inches (1.016 mm). Furthermore, the SMD resistor 18 may have a thickness in the Y direction of e.g. 0.4mm.
Der SMD-Widerstand 18 weist ein plattenförmiges Trägerelement 19 aus Kupfer auf, wobei an der Unterseite des Trägerelements 19 mittels einer Kleberschicht 20 eine Widerstands- Schicht 21 aus einer Kupfer-Mangan-Nickel-Legierung (CuMnl2Ni) festgeklebt ist. Zum einen bewirkt die Kleberschicht 20 eine Fixierung der Widerstandsschicht 21 an der Unterseite des plattenformigen Tragerelements 19. Zum anderen ist die Kleberschicht 20 elektrisch isolierend und isoliert deshalb das leitfahige Tragerelement 19 gegenüber der Widerstandsschicht 21.The SMD resistor 18 has a plate-shaped carrier element 19 made of copper, wherein on the underside of the carrier element 19 by means of an adhesive layer 20 a resistance Layer 21 of a copper-manganese-nickel alloy (CuMnl2Ni) is glued. On the one hand, the adhesive layer 20 effects a fixation of the resistance layer 21 on the underside of the plate-shaped carrier element 19. On the other hand, the adhesive layer 20 is electrically insulating and therefore insulates the conductive carrier element 19 with respect to the resistance layer 21.
Weiterhin weist der SMD-Widerstand 18 seitlich jeweils kap- penformige Anschlussteile 22, 23 auf, wobei die beiden Anschlussteile 22, 23 das Tragerelement 19 und die Widerstandsschicht 21 oben, seitlich und unten umgreifen. Die beiden Anschlussteile 22, 23 kontaktieren also die Widerstandsschicht 21 elektrisch, so dass im montierten Zustand ein Strom über die beiden Anschlussteile 22, 23 und die Widerstandsschicht 21 fließen kann.Furthermore, the SMD resistor 18 has laterally cap-shaped connection parts 22, 23, wherein the two connection parts 22, 23 surround the support element 19 and the resistance layer 21 at the top, sides and bottom. The two connection parts 22, 23 thus contact the resistance layer 21 electrically, so that in the mounted state a current can flow via the two connection parts 22, 23 and the resistance layer 21.
In dem plattenformigen Tragerelement 19 befindet sich ein im wesentlichen V-formiger Einschnitt 24, der das Tragerele- ment 19 in zwei Teile 19.1, 19.2 aufteilt, wobei die beidenIn the plate-shaped carrier element 19 there is a substantially V-shaped cut 24 which divides the carrier element 19 into two parts 19.1, 19.2, the two being
Teile 19.1, 19.2 von dem Einschnitt 24 elektrisch gegeneinander isoliert werden. Die Kleberschicht 20 zwischen der Widerstandsschicht 21 und dem plattenformigen Tragerelement 19 verhindert also in Verbindung mit dem Einschnitt 24 störende elektrische Nebenschlüsse über das Tragerelement 19. Das Tragerelement 19 dient hierbei also lediglich als mechanischer Trager und zur Wärmeableitung, aber nicht zur Stromleitung.Parts 19.1, 19.2 are electrically isolated from the incision 24 against each other. The adhesive layer 20 between the resistive layer 21 and the plate-shaped support member 19 thus prevents in connection with the incision 24 interfering electrical shunts on the support member 19. The support member 19 thus serves only as a mechanical support and heat dissipation, but not to the power line.
Schließlich ist noch zu erwähnen, dass auf die Oberseite des Tragerelements 19 zwischen den beiden Anschlussteilen 22, 23 flachig ein Lotstopplack 25 aufgetragen ist. Darüber hinaus ist auch auf die Unterseite der Widerstandsschicht 21 zwischen den beiden Anschlussteilen 22, 23 flachig ein Lotstopplack 26 aufgetragen. Die Widerstandsschicht 21 ist also in dem SMD-Widerstand 18 bis auf die Anschlussteile 22, 23 voll- standig nach außen isoliert.Finally, it should be mentioned that a solder resist 25 is applied flatly to the upper side of the support element 19 between the two connection parts 22, 23. In addition, a solder resist 26 is also flatly applied to the underside of the resistance layer 21 between the two connection parts 22, 23. The resistance layer 21 is thus in the SMD resistor 18 except for the connection parts 22, 23 completely isolated to the outside.
Im Folgenden wird nun anhand der Figuren 2A-2G und anhand des Flussdiagramms gemäß Figur 3 das erfindungsgemaße Herstellungsverfahren beschrieben, wobei die Figuren 2A-2G verschiedene Zwischenstadien des erfindungsgemaßen SMD-Widerstands 18 zeigen.The production method according to the invention will now be described below with reference to FIGS. 2A-2G and with reference to the flowchart according to FIG. 3, FIGS. 2A-2G showing various intermediate stages of the SMD resistor 18 according to the invention.
In einem ersten Schritt Sl des erfindungsgemaßen Herstellungsverfahren wird zunächst das Tragerelement 19 in Form einer Kupfer-Folie bereitgestellt, wie in Figur 2A dargestellt ist.In a first step S1 of the production method according to the invention, the carrier element 19 is initially provided in the form of a copper foil, as shown in FIG. 2A.
In einem weiteren Schritt S2 wird dann auf die Unterseite des Tragerelements 19 die Widerstandsschicht 21 aufgeklebt, wobei die Verklebung mittels der Kleberschicht 20 erfolgt, wie aus Figur 2B ersichtlich ist.In a further step S2, the resistance layer 21 is then glued to the underside of the carrier element 19, wherein the bonding takes place by means of the adhesive layer 20, as can be seen from FIG. 2B.
Im nächsten Schritt S3 wird dann der Einschnitt 24 in das Tragerelement 19 eingebracht, um spater einen elektrischen Nebenschluss über das elektrisch leitfahige Tragerelement 19 zu verhindern. Die Erzeugung des Einschnitts 24 kann beispielsweise atztechnisch oder durch eine Laserbearbeitung er- folgen. Der Schritt S3 fuhrt zu dem Zwischenstadium gemäß Figur 2C.In the next step S3, the incision 24 is then introduced into the carrier element 19, in order later to prevent an electrical shunt via the electrically conductive carrier element 19. The generation of the incision 24 can take place, for example, by medical technology or by laser processing. Step S3 leads to the intermediate stage according to FIG. 2C.
In dem Schritt S4 wird dann auf die Oberseite des Tragerelements 19 ein Lotstopplack aufgebracht, was an sich bekannt ist.In step S4, a solder resist is then applied to the upper side of the support element 19, which is known per se.
In einem weiteren Schritt S5 erfolgt dann eine atztechnische Strukturierung der Widerstandsschicht 21, die dann anschließend eine maanderformige Widerstandsbahn bildet. In dem Schritt S6 wird dann der Lotstopplack 26 auf die Unterseite der Widerstandsschicht 21 aufgebracht, wie aus Figur 2D ersichtlich ist.In a further step S5, an etching-technical structuring of the resistance layer 21 takes place, which then subsequently forms a maander-shaped resistance path. In the step S6, the solder resist 26 is then applied to the underside of the resistive layer 21, as shown in FIG. 2D.
In den nächsten Schritten S7 und S8 erfolgt dann eine streifenförmige Freilegung des Tragerelements 19 an den in X- Richtung gegenüberliegenden Kanten des SMD-Widerstands 18, damit anschließend die Anschlussteile 22, 23 das Tragerele- ment 19 thermisch kontaktieren können. Die Querschnittsansicht m Figur 2E zeigt diesen Zustand nach der streifenförmigen Freilegung des Tragerelements.In the next steps S7 and S8, a stripe-shaped exposure of the carrier element 19 then takes place at the edges of the SMD resistor 18 which are opposite in the X direction, so that subsequently the connection parts 22, 23 can contact the carrier element 19 thermally. The cross-sectional view m Figure 2E shows this state after the strip-like exposure of the support member.
Anschließend erfolgt dann in einem Schritt S9 die Aufbringung einer Kupferschicht mit einer Dicke von z.B. lOμm auf die freiliegenden Kanten der Widerstandsschicht 21 an deren Unterseite .Then, in a step S9, the deposition of a copper layer having a thickness of e.g. lOμm on the exposed edges of the resistive layer 21 at the bottom.
Im nächsten Schritt SlO erfolgt dann an einem Nutzen mit zahlreichen, noch nicht vereinzelten SMD-Widerstanden ein Widerstandsabgleich .In the next step, SlO then takes place at a benefit with numerous, not yet isolated SMD resistors a resistance balance.
Nach dem Widerstandsabgleich werden dann von dem Nutzen in einem Schritt Sil die einzelnen SMD-Widerstande 18 abge- trennt, was durch Zersägen, Stanzen oder durch Laserbearbeitung erfolgen kann.After the resistance compensation, the individual SMD resistors 18 are then separated from the use in a step S, which can be done by sawing, punching or laser machining.
In einem letzten Schritt S12 werden dann die Anschlussteile 22, 23 als Lotkappen auf die freigelegten Kanten aufge- bracht. Diese Aufbringung der Anschlussteile 22, 23 nach der Vereinzelung des SMD-Widerstands 18 ermöglicht es, dass die Anschlussteile 22, 23 das Tragerelement 19 auch seitlich an den Schnittflachen umgreifen, wie aus der Perspektivansicht in Figur 1 ersichtlich ist. Figur 2G zeigt schließlich den erfindungsgemaßen SMD-Wider- stand 18 auf einer Leiterplatte 27 mit zwei Standard-Lot- pads 28, 29 und zwei Lotstellen 30, 31. Aus der Querschnitts- ansieht ist ersichtlich, dass die Lotstellen 30, 31 seitlich an dem SMD-Widerstand 18 frei liegen und deshalb einer Sichtkontrolle zugänglich sind.In a last step S12, the connecting parts 22, 23 are then applied as solder caps to the exposed edges. This application of the connection parts 22, 23 after the separation of the SMD resistor 18 makes it possible for the connection parts 22, 23 to also laterally surround the support element 19 on the cut surfaces, as can be seen from the perspective view in FIG. Finally, FIG. 2G shows the SMD resistor 18 according to the invention on a printed circuit board 27 with two standard solder pads 28, 29 and two solder pads 30, 31. From the cross-sectional view it can be seen that the solder pads 30, 31 are located laterally on the PCB SMD resistor 18 are exposed and therefore a visual inspection are accessible.
Die Erfindung ist nicht auf die vorstehend beschriebenen be- vorzugten Ausfuhrungsbeispiele beschrankt. Vielmehr ist eine Vielzahl von Varianten und Abwandlungen möglich, die ebenfalls von dem Erfindungsgedanken Gebrauch machen und deshalb in den Schutzbereich fallen. The invention is not limited to the preferred exemplary embodiments described above. Rather, a variety of variants and modifications is possible, which also make use of the inventive idea and therefore fall within the scope.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
1 SMD-Widerstand1 SMD resistor
2 Trager2 carriers
2. 1, 2.2 Tragerelemente2. 1, 2.2 carrier elements
3 Kleberschicht3 adhesive layer
4 Widerstandsbahn4 resistance track
5 Schutzlack5 protective paint
6 Einschnitt6 incision
7 Lotpad7 lot pad
8 Lotpad8 lot pad
9 SMD-Widerstand9 SMD resistor
10 Trager10 carriers
11 Kleberschicht11 adhesive layer
12 Widerstandsschicht12 resistance layer
13 Kupferkontaktierungen13 copper contacts
14 , 15 Anschlussteile14, 15 connection parts
16 , 11 Schutzlackschicht16, 11 protective lacquer layer
18 SMD-Widerstand18 SMD resistor
19 Tragerelement19 carrier element
19 .1, 19.2 Teile19 .1, 19.2 parts
20 Kleberschicht20 adhesive layer
21 WiderStandsSchicht21 Resistance layer
22 , 23 AnSchlussteile22, 23 Connection parts
24 Einschnitt24 incision
25 , 26 Lotstopplack25, 26 Lotstopplack
27 Leiterplatte27 circuit board
28 , 29 Standard-Lotpads28, 29 standard solder pads
30 . 31 Lotstellen 30. 31 plumb bobs

Claims

ANSPRUCHE
1. Widerstand (18), insbesondere SMD-Widerstand, mit a) einem flächigen, metallischen Trägerelement (19) mit einer Oberseite und einer Unterseite, b) einem flachigen Widerstandselement (21) aus einem Widerstandsmaterial, wobei das Widerstandselement (21) auf der Unterseite des Trägerelements (19) angeordnet ist, c) mindestens zwei getrennten metallischen Anschlussteilen1. resistor (18), in particular SMD resistor, with a) a flat, metallic support member (19) having a top and a bottom, b) a flat resistance element (21) made of a resistance material, wherein the resistance element (21) on the Bottom of the support member (19) is arranged, c) at least two separate metal connection parts
(22, 23), die das Widerstandselement (21) elektrisch kontaktieren und teilweise an der Unterseite des Trä- gerelements (19) angeordnet sind, dadurch gekennzeichnet:, dass e) die Anschlussteile (22, 23) an dem Widerstand (18) seitlich frei liegen und seitlich sichtbar von einem Lot benetzbar sind.(22, 23), which electrically contact the resistance element (21) and are partially arranged on the underside of the carrier element (19), characterized in that e) the connection parts (22, 23) on the resistor (18) laterally lie freely and are visibly wetted sideways by a solder.
2. Widerstand (18) nach Anspruch 1, dadurch gekennzeichnet, dass die metallischen Anschlussteile (22, 23) jeweils seitlich an dem Widerstand (18) nach oben bis zu dem metallischen Tragerelement (19) reichen und das Trägerelement (19) berühren und elektrisch und thermisch kontaktieren.2. resistor (18) according to claim 1, characterized in that the metallic connecting parts (22, 23) each side of the resistor (18) up to the metallic support member (19) and touch the support member (19) and electrically and contact thermally.
3. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägerelement (19) einen Einschnitt (24) aufweist, der das Trägerelement (19) in mindestens zwei elektrisch voneinander isolierte Teile (19.1, 19.2) aufteilt und einen Stromfluss über das Tragerelement (19) zwischen den beiden Anschlussteilen (22, 23) verhindert. 3. resistor (18) according to any one of the preceding claims, characterized in that the carrier element (19) has a notch (24) which divides the carrier element (19) in at least two electrically isolated parts (19.1, 19.2) and a current flow prevented by the support element (19) between the two connection parts (22, 23).
4. Widerstand (18) nach Anspruch 3, dadurch gekennzeichnet, dass der Einschnitt (24) in dem Tragerelement (19) mindestens teilweise schräg verlauft.4. resistor (18) according to claim 3, characterized in that the incision (24) in the support member (19) extends at least partially obliquely.
5. Widerstand (18) nach Anspruch 4, dadurch gekennzeichnet, dass der Einschnitt (24) in dem Tragerelement (19) V- formig, W-formig oder maanderformig verlauft.5. resistor (18) according to claim 4, characterized in that the incision (24) in the support member (19) V-shaped, W-shaped or maanderformig runs.
6. Widerstand (18) nach einem der vorhergehenden Anspru- che, dadurch gekennzeichnet, a) dass die Anschlussteile (22, 23) eine seitliche Ausdehnung aufweisen, die kleiner ist als 30%, 20% oder 15% der seitlichen Ausdehnung des Widerstands (18), um die Kontaktierung von Standard-Lotpads (28, 29) zu erleich- tern, und/oder b) dass die Anschlussteile (22, 23) eine seitliche Ausdehnung aufweisen, die kleiner ist als lmm, 0,5mm oder 0,1mm, um die Kontaktierung von Standard-Lotpads (28, 29) zu erleichtern.6. The resistor (18) according to any one of the preceding claims, characterized in that a) that the connecting parts (22, 23) have a lateral extent which is less than 30%, 20% or 15% of the lateral extent of the resistor ( 18) in order to facilitate the contacting of standard solder pads (28, 29) and / or b) that the connecting parts (22, 23) have a lateral extent which is smaller than 1 mm, 0.5 mm or 0, 1mm to facilitate contacting of standard solder pads (28, 29).
7. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Widerstandsmaterial eines der folgenden Materialien ist: a) Kupfer-Mangan-Legierung, insbesondere Kupfer-Mangan- Nickel-Legierung, insbesondere CuMnl2Ni, CuMn7Sn oder7. resistor (18) according to any one of the preceding claims, characterized in that the resistance material is one of the following materials: a) copper-manganese alloy, in particular copper-manganese-nickel alloy, in particular CuMnl2Ni, CuMn7Sn or
CuMn3, b) Nickel-Chrom-Legierung, insbesondere Nickel-Chrom- Aluminium-Legierung, insbesondere NiCr20AlSilMnFe, NiCr6015, NiCr8020, NiCr3020, c) Kupfer-Nickel-Legierung, insbesondere CuNil5 oder Cu- NiIO. CuMn3, b) nickel-chromium alloy, in particular nickel-chromium-aluminum alloy, in particular NiCr20AlSilMnFe, NiCr6015, NiCr8020, NiCr3020, c) copper-nickel alloy, in particular CuNil5 or Cu-NiIO.
8. Widerstand (18) nach einem der vorhergehenden Ansprüche, gekennzeichnet; durch a) eine Dicke von weniger als 2mm, lmm, 0,5mm oder 0,3mm, und/oder b) eine Lange von weniger als 10mm, 5mm, 2mm oder lmm, und/oder c) eine Breite von weniger als 5mm, 2mm oder lmm.8. resistor (18) according to any one of the preceding claims, characterized; by a) a thickness of less than 2mm, lmm, 0,5mm or 0,3mm, and / or b) a length of less than 10mm, 5mm, 2mm or lmm, and / or c) a width of less than 5mm, 2mm or 1mm.
9. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Tragerelement (19) eine Dicke aufweist, die kleiner als 0,3mm und/oder großer als 0, 05mm ist .9. resistor (18) according to any one of the preceding claims, characterized in that the carrier element (19) has a thickness which is smaller than 0.3 mm and / or greater than 0.05 mm.
10. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, a) dass das Tragerelement (19) an seiner Oberseite flachig mit einem Lotstopplack (25) beschichtet ist, und/oder b) dass das Widerstandselement (21) an seiner Unterseite flachig mit einem Lotstopplack (26) beschicht ist.10. resistor (18) according to any one of the preceding claims, characterized in that a) that the support element (19) is coated flat on its upper side with a Lotstopplack (25), and / or b) that the resistance element (21) on its underside flat with a Lotstopplack (26) is coated.
11. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, a) dass die Anschlussteile (22, 23) aus einem hochleitfa- higen Material bestehen, und/oder b) dass das Tragerelement (19) aus einem thermisch hoch- leitfahigen Material bestehen.11. Resistor (18) according to one of the preceding claims, characterized in that a) that the connection parts (22, 23) consist of a highly conductive material, and / or b) that the support element (19) consists of a thermally highly conductive Material exist.
12. Widerstandselement (21) nach Anspruch 11, dadurch gekennzeichnet, a) dass die Anschlussteile (22, 23) aus Kupfer oder einer Kupferlegierung bestehen, und/oder b) dass das Tragerelement (19) aus Kupfer oder einer Kupferlegierung besteht. 12. resistance element (21) according to claim 11, characterized in that a) that the connecting parts (22, 23) made of copper or a copper alloy, and / or b) that the support member (19) consists of copper or a copper alloy.
13. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, a) dass die einzelnen Anschlussteile (22, 23) das Trager- element (19) oben und das Widerstandselement (21) unten kappenformig umgreifen, und/oder b) dass die einzelnen Anschlussteile (22, 23) das Tragerelement (19) und/oder das Widerstandselement (21) seitlich kappenformig umgreifen.13. Resistor (18) according to one of the preceding claims, characterized in that a) that the individual connection parts (22, 23) engage around the support element (19) at the top and the resistance element (21) at the bottom, and / or b) that the individual connection parts (22, 23) laterally surround the support element (19) and / or the resistance element (21) in the shape of a cap.
14. Widerstand (18) nach einem der vorhergehenden Ansprüche, gekennzeichnet durch eine Kleberschicht (20) zwischen dem Widerstandselement (21) und dem Tragerelement (19) .14. Resistor (18) according to one of the preceding claims, characterized by an adhesive layer (20) between the resistance element (21) and the support element (19).
15. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Widerstandselement (21) eine einfach rechteckige oder maanderformig verlaufende Widerstandsbahn aufweist.15. Resistor (18) according to one of the preceding claims, characterized in that the resistance element (21) has a simply rectangular or maanderformig extending resistance path.
16. Widerstand (18) nach einem der vorhergehenden Ansprüche, gekennzeichnet durch einen Widerstandswert im Milliohm- bereich, insbesondere einen Widerstandswert von weniger als 500 mΩ, 200 mΩ, 50mΩ, 30mΩ, 20mΩ, lOmΩ, 5mΩ oder lmΩ.16. resistor (18) according to any one of the preceding claims, characterized by a resistance value in the milliohm range, in particular a resistance value of less than 500 mΩ, 200 mΩ, 50mΩ, 30mΩ, 20mΩ, lOmΩ, 5mΩ or lmΩ.
17. Widerstand (18) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Widerstandselement (21) mit Ausnahme der Anschlussteile (22, 23) nach außen vollständig elektrisch isoliert ist.17. Resistor (18) according to one of the preceding claims, characterized in that the resistance element (21) with the exception of the connecting parts (22, 23) is completely electrically insulated to the outside.
18. Herstellungsverfahren für Widerstände, insbesondere für Widerstände nach einem der vorhergehenden Ansprüche, mit den folgenden Schritten: a) Bereitstellung eines flachigen, metallischen Tragerelements (19) mit einer Oberseite und einer Unterseite, b) Aufbringen eines flachigen Widerstandselements (21) aus einem Widerstandsmaterial auf die Unterseite des Tragerelements (19), c) Elektrische Kontaktxerung des Widerstandselements (21) durch mindestens zwei getrennte metallische Anschlussteile (22, 23), die teilweise an der Unterseite des Tragerelements (19) angeordnet werden, dadurch gekennzeichnet:, dass e) die Anschlussteile (22, 23) an dem Widerstand (18) so angebracht werden, dass die Anschlussteile (22, 23) seitlich frei liegen und seitlich sichtbar von einem Lot benetzbar sind.18. Method for producing resistors, in particular for resistors, according to one of the preceding claims, comprising the following steps: a) providing a flat, metallic support element (19) having a top side and a bottom side, b) applying a flat resistance element (21) made of a resistance material to the underside of the support element (19), c) electrically contacting the resistance element (21) by at least two separate metallic connection parts (22, 23) which are partially located on the underside of the support element ( 19) are arranged, characterized in that e) the connecting parts (22, 23) are attached to the resistor (18) so that the connecting parts (22, 23) are laterally exposed and laterally visibly wetted by a solder.
19. Herstellungsverfahren nach Anspruch 18, gekennzeichnet durch folgenden Schritt:19. Production method according to claim 18, characterized by the following step:
Erzeugung eines Einschnitts (24) in dem Tragerelement (19), wobei der Einschnitt (24) das Tragerelement (19) in zwei Teile (19.1, 19.2) trennt und einen Stromfluss über das Tragerelement (19) zwischen den beiden Anschlussteilen (22, 23) verhindert.Producing an incision (24) in the support element (19), the incision (24) separating the support element (19) into two parts (19.1, 19.2) and a current flow via the support element (19) between the two connection parts (22, 23 ) prevented.
20. Herstellungsverfahren nach Anspruch 19, dadurch gekennzeichnet, dass der Einschnitt (24) in dem Tragerelement (19) atztechnisch oder durch Laserbearbeitung hergestellt wird.20. A manufacturing method according to claim 19, characterized in that the incision (24) in the support member (19) is made by medical technology or by laser machining.
21. Herstellungsverfahren nach Anspruch 19 oder 20, dadurch gekennzeichnet, dass der Einschnitt (24) in dem Tragerelement21. A manufacturing method according to claim 19 or 20, characterized in that the incision (24) in the support element
(19) mindestens teilweise schräg geformt wird, insbesondere V-formig, W-formig oder maanderformig.(19) is formed at least partially obliquely, in particular V-shaped, W-shaped or maanderformig.
22. Herstellungsverfahren nach einem der Ansprüche 18 bis 21, dadurch gekennzeichnet, dass das Widerstandselement (21) durch eine Kleberschicht (20) auf die Unterseite des Tragerelements (19) aufgeklebt wird. 22. Manufacturing method according to one of claims 18 to 21, characterized in that the resistance element (21) by an adhesive layer (20) is adhered to the underside of the support member (19).
23. Herstellungsverfahren nach einem der Ansprüche 18 bis 22, dadurch gekennzeichnet, dass das Widerstandselement (21) atztechnisch oder durch Laserbearbeitung strukturiert wird.23. Production method according to one of claims 18 to 22, characterized in that the resistance element (21) is structured by medical technology or by laser processing.
24. Herstellungsverfahren nach Anspruch 23, dadurch gekennzeichnet, dass durch die Strukturierung des Widerstandselements (21) eine maanderformige Widerstandsbahn in dem Widerstandselement (21) erzeugt wird.24. A manufacturing method according to claim 23, characterized in that by the structuring of the resistive element (21) a maanderformige resistance path in the resistance element (21) is generated.
25. Herstellungsverfahren nach einem der Ansprüche 18 bis 24, gekennzeichnet durch folgende Schritte: a) Flachiges Aufbringen eines Lotstopplacks (25) auf die Oberseite des Tragerelements (19), und/oder b) Flachiges Aufbringen eines Lotstopplacks (26) auf die Unterseite des Widerstandselements (21) .25. A manufacturing method according to any one of claims 18 to 24, characterized by the following steps: a) flat application of a Lotstopplacks (25) on the upper side of the support element (19), and / or b) flat application of a Lotstopplacks (26) on the underside of Resistance elements (21).
26. Herstellungsverfahren nach Anspruch 25, gekennzeichnet durch folgende Schritte: a) Streifenförmige Entfernung des Lotstopplacks (25) an der Oberseite des Tragerelements (19) an zwei gegenüber liegenden Kanten, und/oder b) Streifenförmige Entfernung des Lotstopplacks (26) an der Unterseite des Widerstandselements (21) an den ge- genuber liegenden Kanten, und/oder c) Streifenförmige Entfernung der Klebeschicht (20) zwischen dem Tragerelement (19) und dem Widerstandselement (21) an den gegenüber liegenden Kanten, und/oder d) Streifenförmige Entfernung des Widerstandselements (21) an der Unterseite des Tragerelements (19) an den beiden gegenüber liegenden Kanten zur streifenförmigen Freilegung des Widerstandselements (21) für eine elektrische Kontaktierung . 26. A manufacturing method according to claim 25, characterized by the following steps: a) Strip-shaped removal of the Lotstopplacks (25) on the upper side of the support element (19) on two opposite edges, and / or b) Strip-shaped removal of the Lotstopplacks (26) on the underside and / or c) Strip removal of the adhesive layer (20) between the support element (19) and the resistance element (21) at the opposite edges, and / or d) Strip-shaped removal of the resistance element (21) on the underside of the carrier element (19) at the two opposite edges for strip-like exposure of the resistance element (21) for an electrical contact.
27. Herstellungsverfahren nach einem der Ansprüche 18 bis 26, gekennzeichnet durch folgenden Schritt:27. Production method according to one of claims 18 to 26, characterized by the following step:
Vereinzelung der Widerstände (18) durch Trennung von einem Nutzen, der mehrere Widerstände (18) umfasst.Separating the resistors (18) by separating from a utility comprising a plurality of resistors (18).
28. Herstellungsverfahren nach Anspruch 27, dadurch gekennzeichnet, dass das Vereinzeln der Widerstände (18) durch Sagen, Stanzen oder durch Laserschneiden des Nutzens erfolgt.28. A manufacturing method according to claim 27, characterized in that the separation of the resistors (18) by saying, punching or by laser cutting of the benefit takes place.
29. Herstellungsverfahren nach einem der Ansprüche 27 oder29. A manufacturing method according to any one of claims 27 or
28, gekennzeichnet durch folgenden Schritt:28, characterized by the following step:
Durchfuhrung eines Widerstandsabgleichs vor der Vereinzelung der Widerstände (18) .Carrying out a resistance adjustment before the separation of the resistors (18).
30. Herstellungsverfahren nach einem der Ansprüche 27 bis30. A manufacturing method according to any one of claims 27 to
29, dadurch gekennzeichnet, dass die Anschlussteile (22, 23) nach dem Widerstandsabgleich und/oder nach dem Vereinzeln aufgebracht werden. 29, characterized in that the connection parts (22, 23) are applied after the resistance balance and / or after the separation.
EP07819122A 2006-12-20 2007-10-18 Resistor, particularly smd resistor, and associated production method Active EP1941520B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL07819122T PL1941520T3 (en) 2006-12-20 2007-10-18 Resistor, particularly smd resistor, and associated production method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006060387A DE102006060387A1 (en) 2006-12-20 2006-12-20 Resistor, in particular SMD resistor, and associated manufacturing method
PCT/EP2007/009057 WO2008055582A1 (en) 2006-12-20 2007-10-18 Resistor, particularly smd resistor, and associated production method

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EP1941520A1 true EP1941520A1 (en) 2008-07-09
EP1941520B1 EP1941520B1 (en) 2009-07-08

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KR (1) KR101371053B1 (en)
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AT (1) ATE436077T1 (en)
BR (1) BRPI0720449A2 (en)
CA (1) CA2654216A1 (en)
DE (3) DE102006060387A1 (en)
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JP5237299B2 (en) 2013-07-17
US20090322467A1 (en) 2009-12-31
PL1941520T3 (en) 2009-12-31
KR101371053B1 (en) 2014-03-10
DE502007001025D1 (en) 2009-08-20
JP2010514171A (en) 2010-04-30
US8013713B2 (en) 2011-09-06
DE202006020215U1 (en) 2008-02-21
BRPI0720449A2 (en) 2014-01-21
DE102006060387A1 (en) 2008-06-26
KR20090096304A (en) 2009-09-10
MX2009000553A (en) 2009-01-28
ATE436077T1 (en) 2009-07-15
EP1941520B1 (en) 2009-07-08
CN101484952A (en) 2009-07-15
CA2654216A1 (en) 2008-05-15
ES2329425T3 (en) 2009-11-25
WO2008055582A1 (en) 2008-05-15
CN101484952B (en) 2011-03-30

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